KR102095263B1 - Polymerizable resin, active energy ray-curable composition, and article - Google Patents
Polymerizable resin, active energy ray-curable composition, and article Download PDFInfo
- Publication number
- KR102095263B1 KR102095263B1 KR1020157033090A KR20157033090A KR102095263B1 KR 102095263 B1 KR102095263 B1 KR 102095263B1 KR 1020157033090 A KR1020157033090 A KR 1020157033090A KR 20157033090 A KR20157033090 A KR 20157033090A KR 102095263 B1 KR102095263 B1 KR 102095263B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- compound
- polymerizable unsaturated
- polymerizable
- functional group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 182
- 239000011347 resin Substances 0.000 title claims abstract description 182
- 239000000203 mixture Substances 0.000 title claims abstract description 101
- 239000000178 monomer Substances 0.000 claims abstract description 107
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 40
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 36
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 26
- 125000001153 fluoro group Chemical group F* 0.000 claims abstract description 23
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims description 120
- 125000000524 functional group Chemical group 0.000 claims description 107
- 238000000576 coating method Methods 0.000 claims description 82
- 239000011248 coating agent Substances 0.000 claims description 77
- 229920000642 polymer Polymers 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 43
- 125000000962 organic group Chemical group 0.000 claims description 37
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 34
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 125000005843 halogen group Chemical group 0.000 claims description 25
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 23
- 238000010526 radical polymerization reaction Methods 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 20
- 125000003700 epoxy group Chemical group 0.000 claims description 19
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 claims description 10
- 239000003446 ligand Substances 0.000 claims description 10
- 229910052723 transition metal Inorganic materials 0.000 claims description 10
- 150000003624 transition metals Chemical class 0.000 claims description 10
- 239000003505 polymerization initiator Substances 0.000 claims description 8
- 230000009257 reactivity Effects 0.000 claims description 8
- 125000005022 dithioester group Chemical group 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 150000003623 transition metal compounds Chemical class 0.000 claims description 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical group [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 claims description 2
- 125000002081 peroxide group Chemical group 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims 2
- 238000007127 saponification reaction Methods 0.000 abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 125
- 239000010408 film Substances 0.000 description 99
- -1 2-bromo-2-methylpropionyloxy group Chemical group 0.000 description 68
- 239000000243 solution Substances 0.000 description 63
- 238000003756 stirring Methods 0.000 description 50
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 49
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 49
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 49
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 48
- 239000002904 solvent Substances 0.000 description 39
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 34
- 238000011156 evaluation Methods 0.000 description 31
- 239000000463 material Substances 0.000 description 30
- 239000011521 glass Substances 0.000 description 28
- 239000011247 coating layer Substances 0.000 description 27
- 238000005259 measurement Methods 0.000 description 26
- 239000003054 catalyst Substances 0.000 description 25
- 239000010410 layer Substances 0.000 description 25
- 229910052757 nitrogen Inorganic materials 0.000 description 25
- 238000005227 gel permeation chromatography Methods 0.000 description 24
- 238000001816 cooling Methods 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 20
- 239000003112 inhibitor Substances 0.000 description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 150000003254 radicals Chemical class 0.000 description 18
- 239000006117 anti-reflective coating Substances 0.000 description 17
- 239000004793 Polystyrene Substances 0.000 description 16
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 16
- 238000002329 infrared spectrum Methods 0.000 description 16
- 239000003999 initiator Substances 0.000 description 16
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 16
- 229920002223 polystyrene Polymers 0.000 description 16
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 13
- 229920002284 Cellulose triacetate Polymers 0.000 description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 13
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 13
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 13
- 238000002360 preparation method Methods 0.000 description 13
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 239000003456 ion exchange resin Substances 0.000 description 12
- 229920003303 ion-exchange polymer Polymers 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 11
- 239000008199 coating composition Substances 0.000 description 11
- 230000008034 disappearance Effects 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- 239000004925 Acrylic resin Substances 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 10
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 10
- 229920001400 block copolymer Polymers 0.000 description 10
- 238000001723 curing Methods 0.000 description 10
- 239000012024 dehydrating agents Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- CDXFIRXEAJABAZ-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CDXFIRXEAJABAZ-UHFFFAOYSA-N 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 8
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 239000003973 paint Substances 0.000 description 8
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 7
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 7
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 7
- 229940045803 cuprous chloride Drugs 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- 229920001451 polypropylene glycol Polymers 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 229940059574 pentaerithrityl Drugs 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000005056 polyisocyanate Substances 0.000 description 6
- 229920001228 polyisocyanate Polymers 0.000 description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 6
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 230000003373 anti-fouling effect Effects 0.000 description 5
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 5
- 238000006297 dehydration reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 5
- 235000019341 magnesium sulphate Nutrition 0.000 description 5
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000003504 photosensitizing agent Substances 0.000 description 5
- 239000007870 radical polymerization initiator Substances 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000007405 data analysis Methods 0.000 description 4
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 239000002649 leather substitute Substances 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical class CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 3
- 230000009193 crawling Effects 0.000 description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 230000005865 ionizing radiation Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 125000005702 oxyalkylene group Chemical group 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 229920005604 random copolymer Polymers 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 2
- YOCIJWAHRAJQFT-UHFFFAOYSA-N 2-bromo-2-methylpropanoyl bromide Chemical compound CC(C)(Br)C(Br)=O YOCIJWAHRAJQFT-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- UXTGJIIBLZIQPK-UHFFFAOYSA-N 3-(2-prop-2-enoyloxyethyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(CCOC(=O)C=C)=C1C(O)=O UXTGJIIBLZIQPK-UHFFFAOYSA-N 0.000 description 2
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- NCAVPEPBIJTYSO-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate;2-(oxiran-2-ylmethoxymethyl)oxirane Chemical compound C1OC1COCC1CO1.OCCCCOC(=O)C=C NCAVPEPBIJTYSO-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 2
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- ISSDFLKUSQAECW-UHFFFAOYSA-N acetic acid;pyrrole-2,5-dione Chemical compound CC(O)=O.O=C1NC(=O)C=C1 ISSDFLKUSQAECW-UHFFFAOYSA-N 0.000 description 2
- XFSBVAOIAHNAPC-WSORPINJSA-N acetylbenzoylaconine Chemical compound O([C@H]1[C@]2(O)C[C@H]3C45[C@@H]6[C@@H]([C@@]([C@H]31)(OC(C)=O)[C@@H](O)[C@@H]2OC)[C@H](OC)C4[C@]([C@@H](C[C@H]5OC)O)(COC)CN6CC)C(=O)C1=CC=CC=C1 XFSBVAOIAHNAPC-WSORPINJSA-N 0.000 description 2
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000005202 decontamination Methods 0.000 description 2
- 230000003588 decontaminative effect Effects 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 238000000105 evaporative light scattering detection Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 238000000806 fluorine-19 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- ZMHZSHHZIKJFIR-UHFFFAOYSA-N octyltin Chemical compound CCCCCCCC[Sn] ZMHZSHHZIKJFIR-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000003887 surface segregation Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical class CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- TXZNVWGSLKSTDH-XCADPSHZSA-N (1Z,3Z,5Z)-cyclodeca-1,3,5-triene Chemical class C1CC\C=C/C=C\C=C/C1 TXZNVWGSLKSTDH-XCADPSHZSA-N 0.000 description 1
- MAOBFOXLCJIFLV-UHFFFAOYSA-N (2-aminophenyl)-phenylmethanone Chemical compound NC1=CC=CC=C1C(=O)C1=CC=CC=C1 MAOBFOXLCJIFLV-UHFFFAOYSA-N 0.000 description 1
- ZODNDDPVCIAZIQ-UHFFFAOYSA-N (2-hydroxy-3-prop-2-enoyloxypropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)COC(=O)C=C ZODNDDPVCIAZIQ-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- VNMOIBZLSJDQEO-UHFFFAOYSA-N 1,10-diisocyanatodecane Chemical compound O=C=NCCCCCCCCCCN=C=O VNMOIBZLSJDQEO-UHFFFAOYSA-N 0.000 description 1
- TYVXHXSNTUCEQO-UHFFFAOYSA-N 1,10-phenanthroline;ruthenium Chemical compound [Ru].C1=CN=C2C3=NC=CC=C3C=CC2=C1 TYVXHXSNTUCEQO-UHFFFAOYSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical class O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- VMDFFILMWWBSRJ-UHFFFAOYSA-N 1,2-dichlorobenzene;ruthenium Chemical compound [Ru].ClC1=CC=CC=C1Cl VMDFFILMWWBSRJ-UHFFFAOYSA-N 0.000 description 1
- ZLCLRFKRHPUIQB-UHFFFAOYSA-N 1,2-dichlorocycloocta-1,3-diene ruthenium Chemical compound [Ru].ClC1=C(Cl)C=CCCCC1 ZLCLRFKRHPUIQB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- AHBNSOZREBSAMG-UHFFFAOYSA-N 1,5-diisocyanato-2-methylpentane Chemical compound O=C=NCC(C)CCCN=C=O AHBNSOZREBSAMG-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- UTFSEWQOIIZLRH-UHFFFAOYSA-N 1,7-diisocyanatoheptane Chemical compound O=C=NCCCCCCCN=C=O UTFSEWQOIIZLRH-UHFFFAOYSA-N 0.000 description 1
- QUPKOUOXSNGVLB-UHFFFAOYSA-N 1,8-diisocyanatooctane Chemical compound O=C=NCCCCCCCCN=C=O QUPKOUOXSNGVLB-UHFFFAOYSA-N 0.000 description 1
- NLOCXQZOOGBEEN-UHFFFAOYSA-N 1-(1-hydroxypropan-2-yloxy)-3-phenoxypropan-2-ol Chemical compound OCC(C)OCC(O)COC1=CC=CC=C1 NLOCXQZOOGBEEN-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- AXTADRUCVAUCRS-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrole-2,5-dione Chemical compound OCCN1C(=O)C=CC1=O AXTADRUCVAUCRS-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- FBPVUBVZRPURIU-UHFFFAOYSA-N 1-hexylpyrrole-2,5-dione Chemical compound CCCCCCN1C(=O)C=CC1=O FBPVUBVZRPURIU-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HOLZCMFSCBLOLX-UHFFFAOYSA-N 1-octadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCN1C(=O)C=CC1=O HOLZCMFSCBLOLX-UHFFFAOYSA-N 0.000 description 1
- KIKBJYQCJJXCBZ-UHFFFAOYSA-N 1-octylpyrrole-2,5-dione Chemical compound CCCCCCCCN1C(=O)C=CC1=O KIKBJYQCJJXCBZ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- VYMSWGOFSKMMCE-UHFFFAOYSA-N 10-butyl-2-chloroacridin-9-one Chemical compound ClC1=CC=C2N(CCCC)C3=CC=CC=C3C(=O)C2=C1 VYMSWGOFSKMMCE-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- UXCIJKOCUAQMKD-UHFFFAOYSA-N 2,4-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC(Cl)=C3SC2=C1 UXCIJKOCUAQMKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- ZJRDYUFNRHQEMB-UHFFFAOYSA-N 2-(2-hydroxybutoxycarbonyl)benzoic acid Chemical group CCC(O)COC(=O)C1=CC=CC=C1C(O)=O ZJRDYUFNRHQEMB-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- NTINFTOOVNKGIU-UHFFFAOYSA-N 2-(2-hydroxyethoxycarbonyl)benzoic acid Chemical group OCCOC(=O)C1=CC=CC=C1C(O)=O NTINFTOOVNKGIU-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- AJOPUMVHMNKYCQ-UHFFFAOYSA-N 2-benzoylbenzoic acid;(2-methyl-4-phenylphenyl)-phenylmethanone Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1.CC1=CC(C=2C=CC=CC=2)=CC=C1C(=O)C1=CC=CC=C1 AJOPUMVHMNKYCQ-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-M 2-methylbenzenesulfonate Chemical compound CC1=CC=CC=C1S([O-])(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-M 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- GWOGSJALVLHACY-UHFFFAOYSA-N 2-pyridin-2-ylpyridine;ruthenium Chemical compound [Ru].N1=CC=CC=C1C1=CC=CC=N1 GWOGSJALVLHACY-UHFFFAOYSA-N 0.000 description 1
- USICVVZOKTZACS-UHFFFAOYSA-N 3-butylpyrrole-2,5-dione Chemical compound CCCCC1=CC(=O)NC1=O USICVVZOKTZACS-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- UIZDKHDPZRCOBN-UHFFFAOYSA-N 3-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCC1=CC(=O)NC1=O UIZDKHDPZRCOBN-UHFFFAOYSA-N 0.000 description 1
- MXVZVCCKUVRGQC-UHFFFAOYSA-N 3-hexylpyrrole-2,5-dione Chemical compound CCCCCCC1=CC(=O)NC1=O MXVZVCCKUVRGQC-UHFFFAOYSA-N 0.000 description 1
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- ZLPORNPZJNRGCO-UHFFFAOYSA-N 3-methylpyrrole-2,5-dione Chemical compound CC1=CC(=O)NC1=O ZLPORNPZJNRGCO-UHFFFAOYSA-N 0.000 description 1
- KFIRODWJCYBBHY-UHFFFAOYSA-N 3-nitrophthalic acid Chemical compound OC(=O)C1=CC=CC([N+]([O-])=O)=C1C(O)=O KFIRODWJCYBBHY-UHFFFAOYSA-N 0.000 description 1
- BLHDYAXSQWGYSM-UHFFFAOYSA-N 3-octadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCC1=CC(=O)NC1=O BLHDYAXSQWGYSM-UHFFFAOYSA-N 0.000 description 1
- VOYQCFMGTRPFKT-UHFFFAOYSA-N 3-octylpyrrole-2,5-dione Chemical compound CCCCCCCCC1=CC(=O)NC1=O VOYQCFMGTRPFKT-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- MDXKEHHAIMNCSW-UHFFFAOYSA-N 3-propylpyrrole-2,5-dione Chemical compound CCCC1=CC(=O)NC1=O MDXKEHHAIMNCSW-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- 125000004864 4-thiomethylphenyl group Chemical group 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- YYVYAPXYZVYDHN-UHFFFAOYSA-N 9,10-phenanthroquinone Chemical compound C1=CC=C2C(=O)C(=O)C3=CC=CC=C3C2=C1 YYVYAPXYZVYDHN-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- MVHNVBOVLGKAQS-UHFFFAOYSA-N C(C=C)(=O)OCCCCO.C(C=C)(=O)OCC(C)(COC(C=C)=O)N=C=O Chemical compound C(C=C)(=O)OCCCCO.C(C=C)(=O)OCC(C)(COC(C=C)=O)N=C=O MVHNVBOVLGKAQS-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical group [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical class ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- BWPYBAJTDILQPY-UHFFFAOYSA-N Methoxyphenone Chemical compound C1=C(C)C(OC)=CC=C1C(=O)C1=CC=CC(C)=C1 BWPYBAJTDILQPY-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical group [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000012327 Ruthenium complex Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- URLYGBGJPQYXBN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methyl prop-2-enoate Chemical compound OCC1CCC(COC(=O)C=C)CC1 URLYGBGJPQYXBN-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 125000005228 aryl sulfonate group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-M benzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-M 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 230000005250 beta ray Effects 0.000 description 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
- QDVNNDYBCWZVTI-UHFFFAOYSA-N bis[4-(ethylamino)phenyl]methanone Chemical compound C1=CC(NCC)=CC=C1C(=O)C1=CC=C(NCC)C=C1 QDVNNDYBCWZVTI-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- KQBTUOVABZLXGP-UHFFFAOYSA-N butane-1,4-diol;ethane-1,2-diol Chemical compound OCCO.OCCCCO KQBTUOVABZLXGP-UHFFFAOYSA-N 0.000 description 1
- DDPAAMHROJBRGE-UHFFFAOYSA-N butane-1,4-diol;propane-1,2-diol Chemical compound CC(O)CO.OCCCCO DDPAAMHROJBRGE-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000000460 chlorine Chemical group 0.000 description 1
- 229910052801 chlorine Chemical group 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- WIWBLJMBLGWSIN-UHFFFAOYSA-L dichlorotris(triphenylphosphine)ruthenium(ii) Chemical compound [Cl-].[Cl-].[Ru+2].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 WIWBLJMBLGWSIN-UHFFFAOYSA-L 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- KGGOIDKBHYYNIC-UHFFFAOYSA-N ditert-butyl 4-[3,4-bis(tert-butylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=C1 KGGOIDKBHYYNIC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- CTRFEEQNDJFNNL-UHFFFAOYSA-N hexanoic acid;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.CCCCCC(O)=O CTRFEEQNDJFNNL-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000004698 iron complex Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ACLZYRNSDLQOIA-UHFFFAOYSA-N o-tolylthiourea Chemical compound CC1=CC=CC=C1NC(N)=S ACLZYRNSDLQOIA-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000010702 perfluoropolyether Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003003 phosphines Chemical group 0.000 description 1
- 125000005496 phosphonium group Chemical group 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- UFUASNAHBMBJIX-UHFFFAOYSA-N propan-1-one Chemical compound CC[C]=O UFUASNAHBMBJIX-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical class CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- YXDPTMVPGTZYAZ-UHFFFAOYSA-N ruthenium tributylphosphane Chemical compound [Ru].CCCCP(CCCC)CCCC YXDPTMVPGTZYAZ-UHFFFAOYSA-N 0.000 description 1
- VIHDTGHDWPVSMM-UHFFFAOYSA-N ruthenium;triphenylphosphane Chemical compound [Ru].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 VIHDTGHDWPVSMM-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- ZKDDJTYSFCWVGS-UHFFFAOYSA-M sodium;diethoxy-sulfanylidene-sulfido-$l^{5}-phosphane Chemical compound [Na+].CCOP([S-])(=S)OCC ZKDDJTYSFCWVGS-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 150000005846 sugar alcohols Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 229910052717 sulfur Chemical group 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- IBWGNZVCJVLSHB-UHFFFAOYSA-M tetrabutylphosphanium;chloride Chemical compound [Cl-].CCCC[P+](CCCC)(CCCC)CCCC IBWGNZVCJVLSHB-UHFFFAOYSA-M 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/12—Polymers provided for in subclasses C08C or C08F
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- General Chemical & Material Sciences (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
본 발명은, 활성 에너지선 경화성 조성물로 첨가함으로써, 비누화 처리 후여도 도막 표면이 뛰어난 내찰상성을 부여할 수 있는 불소 원자 함유 중합성 수지 및 이것을 사용한 조성물을 제공하는 것을 목적으로 하여, 중합성 불포화 단량체의 중합으로 형성되는 주쇄를 갖고, 당해 주쇄는, 측쇄로서 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기(x)와 중합성 불포화기(y)를 갖는 중합성 수지이며, 당해 주쇄는, 또한, 그 편말단에 분자량 2,000 이상의 실리콘쇄를 포함하는 구조를 갖는 중합성 수지, 이것을 사용한 활성 에너지선 경화성 조성물을 제공한다.The present invention aims to provide a polymerizable resin containing a fluorine atom and a composition using the polymerizable unsaturated monomer capable of providing excellent scratch resistance even after saponification by adding it as an active energy ray-curable composition. It has a main chain formed by polymerization, and the main chain is a polymerizable resin having a fluorinated alkyl group (x) and a polymerizable unsaturated group (y) having 1 to 6 carbon atoms bonded to the fluorine atom as a side chain. Further, a polymerizable resin having a structure containing a silicone chain having a molecular weight of 2,000 or more at its one end, and an active energy ray-curable composition using the same are provided.
Description
본 발명은, 활성 에너지선 경화성 조성물에 첨가함으로써, 당해 조성물의 경화 도막에 뛰어난 내찰상성을 부여할 수 있는 불소 원자 함유 중합성 수지에 관한 것이다. 또한, 당해 불소 원자 함유 중합성 수지를 사용한 활성 에너지선 경화성 조성물, 및 당해 조성물의 경화 도막을 갖는 물품에 관한 것이다.The present invention relates to a fluorine atom-containing polymerizable resin capable of imparting excellent scratch resistance to a cured coating film of the composition by adding it to the active energy ray-curable composition. Further, the present invention relates to an active energy ray-curable composition using the fluorine atom-containing polymerizable resin, and an article having a cured coating film of the composition.
액정 디스플레이의 화면 최표면이 되는 편광판의 표층에는, AG, AG/LR, 클리어/LR과 같은 방현성이나 반사 방지성을 갖는 도공이 이루어지지만, 최표층이므로 내찰상성이 필요해지고 있다. 내찰상성을 향상시키는 방법으로서는, 다관능 (메타)아크릴레이트 등의 다관능성 단량체를 사용하여 얻어지는 가교 피막을 기재 표면에 형성하는 방법(하드 코팅제)이 알려져 있으며, 내찰상성이 양호한 도공재로서, 실리콘계나 불소계의 레벨링제를 첨가하는 방법이나, 이산화규소, 산화알루미늄 등의 무기 화합물 입자, 탄소, 또는 폴리우레탄 수지, 폴리스티렌 수지, 아크릴 수지 등의 합성 수지 입자를 첨가하는 방법 등이 제안되어 있다.On the surface layer of the polarizing plate serving as the outermost surface of the screen of the liquid crystal display, coatings having anti-glare properties and anti-reflection properties such as AG, AG / LR, and clear / LR are made, but scratch resistance is required because it is the outermost layer. As a method of improving the scratch resistance, a method (hard coating agent) of forming a crosslinked film obtained by using a multifunctional monomer such as a polyfunctional (meth) acrylate on the surface of a substrate is known, and a silicone-based coating material having good scratch resistance A method of adding a fluorine-based leveling agent, a method of adding inorganic compound particles such as silicon dioxide and aluminum oxide, and synthetic resin particles such as carbon or polyurethane resin, polystyrene resin, and acrylic resin have been proposed.
편광판은 편광 필름의 양면 혹은 편면에, 광학적으로 투명하며, 또한 기계적 강도를 갖는 보호막을 첨합시킴으로써 얻어진다. 상기 보호막으로서는, 통상 트리아세틸셀룰로오스(TAC) 필름이 사용된다.The polarizing plate is obtained by adding an optically transparent protective film having mechanical strength to both sides or one side of the polarizing film. As the protective film, a triacetyl cellulose (TAC) film is usually used.
트리아세틸셀룰로오스(TAC) 필름을 편광 필름에 접착하기 위해서는, TAC 필름의 표면을 가성(苛性) 알칼리 등에 의해 비누화 처리하여, -OCOCH3기의 일부 또는 대부분을 친수기인 -OH로 가수 분해할 필요가 있다. TAC 필름에 베이스층과 방현성이나 반사 방지성을 갖는 최표층을 형성하는 것과, 비누화 처리를 행하기 위해서는, 1. TAC 필름을 비누화 처리한 후 필름의 편면에 상기의 도막층을 형성하는 방법, 2. TAC 필름의 편면에 상기의 도막층을 형성한 후 비누화 처리하는 등의 방법이 있지만, 통상은 편광판의 생산 효율의 관점에서, 2.의 방법이 행해지고 있다.To adhere the triacetylcellulose (TAC) film to the polarizing film, the surface of the TAC film needs to be saponified with caustic alkali or the like to hydrolyze some or most of the -OCOCH 3 groups with a hydrophilic group -OH. have. To form a base layer and an outermost layer having anti-glare property or anti-reflection property on the TAC film and to perform saponification, 1. After saponifying the TAC film, a method of forming the above coating layer on one side of the film, 2. There are methods such as saponification after forming the above-mentioned coating layer on one side of the TAC film, but the method of 2. is usually performed from the viewpoint of production efficiency of the polarizing plate.
상기 2.의 방법에 있어서, 비누화 처리할 때에는 가성 알칼리 등의 비누화제로부터 도막층을 보호하기 위해서, 도막층을 보호 필름으로 보호하는 방법이 알려져 있다. 그러나, 최근, 생산 효율의 향상이나 비용 삭감을 위해, 보호 필름으로 도막층을 보호하지 않더라도 상기 비누화제에 폭로되어도 도막의 성능이 저하하지 않는 도막층이 요구되고 있다. 그러나, 일반적으로, 비누화 처리에 의해 경화 도막 표면이 대폭 열화해버리므로, 충분한 내찰상성이 얻어지지 않는 문제가 있다.In the method of 2. above, in order to protect the coating layer from a saponifying agent such as caustic alkali when saponifying, a method of protecting the coating layer with a protective film is known. However, in recent years, in order to improve production efficiency or reduce cost, a coating layer that does not deteriorate the performance of the coating even if exposed to the saponifier is required even if the coating layer is not protected with a protective film. However, in general, since the surface of the cured coating film is significantly deteriorated by saponification treatment, there is a problem that sufficient scratch resistance is not obtained.
내찰상성이 뛰어난 보호층을 얻는 방법으로서, 예를 들면, 분자 내에 라디칼 중합성 불포화기를 갖는 실리콘 화합물을 포함하는 활성 에너지선 경화성 조성물을 사용하는 방법이 알려져 있다(특허문헌 1 참조). 그러나, 이 실리콘 화합물을 첨가한 활성 에너지선 경화성 조성물의 경화 도막은, 액정 디스플레이의 편광판에 사용되는 TAC 필름과 같이, 비누화 처리(강알칼리 처리)되는 용도에 있어서는, 비누화 처리 후에 경화 도막 표면의 활성이 대폭 저하하여, 충분한 내찰상성이 얻어지지 않는 문제가 있었다.As a method for obtaining a protective layer having excellent scratch resistance, for example, a method using an active energy ray-curable composition containing a silicone compound having a radically polymerizable unsaturated group in a molecule is known (see Patent Document 1). However, the cured coating film of the active energy ray-curable composition to which this silicone compound is added is, for use in saponification (strong alkali treatment), such as a TAC film used for a polarizing plate of a liquid crystal display, the activity of the cured coating surface after saponification treatment There was a problem that it was significantly reduced and sufficient scratch resistance was not obtained.
그래서, 비누화 처리(강알칼리 처리) 후에도 흠집을 방지할 수 있는 뛰어난 내찰상성을 경화 도막 표면에 부여할 수 있는 재료가 요구되고 있었다.Therefore, there has been a demand for a material capable of imparting excellent scratch resistance to the surface of the cured coating film, which can prevent scratches even after saponification treatment (strong alkali treatment).
본 발명이 해결하고자 하는 과제는, 활성 에너지선 경화성 조성물에 첨가함으로써, 비누화 처리 후여도 도막 표면이 뛰어난 내찰상성을 부여할 수 있는 불소 원자 함유 중합성 수지를 제공하는 것이다. 또한, 당해 중합성 수지를 사용한 활성 에너지선 경화성 조성물 및 당해 조성물의 경화 도막을 갖는 물품을 제공하는 것이다.The problem to be solved by the present invention is to provide a polymerizable resin containing a fluorine atom that can provide excellent scratch resistance even after saponification by adding it to an active energy ray-curable composition. In addition, it is to provide an article having an active energy ray-curable composition using the polymerizable resin and a cured coating film of the composition.
본 발명자들은, 상기 과제를 해결하도록 예의 연구를 거듭한 결과, 불소화 알킬기와 중합성 불포화기를 갖는 불소계 중합성 수지이며, 또한, 당해 수지의 편말단에, 실리콘쇄를 갖는 것이, 계면 활성제로서 사용 가능한 것, 이 수지를 함유하는 활성 에너지선 경화성 조성물은, 비누화 처리 후여도 그 경화 도막 표면에 뛰어난 내찰상성을 부여할 수 있는 것 등을 알아내어, 본 발명을 완성하기에 이르렀다.As a result of repeated studies to solve the above problems, the present inventors are fluorinated polymerizable resins having a fluorinated alkyl group and a polymerizable unsaturated group, and those having a silicone chain at one end of the resin can be used as a surfactant. The active energy ray-curable composition containing this resin has been found to be capable of imparting excellent scratch resistance to the surface of the cured coating film even after saponification treatment, and the present invention has been completed.
즉, 본 발명은, 중합성 불포화 단량체의 중합으로 형성되는 주쇄를 갖고, 당해 주쇄는, 측쇄로서 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기(x)와 중합성 불포화기(y)를 갖는 중합성 수지이며, 당해 주쇄는, 또한, 그 편말단에 분자량 2,000 이상의 실리콘쇄를 포함하는 구조를 갖는 것을 특징으로 하는 중합성 수지를 제공하는 것이다.That is, the present invention has a main chain formed by polymerization of a polymerizable unsaturated monomer, and the main chain includes a fluorinated alkyl group (x) and a polymerizable unsaturated group (y) having 1 to 6 carbon atoms bonded by fluorine atoms as side chains. It is a polymerizable resin to have, and the main chain further provides a polymerizable resin characterized by having a structure containing a silicone chain having a molecular weight of 2,000 or more at its one end.
또한, 본 발명은, 상기 중합성 수지와, 당해 중합성 수지 이외의 활성 에너지선 경화성 수지(E) 또는 활성 에너지선 경화성 단량체(F)를 함유하는 것을 특징으로 하는 활성 에너지선 경화성 조성물을 제공하는 것이다.In addition, the present invention provides an active energy ray-curable composition comprising the polymerizable resin and an active energy ray-curable resin (E) or an active energy ray-curable monomer (F) other than the polymerizable resin. will be.
또한, 본 발명은, 상기 활성 에너지선 경화성 조성물의 경화 도막을 갖는 것을 특징으로 하는 물품을 제공하는 것이다.In addition, the present invention provides an article characterized by having a cured coating film of the active energy ray-curable composition.
본 발명의 중합성 수지는, 활성 에너지선 경화성 조성물에 첨가함으로써, 그 경화 도막 표면에 활성을 부여하여 뛰어난 내찰상성이 얻어진다. 또한, 이 내찰상성은, 비누화 처리(강알칼리 처리)된 경화 도막에서도 발휘할 수 있으므로, 액정 디스플레이의 편광판에 사용되는 TAC 필름의 하드 코팅재의 재료로서도 유용하다.The polymerizable resin of the present invention is added to an active energy ray-curable composition to impart activity to the surface of the cured coating film, thereby obtaining excellent scratch resistance. In addition, since this scratch resistance can also be exhibited in a cured coating film subjected to saponification (strong alkali treatment), it is also useful as a material for a hard coating material of a TAC film used in a polarizing plate of a liquid crystal display.
도 1은, 실시예1에서 얻어진 중합성 수지(1)의 IR 스펙트럼의 차트도.
도 2는, 실시예1에서 얻어진 중합성 수지(1)의 13C-NMR 스펙트럼의 차트도.
도 3은, 실시예1에서 얻어진 중합성 수지(1)의 GPC의 차트도.
도 4는, 실시예2에서 얻어진 중합성 수지(2)의 IR 스펙트럼의 차트도.
