KR102097412B1 - CIP(Carbonyl Iron Powder)를 함유한 NR(Natural rubber)와 복합재료간 결합을 위한 접착 조성물 및 그 제조 방법 - Google Patents
CIP(Carbonyl Iron Powder)를 함유한 NR(Natural rubber)와 복합재료간 결합을 위한 접착 조성물 및 그 제조 방법 Download PDFInfo
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- KR102097412B1 KR102097412B1 KR1020180054356A KR20180054356A KR102097412B1 KR 102097412 B1 KR102097412 B1 KR 102097412B1 KR 1020180054356 A KR1020180054356 A KR 1020180054356A KR 20180054356 A KR20180054356 A KR 20180054356A KR 102097412 B1 KR102097412 B1 KR 102097412B1
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- 239000000203 mixture Substances 0.000 title claims abstract description 75
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims description 14
- 244000043261 Hevea brasiliensis Species 0.000 title claims description 11
- 229920003052 natural elastomer Polymers 0.000 title claims description 11
- 229920001194 natural rubber Polymers 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000853 adhesive Substances 0.000 claims abstract description 71
- 230000001070 adhesive effect Effects 0.000 claims abstract description 71
- 229920001971 elastomer Polymers 0.000 claims abstract description 26
- 239000005060 rubber Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 239000011230 binding agent Substances 0.000 claims abstract description 16
- 239000011256 inorganic filler Substances 0.000 claims abstract description 15
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000005011 phenolic resin Substances 0.000 claims description 28
- 229920001568 phenolic resin Polymers 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 19
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000011575 calcium Substances 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 9
- 238000004090 dissolution Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229920003987 resole Polymers 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- XAQHXGSHRMHVMU-UHFFFAOYSA-N [S].[S] Chemical compound [S].[S] XAQHXGSHRMHVMU-UHFFFAOYSA-N 0.000 description 2
- 230000007850 degeneration Effects 0.000 description 2
- 238000004925 denaturation Methods 0.000 description 2
- 230000036425 denaturation Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000029052 metamorphosis Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002411 thermogravimetry Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- AWFYPPSBLUWMFQ-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,6,7-tetrahydropyrazolo[4,3-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=C2 AWFYPPSBLUWMFQ-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000002783 friction material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- KMIOJWCYOHBUJS-HAKPAVFJSA-N vorolanib Chemical compound C1N(C(=O)N(C)C)CC[C@@H]1NC(=O)C1=C(C)NC(\C=C/2C3=CC(F)=CC=C3NC\2=O)=C1C KMIOJWCYOHBUJS-HAKPAVFJSA-N 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J121/00—Adhesives based on unspecified rubbers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
도 2는 복합소재 기재 상에서의 접착 조성물의 파단면 사진이다.
도 3은 실시예에 따른 접착 조성물의 TGA 분석 결과이다.
실시예 |
분자량
(g/ mol ) |
연화점
(℃) |
열분해온도
( TGA ) |
Type | 변성유무 |
실시예 1 | 580 | 68 | 300 ℃ | Resol | X |
실시예 2 | 2,241 | 75 | 350 ℃ | X | |
실시예 3 | 2,426 | 75 | 350 ℃ | Rubber 변성 | |
실시예 4 | 2,874 | 79 | 350 ℃ | Novolac | X |
실시예 5 | 3,123 | 79 | 350 ℃ | Alkylphenol 변성 | |
실시예 6 | 4,443 | 83 | 400 ℃ | CNSL 변성 | |
실시예 7 | 36,509 | 94 | 350 ℃ | Rubber 변성 | |
실시예 8 | 12,287 | 89 | 400 ℃ | Xylok 변성 |
페놀수지
종류 |
content (%) | 외관 |
Viscosity
(mPa·s) |
Mw | 흐름성 | |||
