KR102119753B1 - Touch panel - Google Patents

Abstract

A touch panel according to an embodiment includes a cover window; A first substrate disposed on the cover window and including a first hole; And a second substrate disposed on the first substrate, wherein the second substrate has a second pad portion disposed at a position corresponding to the first hole.

Description

Touch panel {TOUCH PANEL}

The embodiment relates to a touch panel.

Recently, in various electronic products, a touch panel for inputting an image displayed on a display device by contacting an input device such as a finger or a stylus has been applied.

The touch panel may be largely divided into a resistive touch panel and a capacitive touch panel. In the resistive touch panel, the position of the glass and the electrode is shorted by the pressure of the input device to detect the position. The capacitive touch panel detects a change in the capacitance between electrodes when a finger touches and the position is detected.

The resistive touch panel may degrade performance by repeated use and scratches may occur. Accordingly, interest in a capacitive touch panel having excellent durability and a long service life is increasing.

A sensing electrode and a wiring electrode are disposed on a cover window or a substrate on the touch panel, and the wiring electrode is connected to the printed circuit board to transmit a touch signal to a driving chip mounted on the printed circuit board.

The printed circuit board is connected to a wiring electrode disposed on the substrates. At this time, after the printed circuit board and the wiring electrode are jointly connected, the sealing portion may be sealed with a sealing material in order to prevent moisture penetration and the like.

However, despite the sealing, there is a problem in that external impurities can be penetrated into the junction between the printed circuit board and the wiring electrode, and the process efficiency is reduced according to the sealing process.

Therefore, there is a need for a new structured touch panel capable of solving these problems.

It is intended to provide a touch panel that can be easily manufactured in practice and has improved reliability.

A touch panel according to an embodiment includes a cover window; A first substrate disposed on the cover window and including a first hole; And a second substrate disposed on the first substrate, wherein the second pad portion is disposed at a position corresponding to the first hole.

Reliability of the touch panel according to the embodiment may be improved.

That is, in the touch panel according to the embodiment, holes may be formed in the adhesive layer and the substrates, and the printed circuit board may be disposed inside the substrate by connecting the printed circuit board through the holes.

Accordingly, it is possible to prevent the inflow of moisture or the like that can penetrate from the outside, thereby improving the reliability of the touch panel.

In addition, when forming a hole, by controlling the width of each hole, to prevent the generation of bubbles due to the shield layer arrangement, or when a bubble occurs, by forming a path to discharge it to the outside, it can remain inside The occurrence of air bubbles can be prevented.

Therefore, the touch panel according to the embodiment may have improved reliability as a whole.

1 is a view illustrating an exploded perspective view of a touch panel according to an embodiment.
2 is a view showing a top view of the first adhesive layer in the touch panel according to the embodiment.
3 is a diagram illustrating a top view of a first substrate in a touch panel according to an embodiment.
4 is a view showing a top view of the second adhesive layer.
5 is a view showing a top view of the second substrate.
6 is a sectional view showing a sectional view of a conventional touch panel.
7 and 8 are views illustrating various cross-sectional views of A-A' of FIG. 1.
9 and 10 are views showing a display device to which a touch panel according to an embodiment is applied.

In the description of the embodiments, each layer (film), region, pattern or structure may be “on/on” or “under/under” the substrate, each layer (film), region, pad or pattern. The term "formed on" includes both those formed directly or through another layer. The criteria for top/bottom or bottom/bottom of each layer are described based on the drawings.

In the drawings, the thickness or size of each layer (film), region, pattern, or structure may be modified for clarity and convenience of description, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 8, the touch panel according to the embodiment is disposed on the cover window 100, the first adhesive layer 210 disposed on the cover window 100, and the first adhesive layer 210. The first substrate 310, the second adhesive layer 220 disposed on the first substrate 310, the second substrate 320 disposed on the second adhesive layer 220 and the printed circuit board 400 Includes.

The cover window 100 may include glass or plastic. As an example, the cover window 100 may include tempered glass, semi-tempered glass, soda lime glass, tempered plastic, soft plastic, and the like.

The cover window 100 may include an effective area AA and a non-active area UA. The effective area AA means an area in which a user's touch command can be input. In addition, the non-effective area UA is a concept opposite to the effective area AA, and refers to an area in which a touch command is not input because it is not activated even when a user touches.

The first adhesive layer 210 may include a transparent adhesive. For example, the first adhesive layer 210 may include an optical clear adhesive (OCA).

The first adhesive layer 210 is disposed on the cover window 100. In detail, the first adhesive layer 210 is disposed on one surface of the cover window 100. The first adhesive layer 210 may bond the cover window 100 and the first substrate 310. That is, the first adhesive layer 210 is disposed between the cover window 100 and the first substrate 310, and can adhere the cover window 100 and the first substrate 310 to each other.

