KR102510575B1 - Camera Module - Google Patents

Abstract

A camera module according to the present invention comprises: a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module disposed at a predetermined distance from the inner bottom of the housing unit, a first coil wound on an outer circumferential surface, and at least one lens installed therein; a second printed circuit board coupled to the bottom of the holder module; a third printed circuit board installed on the upper side of the holder module; a plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which are connected to the third printed circuit board; and a buffer unit provided at a connection portion between the wire spring and the third printed circuit board and surrounding the connection portion between the wire spring and the third printed circuit board. Accordingly, the present invention can minimize component loss due to poor assembly.

Description

Camera Module {Camera Module}

The present invention relates to a camera module.

In the case of a camera module mounted on a small electronic product, the camera module may be frequently shocked during use, and the camera module may be slightly shaken due to a user's hand shaking during shooting. In view of this point, a camera module having a hand shake prevention means has recently been disclosed.

For example, in Korean Patent Registration No. 10-0741823 (registered on July 16, 2007), a gyro sensor IC or an angular velocity sensor is installed inside a device on which a camera module is mounted, such as a mobile phone, to compensate for hand shaking. How to do it is introduced.

However, when a separate angular velocity detection sensor is provided in this way, a separate detection sensor must be provided to implement the hand-shake prevention function, which causes an increase in manufacturing cost, and to configure and install the hand-shake prevention device separately from the camera module. There is the hassle of making space.

(Patent Document 1) KR10-0741823 B1

An object of the present invention is to provide a camera module having an optical image stabilization function.

A camera module according to the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module spaced apart from an inner bottom surface of the housing unit by a predetermined distance, having a first coil wound on an outer circumferential surface thereof, and including at least one lens therein; a second printed circuit board coupled to the bottom surface of the holder module; a third printed circuit board installed above the holder module; a plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; and a buffer unit provided at a connection portion between the wire spring and the third printed circuit board and surrounding the connection portion between the wire spring and the third printed circuit board.

The shock absorber unit may include at least one injection hole formed through the third printed circuit board and formed around a through hole to which the wire spring is connected; It is preferable to include a second wire spring through hole formed in the housing unit in an upper and lower narrow shape so as to be coaxial with the through hole of the third printed circuit board and communicated with the injection hole through the upper opening.

In addition, the camera module according to a preferred embodiment of the present invention may further include an adhesive material injected into the through hole of the second wire spring through the injection hole.

In addition, the wire spring and the third printed circuit board are connected through the through hole, and at this time, it is preferable that both the upper and lower surfaces of the third printed circuit board are connected through the through hole with a connecting material, and the connecting material is conductive such as lead. It is preferable to be provided with a material.

In addition, the shock absorber unit may include a pair of injection holes formed through the third printed circuit board through both sides of the first wire spring through hole through which the wire spring is soldered; a second wire spring through hole formed in the housing unit in an upper and lower narrow shape so as to be coaxial with the first through hole of the wire spring of the third printed circuit board and communicated with the injection hole through an upper opening; It is preferable to include

In addition, the camera unit according to a preferred embodiment of the present invention further includes an adhesive material injected into the second wire spring through hole through the injection hole, wherein the adhesive material is injected into the second wire spring through hole and into the second wire spring through hole. It is preferable to cover the entire connection portion formed on the upper side of the third printed circuit board. At this time, it is preferable that the adhesive material is provided with epoxy.

The second wire spring through-hole may include an upper opening provided in a funnel shape with upper and lower sides in the housing unit; and a wire spring support hole provided coaxially with the through hole.

A diameter of the through hole of the second wire spring may be equal to or larger than the diameter of the through hole.

The housing unit may include a first housing disposed above the first printed circuit board; a second housing disposed above the first housing and having the third printed circuit board installed thereon; first and second permanent magnets interposed between the first and second housings; It is preferable to include; a yoke disposed between the first and second permanent magnets or located on an inner surface of the first and second housings to transmit magnetic force into the holder module.

Preferably, the yoke has a central portion protruding toward the holder module.

Preferably, the second housing and the third printed circuit board are fixed with double-sided tape.

In addition, the camera module according to a preferred embodiment of the present invention has a through-hole at a position corresponding to the lens module and the connection portion of the third printed circuit board and the wire spring, and a shield can installed to surround the housing unit; It is preferable to further include.