도 5는, 실시예2에서 얻어진 중합성 수지(2)의 1H-NMR 스펙트럼의 차트도(전체도).
도 6은, 실시예2에서 얻어진 중합성 수지(2)의 1H-NMR 스펙트럼의 차트도(25배의 확대도).
도 7은, 실시예2에서 얻어진 중합성 수지(2)의 13C-NMR 스펙트럼의 차트도(전체도).
도 8은, 실시예2에서 얻어진 중합성 수지(2)의 13C-NMR 스펙트럼의 차트도(25배의 확대도).
도 9는, 실시예2에서 얻어진 중합성 수지(2)의 19F-NMR 스펙트럼의 차트도(전체도).
도 10은, 실시예2에서 얻어진 중합성 수지(2)의 GPC의 차트도.1 is a chart of the IR spectrum of the polymerizable resin (1) obtained in Example 1. FIG.
Fig. 2 is a chart of the 13 C-NMR spectrum of the polymerizable resin (1) obtained in Example 1.
3 is a chart of GPC of the polymerizable resin (1) obtained in Example 1.
4 is a chart of the IR spectrum of the polymerizable resin (2) obtained in Example 2.
Fig. 5 is a chart of the 1 H-NMR spectrum of the polymerizable resin (2) obtained in Example 2 (overall view).
Fig. 6 is a chart of the 1 H-NMR spectrum of the polymerizable resin (2) obtained in Example 2 (25x magnification).
Fig. 7 is a chart of the 13 C-NMR spectrum of the polymerizable resin (2) obtained in Example 2 (overall view).
Fig. 8 is a chart of the 13 C-NMR spectrum of the polymerizable resin (2) obtained in Example 2 (25x magnification).
9 is a chart of the 19 F-NMR spectrum of the polymerizable resin (2) obtained in Example 2 (overall view).
10 is a chart of GPC of the polymerizable resin (2) obtained in Example 2.
본 발명의 중합성 수지는, 중합성 불포화 단량체의 중합으로 형성되는 주쇄를 갖고, 당해 주쇄는, 측쇄로서 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기(x)와 중합성 불포화기(y)를 갖는 중합성 수지이며, 당해 주쇄는, 또한, 그 편말단에 분자량 2,000 이상의 실리콘쇄를 포함하는 구조를 갖는다. 이 편말단에는, 실리콘쇄를 단수 가지고 있어도, 복수 가지고 있어도 되지만, 본 발명에 있어서는, 편말단에는 실리콘쇄를 단수(1개) 갖는 것이 내마모성과 불소 원자의 표면 편석성(偏析性)의 점에서 바람직하다.The polymerizable resin of the present invention has a main chain formed by polymerization of a polymerizable unsaturated monomer, and the main chain is a fluorinated alkyl group (x) having 1 to 6 carbon atoms bonded to a fluorine atom as a side chain and a polymerizable unsaturated group (y ), And the main chain has a structure containing a silicone chain having a molecular weight of 2,000 or more at its one end. Although it is possible to have a single number of silicon chains or a plurality of silicon chains at this one end, in the present invention, having a single number (1) of silicon chains at one end is in terms of wear resistance and surface segregation of fluorine atoms. desirable.
상기 불소화 알킬기(x)로서는, 탄소 원자수가 4∼6인 것이 표면 편석성과 발수 발유성과 환경 부하 저감의 밸런스가 양호하므로 바람직하고, 탄소 원자수가 6인 것이 보다 바람직하다.As the fluorinated alkyl group (x), a carbon atom number of 4 to 6 is preferable because of a good balance of surface segregation property, water repellency, and environmental load reduction, and more preferably 6 carbon atoms.
또한, 본 발명의 중합성 수지 중의 중합성 불포화기(y)의 당량은, 내마모성이 뛰어난 경화 도막이 얻어지므로 200∼3,500g/eq.의 범위가 바람직하고, 250∼2,000g/eq.의 범위가 보다 바람직하고, 300∼1,500g/eq.의 범위가 더 바람직하고, 400∼1,000g/eq.의 범위가 특히 바람직하다.Moreover, the equivalent of the polymerizable unsaturated group (y) in the polymerizable resin of the present invention is preferably in the range of 200 to 3,500 g / eq., And in the range of 250 to 2,000 g / eq. More preferably, the range of 300 to 1,500 g / eq. Is more preferable, and the range of 400 to 1,000 g / eq. Is particularly preferable.
상기 실리콘쇄의 분자량은 2,000 이상인 것이 필요한, 이러한 분자량의 실리콘쇄를 가짐에 의해, 실리콘쇄가 가지는 활성을 호적하게 발현할 수 있고, 그 결과, 도막의 표면의 마찰을 저감함으로써 뛰어난 내마찰성을 부여할 수 있다. 실리콘쇄의 분자량으로서는, 분자량 2,000∼20,000이 바람직하고, 5,000∼10,000이 보다 바람직하다.The molecular weight of the silicone chain is 2,000 or more, and by having a silicone chain having such molecular weight, the activity of the silicone chain can be favorably expressed, and as a result, excellent friction resistance is provided by reducing friction on the surface of the coating film. can do. The molecular weight of the silicone chain is preferably 2,000 to 20,000 molecular weight, more preferably 5,000 to 10,000.
본 발명에 있어서, 원료를 중합시키는 타이밍을 변화시킴에 의해, 각종의 형태의 중합성 수지가 얻어진다. 예를 들면, 후술하는 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기를 갖는 중합성 불포화 단량체(B)와 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)를 동시에 반응계에 더해서 반응시킨 경우에는, 소위 랜덤 공중합체상의 중합성 수지가 된다. 또한, 중합성 불포화 단량체(B)와 중합성 불포화 단량체(C)를 별개로 반응시킨 경우에는, 소위 블록 공중합체상의 중합성 수지가 된다. 특히, 본 발명의 중합성 수지 중에서도, 활성 에너지선 경화성 조성물에 첨가함으로써, 막두께가 0.1㎛ 정도로 매우 얇은 도막에도 뛰어난 내찰상성을 부여할 수 있는 중합성 수지가 되므로 블록 공중합체가 바람직하다.In the present invention, various types of polymerizable resins are obtained by changing the timing of polymerizing the raw materials. For example, a polymerizable unsaturated monomer (B) having a fluorinated alkyl group having 1 to 6 carbon atoms bonded to a fluorine atom described later and a polymerizable unsaturated monomer (C) having a reactive functional group (c1) are simultaneously added to the reaction system and reacted. In the case, it becomes a so-called random copolymer phase polymerizable resin. Moreover, when a polymerizable unsaturated monomer (B) and a polymerizable unsaturated monomer (C) are made to react separately, it becomes a polymerizable resin of a so-called block copolymer phase. Particularly, among the polymerizable resins of the present invention, a block copolymer is preferred because it is a polymerizable resin capable of imparting excellent scratch resistance even to a very thin film having a film thickness of about 0.1 µm by adding it to an active energy ray-curable composition.
본 발명의 중합성 수지 중에서도, 랜덤 중합체상의 중합성 수지는, 예를 들면, 분자량 2,000 이상의 실리콘쇄의 편말단에 라디칼 생성능을 갖는 관능기를 갖는 화합물(A)과 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기를 갖는 중합성 불포화 단량체(B)와 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)와 상기 관능기(c1)에 대하여 반응성을 갖는 관능기(d1) 및 중합성 불포화기(d2)를 갖는 화합물(D)을 사용하여 얻을 수 있다. 구체적으로는, 상기 화합물(A)로부터 라디칼을 생성시킴에 의해 상기 중합성 불포화 단량체(B)와 상기 중합성 불포화 단량체(C)를 공중합시켜서 얻어지는 공중합체(P)에, 상기 화합물(D)을 반응시킴에 의해 얻어진다.Among the polymerizable resins of the present invention, the random polymer-like polymerizable resin has, for example, a number of carbon atoms in which a compound (A) having a functional group having a radical generating ability and a fluorine atom are bonded to one end of a silicone chain having a molecular weight of 2,000 or more. A polymerizable unsaturated monomer (B) having a 6-membered fluorinated alkyl group and a polymerizable unsaturated monomer (C) having a reactive functional group (c1) and a functional group (d1) and a polymerizable unsaturated group (d2) having reactivity with the functional group (c1) ). Specifically, the compound (D) is added to the copolymer (P) obtained by copolymerizing the polymerizable unsaturated monomer (B) and the polymerizable unsaturated monomer (C) by generating radicals from the compound (A). Obtained by reaction.
또한, 본 발명의 중합성 수지 중에서도, 블록 중합체상의 중합성 수지는, 예를 들면, 중합성 불포화 단량체의 중합으로 형성되는 주쇄와 당해 주쇄의 측쇄로서 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기(x)를 갖는 제1 중합체 세그먼트(α)와, 중합성 불포화 단량체의 중합으로 형성되는 주쇄와 당해 주쇄의 측쇄로서 중합성 불포화기(y)를 갖는 제2 중합체 세그먼트(β)를 갖고, 또한, 편말단에 분자량 2,000 이상의 실리콘쇄를 포함하는 구조를 갖는 중합성 수지를 예시할 수 있다.Moreover, among the polymerizable resins of the present invention, the block polymer-like polymerizable resin is, for example, fluorinated with 1 to 6 carbon atoms having a main chain formed by polymerization of a polymerizable unsaturated monomer and a fluorine atom as a side chain of the main chain. Has a first polymer segment (α) having an alkyl group (x), a main chain formed by polymerization of a polymerizable unsaturated monomer, and a second polymer segment (β) having a polymerizable unsaturated group (y) as a side chain of the main chain, Further, a polymerizable resin having a structure containing a silicone chain having a molecular weight of 2,000 or more at one end can be exemplified.
이러한 블록 중합체상의 중합성 수지는, 예를 들면, 이하의 제조 방법에 따라 바람직하게 얻을 수 있다.Such a block polymer phase polymerizable resin can be preferably obtained, for example, according to the following production method.
방법1 : 분자량 2,000 이상의 실리콘쇄의 편말단에, 라디칼 생성능을 갖는 관능기를 갖는 화합물(A)과, 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기(x)를 갖는 중합성 불포화 단량체(B)를 반응계 내에 투입하고, 상기 화합물(A)로부터 라디칼을 생성시킴에 의해, 상기 중합성 불포화 단량체(B) 유래의 구조를 포함하는 중합체 세그먼트(p)를 얻는 공정(1)과,Method 1: Polymerizable unsaturated monomer having a compound (A) having a functional group having a radical generating ability and a fluorinated alkyl group (x) having 1 to 6 carbon atoms bonded to a fluorine atom at one end of a silicone chain having a molecular weight of 2,000 or more. Step (1) to obtain a polymer segment (p) containing a structure derived from the polymerizable unsaturated monomer (B) by introducing a) into the reaction system and generating radicals from the compound (A),
당해 중합체 세그먼트(p)를 포함하는 반응계 내에, 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)를 투입하고, 당해 중합체 세그먼트(p)로부터 라디칼을 생성시킴에 의해, 중합체 세그먼트(p) 및 중합성 불포화 단량체(C) 유래의 구조를 포함하는 중합체 세그먼트(q)를 포함하는 중합체(Q1)를 얻는 공정(2)과,By introducing a polymerizable unsaturated monomer (C) having a reactive functional group (c1) into a reaction system containing the polymer segment (p) and generating radicals from the polymer segment (p), the polymer segment (p) and Step (2) of obtaining a polymer (Q1) comprising a polymer segment (q) containing a structure derived from a polymerizable unsaturated monomer (C),
중합체(Q1)를 포함하는 반응계 내에, 중합체(Q1)가 갖는 반응성 관능기(c1)에 대하여 반응성을 갖는 관능기(d1) 및 중합성 불포화기(d2)를 갖는 화합물(D)을 투입하고, 반응성 관능기(c1)와 반응성을 갖는 관능기(d1)를 반응시키는 공정(3)을 포함하는 제조 방법.In the reaction system containing the polymer (Q1), a compound (D) having a functional group (d1) and a polymerizable unsaturated group (d2) reactive with respect to the reactive functional group (c1) possessed by the polymer (Q1) are introduced, and the reactive functional group A manufacturing method comprising the step (3) of reacting a functional group (d1) having reactivity with (c1).
방법2 : 분자량 2,000 이상의 실리콘쇄의 편말단에, 라디칼 생성능을 갖는 관능기를 갖는 화합물(A)과, 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)를 반응계 내에 투입하고, 상기 화합물(A)로부터 라디칼을 생성시킴에 의해, 중합성 불포화 단량체(C) 유래의 구조를 포함하는 중합체 세그먼트(q)를 얻는 공정(1-1)과,Method 2: A compound (A) having a functional group having a radical generating ability and a polymerizable unsaturated monomer (C1) having a reactive functional group (c1) are introduced into the reaction system at one end of a silicone chain having a molecular weight of 2,000 or more, and the compound (A Step (1-1) of obtaining a polymer segment (q) containing a structure derived from a polymerizable unsaturated monomer (C) by generating radicals from),
당해 중합체 세그먼트(q)를 포함하는 반응계 내에, 중합성 불포화 단량체(B)를 투입하고, 당해 중합체 세그먼트(q)로부터 라디칼을 생성시킴에 의해, 중합체 세그먼트(q) 및 중합성 불포화 단량체(B) 유래의 구조를 포함하는 중합체 세그먼트를 포함하는 중합체(Q2)를 얻는 공정(2-1)과,The polymer segment (q) and the polymerizable unsaturated monomer (B) are introduced into the reaction system containing the polymer segment (q) by introducing a polymerizable unsaturated monomer (B) and generating radicals from the polymer segment (q). Step (2-1) of obtaining a polymer (Q2) containing a polymer segment containing a derived structure,
중합체(Q2)를 포함하는 반응계 내에, 중합체(Q2)가 갖는 반응성 관능기(c1)에 대하여 반응성을 갖는 관능기(d1) 및 중합성 불포화기(d2)를 갖는 화합물(D)을 투입하고, 반응성 관능기(c1)와 반응성을 갖는 관능기(d1)를 반응시키는 공정(3-1)을 포함하는 제조 방법.In the reaction system containing the polymer (Q2), a compound (D) having a functional group (d1) and a polymerizable unsaturated group (d2) reactive with respect to the reactive functional group (c1) possessed by the polymer (Q2) are introduced, and the reactive functional group A manufacturing method comprising the step (3-1) of reacting a functional group (d1) having reactivity with (c1).
상기 화합물(A)이 갖는 라디칼 생성능을 갖는 관능기로서는, 예를 들면, 할로겐 원자를 갖는 유기기, 알킬텔루륨기를 갖는 유기기, 디티오에스테르기를 갖는 유기기, 퍼옥사이드기를 갖는 유기기, 아조기를 갖는 유기기 등을 들 수 있다. 여기에서, 리빙 라디칼 중합에 의해, 화합물(A)에, 상기 중합성 불포화 단량체(B) 및 중합성 불포화 단량체(C)를 공중합시키는 경우에는, 상기 라디칼 생성능을 갖는 관능기로서 할로겐 원자를 갖는 유기기, 알킬텔루륨기를 갖는 유기기, 디티오에스테르기를 갖는 유기기가 사용할 수 있고, 특히 합성의 용이함, 중합 제어의 용이함, 적용할 수 있는 중합성 불포화 단량체의 다양성으로부터 할로겐 원자를 갖는 유기기를 사용하는 것이 바람직하다.Examples of the functional group having a radical generating ability of the compound (A) include, for example, an organic group having a halogen atom, an organic group having an alkyl tellurium group, an organic group having a dithioester group, an organic group having a peroxide group, and an azo group The organic group etc. which have are mentioned. Here, in the case of copolymerizing the polymerizable unsaturated monomer (B) and the polymerizable unsaturated monomer (C) with the compound (A) by living radical polymerization, an organic group having a halogen atom as a functional group having the radical generating ability , An organic group having an alkyl tellurium group, an organic group having a dithioester group can be used, and in particular, the use of an organic group having a halogen atom from ease of synthesis, ease of polymerization control, and diversity of polymerizable unsaturated monomers applicable desirable.
상기 할로겐 원자를 갖는 유기기로서는, 예를 들면, 2-브로모-2-메틸프로피오닐옥시기, 2-브로모-프로피오닐옥시기, 파라클로로설포닐벤조일옥시기 등을 들 수 있다.Examples of the organic group having a halogen atom include 2-bromo-2-methylpropionyloxy group, 2-bromo-propionyloxy group, and parachlorosulfonylbenzoyloxy group.
상기 할로겐 원자를 갖는 유기기를 주쇄 중에 분자량 2,000 이상의 실리콘쇄를 포함하는 화합물의 편말단에 도입하기 위해서는, 예를 들면, 분자량 2,000 이상의 실리콘쇄의 편말단에 반응에 의해 결합을 형성할 수 있는 관능기를 갖는 화합물(a1)과, 이 관능기와 반응하여 결합을 형성할 수 있는 관능기와 할로겐 원자를 갖는 유기기를 갖는 화합물(a2)을 반응시키는 방법을 들 수 있다. 구체적으로는, 상기 화합물(a1)이 갖는 편말단의 관능기로서는, 예를 들면, 수산기, 이소시아네이트기, 에폭시기, 카르복시기, 카르복시산할라이드기, 카르복시산 무수물기 등을 들 수 있다. 이들의 관능기를 편말단에 갖는 상기 화합물(a1)의 구체예로서는, 하기의 식(a1-1)으로 표시되는 화합물을 바람직하게 예시할 수 있다.In order to introduce the organic group having the halogen atom into one end of a compound containing a silicone chain having a molecular weight of 2,000 or more in the main chain, for example, a functional group capable of forming a bond by reaction to one end of a silicone chain having a molecular weight of 2,000 or more And a method of reacting a compound (a1) having a functional group capable of forming a bond by reacting with the functional group (a1) and a compound (a2) having an organic group having a halogen atom. Specifically, examples of the functional group at one end of the compound (a1) include a hydroxyl group, an isocyanate group, an epoxy group, a carboxy group, a carboxylic acid halide group, and a carboxylic acid anhydride group. As a specific example of the said compound (a1) which has these functional groups at one terminal, the compound represented by following formula (a1-1) can be illustrated preferably.
(식 중 X는 반응에 의해 결합을 형성할 수 있는 관능기인, R1∼R5는 각각 독립으로 탄소 원자수 1∼18의 알킬기 또는 페닐기이다. R6은 2가의 유기기 또는 단결합이다. n은 20∼200이다)(In the formula, X is a functional group capable of forming a bond by reaction, R 1 to R 5 are each independently an alkyl group having 1 to 18 carbon atoms or a phenyl group. R 6 is a divalent organic group or a single bond. n is 20 to 200)
여기에서, 상기 R6으로서는, 예를 들면, 메틸렌기, 프로필렌기, 이소프로필리덴기 등의 탄소 원자수 1 이상의 알킬렌기, 2개 이상의 알킬렌기가 에테르 결합으로 연결된 알킬렌에테르기를 들 수 있다.Here, as R 6 , for example, an alkylene group having 1 or more carbon atoms, such as a methylene group, a propylene group, or an isopropylidene group, and an alkylene ether group in which two or more alkylene groups are connected by ether bonding.
한편, 상기 화합물(a2)이 갖고, 상기 화합물(a1)이 편말단에 갖는 관능기와 반응하여 결합을 형성할 수 있는 관능기로서는, 하기의 것을 들 수 있다.In addition, the following are mentioned as a functional group which the said compound (a2) has and the said compound (a1) can react and form a bond with the functional group which has at one end.
예를 들면, 상기 화합물(a1)이 갖는 관능기가 수산기인 경우에는, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기는, 이소시아네이트기, 카르복시산할라이드기, 카르복시산 무수물기가 바람직하다. 또한, 그 외의 방법으로서, 우선, 상기 화합물(a1)의 수산기에 산무수물을 반응시킴으로써 카르복시기를 생성시키고, 그 카르복시기에 대하여, 에폭시기와 할로겐 원자를 갖는 유기기를 갖는 화합물을 상기 화합물(a2)로서, 추가로 반응시킴에 의해 상기 화합물(a1)의 편말단에 할로겐 원자를 갖는 유기기를 도입하는 것도 가능하다.For example, when the functional group of the compound (a1) is a hydroxyl group, the functional group other than the organic group having the halogen atom of the compound (a2) is preferably an isocyanate group, a carboxylic acid halide group, or a carboxylic acid anhydride group. Further, as another method, first, a carboxyl group is produced by reacting an acid anhydride with the hydroxyl group of the compound (a1), and a compound having an organic group having an epoxy group and a halogen atom with respect to the carboxyl group is the compound (a2), It is also possible to introduce an organic group having a halogen atom at one end of the compound (a1) by further reacting.
상기 화합물(a1)이 갖는 관능기가 이소시아네이트기인 경우에는, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기는, 수산기가 바람직하다. 또한, 상기 화합물(a1)이 갖는 관능기가 에폭시기인 경우에는, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기는, 카르복시기가 바람직하다.When the functional group of the compound (a1) is an isocyanate group, a functional group other than the organic group having a halogen atom of the compound (a2) is preferably a hydroxyl group. In addition, when the functional group of the compound (a1) is an epoxy group, the functional group other than the organic group having a halogen atom of the compound (a2) is preferably a carboxy group.
상기 화합물(a1)이 갖는 관능기가 카르복시기의 경우에는, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기는, 에폭시기가 바람직하다. 또한, 상기 화합물(a1)이 갖는 관능기가 카르복시산 무수물기의 경우에는, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기는, 수산기가 바람직하다.When the functional group of the compound (a1) is a carboxy group, an epoxy group is preferable as the functional group other than the organic group having a halogen atom of the compound (a2). Moreover, when the functional group which the said compound (a1) has is a carboxylic acid anhydride group, the functional group other than the organic group which has the halogen atom which the said compound (a2) has is a hydroxyl group.
상기 화합물(a1)이 갖는 관능기와, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기와의 조합 중에서도, 상기 화합물(a1)이 갖는 관능기가 수산기이며, 상기 화합물(a2)이 갖는 할로겐 원자를 갖는 유기기 이외의 관능기가 카르복시산할라이드기인 조합이, 반응이 용이한 점에서 바람직하다. 이 조합의 경우의 반응 조건으로서는, 하기의 조건을 들 수 있다.Among the combination of the functional group of the compound (a1) with a functional group other than the organic group having a halogen atom of the compound (a2), the functional group of the compound (a1) is a hydroxyl group, and the compound (a2) has A combination in which a functional group other than an organic group having a halogen atom is a carboxylic acid halide group is preferred from the viewpoint of easy reaction. The following conditions are mentioned as reaction conditions in the case of this combination.
상기 할로겐 원자를 갖는 유기기를 실리콘쇄의 편말단에 도입하는 구체적 방법으로서는, 상기 화합물(a1)의 편말단의 관능기가 수산기이며, 상기 화합물(a2)이 할로겐기를 갖는 카르복시산의 경우에는, 탈수 에스테르화 조건하에서 반응을 행함으로써, 주쇄 중에 분자량 2,000 이상의 실리콘쇄를 포함하는 화합물의 편말단에 중합 개시능을 갖는 관능기를 갖는 화합물(A)을 얻을 수 있다. 또한, 상기 화합물(a1)의 편말단의 관능기가 수산기이며, 상기 화합물(a2)이 할로겐기를 갖는 카르복시산의 할로겐화물의 경우에는, 톨루엔, 테트라히드로퓨란 등의 용제 중, (a1)과 (a2)를 반응시킴에 의해 마찬가지로 중합 개시능을 갖는 관능기를 갖는 화합물(A)을 얻을 수 있다. 또, 이 반응에 있어서는 필요에 따라 염기성 촉매를 사용할 수 있다.As a specific method of introducing the organic group having the halogen atom to one end of the silicon chain, in the case where the functional group at one end of the compound (a1) is a hydroxyl group and the compound (a2) is a carboxylic acid having a halogen group, dehydration esterification By reacting under conditions, a compound (A) having a functional group having a polymerization initiating ability at one end of a compound containing a silicone chain having a molecular weight of 2,000 or more in the main chain can be obtained. In addition, when the functional group at one end of the compound (a1) is a hydroxyl group, and the compound (a2) is a halide of a carboxylic acid having a halogen group, (a1) and (a2) in a solvent such as toluene or tetrahydrofuran. Compound (A) having a functional group having the ability to initiate polymerization can be obtained by reacting the same. Moreover, in this reaction, a basic catalyst can be used as needed.
또한 상기 화합물(a1)의 편말단에 있는 관능기가 이소시아네이트기, 상기 화합물(a2)이 할로겐기와, 당해 이소시아네이트기와 반응할 수 있는 관능기로서 수산기를 갖는 경우, 옥틸산주석과 같은 촉매의 존재하, (a1)과 (a2)를 반응시킴에 의해 중합 개시능을 갖는 관능기를 갖는 화합물을 얻을 수 있다.In addition, when the functional group at one end of the compound (a1) has an isocyanate group, and the compound (a2) has a halogen group and a hydroxyl group as a functional group capable of reacting with the isocyanate group, in the presence of a catalyst such as tin octylate, ( By reacting a1) and (a2), a compound having a functional group having a polymerization initiation ability can be obtained.
또한 상기 화합물(a1)의 편말단의 관능기가 에폭시기, 상기 화합물(a2)이 할로겐기와, 당해 에폭시기와 반응할 수 있는 관능기로서 카르복시기를 갖는 경우, 트리페닐포스핀이나 제3급 아민과 같은 염기성 촉매의 존재하, (a1)과 (a2)를 반응시킴에 의해 중합 개시능을 갖는 관능기를 갖는 화합물을 얻을 수 있다.In addition, when the functional group at one end of the compound (a1) has an epoxy group and the compound (a2) has a halogen group and a carboxyl group as a functional group capable of reacting with the epoxy group, a basic catalyst such as triphenylphosphine or tertiary amine By reacting (a1) and (a2) in the presence of, a compound having a functional group having a polymerization initiation ability can be obtained.
본 발명에서 사용하는 주쇄 중에 분자량 2,000 이상의 실리콘쇄를 포함하고, 당해 주쇄의 편말단에 라디칼 생성능을 갖는 관능기를 갖는 화합물(A)의 구체예로서는, 예를 들면, 이하의 식으로 표시되는 화합물 등을 들 수 있다.As a specific example of the compound (A) containing a silicone chain having a molecular weight of 2,000 or more in the main chain used in the present invention and having a functional group having a radical generating ability at one end of the main chain, for example, a compound represented by the following formula Can be lifted.
다음으로, 본 발명에 사용하는 중합성 불포화 단량체(B)에 대해서 설명한다. 중합성 불포화 단량체(B)는 불소 원자가 직접 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기를 갖는다. 본 발명에 있어서, 상기 불소화 알킬기는 불소화 알킬기의 골격 중에 1 이상의 탄소-탄소 이중 결합을 갖는 것도 포함한다. 상기 단량체(B)가 갖는 중합성 불포화기로서는, 라디칼 중합성을 갖는 탄소-탄소 불포화 이중 결합이 바람직하고, (메타)아크릴로일기, 비닐기, 말레이미드기 등을 들 수 있다. 이들 중에서도, 원료의 입수 용이성, 후술하는 활성 에너지선 경화성 조성물 중의 각 배합 성분에 대한 상용성을 제어하는 것의 용이성, 혹은 중합 반응성이 양호하므로, (메타)아크릴로일기가 바람직하다.Next, the polymerizable unsaturated monomer (B) used in the present invention will be described. The polymerizable unsaturated monomer (B) has a fluorinated alkyl group having 1 to 6 carbon atoms directly bonded to the fluorine atom. In the present invention, the fluorinated alkyl group includes one having at least one carbon-carbon double bond in the skeleton of the fluorinated alkyl group. As a polymerizable unsaturated group which the said monomer (B) has, a carbon-carbon unsaturated double bond which has radical polymerization property is preferable, and a (meth) acryloyl group, vinyl group, maleimide group etc. are mentioned. Among these, the (meth) acryloyl group is preferable because it is easy to obtain raw materials, ease of controlling compatibility with each compounding component in the active energy ray-curable composition described later, or polymerization reactivity.
또, 본 발명에 있어서, 「(메타)아크릴레이트」란, 메타크릴레이트와 아크릴레이트의 한쪽 또는 양쪽을 말하고, 「(메타)아크릴로일기」란, 메타크릴로일기와 아크릴로일기의 한쪽 또는 양쪽을 말하고, 「(메타)아크릴산」이란, 메타크릴산과 아크릴산의 한쪽 또는 양쪽을 말한다.In addition, in this invention, "(meth) acrylate" means one or both of methacrylate and acrylate, and "(meth) acryloyl group" means one of a methacryloyl group and an acryloyl group, or Both sides, and "(meth) acrylic acid" means one or both of methacrylic acid and acrylic acid.
상기 불소화 알킬기를 갖는 중합성 불포화 단량체(B)로서는, 예를 들면, 하기 일반식(1)으로 표시되는 것을 들 수 있다.As a polymerizable unsaturated monomer (B) which has the said fluorinated alkyl group, what is represented by the following general formula (1) is mentioned, for example.
(상기 일반식(1) 중, R은 수소 원자 또는 메틸기를 나타내고, L은, 하기 식(L-1)∼(L-10) 중 어느 1개의 기를 나타내고, Rf는 하기 식(Rf-1)∼(Rf-7) 중 어느 1개의 기를 나타낸다)(In the formula (1), R represents a hydrogen atom or a methyl group, L represents any one of the following formulas (L-1) to (L-10), and Rf represents the following formula (Rf-1) -Represents any one group of (Rf-7))
상기 식(L-1), (L-3), (L-4), (L-5), (L-6) 및 (L-7) 중의 n은 1∼8의 정수를 나타낸다. 상기 식(L-8), (L-9) 및 (L-10) 중의 m은 1∼8의 정수를 나타내고, n은 0∼8의 정수를 나타낸다. 상기 식(L-6) 및 (L-7) 중의 Rf"는 하기 식(Rf-1)∼(Rf-7) 중 어느 1개의 기를 나타낸다.N in said formula (L-1), (L-3), (L-4), (L-5), (L-6) and (L-7) represents the integer of 1-8. M in said formula (L-8), (L-9) and (L-10) represents the integer of 1-8, and n represents the integer of 0-8. Rf "in the formulas (L-6) and (L-7) represents any one of the following formulas (Rf-1) to (Rf-7).