A third hole H3 may be formed in the first adhesive layer 210. In detail, the third hole H3 having a size corresponding to a junction of the printed circuit board 400 may be formed in the first adhesive layer 210.

The third hole H3 may be disposed inside the first adhesive layer 210. In detail, the third hole H3 may be formed on at least one edge of the edges of the first adhesive layer 210. In more detail, the first hole H3 may be formed at a position corresponding to the non-effective area AA of the cover window 100 in the first adhesive layer 210.

The first substrate 310 may include plastic. Illero, the first substrate 310 may include polyethylene terephthalate (PET).

The first substrate 310 is disposed on the cover window 100. In detail, the first substrate 210 is disposed on the first adhesive layer 210. The first substrate 310 may be laminated with the cover window 100 through the first adhesive layer 210.

The first substrate 310 may include a first sensing electrode 510 and a first wiring electrode 610. In detail, the first substrate 310 includes an effective area AA and an ineffective area UA, such as the cover window, and the first sensing electrode 510 is disposed on the effective area AA The first wiring electrode 610 may be disposed on the non-effective area UA.

The first sensing electrode 510 may be disposed to extend in the first direction on the first substrate 310. The first sensing electrode 510 may include a conductive material. In detail, the first sensing electrode 510 may include a transparent conductive material. In one example, the first sensing electrode 510 may include indium tin oxide (ITO).

The first wiring electrode 610 may be connected to the first sensing electrode 510. In detail, the first wiring electrode 610 may be electrically connected to the first sensing electrode 510. The first wiring electrode 610 may include a conductive material. In detail, the first wiring electrode 610 may include a metal material. For example, the first wiring electrode 610 may include a metal material such as silver (Ag) or copper (Cu).

The first wiring electrode 610 may be connected to the printed circuit board 400. in details. A first pad portion 710 is disposed on the first substrate 310, and the first wiring electrode 610 and the printed circuit board 400 may be electrically connected through the first pad portion 710. have. For example, the first wiring electrode 610 and the printed circuit board 400 may be connected to each other by using an anisotropic conductive film.

That is, the printed circuit board 400 may include a first junction 410 connected to the first wiring electrode 610. In detail, the printed circuit board 400 may be bonded to the wiring electrode 610 and the first bonding part 410 by the first pad part 710.

A first hole H1 may be formed in the first substrate 310. The first hole H1 may be formed to overlap the third hole H3. In detail, the first hole H1 may be formed to partially overlap the third hole H3.

In addition, the first pad portion 710 and the first hole H1 may be positioned adjacent to each other. In detail, the first pad portion 710 and the first hole H1 may be arranged side by side while being spaced at a predetermined distance on the first substrate 310.

In addition, the first hole H1 may be formed at a position corresponding to the second pad portion 720 disposed on the second substrate 320 described below. This will be described in detail below.

The second adhesive layer 220 may include a transparent adhesive. For example, the second adhesive layer 220 may include an optical clear adhesive (OCA). The first adhesive layer 210 and the second adhesive layer 220 may include the same material.

The second adhesive layer 220 is disposed on the first substrate 310. In detail, the second adhesive layer 220 is disposed on one surface of the first substrate 310. The second adhesive layer 220 may adhere the first substrate 310 and the second substrate 320. That is, the second adhesive layer 220 is disposed between the first substrate 310 and the second substrate 310 and can bond the first substrate 310 and the second substrate 320 to each other. have.

A fourth hole H4 may be formed in the second adhesive layer 220. In detail, the fourth hole H4 having a size corresponding to the first hole H1 may be formed in the first adhesive layer 210.

The fourth hole H4 may be formed at a position overlapping the third hole H3. In detail, the fourth hole H4 may be formed at a position partially overlapping the third hole H3. Further, the fourth hole H4 may be formed at a position overlapping the first hole H1. In detail, the fourth hole H4 may be formed at a position that partially or partially overlaps the first hole H1.

The second substrate 320 is disposed on the cover window 100. In detail, the second substrate 210 is disposed on the second adhesive layer 220. The second substrate 320 may be laminated with the second substrate 310 through the second adhesive layer 220.

The second substrate 320 may include a second sensing electrode 520 and a second wiring electrode 620. In detail, the second substrate 320 includes an effective area AA and an ineffective area UA, such as the cover window 100, and the second sensing electrode 520 is the effective area AA The second wiring electrode 612 may be disposed on the non-active area UA.

The second sensing electrode 520 may be disposed to extend in the second direction on the second substrate 320. In detail, the second sensing electrode 520 may be disposed to extend in a second direction different from the first direction in which the first sensing electrode 510 extends. For example, the first sensing electrode 510 and the second sensing electrode 520 may be disposed to cross each other.

