KR102390944B1 - Improved Device and Method of Measuring Pressure Distribution of Substrates, and Vacuum Bonding Apparatus and Method of Substrates Having the Same - Google Patents

Abstract

The present invention discloses an improved substrate pressure distribution measuring apparatus and measuring method, and a substrate vacuum bonding apparatus and method having the same.
A substrate pressure distribution measuring apparatus according to the present invention comprises: a plate provided with a plurality of receiving portions; and one or more pressure measuring devices mounted on at least part or all of the plurality of receiving units, wherein the substrate pressure distribution measuring device is configured to measure a lower surface or an upper substrate of a lower jig in which the one or more pressure measuring devices support the lower substrate. It is characterized in that it is detachably provided on the stage of the substrate vacuum bonding apparatus so as to contact the lower surface of the supporting upper jig.

Description

Improved Device and Method of Measuring Pressure Distribution of Substrates, and Vacuum Bonding Apparatus and Method of Substrates Having the Same

The present invention relates to an improved substrate pressure distribution measuring apparatus and measuring method, and a substrate vacuum bonding apparatus and method having the same.

More specifically, the present invention is composed of a plate on which one or more pressure measuring devices are mounted, and is provided detachably on the stage of the substrate vacuum bonding device to be used for initial flatness setting of the upper jig for adsorbing and supporting the upper substrate. Therefore, the use of expensive pressure-sensitive paper is unnecessary, and the pressure distribution of the substrate can be measured and monitored in real time during bonding of the upper and lower substrates, so that the reliability of the substrate bonding process can be secured, and the pressure measurement device By changing positions or using additional pressure measuring devices, it is possible to quickly respond to different substrate sizes, thereby significantly reducing the overall tact time and cost, greatly reducing the chance of defective products, The present invention relates to an improved substrate pressure distribution measuring apparatus and measuring method in which quality is remarkably improved, and to a substrate vacuum bonding apparatus and method having the same.

Currently, in the display field and touch screen panel field, devices made by bonding various materials (hereinafter referred to as "substrate") are widely used, such as bonding hard materials to each other, bonding flexible materials to rigid materials, or bonding flexible materials to each other. are doing

In bonding the substrates in this way, in the related art, as shown in FIG. 1A , an in-place bonding method for constantly controlling the distance d between the upper and lower jigs 150 and 112 adsorbing both substrates 1 and 2 to be bonded. this is being used In this in-place bonding method, the lower jig 112 and the upper jig 150 are precisely sent to the pre-calculated positions, and the substrates 1 and 2 to be bonded are respectively mounted to the lower jig 112 and the upper jig 150 . The process is controlled under the assumption that they coalesce while maintaining a pre-calculated interval.

In the in-situ bonding method of the prior art described above, even if the lower jig 112 and the upper jig 150 are accurately moved to the pre-calculated positions, the shape of the substrates 1 and 2 to be actually bonded or the bonding resin R ), it is difficult to maintain a uniform spacing between the two substrates to be actually bonded due to many variables such as the distribution shape.

Therefore, by controlling the pressure applied to the substrate to be actually bonded to be the same on all surfaces of the substrate, it is required to develop a static pressure bonding technology capable of bonding while maintaining and controlling spacing uniformity so that the interval between the substrates to be bonded is the same. there is. Another static pressure bonding technology for solving the problems of the prior art was filed on February 20, 2014 in the name of a bonding device capable of static pressure bonding by Ahn Seong-ryong and others as Korean Patent Application No. 10-2014-0019469, It has been proposed in Korean Patent Publication No. 10-2015-0098341 published on August 18, 2015.

More specifically, FIG. 1b is a view showing the structure of a bonding apparatus capable of static pressure bonding according to an embodiment of the prior art.

Referring to FIG. 1B , the conventional bonding apparatus 100 capable of static pressure bonding includes a lower support panel unit 110 , a stage 120 , a pressure measuring device 130 , a flatness adjusting member 140 , and an upper jig. 150 and a control unit (not shown in the drawing) may be included.

First, the lower support panel part 110 is a component that supports the lower substrate 2 to be bonded from the lower side, and is to closely support the lower substrate 2 among both substrates to be bonded so as not to move during the bonding process. . The lower support panel part 110 has a structure in which a lower jig 112 and an intermediate connection part 114 and a contact panel 116 are additionally provided on the lower side of the lower jig 112 in terms of the installation structure. Here, the lower jig 112 is a component that actually comes into contact with the lower substrate 2 , and the contact panel 116 is provided for contacting and coupling with the stage 120 and the pressure measuring device 130 to be described later. and the intermediate connecting portion 114 is a component for connecting the contact panel 116 and the lower jig 112 . The lower jig 112 of the lower support panel part 110 may further include a vacuum adsorption means (not shown in the drawing), etc. to prevent the movement of the lower substrate 2 to be adhered.

