KR102387993B1 - adhesive member, adhesive sheet comprising the same and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a release film for an adhesive member, an adhesive sheet comprising the same, and a method for manufacturing the same, and more particularly, it has excellent bending characteristics as well as excellent productivity and flexibility, and has appropriate adhesiveness in the manufacturing process It relates to a release film for an adhesive member that not only has stability but also has good bubble generation during the laminating process, an adhesive sheet including the same, and a manufacturing method thereof.

Description

Release film for adhesive member, adhesive sheet including same, and manufacturing method thereof

The present invention relates to a release film for an adhesive member, an adhesive sheet comprising the same, and a method for manufacturing the same, and more particularly, it has excellent bending characteristics as well as excellent productivity and flexibility, and has appropriate adhesiveness in the manufacturing process It relates to a release film for an adhesive member that not only has stability but also has good bubble generation during the laminating process, an adhesive sheet including the same, and a manufacturing method thereof.

With the development of high-tech industry, the requirements for protecting parts or modules from the outside by using adhesive sheets or adhesive sheets or adhesive sheets or adhesive sheets rather than screw fixing of parts and modules are increasing.

In accordance with the trend of advanced parts and modules, the laminating process is performed using a protective sheet, an adhesive sheet and/or an adhesive sheet. is gradually increasing.

For example, when a protective sheet, an adhesive sheet, and/or an adhesive sheet is applied to a PPF film or tablet case applied to an automobile exterior, if bubbles are generated in the laminating process, there is a problem that lamination must be performed again after delamination.

Among the protective sheet, the adhesive sheet and/or the adhesive sheet, an acrylic adhesive sheet, a silicone adhesive sheet, and a urethane adhesive sheet are mostly used.

Among the pressure-sensitive adhesive sheets, the pressure-sensitive adhesive sheet to which the silicone pressure-sensitive adhesive is applied has the least generation of air bubbles during lamination.

On the other hand, in order to assemble an OLED panel or to construct a plurality of circuit boards, it is laminated and laminated with a functional adhesive sheet and assembled into one laminated module. Because these OLED modules and circuit boards require strong impact resistance, thermal conductivity and heat resistance for heat dissipation, functional acrylic, urethane, or silicone-based adhesive sheets are used, and the coating thickness of the adhesive layer is as high as 30㎛ or more. When laminating and laminating, assembling without bubbles is very important for product reliability.

Korean Patent Publication No. 10-2019-0101646 (published on: 2019.09.02)

The present invention has been devised in consideration of the above points, and has excellent bending characteristics, productivity and flexibility, and has appropriate adhesiveness to have stability in the manufacturing process, as well as to prevent the generation of bubbles during the laminating process. An object of the present invention is to provide a good release film for an adhesive member, an adhesive sheet comprising the same, and a method for manufacturing the same.

In order to solve the above problems, the release film for an adhesive member of the present invention is a release film for an adhesive member in which a first adhesive film, a base member and a second adhesive film are sequentially stacked, and the thickness of the first adhesive film is the second It may be thinner than the thickness of the adhesive film.

In a preferred embodiment of the present invention, the first adhesive film may have a 10-point average roughness (Rz) of 1.5 to 9 μm.

In a preferred embodiment of the present invention, the second adhesive film may have a 10-point average roughness (Rz) of 1.5 to 9 μm.

In a preferred embodiment of the present invention, the first pressure-sensitive adhesive film is a polyester-based polymer, an acrylic polymer, a styrene-based polymer, a polycarbonate-based polymer, a polyolefin copolymer, a vinyl chloride-based polymer, an amide-based polymer, an imide-based polymer, It may include at least one selected from a phone-based polymer, a polyphenylene sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer.

In a preferred embodiment of the present invention, the second adhesive film is a polyester-based polymer, an acrylic polymer, a styrene-based polymer, a polycarbonate-based polymer, a polyolefin copolymer, a vinyl chloride-based polymer, an amide-based polymer, an imide-based polymer, It may include at least one selected from a phone-based polymer, a polyphenylene sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer.

In a preferred embodiment of the present invention, the first pressure-sensitive adhesive film may include biaxially oriented polypropylene (biaxially oriented polypropylene).

In a preferred embodiment of the present invention, the second adhesive film may include biaxially oriented polypropylene.

In a preferred embodiment of the present invention, the base member may include paper.

In a preferred embodiment of the present invention, the base member may have a basis weight of 20 to 90 g/m ² .

