KR102453174B1 - 부식 저해를 위한 조성물 및 방법 - Google Patents
부식 저해를 위한 조성물 및 방법 Download PDFInfo
- Publication number
- KR102453174B1 KR102453174B1 KR1020187032903A KR20187032903A KR102453174B1 KR 102453174 B1 KR102453174 B1 KR 102453174B1 KR 1020187032903 A KR1020187032903 A KR 1020187032903A KR 20187032903 A KR20187032903 A KR 20187032903A KR 102453174 B1 KR102453174 B1 KR 102453174B1
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- South Korea
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- water
- soluble salt
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- Prior art date
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- IQEKRNXJPCBUAT-UHFFFAOYSA-N 2-[hydroperoxy(hydroxy)phosphoryl]acetic acid Chemical compound OOP(O)(=O)CC(O)=O IQEKRNXJPCBUAT-UHFFFAOYSA-N 0.000 claims abstract description 79
- 150000003839 salts Chemical class 0.000 claims abstract description 45
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims abstract description 39
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- ZJAOAACCNHFJAH-UHFFFAOYSA-N phosphonoformic acid Chemical compound OC(=O)P(O)(O)=O ZJAOAACCNHFJAH-UHFFFAOYSA-N 0.000 claims abstract description 14
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- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 18
- 229910052725 zinc Inorganic materials 0.000 claims description 18
- 239000011701 zinc Substances 0.000 claims description 18
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- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- ZRGONDPMOQPTPL-UHFFFAOYSA-N 1-[2-(2-hydroxyethylsulfanyl)ethyl]-2-methyl-5-phenylpyrrole-3-carboxylic acid Chemical compound OCCSCCN1C(C)=C(C(O)=O)C=C1C1=CC=CC=C1 ZRGONDPMOQPTPL-UHFFFAOYSA-N 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
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- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 claims 2
- 238000012360 testing method Methods 0.000 description 49
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- -1 ferrous metals Chemical class 0.000 description 4
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- IRLPACMLTUPBCL-KQYNXXCUSA-N 5'-adenylyl sulfate Chemical compound C1=NC=2C(N)=NC=NC=2N1[C@@H]1O[C@H](COP(O)(=O)OS(O)(=O)=O)[C@@H](O)[C@H]1O IRLPACMLTUPBCL-KQYNXXCUSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
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- 231100000419 toxicity Toxicity 0.000 description 3
- 230000001988 toxicity Effects 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
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- 229910052783 alkali metal Inorganic materials 0.000 description 2
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- 239000000956 alloy Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
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- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 150000002903 organophosphorus compounds Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 2
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- 239000002244 precipitate Substances 0.000 description 2
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- 235000018553 tannin Nutrition 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- BRLCQLFBETUGNA-UHFFFAOYSA-N 2-phosphonobut-3-ene-1,2,4-tricarboxylic acid Chemical compound P(=O)(O)(O)C(CC(=O)O)(C=CC(=O)O)C(=O)O BRLCQLFBETUGNA-UHFFFAOYSA-N 0.000 description 1
- KMDMOMDSEVTJTI-UHFFFAOYSA-N 2-phosphonobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)P(O)(O)=O KMDMOMDSEVTJTI-UHFFFAOYSA-N 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
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- 229920002125 Sokalan® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
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- 150000001412 amines Chemical class 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- 238000010561 standard procedure Methods 0.000 description 1
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- 239000010936 titanium Chemical class 0.000 description 1
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- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical class [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Chemical class 0.000 description 1
- 229910052720 vanadium Chemical class 0.000 description 1
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- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F5/00—Softening water; Preventing scale; Adding scale preventatives or scale removers to water, e.g. adding sequestering agents
- C02F5/08—Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents
- C02F5/10—Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents using organic substances
- C02F5/14—Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents using organic substances containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F5/00—Softening water; Preventing scale; Adding scale preventatives or scale removers to water, e.g. adding sequestering agents
- C02F5/08—Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents
- C02F5/10—Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents using organic substances
- C02F5/12—Treatment of water with complexing chemicals or other solubilising agents for softening, scale prevention or scale removal, e.g. adding sequestering agents using organic substances containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/144—Aminocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/167—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/167—Phosphorus-containing compounds
- C23F11/1676—Phosphonic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/173—Macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
- C02F2103/023—Water in cooling circuits
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2303/00—Specific treatment goals
- C02F2303/08—Corrosion inhibition
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- Hydrology & Water Resources (AREA)
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Abstract
Description
도 1은 3ft/sec 및 5ft/sec의 유속에서 스피너 테스트(spinner test) 후 강 쿠폰(steel coupon)들의 부식 수준을 보여주는 사진을 포함한다.
