KR102334547B1 - 어레이 기판 및 이를 이용한 집적 회로 실장 방법 - Google Patents
어레이 기판 및 이를 이용한 집적 회로 실장 방법 Download PDFInfo
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Abstract
Description
도 2는 본 발명의 일 실시예에 따른 어레이 기판의 패드부와 데이터 구동 집적회로의 범프를 개략적으로 나타낸 평면도이다.
도 3은 패드부에 정상 실장 된 범프를 개략적으로 나타낸 평면도이다.
도 4 내지 도 7은 어레이 기판의 팽창 또는 수축에 따른 패드부의 변형과 이에 대응한 범프의 이동을 나타낸 평면도이다.
도 8은 본 발명의 다른 실시예에 따른 제1 패드부의 개략적인 형태를 나타낸 평면도이다.
도 9는 본 발명의 또 다른 실시예에 따른 제1 패드부의 개략적인 형태를 나타낸 평면도이다.
도 10 내지 도 12는 본 발명의 또 다른 실시예에 따른 패드부의 개략적인 형태를 나타낸 평면도이다.
도 13은 본 발명의 또 다른 실시예에 따른 패드부의 개략적인 형태를 나타낸 평면도이다.
도 13은 본 발명의 다른 실시예에 따른 전압 생성부의 블록도이다.
도 14는 본 발명의 또 다른 실시예에 따른 집적 회로 실장 방법의 순서도이다.
110, 210, 310, 410, 510: 제1 패드부
120: 게이트 구동부
130: 전원 공급부
140: 제2 패드부
Claims (20)
- 가요성 물질을 포함하는 어레이 기판으로서, 복수의 화소를 포함하는 표시 영역, 및 제1 패드부와 제2 패드부를 포함하는 비표시 영역을 포함하는 어레이 기판;
상기 제1 패드부 상에 실장된 제1 회로 부재; 및
상기 제1 회로 부재와 상이한 제2 회로 부재로서, 상기 제2 패드부 상에 실장된 제2 회로 부재를 포함하되,
상기 제2 패드부는 상기 어레이 기판의 일 에지를 따라 배치되고,
상기 제1 패드부는 상기 표시 영역과 상기 제2 패드부 사이에 배치되며,
상기 어레이 기판은 제1 방향으로 연장된 제1 신호 라인과 제2 방향으로 연장된 제2 신호 라인을 포함하고,
상기 제1 패드부는 상기 제1 방향을 따라 배열된 기울어진 복수의 제1 경사 패드를 포함하는 제1 서브 패드부 및 상기 제1 방향을 따라 배열된 기울어진 복수의 제2 경사 패드를 포함하는 제2 서브 패드부를 포함하되, 상기 제1 서브 패드부와 상기 제2 서브 패드부는 상기 제1 방향으로 배열되고,
상기 제2 패드부는 상기 제1 방향을 따라 배열된 기울어진 복수의 제3 경사 패드를 포함하는 제3 서브 패드부 및 상기 제1 방향을 따라 배열된 기울어진 복수의 제4 경사 패드를 포함하는 제4 서브 패드부를 포함하되, 상기 제3 서브 패드부와 상기 제4 서브 패드부는 상기 제1 방향으로 배열되며,
상기 복수의 제1 경사 패드 각각은 동일한 경사각으로 기울어지고,
상기 복수의 제2 경사 패드 각각은 동일한 경사각으로 기울어지고,
상기 복수의 제3 경사 패드 각각은 동일한 경사각으로 기울어지고,
상기 복수의 제4 경사 패드 각각은 동일한 경사각으로 기울어지고,
상기 복수의 제1 경사 패드와 상기 복수의 제2 경사 패드는 상기 제2 방향으로 연장되며 상기 제1 패드부를 절반으로 분할하는 제1 직선에 대해 대칭으로 배열되고,
상기 복수의 제3 경사 패드와 상기 복수의 제4 경사 패드는 상기 제1 직선에 대해 대칭으로 배열되는 전자 소자. - 제1 항에 있어서,
상기 복수의 제1 경사 패드 각각은 상기 제1 방향으로 연장된 제1 단변, 상기 제1 단변과 평행한 제2 단변, 상기 제1 단변의 일단으로부터 제1 경사각을 형성하며 연장되는 제1 장변 및 상기 제1 장변과 평행하는 제2 장변을 포함하는 전자 소자. - 제1 항에 있어서,
상기 제1 패드부는 중앙에 기울어지지 않은 적어도 하나의 제1 비경사 패드를 포함하는 제1 중앙 서브 패드부를 더 포함하는 전자 소자. - 삭제
- 삭제
- 삭제
- 제1 항에 있어서,
상기 제1 회로 부재는 데이터 구동 집적회로를 포함하고, 상기 제2 회로 부재는 연성 인쇄 회로 기판을 포함하는 전자 소자. - 제7 항에 있어서,
상기 데이터 구동 집적회로는 상기 복수의 제1 경사 패드의 형상에 상응하는 복수의 제1 경사 범프 및 상기 복수의 제2 경사 패드의 형상에 상응하는 복수의 제2 경사 범프를 포함하고,