페놀수지 | 용제 | 무기필러 | solid | |||||
실시예 1 | 5 | 82 | 5 | 19.0 | 흑색 액상 | 300 | 276,013 | 용해 양호 |
실시예 2 | 5 | 82 | 5 | 18.9 | 회색 액상 | 120 | 166,752 | 용해 양호 |
실시예 3 | 5 | 81 | 5 | 20.2 | 회색 액상 | 220 | 189,342 | 용해 양호 |
실시예 4 | 5 | 80 | 5 | 18.1 | 회색 액상 | 330 | 197,365 | 용해 양호 |
실시예 5 | 5 | 80 | 5 | 21.2 | 흑색 액상 | 150 | 218,310 | 용해 양호 |
실시예 6 | 5 | 80 | 5 | 19.9 | 흑색 액상 | 345 | 220,105 | 용해 양호 |
실시예 7 | 5 | 79 | 5 | 20.9 | 흑색 액상 | 240 | 244,325 | 용해 양호 |
실시예 8 | 5 | 79 | 5 | 20.8 | 흑색 액상 | 280 | 201,415 | 용해 양호 |
접착 조성물 | 페놀수지 종류 | content ( % ) |
접착강도
( Kgf / cm2 ) |
||||
고무 바인더 | 페놀수지 | 무기필러 | 경화제 | 용제 | |||
조성물 1 | 실시예1 | 10 | 5 | 1 | 4 | 80 | 32.12 |
조성물 2 | 10 | 10 | 1 | 4 | 75 | 33.44 | |
조성물 3 | 실시예 2 | 10 | 5 | 1 | 4 | 80 | 30.25 |
조성물 4 | 10 | 10 | 1 | 4 | 75 | 31.24 | |
조성물 5 | 실시예 3 | 10 | 5 | 1 | 4 | 80 | 28.26 |
조성물 6 | 10 | 10 | 1 | 4 | 75 | 30.84 | |
조성물 7 | 실시예 4 | 10 | 5 | 1 | 4 | 80 | 29.12 |
조성물 8 | 10 | 10 | 1 | 4 | 75 | 30.17 | |
조성물 9 | 실시예5 | 10 | 5 | 1 | 4 | 80 | 34.22 |
조성물 10 | 10 | 10 | 1 | 4 | 75 | 38.48 | |
조성물 11 | 실시예6 | 10 | 5 | 1 | 4 | 80 | 33.21 |
조성물 12 | 10 | 10 | 1 | 4 | 75 | 34.25 | |
조성물 13 | 실시예7 | 10 | 5 | 1 | 4 | 80 | 31.57 |
조성물 14 | 10 | 10 | 1 | 4 | 75 | 32.55 | |
조성물 15 | 실시예8 | 10 | 5 | 1 | 4 | 80 | 27.31 |
조성물 16 | 10 | 10 | 1 | 4 | 75 | 28.46 |
Claims (8)
- 고무 바인더, 페놀수지, 무기필러, 경화제 및 용제를 포함하고,
복합재료용 접착 조성물 100 중량%를 기준으로 상기 고무 바인더는 10 내지 13 중량%(w/v), 상기 페놀수지는 5 내지 10 중량%(w/v), 상기 무기필러는 1 내지 2 중량%(w/v), 상기 경화제는 3 내지 4 중량%(w/v) 및 상기 용제는 75 내지 80 중량%(w/v)을 포함하고,
상기 페놀수지는 high-ortho type, rubber 변성 수지, Alkylphenol 변성 수지, Xylok 변성 수지, resorcinol 변성 수지, 및 CNSL 변성 수지로 이루어진 군에서 선택된 어느 하나인 것을 특징으로 하는 복합재료용 접착 조성물.
- 삭제
- 삭제
- 제1항에 있어서,
상기 무기필러는 아연계, 티타늄계 및 칼슘계 카본블랙으로 이루어진 군 중에서 선택되는 어느 하나 이상인 것을 특징으로 하는 복합재료용 접착 조성물.
- 제1항에 있어서,
상기 용제는 벤젠류인 톨루엔 및 자일렌으로 이루어진 군, 케톤류인 MEK, MIBK으로 이루어진 군에서 선택된 적어도 어느 하나인 것을 특징으로 하는 복합재료용 접착 조성물.
- 삭제
- 제1항, 제4항 및 제5항 중 어느 한 항에 따른 복합재료용 접착 조성물을 이용하여 복합재료 및 고무를 접착하는 접착 방법.
- 제7항에 있어서,
상기 복합재료는 유리섬유가 함유된 나일론 수지이고,
상기 고무는 CIP(Carbonyl Iron Powder)를 함유한 Natural rubber인 것을 특징으로 하는 접착 방법.
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KR1020180054356A KR102097412B1 (ko) | 2018-05-11 | 2018-05-11 | CIP(Carbonyl Iron Powder)를 함유한 NR(Natural rubber)와 복합재료간 결합을 위한 접착 조성물 및 그 제조 방법 |
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KR1020180054356A KR102097412B1 (ko) | 2018-05-11 | 2018-05-11 | CIP(Carbonyl Iron Powder)를 함유한 NR(Natural rubber)와 복합재료간 결합을 위한 접착 조성물 및 그 제조 방법 |
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Citations (3)
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JP2000315696A (ja) | 1999-04-28 | 2000-11-14 | Tomoegawa Paper Co Ltd | 半導体装置用接着剤組成物、接着シート及びそれを使用した補強部材 |
JP2009052051A (ja) | 2003-02-12 | 2009-03-12 | Nok Corp | 水性加硫接着剤組成物 |
US20180118903A1 (en) | 2015-06-30 | 2018-05-03 | Henkel Ag & Co. Kgaa | Process for Cold Bonding Rubber on Metal Substrates |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1177890A (ja) * | 1997-07-10 | 1999-03-23 | Nok Corp | ゴム積層金属板 |
KR20170045069A (ko) * | 2015-10-16 | 2017-04-26 | 도레이첨단소재 주식회사 | 비할로겐계 접착제 조성물을 이용한 동박 부착 접착시트 및 그 제조방법 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000315696A (ja) | 1999-04-28 | 2000-11-14 | Tomoegawa Paper Co Ltd | 半導体装置用接着剤組成物、接着シート及びそれを使用した補強部材 |
JP2009052051A (ja) | 2003-02-12 | 2009-03-12 | Nok Corp | 水性加硫接着剤組成物 |
US20180118903A1 (en) | 2015-06-30 | 2018-05-03 | Henkel Ag & Co. Kgaa | Process for Cold Bonding Rubber on Metal Substrates |
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