In addition, the stage 120 is installed under the lower support panel part 110 , and is a component that connects the flatness adjusting member 140 and the lower support panel part 110 . The stage 120 is further provided with a pressure measuring device 130 and a lower panel gripper 160 to be described later. The lower panel holding part 160 is installed on the stage 120 and elastically presses the contact panel 116 of the lower support panel part 110 to the lower side so that the lower support panel part 110 is formed. It is a component that prevents movement in the left and right direction. That is, in a state in which the contact panel 116 is placed on the upper side of the plurality of pressure measuring devices 130 , the lower panel gripper 160 holds the contact panel 116 so as not to move in the left and right directions while holding the contact. The panel 116 does not affect the pressure applied to the pressure measuring device 130 . To this end, the lower panel gripper 160 may specifically include a side standing jig 162 , an inner bending jig 164 , and a pressing jig 166 . In this case, the side standing jig 162 is installed on the side of the stage 120, the lower end is a component fixed to the upper surface of the stage 120 and installed, and the inner bending jig 164 is the side standing jig It is a component installed by being bent in the central direction of the lower support panel part 110 from the upper end of the 162 . In addition, the pressing jig 166 is installed on the lower surface of the inner bending jig 164 and is a component for pressing a point on the upper surface of the lower support panel part 110 downward. At this time, the lower end of the pressing jig 166 is inserted into the contact grooves 117a and 117b formed on the upper surface of the contact panel 116 to prevent the contact panel 116 from moving in the forward, backward, left, and rightward directions.

On the other hand, any one of the inner bending jig 164 or the pressing jig 166 is preferably made of a material having an elastic force. Therefore, while the lower panel gripper 160 grips the contact panel 116 of the lower panel so as not to move in the horizontal direction, the pressure applied to the pressure measuring device 130 by the lower support panel portion 110 is not affected at all. It has an unaffected structure.

In addition, the pressure measuring device 130 is installed between the stage 120 and the contact panel 116 of the lower support panel part 110, and is installed at three or more different points of the contact panel 116. It is a component that senses the pressure applied to the lower side by the lower support panel unit 110 . That is, the pressure measuring device 130 may be installed at least at one point or several points below the contact panel 116 .

1C to 1F are views illustrating a positional relationship between a lower support panel unit and a pressure measuring device according to an embodiment according to the related art shown in FIG. 1B.

Referring to FIG. 1C , the pressure measuring device 130 is installed to contact the lower surfaces of the four corners, senses the pressure applied by each corner very precisely, and transmits the result to the control unit in real time. In addition, as shown in FIGS. 1D to 1F , the pressure measuring device 130 is arranged at various points according to the size of the substrates 1 and 2 on both sides of the bonding part to reduce the error in the pressure distribution, thereby reducing the precision of the uniformity during feedback. can be higher

Although the pressure measuring device 130 according to the above-described prior art may have various configurations, it is preferable that it is composed of a load cell because it has a simple structure and enables precise pressure measurement.

Referring back to FIG. 1B , the flatness adjusting member 140 is installed below the stage 120 , and is a component for adjusting the flatness of the stage 120 . The flatness adjusting member 140 adjusts the flatness of the stage 120, and consequently adjusts the flatness of the lower support panel part 110, which is the lower substrate 2 among the bonded substrates. Adjust the flatness. The flatness adjusting member 140 may simply be configured as a motor for elevating the corners of the stage 120 , or may have an inclined driving structure in which horizontal driving of the motor is changed to vertical driving to elevate.

In addition, the upper jig 150 is installed on the upper side of the lower support panel part 110, and is pressed in the direction of the lower support panel part 110 while supporting the upper substrate 1 from the upper side among the substrates on both sides to be bonded. is a component that That is, the substrates to be bonded by the pressing action of the contact panel 116 are bonded while uniformly spreading the bonding resin (R). For this purpose, a vacuum adsorption means may be provided for stable support of the substrate 1 which is also bonded to the upper jig 150, and an upper lifting member 170 for lifting and lowering the upper jig 150 in the vertical direction is additionally provided. provided

On the other hand, the control unit receives the pressure value applied to each point of the lower support panel part 110 according to the pressurization of the upper jig 150 from the pressure measuring device 130 and receives the pressure value of the lower support panel part 110 of the lower support panel part 110 . It is a component that controls the flatness adjusting member 140 so that the same pressure is applied to all points. This control unit performs a function of first adjusting the flatness of the lower support panel unit 110 .

In addition, in a state in which the substrates 1 and 2 that are bonded between the lower jig 112 and the upper jig 150 are mounted, the upper jig 150 presses the substrates to sense at each point of the contact panel 116 . The flatness adjusting member 140 is adjusted so that the applied pressure value is sensed to be the same as the preset pressure value. Therefore, in the bonding apparatus 100 according to the prior art described above, the pressure value applied to each point of the substrates 1 and 2 to be actually bonded is reflected in the bonding process as it is, so that the same pressure is applied to all points of the substrate to be bonded. Controlled static pressure bonding becomes possible.

In the above-described prior art, the actual pressure applied to various points such as each corner of the lower jig of the bonding device is measured in real time, and based on this pressure value, the actual pressure applied to both substrates to be bonded is sensed while both substrates are separated. Therefore, it is possible to achieve a unique effect of static pressure bonding by controlling the jigs on both sides of the bonding device so that the pressure actually applied to all surfaces of the substrates to be bonded is constant, but the following problems still occur.

1. First, in the bonding apparatus according to the prior art, the lower support panel part 110 supporting the lower substrate 2 from the lower side is in contact with the lower jig 112 and the intermediate connection part 114 on the lower side of the lower jig 112 . It has a structure further comprising a panel 116 . In addition, the pressure measuring device 130 is installed between the contact panel 116 and the stage 120 of the lower support panel part 110 , and the lower panel holding part 160 is additionally installed on the stage 120 , It is configured to prevent the lower support panel part 110 from moving in the left and right direction, and this lower panel grip part 160 specifically includes a side standing jig 162, an inner bending jig 164, and a pressing jig 166. may be included. Accordingly, the conventional bonding apparatus has a very complicated configuration and requires a large number of components, thereby increasing its manufacturing cost.

