KR102179271B1 - Film forming apparatus, manufacturing apparatus of electronic device, film forming method, and manufacturing method of electronic device - Google Patents

Abstract

The film-forming apparatus of the present invention is a film-forming device for depositing a film-forming material on a substrate through a mask, and a vacuum container in which the inner space can be maintained in a vacuum, and a substrate for holding the substrate and installed in the vacuum container An alignment camera unit including a support unit, a mask support unit installed in the vacuum container, for supporting the mask, and an alignment camera installed on the atmosphere side of the vacuum container, for measuring the relative position of the substrate and the mask, and And a film forming source installed in the vacuum container to receive the film-forming material and to granulate and discharge the film-forming material, and the alignment camera is installed so as to protrude into the vacuum container.

Description

Film-forming apparatus, electronic device manufacturing apparatus, film-forming method, and electronic device manufacturing method

The present invention relates to a film forming apparatus, an electronic device manufacturing apparatus, a film forming method, and an electronic device manufacturing method.

Organic EL display devices (organic EL displays) are expanding their application fields to VR HMD (Virtual Reality Head Mount Display), as well as smartphones, TVs, and automobile displays.In particular, displays used for VR HMDs are In order to reduce the user's dizziness, it is required to form a pixel pattern with high precision.

In the manufacture of an organic EL display device, when forming the organic light emitting device (organic EL device; OLED) constituting the organic EL display device, the film forming material emitted from the film forming source of the film forming device is transferred to a substrate through a mask on which a pixel pattern is formed. By forming a film on, an organic material layer or a metal layer is formed.

In such a film forming apparatus, in order to increase the film forming accuracy, the relative position of the substrate and the mask is measured before the film forming process, and if the relative position is shifted, the position is adjusted by moving the substrate and/or the mask relatively (alignment). do.

The measurement of the relative position of the substrate and the mask is performed by photographing alignment marks formed on each of the substrate and the mask in the vacuum container using an alignment camera provided on the upper surface of the outer (atmospheric side) of the vacuum container.

Depending on the structure of the film forming apparatus, if the distance from the outer upper surface of the vacuum container, which is the mounting surface of the alignment camera to the supporting position of the substrate/mask, is longer, the alignment mark of the substrate/mask is used with an alignment camera fixed to the outer upper surface of the vacuum container. It becomes difficult to focus on, and this decreases the accuracy of alignment.

In addition, even when the thickness of the substrate processed by the film forming apparatus is changed, it becomes difficult to accurately focus on the alignment mark formed on the substrate/mask with the alignment camera fixed to the outer upper surface of the vacuum container, thereby reducing the accuracy of alignment. do.

An object of the present invention is to provide a film forming apparatus, an electronic device manufacturing apparatus, a film forming method, and an electronic device manufacturing method using the same capable of accurately measuring the relative position of a substrate and a mask using an alignment camera.

A film forming apparatus according to the first aspect of the present invention is a film forming apparatus for depositing a film forming material on a substrate through a mask, a vacuum container in which an inner space can be maintained in a vacuum, and installed in the vacuum container, and holding a substrate. Includes a substrate holding unit for supporting, a mask supporting unit installed in the vacuum container and supporting the mask, and an alignment camera installed on the atmosphere side of the vacuum container and measuring the relative position of the substrate and the mask And an alignment camera unit that is installed in the vacuum container, and includes a film forming source for receiving a film-forming material and granulating and discharging the film-forming material, and the alignment camera is installed to protrude into the inside of the vacuum container. To do.

An electronic device manufacturing apparatus according to a second aspect of the present invention comprises a film forming apparatus according to the first aspect of the present invention, a mask stock apparatus for accommodating a mask, and a transport apparatus for transporting a substrate or a mask. To do.

A film formation method according to a third aspect of the present invention is a film formation method for depositing a film formation material on a substrate through a mask, the steps of carrying a mask into a vacuum container of a film formation apparatus, and carrying a substrate into the vacuum container. And, holding the substrate in a substrate holding unit in the vacuum container, and using an alignment camera installed on the atmosphere side of the vacuum container and protruding into the vacuum container through the vacuum container, Measuring the relative position of the substrate and the mask, and moving the substrate holding unit by an alignment stage mechanism installed in the vacuum container based on the measured relative position, thereby determining the relative position of the substrate and the mask. It characterized in that it comprises the step of adjusting, the step of bringing the mask into close contact with the film-forming surface of the substrate, and the step of depositing a film-forming material granulated by a film-forming source in the vacuum container on the substrate through the mask. .

A method for manufacturing an electronic device according to a fourth aspect of the present invention is characterized in that an electronic device is manufactured using the film forming method according to the third aspect of the present invention.

According to the present invention, alignment accuracy can be improved by arranging the alignment camera so as to enter the vacuum container from the atmospheric side of the vacuum container.

1 is a schematic diagram of a part of an electronic device manufacturing apparatus.
2 is a schematic diagram of a film forming apparatus according to an embodiment of the present invention.
FIG. 3A is a schematic diagram showing the configuration of an alignment camera unit and a vacuum counter according to an embodiment of the present invention, and FIG. 3B is an enlarged view of a dotted circle portion of FIG. 3A.
4 is a schematic diagram showing an electronic device manufactured by a film forming method according to an embodiment of the present invention.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In addition, in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, size, material, shape, etc. are intended to limit the scope of the present invention to this, unless otherwise limited. no.

The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to perform film formation, and can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation.

As the material of the substrate, any material such as semiconductor (eg, silicon), glass, a film of a polymer material, or a metal may be selected. For example, the substrate is a silicon wafer, or a substrate in which a film such as polyimide is laminated on a glass substrate. May be. Further, as the film-forming material, an arbitrary material such as an organic material and a metallic material (metal, metal oxide, etc.) can be selected.