상기 식(Rf-1), (Rf-2) 중의 n은 1∼6의 정수이며, (Rf-3) 중의 n은 2∼6의 정수이며, (Rf-4) 중의 n은 4∼6의 정수이다. 상기 식(Rf-5) 중의 m은 1∼5의 정수이며, n은 0∼4의 정수이며, 또한 m 및 n의 합계는 4∼5이다. 상기 식(Rf-6) 중의 m은 0∼4의 정수이며, n은 1∼4의 정수이며, p는 0∼4의 정수이며, 또한 m, n 및 p의 합계는 4∼5이다.In formulas (Rf-1) and (Rf-2), n is an integer from 1 to 6, n in (Rf-3) is an integer from 2 to 6, and n in (Rf-4) is from 4 to 6 It is an integer. M in said formula (Rf-5) is an integer of 1-5, n is an integer of 0-4, and the sum of m and n is 4-5. M in the formula (Rf-6) is an integer from 0 to 4, n is an integer from 1 to 4, p is an integer from 0 to 4, and the sum of m, n and p is 4 to 5.
또한, 상기 단량체(B)의 구체예로서, 하기의 단량체(B-1)∼(B-11) 등을 들 수 있다. 또, 이들의 단량체(B)는, 1종류만으로 사용할 수도 2종 이상 병용할 수도 있다.Moreover, the following monomer (B-1)-(B-11) etc. are mentioned as a specific example of the said monomer (B). Moreover, these monomers (B) can be used only in one type or in combination of two or more types.
(식 중의 n은 0∼5의 정수이며, 바람직하게는 3∼5의 정수이다)(N in formula is an integer of 0-5, Preferably it is an integer of 3-5)
다음으로, 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)에 대해서 설명한다. 상기 단량체(C)가 갖는 관능기(c1)로서는, 예를 들면, 수산기, 이소시아네이트기, 에폭시기, 카르복시기, 카르복시산할라이드기, 카르복시산 무수물기 등을 들 수 있다. 또한, 상기 단량체(C)가 갖는 중합성 불포화기는, 라디칼 중합성을 갖는 탄소-탄소 불포화 이중 결합이 바람직하고, 보다 구체적으로는, 비닐기, (메타)아크릴로일기, 말레이미드기 등을 들 수 있고, 중합이 용이한 점에서 (메타)아크릴로일기가 보다 바람직하다.Next, the polymerizable unsaturated monomer (C) having a reactive functional group (c1) will be described. Examples of the functional group (c1) of the monomer (C) include a hydroxyl group, an isocyanate group, an epoxy group, a carboxy group, a carboxylic acid halide group, and a carboxylic acid anhydride group. In addition, the polymerizable unsaturated group of the monomer (C) is preferably a carbon-carbon unsaturated double bond having radical polymerization property, and more specifically, includes a vinyl group, (meth) acryloyl group, maleimide group, and the like. (Meth) acryloyl group is more preferable from the viewpoint of easy polymerization.
상기 단량체(C)의 구체예로서는, 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 3-히드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 1,4-시클로헥산디메탄올모노(메타)아크릴레이트, N-(2-히드록시에틸)(메타)아크릴아미드, 글리세린모노(메타)아크릴레이트, 폴리에틸렌글리콜모노(메타)아크릴레이트, 폴리프로필렌글리콜모노(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸-2-히드록시에틸프탈레이트, 말단에 수산기를 갖는 락톤 변성 (메타)아크릴레이트 등의 수산기를 갖는 불포화 단량체; 2-(메타)아크릴로일옥시에틸이소시아네이트, 2-(2-(메타)아크릴로일옥시에톡시)에틸이소시아네이트, 1,1-비스((메타)아크릴로일옥시메틸)에틸이소시아네이트 등의 이소시아네이트기 함유 불포화 단량체; 글리시딜메타크릴레이트, 4-히드록시부틸아크릴레이트글리시딜에테르 등의 에폭시기 함유 불포화 단량체; (메타)아크릴산, 2-(메타)아크릴로일옥시에틸숙신산, 2-(메타)아크릴로일옥시에틸프탈산, 말레산, 이타콘산 등의 카르복시기 함유 불포화 단량체; 무수말레산, 무수이타콘산 등의 불포화 이중 결합을 갖는 카르복시산 무수물 등을 들 수 있다. 이들의 단량체(C)는, 1종류만으로 사용할 수도 2종 이상 병용할 수도 있다.As a specific example of the said monomer (C), 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) Acrylate, 4-hydroxybutyl (meth) acrylate, 1,4-cyclohexanedimethanol mono (meth) acrylate, N- (2-hydroxyethyl) (meth) acrylamide, glycerin mono (meth) acrylic Rate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2- (meth) acryloyloxyethyl-2- Unsaturated monomers having hydroxyl groups such as hydroxyethyl phthalate and lactone-modified (meth) acrylates having hydroxyl groups at the terminals; Isocyanates such as 2- (meth) acryloyloxyethyl isocyanate, 2- (2- (meth) acryloyloxyethoxy) ethyl isocyanate, and 1,1-bis ((meth) acryloyloxymethyl) ethyl isocyanate Group-containing unsaturated monomers; Epoxy group-containing unsaturated monomers such as glycidyl methacrylate and 4-hydroxybutyl acrylate glycidyl ether; Carboxyl group-containing unsaturated monomers such as (meth) acrylic acid, 2- (meth) acryloyloxyethylsuccinic acid, 2- (meth) acryloyloxyethylphthalic acid, maleic acid, and itaconic acid; And carboxylic acid anhydrides having unsaturated double bonds such as maleic anhydride and itaconic anhydride. These monomers (C) may be used alone or in combination of two or more.
또한, 본 발명의 중합성 수지의 중간체인 상기 공중합체(P)나 중합체(Q1)나 중합체(Q2)를 제조할 때에, 상기 화합물(A), 단량체(B), 단량체(C) 외에, 이들과 공중합할 수 있는 그 외의 중합성 불포화 단량체를 사용해도 상관없다. 이러한 그 외의 중합성 불포화 단량체로서는, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, n-부틸(메타)아크릴레이트, 이소부틸(메타)아크릴레이트, n-펜틸(메타)아크릴레이트, n-헥실(메타)아크릴레이트, n-헵틸(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 노닐(메타)아크릴레이트, 데실(메타)아크릴레이트, 도데실(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 이소보르닐(메타)아크릴레이트, 폴리옥시알킬렌쇄를 갖는 (메타)아크릴레이트 등의 (메타)아크릴산에스테르류; 스티렌, α-메틸스티렌, p-메틸스티렌, p-메톡시스티렌 등의 방향족 비닐류; 말레이미드, 메틸말레이미드, 에틸말레이미드, 프로필말레이미드, 부틸말레이미드, 헥실말레이미드, 옥틸말레이미드, 도데실말레이미드, 스테아릴말레이미드, 페닐말레이미드, 시클로헥실말레이미드 등의 말레이미드류 등을 들 수 있다.In addition, when preparing the copolymer (P) or polymer (Q1) or polymer (Q2), which is an intermediate of the polymerizable resin of the present invention, in addition to the compound (A), monomer (B), monomer (C), these You may use other polymerizable unsaturated monomers which can be copolymerized with. Examples of such other polymerizable unsaturated monomers are methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and n -Pentyl (meth) acrylate, n-hexyl (meth) acrylate, n-heptyl (meth) acrylate, n-octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylic (Meth) such as acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, and (meth) acrylate with polyoxyalkylene chain Acrylic esters; Aromatic vinyls such as styrene, α-methylstyrene, p-methylstyrene, and p-methoxystyrene; Maleimides such as maleimide, methyl maleimide, ethyl maleimide, propyl maleimide, butyl maleimide, hexyl maleimide, octyl maleimide, dodecyl maleimide, stearyl maleimide, phenyl maleimide, and cyclohexyl maleimide And the like.
여기에서, 상기 화합물(B)과 단량체(C)와의 질량비[(B)/(C)]는, 높은 내찰상성을 갖는 경화물이 얻어지므로, 10/90∼90/10의 범위가 바람직하고, 20/80∼80/20의 범위가 보다 바람직하다.Here, the mass ratio [(B) / (C)] of the compound (B) and the monomer (C) is preferably in the range of 10/90 to 90/10, because a cured product having high scratch resistance is obtained, The range of 20/80 to 80/20 is more preferable.
본 발명에서 사용하는 공중합체(P)나 중합체(Q1)나 중합체(Q2)의 제조 방법으로서는, 상기 화합물(A)을 라디칼 중합 개시제로 하여, 상기 단량체(B)나 상기 단량체(C)를, 리빙 라디칼 중합시키는 방법을 들 수 있다. 일반적으로 리빙 라디칼 중합에 있어서는, 활성 중합 말단이 원자 또는 원자단에 의해 보호된 도먼트종이 가역적으로 라디칼을 발생시켜서 모노머와 반응함에 의해, 매우 분자량 분포가 좁은 중합체를 얻을 수 있다. 이러한 리빙 라디칼 중합의 예로서는, 원자 이동 라디칼 중합(ATRP), 가역적 부가-개열형 라디칼 중합(RAFT), 니트록시드를 개재하는 라디칼 중합(NMP), 유기 텔루륨을 사용하는 라디칼 중합(TERP) 등을 들 수 있다. 이 리빙 라디칼 중합에 의해, 상기 공중합체(P)를 제조하면, 분자량 분포가 매우 좁은 공중합체가 얻어지므로 바람직하다. 이들 중 어느 방법을 사용할지는 특히 제약은 없지만, 제어의 용이함 등으로부터 상기 ATRP가 바람직하다. ATRP는, 유기 할로겐화물, 또는 할로겐화설포닐 화합물 등을 개시제, 천이 금속 화합물과 배위자로 이루어지는 금속 착체를 촉매로 하여 중합된다.As a method for producing the copolymer (P) or the polymer (Q1) or the polymer (Q2) used in the present invention, the compound (A) is used as a radical polymerization initiator, and the monomer (B) or the monomer (C) is used. And a method for polymerizing living radicals. In general, in living radical polymerization, a polymer having a very narrow molecular weight distribution can be obtained by reacting a monomer with an active polymerization terminal protected by an atom or an atomic group reversibly generating a radical and reacting with a monomer. Examples of such living radical polymerization include atomic transfer radical polymerization (ATRP), reversible addition-cleaving radical polymerization (RAFT), radical polymerization via nitroxide (NMP), radical polymerization using organic tellurium (TERP), etc. Can be mentioned. When the copolymer (P) is produced by this living radical polymerization, a copolymer having a very narrow molecular weight distribution is obtained, which is preferable. There is no particular limitation as to which method to use, but the ATRP is preferred from the viewpoint of ease of control and the like. ATRP is polymerized using an organic halide or a sulfonyl halide compound or the like as an initiator, a transition metal compound, and a metal complex composed of a ligand.
상기 ATRP에서 사용하는 천이 금속 화합물은, Mn+Xn으로 표시되는 것이다. 천이 금속인 Mn+은, Cu+, Cu2 +, Fe2 +, Fe3 +, Ru2 +, Ru3 +, Cr2 +, Cr3 +, Mo0, Mo+, Mo2 +, Mo3 +, W2+, W3+, Rh3 +, Rh4 +, Co+, Co2 +, Re2 +, Re3 +, Ni0, Ni+, Mn3 +, Mn4 +, V2+, V3+, Zn+, Zn2 +, Au+, Au2 +, Ag+ 및 Ag2 +로 이루어지는 군에서 선택할 수 있다. 또한, X는, 할로겐 원자, 탄소 원자수 1∼6의 알콕시기, (SO4)1/2, (PO4)1/3, (HPO4)1/2, (H2PO4), 트리플레이트, 헥사플루오로포스페이트, 메탄설포네이트, 아릴설포네이트(바람직하게는 벤젠설포네이트 또는 톨루엔설포네이트), SeR1, CN 및 R2COO로 이루어지는 군에서 선택할 수 있다. 여기에서, R1은, 아릴, 직쇄상 또는 분기상의 탄소 원자수 1∼20(바람직하게는 탄소 원자수 1∼10)의 알킬기를 나타내고, R2는, 수소 원자, 할로겐으로 1∼5회(호적하게는 불소 혹은 염소로 1∼3회) 치환되어 있어도 되는 직쇄상 또는 분기상의 탄소 원자수 1∼6의 알킬기(바람직하게는 메틸기)를 나타낸다. 또한, n은, 금속상의 형식 전하를 나타내고, 0∼7의 정수이다.The transition metal compound used in the ATRP is represented by M n + X n . The transition metal M n + is Cu + , Cu 2 + , Fe 2 + , Fe 3 + , Ru 2 + , Ru 3 + , Cr 2 + , Cr 3 + , Mo 0 , Mo + , Mo 2 + , Mo 3 + , W 2+ , W 3+ , Rh 3 + , Rh 4 + , Co + , Co 2 + , Re 2 + , Re 3 + , Ni 0 , Ni + , Mn 3 + , Mn 4 + , V 2+ , V 3+ , Zn + , Zn 2 + , Au + , Au 2 + , Ag + and Ag 2 + . In addition, X is a halogen atom, an alkoxy group having 1 to 6 carbon atoms, (SO 4 ) 1/2 , (PO 4 ) 1/3 , (HPO 4 ) 1/2 , (H 2 PO 4 ), tree Plate, hexafluorophosphate, methanesulfonate, arylsulfonate (preferably benzenesulfonate or toluenesulfonate), SeR 1 , CN and R 2 COO. Here, R 1 represents an aryl, linear or branched alkyl group having 1 to 20 carbon atoms (preferably 1 to 10 carbon atoms), and
상기 천이 금속 착체로서는, 7, 8, 9, 10, 11족의 천이 금속 착체가 바람직하고, 0가의 구리, 1가의 구리, 2가의 루테늄, 2가의 철 또는 2가의 니켈의 착체가 더 바람직하다.As the transition metal complex, transition metal complexes of
상기의 천이 금속과 배위 결합 가능한 배위자를 갖는 화합물로서는, 천이 금속과 σ결합을 개재하여 배위할 수 있는 1개 이상의 질소 원자, 산소 원자, 인 원자 또는 황 원자를 포함하는 배위자를 갖는 화합물, 천이 금속과 π결합을 개재하여 배위할 수 있는 2개 이상의 탄소 원자를 포함하는 배위자를 갖는 화합물, 천이 금속과 μ결합 또는 η결합을 개재하여 배위할 수 있는 배위자를 갖는 화합물을 들 수 있다.As the compound having a ligand capable of coordinating bonds with the transition metal, the compound having a ligand containing at least one nitrogen atom, oxygen atom, phosphorus atom, or sulfur atom capable of coordinating via a transition metal and a σ bond, transition metal And compounds having a ligand containing two or more carbon atoms capable of coordinating via and π bonds, and compounds having a ligand capable of coordinating with a transition metal through a μ bond or an η bond.
상기 배위자를 갖는 화합물의 구체예로서는, 예를 들면, 중심 금속이 구리인 경우에는 2,2'-비피리딜 및 그 유도체, 1,10-페난트롤린 및 그 유도체, 테트라메틸에틸렌디아민, 펜타메틸디에틸렌트리아민, 헥사메틸트리스(2-아미노에틸)아민 등의 폴리아민 등의 배위자와의 착체를 들 수 있다. 또한 2가의 루테늄 착체로서는, 디클로로트리스(트리페닐포스핀)루테늄, 디클로로트리스(트리부틸포스핀)루테늄, 디클로로(시클로옥타디엔)루테늄, 디클로로벤젠루테늄, 디클로로p-시멘루테늄, 디클로로(노르보르나디엔)루테늄, 시스-디클로로비스(2,2'-비피리딘)루테늄, 디클로로트리스(1,10-페난트롤린)루테늄, 카르보닐클로로히드리도트리스(트리페닐포스핀)루테늄 등을 들 수 있다. 또한 2가의 철 착체로서는, 비스트리페닐포스핀 착체, 트리아자시클로노난 착체 등을 들 수 있다.As specific examples of the compound having the above ligand, for example, when the central metal is copper, 2,2'-bipyridyl and its derivatives, 1,10-phenanthroline and its derivatives, tetramethylethylenediamine, pentamethyl And complexes with ligands such as polyamines such as diethylenetriamine and hexamethyltris (2-aminoethyl) amine. In addition, as the divalent ruthenium complex, dichlorotris (triphenylphosphine) ruthenium, dichlorotris (tributylphosphine) ruthenium, dichloro (cyclooctadiene) ruthenium, dichlorobenzene ruthenium, dichlorop-cementium ruthenium, dichloro (norbornadi N) ruthenium, cis-dichlorobis (2,2'-bipyridine) ruthenium, dichlorotris (1,10-phenanthroline) ruthenium, carbonylchlorohydridotris (triphenylphosphine) ruthenium, and the like. . Moreover, as a bivalent iron complex, a bistriphenylphosphine complex, a triazacyclononane complex, etc. are mentioned.
또한, 상기 공중합체(P)의 제조에서는, 용매를 사용하는 것이 바람직하다. 사용하는 용매로서는, 예를 들면, 아세트산에틸, 아세트산부틸, 프로필렌글리콜모노메틸에테르아세테이트 등의 에스테르계 용매; 디이소프로필에테르, 디메톡시에탄, 디에틸렌글리콜디메틸에테르 등의 에테르계 용매; 디클로로메탄, 디클로로에탄 등의 할로겐계 용매; 톨루엔, 자일렌 등의 방향족계 용매; 메틸에틸케톤, 메틸이소부틸케톤, 시클로헥산온 등의 케톤계 용제; 메탄올, 에탄올, 이소프로판올 등의 알코올계 용제; 디메틸포름아미드, 디메틸설폭시드 등의 비프로톤성 극성 용매 등을 들 수 있다. 또한, 상기의 용매는, 단독으로 사용할 수도 2종 이상 병용할 수도 있다.In addition, in the preparation of the copolymer (P), it is preferable to use a solvent. Examples of the solvent to be used include, for example, ester solvents such as ethyl acetate, butyl acetate, and propylene glycol monomethyl ether acetate; Ether solvents such as diisopropyl ether, dimethoxyethane and diethylene glycol dimethyl ether; Halogen-based solvents such as dichloromethane and dichloroethane; Aromatic solvents such as toluene and xylene; Ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; Alcohol solvents such as methanol, ethanol, and isopropanol; And aprotic polar solvents such as dimethylformamide and dimethylsulfoxide. Moreover, the said solvent can be used individually or in combination of 2 or more types.
또한, 상기 공중합체(P)나 중합체(Q1)나 중합체(Q2)의 제조 시의 중합 온도는, 실온으로부터 100℃의 범위가 바람직하다.Moreover, the polymerization temperature at the time of manufacture of the said copolymer (P), a polymer (Q1), or a polymer (Q2) is preferable from room temperature to 100 degreeC.
상기 공중합체(P) 중의 상기 단량체(B) 및 상기 단량체(C)로 구성되는 공중합 부분을 블록상으로 하는 경우에는, 상기 단량체(B) 또는 상기 단량체(C)를 단독으로, 상기 화합물(A), 천이 금속 화합물, 당해 천이 금속과 배위 결합 가능한 배위자를 갖는 화합물 및 용매의 존재하에서 리빙 라디칼 중합시킨 후, 앞서 리빙 라디칼 중합한 단량체와는 다른 단량체를 더하여, 추가로 리빙 라디칼 중합시킴으로써 얻을 수 있다.When the copolymerization part consisting of the monomer (B) and the monomer (C) in the copolymer (P) is in the form of a block, the monomer (B) or the monomer (C) alone is the compound (A). ), After a living radical polymerization in the presence of a transition metal compound, a compound having a ligand capable of coordinating bonds with the transition metal, and a solvent, a monomer different from the living radical polymerized monomer is added, and further obtained by living radical polymerization. .
본 발명의 중합성 수지를 얻기 위해서는, 상기의 방법에서 제조된 공중합체(P)나 중합체(Q1)나 중합체(Q2)가 갖는 상기 반응성기의 일부 또는 전부에, 상기 관능기(c1)에 대하여 반응성을 갖는 관능기(d1) 및 중합성 불포화기(d2)를 갖는 화합물(D)를 사용하여, 공중합체(P)에 중합성 불포화기(y)를 도입한다. 상기 화합물(D)이 갖는 관능기(d1)로서는, 예를 들면, 수산기, 이소시아네이트기, 에폭시기, 카르복시기, 카르복시산할라이드기, 카르복시산 무수물기 등을 들 수 있다. 상기 단량체(C)가 갖는 반응성 관능기(c1)가 수산기인 경우에는, 관능기(d1)로서 이소시아네이트기, 카르복시기, 카르복시산할라이드기, 카르복시산 무수물기, 에폭시기를 들 수 있고, 반응성 관능기(c1)가 이소시아네이트기인 경우에는, 관능기(d1)로서 수산기를 들 수 있고, 반응성 관능기(c1)가 에폭시기인 경우에는, 관능기(d1)로서 카르복시기, 수산기를 들 수 있고, 반응성 관능기(c1)가 카르복시기인 경우에는, 관능기(d1)로서 에폭시기, 수산기를 들 수 있다. 이들은, 복수의 관능기의 조합으로 해도 상관없다. 또한, 이들의 조합 중에서도, 상기 반응성 관능기(c1)가 수산기이며 상기 관능기(d1)가 이소시아네이트기의 조합, 상기 반응성 관능기(c1)가 에폭시기이며 상기 관능기(d1)가 카르복시기의 조합이 바람직하다.In order to obtain the polymerizable resin of the present invention, some or all of the reactive groups of the copolymer (P) or polymer (Q1) or polymer (Q2) prepared in the above method are reactive with the functional group (c1). A polymerizable unsaturated group (y) is introduced into the copolymer (P) using a compound (D) having a functional group (d1) and a polymerizable unsaturated group (d2). As a functional group (d1) which the said compound (D) has, a hydroxyl group, an isocyanate group, an epoxy group, a carboxyl group, a carboxylic acid halide group, a carboxylic acid anhydride group etc. are mentioned, for example. When the reactive functional group (c1) of the monomer (C) is a hydroxyl group, examples of the functional group (d1) include an isocyanate group, a carboxyl group, a carboxylic acid halide group, a carboxylic acid anhydride group, and an epoxy group, and the reactive functional group (c1) is an isocyanate group. In the case, a hydroxyl group is mentioned as a functional group (d1), and when the reactive functional group (c1) is an epoxy group, a carboxyl group or a hydroxyl group is mentioned as a functional group (d1), and when the reactive functional group (c1) is a carboxy group, a functional group An epoxy group and a hydroxyl group are mentioned as (d1). These may be used as a combination of a plurality of functional groups. Moreover, among these combinations, the combination of the reactive functional group (c1) is a hydroxyl group, the functional group (d1) is an isocyanate group, the reactive functional group (c1) is an epoxy group, and the functional group (d1) is preferably a combination of a carboxy group.
또, 상기 단량체(D)가 갖는 중합성 불포화기(y)는, 라디칼 중합성을 갖는 탄소-탄소 불포화 이중 결합이 바람직하고, 보다 구체적으로는, 비닐기, (메타)아크릴로일기, 말레이미드기 등을 들 수 있다. 이들 중에서도, 활성 에너지선 경화형 조성물에 본 발명의 함불소 중합성 중합체를 첨가했을 때에, 후술하는 활성 에너지선 경화성 수지(E), 활성 에너지선 경화성 단량체(F) 등과의 경화성이 높으므로, (메타)아크릴로일기가 바람직하고, 아크릴로일기가 보다 바람직하다.Moreover, the polymerizable unsaturated group (y) possessed by the monomer (D) is preferably a carbon-carbon unsaturated double bond having radical polymerization property, and more specifically, a vinyl group, (meth) acryloyl group, maleimide And the like. Among these, when the fluorinated polymerizable polymer of the present invention is added to the active energy ray-curable composition, the curability with the active energy ray-curable resin (E), the active energy ray-curable monomer (F), and the like described later is high, so (meta ) Acryloyl group is preferred, and acryloyl group is more preferred.
상기 화합물(D)의 구체예로서는, 예를 들면, 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 3-히드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 1,4-시클로헥산디메탄올모노(메타)아크릴레이트, N-(2-히드록시에틸)(메타)아크릴아미드, 글리세린모노(메타)아크릴레이트, 폴리에틸렌글리콜모노(메타)아크릴레이트, 폴리프로필렌글리콜모노(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸-2-히드록시에틸프탈레이트, 말단에 수산기를 갖는 락톤 변성 (메타)아크릴레이트 등의 수산기를 갖는 불포화 단량체; 2-(메타)아크릴로일옥시에틸이소시아네이트, 2-(2-(메타)아크릴로일옥시에톡시)에틸이소시아네이트, 1,1-비스((메타)아크릴로일옥시메틸)에틸이소시아네이트 등의 이소시아네이트기를 갖는 불포화 단량체; 글리시딜메타크릴레이트, 4-히드록시부틸아크릴레이트글리시딜에테르 등의 에폭시기를 갖는 불포화 단량체; (메타)아크릴산, 2-(메타)아크릴로일옥시에틸숙신산, 2-(메타)아크릴로일옥시에틸프탈산, 말레산, 이타콘산 등의 카르복시기 함유 불포화 단량체; 무수말레산, 무수이타콘산 등의 불포화 이중 결합을 갖는 카르복시산 무수물 등을 들 수 있다. 또한, 복수의 중합성 불포화기를 갖는 것으로서, 2-히드록시-3-아크릴로일옥시프로필메타크릴레이트, 펜타에리트리톨트리아크릴레이트, 디펜타에리트리톨펜타아크릴레이트 등을 사용할 수도 있다. 이들의 화합물(D)은, 1종류만으로 사용할 수도 2종 이상 병용할 수도 있다.As specific examples of the compound (D), for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxy Butyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 1,4-cyclohexanedimethanol mono (meth) acrylate, N- (2-hydroxyethyl) (meth) acrylamide, glycerin mono (Meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2- (meth) acryloyloxy Unsaturated monomers having hydroxyl groups such as ethyl-2-hydroxyethyl phthalate and lactone-modified (meth) acrylates having hydroxyl groups at the terminals; Isocyanates such as 2- (meth) acryloyloxyethyl isocyanate, 2- (2- (meth) acryloyloxyethoxy) ethyl isocyanate, and 1,1-bis ((meth) acryloyloxymethyl) ethyl isocyanate Unsaturated monomer having a group; Unsaturated monomers having an epoxy group such as glycidyl methacrylate and 4-hydroxybutyl acrylate glycidyl ether; Carboxyl group-containing unsaturated monomers such as (meth) acrylic acid, 2- (meth) acryloyloxyethylsuccinic acid, 2- (meth) acryloyloxyethylphthalic acid, maleic acid, and itaconic acid; And carboxylic acid anhydrides having unsaturated double bonds such as maleic anhydride and itaconic anhydride. Further, as having a plurality of polymerizable unsaturated groups, 2-hydroxy-3-acryloyloxypropyl methacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, and the like can also be used. These compounds (D) can be used alone or in combination of two or more.
상기의 화합물(D)의 구체적인 것 중에서도 특히 자외선 조사에서의 중합 경화성이 바람직한 점에서, 2-히드록시에틸아크릴레이트, 2-히드록시프로필아크릴레이트, 3-히드록시프로필아크릴레이트, 2-히드록시부틸아크릴레이트, 4-히드록시부틸아크릴레이트, 1,4-시클로헥산디메탄올모노아크릴레이트, N-(2-히드록시에틸)아크릴아미드, 2-아크릴로일옥시에틸이소시아네이트, 1,1-비스(아크릴로일옥시메틸)에틸이소시아네이트4-히드록시부틸아크릴레이트글리시딜에테르, 아크릴산이 바람직하다.2-hydroxyethyl acrylate, 2-hydroxypropylacrylate, 3-hydroxypropylacrylate, 2-hydroxy Butyl acrylate, 4-hydroxybutyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, N- (2-hydroxyethyl) acrylamide, 2-acryloyloxyethyl isocyanate, 1,1-bis (Acryloyloxymethyl) ethyl isocyanate 4-hydroxybutyl acrylate glycidyl ether and acrylic acid are preferred.
상기 공중합체(P)나 중합체(Q1)나 중합체(Q2)에, 상기 화합물(D)을 반응시키는 방법은, 화합물(D) 등이 갖는 중합성 불포화기가 중합하지 않는 조건에서 행하면 되며, 예를 들면, 온도 조건을 30∼120℃의 범위로 조절하여 반응시키는 것이 바람직하다. 이 반응은 촉매나 중합 금지제의 존재하, 필요에 따라 유기 용제의 존재하에서 행하는 것이 바람직하다.The method of reacting the compound (D) with the copolymer (P), the polymer (Q1), or the polymer (Q2) may be performed under the condition that the polymerizable unsaturated group of the compound (D) or the like does not polymerize, for example. For example, it is preferable to react by adjusting the temperature conditions in the range of 30 to 120 ° C. It is preferable to carry out this reaction in the presence of a catalyst or a polymerization inhibitor and, if necessary, in the presence of an organic solvent.
예를 들면, 상기 반응성 관능기(c1)가 수산기이며, 상기 관능기(d1)가 이소시아네이트기인 경우에는, 중합 금지제로서 p-메톡시페놀, 히드로퀴논, 2,6-디-t-부틸-4-메틸페놀 등을 사용하고, 우레탄화 반응 촉매로서 디부틸주석디라우레이트, 디부틸주석디아세테이트, 옥틸산주석, 옥틸산아연 등을 사용하고, 반응 온도 40∼120℃, 특히 60∼90℃에서 반응시키는 방법이 바람직하다. 또한, 상기 반응성 관능기(c1)가 에폭시기이며, 상기 관능기(d1)가 카르복시기인 경우, 또는, 상기 반응성 관능기(c1)가 카르복시기이며, 상기 관능기(d1)가 에폭시기인 경우에는, 중합 금지제로서 p-메톡시페놀, 히드로퀴논, 2,6-디-t-부틸-4-메틸페놀 등을 사용하고, 에스테르화 반응 촉매로서 트리에틸아민 등의 제3급 아민류, 염화테트라메틸암모늄 등의 제4급 암모늄류, 트리페닐포스핀 등의 제3급 포스핀류, 염화테트라부틸포스포늄 등의 제4급 포스포늄류 등을 사용하여, 반응 온도 80∼130℃, 특히 100∼120℃에서 반응시키는 것이 바람직하다.For example, when the reactive functional group (c1) is a hydroxyl group and the functional group (d1) is an isocyanate group, p-methoxyphenol, hydroquinone, 2,6-di-t-butyl-4-methyl as a polymerization inhibitor Phenol or the like is used, and dibutyltin dilaurate, dibutyltin diacetate, tin octylate, zinc octylate, etc. are used as the urethanization reaction catalyst, and reaction is carried out at a reaction temperature of 40 to 120 ° C, particularly 60 to 90 ° C. Preferred is the method. In addition, when the reactive functional group (c1) is an epoxy group, and the functional group (d1) is a carboxy group, or when the reactive functional group (c1) is a carboxy group, and the functional group (d1) is an epoxy group, p is a polymerization inhibitor. -Methoxyphenol, hydroquinone, 2,6-di-t-butyl-4-methylphenol, etc. are used, and tertiary amines such as triethylamine and quaternary tetramethylammonium chloride are used as catalysts for the esterification reaction. It is preferable to react at a reaction temperature of 80 to 130 ° C, particularly 100 to 120 ° C, using tertiary phosphines such as ammoniums and triphenylphosphine, quaternary phosphoniums such as tetrabutylphosphonium chloride, and the like. Do.
