KR102099660B1 - Apparatus for processing substrate - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, wherein the substrate processing apparatus includes a vacuum chamber, a susceptor provided to be able to elevate inside the vacuum chamber, and a variable ground portion selectively connecting the susceptor and the vacuum chamber to ground. And, the ground connection state between the susceptor and the vacuum chamber can be maintained or released by the variable ground part, so that the ground state of the susceptor can be selectively varied, and damage and breakage of the variable ground part can be prevented.

Description

Substrate processing equipment {APPARATUS FOR PROCESSING SUBSTRATE}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of selectively changing the ground state of the susceptor for supporting the substrate inside the chamber.

In general, Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment deposits an insulating film, a protective film, an oxide film, or a metal film on a substrate using a chemical reaction of a gas in a vacuum during a display manufacturing process or a semiconductor manufacturing process. Used for

1 is a view showing a conventional substrate processing apparatus.

Referring to FIG. 1, the existing substrate processing apparatus includes a vacuum chamber 10, a susceptor 20 provided to be lifted inside the vacuum chamber 10, and on which the substrate 2 is loaded, the susceptor ( The upper part of 20) is provided with an electrode and a shower head 30 through which process gas is ejected.

As process gas is supplied to the inside of the vacuum chamber 10 through the shower head 30 and RF power is applied to the electrode, the process gas supplied to the inside of the vacuum chamber 10 is plasmad and susceptor ( 20) may be deposited on the substrate 2 seated on the top surface.

On the other hand, during the deposition process, charges may accumulate on the susceptor 20, and the charges accumulated on the susceptor 20 may generate parasitic discharges. Therefore, in order to generate a more stable and uniform plasma, the susceptor ( It should be possible to discharge the charge of 20) to the outside. Accordingly, the susceptor 20 and the process chamber 10 are connected to a ground strap 22 by way of a conventional method, and charges accumulated in the susceptor 20 can be escaped through the ground strap 22. .

However, conventionally, as one end of the ground strap 22 is fixed to the susceptor 20 and the other end is fixed to the process chamber 10, when the susceptor 20 is elevated, the ground strap 22 is repeatedly bent or There is a problem of being deformed to be folded, and as a result, the performance of the ground strap 22 is deteriorated, and in severe cases, the ground strap 22 is damaged or broken.

In addition, conventionally, the ground strap 22 needs to be periodically replaced after a certain period of use, but there is a problem that it takes a lot of time to replace the ground strap 22 due to the mounting position of the ground strap 22, and the ground strap ( During the replacement work of 22), the process itself must be stopped, so there is a problem that productivity decreases.

Accordingly, in recent years, the grounding stability and reliability of the susceptor can be improved, and various studies have been conducted to improve the process efficiency, but it is still insufficient to develop it.

An object of the present invention is to provide a substrate processing apparatus capable of improving the grounding stability and reliability of the susceptor and improving the process efficiency.

In particular, an object of the present invention is to provide a substrate processing apparatus capable of selectively changing the ground state of the susceptor by using a variable ground.

In addition, an object of the present invention is to provide a substrate processing apparatus capable of preventing performance degradation and damage of the ground strap and extending its life.

In addition, an object of the present invention is to provide a substrate processing apparatus that can locally adjust the impedance of the susceptor using a variable ground.

In addition, an object of the present invention is to provide a substrate processing apparatus capable of efficiently processing a large area substrate.

According to a preferred embodiment of the present invention for achieving the objects of the present invention described above, the substrate processing apparatus is provided to be able to elevate inside the vacuum chamber, a susceptor on which the substrate is seated, and a susceptor and a vacuum chamber. It includes a variable grounding portion for selectively connecting to the ground, the ground connection state between the susceptor and the vacuum chamber can be maintained or released by the variable grounding unit. Through such a configuration, the ground state of the susceptor can be selectively varied, and damage and breakage of the variable ground portion due to the movement of the susceptor can be prevented.

As the variable ground unit, the susceptor and the vacuum chamber may be provided in various structures capable of selectively grounding connection. Here, it is understood that the variable grounding unit selectively connects the susceptor and the vacuum chamber to ground, the variable grounding unit connects the susceptor to the vacuum chamber according to process conditions, or releases the ground connection state of the susceptor and the vacuum chamber. Can be.