The present invention can be applied to a film forming apparatus including a sputtering apparatus or a CVD (Chemical Vapor Deposition) apparatus in addition to a vacuum evaporation apparatus by heating evaporation. Specifically, the technique of the present invention is applicable to various electronic devices such as semiconductor devices, magnetic devices, and electronic parts, and manufacturing apparatuses such as optical parts. As a specific example of an electronic device, a light emitting element, a photoelectric conversion element, a touch panel, etc. are mentioned.

In particular, the present invention is preferably applicable to an apparatus for manufacturing an organic light-emitting device such as an OLED or an organic photoelectric conversion device such as an organic thin-film solar cell. In addition, the electronic device in the present invention includes a display device (e.g., organic EL display device) including a light emitting device, a lighting device (eg, organic EL lighting device), and a sensor (eg, organic CMOS) including a photoelectric conversion device. Image sensor).

<Electronic device manufacturing apparatus>

1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.

The manufacturing apparatus of Fig. 1 is used for manufacturing a display panel of an organic EL display device for a VR HMD, for example. In the case of a display panel for VR HMD, for example, after forming a film for formation of an organic EL element on a silicon wafer of a predetermined size, the silicon wafer is cut out along the region (scribe region) between the element formation regions. It is made from multiple small sized panels.

The electronic device manufacturing apparatus according to the present embodiment generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices 1.

The cluster device 1 includes a film forming device 11 that performs processing (e.g., film forming) on the substrate W, a mask stock device 12 that houses the mask M before and after use, and is disposed in the center thereof. A transfer chamber 13 (transport device) to be used is provided. The transfer chamber 13 is connected to the film forming apparatus 11 and the mask stock apparatus 12, respectively, as shown in FIG. 1.

In the transfer chamber 13, a transfer robot 14 that transfers the substrate W and the mask M is disposed. The transfer robot 14 may be, for example, a robot having a structure in which a robot hand holding a substrate W or a mask M is mounted on an articulated arm.

In the film forming apparatus 11, the film forming material emitted from the film forming source is deposited on the substrate W through the mask M. Transfer of the substrate W/mask M with the transfer robot 14, adjustment (alignment) of the relative position of the substrate W and the mask M, fixation of the mask M and the substrate W, A series of film-forming processes such as film-forming are performed by the film-forming apparatus 11.

In a manufacturing apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be divided into an organic film forming apparatus and a metal film forming apparatus according to the type of material to be deposited, and the organic film forming apparatus includes depositing or depositing an organic film forming material. A film is formed on the substrate W by sputtering, and the metal film forming apparatus deposits a metallic film forming material onto the substrate W by vapor deposition or sputtering.

In a manufacturing apparatus for manufacturing an organic EL display device, which film-forming device is placed at which position may vary depending on the stacked structure of the organic EL device to be manufactured, and a plurality of films for forming it according to the stacked structure of the organic EL device. The device is placed.

In the case of an organic EL device, typically, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode are stacked in this order on the substrate W on which the anode is formed. A film forming apparatus is arranged so that films can be sequentially formed.

For example, in FIG. 1, the film forming apparatus 11a forms a hole injection layer (HIL) and/or a hole transport layer (HTL), the film forming apparatuses 11b and 11f form a blue light-emitting layer, and the film-forming device 11c is a red light-emitting layer. The film forming apparatuses 11d and 11e are arranged to form a green light emitting layer, the film forming apparatus 11g is arranged to form an electron transport layer (ETL) and/or an electron injection layer (EIL), and the film forming apparatus 11h is arranged to form a cathode metal film. In FIG. 1, since the film formation speed of the blue light-emitting layer and the green light-emitting layer is slower than the film-forming speed of the red light-emitting layer due to the characteristics of the material, each of the blue light-emitting layer and the green light-emitting layer is formed in two film forming apparatuses to balance the processing speed. The invention is not limited thereto, and may have other arrangement structures.

In the mask stock apparatus 12, a new mask and a used mask to be used in the film forming process in the film forming apparatus 11 are divided into a plurality of cassettes and stored. The transfer robot 14 transfers the used mask from the film forming apparatus 11 to the cassette of the mask stock apparatus 12, and transfers a new mask stored in another cassette of the mask stock apparatus 12 to the film forming apparatus 11 Return to.

The relay device connected between the plurality of cluster devices 1 includes a pass chamber 15 for conveying the substrate W between the cluster devices 1.

The transfer robot 14 of the transfer chamber 13 receives the substrate W from the upstream pass chamber 15, and one of the film forming apparatuses 11 in the cluster apparatus 1 (e.g., the film forming apparatus 11a) ) To return. In addition, the transfer robot 14 receives the substrate W on which the film formation process in the cluster device 1 has been completed from one of the plurality of film formation devices 11 (e.g., the film formation device 11e), and is connected to the downstream side. It is conveyed to the pass chamber 15.

In addition to the pass chamber 15, the relay device changes the direction of the buffer chamber (not shown) and the substrate W to absorb the difference in the processing speed of the substrate W in the upstream and downstream cluster devices 1 It may further include a turning room (not shown) for. For example, the buffer chamber includes a substrate loading unit for temporarily accommodating a plurality of substrates W, and the turning chamber includes a substrate rotating mechanism (eg, a rotating stage or a transfer robot) for rotating the substrate W 180 degrees. Through this, the direction of the substrate W in the upstream cluster device and the downstream cluster device becomes the same, thereby facilitating substrate processing.

The pass chamber 15 according to an embodiment of the present invention may include a substrate mounting portion (not shown) or a substrate rotating mechanism for temporarily receiving a plurality of substrates W. That is, the pass chamber 15 may also function as a buffer chamber or a turning chamber.

The film forming apparatus 11, the mask stock apparatus 12, the transfer chamber 13, and the like constituting the cluster apparatus 1 are maintained in a high vacuum state during the manufacturing process of the organic light emitting element. The pass chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate (W) on which the film formation of a plurality of layers constituting the organic EL element has been completed is transferred to a sealing device (not shown) for sealing the organic EL element or a cutting device (not shown) for cutting the substrate into a predetermined panel size. do.