상기 반응에서 사용되는 유기 용매는 케톤류, 에스테르류, 아미드류, 설폭시드류, 에테르류, 탄화수소류가 바람직하고, 구체적으로는, 아세톤, 메틸에틸케톤, 메틸이소부틸케톤, 시클로헥산온, 아세트산에틸, 아세트산부틸, 프로필렌글리콜모노메틸에테르아세테이트, 디메틸포름아미드, 디메틸아세트아미드, N-메틸피롤리돈, 디메틸설폭시드, 디에틸에테르, 디이소프로필에테르, 테트라히드로퓨란, 디옥산, 톨루엔, 자일렌 등을 들 수 있다. 이들은, 비점, 상용성을 고려하여 적의 선택하면 된다.The organic solvent used in the reaction is preferably ketones, esters, amides, sulfoxides, ethers, hydrocarbons, and specifically, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl acetate , Butyl acetate, propylene glycol monomethyl ether acetate, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, diethyl ether, diisopropyl ether, tetrahydrofuran, dioxane, toluene, xylene And the like. These may be appropriately selected in consideration of boiling point and compatibility.
상기한 바와 같이 하여 얻어지는 본 발명의 중합성 수지 중에서도, 랜덤 공중합체상인 중합성 수지는, 제조 시의 겔화를 방지할 수 있고, 방오성이 뛰어나므로, 그 수평균 분자량(Mn)이 3,000∼100,000의 범위인 것이 바람직하고, 10,000∼50,000의 범위인 것이 보다 바람직하다. 또한, 중량 평균 분자량(Mw)이 3,000∼150,000의 범위인 것이 바람직하고, 10,000∼75,000의 범위인 것이 보다 바람직하다. 또한, 본 발명의 중합성 수지의 분산도(Mw/Mn)는 1.0∼1.5가 바람직하고, 1.0∼1.3이 보다 바람직하고, 1.0∼1.2가 가장 바람직하다.Among the polymerizable resins of the present invention obtained as described above, since the polymerizable resin in the form of a random copolymer can prevent gelation at the time of manufacture and has excellent antifouling properties, its number average molecular weight (Mn) is 3,000 to 100,000. It is preferable that it is a range, and it is more preferable that it is a range of 10,000-50,000. Moreover, it is preferable that weight average molecular weight (Mw) is the range of 3,000-150,000, and it is more preferable that it is the range of 10,000-75,000. Further, the dispersion degree (Mw / Mn) of the polymerizable resin of the present invention is preferably 1.0 to 1.5, more preferably 1.0 to 1.3, and most preferably 1.0 to 1.2.
상기한 바와 같이 하여 얻어지는 본 발명의 중합성 수지 중에서도, 블록 공중합체상인 중합성 수지는 제조 시의 겔화를 방지할 수 있고, 방오성이 뛰어나므로, 그 수평균 분자량(Mn)이 3,000∼100,000의 범위인 것이 바람직하고, 6,000∼50,000의 범위인 것이 보다 바람직하고, 8,000∼25,000이 더 바람직하다. 또한, 중량 평균 분자량(Mw)이 3,000∼150,000의 범위인 것이 바람직하고, 8,000∼65,000의 범위인 것이 보다 바람직하고, 10,000∼35,000이 더 바람직하다. 또한, 본 발명의 중합성 수지의 분산도(Mw/Mn)는 1.0∼1.5가 바람직하고, 1.0∼1.4가 보다 바람직하고, 1.0∼1.3이 가장 바람직하다.Among the polymerizable resins of the present invention obtained as described above, the polymerizable resin in the form of a block copolymer can prevent gelation at the time of production and has excellent antifouling properties, so its number average molecular weight (Mn) ranges from 3,000 to 100,000. It is preferably, it is more preferably in the range of 6,000 to 50,000, and more preferably 8,000 to 25,000. Further, the weight average molecular weight (Mw) is preferably in the range of 3,000 to 150,000, more preferably in the range of 8,000 to 65,000, and more preferably 10,000 to 35,000. Further, the dispersion degree (Mw / Mn) of the polymerizable resin of the present invention is preferably 1.0 to 1.5, more preferably 1.0 to 1.4, and most preferably 1.0 to 1.3.
여기에서, 수평균 분자량(Mn) 및 중량 평균 분자량(Mw)은 겔침투 크로마토그래피(이하, 「GPC」라고 약기함) 측정에 의거하여 폴리스티렌 환산한 값이다. 또, GPC의 측정 조건은 이하와 같다.Here, the number average molecular weight (Mn) and the weight average molecular weight (Mw) are the values converted into polystyrene based on gel permeation chromatography (hereinafter abbreviated as "GPC") measurement. In addition, the measurement conditions of GPC are as follows.
[GPC 측정 조건][GPC measurement conditions]
측정 장치 : 도소 가부시키가이샤제 「HLC-8220 GPC」,Measuring device: `` HLC-8220 GPC '' manufactured by Tosoh Corporation,
칼럼 : 도소 가부시키가이샤제 가드 칼럼 「HHR-H」(6.0㎜I.D.×4㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)Column: Guard column made by Tosoh Corporation (HHR-H) (6.0 mmID × 4 cm) + Tosoh Corporation manufactured by “TSK-GEL GMHHR-N” (7.8 mm ID × 30 cm) + manufactured by Tosoh Corporation "TSK-GEL GMHHR-N" (7.8 mm ID x 30 cm) + manufactured by Tosoh Corporation "TSK-GEL GMHHR-N" (7.8 mm ID x 30 cm) + manufactured by Tosoh Corporation "TSK-GEL GMHHR- N '' (7.8 mm ID x 30 cm)
검출기 : ELSD(올테크재팬 가부시키가이샤제 「ELSD2000」)Detector: ELSD ("ELSD2000" manufactured by All Tech Japan Co., Ltd.)
데이터 처리 : 도소 가부시키가이샤제 「GPC-8020 모델Ⅱ 데이터 해석 버전4.30」Data processing: `` GPC-8020 Model II data analysis version 4.30 '' manufactured by Tosoh Corporation
측정 조건 : 칼럼 온도 40℃Measurement conditions:
전개 용매 테트라히드로퓨란(THF)Development solvent tetrahydrofuran (THF)
유속 1.0㎖/분Flow rate 1.0 ml / min
시료 : 수지 고형분 환산으로 1.0질량%의 테트라히드로퓨란 용액을 마이크로 필터로 여과한 것(5㎕).Sample: A 1.0% by mass tetrahydrofuran solution was filtered through a micro filter in terms of resin solid content (5 μl).
표준 시료 : 상기 「GPC-8020 모델Ⅱ 데이터 해석 버전4.30」의 측정 매뉴얼에 준거하여, 분자량이 기지의 하기의 단분산 폴리스티렌을 사용했다.Standard sample: In accordance with the measurement manual of "GPC-8020 model II data analysis version 4.30", the following monodisperse polystyrene having a known molecular weight was used.
(단분산 폴리스티렌)(Monodisperse polystyrene)
도소 가부시키가이샤제 「A-500」"A-500" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「A-1000」"A-1000" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「A-2500」"A-2500" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「A-5000」"A-5000" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-1」"F-1" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-2」"F-2" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-4」"F-4" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-10」"F-10" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-20」"F-20" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-40」"F-40" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-80」"F-80" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-128」"F-128" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-288」"F-288" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-550」"F-550" manufactured by Tosoh Corporation
또한, 본 발명의 중합성 수지 중의 중합성 불포화기 당량은, 경화 도막의 내찰상성이 뛰어나므로, 200∼3,500g/eq.의 범위가 바람직하고, 250∼2,500g/eq.의 범위가 보다 바람직하고, 250∼2,000g/eq.의 범위가 보다 바람직하고, 300∼2,000g/eq.의 범위가 보다 바람직하고, 300∼1,500g/eq.의 범위가 더 바람직하고, 400∼1,500g/eq.의 범위가 더 바람직하고, 400∼1,000g/eq.의 범위가 특히 바람직하다.Further, the equivalent of the polymerizable unsaturated group in the polymerizable resin of the present invention is excellent in the scratch resistance of the cured coating film, so the range of 200 to 3,500 g / eq. Is preferable, and the range of 250 to 2,500 g / eq. Is more preferable. The range of 250 to 2,000 g / eq. Is more preferable, the range of 300 to 2,000 g / eq. Is more preferable, the range of 300 to 1,500 g / eq. Is more preferable, and 400 to 1,500 g / eq. The range of. Is more preferable, and the range of 400-1,000 g / eq. Is especially preferable.
또한, 본 발명의 중합성 수지가 블록 공중합체상의 중합성 수지인 경우, 중합성 수지 중의 제1 중합체 세그먼트(α)와 제2 중합체 세그먼트(β)의 비율은, 질량비[(α)/(β)]로 10/90∼90/10이 되는 범위가 다른 수지와의 상용성이 뛰어나고, 또한, 도막 표면에 활성과 내찰상성에 기여하는 실리콘쇄를 양호하게 편석할 수 있으므로 바람직하고, 20/80∼80/20이 되는 범위가 보다 바람직하고, 30/70∼70/30이 되는 범위가 더 바람직하다.In addition, when the polymerizable resin of the present invention is a block copolymer phase polymerizable resin, the ratio of the first polymer segment (α) and the second polymer segment (β) in the polymerizable resin is the mass ratio [(α) / (β )], Which is excellent in compatibility with other resins in the range of 10/90 to 90/10, and is also preferable because the silicone chain contributing to activity and scratch resistance can be favorably segregated on the surface of the coating film. The range which becomes -80/20 is more preferable, and the range which becomes 30 / 70-70 / 30 is more preferable.
본 발명의 중합성 수지는, 그 자체를 활성 에너지선 경화성 조성물의 주제로서 사용할 수 있지만, 매우 뛰어난 표면 개질 성능을 갖고 있기 때문에, 활성 에너지선 경화성 조성물에 첨가하는 표면 개질제(계면 활성제)로서 사용함으로써, 경화 도막에 뛰어난 내찰상성을 부여할 수 있다.The polymerizable resin of the present invention can be used as the subject of the active energy ray-curable composition itself, but because it has very excellent surface modification performance, by using it as a surface modifier (surfactant) added to the active energy ray-curable composition , It is possible to impart excellent scratch resistance to the cured coating film.
본 발명의 활성 에너지선 경화형 조성물은, 본 발명의 중합성 수지를 첨가한 것이지만, 그 주성분으로서는, 본 발명의 중합성 수지 이외의 활성 에너지선 경화형 수지(E) 또는 활성 에너지선 경화성 단량체(F)를 함유한다. 또, 본 발명의 활성 에너지선 경화형 조성물에 있어서, 활성 에너지선 경화형 수지(E)와 활성 에너지선 경화성 단량체(F)는, 각각 단독으로 사용해도 되지만, 병용해도 상관없다. 또한, 본 발명의 중합성 수지는, 당해 활성 에너지선 경화형 조성물에 있어서, 불소계 계면 활성제로서 사용하는 것이 바람직하다.The active energy ray-curable composition of the present invention is obtained by adding the polymerizable resin of the present invention, but as its main component, active energy ray-curable resins other than the polymerizable resin of the invention (E) or active energy ray-curable monomers (F) It contains. In addition, in the active energy ray-curable composition of the present invention, the active energy ray-curable resin (E) and the active energy ray-curable monomer (F) may be used alone, or may be used in combination. The polymerizable resin of the present invention is preferably used as a fluorine-based surfactant in the active energy ray-curable composition.
상기 활성 에너지선 경화형 수지(E)는, 우레탄(메타)아크릴레이트 수지, 불포화 폴리에스테르 수지, 에폭시(메타)아크릴레이트 수지, 폴리에스테르(메타)아크릴레이트 수지, 아크릴(메타)아크릴레이트 수지, 말레이미드기를 갖는 수지 등을 들 수 있지만, 본 발명에서는, 특히 투명성이나 저수축성 등의 점에서 우레탄(메타)아크릴레이트 수지가 바람직하다.The active energy ray-curable resin (E) is urethane (meth) acrylate resin, unsaturated polyester resin, epoxy (meth) acrylate resin, polyester (meth) acrylate resin, acrylic (meth) acrylate resin, and Malay A resin having a mid group may be mentioned, but in the present invention, urethane (meth) acrylate resin is particularly preferred from the viewpoint of transparency and low shrinkage.
여기에서 사용하는 우레탄(메타)아크릴레이트 수지는, 지방족 폴리이소시아네이트 화합물 또는 방향족 폴리이소시아네이트 화합물과 수산기를 갖는 (메타)아크릴레이트 화합물을 반응시켜서 얻어지는 우레탄 결합과 (메타)아크릴로일기를 갖는 수지를 들 수 있다.The urethane (meth) acrylate resin used herein includes resins having urethane bonds and (meth) acryloyl groups obtained by reacting an aliphatic polyisocyanate compound or an aromatic polyisocyanate compound with a (meth) acrylate compound having a hydroxyl group. You can.
상기 지방족 폴리이소시아네이트 화합물로서는, 예를 들면, 테트라메틸렌디이소시아네이트, 펜타메틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트, 헵타메틸렌디이소시아네이트, 옥타메틸렌디이소시아네이트, 데카메틸렌디이소시아네이트, 2-메틸-1,5-펜탄디이소시아네이트, 3-메틸-1,5-펜탄디이소시아네이트, 도데카메틸렌디이소시아네이트, 2-메틸펜타메틸렌디이소시아네이트, 2,2,4-트리메틸헥사메틸렌디이소시아네이트, 2,4,4-트리메틸헥사메틸렌디이소시아네이트, 이소포론디이소시아네이트, 노르보르난디이소시아네이트, 수소 첨가 디페닐메탄디이소시아네이트, 수소 첨가 톨릴렌디이소시아네이트, 수소 첨가 자일릴렌디이소시아네이트, 수소 첨가 테트라메틸자일릴렌디이소시아네이트, 시클로헥실디이소시아네이트 등을 들 수 있고, 또한, 방향족 폴리이소시아네이트 화합물로서는, 톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트, 자일릴렌디이소시아네이트, 1,5-나프탈렌디이소시아네이트, 톨리딘디이소시아네이트, p-페닐렌디이소시아네이트 등을 들 수 있다.Examples of the aliphatic polyisocyanate compound include tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, heptamethylene diisocyanate, octamethylene diisocyanate, decamethylene diisocyanate, and 2-methyl-1,5-pentane. Diisocyanate, 3-methyl-1,5-pentane diisocyanate, dodecamethylene diisocyanate, 2-methylpentamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene Diisocyanate, isophorone diisocyanate, norbornane diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated tetramethylxylylene diisocyanate, cyclohexyl diisocyanate, etc. Can and again , There may be mentioned an aromatic polyester as the isocyanate compound, such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylyl diisocyanate, 1,5-naphthalene diisocyanate, Tolly dindi diisocyanate, p- phenylene diisocyanate.
한편, 수산기를 갖는 아크릴레이트 화합물로서는, 예를 들면, 2-히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 1,5-펜탄디올모노(메타)아크릴레이트, 1,6-헥산디올모노(메타)아크릴레이트, 네오펜틸글리콜모노(메타)아크릴레이트, 히드록시피발산네오펜틸글리콜모노(메타)아크릴레이트 등의 2가 알코올의 모노(메타)아크릴레이트; 트리메틸올프로판디(메타)아크릴레이트, 에톡시화트리메틸올프로판(메타)아크릴레이트, 프로폭시화트리메틸올프로판디(메타)아크릴레이트, 글리세린디(메타)아크릴레이트, 비스(2-(메타)아크릴로일옥시에틸)히드록시에틸이소시아누레이트 등의 3가의 알코올의 모노 또는 디(메타)아크릴레이트, 혹은, 이들의 알코올성 수산기의 일부를 ε-카프로락톤으로 변성한 수산기를 갖는 모노 및 디(메타)아크릴레이트; 펜타에리트리톨트리(메타)아크릴레이트, 디트리메틸올프로판트리(메타)아크릴레이트, 디펜타에리트리톨펜타(메타)아크릴레이트 등의 1관능의 수산기와 3관능 이상의 (메타)아크릴로일기를 갖는 화합물, 혹은, 당해 화합물을 추가로 ε-카프로락톤으로 변성한 수산기를 갖는 다관능 (메타)아크릴레이트; 디프로필렌글리콜모노(메타)아크릴레이트, 디에틸렌글리콜모노(메타)아크릴레이트, 폴리프로필렌글리콜모노(메타)아크릴레이트, 폴리에틸렌글리콜모노(메타)아크릴레이트 등의 옥시알킬렌쇄를 갖는 (메타)아크릴레이트 화합물; 폴리에틸렌글리콜-폴리프로필렌글리콜모노(메타)아크릴레이트, 폴리옥시부틸렌-폴리옥시프로필렌모노(메타)아크릴레이트 등의 블록 구조의 옥시알킬렌쇄를 갖는 (메타)아크릴레이트 화합물; 폴리(에틸렌글리콜-테트라메틸렌글리콜)모노(메타)아크릴레이트, 폴리(프로필렌글리콜-테트라메틸렌글리콜)모노(메타)아크릴레이트 등의 랜덤 구조의 옥시알킬렌쇄를 갖는 (메타)아크릴레이트 화합물 등을 들 수 있다.On the other hand, examples of the acrylate compound having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 4-hydroxy Hydroxybutyl (meth) acrylate, 1,5-pentanediol mono (meth) acrylate, 1,6-hexanediol mono (meth) acrylate, neopentyl glycol mono (meth) acrylate, hydroxypivalate neopentyl Mono (meth) acrylates of dihydric alcohols such as glycol mono (meth) acrylate; Trimethylolpropanedi (meth) acrylate, ethoxylated trimethylolpropane (meth) acrylate, propoxylated trimethylolpropanedi (meth) acrylate, glycerin di (meth) acrylate, bis (2- (meth) acrylic Mono or di (meth) acrylates of trivalent alcohols such as royloxyethyl) hydroxyethylisocyanurate, or mono and di () having hydroxyl groups modified by a part of their alcoholic hydroxyl groups with ε-caprolactone Meth) acrylate; Compounds having a monofunctional hydroxyl group and a trifunctional or higher (meth) acryloyl group such as pentaerythritol tri (meth) acrylate, ditrimethylolpropane tri (meth) acrylate, and dipentaerythritol penta (meth) acrylate , Or, a polyfunctional (meth) acrylate having a hydroxyl group modified with the compound of ε-caprolactone; (Meth) acrylate having an oxyalkylene chain such as dipropylene glycol mono (meth) acrylate, diethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, polyethylene glycol mono (meth) acrylate compound; (Meth) acrylate compounds having a block structure of oxyalkylene chains such as polyethylene glycol-polypropylene glycol mono (meth) acrylate and polyoxybutylene-polyoxypropylene mono (meth) acrylate; And (meth) acrylate compounds having an oxyalkylene chain having a random structure such as poly (ethylene glycol-tetramethylene glycol) mono (meth) acrylate, poly (propylene glycol-tetramethylene glycol) mono (meth) acrylate, and the like. You can.
상기한 지방족 폴리이소시아네이트 화합물 또는 방향족 폴리이소시아네이트 화합물과 수산기를 갖는 아크릴레이트 화합물과의 반응은, 우레탄화 촉매의 존재하, 통상의 방법에 따라 행할 수 있다. 여기에서 사용할 수 있는 우레탄화 촉매는, 구체적으로는, 피리딘, 피롤, 트리에틸아민, 디에틸아민, 디부틸아민 등의 아민류, 트리페닐포스핀, 트리에틸포스핀 등의 포스핀류, 디부틸주석디라우레이트, 옥틸주석트리라우레이트, 옥틸주석디아세테이트, 디부틸주석디아세테이트, 옥틸산주석 등의 유기 주석 화합물, 옥틸산아연 등의 유기 금속 화합물을 들 수 있다.The reaction of the above-described aliphatic polyisocyanate compound or aromatic polyisocyanate compound with an acrylate compound having a hydroxyl group can be carried out according to a conventional method in the presence of a urethanization catalyst. Examples of the urethanization catalyst that can be used herein include amines such as pyridine, pyrrole, triethylamine, diethylamine, and dibutylamine, phosphine such as triphenylphosphine and triethylphosphine, and dibutyltin. And organotin compounds such as dilaurate, octyltin trilaurate, octyltin diacetate, dibutyltin diacetate and tin octylate, and organometallic compounds such as zinc octylate.
이들의 우레탄아크릴레이트 수지 중에서도 특히 지방족 폴리이소시아네이트 화합물과 수산기를 갖는 (메타)아크릴레이트 화합물을 반응시켜서 얻어지는 것이 경화 도막의 투명성이 뛰어나고, 또한, 활성 에너지선에 대한 감도가 양호하며 경화성이 뛰어난 점에서 바람직하다.Among these urethane acrylate resins, those obtained by reacting an aliphatic polyisocyanate compound with a (meth) acrylate compound having a hydroxyl group are excellent in transparency of the cured coating film, and also have good sensitivity to active energy rays and excellent curability. desirable.
다음으로, 불포화 폴리에스테르 수지는, α,β-불포화 이염기산 또는 그 산무수물, 방향족 포화 이염기산 또는 그 산무수물, 및, 글리콜류의 중축합에 의해 얻어지는 경화성 수지이며, α,β-불포화 이염기산 또는 그 산무수물로서는, 말레산, 무수말레산, 푸마르산, 이타콘산, 시트라콘산, 클로로말레산, 및 이들의 에스테르 등을 들 수 있다. 방향족 포화 이염기산 또는 그 산무수물로서는, 프탈산, 무수프탈산, 이소프탈산, 테레프탈산, 니트로프탈산, 테트라히드로무수프탈산, 엔도메틸렌테트라히드로무수프탈산, 할로겐화무수프탈산 및 이들의 에스테르 등을 들 수 있다. 지방족 혹은 지환족 포화 이염기산으로서는, 옥살산, 말론산, 숙신산, 아디프산, 세바스산, 아젤라산, 글루타르산, 헥사히드로무수프탈산 및 이들의 에스테르 등을 들 수 있다. 글리콜류로서는, 에틸렌글리콜, 프로필렌글리콜, 디에틸렌글리콜, 디프로필렌글리콜, 1,3-부탄디올, 1,4-부탄디올, 2-메틸프로판-1,3-디올, 네오펜틸글리콜, 트리에틸렌글리콜, 테트라에틸렌글리콜, 1,5-펜탄디올, 1,6-헥산디올, 비스페놀A, 수소화비스페놀A, 에틸렌글리콜카보네이트, 2,2-디-(4-히드록시프로폭시디페닐)프로판 등을 들 수 있고, 그 외에 에틸렌옥사이드, 프로필렌옥사이드 등의 산화물도 마찬가지로 사용할 수 있다.Next, the unsaturated polyester resin is a curable resin obtained by polycondensation of α, β-unsaturated dibasic acid or its acid anhydride, aromatic saturated dibasic acid or its acid anhydride, and glycols, and α, β-unsaturated dibasic salt Maleic acid, maleic anhydride, fumaric acid, itaconic acid, citraconic acid, chloromaleic acid, and esters thereof are mentioned as the base acid or its acid anhydride. Examples of the aromatic saturated dibasic acid or its acid anhydride include phthalic acid, phthalic anhydride, isophthalic acid, terephthalic acid, nitrophthalic acid, tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, halogenated anhydride phthalic acid and esters thereof. Examples of the aliphatic or alicyclic saturated dibasic acid include oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, glutaric acid, hexahydro anhydride phthalic acid, and esters thereof. As glycols, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, 2-methylpropane-1,3-diol, neopentyl glycol, triethylene glycol, tetra And ethylene glycol, 1,5-pentanediol, 1,6-hexanediol, bisphenol A, hydrogenated bisphenol A, ethylene glycol carbonate, 2,2-di- (4-hydroxypropoxydiphenyl) propane, and the like. , Other oxides, such as ethylene oxide and propylene oxide, can also be used.
다음으로, 에폭시(메타)아크릴레이트 수지로서는, 비스페놀A형 에폭시 수지, 비스페놀F형 에폭시 수지, 페놀노볼락형 에폭시 수지, 크레졸노볼락형 에폭시 수지 등의 에폭시 수지의 에폭시기에 (메타)아크릴산을 반응시켜서 얻어지는 것을 들 수 있다.Next, as the epoxy (meth) acrylate resin, (meth) acrylic acid is reacted with epoxy groups of epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, and cresol novolak type epoxy resin. And those obtained by prescribing.
또한, 말레이미드기를 갖는 수지로서는, N-히드록시에틸말레이미드와 이소포론디이소시아네이트를 우레탄화하여 얻어지는 2관능 말레이미드 우레탄 화합물, 말레이미드아세트산과 폴리테트라메틸렌글리콜을 에스테르화하여 얻어지는 2관능 말레이미드에스테르 화합물, 말레이미드카프로산과 펜타에리트리톨의 테트라에틸렌옥사이드 부가물을 에스테르화하여 얻어지는 4관능 말레이미드에스테르 화합물, 말레이미드아세트산과 다가 알코올 화합물을 에스테르화하여 얻어지는 다관능 말레이미드에스테르 화합물 등을 들 수 있다. 이들의 활성 에너지선 경화성 수지(E)는, 1종류만으로 사용할 수도 2종 이상 병용할 수도 있다.Further, as the resin having a maleimide group, a bifunctional maleimide urethane compound obtained by urethanizing N-hydroxyethyl maleimide and isophorone diisocyanate, a bifunctional maleimide obtained by esterifying maleimide acetic acid and polytetramethylene glycol Ester compounds, tetrafunctional maleimide ester compounds obtained by esterifying maleimidecaproic acid and tetraethylene oxide adducts of pentaerythritol, polyfunctional maleimide ester compounds obtained by esterifying maleimide acetic acid and polyhydric alcohol compounds, and the like. have. These active energy ray-curable resins (E) may be used alone or in combination of two or more.
상기 활성 에너지선 경화성 단량체(F)로서는, 예를 들면, 에틸렌글리콜디(메타)아크릴레이트, 디에틸렌글리콜디(메타)아크릴레이트, 트리에틸렌글리콜디(메타)아크릴레이트, 수평균 분자량이 150∼1000의 범위에 있는 폴리에틸렌글리콜디(메타)아크릴레이트, 프로필렌글리콜디(메타)아크릴레이트, 디프로필렌글리콜디(메타)아크릴레이트, 트리프로필렌글리콜디(메타)아크릴레이트, 수평균 분자량이 150∼1000의 범위에 있는 폴리프로필렌글리콜디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 1,3-부탄디올디(메타)아크릴레이트, 1,4-부탄디올디(메타)아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 히드록시피발산에스테르네오펜틸글리콜디(메타)아크릴레이트, 비스페놀A디(메타)아크릴레이트, 트리메틸올프로판트리(메타)아크릴레이트, 펜타에리트리톨트리(메타)아크릴레이트, 디펜타에리트리톨헥사(메타)아크릴레이트, 펜타에리트리톨테트라(메타)아크릴레이트, 트리메틸올프로판디(메타)아크릴레이트, 디펜타에리트리톨펜타(메타)아크릴레이트, 디시클로펜테닐(메타)아크릴레이트, 메틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 옥틸(메타)아크릴레이트, 데실(메타)아크릴레이트, 이소데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 스테아릴(메타)아크릴레이트, 이소스테아릴(메타)아크릴레이트 등의 지방족 알킬(메타)아크릴레이트, 글리세롤(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트, 3-클로로-2-히드록시프로필(메타)아크릴레이트, 글리시딜(메타)아크릴레이트, 알릴(메타)아크릴레이트, 2-부톡시에틸(메타)아크릴레이트, 2-(디에틸아미노)에틸(메타)아크릴레이트, 2-(디메틸아미노)에틸(메타)아크릴레이트, γ-(메타)아크릴옥시프로필트리메톡시실란, 2-메톡시에틸(메타)아크릴레이트, 메톡시디에틸렌글리콜(메타)아크릴레이트, 메톡시디프로필렌글리콜(메타)아크릴레이트, 노닐페녹시폴리에틸렌글리콜(메타)아크릴레이트, 노닐페녹시폴리프로필렌글리콜(메타)아크릴레이트, 페녹시에틸(메타)아크릴레이트, 페녹시디프로필렌글리콜(메타)아크릴레이트, 페녹시폴리프로필렌글리콜(메타)아크릴레이트, 폴리부타디엔(메타)아크릴레이트, 폴리에틸렌글리콜-폴리프로필렌글리콜(메타)아크릴레이트, 폴리에틸렌글리콜-폴리부틸렌글리콜(메타)아크릴레이트, 폴리스티릴에틸(메타)아크릴레이트, 벤질(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 디시클로펜테닐(메타)아크릴레이트, 이소보르닐(메타)아크릴레이트, 메톡시화시클로데카트리엔(메타)아크릴레이트, 페닐(메타)아크릴레이트; 말레이미드, N-메틸말레이미드, N-에틸말레이미드, N-프로필말레이미드, N-부틸말레이미드, N-헥실말레이미드, N-옥틸말레이미드, N-도데실말레이미드, N-스테아릴말레이미드, N-페닐말레이미드, N-시클로헥실말레이미드, 2-말레이미드에틸-에틸카보네이트, 2-말레이미드에틸-프로필카보네이트, N-에틸-(2-말레이미드에틸)카바메이트, N,N-헥사메틸렌비스말레이미드, 폴리프로필렌글리콜-비스(3-말레이미드프로필)에테르, 비스(2-말레이미드에틸)카보네이트, 1,4-디말레이미드시클로헥산 등의 말레이미드류 등을 들 수 있다.Examples of the active energy ray-curable monomer (F) include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, and a number average molecular weight of 150 to Polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate in the range of 1000, number average molecular weight 150 to 1000 Polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, hydroxypivalic acid ester neopentyl glycol di (meth) acrylate, bisphenol Adi (meth) acrylate, trimethylolpropane tri (meth) acrylate, pen Taerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, trimethylolpropanedi (meth) acrylate, dipentaerythritolpenta (meth) acrylic Rate, dicyclopentenyl (meth) acrylate, methyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylic Late, octyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, etc. Aliphatic alkyl (meth) acrylate, glycerol (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, Allyl (meta) Acrylate, 2-butoxyethyl (meth) acrylate, 2- (diethylamino) ethyl (meth) acrylate, 2- (dimethylamino) ethyl (meth) acrylate, γ- (meth) acryloxypropyl tree Methoxysilane, 2-methoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxydipropylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, nonylphenoxypoly Propylene glycol (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydipropylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, polybutadiene (meth) acrylate, polyethylene glycol-poly Propylene glycol (meth) acrylate, polyethylene glycol-polybutylene glycol (meth) acrylate, polystyrylethyl (meth) acrylate, benzyl (meth) acrylate, cyclo Sil (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclodecatriene (meth) acrylate, phenyl (meth) ) Acrylate; Maleimide, N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-butylmaleimide, N-hexylmaleimide, N-octylmaleimide, N-dodecylmaleimide, N-stearyl Maleimide, N-phenylmaleimide, N-cyclohexylmaleimide, 2-maleimideethyl-ethyl carbonate, 2-maleimideethyl-propyl carbonate, N-ethyl- (2-maleimideethyl) carbamate, N, And maleimides such as N-hexamethylene bismaleimide, polypropylene glycol-bis (3-maleimidepropyl) ether, bis (2-maleimideethyl) carbonate, and 1,4-dimaleimide cyclohexane. have.