In addition, the ground connection state of the susceptor and the vacuum chamber by the variable grounding unit may be variously set according to the position conditions of the susceptor. For example, when the susceptor is raised, the variable ground unit may be configured to ground the susceptor and the vacuum chamber, and when the susceptor is lowered, the ground connection state between the susceptor and the vacuum chamber by the variable ground unit may be released. have. In some cases, it is also possible to configure such that the ground connection state between the susceptor and the vacuum chamber by the variable grounding part is released while the susceptor is raised.

For example, the variable ground portion may include a movable member that is movably provided in a direction approaching and spaced apart from the susceptor, and a ground strap connected to one end of the movable member and the other end to a vacuum chamber. When is moved in the direction approaching the susceptor, the other end of the ground strap is contacted by the movable member to be connected to the ground. With this configuration, when the susceptor is raised and lowered, the contact state between the ground strap and the guide rod can be released, thereby minimizing deformation of the ground strap and preventing damage due to repeated deformation of the ground strap. can do.

As another example, the variable ground unit may include a movable member provided to be movable in a direction approaching and spaced apart from the susceptor, and a grounding strap disposed at one end fixed to the vacuum chamber and disposed at the other end as a free end. When is moved in the direction approaching the susceptor, the free end of the ground strap is contacted by the movable member to be connected to the ground.

In addition, the driving member may be configured to move linearly or rotate in a direction approaching and spaced apart from the susceptor, and the moving method of the driving member may be variously changed according to required conditions and design specifications. In addition, since a driving unit providing a driving force to move the movable member may be provided, the movable member may move in a direction approaching and spaced apart from the susceptor by the driving force of the driving unit.

For reference, the contact portion of the susceptor in contact with the variable contact portion may be variously changed according to required conditions and design specifications. Here, the contact portion of the susceptor in contact with the variable contact portion may be understood as a concept including both the susceptor itself or a peripheral member attached to or coupled to the susceptor to be electrically connected to the susceptor. For example, the susceptor may be coupled such that the guide rod is electrically connected, and the variable ground portion may selectively connect the guide rod and the vacuum chamber to ground. More specifically, one end of the guide rod is fixed to the bottom surface of the susceptor, the other end can be arranged as a free end, and the variable ground part can be selectively grounded to the free end of the guide rod. In addition, a rod accommodating portion for receiving the guide rod when the susceptor is lowered may be formed in the vacuum chamber.

Meanwhile, a plurality of variable ground units may be provided spaced apart on the susceptor, and the plurality of variable ground units may maintain or release a ground connection state independently of each other. That is, while the susceptor is raised, some of the plurality of variable ground parts may maintain the ground connection state, and other parts of the plurality of variable ground parts may release the ground connection state. Here, that the ground connection state by the variable ground unit is maintained may be understood as a state in which the ground strap is in contact with the guide rod, and that the ground connection state by the variable ground unit is released, the ground strap is the guide rod. It can be understood as being spaced from. With this configuration, the impedance of the susceptor can be locally adjusted by locally adjusting the ground portion of the susceptor. When performing a deposition process on a large area substrate, there is a problem in that the impedance of the susceptor is non-uniform frequently, and when the impedance is non-uniform, there is a problem that the deposited material is difficult to be uniformly deposited. However, in the present invention, since the ground connection state by a plurality of variable ground parts can be independently maintained or released, the impedance of the susceptor can be uniformly controlled as a whole, and the deposited material can be deposited more uniformly.

As another example of the variable grounding unit, the variable grounding unit may be configured to vary the ground connection state between the susceptor and the vacuum chamber in a strapless manner. Particularly, since the use of the strapless variable grounding part is excluded, the structure can be simplified and the problem caused by the strap can be fundamentally blocked. For example, the variable ground unit may include a ground terminal electrically connected to the vacuum chamber and provided adjacent to the periphery of the guide rod, and when the susceptor is raised, the guide rod contacts the ground terminal and is grounded, When the susceptor is lowered, the guide rod may be separated from the ground terminal.

In addition, physical contact between the guide rod and the ground terminal can be implemented in various ways according to required conditions and design specifications. For example, the physical contact between the guide rod and the ground terminal may be implemented using the driving force of the driving unit, or may be realized by interference between structures corresponding to each other.

For example, when the guide rod and the ground terminal are physically contacted, a movable member may be provided to be movable in a direction in which the guide rod is approached and spaced apart. The guide rod may be pressed and contact the ground terminal, and when the movable member moves in a direction away from the guide rod, the guide rod may be spaced from the ground terminal.