In the present embodiment, the configuration of an electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited thereto, and other types of apparatuses or chambers may be provided, and arrangements between these apparatuses or chambers may vary. have.

For example, the electronic device manufacturing apparatus according to an embodiment of the present invention may be of an in-line type instead of the cluster type shown in FIG. 1. That is, the substrate W and the mask M may be mounted on a carrier to form a film while passing through a plurality of film forming apparatuses arranged in a row. In addition, it may have a structure in which a cluster type and an inline type are combined. For example, the formation of the organic layer may be performed in a cluster-type manufacturing apparatus, and the electrode layer (cathode layer) forming process, a sealing process, a cutting process, and the like may be performed in an in-line type manufacturing apparatus.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.

<Film forming apparatus>

2 is a schematic diagram showing a configuration of a film forming apparatus 11 according to an embodiment of the present invention. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction and the horizontal plane is the XY plane is used. In addition, the rotation angle around the X axis is expressed as θ _X , the rotation angle around the Y axis is expressed as θ _Y , and the rotation angle around the Z axis is expressed as θ _Z.

2 shows an example of a film forming apparatus 11 in which a film forming material is evaporated or sublimated by heating to form a film on a substrate W through a mask M.

The film forming apparatus 11 includes a vacuum container 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, and is installed in the vacuum container 21 so that the position of the substrate W is at least in the X direction, the Y direction, and θ. A magnetic levitation stage mechanism 22 for adjusting in the _Z direction, a mask support unit 23 installed in the vacuum container 21 to support the mask M, and a substrate W installed in the vacuum container 21 And a substrate adsorption means 24 for adsorbing and holding the film, and a film-forming source 25 installed in the vacuum container 21 to receive a film-forming material and to form particles and discharge the film-forming material during film-forming.

The film forming apparatus 11 according to an embodiment of the present invention may further include a magnetic force applying means 26 for intimate contact with the mask M toward the substrate W by magnetic force.

The vacuum container 21 of the film forming apparatus 11 according to an embodiment of the present invention includes a first vacuum container part 211 in which the magnetic levitation stage mechanism 22 is disposed and a second vacuum container part 211 in which the film forming source 25 is disposed. It includes a vacuum container part 212. The vacuum container 21 is maintained in a high vacuum state by, for example, a vacuum pump (not shown) connected to the second vacuum container part 212.

In addition, a stretchable member 213 is installed between at least the first vacuum container part 211 and the second vacuum container part 212. The expandable member 213 is configured to prevent vibration from a vacuum pump connected to the second vacuum container part 212 or from a floor or floor on which the film forming device 11 is installed, through the second vacuum container part 212. 1 It reduces the transfer to the vacuum container 211. The expandable member 213 may be, for example, a bellows, but the present invention is not limited thereto, and the transmission of vibration between the first vacuum container part 211 and the second vacuum container part 212 can be reduced. One other member may be used.

As described above, in the film forming apparatus 11 according to an embodiment of the present invention, the vacuum container 21 is divided into a plurality of container parts (eg, the first vacuum container part 211 and the second vacuum container part 212). , By providing the expandable member 213 therebetween, it is possible to reduce the transmission of external vibration to the first vacuum container portion 211 in which the magnetic levitation stage mechanism 22 is installed.

The vacuum container 21 further includes a reference plate 214 to which the magnetic levitation stage mechanism 22 is fixedly connected, and a reference plate support 215 for supporting the reference plate 214 to a predetermined height. According to an embodiment of the present invention, as shown in FIG. 2, a stretchable member 213 may be further installed between the reference plate 214 and the first vacuum container 211. Through this, it is possible to further reduce the transmission of external vibrations to the magnetic levitation stage mechanism 22 through the reference plate 214.

The vacuum container 21 is also provided in the reference plate 214 (which serves as the upper container wall of the vacuum container 21) so as to protrude to the inside of the vacuum container 21. Part, see Figure 3a) further includes. The alignment camera of the alignment camera unit 27 described later is disposed so as to be inserted into the atmosphere side of the vacuum response cylinder 219. A detailed structure of the vacuum response cylinder 219 will be described later with reference to FIGS. 3A and 3B.

Between the reference plate support 215 and the mounting base 217 of the film forming apparatus 11, vibration is transmitted from the floor or the floor through the mounting base 217 of the film forming apparatus 11 to the reference plate support 215. A vibration suppression unit 216 is installed to reduce this.

The magnetic levitation stage mechanism 22 is an alignment stage mechanism for aligning the substrate W and the mask M based on the relative positions of the substrate W and the mask M measured by the alignment camera unit 27 It is an example of. That is, the magnetic levitation stage mechanism 22 is a stage mechanism for adjusting the position of the substrate W or the substrate adsorption means 24 by a magnetic levitation linear motor, at least in the X direction, Y direction, θ _Z direction, preferably Specifically, the positions of the substrate W or the substrate adsorption means 24 in six directions in the X direction, Y direction, Z direction, θ _X direction, θ _Y direction, and θ _Z direction are adjusted.

The magnetic levitation stage mechanism 22 includes a stage reference plate portion (a first plate portion, 221) functioning as a fixed stand, a fine moving stage plate portion (second plate portion, 222) functioning as a movable stand, and a fine moving stage plate portion ( It includes a magnetic levitation unit 223 for magnetic levitation and movement of the 222 with respect to the stage reference plate portion 221.

More specifically, the magnetic levitation stage mechanism 22 uses a self-weight compensation magnet (not shown) to provide a levitation force of a magnitude corresponding to the gravity acting on the fine moving stage plate unit 222, thereby providing a fine moving stage plate unit In the state where 222 is floated, a magnetic levitation linear motor (not shown) is used to move the fine stage plate portion 222 in a predetermined direction, for example, six degrees of freedom (X direction, Y direction, Z direction, θ _X direction). , θ _Y direction, θ _Z direction). At this time, the position of the fine stage plate unit 222 may be measured using a laser interferometer (not shown), and the measured position information is used to control the driving of the magnetic levitation linear motor.