도 2는 3ft/sec 및 5ft/sec의 유속에서 살생물제 존재하에 스피너 테스트를 실행한 후 강 쿠폰들의 부식 수준을 보여주는 사진을 포함한다.
도 3은 3ft/sec의 유속에서 스피너 테스트 후 강 쿠폰들의 부식 수준을 보여주는 사진을 포함한다.
도 4는 스피너 테스트 후 아연도금 쿠폰들의 백청 수준을 보여주는 사진을 포함한다.
Claims (43)
- 소정량의 물을 함유하는 용수 설비(water system) 중의 금속 부품 상의 백청(white rust) 형성 또는 부식을 저해하기 위해 상기 용수 설비를 처리하는 방법으로서, 상기 방법은
아미노산계 중합체 또는 이의 수가용성 염;
하이드록시포스포노아세트산 또는 이의 수가용성 염; 및
제2 포스폰산 또는 이의 수가용성 염
을 첨가함을 포함하고,
상기 첨가 단계는, (1) 3ppm 내지 50ppm의 활성 농도의 상기 아미노산계 중합체 또는 이의 수가용성 염, (2) 3ppm 내지 50ppm의 활성 농도의 상기 하이드록시포스포노아세트산 또는 이의 수가용성 염, 및 (3) 2ppm 내지 20ppm의 상기 제2 포스폰산 또는 이의 수가용성 염을 제공하는, 방법. - 제1항에 있어서, 상기 제2 포스폰산은 2-포스포노부탄-1,2,4-트리카복실산(PBTC) 또는 이의 수가용성 염이고, 상기 물은 7 내지 9의 pH를 갖고, 상기 첨가 단계는 PBTC 또는 이의 수가용성 염의 활성 농도 이상인 아미노산계 중합체 또는 이의 수가용성 염의 활성 농도를 제공하는, 방법.
- 제1항에 있어서, 상기 제2 포스폰산은 1-하이드록시에탄-1,1-디포스폰산(HEDP) 또는 이의 수가용성 염인, 방법.
- 제2항 또는 제3항에 있어서, 상기 아미노산계 중합체가 폴리아스파르트산 또는 이의 수가용성 염인, 방법.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 아미노산계 중합체 또는 이의 수가용성 염, 하이드록시포스포노아세트산 또는 이의 수가용성 염, 및 제2 포스폰산 또는 이의 수가용성 염, 및 임의로 추적자(tracer)를 상기 용수 설비에 첨가하기 전에 처리 조성물에서 합하고; 상기 처리 조성물이 2중량% 내지 15중량%의 상기 아미노산계 중합체 또는 이의 수가용성 염 및 2중량% 내지 10중량%의 상기 하이드록시포스포노아세트산 또는 이의 수가용성 염을 포함하는, 방법.
- 제5항에 있어서, 상기 방법이 상기 추적자의 측정치를 기준으로 하여 상기 용수 설비 중의 처리 조성물의 양을 주기적으로 측정하고, 적어도 3ppm의 활성 농도의 상기 아미노산계 중합체 또는 이의 수가용성 염 및 적어도 3ppm의 활성 농도의 상기 하이드록시포스포노아세트산 또는 이의 수가용성 염을 유지하기 위해 필요한 경우 추가의 처리 조성물을 첨가함을 추가로 포함하며, 이들 농도는 상기 용수 설비 중의 상기 소정량의 물에 첨가되는 경우의 것인, 방법.
- 제1항에 있어서, 상기 제2 포스폰산이 포스포노카복실산 또는 이의 수가용성 염인, 방법.
- 제1항에 있어서, 상기 아미노산계 중합체가 폴리아스파르트산 또는 이의 수가용성 염인, 방법.
- 제1항 내지 제3항, 제7항 및 제8항 중 어느 한 항에 있어서, 규제 금속 및 주석을 상기 용수 설비 중의 상기 물에 첨가하지 않는, 방법.
- 제5항에 있어서, 상기 처리 조성물이 아연 또는 주석을 포함하지 않는, 방법.