2. In addition, in the bonding device according to the prior art, since the pressure measuring device 130 is provided under the contact panel 116 , all of the upper substrate 1 and the lower substrate 2 are bonded on the lower jig 112 . Since the pressure actually applied to the surface is not directly measured, but indirectly measured through the intermediate connection part 114 and the contact panel 116, it is not easy to accurately and precisely measure the bonding pressure.

3. In addition, in the bonding apparatus according to the prior art, as shown in FIGS. 1c to 1f , the contact support panel 116 of various sizes according to the size of the substrates 1 and 2 on both sides and the various types provided thereunder A number of pressure measuring devices 130 may be used, but since these contact support panels 116 and pressure measuring devices 130 must be provided in a fixed state to the bonding device according to the prior art, both sides of the substrates 1 and 2 Each size is provided separately. That is, if the size of the bonding substrates 1 and 2 is changed, another bonding device having the contact support panel 116 and the pressure measuring device 130 of the changed size must be used, or in the existing bonding device. After replacing the contact support panel 116 and the pressure measurement device 130 with the contact support panel 116 and the pressure measurement device 130 of the changed size, the bonding device must be newly set, so that the When sizing, the overall tact time and cost increase significantly.

4. In addition, in the bonding apparatus according to the prior art, before bonding the bonding substrates 1 and 2, the upper jig 150 and the lower jig 112 are first contacted, and the upper jig 150 and the lower jig 112 are contacted. ) to set the initial flatness between To this end, in the prior art, an expensive pressure-sensitive paper (or electronic pressure-sensitive paper) is placed on the lower jig 112 , and then the upper jig 150 is lowered using the pressure measuring device 130 to determine the color of the pressure-reducing paper. The initial flatness setting is made by checking the pressure distribution according to the change. However, in the initial flatness setting, expensive pressure-sensitive paper or electronic pressure-sensitive paper must be used, and the exact pressure value cannot be known only by the color change, so the upper jig 150 and/or the lower jig 1120 according to the color change ) to adjust the initial flatness by gradually adjusting the position, there was a problem in that the time and cost required for the initial setting increase.

Therefore, a new method for solving the problems of the prior art is required.

Republic of Korea Patent Publication No. 10-2015-0098341

The present invention is to solve the problems of the prior art described above, is composed of a plate on which one or more pressure measuring devices are mounted, is provided detachably on the stage of the substrate vacuum bonding device, the upper jig for adsorbing and supporting the upper substrate It can be used to set the initial flatness of and can quickly respond to different substrate sizes by changing the position of the pressure measuring device or using an additional pressure measuring device, and thus the overall tact time and cost can be significantly reduced, and the An object of the present invention is to provide an improved substrate pressure distribution measuring apparatus and measuring method in which the possibility of occurrence of defects is greatly reduced and the quality is remarkably improved, and a substrate vacuum bonding apparatus and method having the same.

A substrate pressure distribution measuring apparatus according to a first aspect of the present invention includes: a plate provided with a plurality of accommodating portions; and one or more pressure measuring devices mounted on at least part or all of the plurality of receiving units, wherein the substrate pressure distribution measuring device is configured to measure a lower surface or an upper substrate of a lower jig in which the one or more pressure measuring devices support the lower substrate. It is characterized in that it is detachably provided on the stage of the substrate vacuum bonding apparatus so as to contact the lower surface of the supporting upper jig.

A substrate vacuum bonding apparatus according to a second aspect of the present invention includes an upper chamber and a lower chamber provided to vacuum bonding an upper substrate and a lower substrate; an upper jig provided in the upper chamber and adsorbing and supporting the upper substrate; an upper lifting member on which the upper jig is mounted and moving the upper jig to be lifted; a lower jig provided in the lower chamber and adsorbing and supporting the lower substrate; a stage on which the lower jig is mounted; a lower elevating member provided at a lower portion of the stage to move the lower jig up and down; a substrate pressure distribution measuring device detachably provided on the stage; and a flatness adjusting member provided under the stage and adjusting flatness between the upper substrate and the lower substrate or flatness of the upper jig.

A method for measuring a substrate pressure distribution according to a third aspect of the present invention comprises: a) After mounting the pressure measuring device in a receiving unit desired to be measured among a plurality of receiving units of a plate constituting the substrate pressure distribution measuring device, the plate is placed on a stage positioning; b) lowering the lower jig so that the plate comes into contact with the lower surface of the lower jig on which the lower substrate is mounted; and c) moving the upper jig on which the upper substrate is mounted onto the lower jig to measure the pressure value by moving the upper jig minutely downward while the upper substrate is in contact with the resin-coated lower substrate. It is characterized in that it includes.

The substrate vacuum bonding method according to the fourth aspect of the present invention comprises: a) After mounting the pressure measuring device in a receiving part desired to be measured among a plurality of accommodating parts of a plate constituting the substrate pressure distribution measuring device, the plate is placed on a stage making; b) lowering the lower jig into contact with the plate; c) providing an upper substrate to an upper jig for adsorption support, providing a lower substrate on the lower jig for adsorption support, and then applying a resin on the lower substrate; d) lowering the upper jig so that the upper substrate comes into contact with the lower substrate, and then moving the upper jig to the lower portion to measure the pressure value and bonding the upper substrate and the lower substrate; and e) curing the bonding substrate to which the upper substrate and the lower substrate are bonded.

