KR102211252B1 - 기판 처리 장치 - Google Patents
기판 처리 장치 Download PDFInfo
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- KR102211252B1 KR102211252B1 KR1020190076321A KR20190076321A KR102211252B1 KR 102211252 B1 KR102211252 B1 KR 102211252B1 KR 1020190076321 A KR1020190076321 A KR 1020190076321A KR 20190076321 A KR20190076321 A KR 20190076321A KR 102211252 B1 KR102211252 B1 KR 102211252B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 139
- 238000000034 method Methods 0.000 claims abstract description 111
- 238000012545 processing Methods 0.000 claims abstract description 29
- 238000012805 post-processing Methods 0.000 claims 1
- 238000007781 pre-processing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
- B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/905—Control arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는 도 1에 도시된 이송 로봇을 나타낸 도면이다.
도 3은 도 1에 도시된 이송 로봇이 트랙을 따라 이동하는 것을 나타낸 도면이다.
도 4는 도 1에 도시된 로드락 챔버에서 이송 로봇이 반출되는 것을 나타낸 도면이다.
도 5는 도 4에 도시된 적재 로봇과 비적재 로봇이 트랙을 따라 이동하는 것을 나타낸 도면이다.
도 6은 도 5에 도시된 적재 로봇과 비적재 로봇에 대하여 교환 로봇이 기판을 교환하는 것을 나타낸 도면이다.
도 7은 도 6에서 기판이 교환된 적재 로봇과 비적재 로봇이 트랙을 따라 이동하는 것을 나타낸 도면이다.
도 8은 도 7에 도시된 적재 로봇이 로드락 챔버로 반입되는 것을 나타낸 도면이다.
도 9는 도 8에 도시된 비적재 로봇의 위치가 변경되는 것을 나타낸 도면이다.
도 10은 도 9에 도시된 로드락 챔버에서 적재 로봇이 반출되는 것을 나타낸 도면이다.
12: 로딩 모듈 13: 공정 모듈
14: 제어 모듈 100: 로드 포트
110: 캐리어 200: 이송 프레임
210: 인덱스 레일 220: 인덱스 로봇
221: 인덱스 베이스 222: 인덱스 몸체
223: 인덱스 암 300: 로드락 챔버
310: 인덱스 도어 320: 이송 도어
400: 위치 교환 챔버 500: 이송 챔버
510: 교환 로봇 511: 몸체
512: 암 513: 핸드
520: 트랙 600: 공정 유닛
610: 공정 도어 700, 701, 702, 703: 이송 로봇
710: 베이스부 720: 지지핀
730: 자력부 W1, W2, W3: 기판
Claims (8)
- 일측으로 긴 형상을 갖고, 기판의 이동 공간을 제공하는 이송 챔버;
상기 이송 챔버에 연결되어 상기 이송 챔버와 공정 전 기판 또는 공정 후 기판의 교환 공간을 제공하는 로드락 챔버;
상기 이송 챔버에 연결되어 상기 이송 챔버로부터 전달된 기판에 대한 공정을 수행하는 공정 유닛;
상기 이송 챔버에 구비되어 기판의 이동 경로를 제공하는 트랙; 및
비접촉 방식으로 상기 트랙을 따라 이동 가능하고, 상기 로드락 챔버에 진입하거나 진출하여 상기 로드락 챔버와 상기 이송 챔버 간의 기판 교환을 수행하는 이송 로봇을 포함하되,
상기 트랙은 상기 이송 챔버에서 상기 로드락 챔버의 내부까지 이어지고,
상기 이송 로봇은 상기 로드락 챔버에 구비된 이송 도어를 통과할 수 있는 크기를 갖는 기판 처리 장치. - 제1 항에 있어서,
상기 이송 로봇은,
기판의 지지하기 위한 지지면을 제공하는 베이스부;
상기 지지면에서 돌출 형성되어 기판을 지지하는 지지핀; 및
상기 지지면이 아닌 상기 베이스부의 일측에 배치되어 서로 다른 극성의 영구 자력을 번갈아 가면서 제공하는 자력부를 포함하는 기판 처리 장치. - 제2 항에 있어서,
상기 트랙은 변화하는 자력을 상기 자력부에 제공하여 상기 이송 로봇이 상기 트랙에서 일정 거리만큼 이격된 상태에서 상기 트랙을 따라 이동하도록 하는 기판 처리 장치. - 제1 항에 있어서,
상기 이송 로봇은 기판을 적재하고 있는 적재 로봇과 기판을 적재하지 않고 있는 비적재 로봇을 포함하고,
상기 적재 로봇 및 상기 비적재 로봇은 쌍으로 상기 트랙을 따라 이동하는 기판 처리 장치. - 제4 항에 있어서,
상기 공정 유닛에서 공정이 완료된 기판을 상기 비적재 로봇에 적재하고, 상기 적재 로봇에 적재된 기판을 상기 공정 유닛으로 반입하는 교환 로봇을 더 포함하는 기판 처리 장치. - 제5 항에 있어서,
상기 교환 로봇은 단일의 핸드(hand)를 구비하는 기판 처리 장치. - 제5 항에 있어서,
상기 교환 로봇은 상기 이송 챔버의 천장면에 배치된 스카라(SCARA; Selective Compliance Assembly Robot Arm)를 포함하는 기판 처리 장치. - 제1 항에 있어서,
상기 이송 챔버와 상기 로드락 챔버의 사이에 구비되어 복수의 이송 로봇 간의 위치 변경을 위한 공간을 제공하는 위치 교환 챔버를 더 포함하는 기판 처리 장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020190076321A KR102211252B1 (ko) | 2019-06-26 | 2019-06-26 | 기판 처리 장치 |
CN202010587593.1A CN112151412B (zh) | 2019-06-26 | 2020-06-24 | 传送机器人和具有上述传送机器人的基板处理装置 |
US16/911,779 US11702299B2 (en) | 2019-06-26 | 2020-06-25 | Transport robot and substrate treating apparatus comprising the same |
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KR1020190076321A KR102211252B1 (ko) | 2019-06-26 | 2019-06-26 | 기판 처리 장치 |
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KR20210000972A KR20210000972A (ko) | 2021-01-06 |
KR102211252B1 true KR102211252B1 (ko) | 2021-02-04 |
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KR1020190076321A Active KR102211252B1 (ko) | 2019-06-26 | 2019-06-26 | 기판 처리 장치 |
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US (1) | US11702299B2 (ko) |
KR (1) | KR102211252B1 (ko) |
CN (1) | CN112151412B (ko) |
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JP7526664B2 (ja) * | 2020-12-28 | 2024-08-01 | 東京エレクトロン株式会社 | 基板処理装置 |
EP4043366A1 (de) * | 2021-02-10 | 2022-08-17 | Inores GmbH | Transfervorrichtung zur übergabe von bauteilen an eine sicherheitskritische produktionsseite |
CN115692279A (zh) * | 2021-07-27 | 2023-02-03 | 恩替斯科技有限公司 | 传送机以及传送系统 |
KR102742788B1 (ko) * | 2022-11-29 | 2024-12-16 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
Citations (1)
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JP6003011B2 (ja) * | 2011-03-31 | 2016-10-05 | 東京エレクトロン株式会社 | 基板処理装置 |
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