As another example in which the guide rod and the ground terminal are physically contacted, a contact protrusion may be formed on the guide rod, and a guide protrusion may be provided around the guide rod so as to interfere with the contact protrusion, and the susceptor is elevated. In, the contact protrusion is pressed by the guide protrusion, and the guide rod can be brought into contact with the ground terminal. The interference structure between the contact protrusion and the guide protrusion can be variously changed according to required conditions and design specifications. For example, the guide protrusion may be formed with an inclined guide portion, and the contact protrusion may move along the inclined guide portion and press the guide rod in a direction in contact with the ground terminal.

In addition, a sensing unit may be provided to detect whether the ground strap is in contact with the susceptor. Alternatively, even when a strapless variable grounding unit is applied, a sensing unit for sensing whether or not the grounding is performed by the variable grounding unit (ground connection state) may be used.

As described above, according to the present invention, the grounding stability and reliability of the susceptor can be improved, and the process efficiency can be improved.

In particular, according to the present invention, the ground state of the susceptor can be selectively changed using the variable grounding unit. Therefore, it is possible to minimize deformation of the variable ground portion, prevent performance degradation and damage of the variable ground portion due to vertical movement of the susceptor, and extend life.

In addition, according to the present invention, when the ground strap is used as a variable ground, the ground strap can be separated from the susceptor when the susceptor moves up and down, thereby deteriorating and damaging the performance of the ground strap due to the repeated up and down movement of the susceptor. Can be prevented.

Further, according to the present invention, by making the ground state of the susceptor more stable, it is possible to prevent the occurrence of parasitic discharge and generate a more stable and uniform plasma.

Further, according to the present invention, the impedance of the susceptor region can be uniformly controlled as a whole by locally adjusting the grounding portion of the susceptor using the variable ground. In particular, according to the present invention, the deposition material can be more uniformly and efficiently deposited on a large area substrate by locally adjusting the impedance of the susceptor region according to the process conditions, thereby improving the yield of the large area substrate.

1 is a view showing a conventional substrate processing apparatus,
2 is a view for explaining a substrate processing apparatus according to the present invention,
3 and 4 is a substrate processing apparatus according to the present invention, a view for explaining the structure and operation structure of the variable ground,
5 and 6 is a substrate processing apparatus according to the present invention, a view for explaining a modified example of the variable ground,
7 is a substrate processing apparatus according to the present invention, a view for explaining another example of use of the variable ground,
8 and 9 are views for explaining a substrate processing apparatus according to another embodiment of the present invention,
10 and 11 are views for explaining a substrate processing apparatus according to another embodiment of the present invention,
12 is a substrate processing apparatus according to the present invention, a view for explaining the sensing unit,
13 is a substrate processing apparatus according to the present invention, a view for explaining another arrangement example of the variable ground.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and the contents described in other drawings may be cited and described under these rules, and repeated contents that are deemed to be obvious to those skilled in the art or may be omitted.

2 is a view for explaining the substrate processing apparatus according to the present invention, FIGS. 3 and 4 are diagrams for explaining the structure and operation structure of the variable ground portion as a substrate processing apparatus according to the present invention, FIGS. 5 and 6 Is a substrate processing apparatus according to the present invention, a view for explaining a modification of the variable ground portion.

2 to 4, the substrate processing apparatus according to the present invention includes a vacuum chamber 110, a susceptor 120, and a variable ground unit 200.

The vacuum chamber 110 is provided to have a predetermined processing space therein, and at least one side of the side wall is provided with an entrance for the substrate 102 and a mask.

The size and structure of the vacuum chamber 110 may be appropriately changed according to required conditions and design specifications, and the present invention is not limited or limited by the characteristics of the vacuum chamber 110. As an example, the vacuum chamber 110 may be provided to have a large area processing space in which various transport units can be accommodated, along with a substrate 102 and a mask of a large area size. In addition, the variable ground unit (for example, a ground strap), which will be described later, is connected to a ground wire (not shown) of the vacuum chamber 110, so that the vacuum chamber and the susceptor can be grounded to each other.

The susceptor 120 is provided to be able to move up and down along the vertical direction inside the vacuum chamber 110, and the substrate 102 may be mounted on the upper surface of the susceptor 120. The susceptor 120 may be moved along the vertical direction by a conventional driving means such as a motor.

A shower head for supplying process gas and supplying RF energy may be provided at the upper portion of the susceptor 120, and a known shower head may be used as the shower head.

The variable ground unit 200 is provided to selectively connect the susceptor 120 and the vacuum chamber 110 to ground, and the ground connection state between the susceptor 120 and the vacuum chamber 110 is variable ground unit 200 Can be maintained or released.