The mask holding unit 23 is a means for receiving and holding the mask M that has been transported by the transport robot 14 installed in the transport chamber 13, and is also referred to as a mask holder (mask holding unit).

The mask support unit 23 is installed so as to be elevating at least in the vertical direction. Through this, the distance between the substrate W and the mask M in the vertical direction can be easily adjusted. As in the exemplary embodiment of the present invention, when the position of the substrate W is adjusted by the magnetic levitation stage mechanism 22, the mask support unit 23 supporting the mask M is moved to a motor (not shown) and It is preferable to mechanically lift and drive by a ball screw/guide (not shown).

Further, according to an embodiment of the present invention, the mask support unit 23 may be installed to be movable in a horizontal direction (ie, XYθ _Z direction). Through this, even when the mask M deviates from the view of the alignment camera of the alignment camera unit 27, it can be quickly moved into the view.

The mask support unit 23 further includes a mask pickup 231 for temporarily receiving the mask M carried into the vacuum container 21 by the transfer robot 14.

The mask pickup 231 is configured to be able to move up and down relative to the mask support surface of the mask support unit 23. For example, as shown in FIG. 2, the mask pickup 231 may be configured to be relatively elevated with respect to the mask supporting surface of the mask supporting unit 23 by the mask pickup lifting mechanism 232. The present invention is not limited thereto, and may have other configurations as long as the mask support surfaces of the mask pickup 231 and the mask support unit 23 are relatively elevating.

The mask pickup 231, which received the mask M from the hand of the transfer robot 14, descends relative to the mask support surface of the mask support unit 23 to lower the mask M onto the mask support unit 23. Put it. Conversely, in the case of carrying out the used mask M, the mask M is lifted from the mask support surface of the mask support unit 23 so that the hand of the transfer robot 14 can receive the mask M. do.

The mask M has an opening pattern corresponding to a thin film pattern to be formed on the substrate W, and is supported by the mask support unit 23. For example, the mask M used to manufacture an organic EL display panel for VR HMD includes a fine metal mask, which is a metal mask having a fine opening pattern corresponding to the RGB pixel pattern of the light emitting layer of the organic EL device, and It includes an open mask used to form a common layer (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of an organic EL device.

The opening pattern of the mask M is defined by a blocking pattern that does not allow particles of the film-forming material to pass through.

The substrate adsorption means 24 is an example of a substrate holding unit for holding and supporting the substrate W. The substrate adsorption means 24 adsorbs and holds the substrate W as a film-to-be-formed object transferred by the transfer robot 14 installed in the transfer chamber 13, and is a movable table of the magnetic levitation stage mechanism 22. It is installed on the stage plate part 222.

The substrate adsorption means 24 may be, for example, an electrostatic chuck having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric/insulator (eg, ceramic material) matrix.

The electrostatic chuck as the substrate adsorption means 24 may be a coulomb-force type electrostatic chuck in which a relatively high-resistance dielectric is interposed between the electrode and the adsorption surface and adsorption is performed by the coulomb force between the electrode and the adherend. It may be a Johnson-Rabeck force type electrostatic chuck in which a dielectric with relatively low resistance is interposed between the adsorption surfaces and is adsorbed by the Johnson Rabeck force generated between the adsorption surface of the dielectric and the adsorbed body, and the adsorbed body is removed by a non-uniform electric field. It may be a gradient force type electrostatic chuck that adsorbs.

When the adherend is a conductor or a semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or a Johnson-Ravec force type electrostatic chuck, and when the adherend is an insulator such as glass, a gradient force type electrostatic charge. It is preferable to use a chuck.

The electrostatic chuck may be formed as a single plate or may be formed to have a plurality of subplates. In addition, even when formed as a single plate, a plurality of electric circuits may be included therein, and the electrostatic manpower may be controlled to be different depending on the position within one plate.

Although not shown in FIG. 2, the film forming apparatus 11 temporarily holds the substrate W carried into the vacuum container 21 by the transfer robot 14 by the substrate adsorption means 24. A substrate support unit for holding the substrate W may be further included. For example, the substrate support unit may be provided on the mask support unit 23 so as to have a separate substrate support surface, and may be installed so as to elevate in accordance with the elevation of the mask support unit 23.

In addition, although not shown in FIG. 2, by installing a cooling means (e.g., a cooling plate) to suppress the temperature increase of the substrate W on the side opposite to the adsorption surface of the substrate adsorption means 24, It may be configured to suppress deterioration or deterioration of the deposited organic material.

The film-forming source 25 is a crucible (not shown) in which a film-forming material to be deposited on the substrate W is accommodated, a heater (not shown) for heating the crucible, and the film-forming source 25 is formed until the evaporation rate from the film-forming source 25 becomes constant. It includes a shutter (not shown) or the like that prevents the material from scattering onto the substrate W. The film formation source 25 may have a variety of configurations depending on a purpose, such as a point film formation source or a linear film formation source.

The film formation source 25 may include a plurality of crucibles for storing different film formation materials. In such a configuration, a plurality of crucibles containing different film formation materials may be installed so as to be movable to the film formation position so that the film formation material can be changed without opening the vacuum container 21 to the atmosphere.

The magnetic force applying means 26 is a means for pulling the mask M toward the substrate W side by magnetic force during the film forming process and making it in close contact, and is provided so as to be able to move up and down in the vertical direction. For example, the magnetic force applying means 26 may be composed of an electromagnet and/or a permanent magnet.

