KR102499442B1 - 구리 합금 판재 및 그 제조 방법 - Google Patents
구리 합금 판재 및 그 제조 방법 Download PDFInfo
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- KR102499442B1 KR102499442B1 KR1020197016834A KR20197016834A KR102499442B1 KR 102499442 B1 KR102499442 B1 KR 102499442B1 KR 1020197016834 A KR1020197016834 A KR 1020197016834A KR 20197016834 A KR20197016834 A KR 20197016834A KR 102499442 B1 KR102499442 B1 KR 102499442B1
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 74
- 238000004519 manufacturing process Methods 0.000 title description 24
- 238000000034 method Methods 0.000 claims abstract description 71
- 239000000463 material Substances 0.000 claims abstract description 68
- 239000000956 alloy Substances 0.000 claims abstract description 37
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 27
- 238000001887 electron backscatter diffraction Methods 0.000 claims abstract description 22
- 239000000835 fiber Substances 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 239000012535 impurity Substances 0.000 claims abstract description 11
- 238000004080 punching Methods 0.000 claims description 30
- 238000005096 rolling process Methods 0.000 claims description 30
- 238000005259 measurement Methods 0.000 claims description 19
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910020711 Co—Si Inorganic materials 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 52
- 238000010438 heat treatment Methods 0.000 description 29
- 239000013078 crystal Substances 0.000 description 27
- 238000001816 cooling Methods 0.000 description 17
- 230000032683 aging Effects 0.000 description 15
- 230000009471 action Effects 0.000 description 13
- 238000004458 analytical method Methods 0.000 description 13
- 238000005097 cold rolling Methods 0.000 description 12
- 238000005098 hot rolling Methods 0.000 description 11
- 238000000265 homogenisation Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 9
- 239000002244 precipitate Substances 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 6
- 238000005315 distribution function Methods 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 230000001747 exhibiting effect Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000004881 precipitation hardening Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007665 sagging Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 206010053759 Growth retardation Diseases 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000000984 pole figure measurement Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
- C21D8/0221—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
- C21D8/0226—Hot rolling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
Description
도 2 는, 본 발명의 실시형태의 구리 합금 판재를 나타낸 것으로서, 프레스 타발 가공 후의 절단면이 보이는 상태에서 모식적으로 나타낸 부분 사시도이다.
2 : 절단면
3 : 처짐 (면)
4 : 전단면
5 : 파단면
6 : 버
7 : 처짐 (면) (3) 과 전단면 (4) 의 경계선
Δt : 경계선 (7) 의 변동 높이
tmax : 전단면 (4) 및 파단면 (5) 을 판 두께 방향으로 측정한 합계 치수의 최대치
tmin : 전단면 (4) 및 파단면 (5) 을 판 두께 방향으로 측정한 합계 치수의 최소치
Claims (7)
- Co 를 0.3 ∼ 1.9 질량% 및 Si 를 0.1 ∼ 0.5 질량% 함유하고, 잔부가 Cu 및 불가피 불순물로 이루어지는 합금 조성을 갖고, EBSD 법에 의해 측정한 결과로부터 얻어진, 전체 결정립계에서 차지하는 특수 입계 Σ7 입계와 Σ9 입계의 합계량의 비율이 1.5 % 이상이고, Σ9/Σ7 이 1.0 ∼ 5.0 이고, α-fiber (Φ1 = 0°∼ 45°) 의 방위 밀도가, 3.0 이상 25.0 이하의 범위 내를 만족하는 것을 특징으로 하는 구리 합금 판재.
- Co 를 0.3 ∼ 1.9 질량% 및 Si 를 0.1 ∼ 0.5 질량% 함유하고, 추가로 Cr 을 0.05 ∼ 1.0 질량%, Ni 를 0.05 ∼ 0.7 질량%, Fe 를 0.02 ∼ 0.5 질량%, Mg 를 0.01 ∼ 0.3 질량%, Mn 을 0.01 ∼ 0.5 질량%, Zn 을 0.01 ∼ 0.15 질량% 및 Zr 을 0.01 ∼ 0.15 질량% 로 이루어지는 군에서 선택되는 적어도 1 성분을 함유하고, 잔부가 Cu 및 불가피 불순물로 이루어지는 합금 조성을 갖고, EBSD 법에 의해 측정한 결과로부터 얻어진, 전체 결정립계에서 차지하는 특수 입계 Σ7 입계와 Σ9 입계의 합계량의 비율이 1.5 % 이상이고, Σ9/Σ7 이 1.0 ∼ 5.0 이고, α-fiber (Φ1 = 0°∼ 45°) 의 방위 밀도가, 3.0 이상 25.0 이하의 범위 내를 만족하는 것을 특징으로 하는 구리 합금 판재.