As the variable ground part 200, the susceptor 120 and the vacuum chamber 110 may be provided in various structures capable of selectively ground connection. Here, the variable grounding part 200 selectively connects the susceptor 120 and the vacuum chamber 110 to the ground means that the variable grounding part 200 includes the susceptor 120 and the vacuum chamber ( It may be understood that the ground connection of 110) or the ground connection state of the susceptor 120 and the vacuum chamber 110 is released.

In addition, the ground connection state of the susceptor 120 and the vacuum chamber 110 by the variable ground unit 200 may be variously set according to the position conditions of the susceptor 120. For example, in the state in which the susceptor 120 is raised (the state in which the deposition process is performed), the variable ground unit 200 connects the susceptor 120 and the vacuum chamber 110 to the ground, and the susceptor 120 ) In the lowered state, the ground connection state between the susceptor 120 and the vacuum chamber 110 by the variable ground unit 200 may be released. In some cases, it is also possible to configure such that the ground connection state between the susceptor and the vacuum chamber by the variable grounding part is released while the susceptor is raised.

The variable ground unit 200 may be configured to vary the ground connection state between the susceptor 120 and the vacuum chamber 110 in a strapless or strapless manner, in addition to the required conditions and design specifications It can be configured in a variety of ways.

For example, referring to FIGS. 3 and 4, the variable ground part 200 is a movable member 210 provided to be movable in a direction to approach and space the susceptor 120, and one end is a vacuum chamber 110 ) And the other end may include a ground strap 220 connected to an end of the movable member 210, and when the movable member 210 moves in a direction approaching the susceptor 120, the movable member ( 210, the other end of the ground strap 220 is in contact with the susceptor 120 may be connected to the ground.

The movable member 210 may be configured to move linearly or rotate in a direction approaching and spaced apart from the susceptor 120. Hereinafter, an example in which the movable member 210 is configured to move linearly in a direction approaching and spaced apart from the susceptor 120 will be described.

In addition, a driving unit 230 providing a driving force to move the movable member 210 may be provided. The movable member 210 approaches and separates the susceptor 120 by the driving force of the driving unit 230. You can move in the direction you are. As the driving unit 230, a conventional motor and a solenoid may be used, and the present invention is not limited or limited by the type and characteristics of the driving unit 230.

One end of the ground strap 220 is connected to the vacuum chamber 110 and the other end is connected to the end of the movable member 210, selectively contacting the susceptor 120 in response to the movement of the movable member 210 or It can be spaced from the susceptor 120.

A flexible aluminum strap may be used as the ground strap 220, and it is also possible to use straps of other materials according to required conditions and design specifications. Preferably, the ground strap 220 may be in surface contact, and the bending strap may be formed in a relatively thin plate shape so that bending deformation can be easily implemented, and the ground by the ground strap 220 In the disconnected state, the ground strap 220 may return to an initial position (or an initial arrangement state) before being grounded.

For reference, the contact portion of the susceptor 120 in contact with the variable contact portion may be variously changed according to required conditions and design specifications. Here, the contact portion of the susceptor 120 to which the variable contact portion is contacted refers to both the susceptor 120 itself or a peripheral member attached to or coupled to the susceptor 120 so as to be electrically connected to the susceptor 120. It can be understood as an inclusive concept.

For example, a guide rod 122 may be coupled to the bottom surface of the susceptor 120 to be electrically connected, and the variable ground part 200 selectively grounds the guide rod 122 and the vacuum chamber 110. I can connect. More specifically, one end of the guide rod 122 is fixed to the bottom surface of the susceptor 120 and the other end can be disposed as a free end, and the variable ground part 200 is connected to the free end of the guide rod 122. It can optionally be grounded. Preferably, the guide rod 122 may be formed of a material or structure having a predetermined bending elasticity, and when the ground connection using the guide rod 122 is released, the initial position before the guide rod 122 is connected to the ground Can return to

In addition, a rod receiving portion 112 for receiving the guide rod 122 when the susceptor 120 is lowered may be formed under the vacuum chamber 110. The rod accommodating part 112 may be provided by a rod accommodating member 113 coupled to a lower portion of the vacuum chamber 110, and may form a uniform vacuum state with the vacuum chamber 110.