Using the improved substrate pressure distribution measuring apparatus and measuring method according to the present invention, and the substrate vacuum bonding apparatus and method having the same, the following effects are achieved.

1. A substrate pressure distribution measuring apparatus is provided detachably on the stage of the substrate vacuum bonding apparatus, and can be used for initial flatness setting of the upper jig for adsorbing and supporting the upper substrate.

2. When setting the initial flatness of the upper jig, it is unnecessary to use expensive pressure-sensitive paper.

3. When the upper and lower substrates are bonded, the pressure distribution of the substrate can be measured and monitored in real time, so the reliability of the substrate bonding process can be secured.

4. Quickly respond to different substrate sizes by changing the position of the pressure measuring device or using an additional pressure measuring device.

5. The overall tact time and cost can be significantly reduced.

6. The possibility of occurrence of defects in the final product is greatly reduced, and the quality is significantly improved.

Further advantages of the present invention may become apparent from the following description with reference to the accompanying drawings in which like or similar reference numerals denote like elements.

1A is a view showing a conventional in-situ bonding method.
1B is a view showing the structure of a bonding device capable of static pressure bonding according to an embodiment of the prior art.
1C to 1F are views illustrating a positional relationship between a lower support panel unit and a pressure measuring device according to an embodiment according to the related art shown in FIG. 1B.
2A is a diagram schematically illustrating a substrate pressure distribution measuring apparatus and a substrate vacuum bonding apparatus in which an upper chamber and a lower chamber are spaced apart according to an embodiment of the present invention.
FIG. 2B is a diagram schematically illustrating a substrate pressure distribution measuring apparatus and a substrate vacuum bonding apparatus in which an upper chamber and a lower chamber are combined according to an embodiment of the present invention shown in FIG. 2A.
2C and 2D are diagrams schematically showing a top view of a substrate pressure distribution measuring apparatus according to an embodiment of the present invention.
2E is a diagram schematically illustrating a top view of a size-variable substrate pressure distribution measuring apparatus according to an embodiment of the present invention.
2F is a diagram schematically illustrating an apparatus for measuring a pressure distribution of a substrate and an apparatus for vacuum bonding a substrate in a state in which an upper jig is spaced apart according to an embodiment of the present invention.
FIG. 2G is a view schematically illustrating a substrate vacuum bonding apparatus in which the substrate pressure distribution measuring apparatus and the upper jig are coupled to each other according to an embodiment of the present invention shown in FIG. 2F.
3A is a diagram illustrating a flowchart of a method for measuring a substrate pressure distribution according to an embodiment of the present invention.
3B is a diagram illustrating a flowchart of a substrate vacuum bonding method according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to embodiments and drawings of the present invention.

2A is a diagram schematically illustrating a substrate pressure distribution measuring apparatus and a substrate vacuum bonding apparatus in which an upper chamber and a lower chamber are spaced apart according to an embodiment of the present invention, and FIG. 2B is the present invention shown in FIG. 2A It is a view schematically illustrating a substrate pressure distribution measuring apparatus and a substrate vacuum bonding apparatus in which an upper chamber and a lower chamber are adjacent to each other according to an embodiment, and FIGS. 2C and 2D are a substrate pressure distribution measuring apparatus according to an embodiment of the present invention It is a diagram schematically showing a top view of the device.

2A to 2D, the substrate pressure distribution measuring apparatus 201 according to an embodiment of the present invention includes a plate 216 provided with a plurality of receiving portions 232; and one or more pressure measuring devices 230 mounted on at least some or all of the plurality of receiving portions 232 , wherein the substrate pressure distribution measuring device 201 includes the one or more pressure measuring devices 230 at a lower portion. It is detachable on the stage 220 of the substrate vacuum bonding apparatus 200 so as to be in contact with the lower surface of the lower jig 212 supporting the substrate 2 or the lower surface of the upper jig 250 supporting the upper substrate 1 . It is characterized in that it is possible to provide.

In addition, the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention includes an upper chamber 200a and a lower chamber 200b provided for vacuum bonding the upper substrate 1 and the lower substrate 2 ; an upper jig 250 provided in the upper chamber 200a and adsorbing and supporting the upper substrate 1; an upper elevating member 270 to which the upper jig 250 is mounted and for moving the upper jig 250 to be elevating; a lower jig 212 provided in the lower chamber 200b and adsorbing and supporting the lower substrate 2; a stage 220 on which the lower jig 212 is mounted; a lower elevating member 242 provided at a lower portion of the stage 220 and moving the lower jig 210 to be elevating; a substrate pressure distribution measuring device 201 detachably provided on the stage 220; and a flatness adjusting member 240 provided under the stage 220 and adjusting the flatness between the upper substrate 1 and the lower substrate 2 or the initial flatness of the upper jig 250 . characterized by including. Here, the substrate pressure distribution measuring device 201 includes a plate 216 provided with a plurality of receiving portions 232; and one or more pressure measuring devices 230 mounted on at least a part or all of the plurality of receiving parts 232 , wherein the one or more pressure measuring devices 230 are disposed on the lower surface of the lower jig 212 or the It is provided to contact the lower surface of the upper jig 250 .