In a preferred embodiment of the present invention, when the base member has a basis weight of 30 g/m ² , the first adhesive film may have a thickness of 15 to 45 μm, and the second adhesive film may have a thickness of 20 to 55 μm. there is.

On the other hand, the adhesive sheet of the present invention may include an adhesive member and the release film for the adhesive member of the present invention laminated on one surface of the adhesive member.

In a preferred embodiment of the present invention, the first adhesive film of the release film may be laminated on one surface of the adhesive member.

In a preferred embodiment of the present invention, the adhesive member may include at least one selected from an epoxy resin, an acrylic resin, a urethane resin, and a silicone resin.

In a preferred embodiment of the present invention, the epoxy resin is one selected from bisphenol A epoxy resin, cresol novolak epoxy resin, phenol novolac epoxy resin, naphthalene-based epoxy resin, and dicyclopentadiene (DCPD) type epoxy resin. may include more than one.

In a preferred embodiment of the present invention, the pressure-sensitive adhesive member and the release film may have a thickness ratio of 1: 2-6.

Furthermore, in the method for manufacturing an adhesive sheet of the present invention, a first step of manufacturing a release film by laminating the substrate member to be positioned between the first adhesive film and the second adhesive film, curing the first adhesive film, and adhesion to one surface of the release substrate A second step of coating the member composition and curing it to form an adhesive member, a third step of curing the first adhesive film of a release film and the adhesive member to face, laminating, and curing the release substrate It may include a fourth step of manufacturing the adhesive sheet by removing the.

In a preferred embodiment of the present invention, in the method for manufacturing an adhesive sheet of the present invention, the thickness of the first adhesive film is thinner than the thickness of the second adhesive film, and the first adhesive film and the second adhesive film are 1.5 to 10 μm, respectively. It may have a 10-point average roughness (Rz).

In a preferred embodiment of the present invention, in the method for manufacturing an adhesive sheet of the present invention, the first adhesive film and the second adhesive film may each include biaxially oriented polypropylene, and the base member is made of paper. may include

In a preferred embodiment of the present invention, in the method for manufacturing the adhesive sheet of the present invention, the base member may have a basis weight of 20 to 90 g/m ² .

In a preferred embodiment of the present invention, when the base member has a basis weight of 30 g/m ² in the method for manufacturing an adhesive sheet of the present invention, the first adhesive film has a thickness of 15 to 45 μm, and the second adhesive film has a thickness of 20 It may have a thickness of ~ 55㎛.

Furthermore, the method for manufacturing a multilayer circuit board of the present invention includes a first step of preparing a first circuit board, a second circuit board and the adhesive sheet of the present invention, attaching the adhesive member of the adhesive sheet to one surface of the first circuit board, A second step of manufacturing a first circuit board having an adhesive member attached to one surface by removing the release film of the adhesive sheet, and attaching the adhesive member of the first circuit board to one surface of the second circuit board, a multilayer circuit board It may include a third step of manufacturing.

The release film for an adhesive member of the present invention, a pressure-sensitive adhesive sheet comprising the same, and a manufacturing method thereof have not only excellent bending properties, but also excellent productivity and flexibility, have appropriate adhesiveness, and have stability in the manufacturing process, as well as a laminating process The generation of air bubbles is good.

1 is a cross-sectional view of an adhesive sheet according to a preferred embodiment of the present invention.
2 is a process diagram of a method for manufacturing an adhesive sheet according to a preferred embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar elements throughout the specification.

The adhesive sheet of the present invention serves to mutually adhere and/or adhere to various adherends, for example, between circuit boards, and may be an adhesive sheet or an adhesive sheet.

Specifically, when the adhesive sheet of the present invention is described with reference to FIG. 1 , it may include an adhesive member 200 and a release film 100 for an adhesive member laminated on one surface of the adhesive member 200 .

First, the adhesive member 200 exhibits a certain adhesive force and/or adhesive force to serve to adhere or adhere various adherends, for example, a plurality of circuit boards to each other, among epoxy resins, acrylic resins, urethane resins and silicone resins. It may include one or more selected from, preferably an epoxy resin.

Specifically, the epoxy resin may include at least one selected from bisphenol A epoxy resin, cresol novolac epoxy resin, phenol novolac epoxy resin, naphthalene-based epoxy resin, and dicyclopentadiene (DCPD)-type epoxy resin.