Referring again to FIG. 3, when the susceptor 120 is raised to perform the deposition process, the guide rod 122 connected to the susceptor 120 also rises as the susceptor 120 rises. . In the state in which the susceptor 120 and the guide rod 122 are raised, the movable member 210 moves in a direction approaching the guide rod 122 by the driving force of the driving unit 230, and accordingly, the movable member 210 ) The other end of the ground strap 220 connected to the end of the contact with the guide rod 122 may be connected to the ground.

Preferably, the susceptor 120 may be formed with a flat portion 122a for the ground strap 220 to be in surface contact. For example, a flat portion 122a in which the ground strap 220 can be in surface contact may be formed in an outer circumferential surface area of the guide rod 122 where the ground strap 220 is in contact. In some cases, it is also possible that the guide rod is provided as a square rod having a square cross-sectional shape.

On the other hand, referring to FIG. 4, the susceptor 120 may descend while the substrate 102 or the mask is being loaded or unloaded. Before the susceptor 120 descends and simultaneously or descends, the movable member 210 may move in a direction away from the guide rod 122 by the driving force of the driving unit 230, and accordingly, the movable member ( Since the other end of the ground strap 220 connected to the end of 210 is spaced from the guide rod 122, the ground connection state by the ground strap 220 may be released.

As described above, in the present invention, the ground connection state between the susceptor 120 (guide rod) and the vacuum chamber 110 by the ground strap 220 of the variable ground unit 200 can be selectively maintained or released. When the susceptor 120 is raised and lowered, the contact state between the ground strap 220 and the guide rod 122 can be released, thereby minimizing the deformation or bending deformation of the ground strap 220, and the ground strap ( The damage caused by repeated deformation of 220) can be prevented.

As a modification of the variable grounding unit 200, referring to FIGS. 5 and 6, the variable grounding unit 200 is a movable member 210 provided to be movable in a direction approaching and spaced apart from the susceptor 120 ), And one end may be fixed to the vacuum chamber 110 and the other end may include a ground strap 220 disposed as a free end. When the movable member 210 moves in the direction to approach the susceptor 120, The free end of the ground strap 220 is in contact with the susceptor 120 by the movable member 210 and can be connected to the ground.

The ground strap 220 is a cantilever (cantilever) structure, one end is fixed to the vacuum chamber 110 and the other end is arranged as a free end, the guide rod of the susceptor 120 selectively by the movable member 210 (122).

Referring to FIG. 5, when the susceptor 120 is elevated to perform a deposition process, the guide rod 122 connected to the susceptor 120 also rises as the susceptor 120 rises. In the state in which the susceptor 120 and the guide rod 122 are raised, the movable member 210 moves in a direction approaching the guide rod 122 by the driving force of the driving unit 230, and accordingly, the movable member 210 ), The free end of the ground strap 220 disposed adjacent to the end of the contact with the guide rod 122 may be connected to the ground.

As in the above-described embodiment, a flat portion 122a in which the ground strap 220 can be in surface contact may be formed on an outer circumferential surface area of the guide rod 122 where the ground strap 220 is in contact.

On the other hand, referring to FIG. 6, the susceptor 120 may descend while the substrate 102 or the mask is being loaded or unloaded. At this time, the movable member 210 may move in a direction away from the guide rod 122 by the driving force of the driving unit 230, and the free end of the ground strap 220 pressed by the movable member 210 is As the pressing force by the movable member 210 is released, it is separated from the guide rod 122, so that the ground connection state by the ground strap 220 can be released.

7 is a substrate processing apparatus according to the present invention, a view for explaining another example of use of the variable ground unit 200. In addition, the same or equivalent parts and the same reference numerals are assigned to the same or equivalent parts, and detailed description thereof will be omitted.

Referring to FIG. 7, a plurality of variable ground units 200 may be provided spaced apart on the susceptor 120, and the plurality of variable ground units 200 may independently maintain or release a ground connection state. have. That is, while the susceptor 120 is raised, some of the plurality of variable ground parts 200 may maintain a ground connection state, and some of the plurality of variable ground parts 200 may be disconnected from the ground connection state. have.

Here, that the ground connection state by the variable ground unit 200 is maintained, it can be understood that the ground strap 220 is in contact with the guide rod 122, and the ground connection by the variable ground unit 200 It can be understood that the state is released, the ground strap 220 is spaced apart from the guide rod 122.

The number and spacing of the variable ground parts 200 may be appropriately changed according to required conditions and design specifications, and the ground connection state by each variable ground part 200 may also be variously changed according to process conditions. .