The holder module may include an outer blade on which a first coil is wound on an outer circumferential surface; a bobbin elastically supported by an elastic member on the upper side of the outer blade, disposed to be movable up and down inside the outer blade, having a second coil wound on its outer circumferential surface, and having at least one lens installed therein; and upper and lower elastic members respectively disposed on upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein magnetic force may be invested toward the second coil at the center of the first coil. A space portion may be formed so as to be.

Preferably, the wire spring is made of a metal material and is electrically connected to the second and third printed circuit boards.

At least six wire springs are provided, and two polarities for auto focusing control and four polarities for OIS driving are supplied to the holder module through connection with the second and third printed circuit boards. good night.

In addition, the wire springs, with the same length, are disposed at each corner of the holder module by two, so that a total of eight may be provided.

A camera module according to a preferred and optimum embodiment of the present invention includes a first printed circuit board on which an image sensor is mounted; a housing unit disposed above the first printed circuit board; a holder module spaced apart from an inner bottom surface of the housing unit by a predetermined distance, having a first coil wound on an outer circumferential surface thereof, and including at least one lens therein; a second printed circuit board coupled to the bottom surface of the holder module; a third printed circuit board installed above the holder module; a plurality of wire springs having one end connected to the second printed circuit board and the other end connected to the third printed circuit board; And the connection between the wire spring and the third printed circuit board is characterized in that both upper and lower surfaces of the third printed circuit board are connected with a connecting material through a through hole formed through the third printed circuit board.

Since the present invention has a buffer unit to absorb the load repeatedly applied to the wire spring, the wire spring can be firmly connected to the connection part of the printed circuit board.

In addition, even if the wire spring receives excessive force during the assembly process of the lens module, since it can absorb the force excessively applied by the shock absorber unit, assemblability can be improved and component loss due to assembly failure can be minimized.

1 is a schematic plan view of a camera module according to an embodiment of the present invention.
FIG. 2 is a AA cross-sectional view of FIG. 1 .
3 is a side view of a camera module according to an embodiment of the present invention.
4 is a perspective view showing a part of the configuration of FIG. 3 through perspective.
FIG. 5 is an enlarged view of part B of FIG. 2 according to the first embodiment of the present invention.
FIG. 6 is an enlarged view of part B of FIG. 2 according to a second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is an A-A cross-sectional view of FIG. 1, FIG. 3 is a side view of a camera module according to an embodiment of the present invention, and FIG. 4 is a part of FIG. A perspective view showing the configuration in perspective, FIG. 5 is an enlarged view of part B of FIG. 2 according to the first embodiment of the present invention, and FIG. 6 is a view showing B of FIG. 2 according to the second embodiment of the present invention It is an enlarged view of a part.

As shown in FIG. 2 showing a schematic plan view of FIG. 1 and a schematic side view showing a cross-section A-A of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10 and a housing unit 20 , It includes a holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60 and a buffer unit 100.

The image sensor 11 is mounted approximately in the vicinity of the center of the first printed circuit board 10, and is preferably provided as a PCB board. Components for operating the image sensor 11 may be disposed on the first printed circuit board 10, or a plurality of terminal units capable of supplying power and outputting information of the image sensor 11 may be provided. .

The housing unit 20 is disposed above the first printed circuit board 10 and forms the frame of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25. includes

The first housing 21 is a base and is disposed on the upper side of the first printed circuit board 10 and is spaced apart from the image sensor 11 by a predetermined distance. If necessary, a filter member capable of filtering an image incident on the image sensor 11 may be further installed in the first housing 21 .

The second housing 22 is disposed above the first housing 21 and is configured to cover the first housing 21 . An opening is formed at a corresponding position near the center of the second housing 22 so that an image can be transmitted to the image sensor 11 . On the upper surface of the second housing 22, a third printed circuit board 50, which will be described later, is adhered and fixed by a fixing member such as double-sided tape or adhesive, but this is not limited, and depending on product design, the above It is also possible to provide a separate third housing such as a case or a shield can for the third printed circuit board 50 and to fix the third printed circuit board 50 to the inner surface of the third housing with the aforementioned fixing member. If a third housing is provided, the third printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to invest magnetic force into the holder module 30 . It is preferable that the first and second permanent magnets 23 and 24 have the same size. In addition, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on inner surfaces of the first and second housings if possible within a design allowable range.

