KR102393843B1 - A Printed Circuit Board Module for a LED Lighting - Google Patents

Abstract

The present invention relates to a printed circuit board (PCB) module for LED lighting to increase structural safety and lighting properties. According to the present invention, the PCB module for LED lighting comprises: a base substrate (12) made of a metal material coupled to a receiving groove (111) formed in a fixed substrate (11); a conductive layer (14) bonded to the base substrate (12) and the upper side by a first insulating layer (13); a photo imageable solider resist (PSR) coating layer (15) coated on the conductive layer (14); and a second insulating layer (16) bonding the base substrate (12) and the fixed substrate (11). The PSR coating layer (15) includes an epoxy acrylate oligomer, 1,3,5 triglycidyl isocyanurate, an acrylate resin, and an inorganic filler.

Description

A Printed Circuit Board Module for a LED Lighting}

The present invention relates to a printed circuit board module for LED lighting, and more particularly, to a printed circuit board module for LED lighting with improved insulation safety and durability.

Various types of LED lighting are known in the art, and the LED element may be disposed on a printed circuit board (PCB) or an LED lead frame. The LED device may be disposed on a PCB in a Chip on Board method, and may be coupled to a heat dissipation block on one side of the PCB, and a lens block for controlling light distribution characteristics of the LED device may be coupled to the other side. . In such a structure, the heat dissipation structure may affect the operation of the LED element and may affect the optical characteristics of the lens block. Other factors that affect the operation of LED devices can be the insulation properties and durability of the PCB. Therefore, the PCB module needs to be made in a structure that can satisfy these various conditions. Patent Registration No. 10-1412617 discloses a PCB for LEDs capable of absorbing electromagnetic waves in a low frequency band. In addition, Patent Registration No. 10-1792106 discloses an LED PCB module having a reflective layer on a metal PCB. Considering the heat dissipation characteristics of the LED element and the material of the PCB, the PCB basically needs to have durability while maintaining insulation regardless of the environment in which it is used. However, the prior art does not disclose a PCB having such characteristics.

The present invention has the following object as to solve the problem of the preceding rider.

Prior art 1: Patent Registration No. 10-1412617 (Hong Chul-hwan, 2014.06.27. Announcement) LED PCB having electromagnetic wave absorption and heat dissipation characteristics and manufacturing method thereof Prior art 2: Patent Registration No. 10-1792106 (Soi, 2017.11.20. Announcement) LED PCB module with reflective layer on metal PCB

It is an object of the present invention to provide a printed circuit board module for LED lighting with improved structural safety and lighting characteristics due to improved insulation and durability.

According to a suitable embodiment of the present invention, a printed circuit board module for LED lighting includes a base substrate made of a metal material coupled to a receiving groove formed in a fixed substrate; a conductive layer adhered to the base substrate by a first insulating layer thereon; a PSR (Photo imageable Solider Resist) coating layer coated with a conductive layer; and a second insulating layer for bonding the base substrate and the fixed substrate, wherein the PSR coating layer includes an epoxy acrylate oligomer, 1,3,5 triglycidyl isocyanurate, an acrylate resin, and an inorganic filler.

According to another suitable embodiment of the present invention, it further includes a lens block coupled to the fixed substrate, and a plurality of convex light distribution lenses are formed in a matrix shape on the lens block.

According to another suitable embodiment of the present invention, it further includes an induction lens for guiding the LED light to each of the convex light distribution lenses.

According to another suitable embodiment of the present invention, it further includes an adhesive reinforcement groove formed on the lower surface of the base substrate.

The printed circuit board module for LED lighting according to the present invention improves adhesion to a heat dissipation substrate and has excellent insulation properties to improve durability of lighting equipment. The printed circuit board module according to the present invention may be applied to various types of LED lighting devices, and the present invention is not limited thereby.

1 shows an embodiment of a printed circuit board module for LED lighting according to the present invention.
2 illustrates an embodiment of a lens block coupled to a printed circuit board module according to the present invention.
3 shows an embodiment of an LED lighting device to which a printed circuit board module according to the present invention is applied.

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the embodiments are for a clear understanding of the present invention, and the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so unless necessary for the understanding of the invention, the description will not be repeated and well-known components will be briefly described or omitted, but the present invention It should not be construed as being excluded from the embodiment of

1 shows an embodiment of a printed circuit board module for LED lighting according to the present invention.