Such a structure allows the impedance of the susceptor 120 to be locally adjusted by locally adjusting the grounding portion of the susceptor 120 using the variable ground 200. In particular, when performing the deposition process on the large area substrate 102, there is a problem that the impedance of the susceptor 120 is non-uniform frequently, and when the impedance is non-uniform, the deposited material is uniformly deposited. There are difficult problems. However, according to the present invention, since the grounding part of the susceptor 120 can be locally adjusted using the variable ground part 200 according to the process conditions, the impedance of the susceptor 120 can be uniformly controlled as a whole, The deposited material can be deposited more uniformly.

In the above-described and illustrated embodiments of the present invention, the variable grounding unit 200 includes an earth strap 220, for example, but the variable grounding unit 200 is strapless. It may be configured to vary the ground connection state between the acceptor 120 and the vacuum chamber 110.

8 and 9 are views illustrating a substrate processing apparatus according to another embodiment of the present invention, and FIGS. 10 and 11 are views illustrating a substrate processing apparatus according to another embodiment of the present invention. In addition, the same or equivalent parts and the same reference numerals are assigned to the same or equivalent parts, and detailed description thereof will be omitted.

8 to 11, the substrate processing apparatus includes a vacuum chamber 110, a susceptor 120, and a variable grounding unit 200, wherein the variable grounding unit 200 is provided in the vacuum chamber 110. It may be electrically connected and may include a ground terminal 220 'provided adjacent to the periphery of the guide rod 122, and when the susceptor 120 is raised, the guide rod 122 is the ground terminal 220'. In contact with the ground connection, the susceptor 120 in the lowered state, the guide rod 122 may be spaced from the ground terminal (220 ').

The ground terminal 220 ′ may be provided as an electrically conductive block structure electrically connected to the vacuum chamber 110. In some cases, the ground terminal may be provided through another structure or member electrically connectable to the vacuum chamber, and the present invention is not limited or limited by the characteristics and structure of the ground terminal. For example, the ground terminal 220 'may be provided on the inner wall surface of the rod receptor 113 in which the guide rod 122 is accommodated.

In addition, physical contact between the guide rod 122 and the ground terminal 220 'may be implemented in various ways according to required conditions and design specifications. For example, physical contact between the guide rod 122 and the ground terminal 220 ′ may be realized by using a driving force of the driving unit 230 or by interference between structures corresponding to each other.

For example, physical contact between the guide rod 122 and the ground terminal 220 ′ may be implemented using a driving force of the driving unit 230. 8 and 9, a movable member 210 may be provided to be movable in a direction that is approached and spaced apart from the guide rod 122, and the movable member 210 is driven by the driving force of the driving unit 230. When the movable member 210 moves in a direction approaching the guide rod 122, the guide rod 122 is pressed by the movable member 210 and can be brought into contact with the ground terminal 220 '. When the movable member 210 moves in a direction away from the guide rod 122, the guide rod 122 may be spaced apart from the ground terminal 220 '. As such, in another embodiment of the present invention, the guide rod 122 itself may serve as the ground strap 220 of the above-described embodiment.

Referring again to FIG. 8, when the susceptor 120 is raised, the guide rod 122 connected to the susceptor 120 also rises as the susceptor 120 rises. In the state in which the susceptor 120 and the guide rod 122 are raised, the movable member 210 moves in a direction approaching the guide rod 122 by the driving force of the driving unit 230, and accordingly, the guide rod 122 ) By the free end (lower end) of the movable member 210 being pressed against the ground terminal 220 ′ and connected to the ground. Here, the guide rod 122 and the ground terminal 220 'is preferably configured to be in surface contact.

On the other hand, referring to FIG. 9, the susceptor 120 may descend while the substrate 102 or the mask is being loaded or unloaded. At this time, the movable member 210 may move in a direction away from the guide rod 122 by the driving force of the driving unit 230, and the free end of the guide rod 122 pressed by the movable member 210 is As the pressing force by the movable member 210 is released, the ground connection state by the guide rod 122 may be released by being separated from the ground terminal 220 '.

As another example, physical contact between the guide rod 122 and the ground terminal 220 ′ may be implemented by interference between structures corresponding to each other. 10 and 11, a contact protrusion 122b may be formed on the guide rod 122, and a guide protrusion 210 ′ is provided around the guide rod 122 so as to interfere with the contact protrusion 122b. As it can be provided, in the state where the susceptor 120 is raised, the contact protrusion 122b is pressed by the guide protrusion 210 ′ and can guide the guide rod 122 to the ground terminal 220 ′. For example, the guide protrusion 210 ′ may be provided on the inner wall surface of the rod receptor 113 in which the guide rod 122 is accommodated.