On the other hand, when the size of the first and second permanent magnets 23 and 24 increases, the OIS operation increases even with a small current, and if the first and second permanent magnets 23 and 24 have a constant size, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS drive increases. In conclusion, the larger the size of the first and second permanent magnets 23 and 24, the better the OIS operation, but it is desirable to design the optimal size within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided in a protruding shape near the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is the same as that of the first and second permanent magnets 23 and 24, and the center protrudes to a certain size so that the permanent magnet and the yoke are formed to have an approximate "T" shape. desirable.

The holder module 30 is disposed at a predetermined distance from the inner bottom surface of the housing unit 20 and is composed of an outer blade 31 and a bobbin 32 . The holder module 30 can perform a pendulum motion in front/back/left/right and diagonal directions while being suspended by the wire spring 60 .

Spring members 35 and 36 are provided on the upper and lower sides of the outer blade 31, and are elastically supported by the spring member 35, and are connected to allow the bobbin 32 to move in a vertical direction.

As shown in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound on the outer circumferential surface of the four sides, and the central portion of the four sides where the coils 31a to 31d are wound. It is perforated without a coil. The yoke 25 is disposed at a position corresponding to the open space, so that the yoke 25 is partially inserted into the space.

The second printed circuit board 40 may be fixed to the lower surface of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 rotates forward, backward, left, right or diagonally as shown by the arrow in FIG. 2 according to the interaction between the magnetic force of the first and second permanent magnets 22 and 23 and the first coil 31a. It is suspended by a plurality of wire springs 60 so as to be movable, and is spaced apart from the bottom surface of the first housing 21 at a predetermined interval.

In addition, a plurality of spring through-holes 37 may be provided in the outer blade 31 so that the wire spring 60 may pass through and be connected to the second printed circuit board 40 .

In the bobbin 32, the outer blade 31 is disposed inside to be movable up and down, and at least one lens 34 is installed inside the bobbin 32. A second coil 32a is wound on the outer circumferential surface of the bobbin 32, and the second coil 32a is connected to the first coils 31a to 31d of the outer blade 31 through the yoke 25. The operation of raising and lowering the bobbin 32 is performed by interaction with the magnetic force invested through the empty space. As the size of the yoke 25 increases, the AF drive improves, but this may also vary depending on the optimal design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by such an elevation action of the bobbin 32 .

As described above, the second printed circuit board 40 is disposed on the bottom surface of the outer blade 31, and the wire spring 60 is provided to supply power to the first and second coils 31a and 32a. Connected. The connection method may be any method as long as it can be connected by soldering or other conductive material. That is, as shown in FIG. 2, the connection part w' of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, so that the wire spring 60 ) is transferred to the first and second coils 31a and 32a to form electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the second printed circuit board 40, and as shown in FIG. 2, first connected to the lower spring 36 and then the lower spring 36 ) It is also possible to connect the second printed circuit board 40.

The third printed circuit board 50 is fixed to the upper side of the second housing 22 with a fixing member such as double-sided tape or an adhesive member as described above, and the third printed circuit board 50 connected to the first printed circuit board 10 The power transmitted through the terminal part 52 of the printed circuit board 50 is transferred to the second printed circuit board 40 through the wire spring 60 connected like the second printed circuit board 40 . The connection method may be any method as long as it can be connected by soldering or other conductive material.

As shown in FIGS. 3 and 4, the third printed circuit board 50 is provided to cover one side wall surface of the first and second housings 21 and 22. At this time, the first and second printed circuit boards 50 A window 55 is formed on the surface facing the second permanent magnets 23 and 24 and the yoke 25, so that interference with them can be avoided.

This is a configuration to avoid this, since the first and second permanent magnets 23 and 24 and the yoke 25 are generally directly attached to the shield can 70 to be described later by a fixing means such as epoxy.

On the other hand, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), printed circuit board (PCB) or R-FPCB (Rigid FPCB integral type), but this It is not limited, and any board is possible as long as it is electrically connected.

Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, as shown in FIG. 5, one end of the wire spring 60 is connected to a pad 51 formed on the third printed circuit board 50, and the center of the pad 51 is the wire spring. A through hole 53 through which 60 passes is formed. The connection method may be any method as long as it can be connected by soldering or other conductive material. On the other hand, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 area can be connected to enable conduction by opening the solder register. there is.

In this way, the wire spring 60 connected to the pad 51 supplies the power supplied through the terminal part 52 to the second printed circuit board 40, and the first and second coils 31a ( 32a) enables interaction with the first and second permanent magnets 23 and 24.

In addition, as shown in FIG. 2 , the other end of the wire spring 60 passes through the spring hole 37 formed in the outer blade 31, and the second spring installed on the bottom surface of the outer blade 31. It is connected to the printed circuit board 40. At this time, although not shown, the other end of the wire spring 60 is connected to a pad (not shown) formed on the second printed circuit board 40 like the third printed circuit board 50, the pad A through hole (not shown) through which the wire spring 60 passes is formed in the center of (not shown). The connection method may be any method as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 hangs on the wire spring 60 and may be spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum motion, so that the outer blade ( It is possible to correct the vibration of 31) by the interaction between the first coil 31a and the first and second permanent magnets 23 and 24. To this end, it is preferable that the wire spring 60 is made of a metal material that has elasticity and can be energized so as to withstand impact.

On the other hand, as the thickness of the wire spring 60 becomes thinner, hand shake compensation motion improves even with a small current, but this may vary depending on the optimal design value. Preferably, the thickness of the wire spring 60 is from several μm to hundreds of μm, preferably from 1 to 100 μm.

In addition, it is preferable that at least six wire springs 60 are provided. At least two polarities for auto-focusing control and four polarities for hand-shake compensation motion compensation are supplied to the second and third printed circuits. It is necessary to supply the holder module 30 through connection with the substrates 40 and 50.

According to a preferred embodiment of the present invention, as shown in FIGS. 1 and 2, it is preferable to provide a total of 8 pieces of the same length, two to each corner of the holder module 30, and balance. .

On the other hand, as shown in FIG. 2, when a separate third housing such as a shield can 70 is further included, as described above, the third printed circuit board 50 has the first and second permanent Since the magnets 23 and 24 and the yoke 25 are fixedly coupled to the shield can 70 with epoxy or the like, a window 55 is formed to avoid this coupling portion, and the first and second housings (21) Covers the side wall surface of (22).

If the shield can 70 is deleted, the third printed circuit board 50 is formed of a PCB or the like, and the first and second permanent magnets 23 and 24 and the yoke ( 25) may be attached and fixed. As described above, the third printed circuit board 50 is constituted by a PCB, but a window 55 as described above is provided, and the window 55 is provided with the third printed circuit board 50. The first and second permanent magnets 23 and 24 and the yoke 25 may be inserted and configured, and additionally, it may be configured by reinforcing the external shielding tape or the like.

The shock absorber unit 100 surrounds the connection portion w of the connection portion between the wire spring 60 and the third printed circuit board 50 to absorb impact and repeated loads applied to the wire spring 60.

According to a preferred embodiment of the present invention, the buffer unit 100 includes an injection hole 110 and a second wire spring through hole 120 .

The injection hole 110 is formed through the through hole 53 where the wire spring 60 passing through the third printed circuit board 50 is soldered. According to the first embodiment of the present invention, as shown in FIG. 5, the injection hole 110 may be formed through one.

A second wire spring through hole 120 is provided in the second holder 22 . The second wire spring through hole 120 includes an upper opening 121 and a support hole 122 .

The upper opening 121 has an upper and lower narrow structure, and as shown in FIGS. 5 and 6, it is preferable to be provided in a conical funnel shape that becomes narrower toward the lower side. The support hole 122 is formed coaxially with the through hole 53 and preferably has a diameter corresponding to or larger than the diameter of the through hole 53 .

It is preferable that the diameter of the through hole 53 is slightly larger than the diameter of the wire spring 60, and when the wire spring 60 and the pad 51 formed on the third printed circuit board 50 are connected, soldering or A connecting material 101 such as other conductive material flows down through the through hole 53 and is connected to the wire spring 60 on both upper and lower surfaces of the third printed circuit board 50 as shown in FIGS. 5 and 6 . It can be designed to be fixed.