Although not shown in Fig. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

On the upper outside (atmospheric side) of the vacuum container 21, that is, on the reference plate 214, the mask pickup lifting mechanism 232 for lifting the mask pickup 231, and the magnetic force applying means 26 A magnetic force application means lifting mechanism 261 and the like are installed. A mask support unit lifting mechanism (not shown) for lifting the mask support unit 23 may be provided on the reference plate 214, but the present invention is not limited thereto, and, for example, a mask support unit lifting mechanism (not shown) ) May be installed in the lower atmosphere of the first vacuum container 211.

The film forming apparatus 11 according to an embodiment of the present invention uses an alignment camera for measuring a relative position between the substrate W and the mask M by photographing alignment marks formed on the substrate W and the mask M. It further includes an alignment camera unit 27 that includes.

The alignment camera unit 27 is installed on the upper outside (atmospheric side) of the vacuum container 21, more specifically at the upper side of the support plate 214, which functions as an upper container wall of the vacuum container 21. do. In particular, the alignment camera unit 27 according to an embodiment of the present invention is installed so as to protrude to the inside of the vacuum container 21. The alignment camera unit 27 will be described in detail later with reference to FIGS. 3A and 3B.

The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as control of conveyance and alignment of the substrate W/mask M, and control of film formation. The control unit may also have a function of controlling the application of voltage to the electrostatic chuck.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a programmable controller (PLC) may be used. Alternatively, some or all of the functions of the control unit may be configured with a circuit such as an ASIC or an FPGA. Further, a control unit may be provided for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatuses.

<Alignment Camera Unit>

Hereinafter, an alignment camera unit 27 according to an embodiment of the present invention will be described with reference to FIGS. 3A and 3B.

3A is a schematic cross-sectional view showing the configuration and arrangement of the alignment camera unit 27 according to an embodiment of the present invention, and is a view showing an enlarged view of a dotted circle portion of FIG. 3A of FIG. 3B.

3A and 3B, the alignment camera unit 27 includes an alignment camera 27a, a camera adjustment stage mechanism 27b, a vibration isolation stand 27c, and a lighting means 27d.

The alignment camera 27a is a device for measuring the relative positions of the substrate W and the mask M by photographing alignment marks of each of the substrate W and the mask M.

In this embodiment, the alignment camera 27a is a rough alignment camera used to roughly adjust the relative positions of the substrate W and the mask M, and the relative positions of the substrate W and the mask M. It includes a fine alignment camera used to adjust with high precision. The rough alignment camera has a relatively wide viewing angle and low resolution, and the fine alignment camera has a relatively narrow viewing angle but has a high resolution. However, the present invention is not limited thereto, and for example, the alignment camera 27a may be a rough alignment camera or a fine alignment camera.

The rough alignment camera and the fine alignment camera are installed at positions corresponding to the alignment marks formed on the substrate W and the mask M. For example, in the fine alignment camera, four cameras may be installed to form four rectangular corners, and in the rough alignment camera, two cameras may be installed in the center of two opposite sides of the rectangle. However, the present invention is not limited thereto, and may have a different number or arrangement according to the positions of the alignment marks of the substrate W and the mask M.

According to the embodiment of the present invention, the alignment camera 27a is disposed on the atmosphere side, which is outside the vacuum container 21 of the film forming apparatus 11, but through the vacuum container 21 to the inside of the vacuum container 21 It is installed to protrude. By installing the alignment camera 27a to the inside of the vacuum container 21, the substrate W and the mask M are relatively far away from the reference plate 214 due to the interposition of the magnetic levitation stage mechanism 22. Even if supported apart, it is possible to accurately focus on the alignment marks formed on the substrate W and the mask M.

To this end, the vacuum vessel 21 according to an embodiment of the present invention includes a vacuum response vessel 219 installed to protrude from the vessel wall 218 of the vacuum vessel 21 into the inside of the vacuum vessel 21. Is composed. However, the present embodiment is not limited thereto, and as long as the alignment camera 27a can be disposed to protrude into the vacuum container 21, other structures may be used.

The vacuum response vessel 219 protrudes into the inside of the vacuum vessel 21 through the vessel wall 218 (corresponding to the reference plate 214 in Fig. 2) of the vacuum vessel 21, and the upper surface is open. It may be a cylindrical structure. The inside of the vacuum response cylinder 219 communicated with the outside through the open top surface corresponds to the atmosphere side. And the alignment camera (27a) is installed so that it may be inserted into the atmosphere side of this vacuum response cylinder (219). Thereby, the alignment camera 27a is installed so that at least a part of the alignment camera 27a enters the inside of the vacuum container 21, that is, below the container wall.

In addition, the vacuum response cylinder 219 has a sealing structure so that the inside of the vacuum container 21 can be maintained in a vacuum state. Accordingly, the vacuum response cylinder 219 surrounds the alignment camera 27a disposed on the atmosphere side and seals the alignment camera 27a.

According to an embodiment of the present invention, the vacuum response vessel 219 includes a side wall portion 219a installed on the vessel wall 218 of the vacuum vessel 21, and a front end portion installed at the lower end of the side wall portion 219a. (219b).

The side wall portion 219a is installed on the container wall 211 by a sealing material (not shown) so that the vacuum is not broken at a portion where the side wall portion 219a and the container wall 211 are connected.

The distal end portion 219b is formed of a transparent material so that alignment marks between the substrate W and the mask M can be photographed by an alignment camera 27a inserted into the atmosphere side of the vacuum response vessel 219. For example, the tip portion 219b may be made of glass, but is not limited thereto.

The vacuum response cylinder 219 may further include a connection portion 219c connecting the side wall portion 219a and the tip portion 219b. The connection part 219c vacuum-seas the connection part between the side wall part 219a and the front end part 219b. The structure of the connection part 219c shown in FIG. 3B is exemplary, and the connection part 219c may have a different structure as long as the connection part between the sidewall part 219a and the tip part 219b can be vacuum-sealed.