The interference structure between the contact protrusion 122b and the guide protrusion 210 'may be variously changed according to required conditions and design specifications. For example, an inclined guide portion 210a may be formed on the guide protrusion 210 ', and the contact protrusion 122b is guided by the inclined guide portion 210a to induce bending deformation of the guide rod 122. By doing so, the guide rod 122 can be brought into contact with the ground terminal 220 '. In some cases, it is possible to form a guide projection having an inclined guide portion on the guide rod, and to form a contact projection around the guide rod (eg, the inner wall surface of the rod receptor).

Referring again to FIG. 10, as the susceptor 120 rises, the guide rod 122 connected to the susceptor 120 also rises. When the guide rod 122 is raised, the contact projections 122b formed on the guide rods 122 follow the inclined guide portion 210a of the guide projections 210 'formed on the inner wall surface of the rod receptor 113. It can be moved and pressurized, and consequently, the guide rod 122 is pressed in the direction approaching the ground terminal 220 ′ to be in contact with the ground terminal 220 ′ and connected to the ground.

On the other hand, referring to FIG. 11, the susceptor 120 may descend while the substrate 102 or the mask is being loaded or unloaded. When the susceptor 120 descends, the interference between the contact protrusions 122b and the guide protrusions 210 'may be released, and as the pressing force applied to the guide rod 122 is released by the interference between the protrusions As the guide rod 122 is spaced from the ground terminal 220 ', the ground connection state by the guide rod 122 may be released.

On the other hand, Figure 12 is a substrate processing apparatus according to the present invention, a view for explaining the sensing unit 300. In addition, the same or equivalent parts and the same reference numerals are assigned to the same or equivalent parts, and detailed description thereof will be omitted.

Referring to FIG. 12, according to the present invention, a sensing unit 300 for sensing whether the ground strap 220 is in contact with the susceptor 120 may be provided.

The sensing unit 300 may be configured to detect whether the ground strap 220 contacts the susceptor 120 in various ways according to required conditions and design specifications. For example, the sensing unit 300 may detect whether the ground strap 220 is in contact by detecting the movement of the guide rod 122. That is, in the case of the method in which the ground strap 220 is pressurized by the movable member 210, the ground strap () is detected by sensing the movement of the guide rod 122 as the movable member 210 presses the ground strap 220. 220) can be detected.

As the sensing unit 300, a conventional mechanical switch or sensor may be used, and the present invention is not limited or limited by the type and characteristics of the sensing unit 300. In some cases, even when a strapless variable grounding unit is applied (see FIGS. 8 to 11), a sensing unit for detecting whether or not the variable grounding unit is in contact (ground connection state) may be used.

On the other hand, Figure 13 is a substrate processing apparatus according to the present invention, a view for explaining another arrangement example of the variable ground. In addition, the same or equivalent parts and the same reference numerals are assigned to the same or equivalent parts, and detailed description thereof will be omitted.

Referring to FIG. 13, according to the present invention, even in a condition in which a peripheral member such as a guide rod described above is excluded from the susceptor, the variable ground part may be configured to be selectively grounded directly to the susceptor.

As an example, referring to FIG. 13, the variable ground portion may be provided on the sidewall surface of the vacuum chamber to be selectively contacted with the outer peripheral surface of the susceptor. For example, the variable ground portion is movable member 210 provided to be movable in the direction of approaching and spaced apart from the outer circumferential surface of the susceptor 120, and one end is connected to the wall surface of the vacuum chamber 110 (connected to the ground wire of the vacuum chamber) ) And the other end may include a ground strap 220 which is connected to an end of the movable member 210 (or adjacently arranged in a spaced state), and the movable member 210 is attached to the outer circumferential surface of the susceptor 120. When moving in the approaching direction, the other end of the ground strap 220 by the movable member 210 is in contact with the outer peripheral surface of the susceptor 120 may be connected to the ground. As in the above-described embodiment, the movable member 210 can be moved by a conventional driving unit 230.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can change it.