The diameter of the support hole 122 is preferably slightly larger than the diameter of the wire spring 60, and may be equal to or larger than the diameter of the through hole 53. That is, the design may be designed so that the wire spring 60 does not interfere with the second holder 22 in the vicinity of the support hole 122 .

The adhesive material 130 is injected through the injection hole 110 and fills the inner space of the second wire spring through hole 120 as shown in FIG. 5 . It is also possible to add an adhesive material 130 to cover the connection portion w of the third printed circuit board 50 . The adhesive material 130 filled in the through hole 120 of the second wire spring absorbs shock and load transmitted to the connection part w of the wire spring 60 and the third printed circuit board 50, and the wire spring 60 may be prevented from swinging inside the upper opening 121 of the second wire spring through hole 120. The adhesive material 130 may be epoxy, but is not limited thereto, and any other material capable of being adhered and elastically supported may be used.

According to the second embodiment of the present invention, the buffer unit 100 is configured the same as the first embodiment, but the injection holes 110 are provided in pairs, and the through hole 53 is the center. It can be arranged on both sides, or it can be arranged symmetrically, but the location is not limited thereto.

In this case, the adhesive material 130 injected through the pair of injection holes 110 is not only inside the upper opening 121 of the second wire spring through hole 120, as shown in FIG. It can completely cover even the connection portion w formed on the upper side of the third printed circuit board 50 .

According to this configuration, it is possible to prevent damage to the connection portion w of the third printed circuit board 50, which is exposed on the top, by an external impact, and to have an effect of insulating the connection portion w. can be obtained additionally.

On the other hand, in a general assembly sequence, after combining the bobbin 32 and the outer blade 31, the second housing 22, the second and third printed circuit boards 40 and 50 and the wire springs ( 60), connect the bobbin 32 provided with the lens barrel, connect the first housing 21, and mount it on the first printed circuit board 10. Before connecting the first housing 21, the permanent magnet and yoke coupling may be performed first. This assembly sequence may be changed as needed. In other words, it may be possible directly on the equipment without a jig. In this process, even if the force of inserting and coupling the bobbin 32 provided with the lens barrel is excessively large and puts a strain on the connection part (w), the buffer unit 100 can absorb this excessive force.

That is, as shown in FIGS. 2, 5 and 6, the buffer unit 100 is connected to the wire spring 60 near the connection portion w between the wire spring 60 and the third printed circuit board 50. ) absorbs the load generated when a load is generated and pulled in the direction of gravity or shaken from side to side as the deformation energy of the buffer unit 100.

Therefore, it is possible to prevent the inconvenience of performing a connection operation again due to damage to the connection part w during the assembly process or to prevent parts from being unusable, and it is possible to produce a camera module with more reliability.

On the other hand, according to a preferred embodiment of the present invention, a through hole is provided around the connection portion (w) of the third printed circuit board 50 and the wire spring 60 at a position corresponding to the lens module 30, and the housing A shield can 70 installed to surround the units 21 and 22 may be further included. In this case, as described above, the third printed circuit board 50 may be attached and fixed to the inner circumferential surface of the shield can 70 . Meanwhile, the shield can 70 is not necessarily required, and may be omitted depending on the configuration of the housing units 21 and 22.

Meanwhile, as shown in FIG. 2 , hook units 80 may be provided on four or at least one surface to fix the shield can 70 to the first housing 21 . The location may be within a range allowed by the design of the center or the edge, and the number may be provided in one or a plurality of pieces.

The hook unit 80 may be composed of a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81, , and vice versa, if necessary.

The maximum width in the direction perpendicular to the optical axis of the buffer unit 100 (see L1 in FIG. 6) may be longer than the maximum width in the corresponding direction of the connection portion w (see L2 in FIG. 6).

One of the first to third printed circuit boards 10, 40, and 50 may be referred to as a 'first board', the other may be referred to as a 'second board', and the other may be referred to as a 'third board'. Alternatively, each of the first to third printed circuit boards 10, 40, and 50 may be referred to as a 'substrate'. The wire spring 60 may include a wire. The buffer unit 100 may be referred to as a 'buffer unit'.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can improve and change the technical spirit of the present invention in various forms. Therefore, such improvements and changes will fall within the protection scope of the present invention as long as they are obvious to those skilled in the art.