- 제 2 항에 있어서,
상기 Cr, Ni, Fe, Mg, Mn, Zn 및 Zr 로 이루어지는 군에서 선택되는 적어도 2 성분을, 합계로 1.5 질량% 이하 함유하는 구리 합금 판재. - 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,
압연 평행 방향의 인장 강도가 500 MPa 이상이고, 도전율이 50 %IACS 초과이며, 또한, 프레스 타발 가공에 의한 절단면을 주사형 전자 현미경 (SEM) 으로 관찰함으로써 특정한 전단면 및 파단면은, 판 두께 방향으로 측정한 합계 치수의 최대치 (tmax) 와 최소치 (tmin) 의 차 (Δt) 가, 판 두께 (T) 의 30 % 이하인 구리 합금 판재. - 삭제
- 삭제
- 삭제
Applications Claiming Priority (3)
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JPJP-P-2017-086790 | 2017-04-26 | ||
JP2017086790 | 2017-04-26 | ||
PCT/JP2018/016389 WO2018198995A1 (ja) | 2017-04-26 | 2018-04-23 | 銅合金板材およびその製造方法 |
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KR20200002779A KR20200002779A (ko) | 2020-01-08 |
KR102499442B1 true KR102499442B1 (ko) | 2023-02-13 |
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Country Status (4)
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JP (1) | JP7145847B2 (ko) |
KR (1) | KR102499442B1 (ko) |
CN (1) | CN110573635B (ko) |
WO (1) | WO2018198995A1 (ko) |
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CN113166850B (zh) * | 2019-01-22 | 2022-09-06 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101027840B1 (ko) | 2006-09-12 | 2011-04-07 | 후루카와 덴키 고교 가부시키가이샤 | 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 |
JP2011252209A (ja) * | 2010-06-03 | 2011-12-15 | Jx Nippon Mining & Metals Corp | Cu−Co−Si系銅合金圧延板及びそれを用いた電気部品 |
JP2016047945A (ja) | 2014-08-27 | 2016-04-07 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品及び端子 |
JP2016050326A (ja) | 2014-08-29 | 2016-04-11 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品及び端子 |
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JPS5534610B2 (ko) | 1974-03-13 | 1980-09-08 | ||
KR20080027910A (ko) * | 2005-08-03 | 2008-03-28 | 닛코 킨조쿠 가부시키가이샤 | 전자 부품용 고강도 구리 합금 및 전자 부품 |
JP4981748B2 (ja) * | 2007-05-31 | 2012-07-25 | 古河電気工業株式会社 | 電気・電子機器用銅合金 |
CN102105610B (zh) * | 2008-06-03 | 2013-05-29 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
WO2010047373A1 (ja) * | 2008-10-22 | 2010-04-29 | 古河電気工業株式会社 | 銅合金材料、電気電子部品および銅合金材料の製造方法 |
WO2011068124A1 (ja) | 2009-12-02 | 2011-06-09 | 古河電気工業株式会社 | 銅合金板材 |
WO2011068135A1 (ja) * | 2009-12-02 | 2011-06-09 | 古河電気工業株式会社 | 銅合金板材およびその製造方法 |
US20120192997A1 (en) * | 2011-02-01 | 2012-08-02 | Mitsubishi Materials Corporation | Thermo-mechanical process to enhance the quality of grain boundary networks in metal alloys |
JP6366298B2 (ja) | 2014-02-28 | 2018-08-01 | Dowaメタルテック株式会社 | 高強度銅合金薄板材およびその製造方法 |
CN107406913B (zh) * | 2015-04-24 | 2019-05-17 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
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- 2018-04-23 CN CN201880028035.2A patent/CN110573635B/zh active Active
- 2018-04-23 JP JP2019514474A patent/JP7145847B2/ja active Active
- 2018-04-23 KR KR1020197016834A patent/KR102499442B1/ko active Active
- 2018-04-23 WO PCT/JP2018/016389 patent/WO2018198995A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101027840B1 (ko) | 2006-09-12 | 2011-04-07 | 후루카와 덴키 고교 가부시키가이샤 | 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 |
JP2011252209A (ja) * | 2010-06-03 | 2011-12-15 | Jx Nippon Mining & Metals Corp | Cu−Co−Si系銅合金圧延板及びそれを用いた電気部品 |
JP2016047945A (ja) | 2014-08-27 | 2016-04-07 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品及び端子 |
JP2016050326A (ja) | 2014-08-29 | 2016-04-11 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品及び端子 |
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KR20200002779A (ko) | 2020-01-08 |
WO2018198995A1 (ja) | 2018-11-01 |
CN110573635A (zh) | 2019-12-13 |
JP7145847B2 (ja) | 2022-10-03 |
CN110573635B (zh) | 2021-08-03 |
JPWO2018198995A1 (ja) | 2020-03-12 |
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