110: vacuum chamber 120: susceptor
122: guide rod 200: variable ground
210: movable member 220: ground strap
230: driving unit 300: detection unit

Claims (18)

Vacuum chamber;
A susceptor provided to be able to elevate inside the vacuum chamber and on which a substrate is seated; And
Optionally, the susceptor and the vacuum chamber include a movable member that is movably provided in a direction approaching and spaced apart from the susceptor, and a ground strap having one end fixed to the vacuum chamber and the other end disposed at a free end. A grounded variable connection to ground;
When the movable member moves in a direction approaching the susceptor, the free end of the ground strap is contacted and connected to the susceptor by the movable member, so that the ground connection state between the susceptor and the vacuum chamber is the A substrate processing apparatus, which can be held or released by a variable grounding unit.
According to claim 1,
And a driving unit providing a driving force to move the movable member.
According to claim 1,
The susceptor is a substrate processing apparatus, characterized in that a flat portion is formed for the ground strap is in surface contact.
According to claim 1,
And a sensing unit configured to detect whether the ground strap is in contact with the susceptor.
Vacuum chamber;
A susceptor provided to be able to elevate inside the vacuum chamber and on which a substrate is seated;
A guide rod electrically connected to the susceptor; And
A variable grounding part selectively connecting the susceptor and the vacuum chamber to the ground by selectively connecting the guide rod and the vacuum chamber to the ground;
And a ground connection state between the susceptor and the vacuum chamber can be maintained or released by the variable ground unit.
The method of claim 5,
The guide rod is provided to be able to elevate integrally with the susceptor,
When the susceptor is raised, the variable ground part connects the guide rod and the vacuum chamber to ground, and when the susceptor is lowered, the ground connection state between the guide rod and the vacuum chamber is released. Substrate processing device.
The method of claim 5,
One end of the guide rod is fixed to the bottom surface of the susceptor, the other end is arranged as a free end,
The variable ground portion is a substrate processing apparatus characterized in that it is selectively grounded to the free end of the guide rod.
The method of claim 5,
In the vacuum chamber, the substrate processing apparatus, characterized in that a rod receiving portion for receiving the guide rod is received when the susceptor is lowered.
The method of claim 5,
The variable ground unit,
A movable member movably provided in a direction approaching and spaced apart from the guide rod; And
One end is connected to the vacuum chamber, the other end is connected to the end of the movable member ground strap; includes,
When the movable member is moved in a direction approaching the guide rod, the substrate processing apparatus, characterized in that the other end of the ground strap by the movable member is in contact with the guide rod is connected to the ground.
The method of claim 5,
The variable ground unit,
A movable member movably provided in a direction approaching and spaced apart from the guide rod; And
One end is fixed to the vacuum chamber, the other end is a ground strap disposed as a free end; includes,
When the movable member is moved in a direction approaching the guide rod, the substrate processing apparatus, characterized in that the free end of the ground strap by the movable member is in contact with the guide rod is connected to the ground.
Vacuum chamber;
A susceptor provided to be able to elevate inside the vacuum chamber and on which a substrate is seated;
A guide rod electrically connected to the susceptor; And
A variable ground part electrically connected to the vacuum chamber and including a ground terminal provided adjacent to the periphery of the guide rod, and selectively connecting the susceptor and the vacuum chamber to ground;
It is configured to include, when the susceptor is raised, the guide rod is in contact with the ground terminal and connected to the ground, and when the susceptor is lowered, the guide rod is spaced apart from the ground terminal, and the susceptor The ground connection state between the vacuum chambers can be maintained or released by the variable grounding unit.
The method of claim 11,
It includes a movable member provided to be movable in a direction to approach and space the guide rod,
When the movable member moves in a direction approaching the guide rod, the guide rod is pressed by the movable member and contacts the ground terminal, and the guide rod is moved when the movable member moves in a direction away from the guide rod. A substrate processing apparatus characterized by being spaced apart from the ground terminal.
The method of claim 11,
Further comprising a contact protrusion formed on the guide rod, and a guide protrusion provided around the guide rod so as to interfere with the contact projection,
In the state in which the susceptor is raised, the substrate processing apparatus is characterized in that the contact protrusion is pressed by the guide protrusion and contacts the guide rod to the ground terminal.
The method of claim 13,
An inclined guide portion is formed in the guide projection,
The contact protrusion moves along the inclined guide portion and presses the guide rod in a direction in contact with the ground terminal.
The method according to any one of claims 1 to 14,
When the susceptor is raised, the variable ground part connects the susceptor and the vacuum chamber to ground,
When the susceptor is lowered, the substrate processing apparatus characterized in that the ground connection state between the susceptor and the vacuum chamber by the variable ground is released.
The method according to any one of claims 1 to 14,
The variable ground portion is provided with a plurality of spaced apart on the susceptor,
A plurality of the variable ground portion substrate processing apparatus characterized in that it is possible to maintain or release the ground connection independently of each other.
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