The position of the lower end (tip) of the vacuum response cylinder 219, that is, the front end 219b, is based on the depth of focus of the alignment camera 27a and the distance the substrate W/mask M is from the container wall 218. It can be determined appropriately.

For example, the front end of the vacuum response tank 219 may be provided with a vacuum response tank 219 so as to be positioned between the container wall 218 and the substrate adsorption means 24 (see FIG. 2). In particular, the front end of the vacuum correspondence cylinder 219 may be installed so as to come between the stage reference plate portion (the first plate portion, 221) and the fine moving stage plate portion (the second plate portion, 222) (see FIG. 2). . According to this, since the alignment camera 27a protrudes to the inside of the vacuum container 21, the alignment mark of the substrate W/mask M can be photographed at a position close to the substrate W/mask M. have.

On the other hand, the front end of the vacuum response tank 219 is a distance between the tip of the vacuum response tank 219 and the upper surface of the substrate W adsorbed by the substrate adsorption means 24 is the thickness of the magnetic force application means 26 and the substrate It is preferable to be positioned so as to be greater than the sum of the thicknesses of the suction means 24.

The camera adjustment stage part 27b is connected to the alignment camera 27a and is a means for moving the alignment camera 27a relative to the vacuum container 21.

More specifically, the camera adjustment stage part 27b moves the alignment camera 27a in at least an up-down direction (Z-axis direction), that is, a direction from the container wall 218 of the vacuum container 21 toward the substrate adsorption means 24 And/or the opposite direction (eg, a direction perpendicular to the container wall 218). According to this, even if there is a slight variation in the thickness of the substrate W, the distance between the alignment camera 27a and the substrate W is appropriately adjusted, so that the alignment mark of the substrate W is accurately focused.

To this end, the camera adjustment stage part 27b may include a predetermined driving means capable of moving the alignment camera 27a in the vertical direction, such as a Z-axis actuator. However, the present invention is not limited thereto, and the camera adjustment stage portion 27b is configured to move the alignment camera 27a in a direction parallel to the substrate surface, that is, in the front and rear and/or left and right directions (X-axis and/or Y-axis directions). ) Can be moved. That is, the camera adjustment stage portion 27b may further include driving means such as an X-axis actuator and/or a Y-axis actuator.

The camera adjustment stage portion 27b may also adjust the posture of the alignment camera 27a. More specifically, the camera adjustment stage part 27b can change the angle made by the alignment camera 27a with the container wall 218 of the vacuum container 21. To this end, the camera adjustment stage part 27b may further include a rotation actuator capable of changing the standing angle of the alignment camera 27a with respect to the container wall 218. According to this, even if the vacuum container 21 is deformed during evacuation and the alignment camera 27a is inclined with respect to the substrate W/mask M, the alignment camera 27a is By adjusting the angle made with the 218, the alignment camera 27a can be made to face vertically with respect to the substrate W/mask M. As a result, it is possible to accurately focus on the alignment mark of the substrate W/mask M.

The vibration isolation stand 27c is provided between the camera adjustment stage portion 27b and the vacuum container 21, for example, the container wall 218 of the vacuum container 21. The vibration isolating stand 27c reduces the vibration from the vacuum container 21 from being transmitted to the camera adjustment stage portion 27b and the alignment camera 27a connected thereto. The vibration isolating stand 27c may have various structures. For example, the vibration isolating stand 27c includes a support fixedly installed on the vacuum container 21, and a vibration isolating unit disposed between the support and the camera adjustment stage 27b. It may include.

The luminaire 27d is disposed on the opposite side of the substrate adsorption means 24 (see Fig. 2) and/or the mask support unit 23 (see Fig. 2) with respect to the alignment camera 27a, so that the substrate W/mask It has the function of illuminating the alignment mark of (M). The lighting means (27d) is, in particular, in a situation in which the alignment camera (27a) entering the inside of the vacuum container (21) is dark enough to photograph the alignment mark of the substrate (W)/mask (M), the substrate (W) /It can provide a sufficient amount of light to photograph the alignment mark of the mask (M).

<Alignment method>

Hereinafter, an alignment method for adjusting the relative position between the substrate W and the mask M using the magnetic levitation stage mechanism 22 of the present invention will be described.

First, the mask M and the substrate W are carried into the vacuum container 21 and are supported by the mask support unit 23 and the substrate support unit, respectively.

The substrate W supported by the substrate support unit is moved toward the substrate adsorption means 24 provided in the fine moving stage plate portion 222 of the magnetic levitation stage mechanism 22.

When the substrate W is sufficiently close to the substrate adsorption means 24, a substrate adsorption voltage is applied to the substrate adsorption means 24, and the substrate W is adsorbed to the substrate adsorption means 24 by electrostatic force. When the substrate W is adsorbed to the substrate adsorption means 24, the entire surface of the substrate W may be simultaneously adsorbed on the entire adsorption surface of the substrate adsorption means 24, among a plurality of areas of the substrate adsorption means 24. The substrate W may be sequentially adsorbed from one region to another region.

Subsequently, the control unit of the film forming apparatus 11 drives the mask support unit lifting mechanism to make the substrate adsorption means 24 and the mask support unit 23 relatively close. At this time, the control unit adsorbs the substrate until the distance between the substrate W adsorbed by the substrate adsorbing means 24 and the mask M supported by the mask support unit 23 becomes a preset rough alignment measurement distance. The means 24 and the mask support unit 23 are relatively approached (for example, the mask support unit 23 is raised).

When the distance between the substrate (W) and the mask (M) with a predetermined rough alignment measurement distance, by the rough alignment camera, to image the alignment marks of the substrate (W) and the mask (M), in the XYθ _Z direction The relative positions of the substrate W and the mask M are measured, and the relative positional shift amount between them is calculated based on this.

The control unit is based on the position of the fine stage plate unit 222 or the substrate adsorption means 24 measured by the laser interferometer and the relative position shift amount calculated by the rough alignment camera, the fine stage plate unit 222 or the substrate The coordinates of the moving target position of the suction means 24 are calculated.