이들 중에서도 특히 경화 도막의 경도가 뛰어난 점에서 트리메틸올프로판트리(메타)아크릴레이트, 펜타에리트리톨트리(메타)아크릴레이트, 디펜타에리트리톨헥사(메타)아크릴레이트, 펜타에리트리톨테트라(메타)아크릴레이트 등의 3관능 이상의 다관능 (메타)아크릴레이트가 바람직하다. 이들의 활성 에너지선 경화성 단량체(E)는, 1종류만으로 사용할 수도 2종 이상 병용할 수도 있다.Among these, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and pentaerythritol tetra (meth) acrylic Trifunctional or higher polyfunctional (meth) acrylates such as rate are preferred. These active energy ray-curable monomers (E) may be used alone or in combination of two or more.
본 발명의 활성 에너지선 경화형 조성물에 있어서, 본 발명의 중합성 수지의 사용량은, 상기 활성 에너지선 경화형 수지(E) 및 활성 에너지선 경화성 단량체(F)의 합계 100질량부에 대하여, 0.001∼20질량부의 범위가 바람직하고, 0.01∼15질량부의 범위가 보다 바람직하고, 0.1∼15질량부의 범위가 보다 바람직하고, 0.1∼10질량부의 범위가 더 바람직하고, 0.5∼15질량부의 범위가 특히 바람직하다. 본 발명의 중합성 수지의 사용량이 이 범위이면, 레벨링성, 발수 발유성, 방오성을 충분한 것으로 할 수 있고, 당해 조성물의 경화 후의 경도나 투명성도 충분한 것으로 할 수 있다. 또한, 본 발명의 활성 에너지선 경화성 조성물을 도막으로 했을 때의 막두께에 의해, 도막의 표층 부분에 차지하는 본 발명의 중합성 수지의 비율이 변화하므로, 후막의 경우에는, 본 발명의 중합성 수지의 첨가량을 낮게 설정하고, 박막의 경우에는, 본 발명의 중합성 수지의 첨가량을 높게 설정함으로써, 도막 표면에 본 발명의 중합성 수지를 빈틈없이 존재시킬 수 있고, 높은 내찰상성을 기대할 수 있기 때문에 바람직하다.In the active energy ray-curable composition of the present invention, the amount of the polymerizable resin used in the present invention is 0.001 to 20 based on 100 parts by mass of the total amount of the active energy ray-curable resin (E) and the active energy ray-curable monomer (F). The range of parts by mass is preferable, the range of 0.01 to 15 parts by mass is more preferable, the range of 0.1 to 15 parts by mass is more preferable, the range of 0.1 to 10 parts by mass is more preferable, and the range of 0.5 to 15 parts by mass is particularly preferable. . When the use amount of the polymerizable resin of the present invention is within this range, leveling properties, water-repellent and oil-repellent properties and anti-fouling properties can be sufficient, and hardness and transparency after curing of the composition can also be sufficient. Moreover, since the ratio of the polymerizable resin of the present invention to the surface layer portion of the coating film changes depending on the film thickness when the active energy ray-curable composition of the present invention is used as a coating film, in the case of a thick film, the polymerizable resin of the present invention By setting the addition amount of low, and in the case of a thin film, by setting the addition amount of the polymerizable resin of the present invention high, the polymerizable resin of the present invention can be present on the surface of the coating film tightly, and high scratch resistance can be expected. desirable.
본 발명의 중합성 수지 또는 활성 에너지선 경화형 조성물은, 기재에 도포 후, 활성 에너지선을 조사함으로써 경화 도막으로 할 수 있다. 이 활성 에너지선이란, 자외선, 전자선, α선, β선, γ선과 같은 전리 방사선을 말한다. 활성 에너지선으로서 자외선을 조사하여 경화 도막으로 하는 경우에는, 당해 중합성 수지 또는 활성 에너지선 경화형 조성물 중에 광중합 개시제(G)를 첨가하고, 경화성을 향상하는 것이 바람직하다. 또한, 필요하면 추가로 광증감제를 첨가하여, 경화성을 향상할 수도 있다. 한편, 전자선, α선, β선, γ선과 같은 전리 방사선을 사용하는 경우에는, 광중합 개시제나 광증감제를 사용하지 않아도 조속히 경화하므로, 특히 광중합 개시제(G)나 광증감제를 첨가할 필요는 없다.The polymerizable resin or active energy ray-curable composition of the present invention can be formed into a cured coating film by applying an active energy ray after being applied to a substrate. The active energy ray refers to ionizing radiation such as ultraviolet rays, electron beams, α rays, β rays, and γ rays. When irradiating with ultraviolet rays as an active energy ray to form a cured coating film, it is preferable to add a photopolymerization initiator (G) to the polymerizable resin or an active energy ray-curable composition, and to improve the curability. In addition, if necessary, a photosensitizer may be further added to improve curability. On the other hand, in the case of using ionizing radiation such as electron beam, α-ray, β-ray, or γ-ray, it is cured promptly without using a photopolymerization initiator or photosensitizer, so it is particularly necessary to add a photopolymerization initiator (G) or photosensitizer none.
상기 광중합 개시제(G)로서는, 분자 내 개열형 광중합 개시제 및 수소 인발형 광중합 개시제를 들 수 있다. 분자 내 개열형 광중합 개시제로서는, 예를 들면, 디에톡시아세토페논, 2-히드록시-2-메틸-1-페닐프로판-1-온, 벤질디메틸케탈, 1-(4-이소프로필페닐)-2-히드록시-2-메틸프로판-1-온, 4-(2-히드록시에톡시)페닐-(2-히드록시-2-프로필)케톤, 1-히드록시시클로헥실-페닐케톤, 2-메틸-2-모르폴리노(4-티오메틸페닐)프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르폴리노페닐)-부탄온 등의 아세토페논계 화합물; 벤조인, 벤조인메틸에테르, 벤조인이소프로필에테르 등의 벤조인류; 2,4,6-트리메틸벤조인디페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드 등의 아실포스핀옥사이드계 화합물; 벤질, 메틸페닐글리옥시에스테르 등을 들 수 있다.Examples of the photopolymerization initiator (G) include an intramolecular cleavage type photopolymerization initiator and a hydrogen drawing type photopolymerization initiator. As an intramolecular cleavage type photopolymerization initiator, for example, diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 1- (4-isopropylphenyl) -2 -Hydroxy-2-methylpropan-1-one, 4- (2-hydroxyethoxy) phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl-phenylketone, 2-methyl Acetophenone compounds such as -2-morpholino (4-thiomethylphenyl) propan-1-one and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone; Benzoins such as benzoin, benzoin methyl ether, and benzoin isopropyl ether; Acylphosphine oxide compounds such as 2,4,6-trimethylbenzoindiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide; And benzyl, methylphenylglycoxyester, and the like.
한편, 수소 인발형 광중합 개시제로서는, 예를 들면, 벤조페논, o-벤조일벤조산메틸-4-페닐벤조페논, 4,4'-디클로로벤조페논, 히드록시벤조페논, 4-벤조일-4'-메틸-디페닐설피드, 아크릴화벤조페논, 3,3',4,4'-테트라(t-부틸퍼옥시카르보닐)벤조페논, 3,3'-디메틸-4-메톡시벤조페논 등의 벤조페논계 화합물; 2-이소프로필티오잔톤, 2,4-디메틸티오잔톤, 2,4-디에틸티오잔톤, 2,4-디클로로티오잔톤 등의 티오잔톤계 화합물; 미힐러-케톤, 4,4'-디에틸아미노벤조페논 등의 아미노벤조페논계 화합물; 10-부틸-2-클로로아크리돈, 2-에틸안트라퀴논, 9,10-페난트렌퀴논, 캄포르퀴논 등을 들 수 있다.On the other hand, as a hydrogen drawing type photopolymerization initiator, for example, benzophenone, o-benzoylbenzoate methyl-4-phenylbenzophenone, 4,4'-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4'-methyl -Benzophene such as diphenyl sulfide, acrylated benzophenone, 3,3 ', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone, 3,3'-dimethyl-4-methoxybenzophenone Non-based compounds; Thioxanthone compounds such as 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone and 2,4-dichlorothioxanthone; Aminobenzophenone-based compounds such as Mihiler-ketone and 4,4'-diethylaminobenzophenone; And 10-butyl-2-chloroacridone, 2-ethylanthraquinone, 9,10-phenanthrenequinone, and camphorquinone.
상기의 광중합 개시제(G) 중에서도, 활성 에너지선 경화형 조성물 중의 상기 활성 에너지선 경화성 수지(E) 및 활성 에너지선 경화성 단량체(F)의 상용성이 뛰어난 점에서, 1-히드록시시클로헥실페닐케톤, 및 벤조페논이 바람직하고, 특히, 1-히드록시시클로헥실페닐케톤이 바람직하다. 이들의 광중합 개시제(G)는, 단독으로 사용할 수도, 2종 이상을 병용할 수도 있다.Among the photopolymerization initiators (G), 1-hydroxycyclohexylphenyl ketone, from the viewpoint of excellent compatibility between the active energy ray-curable resin (E) and the active energy ray-curable monomer (F) in the active energy ray-curable composition, And benzophenone is preferred, particularly 1-hydroxycyclohexylphenylketone. These photoinitiators (G) can be used alone or in combination of two or more.
또한, 상기 광증감제로서는, 예를 들면, 지방족 아민, 방향족 아민 등의 아민류, o-톨릴티오요소 등의 요소류, 나트륨디에틸디티오포스페이트, s-벤질이소티우로늄-p-톨루엔설포네이트 등의 황 화합물 등을 들 수 있다.Further, examples of the photosensitizer include amines such as aliphatic amines and aromatic amines, ureas such as o-tolylthiourea, sodium diethyldithiophosphate, and s-benzylisothiuronium-p-toluenesulfo And sulfur compounds such as nate.
이들의 광중합 개시제 및 광증감제의 사용량은, 활성 에너지선 경화성 조성물 중의 불휘발 성분 100질량부에 대하여, 각각 0.01∼20질량부가 바람직하고, 0.1∼15질량%가 보다 바람직하고, 0.3∼7질량부가 더 바람직하다.The amount of the photopolymerization initiator and photosensitizer used is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 15 parts by mass, and more preferably 0.3 to 7 parts by mass, relative to 100 parts by mass of the nonvolatile component in the active energy ray-curable composition. Addition is more preferred.
또한, 본 발명의 활성 에너지선 경화성 조성물은, 용도, 특성 등의 목적에 따라, 본 발명의 효과를 손상하지 않는 범위에서, 점도나 굴절률의 조정, 혹은, 도막의 색조의 조정이나 그 외의 도료성상이나 도막 물성의 조정을 목적으로 각종의 배합 재료, 예를 들면, 각종 유기 용제, 아크릴 수지, 페놀 수지, 폴리에스테르 수지, 폴리스티렌 수지, 우레탄 수지, 요소 수지, 멜라민 수지, 알키드 수지, 에폭시 수지, 폴리아미드 수지, 폴리카보네이트 수지, 석유 수지, 불소 수지 등의 각종 수지, PTFE(폴리테트라플루오로에틸렌), 폴리에틸렌, 폴리프로필렌, 카본, 산화티타늄, 알루미나, 구리, 실리카 미립자 등의 각종의 유기 또는 무기 입자, 중합 개시제, 중합 금지제, 대전 방지제, 소포제, 점도 조정제, 내광안정제, 내후안정제, 내열안정제, 산화 방지제, 방청제, 슬립제, 왁스, 매트 조정제, 이형제, 상용화제, 도전 조정제, 안료, 염료, 분산제, 분산 안정제, 실리콘계, 탄화수소계 계면 활성제 등을 병용할 수 있다.In addition, the active energy ray-curable composition of the present invention may adjust the viscosity or refractive index, or adjust the color tone of the coating film or other coating properties, within a range not impairing the effect of the present invention depending on the purpose of use, properties, and the like. For the purpose of adjusting the properties of the coating or coating, various compounding materials, for example, various organic solvents, acrylic resins, phenol resins, polyester resins, polystyrene resins, urethane resins, urea resins, melamine resins, alkyd resins, epoxy resins, poly Various organic or inorganic particles such as amide resin, polycarbonate resin, petroleum resin, fluorine resin, various resins, PTFE (polytetrafluoroethylene), polyethylene, polypropylene, carbon, titanium oxide, alumina, copper, and silica particles , Polymerization initiator, polymerization inhibitor, antistatic agent, antifoaming agent, viscosity modifier, light stabilizer, weathering stabilizer, heat stabilizer, antioxidant, rust inhibitor, Slip agents, waxes, matt adjusters, release agents, compatibilizers, conductive adjusters, pigments, dyes, dispersants, dispersion stabilizers, silicone-based, hydrocarbon-based surfactants, and the like can be used in combination.
상기의 각 배합 성분 중, 유기 용매는, 본 발명의 활성 에너지선 경화성 조성물의 용액 점도를 적의 조정함에 있어서 유용하며, 특히 박막 코팅을 행하기 위해서는, 막두께를 조정하는 것이 용이해진다. 여기에서 사용할 수 있는 유기 용매로서는, 예를 들면, 톨루엔, 자일렌 등의 방향족 탄화수소; 메탄올, 에탄올, 이소프로판올, t-부탄올 등의 알코올류; 아세트산에틸, 프로필렌글리콜모노메틸에테르아세테이트 등의 에스테르류; 메틸에틸케톤, 메틸이소부틸케톤, 시클로헥산온 등의 케톤류 등을 들 수 있다. 이들의 용제는, 단독으로 사용할 수도, 2종 이상을 병용할 수도 있다.Of the above-mentioned respective blending components, the organic solvent is useful for appropriately adjusting the solution viscosity of the active energy ray-curable composition of the present invention, and in particular, it is easy to adjust the film thickness for thin film coating. As an organic solvent which can be used here, For example, aromatic hydrocarbons, such as toluene and xylene; Alcohols such as methanol, ethanol, isopropanol, and t-butanol; Esters such as ethyl acetate and propylene glycol monomethyl ether acetate; And ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. These solvents may be used alone or in combination of two or more.
여기에서 유기 용매의 사용량은, 용도나 목적으로 하는 막두께나 점도에 따라 다르지만, 경화 성분의 전 질량에 대하여, 질량 기준으로, 0.5∼50배량의 범위인 것이 바람직하다.The amount of the organic solvent used here varies depending on the application and the intended film thickness and viscosity, but is preferably in the range of 0.5 to 50 times the mass based on the total mass of the cured component.
본 발명의 활성 에너지선 경화성 조성물을 경화시키는 활성 에너지선으로서는, 상기한 바와 같이, 자외선, 전자선, α선, β선, γ선과 같은 전리 방사선이지만, 구체적인 에너지원 또는 경화 장치로서는, 예를 들면, 살균등, 자외선용 형광등, 카본 아크, 제논 램프, 복사용 고압 수은등, 중압 또는 고압 수은등, 초고압 수은등, 무전극 램프, 메탈 할라이드 램프, 자연광 등을 광원으로 하는 자외선, 또는 주사형, 커튼형 전자선 가속기에 의한 전자선 등을 들 수 있다.As the active energy ray for curing the active energy ray-curable composition of the present invention, as described above, it is ionizing radiation such as ultraviolet rays, electron beams, α rays, β rays, and γ rays, but as specific energy sources or curing devices, for example, Sterilization lamp, fluorescent lamp for ultraviolet light, carbon arc, xenon lamp, high pressure mercury lamp for radiation, medium or high pressure mercury lamp, ultra high pressure mercury lamp, electrodeless lamp, metal halide lamp, ultraviolet light using natural light, etc., or scanning type, curtain electron beam accelerator And electron beams.
이들 중에서도 특히 자외선인 것이 바람직하고, 산소 등에 의한 경화 저해를 피하기 위해서, 질소 가스 등의 불활성 가스 분위기하에서, 자외선을 조사하는 것이 바람직하다. 또한, 필요에 따라 열을 에너지원으로서 병용하고, 자외선으로 경화한 후, 열처리를 행해도 된다.Among these, ultraviolet rays are particularly preferable, and ultraviolet rays are preferably irradiated under an inert gas atmosphere such as nitrogen gas in order to avoid curing inhibition by oxygen or the like. Moreover, you may use heat as an energy source as needed, and after hardening with ultraviolet rays, you may heat-process.
본 발명의 활성 에너지선 경화성 조성물의 도공 방법은 용도에 따라 다르지만, 예를 들면, 그라비아 코터, 롤 코터, 콤마 코터, 나이프 코터, 에어나이프 코터, 커튼 코터, 키스 코터, 샤워 코터, 호일러 코터, 스핀 코터, 딥핑, 스크린 인쇄, 스프레이, 애플리케이터, 바 코터 등을 사용한 도포 방법, 혹은 각종 금형을 사용한 성형 방법 등을 들 수 있다.The coating method of the active energy ray-curable composition of the present invention varies depending on the application, but, for example, gravure coater, roll coater, comma coater, knife coater, air knife coater, curtain coater, kiss coater, shower coater, foil coater, And a coating method using a spin coater, dipping, screen printing, spraying, applicator, bar coater, or the like, or a molding method using various molds.
본 발명의 중합성 수지의 경화 도막은, 내찰상성을 가지므로, 물품의 표면에 도포·경화함으로써, 물품의 표면에 내찰상성을 부여할 수 있다. 또한, 본 발명의 중합성 수지는, 도재에 첨가함으로써, 그 도재에 레벨링성을 부여할 수도 있기 때문에, 본 발명의 활성 에너지선 경화료 조성물은, 높은 레벨링성을 갖는다. 또한, 본 발명의 중합성 수지의 경화 도막은 활성이 뛰어나므로 터치 패널 등 터치 조작이 양호해지는 효과도 갖는, 또한, 본 발명의 중합성 수지의 경화 도막은 방오성도 뛰어나다.Since the cured coating film of the polymerizable resin of the present invention has scratch resistance, it is possible to impart scratch resistance to the surface of the article by coating and curing the surface of the article. Moreover, since the leveling property can also be provided to the porcelain by adding the polymerizable resin of this invention to a porcelain, the active energy ray hardener composition of this invention has high leveling property. Moreover, since the cured coating film of the polymerizable resin of this invention is excellent in activity, it also has the effect of favorable touch operation, such as a touch panel. Moreover, the cured coating film of the polymerizable resin of this invention is also excellent in antifouling property.
본 발명의 중합성 수지 또는 활성 에너지선 경화성 조성물의 경화 도막은, 뛰어난 내찰상성 등을 가지므로, 물품의 표면에 도포·경화함으로써, 물품의 표면에 내찰상성 등을 부여할 수 있다.The cured coating film of the polymerizable resin or the active energy ray-curable composition of the present invention has excellent scratch resistance and the like, so that it is possible to impart scratch resistance and the like to the surface of the article by applying and curing the surface of the article.
본 발명의 중합성 수지 또는 활성 에너지선 경화성 조성물을 사용하여 흠집을 방지할 수 있는 물품으로서는, TAC 필름 등의 액정 디스플레이(LCD)의 편광판용 필름; 플라스마 디스플레이(PDP), 유기 EL 디스플레이 등의 각종 디스플레이 화면; 터치 패널; 휴대전화 등의 전자 단말의 케이싱 또는 화면; 액정 디스플레이용 컬러 필터(이하, 「CF」라고 함)용 투명 보호막; 액정 TFT 어레이용 유기 절연막; 전자 회로 형성용 잉크젯 잉크; CD, DVD, 블루레이 디스크 등의 광학 기록 매체; 인서트 몰드(IMD, IMF)용 전사 필름; 카피기, 프린터 등의 OA 기기용 고무 롤러; 카피기, 스캐너 등의 OA 기기의 판독부의 유리면; 카메라, 비디오 카메라, 안경 등의 광학 렌즈; 손목 시계 등의 시계의 방풍, 유리면; 자동차, 철도차량 등의 각종 차량의 윈도우; 태양 전지용 커버 유리 또는 필름; 화장판 등의 각종 건재; 주택의 창문 유리; 가구 등의 목공 재료, 인공·합성 피혁, 가전의 케이싱 등의 각종 플라스틱 성형품, FRP 욕조 등을 들 수 있다. 이들의 물품 표면에 본 발명의 활성 에너지선 경화성 조성물을 도포하고, 자외선 등의 활성 에너지선을 조사하여 경화 도막을 형성함으로써, 물품 표면에 내찰상성을 부여할 수 있다.Examples of the article that can prevent scratches by using the polymerizable resin or the active energy ray-curable composition of the present invention include films for polarizing plates of liquid crystal displays (LCDs) such as TAC films; Various display screens such as plasma displays (PDPs) and organic EL displays; Touch panel; A casing or screen of an electronic terminal such as a mobile phone; A transparent protective film for a color filter for a liquid crystal display (hereinafter referred to as "CF"); Organic insulating film for liquid crystal TFT array; Inkjet ink for electronic circuit formation; Optical recording media such as CD, DVD, and Blu-ray Disc; Transfer film for insert mold (IMD, IMF); Rubber rollers for OA machines such as copy machines and printers; A glass surface of the reading portion of the OA device such as a copy machine or a scanner; Optical lenses such as cameras, video cameras, and glasses; Windshields of watches, such as wrist watches, glass surfaces; Windows of various vehicles such as automobiles and railway vehicles; Cover glass or film for solar cells; Various building materials such as decorative plates; Window glass in houses; And woodworking materials such as furniture, artificial / synthetic leather, various plastic molded products such as casings for home appliances, and FRP baths. By applying the active energy ray-curable composition of the present invention to these article surfaces and irradiating active energy rays such as ultraviolet rays to form a cured coating film, scratch resistance can be imparted to the article surface.
또한, 본 발명의 중합성 수지를 첨가하여 내찰상성을 부여할 수 있는 도재로서는, TAC 필름 등의 LCD의 편광판용 필름의 하드 코팅재, 안티글레어(AG : 방현) 코팅재 또는 반사 방지(LR) 코팅재; 플라스마 디스플레이(PDP), 유기 EL 디스플레이 등의 각종 디스플레이 화면용 하드 코팅재; 터치 패널용 하드 코팅재; CF에 사용되는 RGB의 각 화소를 형성하기 위한 컬러 레지스트, 인쇄 잉크, 잉크젯 잉크 또는 도료; CF의 블랙 매트릭스용의 블랙 레지스트, 인쇄 잉크, 잉크젯 잉크 또는 도료; 플라스마 디스플레이(PDP), 유기 EL 디스플레이 등의 화소 격벽용 수지 조성물; 휴대전화 등의 전자 단말 케이싱용 도료 또는 하드 코팅재; 휴대전화의 화면용 하드 코팅재; CF 표면을 보호하는 투명 보호막용 도료; 액정 TFT 어레이의 유기 절연막용 도료; 전자 회로 형성용 잉크젯 잉크; CD, DVD, 블루레이 디스크 등의 광학 기록 매체용 하드 코팅재; 인서트 몰드(IMD, IMF)용 전사 필름용 하드 코팅재; 카피기, 프린터 등의 OA 기기용 고무 롤러용 코팅재; 카피기, 스캐너 등의 OA 기기의 판독부의 유리용 코팅재; 카메라, 비디오 카메라, 안경 등의 광학 렌즈용 코팅재; 손목 시계 등의 시계의 방풍, 유리용 코팅재; 자동차, 철도차량 등의 각종 차량의 윈도우용 코팅재; 태양 전지용 커버 유리 또는 필름의 반사 방지막용 도료; 화장판 등의 각종 건재용 인쇄 잉크 또는 도료; 주택의 창문 유리용 코팅재; 가구 등의 목공용 도료; 인공·합성 피혁용 코팅재; 가전의 케이싱 등의 각종 플라스틱 성형품용 도료 또는 코팅재; FRP 욕조용 도료 또는 코팅재 등을 들 수 있다.Further, examples of the porcelain that can impart abrasion resistance by adding the polymerizable resin of the present invention include a hard coating material of an LCD polarizing plate film such as a TAC film, an anti-glare (AG: anti-glare) coating material, or an anti-reflective (LR) coating material; Hard coating materials for various display screens such as plasma displays (PDPs) and organic EL displays; Hard coating material for touch panels; Color resist, printing ink, inkjet ink or paint for forming each pixel of RGB used in CF; CF black resist for black matrix, printing ink, inkjet ink or paint; Resin compositions for pixel partition walls such as plasma displays (PDPs) and organic EL displays; Paints or hard coating materials for electronic terminal casings such as mobile phones; A hard coating material for a screen of a mobile phone; Transparent protective coating for protecting the CF surface; Coatings for organic insulating films of liquid crystal TFT arrays; Inkjet ink for electronic circuit formation; Hard coating materials for optical recording media such as CD, DVD, and Blu-ray discs; Hard coating material for transfer films for insert molds (IMD, IMF); Coating materials for rubber rollers for OA devices such as copy machines and printers; A coating material for glass of the reading portion of an OA device such as a copy machine or a scanner; Coating materials for optical lenses such as cameras, video cameras, and glasses; Windshields of watches, such as wrist watches, coating materials for glass; Coating materials for windows of various vehicles such as automobiles and railway vehicles; Paint for an antireflection film of a solar cell cover glass or film; Printing ink or paints for various building materials such as decorative plates; Coatings for window glass in houses; Woodworking paints such as furniture; Artificial and synthetic leather coatings; Paints or coating materials for various plastic molded products such as casings for home appliances; And paints or coating materials for FRP baths.
또한, 본 발명의 중합성 수지 또는 활성 에너지선 경화성 조성물을 사용하여 내찰상성(내스크래치성)을 부여할 수 있는 물품으로서는, LCD의 백라이트 부재인 프리즘 시트 또는 확산 시트 등을 들 수 있다. 또한, 프리즘 시트 또는 확산 시트용 코팅재에 본 발명의 중합성 수지를 첨가함으로써, 당해 코팅재의 레벨링성을 향상함과 함께, 코팅재의 도막에 내찰상성(내스크래치성) 및 방오성을 부여할 수 있다.Moreover, as an article which can provide abrasion resistance (scratch resistance) using the polymerizable resin of this invention or an active energy ray curable composition, the prism sheet or diffusion sheet etc. which are backlight members of LCD are mentioned. In addition, by adding the polymerizable resin of the present invention to a coating material for a prism sheet or a diffusion sheet, the leveling property of the coating material is improved, and scratch resistance (scratch resistance) and antifouling property can be imparted to the coating film of the coating material.
또한, 본 발명의 중합성 수지의 경화 도막은 저굴절률이기 때문에, LCD 등의 각종 디스플레이 표면에의 형광등 등의 비침을 방지하는 반사 방지층 중의 저굴절률층용 도재로서도 사용할 수 있다. 또한, 반사 방지층용의 도재, 특히 반사 방지층 중의 저굴절률층용 도재에 본 발명의 함불소 경화성 수지를 첨가함으로써, 도막의 저굴절률을 유지하면서, 도막 표면에 내찰상성을 부여할 수도 있다.In addition, since the cured coating film of the polymerizable resin of the present invention has a low refractive index, it can also be used as a ceramic material for a low refractive index layer in an antireflection layer that prevents reflection of fluorescent lamps and the like on various display surfaces such as LCDs. Further, by adding the fluorine-containing curable resin of the present invention to a ceramic material for an antireflection layer, particularly a low refractive index layer in an antireflection layer, scratch resistance can be imparted to the surface of the coating film while maintaining the low refractive index of the coating film.
또한, 본 발명의 중합성 수지 또는 활성 에너지선 경화성 조성물을 사용할 수 있는 그 외의 용도로서, 광파이버 클래드재, 도파로, 액정 패널의 봉지재, 각종 광학용 씰재, 광학용 접착제 등을 들 수 있다.Moreover, as other uses which can use the polymerizable resin or active energy ray curable composition of this invention, the optical fiber cladding material, a waveguide, the sealing material of a liquid crystal panel, various optical sealing materials, optical adhesive etc. are mentioned.
특히, LCD용 편광판의 보호 필름용 코팅재 용도 중, 안티글레어 코팅재로서 본 발명의 활성 에너지선 경화성 조성물을 사용하는 경우, 실리카 미립자, 아크릴 수지 미립자, 폴리스티렌 수지 미립자 등의 무기 또는 유기 미립자를, 본 발명의 활성 에너지선 경화성 조성물 중의 경화 성분의 전 질량의 0.1∼0.5배량이 되는 비율로 배합함으로써 방현성이 뛰어난 것이 되기 때문에 바람직하다.Particularly, among the use of the coating material for a protective film of a polarizing plate for LCD, when the active energy ray-curable composition of the present invention is used as an anti-glare coating material, inorganic or organic fine particles such as silica fine particles, acrylic resin fine particles, and polystyrene resin fine particles can be used. It is preferable because it is excellent in anti-glare property by blending at a ratio of 0.1 to 0.5 times the total mass of the curing component in the active energy ray-curable composition.
또한, 본 발명의 중합성 수지 또는 활성 에너지선 경화성 조성물을, LCD용 편광판의 보호 필름용 안티글레어 코팅재에 사용하는 경우, 코팅재를 경화시키기 전에 요철의 표면 형상의 금형에 접촉시킨 후, 금형과 반대측으로부터 활성 에너지선을 조사하여 경화하고, 코팅층의 표면을 엠보싱 가공하여 방현성을 부여하는 전사법에도 적용할 수 있다.In addition, when the polymerizable resin or active energy ray-curable composition of the present invention is used for an anti-glare coating material for a protective film of a polarizing plate for LCD, after contacting the mold having a surface shape of irregularities before curing the coating material, the opposite side to the mold It can also be applied to a transfer method that hardens by irradiating with an active energy ray from and embossing the surface of the coating layer to impart anti-glare properties.