The second sensing electrode 520 may include a conductive material. In detail, the second sensing electrode 520 may include a transparent conductive material. In one example, the second sensing electrode 520 may include indium tin oxide (ITO).

The second wiring electrode 620 may be connected to the second sensing electrode 520. In detail, the second wiring electrode 620 may be electrically connected to the second sensing electrode 520. The second wiring electrode 620 may include a conductive material. In detail, the second wiring electrode 620 may include a metal material. For example, the second wiring electrode 620 may include a metal material such as silver (Ag) or copper (Cu).

The second wiring electrode 620 may be connected to the printed circuit board 400. in details. A second pad part 720 is disposed on the second substrate 320, and the second wiring electrode 610 and the printed circuit board 400 may be electrically connected through the second pad part 720. have. For example, the second wiring electrode 620 and the printed circuit board 400 may be connected to each other by using an anisotropic conductive film.

The second pad part 720 may be disposed on the second substrate 320 at positions corresponding to the first hole H1 and the fourth hole H4. in details. The upper surface of the second pad portion 720 may be exposed to the second pad portion 720 by the first hole H1. In more detail, the upper surface of the second pad portion 720 may be exposed to the second pad portion 720 by the first hole H1, the third hole H3, and the fourth hole H4. You can.

Accordingly, in the printed circuit board 400, the wiring electrode 620 and the second bonding portion 420 are connected to the first hole by the second bonding portion 420 connected to the second wiring electrode 620. H1), the third hole H3 and the second pad part 720 exposed by the fourth hole H4 may be joined to each other and connected.

A second hole H2 may be formed in the second substrate 320. The second hole H2 may be formed at a position corresponding to the third hole H3. Also, the second hole H2 may be formed to overlap the third hole H3. In detail, the second hole H2 may be formed to partially or completely overlap the first hole H1, the third hole H3, and the fourth hole H4.

Further, the second pad portion 720 and the second hole H2 may be positioned adjacent to each other. In detail, the second pad part 720 may be positioned above or below the second hole H2.

The printed circuit board 400 may be flexible. In detail, the printed circuit board may include a flexible printed circuit board (FPCB). The printed circuit board 400 is the first pad portion 710 disposed on the first substrate 310 and the second pad portion 720 disposed on the second substrate 320, the The first wiring electrode 610 and the second wiring electrode 620 may be electrically connected to each other.

A driving chip 430 may be mounted on the printed circuit board 400. Accordingly, touch signals sensed by the first sensing electrode 510 and the second sensing electrode 520 are transmitted through the first wiring electrode 610 and the second wiring electrode 620 through the printed circuit board ( 400) may be transmitted to the driving chip 430.

The shielding layer 800 may be disposed on the second substrate 320. The shielding layer 800 may be formed while covering all of the first hole H1, the second hole H2, the third hole H3, and the fourth hole H4.

The shielding layer 800 may serve as an antireflection layer and a protective layer. That is, the shielding layer 800 is disposed on the second substrate 320 to serve as an anti-reflection function, thereby improving optical properties, and at the same time, acting as a protective layer through which impurities are penetrated to improve reliability. You can.

The first hole H1, the second hole H2, the third hole H3, and the fourth hole H4 may have different sizes. In detail, the first hole H1, the second hole H2, the third hole H3 and the fourth hole H4 may be formed with different widths.

In detail, the width d3 of the third hole H3 is the width d1 of the first hole H1, the width d4 of the fourth hole H4 and the width of the second hole H2 ( d2). In detail, the width d1 of the first hole H1 and the width d4 of the fourth hole H4 may be about 1.65 mm to about 1.85 mm.

The first hole H1 and the fourth hole H4 include the second pad part 720 in which the second bonding part 420 of the printed circuit board 400 is disposed on the second substrate 320. It can act as a passageway to connect with.

Conventionally, as illustrated in FIG. 6, the shielding layer 800 disposed at the bottom is formed while covering all of the first hole H1, the second hole H2, and the three holes H3. In this case, when the second substrate is disposed by the holes, it may be disposed to be biased toward the hole portion, and air bubbles may be generated between the second substrate and the shielding layer in the biased portion. In addition, even if the width is controlled, there is a problem that bubbles are still present because there is no path through which bubbles are generated.

Accordingly, the touch panel according to the embodiment, as illustrated in FIGS. 7 and 8, controls the widths of the first hole H1 and the fourth hole H4 to prevent the bubbles from occurring. , A second hole may be formed in the second substrate. That is, when the widths of the first hole H1 and the fourth hole H4 are formed to exceed 1.85 mm, the generation of bubbles due to the step difference may increase, and when the widths of the first hole H1 and less than 1.65 mm are formed, the width When it is too small, when air bubbles are generated, the air bubbles cannot escape through the second hole H2.