The above-described substrate pressure distribution measuring apparatus 201 according to an embodiment of the present invention and the pressure measuring apparatus 230 used in the substrate vacuum bonding apparatus 200 having the same are preferably implemented as, for example, a load cell.

Hereinafter, a detailed configuration and operation of the substrate pressure distribution measuring apparatus 201 and the substrate vacuum bonding apparatus 200 having the same according to an embodiment of the present invention will be described.

Referring back to FIGS. 2A to 2D , the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention includes an upper chamber 200a and a lower portion provided to vacuum bonding the upper substrate 1 and the lower substrate 2 to each other. A chamber 200b is provided. An upper jig 250 is provided in the upper chamber 200a to adsorb and support the upper substrate 1 . In addition, a lower jig 212 is provided in the lower chamber 200b to adsorb and support the lower substrate 2 . The upper chamber 200a may be moved up and down in the direction of the lower chamber 200b by a first driving device (not shown) provided separately, and those skilled in the art may move the upper chamber 200a in the direction of the lower chamber 200b. Instead, the lower chamber 200b may be moved up and down in the direction of the upper chamber 200a by a second driving device (not shown) separately provided in the lower chamber 200b, or the upper chamber 200a and the lower chamber 200b are It will be fully understood that the above-described first and second driving devices (not shown) may move relatively close to or away from each other.

The above-described upper jig 250 is mounted on the upper elevating member 270 , and the upper jig 250 may be moved up and down on the lower jig 212 by the upper elevating member 270 .

In addition, the lower jig 212 is mounted on the stage 220 , and may be lifted and moved by the lower lifting member 242 provided at the lower portion of the stage 220 .

Further, on the stage 220 , a substrate pressure distribution measuring device 201 is provided detachably. This substrate pressure distribution measuring apparatus 201 includes a plate 216 provided with a plurality of receiving portions 232 . One or more pressure measuring devices 230 are mounted in at least some or all of the plurality of receiving units 232 . One or more pressure measuring devices 230 provided in the substrate pressure distribution measuring device 201 are provided to contact the lower surface of the lower jig 212 supporting the lower substrate 2 .

More specifically, referring to FIGS. 2C and 2D , the receiving portions 232a, 232b, 232c, and 232d are provided on the plate 216 at four locations including, for example, three outer portions and one central portion. has been In this case, three pressure measuring devices 230 are provided in three receiving portions 232a, 232b, and 232c located on three outer portions of the plate 216 so that the upper substrate 1 and the lower substrate 2 are separated. A pressure measuring device 230 is provided for measuring the cementing pressure distribution (in case A shown in FIG. 2C) or only in one receiving portion 232d located in the central portion of the plate 216, so that the upper substrate 1 and The bonding pressure distribution between the lower substrates 2 can be measured (in case of B shown in FIG. 2D ). These embodiments shown in Figs. 2c and 2d are exemplary, and those skilled in the art can, for example, pressure in the upper right receiving portion 232b and the central receiving portion 232d among the four receiving portions 232 shown in Fig. 2c. It will be fully understood that a measuring device 230 may be provided to measure the bonding pressure distribution between the upper substrate 1 and the lower substrate 2 .

Meanwhile, the substrate pressure distribution measuring apparatus 201 used in the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention may be implemented as a size-variable substrate pressure distribution measuring apparatus 201 .

More specifically, FIG. 2E is a diagram schematically illustrating a top view of a size-variable substrate pressure distribution measuring apparatus according to an embodiment of the present invention.

Referring to FIG. 2E , a size-variable substrate pressure distribution measuring apparatus 201 according to an embodiment of the present invention includes a plurality of first receiving units on a first region R1 corresponding to a lower substrate 2 having a first size. A first area plate 216a provided with 232a and a second area plate provided with a plurality of second receiving portions 232b on a second area R2 corresponding to the lower substrate 2 of the second size ( 216b) and a plate 216 composed of an n-th region plate 216n in which a plurality of n-th accommodating portions 232n are provided on the n-th region Rn corresponding to the n-th size lower substrate 2; and one or more pressure measuring devices 230 mounted on at least some or all of the plurality of first accommodating parts 232a to nth accommodating parts 232n.

As in the embodiment shown in FIG. 2E , when the size of the lower substrate 2 has a size corresponding to the first region R1 , the pressure measuring device 230 is provided on the first region plate 216a. It may be provided in at least some or all of the plurality of first receiving portions 232a to measure the pressure distribution during bonding of the upper substrate 1 and the lower substrate 2 shown in FIGS. 2A and 2B .

In addition, when the size of the lower substrate 2 has a size corresponding to the second region R1 , the pressure measuring device 230 includes the plurality of first receiving portions 232a provided on the second region plate 216b. ) and the second accommodating part 232b may be provided in at least some or all of them to measure the pressure distribution when the upper substrate 1 and the lower substrate 2 shown in FIGS. 2A and 2B are attached to each other.

In addition, when the size of the lower substrate 2 has a size corresponding to the third region R3 , the pressure measuring device 230 includes the plurality of first receiving portions 232a provided on the third region plate 216c. ) to at least some or all of the n-th accommodating part 232n to measure the pressure distribution when the upper substrate 1 and the lower substrate 2 shown in FIGS. 2A and 2B are attached to each other.

In addition, a flatness adjusting member 240 is provided at the lower portion of the stage 220 to measure and adjust the flatness of the stage 220 , thereby ultimately adjusting the flatness between the upper jig 250 and the lower jig 212 . It is possible.

