KR102331178B1 - 표시장치 - Google Patents
표시장치 Download PDFInfo
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- KR102331178B1 KR102331178B1 KR1020150046642A KR20150046642A KR102331178B1 KR 102331178 B1 KR102331178 B1 KR 102331178B1 KR 1020150046642 A KR1020150046642 A KR 1020150046642A KR 20150046642 A KR20150046642 A KR 20150046642A KR 102331178 B1 KR102331178 B1 KR 102331178B1
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- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 13
- 125000006850 spacer group Chemical group 0.000 claims description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 3
- 239000012044 organic layer Substances 0.000 claims description 3
- 230000005684 electric field Effects 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229910001182 Mo alloy Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
Description
도 2a는 도 1에서 I-I'선에 따른 단면도이다.
도 2b는 도 2a의 다른 실시예를 나타내는 단면도이다.
도 3은 도 1의 게이트 전송부 및 데이터 전송부의 배치를 나타내는 개략도이다.
도 4는 도 1에서 게이트 전송부와 화소 전극 사이의 전압차에 의한 전계를 나타내는 도면이다.
도 5는 도 1에서 화소 전극의 다른 실시예를 나타낸 도면이다.
도 6은 도 1의 다른 실시예로 하나의 화소에 대한 평면도이다.
20 : 제 2 기판 200 : 데이터 전송부
30 : 액정층 210 : 데이터 라인
40 : 게이트 절연막 220 : 데이터 전극
50 : 화소 전극 300 : 트랜지스터
51 : 투명전극층 310 : 반도체층
60 : 블랙 매트릭스
70 : 스페이서
Claims (12)
- 서로 대향하여 위치한 제 1 기판과 제 2 기판;
상기 제 1 기판과 상기 제 2 기판 사이에 위치한 액정층;
상기 제 1 기판 상에 위치한 게이트 라인 및 게이트 전극을 포함하는 게이트 전송부;
상기 게이트 전송부 상에 위치한 게이트 절연막;
상기 게이트 절연막 상에 위치한 화소 전극;
상기 게이트 절연막 상에 위치한 데이터 라인 및 데이터 전극을 포함하는 데이터 전송부;
상기 게이트 절연막 상에 배치한 반도체층을 포함하고 상기 게이트 전송부, 상기 데이터 전송부 및 상기 화소 전극에 연결된 트랜지스터; 및
상기 게이트 절연막 및 상기 트랜지스터 상에 위치하여 화소 영역을 정의하는 블랙 매트릭스를 포함하며,
상기 게이트 전송부는 상기 화소 전극과 완전히 중첩되고 상기 화소 영역으로 연장하는 표시장치. - 제 1 항에 있어서,
상기 게이트 전송부는 상기 화소전극과 전압차를 발생시키는 공통전극인 표시장치. - 제 2 항에 있어서,
상기 게이트 전송부는 ITO(Indium Tin Oxide) 또는 IZO(Indium Zinc Oxide)으로 이루어진 표시장치. - 제 3 항에 있어서,
상기 게이트 전송부는 면 형상인 표시장치. - 제 1 항에 있어서,
상기 블랙 매트릭스는 유기막 및 무기막 중 적어도 하나를 포함하는 표시장치. - 제 1 항에 있어서,
상기 화소 전극은 상기 반도체층과 접촉하는 표시장치. - 제 1 항에 있어서,
상기 데이터 전송부와 상기 반도체층의 사이에 투명전극층을 더 포함하고, 상기 투명전극층은 상기 화소 전극과 동시에 형성되는 표시장치. - 제 1 항에 있어서,
상기 화소 전극은 상기 데이터 라인에 수직 방향으로 연장된 줄기부, 및 상기 줄기부로부터 상기 데이터 라인과 실질적으로 평행하게 연장된 가지부를 포함하고, 상기 가지부는 상기 줄기부의 길이방향을 따라 복수 개가 이격되어 형성된 표시장치. - 제 1 항에 있어서,
상기 반도체층은 산화물, 비정질 실리콘 및 결정질 실리콘 중 하나인 표시장치. - 제 1 항에 있어서,
상기 화소 전극의 단부에 위치하는 스페이서를 더 포함하는 표시장치. - 삭제
- 삭제
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