Next, the release film 100 for the adhesive member serves to protect the adhesive member 200 .

Specifically, the release film 100 for an adhesive member may have a configuration in which the first adhesive film 20, the base member 10, and the second adhesive film 30 are sequentially stacked. At this time, the first adhesive film 20 of the release film 100 may be laminated on one surface of the adhesive member 200 .

In other words, the adhesive sheet of the present invention may have a configuration in which the adhesive member 200 , the first adhesive film 20 , the base member 10 and the second adhesive film 30 are sequentially stacked.

The base member 10 of the present invention may include paper, preferably 20 to 90 g/m ² of basis weight, more preferably 20 to 40 g/m ² It may include paper having a basis weight . If the basis weight of the paper is less than 20 g/m ² , as well as the appearance of pinholes, etc. is poor, there may be a problem in that a large amount of air bubbles are generated during the manufacture of the adhesive sheet of the present invention, and it exceeds 90 g/m ² If this is done, there may be problems of reduced productivity and increased cost, as well as reduced flexibility.

The first adhesive film 20 of the present invention is a polyester-based polymer, acrylic polymer, styrene-based polymer, polycarbonate-based polymer, polyolefin copolymer, vinyl chloride-based polymer, amide-based polymer, imide-based polymer, sulfone-based polymer, poly It may include at least one selected from a phenylene sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer, preferably a polyolefin copolymer, more preferably It may include biaxially oriented polypropylene.

At this time, the polyester-based polymer may include at least one selected from polyethylene terephthalate and polyethylene naphthalate, and may include polymethyl methacrylate as the acrylic polymer, and polystyrene and acrylonitrile- It may include at least one selected from among styrene copolymers, and may include at least one selected from polyethylene and polypropylene as a polyolefin copolymer, and may include at least one selected from nylon and aromatic polyamide as an amide-based polymer. can

In addition, the first adhesive film 20 of the present invention may have a 10-point average roughness (Rz, ten point median height roughness) of 1.5 to 9 μm, preferably 1.5 to 5 μm, more preferably 2 to 4 μm. there is. If the 10-point average roughness is less than 1.5 μm, there may be a problem in that the control characteristics of the surface adhesive force are lowered, and if it exceeds 9 μm, there may be a problem in that the releasability with the adhesive member 200 is reduced due to the anchoring effect.

The second adhesive film 30 of the present invention is a polyester-based polymer, acrylic polymer, styrene-based polymer, polycarbonate-based polymer, polyolefin copolymer, vinyl chloride-based polymer, amide-based polymer, imide-based polymer, sulfone-based polymer, poly It may include at least one selected from a phenylene sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer, preferably a polyolefin copolymer, more preferably It may include biaxially oriented polypropylene.

At this time, the polyester-based polymer may include at least one selected from polyethylene terephthalate and polyethylene naphthalate, and may include polymethyl methacrylate as the acrylic polymer, and polystyrene and acrylonitrile- It may include at least one selected from among styrene copolymers, and may include at least one selected from polyethylene and polypropylene as a polyolefin copolymer, and may include at least one selected from nylon and aromatic polyamide as an amide-based polymer. can

In addition, the second adhesive film 30 of the present invention may have a 10-point average roughness (Rz, ten point median height roughness) of 1.5 to 9 μm, preferably 1.5 to 5 μm, more preferably 2 to 4 μm. there is. If the 10-point average roughness is less than 1.5 μm, there may be a problem in that the control characteristics of the surface adhesive force are lowered, and if it exceeds 9 μm, there may be a problem in that the releasability with the adhesive member 200 is reduced due to the anchoring effect.

On the other hand, the release film 100 for an adhesive member of the present invention has a technical feature that the thickness of the first adhesive film 20 is thinner than the thickness of the second adhesive film 30 , and if the thickness of the first adhesive film 20 is If is equal to or thicker than the thickness of the second adhesive film 30, there may be a problem in that the bending characteristics are lowered.

Specifically, when the release film 100 for an adhesive member of the present invention has a basis weight of 30 g/m ² of paper, the first adhesive film 20 has a thickness of 15 to 45 μm, preferably 15 to 35 μm. may have a thickness of, more preferably, a thickness of 17 to 23 μm, and the second adhesive film 30 has a thickness of 20 to 55 μm, preferably a thickness of 20 to 45 μm, more preferably 22 to 28 It may have a thickness of μm. If the thickness of the first adhesive film 20 is less than 15 μm, it is difficult to give the above-mentioned 10-point average roughness range, and fairness is deteriorated. There may be problems with increasing this and decreasing flexibility. In addition, if the thickness of the second adhesive film 30 is less than 20 μm, it is difficult to give the above-mentioned 10-point average roughness range, and fairness is deteriorated. There may be problems with increasing this and decreasing flexibility.