Hereinafter, a method for controlling the flatness between the upper jig 250 and the lower jig 212 and the substrate pressure using the substrate pressure distribution measuring apparatus 201 and the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention A distribution measurement method will be described in detail. Here, the substrate pressure distribution measuring device 201 is described with reference to the substrate pressure distribution measuring device 201 of the description shown in FIGS. 2C and 2D for convenience of description, but those skilled in the art will know that the size-variable substrate pressure distribution shown in FIG. 2E is used. It will be fully understood that the same may be applied to the measuring device 201 .

Referring again to FIGS. 2A to 2E , in the substrate pressure distribution measuring apparatus 201 and the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention, first, a plate constituting the substrate pressure distribution measuring apparatus 201 ( After mounting the pressure measuring device 230 in the receiving unit 232 to be measured among the plurality of receiving units 232 of the 216 , the plate 216 is positioned on the stage 220 .

Thereafter, the lower jig 210 is lowered using the lower lifting member 242 so that the upper portion of the pressure measuring device 230 comes into contact with the lower surface of the lower jig 210 . After that, the lower substrate 2 is mounted on the lower jig 212 and vacuum-adsorbed, and then the resin R is applied on the lower substrate 2 (see FIG. 2B ).

Thereafter, the upper lifting device 270 moves the upper jig 250 on which the upper substrate 1 is mounted onto the lower jig 212 to bring the upper substrate 1 and the lower substrate 2 into contact with the upper jig. The pressure measuring device 230 measures the pressure value between the upper substrate 1 and the lower substrate 2 while performing the bonding process by moving 250 finely downward. The measured pressure value is transmitted to a separately provided control unit (not shown), and may be displayed, for example, on a monitor member (not shown) such as a display. As a result, the pressure distribution measured according to the bonding of the upper substrate 1 and the lower substrate 2 can be confirmed. According to the confirmed pressure distribution, the flatness of the stage 220 may be adjusted by using the flatness adjusting member 240 provided at the lower portion of the stage 220 , and the flatness of the stage 220 may be adjusted by adjusting the flatness of the stage 220 . Ultimately, the flatness between the upper substrate 1 and the lower substrate 2 may be adjusted.

As described above, the substrate pressure distribution measuring apparatus 201 used in the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention has a very simple structure, and the pressure measuring apparatus 230 includes a lower jig. Since the pressure during bonding of the upper substrate 1 and the lower substrate 2 is measured at a plurality of positions desired by the user by direct contact with the lower surface of the 212, the pressure between the upper substrate 1 and the lower substrate 2 The distribution can be measured and monitored very precisely and accurately.

Meanwhile, by using the substrate pressure distribution measuring apparatus 201 according to an embodiment of the present invention, it is possible to measure and set the initial flatness of the upper jig 250 .

More specifically, FIG. 2F is a diagram schematically illustrating a substrate pressure distribution measuring apparatus and a substrate vacuum bonding apparatus in a state in which the upper jig is spaced apart according to an embodiment of the present invention, and FIG. 2G is a view shown in FIG. 2F It is a diagram schematically illustrating a substrate vacuum bonding apparatus in which the substrate pressure distribution measuring apparatus and the upper jig are coupled according to an embodiment of the present invention.

2F and 2G , in the substrate pressure distribution measuring apparatus 201 and the substrate vacuum bonding apparatus 200 according to an embodiment of the present invention, first, the plate 216 constituting the substrate pressure distribution measuring apparatus 201 . ) of the plurality of accommodating parts 232 , after mounting the pressure measuring device 230 in the desired accommodating part 232 , the plate 216 is positioned on the stage 220 .

Then, the upper lifting device 270 moves the upper jig 250 in a state in which the upper substrate 1 is not mounted onto the plate 216 to place the lower surface of the upper jig 250 on the plate 216 . After direct contact, the pressure value between the upper jig 250 and the plate 216 is measured by using the pressure measuring device 230 while moving the upper jig 250 down. The measured pressure value may be transmitted to a separately provided control unit (not shown), and may be displayed, for example, on a monitor member (not shown) such as a display. As a result, the pressure distribution measured according to the contact between the upper jig 250 and the plate 216 can be confirmed. According to the confirmed pressure distribution, the initial flatness of the upper jig 250 may be confirmed, and the initial flatness of the stage 220 may be adjusted using the flatness adjusting member 240 provided at the lower portion of the stage 220 . By adjusting, the initial flatness (flatness) of the upper jig 250 may be adjusted. As a result, if the substrate pressure distribution measuring apparatus 201 according to an embodiment of the present invention is used, the initial flatness of the upper jig 250 is measured and set without using expensive pressure-sensitive paper or electronic pressure-sensitive paper as in the prior art. this becomes possible

Therefore, according to the present invention, 1) the substrate pressure distribution measuring apparatus 201 is provided detachably on the stage 220 of the substrate vacuum bonding apparatus 200, and an upper jig for adsorbing and supporting the upper substrate 1 ( 250) can be used for the initial flatness setting, 2) unlike the prior art, it is unnecessary to use expensive pressure-sensitive paper for initial flatness setting, and 3) the pressure distribution of the substrate during bonding of the upper and lower substrates in real time It is possible to measure and monitor the reliability of the substrate bonding process, 4) change the position of the pressure measuring device or use an additional pressure measuring device to quickly respond to various substrate sizes, 5) the overall process time ( tact time) and cost can be significantly reduced, 6) the possibility of occurrence of defects in the final product is greatly reduced, and the advantages that the quality is significantly improved can be achieved.