Based on the coordinates of the moving target position, the fine moving stage plate part 222 or the substrate adsorption means 24 in the XYθ _Z direction by a magnetic levitation linear motor while measuring the position of the fine moving stage plate part 222 by a laser interferometer The relative positions of the substrate W and the mask M are adjusted by driving to the movement target position. In the rough alignment, it has been described that the fine stage plate portion 222 is moved by a magnetic levitation linear motor, but the mask support unit 23 is moved in the XYθ _Z direction according to the amount of positional displacement between the substrate W and the mask M. It may move to and may perform rough alignment.

When the rough alignment is completed, the mask support unit 23 is further raised by the mask support unit lifting mechanism, so that the mask M comes to the fine alignment measurement position with respect to the substrate W.

When the mask M comes to the fine alignment measurement position with respect to the substrate W, the alignment mark between the substrate W and the mask M is photographed with a fine alignment camera, and the relative positional displacement in the XYθ _Z direction is measured. .

When the relative positional deviation of the substrate W and the mask M at the fine alignment measurement position is greater than a predetermined threshold, the mask M is lowered again, so that the substrate W and the mask M are separated from each other. , Based on the position of the fine moving stage plate unit 222 measured by the laser interferometer 32 and the relative positional displacement of the substrate W and the mask M, the movement target position of the fine moving stage plate unit 222 is determined. Calculate.

Based on the calculated movement target position, by measuring the position of the fine moving stage plate part 222 with a laser interferometer, by driving the fine moving stage plate part 222 in the XYθ _Z direction by a magnetic levitation linear motor to the moving target position. , Adjust the relative position of the substrate W and the mask M.

And, if necessary, during or before or after rough alignment and/or fine alignment, the position and/or posture of the rough alignment camera and/or the fine alignment camera may be adjusted. For example, the rough alignment camera and/or the fine alignment camera may be moved in the Z-axis direction so that the substrate W is positioned at an appropriate focal position with respect to the rough alignment camera and/or the fine alignment camera. In addition, when the rough alignment camera and/or the fine alignment camera do not face vertically with respect to the substrate W, the inclination of the rough alignment camera and/or the fine alignment camera with respect to the container wall may be adjusted.

This process is repeated until the amount of relative positional shift between the substrate W and the mask M becomes smaller than a predetermined threshold.

When the relative positional deviation of the substrate W and the mask M is smaller than a predetermined threshold, the deposition position in which the deposition surface of the substrate W adsorbed by the substrate adsorption means 24 contacts the upper surface of the mask M If possible, the mask supporting unit 23 is raised.

When the deposition position where the substrate W and the mask M are in contact is reached, the magnetic force application means 26 is lowered and the mask M is pulled over the substrate W, so that the substrate W and the mask M Make it close.

To determine in this process whether the positional deviation of the XYθ _Z direction between the substrate (W) and the mask (M) occurs, by using the fine alignment camera performs the measurement of the relative position of the substrate (W) and the mask (M), When the measured displacement of the relative position is more than a predetermined threshold, the substrate W and the mask M are separated again by a predetermined distance (for example, the mask support unit 23 is lowered), and then the substrate W and the mask Adjust the relative position of (M) and repeat the same process.

In the state where the substrate W and the mask M are positioned at the deposition position, when the relative positional shift between the substrate W and the mask M is smaller than a predetermined threshold, the alignment process ends and the film formation process starts.

<Method of film formation>

Hereinafter, a film forming method employing an alignment method according to an embodiment of the present invention will be described.

In the state where the mask M is supported by the mask support unit 23 in the vacuum container 21, the substrate W is transferred to the vacuum container of the film forming apparatus 11 by the transfer robot 14 of the transfer chamber 13. 21) It is brought inside.

The hand of the transfer robot 14 entering the vacuum container 21 places the substrate W on the support portion of the substrate support unit.

After the substrate supporting unit is sufficiently close to or in contact with the substrate adsorbing means 24, a substrate adsorption voltage is applied to the substrate adsorbing means 24 to adsorb the substrate W.

In the state in which the substrate W is adsorbed by the substrate adsorbing means 24, the alignment process is performed according to the above-described alignment method according to the present embodiment.

According to the alignment method of this embodiment, when the relative positional shift amount between the substrate W and the mask M is smaller than a predetermined threshold, the shutter of the film forming source 25 is opened and the film forming material is transferred to the substrate W through the mask. The tabernacle.

After the film is formed to a desired thickness, the mask M is separated by raising the magnetic force applying means 26, and the mask supporting unit 23 is lowered.

Subsequently, the hand of the transfer robot 14 enters the vacuum container 21 of the film forming apparatus 11, and a zero (0) or reverse polarity substrate separation voltage is applied to the electrode portion of the substrate adsorption means 24, Separate (W) from the substrate adsorption means (24). The separated substrate is taken out from the vacuum container 21 by the transfer robot 14.

In the above description, the film forming apparatus 11 has a configuration of a so-called depo-up, in which film formation is performed while the film-forming surface of the substrate W faces downward in the vertical direction, but the present invention is not limited thereto. Alternatively, the substrate W may be disposed vertically on the side surface of the vacuum container 21, and the film may be formed in a state in which the film-forming surface of the substrate W is parallel to the direction of gravity.

<Method of manufacturing electronic device>

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device are illustrated as examples of electronic devices.

First, an organic EL display device to be manufactured will be described. Fig. 4(a) is an overall view of the organic EL display device 60, and Fig. 4(b) shows a cross-sectional structure of one pixel.

As shown in Fig. 4A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light-emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. Incidentally, the pixel referred to herein refers to a minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that exhibit different light emission. Has been. The pixel 62 is often composed of a combination of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, but may be a combination of a yellow light-emitting device, a cyan light-emitting device, and a white light-emitting device, and is particularly limited if it is at least one color. no.