- 제3항에 있어서, 상기 첨가 단계는 HEDP 또는 이의 수가용성 염의 활성 농도 이상인 아미노산계 중합체 또는 이의 수가용성 염의 활성 농도를 제공하는, 방법.
- 냉각수 설비 중의 금속 부품 상의 부식 또는 백청을 저해하기 위한 조성물로서, (1) 아미노산계 중합체 또는 이의 수가용성 염, (2) 하이드록시포스포노아세트산 또는 이의 수가용성 염, 및 (3) 제2 포스폰산 또는 이의 수가용성 염을 포함하고, 상기 조성물은 8을 초과하는 pH를 갖는, 조성물.
- 제12항에 있어서, 상기 제2 포스폰산이 HEDP 또는 이의 수가용성 염이고; 상기 아미노산계 중합체가 폴리아스파르트산 또는 이의 수가용성 염인, 조성물.
- 제12항 또는 제13항에 있어서, 규제 금속 또는 주석이 상기 조성물에 포함되지 않는, 조성물.
- 제12항 또는 제13항에 있어서, 상기 아미노산계 중합체 또는 이의 수가용성 염 대 상기 하이드록시포스포노아세트산 또는 이의 수가용성 염의 중량비가 90:10 내지 10:90 범위이고, 조합된 상기 아미노산계 중합체 또는 이의 수가용성 염과 상기 하이드록시포스포노아세트산 또는 이의 수가용성 염 대 상기 제2 포스폰산 또는 이의 수가용성 염의 중량비가 90:10 내지 60:40 범위인, 조성물.
- 제12항에 있어서, 상기 조성물이 2중량% 내지 15중량%의 상기 아미노산계 중합체 또는 이의 수가용성 염, 2중량% 내지 10중량%의 상기 하이드록시포스포노아세트산 또는 이의 수가용성 염, 및 2중량% 내지 10중량%의 상기 제2 포스폰산 또는 이의 수가용성 염을 포함하고; 상기 제2 포스폰산은 PBTC 또는 이의 수가용성 염인, 조성물.
- 제12항, 제13항 및 제16항 중 어느 한 항에 있어서, 아졸 부식 저해제를 추가로 포함하고, 상기 조성물의 pH는 11을 초과하는, 조성물.
- 제12항, 제13항 및 제16항 중 어느 한 항에 있어서, 모노에탄올 아민, 폴리카복실레이트 중합체, 카복실레이트/설포네이트 기능성 공중합체, 벤조트리아졸, 알킬벤조트리아졸 (톨릴트리아졸), 및 1,3,6,8-피렌테트라설폰산 사나트륨 염 중 하나 이상을 추가로 포함하는, 조성물.
- 제12항, 제13항 및 제16항 중 어느 한 항에 있어서, 상기 조성물이, 상기 냉각수 설비 중의 소정량의 물에 첨가되는 경우, 적어도 3ppm의 활성 아미노산계 중합체 또는 이의 수가용성 염 및 적어도 3ppm의 활성 하이드록시포스포노아세트산 또는 이의 수가용성 염을 얻기에 충분한 양의 아미노산계 중합체 또는 이의 수가용성 염 및 하이드록시포스포노아세트산 또는 이의 수가용성 염을 포함하는, 조성물.
- 제19항에 있어서, 상기 조성물은 규제 금속을 포함하지 않는, 조성물.
- 제12항, 제13항 및 제16항 중 어느 한 항에 있어서, 상기 조성물이 아연 또는 주석을 포함하지 않는, 조성물.
- 제1항 내지 제3항, 제7항, 제8항 및 제11항 중 어느 한 항에 있어서, 상기 용수 설비 중의 상기 물이 살생물제를 함유하는, 방법.
- 제1항 내지 제3항, 제7항, 제8항 및 제11항 중 어느 한 항에 있어서, 상기 용수 설비 중의 상기 물이 7 내지 9의 pH를 갖는, 방법.
- 제1항 내지 제3항, 제7항, 제8항 및 제11항 중 어느 한 항에 있어서, 상기 용수 설비는 개방형 재순환 설비, 폐쇄형 루프 냉각 또는 가열 설비, 또는 보일러 설비인, 방법.
- 제1항 내지 제3항, 제7항, 제8항 및 제11항 중 어느 한 항에 있어서, 상기 용수 설비 중의 상기 물이 0 미만의 LSI 값을 갖는, 방법.
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