On the other hand, in the adhesive sheet of the present invention, the adhesive member 200 and the release film 100 for the adhesive member may have a thickness ratio of 1: 2 to 6, preferably 1: 2 to 4, if the thickness ratio is 1: 2 If it is less than, there may be a problem in that it is difficult to give a range of 10-point average roughness, and if it exceeds 1: 6, there may be problems in that cost increases and flexibility is lowered.

Furthermore, when the method for manufacturing the pressure-sensitive adhesive sheet of the present invention is described with reference to FIG. 2 , the method for manufacturing the pressure-sensitive adhesive sheet of the present invention includes first to fourth steps.

First, in the first step of the method for manufacturing an adhesive sheet of the present invention, the substrate member 10 is laminated so that the base member 10 is positioned between the first adhesive film 20 and the second adhesive film 30, and then cured to form a release film (100) can be prepared. At this time, the lamination may be performed at a speed of 50 to 200 m/min by putting it on a gap roller. In addition, curing may be performed without limitation as long as it is a method commonly used in the art, and UV curing or thermal curing may be preferably performed.

The first adhesive film 20 is a polyester-based polymer, acrylic polymer, styrene-based polymer, polycarbonate-based polymer, polyolefin copolymer, vinyl chloride-based polymer, amide-based polymer, imide-based polymer, sulfone-based polymer, polyphenylene sulfide It may include at least one selected from a polymer-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer, preferably a polyolefin copolymer, and more preferably 2 It may include biaxially oriented polypropylene.

At this time, the polyester-based polymer may include at least one selected from polyethylene terephthalate and polyethylene naphthalate, and may include polymethyl methacrylate as the acrylic polymer, and polystyrene and acrylonitrile- It may include at least one selected from among styrene copolymers, and may include at least one selected from polyethylene and polypropylene as a polyolefin copolymer, and may include at least one selected from nylon and aromatic polyamide as an amide-based polymer. can

In addition, the first adhesive film 20 of the present invention may have a 10-point average roughness (Rz, ten point median height roughness) of 1.5 to 9 μm, preferably 1.5 to 5 μm, more preferably 2 to 4 μm. there is.

The second adhesive film 30 of the present invention is a polyester-based polymer, acrylic polymer, styrene-based polymer, polycarbonate-based polymer, polyolefin copolymer, vinyl chloride-based polymer, amide-based polymer, imide-based polymer, sulfone-based polymer, poly It may include at least one selected from a phenylene sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer, preferably a polyolefin copolymer, more preferably It may include biaxially oriented polypropylene.

At this time, the polyester-based polymer may include at least one selected from polyethylene terephthalate and polyethylene naphthalate, and may include polymethyl methacrylate as the acrylic polymer, and polystyrene and acrylonitrile- It may include at least one selected from among styrene copolymers, and may include at least one selected from polyethylene and polypropylene as a polyolefin copolymer, and may include at least one selected from nylon and aromatic polyamide as an amide-based polymer. can

In addition, the second adhesive film 30 of the present invention may have a 10-point average roughness (Rz, ten point median height roughness) of 1.5 to 9 μm, preferably 1.5 to 5 μm, more preferably 2 to 4 μm. there is.

In addition, the thickness of the first adhesive film 20 may have a technical feature that is thinner than the thickness of the second adhesive film 30 .

In addition, the base member 10 may include paper, preferably 20 to 90 g/m ² of the basis weight, more preferably 20 to 40 g/m ² may include paper having a basis weight.