상기 연성 인쇄 회로 기판은 상기 복수의 제3 경사 패드의 형상에 상응하는 복수의 제3 경사 범프 및 상기 복수의 제4 경사 패드의 형상에 상응하는 복수의 제4 경사 범프를 포함하되,
상기 복수의 제1 내지 제4 경사 패드 각각의 장변은 각각 그에 상응하는 상기 복수의 제1 내지 제4 경사 범프 각각의 장변보다 길게 형성되는 전자 소자. - 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
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US14/526,182 US9591754B2 (en) | 2014-06-17 | 2014-10-28 | Array substrate and method of mounting integrated circuit using the same |
EP15152709.0A EP2957951B1 (en) | 2014-06-17 | 2015-01-27 | Array substrate and method of mounting integrated circuit using the same |
CN201510073831.6A CN105301851B (zh) | 2014-06-17 | 2015-02-11 | 阵列基底和使用该阵列基底安装集成电路的方法 |
CN202110002998.9A CN112768473B (zh) | 2014-06-17 | 2015-02-11 | 阵列基底和使用该阵列基底安装集成电路的方法 |
US15/429,411 US9917113B2 (en) | 2014-06-17 | 2017-02-10 | Array substrate and method of mounting integrated circuit using the same |
US15/901,846 US10373987B2 (en) | 2014-06-17 | 2018-02-21 | Array substrate and method of mounting integrated circuit using the same |
US16/510,262 US11081503B2 (en) | 2014-06-17 | 2019-07-12 | Array substrate and method of mounting integrated circuit using the same |
US17/391,036 US11967597B2 (en) | 2014-06-17 | 2021-08-02 | Array substrate and method of mounting integrated circuit using the same |
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US20240234443A1 (en) | 2024-07-11 |
US20180182781A1 (en) | 2018-06-28 |
CN112768473A (zh) | 2021-05-07 |
US9591754B2 (en) | 2017-03-07 |
KR102585079B1 (ko) | 2023-10-05 |
US11967597B2 (en) | 2024-04-23 |
EP2957951A1 (en) | 2015-12-23 |
CN105301851A (zh) | 2016-02-03 |
US20170154899A1 (en) | 2017-06-01 |
US11081503B2 (en) | 2021-08-03 |
CN105301851B (zh) | 2021-01-22 |
US9917113B2 (en) | 2018-03-13 |
EP2957951B1 (en) | 2020-04-15 |
US20150366049A1 (en) | 2015-12-17 |
US20190333939A1 (en) | 2019-10-31 |
US10373987B2 (en) | 2019-08-06 |
CN112768473B (zh) | 2024-09-27 |
KR20150144907A (ko) | 2015-12-29 |
US20210366938A1 (en) | 2021-11-25 |
KR20210149011A (ko) | 2021-12-08 |
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