[실시예][Example]
이하에 본 발명을 구체적인 실시예를 들어서 보다 상세하게 설명한다. 예 중, 「부」, 「%」는 특히 언급이 없는 한 질량 기준이다. 또, 얻어진 중합성 수지의 IR 스펙트럼, 13C-NMR 스펙트럼 및 GPC의 측정 조건은 하기와 같다.Hereinafter, the present invention will be described in more detail with reference to specific examples. In the examples, "parts" and "%" are based on mass unless otherwise specified. Moreover, the IR spectrum, 13 C-NMR spectrum, and GPC measurement conditions of the obtained polymerizable resin are as follows.
[IR 스펙트럼 측정 조건][IR spectrum measurement conditions]
장치 : 써모일렉트론 가부시키가이샤제 「NICOLET380」Apparatus: `` NICOLET380 '' manufactured by Thermoelectron Corporation
측정 방법 : KBr법Measurement method: KBr method
[13C-NMR 스펙트럼 측정 조건][ 13 C-NMR spectrum measurement conditions]
장치 : 니혼덴시 가부시키가이샤제 「JNM-ECA500」Apparatus: "JNM-ECA500" manufactured by Nippon Denshi Co., Ltd.
용매 : DMSO-d6 Solvent: DMSO-d 6
[GPC 측정 조건][GPC measurement conditions]
측정 장치 : 도소 가부시키가이샤제 「HLC-8220 GPC」,Measuring device: `` HLC-8220 GPC '' manufactured by Tosoh Corporation,
칼럼 : 도소 가부시키가이샤제 가드 칼럼 「HHR-H」(6.0㎜I.D.×4㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)+도소 가부시키가이샤제 「TSK-GEL GMHHR-N」(7.8㎜I.D.×30㎝)Column: Guard column made by Tosoh Corporation (HHR-H) (6.0 mmID × 4 cm) + Tosoh Corporation manufactured by “TSK-GEL GMHHR-N” (7.8 mm ID × 30 cm) + manufactured by Tosoh Corporation "TSK-GEL GMHHR-N" (7.8 mm ID x 30 cm) + manufactured by Tosoh Corporation "TSK-GEL GMHHR-N" (7.8 mm ID x 30 cm) + manufactured by Tosoh Corporation "TSK-GEL GMHHR- N '' (7.8 mm ID x 30 cm)
검출기 : ELSD(올테크재팬 가부시키가이샤제 「ELSD2000」)Detector: ELSD ("ELSD2000" manufactured by All Tech Japan Co., Ltd.)
데이터 처리 : 도소 가부시키가이샤제 「GPC-8020 모델Ⅱ 데이터 해석 버전4.30」Data processing: `` GPC-8020 Model II data analysis version 4.30 '' manufactured by Tosoh Corporation
측정 조건 : 칼럼 온도 40℃Measurement conditions:
전개 용매 테트라히드로퓨란(THF)Development solvent tetrahydrofuran (THF)
유속 1.0㎖/분Flow rate 1.0 ml / min
시료 : 수지 고형분 환산으로 1.0질량%의 테트라히드로퓨란 용액을 마이크로 필터로 여과한 것(5㎕).Sample: A 1.0% by mass tetrahydrofuran solution was filtered through a micro filter in terms of resin solid content (5 μl).
표준 시료 : 상기 「GPC-8020 모델Ⅱ 데이터 해석 버전4.30」의 측정 매뉴얼에 준거하여, 분자량이 기지의 하기의 단분산 폴리스티렌을 사용했다.Standard sample: In accordance with the measurement manual of "GPC-8020 model II data analysis version 4.30", the following monodisperse polystyrene having a known molecular weight was used.
(단분산 폴리스티렌)(Monodisperse polystyrene)
도소 가부시키가이샤제 「A-500」"A-500" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「A-1000」"A-1000" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「A-2500」"A-2500" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「A-5000」"A-5000" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-1」"F-1" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-2」"F-2" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-4」"F-4" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-10」"F-10" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-20」"F-20" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-40」"F-40" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-80」"F-80" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-128」"F-128" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-288」"F-288" manufactured by Tosoh Corporation
도소 가부시키가이샤제 「F-550」"F-550" manufactured by Tosoh Corporation
실시예1(중합성 수지의 조제)Example 1 (Preparation of polymerizable resin)
교반 장치, 온도계, 냉각관을 구비한 유리 플라스크에, 용매로서 이소프로필에테르 26.4g과, 하기 식(a-1)으로 표시되는 편말단에 수산기를 갖는 실리콘 화합물을 25.2g과, 촉매로서 트리에틸아민 0.66g을 투입하고, 플라스크 내 온도를 5℃로 유지한 채, 30분간 교반했다.In a glass flask equipped with a stirring device, a thermometer, and a cooling tube, 26.4 g of isopropyl ether as a solvent, 25.2 g of a silicone compound having a hydroxyl group at one end represented by the following formula (a-1), and triethyl as a catalyst 0.66 g of amine was added and stirred for 30 minutes while maintaining the temperature in the flask at 5 ° C.
(식 중, n은 평균 65이다)(In the formula, n is 65 on average)
이어서, 2-브로모이소부티르산브로마이드 1.50g을 투입하여 3시간 교반하고, 40℃로 승온하여 8시간 교반했다. 반응 종료 후, 이온 교환수 80g을 혼합하여 교반하고 나서 정치하고 수층을 분리시켜서 제거하는 방법에 의한 세정을 3회 반복했다. 이어서, 탈수제로서 황산마그네슘 8g을 첨가하여 1일간 정치함으로써 완전히 탈수한 후, 탈수제를 여별(濾別)했다. 그 후, 감압하에서 용매를 유거(留去)함으로써, 하기 식(A-4)으로 표시되는 본 발명에서 사용하는 라디칼 생성능을 갖는 관능기와 분자량 2,000 이상의 실리콘쇄를 1개 포함하는 화합물을 얻었다.Subsequently, 1.50 g of 2-bromoisobutyric acid bromide was added, stirred for 3 hours, heated to 40 ° C., and stirred for 8 hours. After the completion of the reaction, 80 g of ion-exchanged water was mixed and stirred, then left standing, and washing by a method of separating and removing the aqueous layer was repeated three times. Subsequently, 8 g of magnesium sulfate was added as a dehydrating agent and allowed to stand for 1 day to complete dehydration, followed by filtration of the dehydrating agent. Then, the solvent was distilled off under reduced pressure to obtain a compound containing one functional group having a radical generating ability and a silicone chain having a molecular weight of 2,000 or more, used in the present invention represented by the following formula (A-4).
(식 중, n은 평균 65이다)(In the formula, n is 65 on average)
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 14.2g, 메틸에틸케톤 14.2g, 트리데카플루오로헥실에틸메타크릴레이트 6.0g, 2-히드록시에틸메타크릴레이트 4.3g을 투입하고, 질소 기류하에서 교반하면서 35℃로 승온하여 2시간 교반했다. 이어서, 염화제1구리 0.335g, 2,2-비피리딜 0.937g을 투입하고, 60℃로 승온하여 1시간 교반했다. 다음으로, 상기 화합물(A-4) 15.04g을 이소프로필알코올 5.0g과 메틸에틸케톤 5.0g에 용해시켜서 더하고, 플라스크 내 온도를 60℃로 유지한 채 4시간 교반하고, 그 후 80℃로 승온하여 7시간 교반했다. 이 반응 혼합물을 메탄올에 녹이고, 물/메탄올로 재침전 정제하여 랜덤 공중합체(P-1)를 얻었다.Subsequently, a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device were provided, and a nitrogen-substituted glass flask was added with 14.2 g of isopropyl alcohol, 14.2 g of methyl ethyl ketone, and 6.0 g of tridecafluorohexyl ethyl methacrylate. , 4.3 g of 2-hydroxyethyl methacrylate was added, and the mixture was heated to 35 ° C. while stirring under a stream of nitrogen and stirred for 2 hours. Subsequently, 0.335 g of cuprous chloride and 0.937 g of 2,2-bipyridyl were added, heated to 60 ° C., and stirred for 1 hour. Next, 15.04 g of the compound (A-4) was dissolved in 5.0 g of isopropyl alcohol and 5.0 g of methyl ethyl ketone, added, stirred for 4 hours while maintaining the temperature in the flask at 60 ° C., and then heated to 80 ° C. And stirred for 7 hours. The reaction mixture was dissolved in methanol and reprecipitated and purified with water / methanol to obtain a random copolymer (P-1).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(P-1) 50.0g, 메틸에틸케톤 50.0g과, 중합 금지제로서 p-메톡시페놀 0.1g, 우레탄화 촉매로서 옥틸산주석 0.03g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 15.6g을 1시간으로 적하했다. 적하 종료 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 10시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸에틸케톤 15.6g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(1)를 얻었다.Subsequently, 50.0 g of the obtained copolymer (P-1), 50.0 g of methyl ethyl ketone, and p-methoxyphenol as a polymerization inhibitor were placed in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device. 0.1 g, 0.03 g of octylic acid tin was added as a urethanization catalyst, stirring was started under an air stream, and 15.6 g of 2-acryloyloxyethyl isocyanate was added dropwise over 1 hour while maintaining at 60 ° C. After completion of the dropwise addition, the mixture was stirred at 60 ° C for 1 hour, then heated to 80 ° C and stirred for 10 hours to confirm the disappearance of the isocyanate group by IR spectrum measurement, and by adding 15.6 g of methyl ethyl ketone to have an active energy ray-curable group. The polymerizable resin (1) of the present invention was obtained.
얻어진 중합성 수지(1)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 11,000, 중량 평균 분자량 12,000, 라디칼 중합성 불포화기 당량은 904g/eq.이었다. 또, 중합성 수지(1)의 IR 스펙트럼의 차트도를 도 1에, 13C-NMR 스펙트럼의 차트도를 도 2에, GPC의 차트도를 도 3에 나타낸다.As a result of measuring the molecular weight of the obtained polymerizable resin (1) by GPC (polystyrene equivalent molecular weight), the number average molecular weight 11,000, the weight average molecular weight 12,000, and the radically polymerizable unsaturated group equivalent were 904 g / eq. Moreover, the chart figure of the IR spectrum of the polymerizable resin (1) is shown in FIG. 1, the chart figure of the 13 C-NMR spectrum is shown in FIG. 2, and the chart figure of the GPC is shown in FIG.
실시예2(동상(同上))Example 2 (status)
질소 도입관, 교반 장치, 온도계, 냉각관을 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 30.70g, 메틸에틸케톤 30.70g, 트리데카플루오로헥실에틸메타크릴레이트 10.93g, 메톡시벤젠 0.5470g을 질소 기류하에서 교반하면서 25℃에서 1시간 교반했다. 이어서, 염화제1구리 0.4510g, 브롬화제2구리 0.1130g, 2,2-비피리딜 1.581g을 투입하고, 30분 교반했다. 60℃로 승온한 후에, 상기 화합물(A-4) 30g을 더해, 플라스크 내 온도를 60℃로 유지한 채 4시간 교반했다. 그 후, 2-히드록시에틸메타크릴레이트 6.585g을 투입하고, 1시간 교반했다. 그 후 75℃로 승온하여 31시간 교반했다. 공기하에서 85% 인산 수용액 1.167g을 더해서 2시간 교반하고, 석출한 고형분을 여별했다. 이온 교환 수지에 의한 촉매의 제거를 행하고, 이온 교환 수지를 여별하여 블록 공중합체(Q1-1)를 얻었다.Equipped with a nitrogen introduction tube, a stirring device, a thermometer, and a cooling tube, in a nitrogen-substituted glass flask, isopropyl alcohol 30.70 g, methyl ethyl ketone 30.70 g, tridecafluorohexyl ethyl methacrylate 10.93 g, methoxybenzene 0.5470 It stirred at 25 degreeC for 1 hour, stirring g under nitrogen stream. Subsequently, 0.4510 g of cuprous chloride, 0.1130 g of copper bromide, and 1.581 g of 2,2-bipyridyl were added and stirred for 30 minutes. After raising the temperature to 60 ° C, 30 g of the compound (A-4) was added and stirred for 4 hours while maintaining the temperature in the flask at 60 ° C. Thereafter, 6.585 g of 2-hydroxyethyl methacrylate was added and stirred for 1 hour. Then, it heated up to 75 degreeC and stirred for 31 hours. 1.167 g of an aqueous 85% phosphoric acid solution was added under air, stirred for 2 hours, and the precipitated solid was separated. The catalyst was removed with an ion exchange resin, and the ion exchange resin was separated to obtain a block copolymer (Q1-1).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(Q1-1) 32.54g, 메틸이소부틸케톤 36.70g, 중합 금지제로서 p-메톡시페놀 0.0149질량부, 디부틸히드록시톨루엔 0.1116g 및 우레탄화 촉매로서 옥틸산주석 0.0111g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 4.67g을 더했다. 그 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 4시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸이소부틸케톤 50.46g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(2)를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(2)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 10,500, 중량 평균 분자량 12,000이었다. 또, 중합성 수지(2)의 IR 스펙트럼의 차트도를 도 4에, 1H-NMR 스펙트럼의 차트도(전체도)를 도 5에, 1H-NMR 스펙트럼의 차트도(25배의 확대도)를 도 6에, 13C-NMR 스펙트럼의 차트도(전체도)를 도 7에, 13C-NMR 스펙트럼의 차트도(25배의 확대도)를 도 8에, 19F-NMR 스펙트럼의 차트도(전체도)를 도 9에, GPC의 차트도를 도 10에 각각 나타낸다.Subsequently, in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device, 32.54 g of the obtained copolymer (Q1-1), 36.70 g of methyl isobutyl ketone, p-methoxyphenol as a polymerization inhibitor 0.0149 parts by mass, 0.1116 g of dibutylhydroxytoluene, and 0.0111 g of tin octylate as a urethanization catalyst were added, stirring was started under an air stream, and 4.67 g of 2-acryloyloxyethyl isocyanate was maintained while maintaining 60 ° C. More. Thereafter, the mixture was stirred at 60 ° C for 1 hour, then heated to 80 ° C and stirred for 4 hours, confirming the disappearance of the isocyanate group by IR spectrum measurement, and adding 50.46 g of methyl isobutyl ketone to have an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin (2) of the present invention was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (2) by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 10,500 and the weight average molecular weight was 12,000. In addition, a chart diagram of the IR spectrum of the
실시예3(동상)Example 3 (status)
질소 도입관, 교반 장치, 온도계, 냉각관을 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 54.88g, 메틸에틸케톤 54.88g, 2-히드록시에틸메타크릴레이트 13.17g, 메톡시벤젠 1.094g을 질소 기류하에서 교반하면서 25℃에서 1시간 교반했다. 이어서, 염화제1구리 0.9017g, 브롬화제2구리 0.2261g, 2,2-비피리딜 3.162g을 투입하고, 30분 교반했다. 60℃로 승온한 후에, 상기 화합물(A-4) 60g을 더해, 플라스크 내 온도를 60℃로 유지한 채 3시간 교반했다. 그 후, 트리데카플루오로헥실에틸메타크릴레이트 21.87g을 투입하고, 1시간 교반했다. 그 후 75℃로 승온하여 37.5시간 교반했다. 공기하에서 85% 인산 수용액 2.334g을 더해서 2시간 교반하고, 석출한 고형분을 여별했다. 이온 교환 수지에 의한 촉매의 제거를 행하고, 이온 교환 수지를 여별하여 블록 공중합체(Q2-1)를 얻었다.Equipped with a nitrogen introduction tube, a stirring device, a thermometer, and a cooling tube, in a nitrogen-substituted glass flask, isopropyl alcohol 54.88 g, methyl ethyl ketone 54.88 g, 2-hydroxyethyl methacrylate 13.17 g, methoxybenzene 1.094 g The mixture was stirred at 25 ° C for 1 hour while stirring under a nitrogen stream. Subsequently, 0.9017 g of cuprous chloride, 0.2261 g of copper bromide, and 3.162 g of 2,2-bipyridyl were added and stirred for 30 minutes. After raising the temperature to 60 ° C, 60 g of the compound (A-4) was added and stirred for 3 hours while maintaining the temperature in the flask at 60 ° C. Thereafter, 21.87 g of tridecafluorohexyl ethyl methacrylate was added and stirred for 1 hour. Then, it heated up to 75 degreeC and stirred for 37.5 hours. 2.334 g of 85% aqueous phosphoric acid solution was added under air, stirred for 2 hours, and the precipitated solid was separated. The catalyst was removed with an ion exchange resin, and the ion exchange resin was separated to obtain a block copolymer (Q2-1).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(Q2-1) 68.15g, 메틸이소부틸케톤 51.47g, 중합 금지제로서 p-메톡시페놀 0.0311질량부, 디부틸히드록시톨루엔 0.2335g 및 우레탄화 촉매로서 옥틸산주석 0.0234g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 9.69g을 더했다. 그 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 4시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸이소부틸케톤 86.00g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(3)를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(3)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 10,100, 중량 평균 분자량 14,000이었다.Subsequently, 68.15 g of the obtained copolymer (Q2-1), 51.47 g of methyl isobutyl ketone, 51.47 g of methyl isobutyl ketone, and p-methoxyphenol as a polymerization inhibitor were provided in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device. 0.0311 parts by mass, 0.2335 g of dibutylhydroxytoluene, and 0.0234 g of tin octylate as a urethanization catalyst were added, stirring was started under air flow, and while maintaining 60 ° C., 9.69 g of 2-acryloyloxyethyl isocyanate was added. More. Thereafter, the mixture was stirred at 60 ° C for 1 hour, then heated to 80 ° C and stirred for 4 hours, confirming the disappearance of the isocyanate group by IR spectrum measurement, and adding 86.00 g of methyl isobutyl ketone to have an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin (3) of the present invention was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (3) by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 10,100 and the weight average molecular weight was 14,000.
실시예4(동상)Example 4 (status)
질소 도입관, 교반 장치, 온도계, 냉각관을 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 32.20g, 메틸에틸케톤 32.20g, 트리데카플루오로헥실에틸메타크릴레이트 12.97g, 메톡시벤젠 0.6480g을 질소 기류하에서 교반하면서 25℃에서 1시간 교반했다. 이어서, 염화제1구리 0.5350g, 브롬화제2구리 0.1370g, 2,2-비피리딜 1.874g을 투입하고, 30분 교반했다. 60℃로 승온한 후에, 상기 화합물(A-4) 30.06g을 더해, 플라스크 내 온도를 60℃로 유지한 채 4.5시간 교반했다. 그 후, 2-히드록시에틸메타크릴레이트 3.900g을 투입하고, 1시간 교반했다. 그 후 75℃로 승온하여 31시간 교반했다. 공기하에서 36% 염산 1.370g을 더해서 2시간 교반하고, 석출한 고형분을 여별했다. 이온 교환 수지에 의한 촉매의 제거를 행하고, 이온 교환 수지를 여별하여 블록 공중합체(Q1-2)를 얻었다.Equipped with a nitrogen introduction tube, a stirring device, a thermometer, and a cooling tube, in a nitrogen-substituted glass flask, isopropyl alcohol 32.20 g, methyl ethyl ketone 32.20 g, tridecafluorohexyl ethyl methacrylate 12.97 g, methoxybenzene 0.6480 It stirred at 25 degreeC for 1 hour, stirring g under nitrogen stream. Subsequently, 0.5350 g of cuprous chloride, 0.1370 g of copper bromide, and 1.874 g of 2,2-bipyridyl were added and stirred for 30 minutes. After raising the temperature to 60 ° C, 30.06 g of the compound (A-4) was added and stirred for 4.5 hours while maintaining the temperature in the flask at 60 ° C. Then, 3.900 g of 2-hydroxyethyl methacrylate was added and stirred for 1 hour. Then, it heated up to 75 degreeC and stirred for 31 hours. 1.370 g of 36% hydrochloric acid was added under air, stirred for 2 hours, and the precipitated solid was separated. The catalyst was removed with an ion exchange resin, and the ion exchange resin was separated to obtain a block copolymer (Q1-2).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(Q1-2) 31.61g, 메틸이소부틸케톤 19.16g, 중합 금지제로서 p-메톡시페놀 0.0137질량부, 디부틸히드록시톨루엔 0.1025g 및 우레탄화 촉매로서 옥틸산주석 0.0103g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 2.56g을 더했다. 그 후, 60℃에서 2시간 교반한 후, 80℃로 승온하여 3시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸이소부틸케톤 56.44g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(4)를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(4)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 8,700, 중량 평균 분자량 10,000이었다.Subsequently, in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device, 31.61 g of the obtained copolymer (Q1-2), 19.16 g of methyl isobutyl ketone, p-methoxyphenol as a polymerization inhibitor 0.0137 parts by mass, 0.1025 g of dibutylhydroxytoluene and 0.0103 g of tin octylate as a urethanization catalyst were added, stirring was started under air flow, and while maintaining 60 ° C, 2.56 g of 2-acryloyloxyethyl isocyanate was added. More. Thereafter, the mixture was stirred at 60 ° C for 2 hours, then heated to 80 ° C and stirred for 3 hours, confirming the disappearance of the isocyanate group by IR spectrum measurement, and adding 56.44 g of methyl isobutyl ketone to have an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin (4) of the present invention was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (4) by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 8,700 and the weight average molecular weight was 10,000.
실시예5(동상)Example 5 (status)
질소 도입관, 교반 장치, 온도계, 냉각관을 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 30.28g, 메틸에틸케톤 30.28g, 트리데카플루오로헥실에틸메타크릴레이트 10.37g, 메톡시벤젠 0.6480g을 질소 기류하에서 교반하면서 25℃에서 1시간 교반했다. 이어서, 염화제1구리 0.5350g, 브롬화제2구리 0.1370g, 2,2-비피리딜 1.874g을 투입하고, 30분 교반했다. 60℃로 승온한 후에, 상기 화합물(A-4) 30.00g을 더해, 플라스크 내 온도를 60℃로 유지한 채 4시간 교반했다. 그 후, 2-히드록시에틸메타크릴레이트 9.37g을 투입하고, 1시간 교반했다. 그 후 75℃로 승온하여 30시간 교반했다. 공기하에서 85% 인산 1.383g을 더해서 2시간 교반하고, 석출한 고형분을 여별했다. 이온 교환 수지에 의한 촉매의 제거를 행하고, 이온 교환 수지를 여별하여 블록 공중합체(Q1-3)를 얻었다.Equipped with a nitrogen introduction tube, a stirring device, a thermometer, and a cooling tube, in a nitrogen-substituted glass flask, isopropyl alcohol 30.28 g, methyl ethyl ketone 30.28 g, tridecafluorohexyl ethyl methacrylate 10.37 g, methoxybenzene 0.6480 It stirred at 25 degreeC for 1 hour, stirring g under nitrogen stream. Subsequently, 0.5350 g of cuprous chloride, 0.1370 g of copper bromide, and 1.874 g of 2,2-bipyridyl were added and stirred for 30 minutes. After raising the temperature to 60 ° C, 30.00 g of the compound (A-4) was added and stirred for 4 hours while maintaining the temperature in the flask at 60 ° C. Then, 9.37 g of 2-hydroxyethyl methacrylate was added and stirred for 1 hour. Then, it heated up to 75 degreeC and stirred for 30 hours. 1.383 g of 85% phosphoric acid was added under air, stirred for 2 hours, and the precipitated solid was separated. The catalyst was removed with an ion exchange resin, and the ion exchange resin was separated to obtain a block copolymer (Q1-3).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(Q1-3) 33.93g, 메틸이소부틸케톤 22.64g, 중합 금지제로서 p-메톡시페놀 0.0162질량부, 디부틸히드록시톨루엔 0.1215g 및 우레탄화 촉매로서 옥틸산주석 0.0122g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 6.576g을 더했다. 그 후, 60℃에서 2시간 교반한 후, 80℃로 승온하여 4시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸이소부틸케톤 71.85g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(5)를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(5)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 10,500, 중량 평균 분자량 13,400이었다.Subsequently, in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device, 33.93 g of the obtained copolymer (Q1-3), 22.64 g of methyl isobutyl ketone, p-methoxyphenol as a polymerization inhibitor 0.0162 parts by mass, 0.1215 g of dibutylhydroxytoluene, and 0.0122 g of tin octylate as a urethanization catalyst were added, stirring was started under air flow, and while maintaining 60 ° C, 6.576 g of 2-acryloyloxyethyl isocyanate was added. More. Thereafter, the mixture was stirred at 60 ° C for 2 hours, then heated to 80 ° C and stirred for 4 hours, confirming the disappearance of the isocyanate group by IR spectrum measurement, and adding 71.85 g of methyl isobutyl ketone to have an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin (5) of the present invention was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (5) by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 10,500 and the weight average molecular weight was 13,400.
실시예6(동상)Example 6 (status)
교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 용매로서 n-헵탄 134.05g과, 상기 식(a-1)으로 표시되는 편말단에 수산기를 갖는 실리콘 화합물(식 중, n은 평균 130이다)을 300g과, 촉매로서 트리에틸아민 7.03g을 투입하고, 플라스크 내 온도를 40℃로 유지한 채, 30분간 교반했다.In a glass flask equipped with a stirring device, a thermometer, a cooling tube, and a dropping device, 134.05 g of n-heptane as a solvent and a silicone compound having a hydroxyl group at one end of the formula (a-1) (where n is The average of 130) was added to 300 g and 7.03 g of triethylamine as a catalyst, and the mixture was stirred for 30 minutes while maintaining the temperature in the flask at 40 ° C.
이어서, 2-브로모이소부티르산브로마이드 12.79g을 투입하여 40℃에서 3시간 교반했다. 그 후, n-헵탄 335.15g, 0.36% 염산 600.00g을 혼합하여 교반하고 나서 정치하고, 염산층을 분리시켜서 제거했다. 그 후, 포화 탄산수소나트륨 수용액 600g을 혼합하여 교반하고 나서 정치하고, 포화 탄산수소나트륨 수용액층을 분리시켜서 제거하고, 또한 이온 교환수 600g을 혼합하여 교반하고 나서 정치하고, 이온 교환수층을 분리시켜서 제거했다. 이어서, 탈수제로서 황산마그네슘 25g을 첨가하여 흔들어 섞어서 탈수한 후, 탈수제를 여별했다. 그 후, 감압하에서 용매를 유거하고, 얻어진 잔사를 이소프로필에테르 303.25g에 용해했다. 0.36% 염산 303.25g을 혼합하여 교반하고 나서 정치하고, 염산층을 분리시켜서 제거했다. 그 후, 1% 수산화나트륨 수용액 303.25g을 혼합하여 교반하고 나서 정치하고, 1% 수산화나트륨 수용액층을 분리시켜서 제거하고, 또한 이온 교환수 300g을 혼합하여 교반하고 나서 정치하고, 이온 교환수층을 분리시켜서 제거했다. 그 후, 다시 이온 교환수 300g을 혼합하여 교반하고 나서 정치하고, 이온 교환수층을 분리시켜서 제거하고, 이어서, 탈수제로서 황산마그네슘 25g을 첨가하여 흔들어 섞어서 탈수한 후, 탈수제를 여별했다. 그 후, 감압하에서 용매를 유거함으로써, 하기 식으로 표시되는 본 발명에서 사용하는 화합물(A-4-1)을 얻었다.Subsequently, 12.79 g of 2-bromoisobutyric acid bromide was added and stirred at 40 ° C for 3 hours. Thereafter, 335.15 g of n-heptane and 600.00 g of 0.36% hydrochloric acid were mixed, stirred, and left standing, and the hydrochloric acid layer was separated and removed. Thereafter, 600 g of saturated aqueous sodium hydrogen carbonate solution was mixed, stirred, and then left standing. The saturated aqueous sodium hydrogen carbonate solution layer was separated and removed, and 600 g of ion-exchanged water was mixed and stirred to stand, and the ion exchange water layer was separated. Removed. Subsequently, 25 g of magnesium sulfate was added as a dehydrating agent, the mixture was shaken to dehydrate, and then the dehydrating agent was separated. Then, the solvent was distilled off under reduced pressure, and the obtained residue was dissolved in 303.25 g of isopropyl ether. 303.25 g of 0.36% hydrochloric acid was mixed, stirred and left standing, and the hydrochloric acid layer was separated and removed. Thereafter, 303.25 g of a 1% sodium hydroxide aqueous solution was mixed and stirred, and then left to stand, and the 1% sodium hydroxide aqueous solution layer was separated and removed, and 300 g of ion-exchanged water was mixed and stirred and left to stand, and the ion exchange water layer was separated. Order to remove it. Subsequently, 300 g of ion-exchanged water was mixed, stirred and left standing, and the ion-exchanged water layer was separated and removed. Then, 25 g of magnesium sulfate was added as a dehydrating agent, followed by shaking and dehydration, followed by filtration of the dehydrating agent. Thereafter, the solvent (A-4-1) used in the present invention represented by the following formula was obtained by distilling off the solvent under reduced pressure.
(식 중, n은 평균 130이다)(In the formula, n is an average of 130)
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관을 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 56.08g, 메틸에틸케톤 56.08g, 트리데카플루오로헥실에틸메타크릴레이트 14.77g, 메톡시벤젠 0.7387g을 질소 기류하에서 교반하면서 25℃에서 1시간 교반했다. 이어서, 염화제1구리 0.6089g, 브롬화제2구리 0.1527g, 2,2-비피리딜 2.135g을 투입하고, 30분 교반했다. 60℃로 승온한 후에, 상기 화합물(A-4-1) 60.00g을 더해, 플라스크 내 온도를 60℃로 유지한 채 9시간 교반했다. 그 후, 2-히드록시에틸메타크릴레이트 8.893g을 투입하고, 1시간 교반했다. 그 후 75℃로 승온하여 48시간 교반했다. 공기하에서 85% 인산 수용액 1.576g을 더해서 2시간 교반하고, 석출한 고형분을 여별했다. 이온 교환 수지에 의한 촉매의 제거를 행하고, 이온 교환 수지를 여별하여 블록 공중합체(Q1-4)를 얻었다.Subsequently, a nitrogen-introducing tube, a stirring device, a thermometer, and a cooling tube were provided, and in a nitrogen-substituted glass flask, 56.08 g of isopropyl alcohol, 56.08 g of methyl ethyl ketone, 14.77 g of tridecafluorohexyl ethyl methacrylate, methoxy 0.7387 g of benzene was stirred at 25 ° C. for 1 hour while stirring under a stream of nitrogen. Subsequently, 0.6089 g of cuprous chloride, 0.1527 g of copper bromide, and 2.135 g of 2,2-bipyridyl were added and stirred for 30 minutes. After heating to 60 ° C, 60.00 g of the compound (A-4-1) was added, and the flask was stirred for 9 hours while maintaining the temperature at 60 ° C. Thereafter, 8.893 g of 2-hydroxyethyl methacrylate was added and stirred for 1 hour. Then, it heated up to 75 degreeC and stirred for 48 hours. 1.576 g of an aqueous 85% phosphoric acid solution was added under air, stirred for 2 hours, and the precipitated solid was separated. The catalyst was removed with an ion exchange resin, and the ion exchange resin was separated to obtain a block copolymer (Q1-4).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(Q1-4) 58.56g, 메틸이소부틸케톤 39.04g, 중합 금지제로서 p-메톡시페놀 0.0260질량부, 디부틸히드록시톨루엔 0.1949g 및 우레탄화 촉매로서 옥틸산주석 0.0195g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 6.407g을 더했다. 그 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 5시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸이소부틸케톤 112.54g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(6)를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(6)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 16,000, 중량 평균 분자량 19,000이었다.Subsequently, 58.56 g of the obtained copolymer (Q1-4), 39.04 g of methyl isobutyl ketone, and p-methoxyphenol as a polymerization inhibitor were placed in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device. 0.0260 parts by mass, 0.1949 g of dibutylhydroxytoluene and 0.0195 g of tin octylate as urethane catalyst were added, stirring was started under air flow, and while maintaining 60 ° C, 6.407 g of 2-acryloyloxyethyl isocyanate was added. More. Thereafter, the mixture was stirred at 60 ° C for 1 hour, then heated to 80 ° C and stirred for 5 hours, confirming the disappearance of the isocyanate group by IR spectrum measurement, and adding 112.54 g of methyl isobutyl ketone to have an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin (6) of the present invention was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (6) by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 16,000 and the weight average molecular weight was 19,000.