In addition, in the release film 100 for an adhesive member of the present invention, when the paper has a basis weight of 30 g/m ² , the first adhesive film 20 has a thickness of 15 to 45 μm, preferably 15 to 35 μm. A thickness, more preferably, may have a thickness of 17 to 23 μm, and the second adhesive film 30 has a thickness of 20 to 55 μm, preferably a thickness of 20 to 45 μm, more preferably 22 to 28 μm. may have a thickness of

Next, in the second step of the method of manufacturing the adhesive sheet of the present invention, the adhesive member 200 may be formed by coating the adhesive member composition on one surface of the release substrate 40 and curing it. In this case, the adhesive member composition may include at least one selected from an epoxy resin, an acrylic resin, a urethane resin, and a silicone resin, and preferably an epoxy resin. At this time, the coating may be performed without limitation as long as it is a method commonly used in the art, and preferably may be performed through a comma coating method or a micro gravure method. In addition, the curing may be carried out without limitation as long as it is a method commonly used in the art, and may preferably be cured by drying and/or aging using heat or UV.

The release substrate 40 of the present invention is a polyester-based polymer, an acrylic polymer, a styrene-based polymer, a polycarbonate-based polymer, a polyolefin copolymer, a vinyl chloride-based polymer, an amide-based polymer, an imide-based polymer, a sulfone-based polymer, and polyphenylene. It may include at least one selected from a sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer, preferably a polyolefin copolymer, more preferably It may include polyethylene terephthalate (PET) treated with a separate release coating. In this case, silicone may be used for the release coating treatment.

In this case, the polyester-based polymer may include at least one selected from polyethylene terephthalate and polyethylene naphthalate, and may include polymethyl methacrylate as the acrylic polymer, and polystyrene and acrylonitrile- It may include at least one selected from among styrene copolymers, and may include at least one selected from polyethylene and polypropylene as a polyolefin copolymer, and may include at least one selected from nylon and aromatic polyamide as an amide-based polymer. can

Next, in the third step of the method for manufacturing the adhesive sheet of the present invention, the first adhesive film 20 of the release film 100 and the adhesive member 200 are positioned to face each other, laminated, and cured. can At this time, the lamination may be performed at a speed of 25 to 100 m/min by putting it on a gap roller. In addition, the curing may be carried out without limitation as long as it is a method commonly used in the art, and may preferably be cured through drying and/or aging using heat or UV.

Finally, in the fourth step of the method for manufacturing the pressure-sensitive adhesive sheet of the present invention, the pressure-sensitive adhesive sheet may be manufactured by removing the release substrate 40 .

Furthermore, a multilayer circuit board can be manufactured using the adhesive sheet of the present invention. Specifically, the multilayer circuit board manufacturing method of the present invention includes a first circuit board, a second circuit board, and a first step for preparing the adhesive sheet of the present invention. Step 1, a second step of attaching the adhesive member of the adhesive sheet of the present invention to one surface of the first circuit board, removing the release film of the adhesive sheet of the present invention, and manufacturing a first circuit board having an adhesive member attached to one surface and a third step of manufacturing a multilayer circuit board by attaching an adhesive member of the first circuit board to one surface of the second circuit board.

In this case, the first circuit board and the second circuit board may be a glass circuit board, a printed circuit board (PCB), a metal printed circuit board (Metal PCB), or a flexible printed circuit board (FPCB), respectively.

On the other hand, the method for manufacturing a multilayer circuit board of the present invention may include a third circuit board other than the first circuit board and the second circuit board, and specifically, the adhesive sheet of the present invention on one surface of the second circuit board. A three-layer circuit board may be manufactured by attaching an adhesive member, removing the release film of the adhesive sheet of the present invention, and attaching the adhesive member of the second circuit board to one surface of the third circuit board. Through this method, it is possible to manufacture a multilayer circuit board having a plurality of layers.

In the above, the present invention has been mainly described with respect to the embodiment, but this is only an example and does not limit the embodiment of the present invention. It can be seen that various modifications and applications not exemplified above are possible without departing from the scope. For example, each component specifically shown in the embodiment of the present invention can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Example 1: Preparation of adhesive sheet

(1) A first adhesive film having a thickness of 20 μm and having a 10-point average roughness (Rz) of 3.75 μm and a second adhesive film having a thickness of 25 μm and a 10-point average roughness (Rz) of 3.75 μm After placing the substrate member in between, it was put on a gap roller, laminated at a speed of 100 m/min, and then UV cured to prepare a release film.

In this case, biaxially oriented polypropylene was used as the first adhesive film and the second adhesive film, respectively, and paper having a basis weight of 30 g/m ² was used as the base member.

(2) The adhesive member composition was coated on PET treated with silicone release coating having a thickness of 38 μm through comma coating, and dried and aged to form an adhesive member having a thickness of 25 μm. In this case, a composition in which a curing agent and a curing accelerator are mixed based on an acrylic binder and an epoxy resin was used as the adhesive member composition.