Referring to FIG. 1 , the printed circuit board module for LED lighting includes a metal base substrate 12 coupled to a receiving groove 111 formed in a fixed substrate 11 ; a conductive layer 14 adhered to the base substrate 12 by a first insulating layer 13 thereon; a photo imageable solider resist (PSR) coating layer 15 coated on the conductive layer 14; and a second insulating layer 16 for bonding the base substrate 12 and the fixed substrate 11, wherein the PSR coating layer 15 is an epoxy acrylate oligomer, 1,3,5 triglycidyl isocyanu. acrylates, acrylate resins and inorganic fillers. The fixed substrate 11 may have a rectangular plate shape as a whole, and may be made of aluminum or stainless steel material having high thermal conductivity, but is not limited thereto. A receiving groove 111 having a rectangular shape may be formed on the upper surface of the fixed substrate 11 , and sealing grooves 112a and 112b having an inwardly cut shape may be formed on at least one edge of the fixed substrate 11 . . The accommodating groove 111 may be formed to a depth that can accommodate the base substrate 12 , and the sealing grooves 112a and 112b may be formed in portions of long sides of the base substrate 12 facing each other. A heat dissipation block 17 may be formed below the fixed substrate 11 , and the heat dissipation block 17 may be integrally formed of the same material as the fixed substrate 11 . The heat dissipation block 17 may be made of various structures, and the present invention is not limited thereby.

A printed circuit board (PCB) may be coupled to the fixed substrate 11 , and the PCB includes a plate-shaped base substrate 12 made of a metal material such as aluminum; a conductive layer 14 made of a conductive material such as copper which is adhered to the upper surface of the base substrate 12 by a first insulating layer 13; a photo imageable solider resist (PSR) coating layer 15 coated on the upper surface of the conductive layer 14; and a second insulating layer 16 for bonding the base substrate 12 to the fixed substrate 11 . The base substrate 12 may have a rectangular plate shape, and may be made of a strong material with high thermal conductivity. The base substrate 12 may have a relatively large thickness, and the conductive layer 14 made of copper may be coupled to the upper surface by the first insulating layer 13 . The first insulating layer 13 may be formed of various types of insulating materials, synthetic resin adhesives, inorganic or organic adhesives. The first insulating layer 13 may be formed of, for example, a silicone adhesive, an acrylic adhesive, an epoxy adhesive, a ceramic adhesive, or a similar adhesive material, but is not limited thereto.

A circuit pattern for electrically connecting different LED elements may be formed on the conductive layer 14 , and the conductive layer 14 may be made of, for example, a conductive material such as copper. When the circuit pattern is formed on the conductive layer 14 , the PSR coating layer 15 may be formed on the conductive layer 14 . The PSR coating layer 15 may have a function of protecting the conductive layer 14 in the form of a thin film and preventing oxidation of the exposed circuit while preventing the LED device from bridging the soldering solder. The PSR coating layer 15 needs to be appropriately selected because the insulation and durability of the PCB have a major influence. According to one embodiment of the present invention, 1,3,5 triglycidyl isocyanurate, an acrylate resin, diethylene glycol monoethyl ether acetate, a synthetic resin adhesive and a filler (filler) may be included. Specifically, 10 to 45 wt% epoxy acrylate oligomer (epoxy acrylate oligomer); 0.5 to 5 wt % of 1,3,5 triglycidyl isocyanurate (TGIC); 1 to 20 wt% of an epoxy resin; 3 to 15 wt % of a photo initiator; 10 to 30 wt % of pigment; and 0.5 to 30 wt% of an inorganic filler. In addition, the solvent may be 10 to 40 wt% of the total weight, for example, 10 to 20 wt% of naphtha or 5 to 25 wt% of diethylene glycol monoethyl ether acetate (diethylene) glycol monoethyl ether acetate: carbitol acetate) may be used. As a solvent for coating, 10 to 20 wt% of the total weight may be used, but is not limited thereto.