실시예7(동상)Example 7 (status)
질소 도입관, 교반 장치, 온도계, 냉각관을 구비하여, 질소 치환한 유리 플라스크에, 이소프로필알코올 69.37g, 메틸에틸케톤 69.37g, 트리데카플루오로헥실에틸메타크릴레이트 32.49g, 메톡시벤젠 0.7387g을 질소 기류하에서 교반하면서 25℃에서 1시간 교반했다. 이어서, 염화제1구리 0.6089g, 브롬화제2구리 0.1527g, 2,2-비피리딜 2.135g을 투입하고, 30분 교반했다. 60℃로 승온한 후에, 상기 화합물(A-4-1) 60.00g을 더해, 플라스크 내 온도를 60℃로 유지한 채 12시간 교반했다. 그 후, 2-히드록시에틸메타크릴레이트 31.27g을 투입하고, 1시간 교반했다. 그 후 75℃로 승온하여 81시간 교반했다. 공기하에서 85% 인산 수용액 1.576g을 더해서 2시간 교반하여, 석출한 고형분을 여별했다. 이온 교환 수지에 의한 촉매의 제거를 행하고, 이온 교환 수지를 여별하여 블록 공중합체(Q1-5)를 얻었다.Equipped with a nitrogen introduction tube, a stirring device, a thermometer, and a cooling tube, into a nitrogen-substituted glass flask, isopropyl alcohol 69.37 g, methyl ethyl ketone 69.37 g, tridecafluorohexyl ethyl methacrylate 32.49 g, methoxybenzene 0.7387 It stirred at 25 degreeC for 1 hour, stirring g under nitrogen stream. Subsequently, 0.6089 g of cuprous chloride, 0.1527 g of copper bromide, and 2.135 g of 2,2-bipyridyl were added and stirred for 30 minutes. After the temperature was raised to 60 ° C, 60.00 g of the compound (A-4-1) was added, followed by stirring for 12 hours while maintaining the temperature in the flask at 60 ° C. Then, 31.27 g of 2-hydroxyethyl methacrylate was added and stirred for 1 hour. Then, it heated up to 75 degreeC and stirred for 81 hours. 1.576 g of an aqueous 85% phosphoric acid solution was added under air and stirred for 2 hours to separate the precipitated solids. The catalyst was removed with an ion exchange resin, and the ion exchange resin was separated to obtain a block copolymer (Q1-5).
이어서, 질소 도입관, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 얻어진 공중합체(Q1-5) 93.17g, 메틸이소부틸케톤 62.10g, 중합 금지제로서 p-메톡시페놀 0.0470질량부, 디부틸히드록시톨루엔 0.3522g 및 우레탄화 촉매로서 옥틸산주석 0.0352g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 24.23g을 더했다. 그 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 5.5시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인하고, 메틸이소부틸케톤 211.8g을 더함으로써 활성 에너지선 경화성기를 갖는 본 발명의 중합성 수지(7)를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(7)의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 24,400, 중량 평균 분자량 31,300이었다.Subsequently, in a glass flask equipped with a nitrogen introduction tube, a stirring device, a thermometer, a cooling tube, and a dropping device, 93.17 g of the obtained copolymer (Q1-5), 62.10 g of methyl isobutyl ketone, p-methoxyphenol as a polymerization inhibitor 0.0470 parts by mass, 0.3522 g of dibutylhydroxytoluene and 0.0352 g of tin octylate as a urethanization catalyst were added, stirring was started under air flow, and while maintaining 60 ° C, 24.23 g of 2-acryloyloxyethyl isocyanate was added. More. After that, the mixture was stirred at 60 ° C for 1 hour, then heated to 80 ° C and stirred for 5.5 hours, confirming the disappearance of the isocyanate group by IR spectrum measurement, and adding 211.8 g of methyl isobutyl ketone to have an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin (7) of the present invention was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (7) by GPC (polystyrene equivalent molecular weight), it was number average molecular weight 24,400 and weight average molecular weight 31,300.
비교예1(비교 대조용 계면 활성제의 조제)Comparative Example 1 (Preparation of surfactant for comparative control)
교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 용매로서 메틸이소부틸케톤 77.7g을 투입하고, 질소 기류하에서 교반하면서 105℃로 승온했다. 이어서, 트리데카플루오로헥실에틸메타크릴레이트 23g과, 하기 식으로 표시되는 실리콘기를 갖는 중합성 불포화 단량체[이하, 단량체(A'-1)로 약기함] 10g과, 글리시딜메타크릴레이트 44.7g을 메틸이소부틸케톤 53.4g에 용해한 모노머 용액과, 라디칼 중합 개시제로서 t-부틸퍼옥시-2-에틸헥사노에이트 3.9g을 메틸이소부틸케톤 50.2g에 용해한 중합 개시제 용액과의 2종류의 적하액을 각각 별도의 적하 장치에 세트하고, 플라스크 내를 105℃로 유지하면서 동시에 3시간 걸쳐서 적하했다.To a glass flask equipped with a stirring device, a thermometer, a cooling tube, and a dropping device, 77.7 g of methyl isobutyl ketone was added as a solvent, and the temperature was raised to 105 ° C while stirring under a stream of nitrogen. Subsequently, 23 g of tridecafluorohexyl ethyl methacrylate, 10 g of a polymerizable unsaturated monomer having a silicone group represented by the following formula (hereinafter abbreviated as monomer (A'-1)), and glycidyl methacrylate 44.7 Two types of dropwise addition of a monomer solution in which g is dissolved in 53.4 g of methyl isobutyl ketone and a polymerization initiator solution in which 3.9 g of t-butylperoxy-2-ethylhexanoate is dissolved in 50.2 g of methyl isobutyl ketone as a radical polymerization initiator The liquids were each set in a separate dropping apparatus, and the flask was dripped over 3 hours while maintaining the inside at 105 ° C.
(식 중, n은 평균 65이다)(In the formula, n is 65 on average)
적하 종료 후, 105℃에서 1.5시간 교반한 후, t-부틸퍼옥시-2-에틸헥사노에이트 1.17g을 메틸이소부틸케톤 11.7질량부에 용해한 중합 개시제 용액을 45분 걸쳐서 적하하고, 적하 종료 후, 105℃에서 8시간 교반했다. 반응 종료 후, 메틸이소부틸케톤 164질량부를 감압 유거함에 의해, 중합체(P-2) 용액을 얻었다.After completion of the dropwise addition, after stirring at 105 ° C for 1.5 hours, a polymerization initiator solution in which 1.17 g of t-butylperoxy-2-ethylhexanoate was dissolved in 11.7 parts by mass of methyl isobutyl ketone was added dropwise over 45 minutes. , And stirred at 105 ° C for 8 hours. After completion of the reaction, 164 parts by mass of methyl isobutyl ketone was distilled off under reduced pressure to obtain a polymer (P-2) solution.
이어서, 중합 금지제로서 p-메톡시페놀 0.1g을 투입하고, 플라스크 내 온도를 80℃로 유지하면서, 아크릴산 22.3g, 개환 반응 촉매로서 트리페닐포스핀 0.5g을 투입하고, 공기 기류하에서 40시간 교반하고, 0.1[㏖/l] 수산화칼륨 용액에 의한 적정으로 고형분의 산가가 1[㎎KOH/g] 이하로 저하한 것을 확인했다. 그 후 메틸이소부틸케톤 116.7g을 더함으로써, 활성 에너지선 경화성기를 갖는 중합성 수지(1')를 40% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(1')의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 4,700, 중량 평균 분자량 8,600이며, 라디칼 중합성 불포화기 당량은 323g/eq.이었다.Subsequently, 0.1 g of p-methoxyphenol was added as a polymerization inhibitor, while maintaining the temperature in the flask at 80 ° C, 22.3 g of acrylic acid and 0.5 g of triphenylphosphine as a ring-opening reaction catalyst were added, and for 40 hours under air flow. It stirred and it confirmed that the acid value of solid content fell to 1 [mgKOH / g] or less by titration with 0.1 [mol / l] potassium hydroxide solution. Thereafter, 116.7 g of methyl isobutyl ketone was added to obtain a methyl isobutyl ketone solution containing 40% of a polymerizable resin (1 ') having an active energy ray-curable group. When the molecular weight of the obtained polymerizable resin (1 ') was measured by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 4,700 and the weight average molecular weight was 8,600, and the radical polymerizable unsaturated group equivalent was 323 g / eq.
비교예2(동상)Comparative Example 2 (statue)
교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 하기 식(X-1)으로 표시되는 양말단에 수산기를 갖는 퍼플루오로폴리에테르 화합물(이하, 「화합물(X-1)」이라고 약기함)을 20g, 용매로서 디이소프로필에테르 20g, 중합 금지제로서 p-메톡시페놀 0.02g, 중화제로서 트리에틸아민 3.1g을 투입하고, 공기 기류하에서 교반을 개시하고, 플라스크 내를 10℃로 유지하면서 아크릴산클로라이드 2.7g을 1시간 걸쳐서 적하했다. 적하 종료 후, 10℃에서 1시간 교반하고, 승온하여 30℃에서 1시간 교반한 후, 50℃로 승온하여 10시간 교반함에 의해 반응을 행하고, 가스 크로마토그래피 측정으로 아크릴산클로라이드의 소실이 확인되었다. 이어서, 용매로서 디이소프로필에테르 40g을 추가한 후, 이온 교환수 80g을 혼합하여 교반하고 나서 정치하여 수층을 분리시켜서 제거하는 방법에 의한 세정을 3회 반복했다. 이어서, 중합 금지제로서 p-메톡시페놀 0.02질량부를 첨가하고, 탈수제로서 황산마그네슘 8질량부를 첨가하여 1일간 정치함으로써 완전히 탈수한 후, 탈수제를 여별했다.A perfluoropolyether compound having a hydroxyl group at the sock end represented by the following formula (X-1) in a glass flask equipped with a stirring device, a thermometer, a cooling tube, and a dropping device (hereinafter referred to as "Compound (X-1)") ), 20 g of diisopropyl ether as a solvent, 0.02 g of p-methoxyphenol as a polymerization inhibitor, and 3.1 g of triethylamine as a neutralizing agent, stirring was started under an air flow, and the flask was charged with 10 g. While maintaining at ° C, 2.7 g of acrylic acid chloride was added dropwise over 1 hour. After completion of the dropwise addition, the mixture was stirred for 1 hour at 10 ° C, heated, stirred for 1 hour at 30 ° C, heated to 50 ° C, and reacted by stirring for 10 hours, and disappearance of acrylic acid chloride was confirmed by gas chromatography measurement. Subsequently, after adding 40 g of diisopropyl ether as a solvent, washing with 80 g of ion-exchanged water was mixed, stirred, and then allowed to stand, followed by washing by separating and removing the aqueous layer. Subsequently, 0.02 parts by mass of p-methoxyphenol was added as a polymerization inhibitor, and 8 parts by mass of magnesium sulfate was added as a dehydrating agent to stand for 1 day, followed by complete dehydration, followed by filtration of the dehydrating agent.
(식 중, X는 퍼플루오로메틸렌기 및 퍼플루오로에틸렌기이며, 1분자당, 퍼플루오로메틸렌기가 평균 7개, 퍼플루오로에틸렌기가 평균 8개 존재하는 것이며, 불소 원자의 수가 평균 46이다. 또한, GPC에 의한 수평균 분자량은 1,500이다)(Wherein, X is a perfluoromethylene group and a perfluoroethylene group, per molecule, perfluoromethylene group on average 7, perfluoroethylene group on average 8 present, the number of fluorine atoms on average 46 In addition, the number average molecular weight by GPC is 1,500)
이어서, 감압하에서 용매를 유거함에 의해, 하기 구조식(B-1)으로 표시되는 단량체를 얻었다.Next, the solvent represented by the following structural formula (B-1) was obtained by distilling off the solvent under reduced pressure.
(식 중, X는 퍼플루오로메틸렌기 및 퍼플루오로에틸렌기이며, 1분자당, 퍼플루오로메틸렌기가 평균 7개, 퍼플루오로에틸렌기가 평균 8개 존재하는 것이며, 불소 원자의 수가 평균 46이다)(Wherein, X is a perfluoromethylene group and a perfluoroethylene group, per molecule, perfluoromethylene group on average 7, perfluoroethylene group on average 8 present, the number of fluorine atoms on average 46 to be)
이어서, 교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 용매로서 메틸이소부틸케톤 29.1g을 투입하고, 질소 기류하에서 교반하면서 105℃로 승온했다. 이어서 단량체(B-1) 38.5g, 2-히드록시에틸메타크릴레이트 32.8g, 라디칼 중합 개시제로서 t-부틸퍼옥시-2-에틸헥사노에이트 10.7g과 용매로서 메틸이소부틸케톤 58.1g을 혼합한 개시제 용액의 3종류의 적하액을 각각 별도의 적하 장치에 세트하고, 플라스크 내를 105℃로 유지하면서 동시에 2시간 걸쳐서 적하했다. 적하 종료 후, 105℃에서 10시간 교반한 후, 감압하에서 용매를 유거함에 의해, 중합체(P-3)를 얻었다.Subsequently, 29.1 g of methyl isobutyl ketone was added as a solvent to a glass flask equipped with a stirring device, a thermometer, a cooling tube, and a dropping device, and the temperature was raised to 105 ° C. while stirring under a stream of nitrogen. Subsequently, 38.5 g of monomer (B-1), 32.8 g of 2-hydroxyethyl methacrylate, 10.7 g of t-butyl peroxy-2-ethyl hexanoate as a radical polymerization initiator, and 58.1 g of methyl isobutyl ketone as a solvent were mixed. Three types of dropping solutions of one initiator solution were set in separate dropping devices, respectively, and the flask was kept dropping over 2 hours while maintaining the temperature at 105 ° C. After completion of the dropwise addition, the mixture was stirred at 105 ° C for 10 hours, and then the solvent was distilled off under reduced pressure to obtain a polymer (P-3).
이어서, 중합체(P-3)에, 용매로서 메틸에틸케톤 106.9g, 중합 금지제로서 p-메톡시페놀 0.1g, 우레탄화 촉매로서 옥틸산주석 0.03g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서 2-아크릴로일옥시에틸이소시아네이트 35.6g을 1시간으로 적하했다. 적하 종료 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 10시간 교반함에 의해 반응을 행한 결과, IR 스펙트럼 측정에 의해 이소시아네이트기의 소실이 확인되었다. 이어서, 용매로서 메틸에틸케톤으로 희석한 후에 여과에 의해 용액에 불용한 것은 여별하여, 활성 에너지선 경화성기를 갖는 중합성 수지(2') 20질량% 함유의 메틸에틸케톤 용액을 얻었다. 중합성 수지(2')의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 3,200, 중량 평균 분자량 87,000이며, 라디칼 중합성 불포화기 당량은 423g/eq.이었다.Subsequently, 106.9 g of methyl ethyl ketone as a solvent, 0.1 g of p-methoxyphenol as a polymerization inhibitor, and 0.03 g of octylic acid tin as a urethanization catalyst were added to the polymer (P-3), and stirring was started under air flow. , 35.6 g of 2-acryloyloxyethyl isocyanate was added dropwise at 1 hour while maintaining at 60 ° C. After completion of the dropwise addition, the mixture was stirred at 60 ° C for 1 hour, heated to 80 ° C, and reacted by stirring for 10 hours. As a result, loss of the isocyanate group was confirmed by IR spectrum measurement. Subsequently, what was insoluble in the solution by filtration after dilution with methyl ethyl ketone as a solvent was separated, thereby obtaining a methyl ethyl ketone solution containing 20% by mass of a polymerizable resin (2 ') having an active energy ray-curable group. As a result of measuring the molecular weight of the polymerizable resin (2 ') by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 3,200, the weight average molecular weight was 87,000, and the radical polymerizable unsaturated group equivalent was 423 g / eq.
비교예3(동상)Comparative Example 3 (statue)
교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 화합물(X-1) 20g, 용매로서 디이소프로필에테르 10g, 중합 금지제로서 p-메톡시페놀 0.006g 및 중화제로서 트리에틸아민 3.3g을 투입하고, 공기 기류하에서 교반을 개시하고, 플라스크 내를 10℃로 유지하면서 메타크릴산클로라이드 3.1g을 2시간 걸쳐서 적하했다. 적하 종료 후, 10℃에서 1시간 교반하고, 승온하여 30℃에서 1시간 교반한 후, 50℃로 승온하여 10시간 교반함에 의해 반응을 행하고, 가스 크로마토그래피 측정으로 메타크릴산클로라이드의 소실이 확인되었다. 이어서, 용매로서 디이소프로필에테르 70g을 추가한 후, 이온 교환수 80g을 혼합하여 교반하고 나서 정치하여 수층을 분리시켜서 제거하는 방법에 의한 세정을 3회 반복했다. 이어서, 중합 금지제로서 p-메톡시페놀 0.02g을 첨가하고, 탈수제로서 황산마그네슘 8g을 첨가하여 1일간 정치함으로써 완전히 탈수한 후, 탈수제를 여별했다.In a glass flask equipped with a stirring device, thermometer, cooling tube, and dropping device, 20 g of compound (X-1), 10 g of diisopropyl ether as a solvent, 0.006 g of p-methoxyphenol as a polymerization inhibitor, and triethylamine as a neutralizing agent 3.3 g was added, stirring was started under an air stream, and 3.1 g of methacrylic acid chloride was added dropwise over 2 hours while maintaining the inside of the flask at 10 ° C. After completion of the dropwise addition, the mixture was stirred for 1 hour at 10 ° C, heated up, stirred for 1 hour at 30 ° C, heated to 50 ° C and reacted by stirring for 10 hours, and disappearance of methacrylic acid chloride was confirmed by gas chromatography measurement. Became. Subsequently, after 70 g of diisopropyl ether was added as a solvent, 80 g of ion-exchanged water was mixed and stirred, and then washed and washed by a method of separating and removing the aqueous layer. Subsequently, 0.02 g of p-methoxyphenol was added as a polymerization inhibitor, and 8 g of magnesium sulfate was added as a dehydrating agent to stand for one day, followed by complete dehydration, followed by filtration of the dehydrating agent.
이어서, 감압하에서 용매를 유거함에 의해, 하기 구조식(B-2)으로 표시되는 단량체를 얻었다.Subsequently, by distilling off the solvent under reduced pressure, a monomer represented by the following structural formula (B-2) was obtained.
(식 중, X는 퍼플루오로메틸렌기 및 퍼플루오로에틸렌기이며, 1분자당, 퍼플루오로메틸렌기가 평균 7개, 퍼플루오로에틸렌기가 평균 8개 존재하는 것이며, 불소 원자의 수가 평균 46이다)(Wherein, X is a perfluoromethylene group and a perfluoroethylene group, per molecule, perfluoromethylene group on average 7, perfluoroethylene group on average 8 present, the number of fluorine atoms on average 46 to be)
교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 용매로서 메틸이소부틸케톤 96.7g을 투입하고, 질소 기류하에서 교반하면서 105℃로 승온했다. 이어서, 단량체(B-2) 74g과, 단량체(A'-1) 37g 및 2-히드록시에틸메타크릴레이트 45.4g을 메틸이소부틸케톤 126g에 용해한 모노머 용액과, 라디칼 중합 개시제로서 t-부틸퍼옥시-2-에틸헥사노에이트 23.5g을 메틸이소부틸케톤 67.8g에 용해한 중합 개시제 용액과의 3종류의 적하액을 각각 별도의 적하 장치에 세트하고, 플라스크 내를 105℃로 유지하면서 동시에 2시간 걸쳐서 적하했다. 적하 종료 후, 105℃에서 10시간 교반하여, 중합체(P-4)의 용액을 얻었다.To a glass flask equipped with a stirring device, a thermometer, a cooling tube, and a dropping device, 96.7 g of methyl isobutyl ketone was added as a solvent, and the temperature was raised to 105 ° C while stirring under a stream of nitrogen. Subsequently, a monomer solution in which 74 g of monomer (B-2), 37 g of monomer (A'-1), and 45.4 g of 2-hydroxyethyl methacrylate were dissolved in 126 g of methyl isobutyl ketone, and t-butylper as a radical polymerization initiator Three types of dripping solution with a polymerization initiator solution in which 23.5 g of oxy-2-ethylhexanoate was dissolved in 67.8 g of methyl isobutyl ketone were set in separate dropping devices, and the flask was kept at 105 ° C for 2 hours at the same time. Dropped over. After completion of dropping, the mixture was stirred at 105 ° C for 10 hours to obtain a solution of polymer (P-4).
상기의 중합체(P-4)의 용액에, 중합 금지제로서 p-메톡시페놀 0.2g, 우레탄화 촉매로서 옥틸산주석 0.06g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 49.1g을 1시간으로 적하했다. 적하 종료 후, 60℃에서 1시간 교반한 후, 80℃로 승온하여 10시간 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실이 확인되었다. 이어서, 메틸이소부틸케톤을 더해, 활성 에너지선 경화성기를 갖는 중합성 수지(3')을 40질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(3')의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 2,700, 중량 평균 분자량 8,000이며, 라디칼 중합성 불포화기 당량은 588g/eq.이었다.To the solution of the polymer (P-4), 0.2 g of p-methoxyphenol as a polymerization inhibitor and 0.06 g of tin octylate as a urethanization catalyst were added, stirring was started under air flow, and 60 ° C was maintained. , 49.1 g of 2-acryloyloxyethyl isocyanate was added dropwise over 1 hour. After completion of the dropwise addition, the mixture was stirred at 60 ° C for 1 hour, then heated to 80 ° C and stirred for 10 hours to confirm the disappearance of the isocyanate group by IR spectrum measurement. Subsequently, methyl isobutyl ketone was added to obtain a methyl isobutyl ketone solution containing 40% by mass of a polymerizable resin (3 ') having an active energy ray-curable group. When the molecular weight of the obtained polymerizable resin (3 ') was measured by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 2,700 and the weight average molecular weight was 8,000, and the radical polymerizable unsaturated group equivalent was 588 g / eq.
비교예4(동상)Comparative Example 4 (statue)
교반 장치, 온도계, 냉각관, 적하 장치를 구비한 유리 플라스크에, 용매로서 메틸이소부틸케톤 714g을 투입하고, 질소 기류하에서 교반하면서 105℃로 승온했다. 이어서, 트리데카플루오로헥실에틸메타크릴레이트 90g과, 상기 단량체(A'-1) 360g과, 2-히드록시에틸메타크릴레이트 264g을 메틸이소부틸케톤 1106.4g에 용해한 모노머 용액과, 라디칼 중합 개시제로서 t-부틸퍼옥시-2-에틸헥사노에이트 107.2g을 메틸이소부틸케톤 321.6g에 용해한 중합 개시제 용액과의 2종류의 적하액을 각각 별도의 적하 장치에 세트하고, 플라스크 내를 105℃로 유지하면서 모노머 용액을 2시간, 중합 개시제 용액을 2시간 20분 걸쳐서 적하했다.To a glass flask equipped with a stirring device, a thermometer, a cooling tube, and a dropping device, 714 g of methyl isobutyl ketone was added as a solvent and heated to 105 ° C while stirring under a stream of nitrogen. Subsequently, a monomer solution in which 90 g of tridecafluorohexyl ethyl methacrylate, 360 g of the monomer (A'-1), and 264 g of 2-hydroxyethyl methacrylate were dissolved in 1106.4 g of methyl isobutyl ketone, and a radical polymerization initiator As a dropping agent, two kinds of dropping solutions with a polymerization initiator solution in which 107.2 g of t-butylperoxy-2-ethylhexanoate was dissolved in 321.6 g of methyl isobutyl ketone were set in separate dropping devices, and the flask was set to 105 ° C. While maintaining, the monomer solution was dripped over 2 hours, and the polymerization initiator solution over 2 hours and 20 minutes.
적하 종료 후, 105℃에서 1.5시간 교반했다. 반응 종료 후 메틸이소부틸케톤 1660g을 감압 유거함에 의해, 중합체(p'-1) 용액을 얻었다.After completion of dropping, the mixture was stirred at 105 ° C for 1.5 hours. After completion of the reaction, 1660 g of methyl isobutyl ketone was distilled off under reduced pressure to obtain a polymer (p'-1) solution.
이어서, 중합 금지제로서 p-메톡시페놀 0.399g, 디부틸히드록시톨루엔 2.993g, 우레탄화 촉매로서 옥틸산주석 0.299g을 투입하고, 공기 기류하에서 교반을 개시하고, 60℃를 유지하면서, 2-아크릴로일옥시에틸이소시아네이트 282.25g을 1시간 걸쳐서 적하했다. 그 후, 60℃에서 2시간 교반한 후, 80℃로 승온하여 2시간 반 교반함에 의해, IR 스펙트럼 측정으로 이소시아네이트기의 소실을 확인한 후, 메틸이소부틸케톤 1942.83g을 더함으로써 활성 에너지선 경화성기를 갖는 비교 대조용 중합성 수지(4')를 30질량% 함유하는 메틸이소부틸케톤 용액을 얻었다. 얻어진 중합성 수지(4')의 분자량을 GPC(폴리스티렌 환산 분자량)로 측정한 결과, 수평균 분자량 2,335, 중량 평균 분자량 6,115이었다.Subsequently, 0.399 g of p-methoxyphenol as a polymerization inhibitor, 2.993 g of dibutylhydroxytoluene, and 0.299 g of octylic acid tin as a urethanization catalyst were added, stirring was started under an air flow, and 60 ° C was maintained, 2 -282.25 g of acryloyloxyethyl isocyanate was added dropwise over 1 hour. Thereafter, the mixture was stirred at 60 ° C. for 2 hours, heated to 80 ° C., and stirred for 2 and a half hours. After confirming the disappearance of the isocyanate group by IR spectrum measurement, 1942.83 g of methyl isobutyl ketone was added, thereby adding an active energy ray-curable group. A methyl isobutyl ketone solution containing 30% by mass of the polymerizable resin for comparative control (4 ') was obtained. As a result of measuring the molecular weight of the obtained polymerizable resin (4 ') by GPC (polystyrene equivalent molecular weight), the number average molecular weight was 2,335 and the weight average molecular weight was 6,115.
실시예8(활성 에너지선 경화성 조성물의 조제)Example 8 (Preparation of active energy ray-curable composition)
본 발명의 활성 에너지선 경화성 조성물의 일례로서 편광판의 보호 필름의 최표면에 위치하는 반사 방지막용의 조성물을 조제했다. 구체적으로는, 중공 실리카 미립자(평균 입자경 50㎚)를 20질량% 함유하는 메틸이소부틸케톤 분산액 15부, 펜타에리트리톨트리아크릴레이트 1.6부, 광중합 개시제로서 2-히드록시-1-{4-[4-(2-히드록시-2-메틸-프로피오닐)-벤질]-페닐}-2-메틸-프로판-1-온(치바·재팬 가부시키가이샤제 「이르가큐어127」) 0.1부, 용제로서 메틸이소부틸케톤 81.8질량부를 혼합하여 용해시켜서, 반사 방지 도료 조성물의 베이스 조성물을 얻었다.As an example of the active energy ray-curable composition of the present invention, a composition for an antireflection film positioned on the outermost surface of a protective film of a polarizing plate was prepared. Specifically, 15 parts of a methyl isobutyl ketone dispersion containing 20% by mass of hollow silica fine particles (
상기에서 얻어진 반사 방지 도료 조성물의 베이스 조성물 99.2부에 대하여, 중합성 수지(1)의 50% 함유 용액을 수지분으로서 0.4부가 되도록 첨가하고, 균일하게 혼합하여 본 발명의 활성 에너지선 경화성 조성물(1)[반사 방지 도료 조성물(1)]을 조제했다.To 99.2 parts of the base composition of the antireflective coating composition obtained above, a solution containing 50% of the polymerizable resin (1) is added so as to be 0.4 parts as a resin powder, and uniformly mixed to form an active energy ray-curable composition of the present invention (1 ) [Anti-reflective coating composition (1)] was prepared.
얻어진 반사 방지 도료 조성물(1)을 사용하여 이하의 순서에 따라 반사 방지층과 하드 코팅층을 갖는 필름에 반사 방지층을 조제했다.Using the obtained antireflection coating composition (1), an antireflection layer was prepared on the film having the antireflection layer and the hard coating layer in the following procedure.
<하드 코팅층용 도료 조성물의 조제><Preparation of coating composition for hard coating layer>
5관능의 무황변형 우레탄아크릴레이트 50부, 디펜타에리트리톨헥사아크릴레이트 50부, 아세트산부틸 25부, 광중합 개시제로서 1-히드록시시클로헥실페닐케톤(치바스페셜티케미컬즈사제 「이르가큐어184」) 5부, 용제로서 톨루엔 54부, 2-프로판올 28부, 아세트산에틸 28부, 프로필렌글리콜모노메틸에테르 28부를 혼합하여 용해시켜서, 하드 코팅층용 도료 조성물을 얻었다.5-functional
<하드 코팅층을 갖는 필름의 조제><Preparation of film having hard coating layer>
얻어진 하드 코팅층용 도료 조성물을 바 코터 No.13을 사용하여, 두께 80㎛의 TAC 필름에 도포한 후, 60℃의 건조기에 5분간 넣어서 용제를 휘발시키고, 자외선 경화 장치(질소 분위기하, 고압 수은등 사용, 자외선 조사량 2kJ/㎡)로 경화시켜, 막두께 10㎛의 하드 코팅층을 편면에 갖는 하드 코팅 필름을 제작했다.The obtained coating composition for hard coating layer was applied to a TAC film having a thickness of 80 µm using a bar coater No. 13, and then placed in a dryer at 60 ° C. for 5 minutes to volatilize the solvent, and a UV curing device (in a nitrogen atmosphere, high pressure mercury, etc.) Hardened by use and ultraviolet irradiation amount of 2 kJ / m 2), a hard coating film having a hard coating layer having a thickness of 10 μm on one side was produced.