(3) After placing the first adhesive film of the prepared release film and the prepared adhesive member to face each other, put it in a gap roller, laminate at a speed of 50 m/min, and then at 60°C The aging process was carried out for 1 day at a temperature of

Example 2: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, using paper having a basis weight of 15 g/m ² as a base member, an adhesive sheet was finally manufactured.

Example 3: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, using paper having a basis weight of 100 g/m ² as a base member, an adhesive sheet was finally manufactured.

Example 4: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, the first adhesive film having a thickness of 10 μm and having a 10-point average roughness (Rz) of 3.75 μm was used, and the second adhesive film having a thickness of 15 μm and a 10-point average roughness of 3.75 μm ( Rz) was used to finally prepare an adhesive sheet.

Example 5: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, the first adhesive film having a thickness of 50 μm and having a 10-point average roughness (Rz) of 3.75 μm was used, and the second adhesive film having a thickness of 60 μm and a 10-point average roughness of 3.75 μm ( Rz) was used to finally prepare an adhesive sheet.

Comparative Example 1: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, the first adhesive film having a thickness of 20 μm and having a 10-point average roughness (Rz) of 0.7 μm was used, and the second adhesive film having a thickness of 25 μm and a 10-point average roughness of 0.7 μm ( Rz) was used to finally prepare an adhesive sheet.

Comparative Example 2: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, the first adhesive film having a thickness of 20 μm and having a 10-point average roughness (Rz) of 10 μm was used, and the second adhesive film having a thickness of 25 μm and a 10-point average roughness of 10 μm ( Rz) was used to finally prepare an adhesive sheet.

Comparative Example 3: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, the first adhesive film having a thickness of 25 μm and having a 10-point average roughness (Rz) of 3.75 μm was used, and as the second adhesive film, a thickness of 25 μm and a 10-point average roughness of 3.75 μm ( Rz) was used to finally prepare an adhesive sheet.

Comparative Example 4: Preparation of adhesive sheet

An adhesive sheet was prepared in the same manner as in Example 1. However, the first adhesive film having a thickness of 25 μm and having a 10-point average roughness (Rz) of 3.75 μm was used, and as the second adhesive film, a thickness of 20 μm and a 10-point average roughness of 3.75 μm ( Rz) was used to finally prepare an adhesive sheet.

Experimental Example 1

The pressure-sensitive adhesive sheets prepared in Examples 1 to 5 and Comparative Examples 1 to 4 were evaluated based on the following physical property evaluation methods, respectively, and the results are shown in Table 1.

(1) bending characteristics

The adhesive sheets prepared in Examples 1 to 5 and Comparative Examples 1 to 4 were cut to have a size of 10 cm in width and length, respectively, to prepare a specimen, and after cutting the prepared specimen in an “X” shape by about 10 mm in the diagonal direction, By measuring the bending direction and height of the cut part, the bending characteristics were evaluated. In evaluating the bending characteristics, when the bending direction and height were ±1mm or less, ○, when it was more than ±1mm and less than ±2mm, △, and when it exceeded ±2mm, ×.

(2) Degree of bubble formation

Specimens were prepared by cutting the adhesive sheets prepared in Examples 1 to 5 and Comparative Examples 1 to 4 to have a size of 10 cm in width and length, respectively, and lamination of the prepared specimen to an attachment substrate that can visually check the degree of bubble generation Then, the degree of foaming was evaluated as × if the area where the foaming occurred was more than 10% of the total area, and ○ if it was less than 10%.

(3) Surface adhesion

After cutting the adhesive sheets prepared in Examples 1 to 5 and Comparative Examples 1 to 4 to have a size of 10 cm in width and length, respectively, to prepare a specimen, and laminating the prepared specimen to an adhesive substrate capable of confirming surface adhesion, When the release film of the specimen was removed, surface adhesion was evaluated as ○ if the adhesive member of the specimen was transferred to the attachment substrate, and × if not transferred.

(4) Productivity, flexibility

Productivity was determined as ○ when the basis weight of the base material of the adhesive sheet was 20 to 50 g/m ² , and Х otherwise. In addition, productivity was determined as Х when the 10-point average roughness (Rz) of the first and second pressure-sensitive adhesive films was 30% or more of each film thickness, and the others were determined as ○.