Further, the width of the second hole H2 may be smaller than the width of the first hole H1, the third hole H3, and the fourth hole H4. For example, the width of the second hole H2 may be about 0.1 mm to about 0.3 mm. The second hole H2 serves to discharge bubbles generated therein to the outside. When the width of the second hole H2 is formed below the above range, the generated bubbles may not be smoothly discharged to the outside.

The touch panel according to the embodiment may connect the printed circuit board and the wiring electrodes from the inside of the first substrate and the second substrate. Accordingly, it is possible to prevent the penetration of moisture, which may penetrate into the junction between the printed circuit board and the wiring electrodes.

Conventionally, the printed circuit board and the wiring electrode are connected over the inner and outer sides of the first substrate and the second substrate, and as a result, impurities such as moisture may penetrate into the outer portions of the first substrate and the second substrate.

To solve this problem, the touch panel according to the embodiment forms a pad portion inside the first substrate and the second substrate, and the first adhesive layer and the second adhesive layer have printed circuit boards at positions corresponding to the pad portions. By forming holes for bonding of the printed circuit boards from the inside of the substrate.

Accordingly, in the touch panel according to the embodiment, after bonding the printed circuit board and the wiring electrode, penetration of impurities such as moisture that may be introduced from the outside can be prevented. In addition, the bonding process can be omitted after bonding the printed circuit board and the wiring electrode, thereby improving process efficiency.

In addition, the touch panel according to the embodiment, when forming the first hole, the second hole, the third hole and the fourth hole in the adhesive layers and the substrate, by controlling their width to prevent the occurrence of bubbles caused by this have. That is, by optimizing the widths of the first hole and the fourth hole, it is possible to minimize the generation of bubbles, and the bubbles generated therefrom can be discharged through the second hole formed in the second substrate.

Therefore, the touch panel according to the embodiment may minimize air bubbles and form a passage for discharging it, thereby improving reliability of the entire touch panel.

9 and 10 are views illustrating an example of a display device including the touch panel described above.

Referring to FIG. 9, as an example of a display device, a mobile terminal is illustrated. The mobile terminal 1500 may include an effective area AA and a non-active area UA. The effective area AA detects a touch signal by a touch of a finger or the like, and a command icon pattern unit and a logo may be formed in the non-effective area.

In addition, referring to FIG. 10, as an example of a display device, a portable notebook is illustrated. The portable notebook includes a touch panel 1000, a touch sheet 3000 and a circuit board 2000. A touch sheet 3000 is disposed on an upper surface of the touch panel 1000. The touch sheet 300 may protect the touch area TA. In addition, the touch sheet 3000 may improve a user's touch feeling.

Subsequently, a circuit board 2000 electrically connected to the touch panel 1000 is included on a lower surface of the touch panel 1000. The circuit board 2000 is a printed circuit board, and various components for constructing a portable notebook may be mounted.

In FIGS. 9 and 10, for example, only the mobile terminal and the portable notebook are illustrated, but the touch panel described above can be used in various electronic products such as automobiles and home appliances to which the display is applied in addition to the mobile terminal and the portable laptop. .

Features, structures, effects, and the like described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, and the like exemplified in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been mainly described above, these are merely examples and do not limit the present invention, and those skilled in the art to which the present invention pertains are exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be implemented by modification. And differences related to these modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

Claims (10)

Cover window;
A first substrate disposed on the cover window and including a first hole;
A second substrate disposed on the first substrate; And
And a shielding layer disposed on the second substrate,
A second pad portion is disposed on the second substrate at a position corresponding to the first hole,
A first pad portion is disposed on the first substrate,
The first pad portion is spaced apart from the first hole and is arranged side by side,
A first adhesive layer disposed between the cover window and the first substrate; And
Further comprising a second adhesive layer disposed between the first substrate and the second substrate,
The first adhesive layer includes a third hole into which the printed circuit board is inserted,
The second adhesive layer is a touch panel including a fourth hole formed in a position corresponding to the first hole. delete delete According to claim 1,
The upper surface of the second pad portion is exposed by the first hole and the fourth hole in the second pad portion.
The printed circuit board is a touch panel connected to the second pad part through the first hole and the fourth hole. According to claim 1,
The width of the third hole is larger than the width of the first hole and the width of the fourth hole. The method of claim 5,
The width of the first hole and the fourth hole is 1.65 mm to 1.85 mm. According to claim 1,
The first hole and the fourth hole, a touch panel partially overlapping the third hole. According to claim 1,
In the second substrate, a touch panel in which a second hole is formed at a position corresponding to the third hole. The method of claim 8,
The width of the second hole, the touch panel is formed smaller than the width of the first hole, the third hole and the fourth hole. delete

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