3A is a diagram illustrating a flowchart of a method for measuring a substrate pressure distribution according to an embodiment of the present invention.

Referring to FIG. 3A together with FIGS. 2A to 2E , the method 300 for measuring a substrate pressure distribution according to an embodiment of the present invention includes a) a plurality of plates 216 constituting the substrate pressure distribution measuring apparatus 201 . A step 310 of mounting the pressure measuring device 230 in the receiving unit 232 of the receiving unit 232 to be measured and then placing the plate 216 on the stage 220; b) lowering the lower jig 212 so that the plate 216 comes into contact with the lower surface of the lower jig 212 on which the lower substrate 2 is mounted (320); and c) moving the upper jig 250 on which the upper substrate 1 is mounted onto the lower jig 212 so that the upper substrate 1 comes into contact with the lower substrate 2 coated with the resin (R). In this state, the step 330 of measuring the pressure value by moving the upper jig 250 to the lower part is included.

The substrate pressure distribution measuring method 300 according to the embodiment of the present invention described above d) uses the measured pressure value to measure the pressure distribution at the time of bonding between the upper substrate 1 and the lower substrate 2 in real time. to confirm with; and e) adjusting the flatness between the upper substrate 1 and the lower substrate 2 using the pressure distribution.

In addition, in the method 300 for measuring a substrate pressure distribution according to an embodiment of the present invention, before performing steps a) to e), a1) measuring among the plurality of receiving parts 232 of the plate 216 . placing the plate 216 on the stage 220 after mounting the pressure measuring device 230 in the receiving part 232 where you want to; b1) lowering the upper jig 250 so that the lower surface of the upper jig 250 in a state in which the upper substrate 1 is not mounted comes into contact with the plate 216; and c1) setting the initial flatness of the upper jig 250 by measuring an initial pressure value by moving the upper jig 250 down.

Also, the substrate pressure distribution measuring apparatus 201 used in the substrate pressure distribution measuring method 300 according to an embodiment of the present invention may be implemented as a size-variable substrate pressure distribution measuring apparatus.

3B is a diagram illustrating a flowchart of a substrate vacuum bonding method according to an embodiment of the present invention.

Referring to FIG. 3B together with FIGS. 2A to 2E , a substrate vacuum bonding method 301 according to an embodiment of the present invention includes a) a plurality of receiving plates 216 constituting the substrate pressure distribution measuring device 201 . After mounting the pressure measuring device 230 in the receiving part 232 of the part 232 to be measured, the step 311 of placing the plate 216 on the stage 220; b) lowering the lower jig 210 to contact the plate 216 ( 321 ); c) The upper substrate 1 is provided on the upper jig 2 for adsorption support, and the lower substrate 2 is provided on the lower jig 212 for adsorption support, and then the resin (R) on the lower substrate 2 . ) applying a step (331); d) lowering the upper jig 250 so that the upper substrate 1 comes into contact with the lower substrate 2 ) and bonding the lower substrate 2 (341); and e) curing (351) the bonding substrate to which the upper substrate 1 and the lower substrate 2 are bonded.

The substrate vacuum bonding method 301 according to an embodiment of the present invention described above uses the measured pressure value d1) between steps d) and e) to the upper substrate 1 and the lower substrate ( 2) checking the pressure distribution in the liver in real time; and d2) adjusting the flatness between the upper substrate 1 and the lower substrate 2 using the pressure distribution.

In addition, in the substrate vacuum bonding method 301 according to an embodiment of the present invention, before performing steps a) to e), a1) measurement among the plurality of receiving portions 232 of the plate 216 is performed. placing the plate (216) on the stage (220) after mounting the pressure measuring device (230) in the desired receiving part (232); b1) lowering the upper jig 250 so that the lower surface of the upper jig 250 in a state in which the upper substrate 1 is not mounted comes into contact with the plate 216; and c1) setting the initial flatness of the upper jig 250 by measuring an initial pressure value by moving the upper jig 250 down.

Also, the substrate pressure distribution measuring apparatus 201 used in the substrate vacuum bonding method 301 according to an embodiment of the present invention may be implemented as a size-variable substrate pressure distribution measuring apparatus.

Since various modifications can be made in the constructions and methods described and illustrated herein without departing from the scope of the invention, it is intended that all matter contained in the above detailed description or shown in the accompanying drawings be illustrative and not intended to limit the invention. it is not Accordingly, the scope of the present invention is not limited by the above-described exemplary embodiments, and should be defined only in accordance with the following claims and their equivalents.