The epoxy acrylate oligomer may be a diacrylate oligomer or triacrylate oligomer with controlled viscosity, whereby advantages such as curing properties by a photocuring agent, prevention of yellowing, or improvement of adhesion may be generated. there is. The epoxy acrylate oligomer may be in a form substituted with adipic acid at a ratio of, for example, 0.01 to 10 mol/L, whereby curing properties, curing properties, and insulation properties may be improved. Various types of epoxy acrylate oligomers may be added to form the PSC coating layer 15, and the present invention is not limited thereby. 1,3,5 triglycidyl isonuarate (TGIC) may have a curing agent, and has a function of stably forming the coating layer 15 by increasing adhesion while improving electrical insulation . The photoinitiator may be, for example, but not limited to, 2-Methyl-4'-(Methylthio)-2-Morpholinopropiophenone, oligomeric alpha hydroxyl ketone, 2-hydroxy-2-methyl-1-phenyl propane, or mixtures thereof. . Such a photoinitiator has a fast curing rate and is combined with a pigment so that the color appears effectively. The pigment may be, for example, TiO ₂ or ZnO, and such an oxide has an advantage that the pigment has an ultraviolet absorbing function and can improve the insulation of the coating layer 15 together with it. The inorganic filler may be, for example, but not limited to, barium sulfate, KNm04, or a similar compound. The solvent is naphtha or diethylene glycol monoethyl ether acetate (diethylene glycol monoethyl ether acetate: carbitol), which is a hydrocarbon having C9 to C16 carbon and a boiling point of 165 ° C to 290 ° C. acetate) may be included. Optionally, the PSR coating layer 15 may include 0.5 to 5.0 wt% of polypropylene or pyrrolidone or 2-pyrrolidone based on the total weight. Polypropylene or pyrrolidone may improve the water-repellent properties of the PSR, thereby improving the durability of the PCB. An LED element is disposed on a PCB having such a structure, and a lens block is combined to form a PCB block.

2 illustrates an embodiment of a lens block coupled to a printed circuit board module according to the present invention.

Referring to FIG. 2 , it further includes a lens block 21 coupled to the fixed substrate 11 , and a plurality of convex light distribution lenses 23_1 to 23_N are formed in a matrix shape on the lens block 21 . The lens block 21 may have a structure that covers the receiving groove and the PCB described above while forming a rectangular receiving case as a whole. The lens block 21 may be entirely made of a transparent synthetic resin material or a tempered glass material, and may include, for example, convex light distribution lenses 23_1 to 23_N arranged in a matrix of two rows. For example, 12 convex light distribution lenses 23_1 to 23_N may be arranged in two rows inside the long side of the lens block 21 of the rectangular accommodation case shape, and the induction of a wire for power supply between the two rows is performed. A receiving portion 24 for this may be formed. Also between the two rows a protective portion 24 may be formed to protect the fixing means for fixing the PCB to the fixing substrate. Referring to the rear surface of the lens block 21 shown in the lower part of FIG. 2 , the lens block 21 may have an upwardly convex case shape, and a height difference may be formed in the circumferential step 26 . In addition, induction lenses 27_1 to 27_N for guiding the LED light to each of the block light distribution lenses 23_1 to 23_N may be formed under each of the convex light distribution lenses 23_1 to 23_N. Referring to the right of FIG. 2 , the convex light distribution lenses 23_1 to 23_N may include a diffusion plane 231 and an induction curved surface 232 that is convex outwardly and extends downward along a circumferential surface of the diffusion plane 231 . The diffusion plane 231 may have a shape in which both sides of the diffusion plane 231 have a rectangular shape as a whole. The induction lenses 27_1 to 27_N may include a path guiding surface 271 formed to be convex outward and an induction hole 272 formed to have an elliptical shape in an upper portion of the path guiding surface 271 as a whole. The path guide surface may have an outwardly convex curved shape that gradually decreases in width as it goes to the guide hole 272 while forming a rectangular edge cross-section in which the corner is a curved surface as a whole. The guide hole 272 may have an asymmetric elliptical shape, and a portion having a relatively large horizontal distance may be formed to be located close to the edge of the path guide surface 271 . Light guided from the LED element may be emitted to the illumination area through the convex light distribution lenses 23_1 to 23_N after an emission path is formed along the induction lenses 27_1 to 27_N. The convex light distribution lenses 23_1 to 23_N or the induction lenses 27_1 to 27_N may have various structures and are not limited to the presented embodiment.

