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KR102381728B9 - 방열판 - Google Patents

방열판

Info

Publication number
KR102381728B9
KR102381728B9 KR1020200059541A KR20200059541A KR102381728B9 KR 102381728 B9 KR102381728 B9 KR 102381728B9 KR 1020200059541 A KR1020200059541 A KR 1020200059541A KR 20200059541 A KR20200059541 A KR 20200059541A KR 102381728 B9 KR102381728 B9 KR 102381728B9
Authority
KR
South Korea
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020200059541A
Other languages
English (en)
Other versions
KR20210142850A (ko
KR102381728B1 (ko
Inventor
김영주
김용수
정승붕
최종윤
Original Assignee
효성중공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 효성중공업 주식회사 filed Critical 효성중공업 주식회사
Priority to KR1020200059541A priority Critical patent/KR102381728B1/ko
Priority to US17/914,718 priority patent/US12274027B2/en
Priority to PCT/KR2021/005714 priority patent/WO2021235748A1/ko
Publication of KR20210142850A publication Critical patent/KR20210142850A/ko
Application granted granted Critical
Publication of KR102381728B1 publication Critical patent/KR102381728B1/ko
Publication of KR102381728B9 publication Critical patent/KR102381728B9/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
    • F28D1/0472—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being helically or spirally coiled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020200059541A 2020-05-19 2020-05-19 방열판 Active KR102381728B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200059541A KR102381728B1 (ko) 2020-05-19 2020-05-19 방열판
US17/914,718 US12274027B2 (en) 2020-05-19 2021-05-07 Heat sink
PCT/KR2021/005714 WO2021235748A1 (ko) 2020-05-19 2021-05-07 방열판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200059541A KR102381728B1 (ko) 2020-05-19 2020-05-19 방열판

Publications (3)

Publication Number Publication Date
KR20210142850A KR20210142850A (ko) 2021-11-26
KR102381728B1 KR102381728B1 (ko) 2022-04-01
KR102381728B9 true KR102381728B9 (ko) 2023-04-12

Family

ID=78700212

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200059541A Active KR102381728B1 (ko) 2020-05-19 2020-05-19 방열판

Country Status (3)

Country Link
US (1) US12274027B2 (ko)
KR (1) KR102381728B1 (ko)
WO (1) WO2021235748A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102530398B1 (ko) * 2022-11-16 2023-05-15 (주)구수중전기 수냉식 방열 장치 및 수냉식 방열 스택

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3466833D1 (en) * 1983-11-02 1987-11-19 Bbc Brown Boveri & Cie Cooling body for the liquid cooling of power semiconductor devices
US4700272A (en) 1986-06-26 1987-10-13 Digital Equipment Corporation Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
FR2631165B1 (fr) * 1988-05-05 1992-02-21 Moulene Daniel Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support
US5186238A (en) * 1991-04-25 1993-02-16 International Business Machines Corporation Liquid film interface cooling chuck for semiconductor wafer processing
JP3210199B2 (ja) * 1995-01-27 2001-09-17 株式会社東芝 平形半導体素子の冷却体
JP3352362B2 (ja) 1997-07-14 2002-12-03 三菱電機株式会社 放熱板
JP4233827B2 (ja) * 2002-08-08 2009-03-04 岡野電線株式会社 ヒートスプレッダーおよびその製造方法
JP2004316955A (ja) * 2003-04-11 2004-11-11 Sumitomo Electric Ind Ltd 薄型流路形成体、熱交換装置、電子機器及び薄型流路形成体の製造方法
WO2010005785A2 (en) * 2008-07-11 2010-01-14 Acid Piping Technology, Inc. Packing element for heat and mass transfer towers
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
KR101747225B1 (ko) 2015-04-30 2017-06-15 한화테크윈 주식회사 냉각 장치
JP6080912B2 (ja) * 2015-07-09 2017-02-15 正明 林原 ミネラル調整水及びその製造方法

Also Published As

Publication number Publication date
KR20210142850A (ko) 2021-11-26
KR102381728B1 (ko) 2022-04-01
WO2021235748A1 (ko) 2021-11-25
US12274027B2 (en) 2025-04-08
US20230354550A1 (en) 2023-11-02

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