Flexibility was judged as ○ when the thickness of the pressure-sensitive adhesive sheet was 50 to 100 μm or more, and Х otherwise.

As can be seen in Table 1, the pressure-sensitive adhesive sheet prepared in Example 1 not only has superior bending properties than the pressure-sensitive adhesive sheets prepared in other examples and comparative examples, but also has less bubble generation and excellent surface adhesion, It was confirmed that the productivity and flexibility were excellent.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

10: base member
20: first adhesive film
30: second adhesive film
40: release material
100: release film for adhesive member
200: adhesive member

Claims (13)

A release film for an adhesive member in which a first adhesive film, a base member and a second adhesive film are sequentially stacked,
The thickness of the first adhesive film is thinner than the thickness of the second adhesive film,
A release film for an adhesive member, characterized in that each of the first adhesive film and the second adhesive film has a 10-point average roughness (Rz) of 1.5 to 9 μm.
According to claim 1,
The first adhesive film and the second adhesive film are each a polyester-based polymer, an acrylic polymer, a styrene-based polymer, a polycarbonate-based polymer, a polyolefin copolymer, a vinyl chloride-based polymer, an amide-based polymer, an imide-based polymer, a sulfone-based polymer, A release film for an adhesive member, comprising at least one selected from a polyphenylene sulfide-based polymer, a vinyl alcohol-based polymer, an allylate-based polymer, an epoxy-based polymer, a urethane-based polymer, and a silicone-based polymer.
3. The method of claim 2,
The first adhesive film and the second adhesive film is a release film for an adhesive member, characterized in that it comprises a biaxially oriented polypropylene (biaxially oriented polypropylene), respectively.
The method of claim 1,
The base member includes paper,
The base member is a release film for an adhesive member, characterized in that it has a basis weight of 20 ~ 90 g / m ² .
5. The method of claim 4,
When the base member has a basis weight of 30 g/m ² , the first adhesive film has a thickness of 15 to 45 μm, and the second adhesive film has a thickness of 20 to 55 μm.
adhesive member; and
The release film for the adhesive member of claim 1 laminated on one surface of the adhesive member; including,
An adhesive sheet, characterized in that the first adhesive film of the release film is laminated on one surface of the adhesive member.
7. The method of claim 6,
The adhesive member is an adhesive sheet, characterized in that it comprises at least one selected from an epoxy resin, an acrylic resin, a urethane resin, and a silicone resin.
8. The method of claim 7,
The epoxy resin comprises at least one selected from bisphenol A epoxy resin, cresol novolak epoxy resin, phenol novolac epoxy resin, naphthalene-based epoxy resin, and dicyclopentadiene (DCPD) type epoxy resin. Sheet.
8. The method of claim 7,
The adhesive member and the release film are 1: 2 to 6 adhesive sheet, characterized in that having a thickness ratio.
A first step of laminating a substrate member to be positioned between the first adhesive film and the second adhesive film, and then curing to prepare a release film;
A second step of coating the adhesive member composition on one surface of the release substrate and curing it to form an adhesive member;
a third step of positioning the first adhesive film of the release film and the adhesive member to face each other, laminating and curing the first adhesive film; and
A fourth step of manufacturing an adhesive sheet by removing the release substrate;
The thickness of the first adhesive film is thinner than the thickness of the second adhesive film,
The first adhesive film and the second adhesive film each have a 10-point average roughness (Rz) of 1.5 ~ 10㎛ pressure-sensitive adhesive sheet manufacturing method.
11. The method of claim 10,
The first adhesive film and the second adhesive film each include a biaxially oriented polypropylene (biaxially oriented polypropylene),
The base member is a method of manufacturing an adhesive sheet, characterized in that it comprises paper.
12. The method of claim 11,
The base member has a basis weight of 20 ~ 90 g / m ² ,
When the base member has a basis weight of 30 g/m ² , the first adhesive film has a thickness of 15 to 45 μm, and the second adhesive film has a thickness of 20 to 55 μm.
A first step of preparing the first circuit board, the second circuit board and the adhesive sheet of claim 6;
a second step of attaching an adhesive member of the adhesive sheet to one surface of the first circuit board, removing the release film of the adhesive sheet, and manufacturing a first circuit board having an adhesive member attached to one surface; and
a third step of manufacturing a multilayer circuit board by attaching an adhesive member of the first circuit board to one surface of the second circuit board;
Multilayer circuit board manufacturing method comprising a.

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