1: upper substrate 2: lower substrate 100: bonding device
110: lower support panel part 112, 212: lower jig 120, 220: stage
130,230: pressure measuring device 140,240: flatness control member
150,250: upper jig 160: lower panel gripping part
170,270: upper lifting member 200: substrate vacuum bonding device
200a: upper chamber 200b: lower chamber 201: substrate pressure distribution measuring device
216: plate 232,232a,232b,232c,232d,232n: receiving part
242: lower lifting member

Claims (17)

A substrate pressure distribution measuring apparatus comprising:
a plate provided with a plurality of accommodating portions; and
One or more pressure measuring devices mounted on at least a part or all of the plurality of receptacles
including,
The substrate pressure distribution measuring device is detachably provided on the stage of the substrate vacuum bonding device so that the one or more pressure measuring devices come into contact with a lower surface of a lower jig supporting a lower substrate or a lower surface of an upper jig supporting an upper substrate becomes,
The substrate pressure distribution measuring device is a substrate pressure distribution measuring device implemented as a size-variable substrate pressure distribution measuring device. The method of claim 1,
The one or more pressure measuring devices mounted in the plurality of receptacles may change positions according to positions to be measured, or additional pressure measuring devices may be mounted in the plurality of receptacles. delete 3. The method of claim 1 or 2,
The substrate pressure distribution measuring apparatus further includes a control unit for controlling the measured pressure distribution in real time and a monitor member for displaying the measured pressure distribution in real time. In the vacuum bonding apparatus,
an upper chamber and a lower chamber provided for vacuum bonding the upper substrate and the lower substrate;
an upper jig provided in the upper chamber and adsorbing and supporting the upper substrate;
an upper lifting member on which the upper jig is mounted and moving the upper jig to be lifted;
a lower jig provided in the lower chamber and adsorbing and supporting the lower substrate;
a stage on which the lower jig is mounted;
a lower elevating member provided at a lower portion of the stage to move the lower jig up and down;
a substrate pressure distribution measuring device detachably provided on the stage; and
A flatness adjusting member provided under the stage to adjust the flatness between the upper substrate and the lower substrate or the flatness of the upper jig
includes,
The substrate pressure distribution measuring device is
a plate provided with a plurality of accommodating portions; and
One or more pressure measuring devices mounted on at least a part or all of the plurality of receptacles
including,
The one or more pressure measuring devices are provided to be in contact with a lower surface of the lower jig or a lower surface of the upper jig,
The substrate pressure distribution measuring device is a substrate vacuum bonding device implemented as a size-variable substrate pressure distribution measuring device. delete 6. The method of claim 5,
The one or more pressure measuring devices mounted in the plurality of accommodating parts may change positions according to positions to be measured, or additional pressure measuring devices may be mounted in the plurality of accommodating parts. delete 8. The method according to claim 5 or 7,
The substrate vacuum bonding apparatus further comprises a control unit for controlling the measured pressure distribution in real time and a monitor member for displaying the measured pressure distribution in real time. A method for measuring a substrate pressure distribution, the method comprising:
a) placing the plate on a stage after mounting the pressure measuring device in a receiving part desired to be measured among a plurality of accommodating parts of a plate constituting the substrate pressure distribution measuring device;
b) lowering the lower jig so that the plate comes into contact with the lower surface of the lower jig on which the lower substrate is mounted; and
c) measuring the pressure value by moving the upper jig on which the upper substrate is mounted onto the lower jig and then moving the upper jig slightly downward while the upper substrate is in contact with the resin-coated lower substrate
includes,
The substrate pressure distribution measuring device used in the substrate pressure distribution measuring method is a substrate pressure distribution measuring method implemented as a size-variable substrate pressure distribution measuring device. 11. The method of claim 10,
The substrate pressure distribution measuring method is
d) checking a pressure distribution between the upper substrate and the lower substrate in real time using the measured pressure value; and
e) adjusting the flatness between the upper substrate and the lower substrate using the pressure distribution
Substrate pressure distribution measurement method further comprising a. 12. The method of claim 11,
The method for measuring the substrate pressure distribution is performed before steps a) to d) are performed.
a1) placing the plate on the stage after mounting the pressure measuring device in the receiving unit to be measured among the plurality of receiving units of the plate;
b1) lowering the upper jig so that the lower surface of the upper jig in a state in which the upper substrate is not mounted comes into contact with the plate; and
c1) setting the initial flatness of the upper jig by measuring the initial pressure value by moving the upper jig to the lower part
Substrate pressure distribution measurement method further comprising a. delete In the substrate vacuum bonding method,
a) placing the plate on a stage after mounting the pressure measuring device in a receiving part desired to be measured among a plurality of accommodating parts of a plate constituting the substrate pressure distribution measuring device;
b) lowering the lower jig into contact with the plate;
c) providing an upper substrate to an upper jig for adsorption support, providing a lower substrate on the lower jig for adsorption support, and then applying a resin on the lower substrate;
d) lowering the upper jig so that the upper substrate comes into contact with the lower substrate, then moving the upper jig to the lower portion to measure a pressure value and bonding the upper substrate and the lower substrate; and
e) curing the bonded substrate to which the upper substrate and the lower substrate are bonded
includes,
The substrate pressure distribution measuring device used in the substrate vacuum bonding method is a substrate vacuum bonding method implemented as a size-variable substrate pressure distribution measuring device. 15. The method of claim 14,
The substrate vacuum bonding method is performed between steps d) and e).
d1) checking a pressure distribution between the upper substrate and the lower substrate in real time using the measured pressure value; and
d2) adjusting the flatness between the upper substrate and the lower substrate using the pressure distribution
Substrate vacuum bonding method further comprising a. 15. The method of claim 14,
The substrate vacuum bonding method is performed before steps a) to e) are performed.
a1) placing the plate on the stage after mounting the pressure measuring device in the receiving unit to be measured among the plurality of receiving units of the plate;
b1) lowering the upper jig so that the lower surface of the upper jig in a state in which the upper substrate is not mounted comes into contact with the plate; and
c1) setting the initial flatness of the upper jig by measuring the initial pressure value by moving the upper jig to the lower part
Substrate vacuum bonding method further comprising a. delete

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