10; a first printed circuit board 20; housing unit
21; first housing 22; 2nd housing
23; first permanent magnet 24; No. 2 permanent magnet
25; York 30; holder module
31; outer blade 31a; 1st coil
32; bobbin 32a; 2nd coil
40; a second printed circuit board 50; 3rd printed circuit board
51; pad 52; Terminals
53; through hole 60; wire spring
70; shield can 80; hook unit
100; buffer unit 101; connective substance
110; injection hole 120; 2nd wire spring through hole
121; upper opening 122; support hall
130; adhesive material

Claims (20)

Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade;
a first coil disposed on the bobbin;
a magnet interacting with the first coil;
a second coil interacting with the magnet;
a wire coupled to the holder module;
a first connection portion fixing a first end of the wire; and
A buffer portion disposed on a portion of the wire and including an adhesive material;
In a direction perpendicular to the wire, the maximum width of the buffer part is greater than the maximum width of the first connection part,
The holder module includes first to fourth corner portions,
The wire is disposed in each of the first to fourth corner portions of the holder module. According to claim 1,
At least a portion of the buffer unit is disposed between the first connection unit and the outer blade. According to claim 1,
The spring member includes an upper spring coupled to an upper portion of the bobbin and a lower spring coupled to a lower portion of the bobbin,
The shock absorber is disposed closer to the upper spring than to the lower spring. According to claim 1,
A first substrate disposed on the base and including a terminal,
The first substrate includes a first portion disposed on the base and a second portion bent and extended from the first portion;
wherein the wire connects the holder module and the first portion of the first substrate. According to claim 4,
The first portion of the first substrate includes a first surface facing the holder module and a second surface disposed opposite to the first surface,
The wire is coupled to the second surface of the first portion of the first substrate. According to claim 4,
The first substrate includes a pad disposed in the first portion and a hole disposed in a central region of the pad,
The wire passes through the hole and is coupled to the pad by solder. According to claim 6,
A solder resist is disposed around the pad to form a surface of the first substrate. According to claim 3,
And a second connection portion for fixing the second end of the wire,
The second connection part is disposed closer to the lower spring than to the upper spring. According to claim 8,
The first connection part includes a first solder,
The second connection part includes a second solder. According to claim 9,
At least a portion of the shock absorber is disposed between the first solder and the second solder. According to claim 1,
The wire includes 6 wires spaced apart from each other,
Two of the six wires are disposed in the first corner portion, and two of the six wires are disposed in the third corner portion;
The first corner part and the third corner part are disposed opposite to each other with respect to an optical axis. According to claim 1,
The first coil is electrically connected to the wire. According to claim 11,
The two wires disposed in the first corner portion are electrically connected to the first coil. According to claim 1,
The shock absorbing part is formed to absorb shock or load applied to the wire. Base;
a holder module including an outer blade spaced apart from the base, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade;
a first coil disposed on the bobbin;
a magnet interacting with the first coil;
a second coil interacting with the magnet;
a wire coupled to the holder module;
a first solder fixing a first end of the wire; and
A buffer portion disposed on a portion of the wire and including an adhesive material;
The buffer unit contacts the first solder,
The maximum width of the first solder in a direction perpendicular to the optical axis is smaller than the maximum width of the buffer part,
The image stabilization device includes first to fourth wires disposed at first to fourth corner portions of the holder module, respectively. According to claim 15,
In a direction perpendicular to the wire, a maximum width of the shock absorber is greater than a maximum width of the first solder. printed circuit board;
an image sensor disposed on the printed circuit board;
an image stabilization device according to any one of claims 1 to 16 disposed on the printed circuit board; and
A camera module including a lens coupled to the bobbin of the image stabilization device. A mobile phone comprising the camera module of claim 17. Base;
a holder module disposed on the base;
a first coil disposed in the holder module;
a magnet disposed to interact with the first coil;
a substrate disposed between the base and the holder module;
a wire supporting the holder module and electrically connected to the substrate;
a first connection portion fixing a first end of the wire; and
Including a buffer in contact with the wire,
The holder module includes an outer blade, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade,
The first coil is disposed on the outer surface of the bobbin,
The wires include first to fourth wires disposed at first to fourth corners of the holder module, respectively;
A camera device in which a maximum width of the buffer part in a direction perpendicular to the optical axis is greater than a maximum width of the first connection part. delete

Images