3 shows an embodiment of an LED lighting device to which a printed circuit board module according to the present invention is applied.

Referring to FIG. 3 , adhesive reinforcement grooves 31a, 31b, 33a to 33d, and 34 formed on the lower surface of the base substrate 12 are included. The PCB may be fixed to the fixed substrate 11 by an adhesive method, and the PCB may be firmly fixed to the fixed substrate 11 by a fixing means located inside the protection part 25 . A plurality of LED elements may be arranged on the PCB in a matrix shape, and a lens block in which the convex light distribution lenses 23_1 to 23_N are formed at positions corresponding to the positions of the LED elements may be coupled to the fixed substrate 11 in the form of covering the PCB. there is. The lens block may be fixed to the fixed substrate 11 by a plurality of fixing means (FB), and fastening portions 114 are formed on both sides of the fixed substrate 11 to be coupled to a lighting component such as a lighting case. there is.

Referring to the embodiment shown on the right side of FIG. 3 , adhesive reinforcing grooves 31a , 31b , 33a to 33d and 34 may be formed on the lower surface of the base substrate 12 . For example, at least one linear reinforcing grooves 31a and 31b may be formed along the longitudinal direction of the base substrate 12 , or cross reinforcing grooves 34 may be formed in a positive shape with respect to the base substrate 12 . Optionally, spare grooves 33a, 33b, 33c, and 33d extending along a portion of an edge may be formed at the ends of each of the reinforcing grooves 31a, 31b, 34. Such reinforcing grooves (31a, 31b, 34) are thermally expanded together with the strengthening of the adhesive force of the base substrate (12). It may have a function of preventing deformation due to shrinkage or partial deformation. Alternatively, while absorbing expansion or contraction along the circumferential surface of the base substrate 12 of the spare grooves 33a to 33d, it may have a function of improving the sealing property by elasticity. In the presented embodiment, the reinforcing grooves 31a, 31b, 33a, 33b, 33c, and 33d are presented as having a rectangular cross section, but may have a wedge-shaped, triangular-shaped, semi-cylindrical, trapezoidal or similar cross-section, and thus Therefore, the present invention is not limited.

Although the present invention has been described in detail with reference to the presented embodiment, those skilled in the art will be able to make various modifications and variations of the invention without departing from the technical spirit of the present invention with reference to the presented embodiment. . The present invention is not limited by such variations and modifications, but only by the claims appended hereto.

11: fixed substrate 12: base substrate
13: insulating layer 14: conductive layer
15: coating layer 21: lens block
23_1 to 23_N: light distribution lens 27_1 to 27_N: induction lens
31a, 31b, 33a to 33d, 34: reinforcing grooves

Claims (4)

a metal base substrate 12 coupled to the receiving groove 111 formed in the fixed substrate 11;
a conductive layer 14 adhered to the base substrate 12 by a first insulating layer 13 thereon;
a photo imageable solider resist (PSR) coating layer 15 coated on the conductive layer 14; and
a second insulating layer (16) bonding the base substrate (12) and the fixed substrate (11);
The PSR coating layer 15 comprises an epoxy acrylate oligomer, 1,3,5 triglycidyl isocyanurate, an acrylate resin and an inorganic filler,
Further comprising a lens block 21 coupled to the fixed substrate 11, a plurality of convex light distribution lenses 23_1 to 23_N are formed in a matrix shape on the lens block 21,
Further comprising an induction lens (27_1 to 27_N) for guiding the LED light to each of the block light distribution lenses (23_1 to 23_N) under each of the convex light distribution lenses (23_1 to 23_N),
The convex light distribution lenses 23_1 to 23_N are composed of a diffusion plane 231 and an induction curved surface 232 extending downward while being convex outward along the circumferential surface of the diffusion plane 231, and the induction lenses 27_1 to 27_N are A printed circuit board module for LED lighting, characterized in that it comprises a path guiding surface 271 formed to be convex outward and a guiding hole 272 formed to have an elliptical shape as a whole in an upper portion of the path guiding surface 271. delete delete The printed circuit board module for LED lighting according to claim 1, further comprising adhesive reinforcement grooves (31a, 31b, 33a to 33d, 34) formed on the lower surface of the base substrate (12).

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