Fig. 4(b) is a schematic partial cross-sectional view taken along line A-B in Fig. 4(a). The pixel 62 has an organic EL element including an anode 64, a hole transport layer 65, an emission layer 66R, 66G, and 66B, an electron transport layer 67, and a cathode 68 on the substrate 63. . Among these, the hole transport layer 65, the emission layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In this embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements emitting red, green, and blue colors (also referred to as organic EL elements). In addition, the anode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. Further, in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the anode 64. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In FIG. 4(b), the hole transport layer 65 or the electron transport layer 67 is illustrated as one layer, but depending on the structure of the organic EL display device, a plurality of layers including a hole block layer or an electron block layer may be formed. May be. In addition, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 may be formed. . Likewise, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method of manufacturing an organic EL display device will be described in detail.

First, a substrate 63 on which a circuit (not shown) and an anode 64 for driving an organic EL display device is formed is prepared.

On the substrate 63 on which the anode 64 is formed, an acrylic resin is formed by spin coating, and the acrylic resin is patterned to form an opening in the portion where the anode 64 is formed by a lithography method to form the insulating layer 69. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, and the substrate is held with an electrostatic chuck, and the hole transport layer 65 is formed as a common layer on the anode 64 in the display area. do. The hole transport layer 65 is formed by vacuum evaporation. Actually, since the hole transport layer 65 is formed to have a size larger than that of the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second organic material film forming apparatus, and is held by an electrostatic chuck. The substrate and the mask are aligned, and a light emitting layer 66R emitting red is formed on a portion of the substrate 63 in which an element emitting red is disposed.

Similar to the film formation of the light-emitting layer 66R, the light-emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and further, the light-emitting layer 66B emitting blue color is formed by the fourth organic material film-forming device. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth organic material film forming apparatus. The electron transport layer 67 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is transferred to a metal material film forming apparatus to form a cathode 68. At this time, the metal material film forming apparatus may be a film forming apparatus of a heat evaporation method or a film forming apparatus of a sputtering method.

According to the present invention, by installing the alignment camera so as to protrude into the vacuum container 21, even if the distance between the upper surface of the vacuum container 21 and the substrate/mask increases, it is possible to focus on the substrate/mask. Further, by providing the alignment camera so that its position and posture can be adjusted, the alignment accuracy can be further improved.

After that, it is transferred to a plasma CVD device to form a protective layer 70 to complete the organic EL display device 60.

From the time the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of an organic EL material is There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the carrying in and carrying out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea.

11: tabernacle device
21: vacuum container
22: magnetic levitation stage mechanism
23: mask support unit
24: substrate adsorption means
25: Tabernacle
26: magnetic force application means
27: alignment camera unit

Claims (17)

A film forming apparatus for depositing a film forming material on a substrate through a mask,
Vacuum container,
A substrate holding unit installed in the vacuum container and configured to hold a substrate,
A mask holding unit installed in the vacuum container and configured to hold the mask,
An alignment stage mechanism comprising a first plate portion installed in the vacuum container and a second plate portion movably installed with respect to the first plate portion, and for adjusting the relative positions of the substrate holding unit and the mask holding unit Wow,
An alignment camera for photographing a substrate held by the substrate holding unit and a mask held by the mask holding unit
Includes,
The vacuum container includes a cylindrical portion installed on the container wall to protrude from the container wall of the vacuum container to the inside of the vacuum container so that the tip thereof is between the first plate part and the second plate part,
The film forming apparatus, wherein the alignment camera is provided on the cylindrical portion.
delete delete delete The method of claim 1,
And the tubular portion includes a side wall portion installed on the vessel wall of the vacuum container and a tip portion made of a transparent material.
The film forming apparatus according to claim 5, wherein the cylindrical portion further comprises a connecting portion connecting the side wall portion and the tip portion, and the connecting portion vacuum-sealing the side wall portion and the tip portion.
The film forming apparatus according to claim 1, further comprising a camera adjustment stage unit capable of moving the alignment camera relative to the vacuum container.
The film forming apparatus according to claim 7, wherein the camera adjustment stage unit is capable of moving the alignment camera from a container wall of the vacuum container toward the substrate holding unit.
The film forming apparatus according to claim 7, wherein the camera adjustment stage part is capable of changing an angle formed by the alignment camera with a container wall of the vacuum container.
8. The film forming apparatus according to claim 7, further comprising a vibration suppression unit installed between the camera adjustment stage and the vacuum container.
The film forming apparatus according to claim 1, further comprising an illumination means provided on the opposite side of the substrate holding unit with respect to the alignment camera.
The film forming apparatus according to claim 1, wherein the substrate is a silicon wafer.
The film forming apparatus according to claim 1, wherein the first plate portion is a stage reference plate portion that functions as a stationary table, and the second plate portion is a fine-moving stage plate portion that functions as a movable table.
A film forming apparatus for depositing a film forming material on a substrate through a mask,
Vacuum container,
A substrate holding unit installed in the vacuum container and configured to hold a substrate,
A mask holding unit installed in the vacuum container and configured to hold the mask,
An alignment camera installed on the atmospheric side of the vacuum container and for photographing a substrate held by the substrate holding unit and a mask held by the mask holding unit,
A camera adjustment stage unit capable of moving the alignment camera relative to the vacuum container
Including,
The alignment camera is installed to protrude into the vacuum container,
Wherein the camera adjustment stage unit is capable of changing an angle formed by the alignment camera with a container wall of the vacuum container.
The film forming apparatus according to any one of claims 1 and 5 to 14, and
A mask stock device for storing a mask,
A transfer device for transferring a substrate or a mask
Electronic device manufacturing apparatus comprising a.
A film forming method comprising forming a film on a substrate by means of the film forming apparatus according to any one of claims 1 and 5 to 14 through a mask.
An electronic device manufacturing method, characterized in that an electronic device is manufactured using the film forming method according to claim 16.

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