<반사 방지층과 하드 코팅층을 갖는 필름의 조제><Preparation of film having anti-reflection layer and hard coating layer>
반사 방지 도료 조성물(1)을 2g/㎡의 도포량이 되도록, 상기에서 얻어진 하드 코팅 필름의 하드 코팅층 상에 바 코터 No.2로 도포한 후, 60℃의 건조기에 5분간 넣어서 용제를 휘발시키고, 자외선 경화 장치(질소 분위기하, 고압 수은등 사용, 자외선 조사량 2kJ/㎡)로 경화시켜, 막두께 10㎛의 하드 코팅층 상에 막두께 0.1㎛의 반사 방지층과 하드 코팅층을 갖는 필름을 제작했다. 얻어진 필름의 반사 방지 도료 조성물의 경화 도막 표면에 대해서, 하기의 외관, 내찰상성, 오염 제거성의 평가를 행했다. 또한, 반사 방지 필름의 반사율을 측정했다. 이들의 평가는 하기에 나타내는 알칼리 처리를 행하기 전과 행한 후에 각각 행했다. 평가 결과를 제1 표에 나타낸다.After coating the anti-reflective coating composition (1) with a bar coater No. 2 on the hard coating layer of the hard coating film obtained above, so as to have an application amount of 2 g /
[외관의 평가][Evaluation of appearance]
흑색의 판 상에 상기에서 얻은 반사 방지 필름을 두고, 반사 방지 도료 조성물의 경화 도막의 백화의 유무를 목시로 관찰하여, 하기의 기준에서 외관을 평가했다.The antireflection film obtained above was placed on a black plate, and the presence or absence of whitening of the cured coating film of the antireflective coating composition was visually observed to evaluate the appearance according to the following criteria.
○ : 백화가 생겨 있지 않은 것.○: No white flowers were formed.
× : 백화가 생겨 있는 것.×: A white flower is formed.
[내찰상성의 평가][Evaluation of scratch resistance]
토라이보기아 HEIDON 왕복 마모 시험기 TYPE : 30S(신토가가쿠 가부시키가이샤제)를 사용하고, 직경 27㎜의 원형의 지그에 본스타 No, 0000(니혼스틸울 가부시키가이샤제)을 부착한 마모 시험기(500g/㎠ 하중)로, 30왕복 마모시켜서 시험을 행했다. 시험 후의 도막 표면에 생긴 흠집의 개수를 세어, 하기의 기준에 의해 내찰상성을 평가했다.Torraiboa HEIDON reciprocating wear tester TYPE: Wear tester using 30S (manufactured by Shinto Chemical Co., Ltd.) and Bonstar No. 0000 (manufactured by Nihon Steel Wool Co., Ltd.) attached to a circular jig with a diameter of 27 mm The test was conducted with 30 reciprocating wears (500 g /
◎ : 흠집의 개수가 5개 미만.◎: Less than 5 scratches.
○ : 흠집의 개수가 10개 미만.○: The number of scratches is less than 10.
△ : 흠집의 개수가 10개 이상 50개 미만.△: The number of scratches is 10 or more and less than 50.
× : 흠집의 개수가 50개 이상.×: The number of scratches is 50 or more.
[지문 오염 제거성의 평가][Evaluation of fingerprint decontamination property]
상기에서 얻은 반사 방지 필름의 반사 방지 도료 조성물의 경화 도막의 표면에 손가락으로 지문을 부착시켜, 티슈 페이퍼로 10왕복 닦아냈을 때의 닦인 정도를 목시로 관찰하여, 하기의 기준에서 지문 오염 제거성을 평가했다.Fingerprints are attached to the surface of the cured coating film of the antireflection coating composition of the antireflection film obtained above, and the degree of wiping when wiped 10 times with tissue paper is visually observed, thereby removing fingerprint contamination from the following criteria. Evaluated.
◎ : 지문을 완전히 닦을 수 있는 것.◎: The thing that can wipe the fingerprint completely.
○ : 지문의 부착 흔적, 또는, 닦인 방향을 따라 선상의 흔적이, 부착 시에 비하여 약간 남은 것.(Circle): The traces of fingerprint attachment, or traces on the line along the wiped direction, are slightly left as compared to when attached.
× : 지문의 부착 흔적, 또는, 닦인 방향을 따라 선상의 흔적이, 부착 시의 반 이상의 농도로 남은 것.X: The traces of adhesion of fingerprints, or traces on the line along the wiped direction, remained at a concentration of more than half when attached.
[반사율의 측정][Measurement of reflectance]
5℃ 정반사 측정 장치를 구비한 분광 광도계(가부시키가이샤 시마즈세이사쿠쇼제 「UV-3100PC」)를 사용하여 반사율의 측정을 행했다. 또, 반사율은 파장 550㎚ 부근에서 극소값(최저 반사율)이 되었을 때의 값으로 했다.The reflectance was measured using a spectrophotometer ("UV-3100PC" manufactured by Shimadzu Corporation, Inc.) equipped with a 5 占 폚 specular reflection measuring device. Moreover, the reflectance was made into the value when it became the minimum value (lowest reflectance) in the vicinity of a wavelength of 550 nm.
<경화 도막의 강알칼리(비누화) 처리 방법><How to treat strong alkali (saponification) of hardened coating film>
상기에서 얻어진 반사 방지 필름을, 70℃로 가온한 2.0㏖/L의 수산화칼륨 수용액에 1분간 침지시켜, 수세 후, 100℃에서 3분간 건조시켜서, 강알칼리 처리를 행했다.The antireflection film obtained above was immersed in a 2.0 mol / L aqueous potassium hydroxide solution heated to 70 ° C for 1 minute, and then washed with water and dried at 100 ° C for 3 minutes to perform strong alkali treatment.
비교예5(비교 대조용 활성 에너지선 경화성 조성물의 조제)Comparative Example 5 (Preparation of active energy ray-curable composition for comparative control)
실시예8에서 사용한 중합성 수지(1)의 50% 함유 용액을 대신하여, 중합성 수지(1')를 40% 함유하는 메틸이소부틸케톤 용액을 수지분으로서 0.4질량부 첨가한 이외에는 실시예8과 마찬가지로 조작하여, 비교 대조용 반사 방지 도료 조성물(1')을 얻었다. 이것을 사용하여 실시예8과 마찬가지로 하여 평가를 행했다. 평가 결과를 제1 표에 나타낸다.Example 8, except for the addition of 0.4 parts by mass of the methyl isobutyl ketone solution containing 40% of the polymerizable resin (1 ') as a resin powder, in place of the 50% solution of the polymerizable resin (1) used in Example 8 The operation was performed in the same manner to obtain an antireflective coating composition for comparison and control (1 '). This was used to perform evaluation in the same manner as in Example 8. The evaluation results are shown in Table 1.
비교예6(동상)Comparative Example 6 (statue)
실시예8에서 사용한 중합성 수지(1)의 50% 함유 용액을 대신하여, 중합성 수지(2')의 20% 함유 용액을 수지분으로서 0.4질량부 첨가한 이외에는 실시예8과 마찬가지로 조작하여, 비교 대조용 반사 방지 도료 조성물(2')을 얻었다. 이것을 사용하여 실시예8과 마찬가지로 하여 평가를 행했다. 평가 결과를 제1 표에 나타낸다.In place of the solution containing 50% of the polymerizable resin (1) used in Example 8, the same operation as in Example 8 was carried out except that 0.4% by weight of the solution containing 20% of the polymerizable resin (2 ') as a resin powder was added. An antireflective coating composition (2 ') for comparative control was obtained. This was used to perform evaluation in the same manner as in Example 8. The evaluation results are shown in Table 1.
비교예7(동상)Comparative Example 7 (statue)
실시예8에서 사용한 중합성 수지(1)의 50% 함유 용액을 대신하여, 중합성 수지(3')의 40% 함유 용액을 수지분으로서 0.4질량부 첨가한 이외에는 실시예8과 마찬가지로 조작하여, 비교 대조용 반사 방지 도료 조성물(3')을 얻었다. 이것을 사용하여 실시예8과 마찬가지로 하여 평가를 행했다. 평가 결과를 제1 표에 나타낸다.In place of the 50% -containing solution of the polymerizable resin (1) used in Example 8, except for adding 0.4 parts by weight of a 40% -containing solution of the polymerizable resin (3 ') as a resin powder, the same operation as in Example 8 was carried out. An antireflective coating composition (3 ') for comparative control was obtained. This was used to perform evaluation in the same manner as in Example 8. The evaluation results are shown in Table 1.
비교예8(동상)Comparative Example 8 (statue)
실시예8에서 사용한 중합성 수지(1)의 50% 함유 용액을 대신하여, 실리콘 오일(JNC 가부시키가이샤제 「사이라푸렌 FM-4421」, 폴리디메틸실록산쇄의 양말단에 -C3H6OC2H4OH를 갖는 것)을 50질량% 함유하는 메틸이소부틸케톤 용액을 0.8질량부(수지분으로서 0.4질량부) 첨가한 이외에는 실시예8과 마찬가지로 조작하여, 비교 대조용 반사 방지 도료 조성물(4')을 얻었다. 이것을 사용하여 실시예8과 마찬가지로 하여 평가를 행했다. 평가 결과를 제1 표에 나타낸다.In place of the solution containing 50% of the polymerizable resin (1) used in Example 8, silicone oil ("Sirapurene FM-4421" manufactured by JNC Corporation), -C 3 H 6 was added to the sock end of the polydimethylsiloxane chain. The same operation as in Example 8 was performed except that 0.8 parts by mass (0.4 parts by mass of resin) of a methyl isobutyl ketone solution containing 50% by mass of OC 2 H 4 OH) was added, and the anti-reflective coating composition for comparative control was used. (4 '). This was used to perform evaluation in the same manner as in Example 8. The evaluation results are shown in Table 1.
비교예9(동상)Comparative Example 9 (statue)
실시예8에서 사용한 중합성 수지(1)의 50% 함유 용액을 대신하여, FM-0721K(JNC 가부시키가이샤제의 실리콘 오일. 중합성 불포화기를 편말단에 갖고 있음)를 50질량% 함유하는 메틸이소부틸케톤 용액을 0.8질량부(수지분으로서 0.4질량부) 첨가한 이외에는 실시예8과 마찬가지로 조작하여, 비교 대조용 반사 방지 도료 조성물(5')을 얻었다. 이것을 사용하여 실시예8과 마찬가지로 하여 평가를 행했다. 평가 결과를 제2 표에 나타낸다.Methyl containing 50% by mass of FM-0721K (silicone oil made by JNC, which has a polymerizable unsaturated group at one end) in place of the solution containing 50% of the polymerizable resin (1) used in Example 8. It was operated in the same manner as in Example 8, except that 0.8 parts by mass of the isobutyl ketone solution (0.4 parts by mass as the resin content) was obtained, thereby obtaining an antireflective coating composition for comparison (5 '). This was used to perform evaluation in the same manner as in Example 8. The evaluation results are shown in Table 2.
비교예10(동상)Comparative Example 10 (statue)
실시예8에서 사용한 중합성 수지(1)의 50% 함유 용액을 대신하여, 디메틸실록산쇄를 갖는 4관능 아크릴레이트(빅케미·재팬 가부시키가이샤제 「BYK-UV3570」)를 50질량% 함유하는 메틸이소부틸케톤 용액을 0.8질량부(수지분으로서 0.4질량부) 첨가한 이외에는 실시예8과 마찬가지로 조작하여, 비교 대조용 반사 방지 도료 조성물(6')을 얻었다. 이것을 사용하여 실시예8과 마찬가지로 하여 평가를 행했다. 평가 결과를 제2 표에 나타낸다.In place of the 50% -containing solution of the polymerizable resin (1) used in Example 8, a 50% by mass content of a tetrafunctional acrylate having a dimethylsiloxane chain ("BYK-UV3570" manufactured by BICCHEM Japan Co., Ltd.) The same operation as in Example 8 was performed except that 0.8 parts by mass of the methyl isobutyl ketone solution (0.4 parts by mass as the resin content) was added to obtain an antireflective coating composition for comparison (6 '). This was used to perform evaluation in the same manner as in Example 8. The evaluation results are shown in Table 2.
비교예11(동상)Comparative Example 11 (statue)
실시예8에서 조제한 활성 에너지선 경화성 조성물의 베이스 수지 조성물에, 아무것도 첨가하지 않고 실시예8과 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제2 표에 나타낸다.Nothing was added to the base resin composition of the active energy ray-curable composition prepared in Example 8, and the same operation as in Example 8 was performed to evaluate it. The evaluation results are shown in Table 2.
[표 1][Table 1]
[표 2][Table 2]
실시예9(본 발명의 활성 에너지선 경화성 조성물의 조제)Example 9 (Preparation of active energy ray-curable composition of the present invention)
본 발명의 활성 에너지선 경화성 조성물의 일례로서 편광판의 보호 필름의 최표면에 위치하는 반사 방지막용의 조성물을 조제했다. 구체적으로는, 중공 실리카 미립자(평균 입자경 60㎚)를 20질량% 함유하는 메틸이소부틸케톤 분산액 1.265부, 펜타에리트리톨트리아크릴레이트 0.207부, 광중합 개시제로서 2-히드록시-1-{4-[4-(2-히드록시-2-메틸-프로피오닐)-벤질]-페닐}-2-메틸-프로판-1-온(치바·재팬 가부시키가이샤제 「이르가큐어127」) 0.0092부, 용제로서 메틸이소부틸케톤 8.395부를 혼합하여 용해시켜서, 반사 방지 도료 조성물의 베이스 조성물을 얻었다.As an example of the active energy ray-curable composition of the present invention, a composition for an antireflection film positioned on the outermost surface of a protective film of a polarizing plate was prepared. Specifically, 1.265 parts of methyl isobutyl ketone dispersion containing 20% by mass of hollow silica fine particles (average particle diameter: 60 nm), 0.207 parts of pentaerythritol triacrylate, 2-hydroxy-1- {4- [as photopolymerization initiator 4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propan-1-one ("Irgacure127" manufactured by Chiba Japan Co., Ltd.) 0.0092 parts, solvent As a mixture, 8.395 parts of methyl isobutyl ketone was mixed and dissolved to obtain a base composition of an antireflective coating composition.
상기에서 얻어진 반사 방지 도료 조성물의 베이스 조성물 9.87부에 대하여, 중합성 수지(2)의 30% 함유 용액을 수지분으로서 0.04부가 되도록 첨가하고, 균일하게 혼합하여 본 발명의 활성 에너지선 경화성 조성물(2)[반사 방지 도료 조성물(2)]을 조제했다.With respect to 9.87 parts of the base composition of the antireflective coating composition obtained above, a solution containing 30% of the polymerizable resin (2) is added so as to be 0.04 parts as a resin powder, and uniformly mixed to form an active energy ray-curable composition of the present invention (2 ) [Anti-reflective coating composition (2)] was prepared.
얻어진 반사 방지 도료 조성물(2)을 사용하여 이하의 순서에 따라 반사 방지층과 하드 코팅층을 갖는 필름을 조제했다.Using the obtained antireflection coating composition (2), a film having an antireflection layer and a hard coating layer was prepared in the following procedure.
<하드 코팅층용 도료 조성물의 조제><Preparation of coating composition for hard coating layer>
우레탄아크릴레이트(니혼고세이가가쿠고교 가부시키가이샤의 「UV1700B」) 30부, 아세트산부틸 25부, 광중합 개시제로서 1-히드록시시클로헥실페닐케톤(치바스페셜티케미컬즈사제 「이르가큐어184」) 1.2질량부, 용제로서 톨루엔 11.78부, 2-프로판올 5.892부, 아세트산에틸 5.892부 및 프로필렌글리콜모노메틸에테르 5.892부를 혼합하여 용해시켜서, 하드 코팅층용 도료 조성물을 얻었다.30 parts of urethane acrylate ("UV1700B" manufactured by Nippon Kosei Chemical Co., Ltd.), 25 parts of butyl acetate, 1-hydroxycyclohexylphenyl ketone ("Irgacure 184" manufactured by Chiba Specialty Chemicals) as photopolymerization initiator 1.2 As a mass part and a solvent, 11.78 parts of toluene, 5.892 parts of 2-propanol, 5.892 parts of ethyl acetate and 5.892 parts of propylene glycol monomethyl ether were mixed and dissolved to obtain a coating composition for a hard coating layer.
<하드 코팅층을 갖는 필름의 조제><Preparation of film having hard coating layer>
얻어진 하드 코팅층용 도료 조성물을 바 코터 No.13을 사용하여, 두께 188㎛의 PET 필름에 도포한 후, 70℃의 건조기에 1분간 넣어서 용제를 휘발시키고, 자외선 경화 장치(질소 분위기하, 고압 수은등 사용, 자외선 조사량 0.5kJ/㎡)로 경화시켜, 막두께 8㎛의 하드 코팅층을 편면에 갖는 하드 코팅 필름을 제작했다.The obtained coating composition for hard coating layer was applied to a PET film having a thickness of 188 μm using a bar coater No. 13, and then put in a dryer at 70 ° C. for 1 minute to volatilize the solvent, and a UV curing device (in a nitrogen atmosphere, high pressure mercury, etc Hardened by use and UV irradiation amount of 0.5 kJ / m 2), a hard coating film having a hard coating layer having a film thickness of 8 μm on one side was produced.
<반사 방지층과 하드 코팅층을 갖는 필름의 조제><Preparation of film having anti-reflection layer and hard coating layer>
반사 방지 도료 조성물(2)을 상기에서 얻어진 하드 코팅 필름의 하드 코팅층 상에 바 코터 No.2로 도포한 후, 50℃의 건조기에 1분 30초간 넣어서 용제를 휘발시켜, 자외선 경화 장치(질소 분위기하, 고압 수은등 사용, 자외선 조사량 2kJ/㎡)로 경화시켜, 막두께 8㎛의 하드 코팅층 상에 막두께 0.1㎛의 반사 방지층과 하드 코팅층을 갖는 필름(반사 방지 필름)을 제작했다. 얻어진 필름의 반사 방지 도료 조성물의 경화 도막 표면에 대해서, 하기의 평가 방법에 따라, 외관, 활성 및 내찰상성의 평가를 행했다. 이들의 측정은, 상기 알칼리 처리를 행하기 전과 행한 후에 각각 행했다. 평가 결과를 제3 표에 나타낸다.After coating the anti-reflective coating composition (2) on the hard coating layer of the hard coating film obtained above with a bar coater No. 2, and putting it in a dryer at 50 ° C. for 1 minute and 30 seconds to volatilize the solvent, an ultraviolet curing device (nitrogen atmosphere Ha, using a high-pressure mercury lamp, and cured with an ultraviolet irradiation amount of 2 kJ / m 2) to produce a film (antireflection film) having an antireflection layer and a hard coating layer with a film thickness of 0.1 μm on a hard coating layer having a thickness of 8 μm. The surface of the cured coating film of the antireflection coating composition of the obtained film was evaluated for appearance, activity, and scratch resistance according to the following evaluation method. These measurements were performed before and after the alkali treatment. The evaluation results are shown in Table 3.
[외관의 평가][Evaluation of appearance]
상기에서 얻은 필름에 대해서, 반사 방지 도료 조성물의 경화 도막 상에 형성되는 세밀한 유적상의 불균일(크롤링)을 목시로 관찰하여, 하기의 기준에서 외관을 평가했다. 평가 결과를 제1 표에 나타낸다.The film obtained above was visually observed for unevenness (crawling) of fine oil droplets formed on the cured coating film of the antireflective coating composition, and the appearance was evaluated based on the following criteria. The evaluation results are shown in Table 1.
○ : 크롤링이 전혀 보이지 않음.○: No crawling was observed.
△ : 점상의 크롤링이 일부 보임.△: Partial crawling was observed.
× : 점상의 크롤링이 전체적으로 보임.X: The dot-like crawl is seen as a whole.
[활성의 평가][Evaluation of activity]
표면성 측정기(신토가가쿠 가부시키가이샤제 「HEIDON-14D」)를 사용하여, 샘플대에 상기에서 얻은 필름을 고정하여 수평을 확인 후, 샘플 상에 프로브를 세트하고, 100g 하중으로, 인장 속도 0.3m/분의 조건에서 측정을 행하고, 동마찰계수를 구했다. 동마찰계수가 작을수록 활성이 뛰어나다.Using a surface measuring instrument ("HEIDON-14D" manufactured by Shinto Chemical Co., Ltd.), fix the film obtained above on a sample stand to check the level, set a probe on the sample, and load tension with 100 g load. Measurement was performed under a condition of 0.3 m / min, and a dynamic friction coefficient was obtained. The smaller the coefficient of dynamic friction, the better the activity.
[내찰상성의 평가][Evaluation of scratch resistance]
#0000의 스틸울을 사용하여, 하중 500g으로 10왕복 마모시켜서 시험을 행했다. 시험 후의 도막 표면에 생긴 흠집의 개수를 세어, 하기의 기준에 의해 내찰상성을 평가했다.Using # 0000 steel wool, the test was carried out with 500 loads of 10 repetitive wears. The number of scratches on the surface of the coating film after the test was counted, and the scratch resistance was evaluated according to the following criteria.
◎ : 흠집의 개수가 5개 미만.◎: Less than 5 scratches.
○ : 흠집의 개수가 5개 이상 10개 미만.○: 5 or more and less than 10 scratches.
△ : 흠집의 개수가 10개 이상 30개 미만.△: The number of scratches is 10 or more and less than 30.
× : 흠집의 개수가 30개 이상.×: The number of scratches is 30 or more.
실시예10(동상)Example 10 (status)
실시예9에서 사용한 중합성 수지(2)의 30% 함유 용액을 대신하여, 중합성 수지(3)의 30% 함유 용액을 수지분으로서 0.04질량부 첨가한 이외에는 실시예9와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제3 표에 나타낸다.The procedure was evaluated in the same manner as in Example 9, except that 0.04 parts by mass of the solution containing 30% of the polymerizable resin (3) was added as a resin powder instead of the solution containing 30% of the polymerizable resin (2) used in Example 9. Was done. The evaluation results are shown in Table 3.
실시예11(동상)Example 11 (status)
실시예9에서 사용한 중합성 수지(2)의 30% 함유 용액을 대신하여, 중합성 수지(4)의 30% 함유 용액을 수지분으로서 0.04질량부 첨가한 이외에는 실시예2와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제3 표에 나타낸다.The procedure was evaluated in the same manner as in Example 2, except that 0.04 parts by mass of the 30% solution of the polymerizable resin (4) was added as a resin powder instead of the 30% solution of the polymerizable resin (2) used in Example 9. Was done. The evaluation results are shown in Table 3.
실시예12(동상)Example 12 (status)
실시예9에서 사용한 중합성 수지(2)의 30% 함유 용액을 대신하여, 중합성 수지(5)의 30% 함유 용액을 수지분으로서 0.04질량부 첨가한 이외에는 실시예9와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제3 표에 나타낸다.It was evaluated in the same manner as in Example 9, except that 0.04 parts by mass of the solution containing 30% of the polymerizable resin (5) was added as a resin powder instead of the solution containing 30% of the polymerizable resin (2) used in Example 9. Was done. The evaluation results are shown in Table 3.
실시예13(동상)Example 13 (status)
실시예9에서 사용한 중합성 수지(2)의 30% 함유 용액을 대신하여, 중합성 수지(6)의 30% 함유 용액을 수지분으로서 0.04질량부 첨가한 이외에는 실시예9와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제3 표에 나타낸다.It was evaluated in the same manner as in Example 9, except that 0.04 parts by mass of the solution containing 30% of the polymerizable resin (6) was added as a resin powder instead of the solution containing 30% of the polymerizable resin (2) used in Example 9. Was done. The evaluation results are shown in Table 3.
실시예14(동상)Example 14 (status)
실시예9에서 사용한 중합성 수지(2)의 30% 함유 용액을 대신하여, 중합성 수지(7)의 30% 함유 용액을 수지분으로서 0.04질량부 첨가한 이외에는 실시예9와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제3 표에 나타낸다.It was evaluated and operated in the same manner as in Example 9, except that 0.04 parts by mass of the solution containing 30% of the polymerizable resin (7) was added as a resin powder instead of the solution containing 30% of the polymerizable resin (2) used in Example 9. Was done. The evaluation results are shown in Table 3.
비교예12(비교 대조용의 활성 에너지선 경화성 조성물의 조제)Comparative Example 12 (Preparation of active energy ray-curable composition for comparative control)
실시예9에서 사용한 중합성 수지(2)의 30% 함유 용액을 대신하여, 비교 대조용 중합성 수지(4')의 30% 함유 용액을 수지분으로서 0.4질량부 첨가한 이외에는 실시예9와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제4 표에 나타낸다.As in Example 9, instead of the solution containing 30% of the polymerizable resin (2) used in Example 9, 0.4 parts by mass of the solution containing 30% of the polymerizable resin for comparison (4 ') as a resin powder was added. It operated and evaluated. Table 4 shows the evaluation results.
비교예13(동상)Comparative Example 13 (statue)
실시예9에서 조제한 반사 방지 도료 조성물의 베이스 조성물에, 아무것도 첨가하지 않고 실시예9와 마찬가지로 조작하여, 평가를 행했다. 평가 결과를 제3 표에 나타낸다.To the base composition of the antireflective coating composition prepared in Example 9, nothing was added and operated in the same manner as in Example 9 to evaluate. The evaluation results are shown in Table 3.
[표 3][Table 3]
[표 4][Table 4]
Claims (16)
상기 화합물(A)이 갖는 실리콘쇄가 분자량 2,000∼20,000의 실리콘쇄인 중합성 수지.According to claim 1,
The polymerizable resin in which the silicone chain of the compound (A) is a silicone chain having a molecular weight of 2,000 to 20,000.
상기 리빙 라디칼 중합이, 중합 개시제, 천이 금속 화합물 및 당해 천이 금속과 배위 결합 가능한 배위자를 갖는 화합물의 존재하에서 행하는 원자 이동형 라디칼 중합인 중합성 수지.According to claim 1,
A polymerizable resin in which the living radical polymerization is an atomic transfer radical polymerization performed in the presence of a polymerization initiator, a transition metal compound, and a compound having a ligand capable of coordinating bonds with the transition metal.
상기 반응성 관능기(c1)가 수산기, 이소시아네이트기, 에폭시기, 카르복시기, 카르복시산할라이드기 및 카르복시산 무수물기로 이루어지는 군에서 선택되는 1종 이상의 관능기인 중합성 수지.According to claim 1,
The polymerizable resin wherein the reactive functional group (c1) is at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, an epoxy group, a carboxy group, a carboxylic acid halide group and a carboxylic acid anhydride group.
분자량 2,000 이상의 실리콘쇄의 편말단에, 라디칼 생성능을 갖는 관능기를 갖는 화합물(A)과, 불소 원자가 결합한 탄소 원자의 수가 1∼6인 불소화 알킬기(x)를 갖는 중합성 불포화 단량체(B)를 반응계 내에 투입하고, 상기 화합물(A)로부터 라디칼을 생성시킴에 의해, 상기 중합성 불포화 단량체(B) 유래의 구조를 포함하는 중합체 세그먼트(p)를 얻는 공정(1)과,
당해 중합체 세그먼트(p)를 포함하는 반응계 내에, 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)를 투입하고, 당해 중합체 세그먼트(p)로부터 라디칼을 생성시킴에 의해, 중합체 세그먼트(p) 및 중합성 불포화 단량체(C) 유래의 구조를 포함하는 중합체 세그먼트(q1)를 포함하는 중합체(Q1)를 얻는 공정(2)과,
중합체(Q1)를 포함하는 반응계 내에, 중합체(Q1)가 갖는 반응성 관능기(c1)에 대하여 반응성을 갖는 관능기(d1) 및 중합성 불포화기(d2)를 갖는 화합물(D)을 투입하고, 반응성 관능기(c1)와 반응성을 갖는 관능기(d1)를 반응시키는 공정(3)을 포함하는 제조 방법에 따라 얻어지는 것인 중합성 수지.The method of claim 5,
The reaction system is a compound (A) having a functional group having a radical generating ability and a polymerizable unsaturated monomer (B) having a fluorinated alkyl group (x) having 1 to 6 carbon atoms bonded to a fluorine atom at one end of a silicone chain having a molecular weight of 2,000 or more. A step (1) of introducing a polymer segment (p) containing a structure derived from the polymerizable unsaturated monomer (B) by introducing it into the compound and generating radicals from the compound (A);
By introducing a polymerizable unsaturated monomer (C) having a reactive functional group (c1) into the reaction system containing the polymer segment (p) and generating radicals from the polymer segment (p), the polymer segment (p) and Step (2) of obtaining a polymer (Q1) containing a polymer segment (q1) containing a structure derived from a polymerizable unsaturated monomer (C),
In the reaction system containing the polymer (Q1), a compound (D) having a functional group (d1) and a polymerizable unsaturated group (d2) reactive with respect to the reactive functional group (c1) possessed by the polymer (Q1) are introduced, and the reactive functional group A polymerizable resin obtained according to a production method comprising a step (3) of reacting a functional group (d1) having reactivity with (c1).
분자량 2,000 이상의 실리콘쇄의 편말단에, 라디칼 생성능을 갖는 관능기를 갖는 화합물(A)과, 반응성 관능기(c1)를 갖는 중합성 불포화 단량체(C)를 반응계 내에 투입하고, 상기 화합물(A)로부터 라디칼을 생성시킴에 의해, 상기 중합성 불포화 단량체(C) 유래의 구조를 포함하는 중합체 세그먼트(q)를 얻는 공정(1-1)과,
당해 중합체 세그먼트(q)를 포함하는 반응계 내에, 중합성 불포화 단량체(B)를 투입하고, 당해 중합체 세그먼트(q)로부터 라디칼을 생성시킴에 의해, 중합체 세그먼트(q) 및 중합성 불포화 단량체(B) 유래의 구조를 포함하는 중합체 세그먼트를 포함하는 중합체(Q2)를 얻는 공정(2-1)과,
중합체(Q2)를 포함하는 반응계 내에, 중합체(Q2)가 갖는 반응성 관능기(c1)에 대하여 반응성을 갖는 관능기(d1) 및 중합성 불포화기(d2)를 갖는 화합물(D)을 투입하고, 반응성 관능기(c1)와 반응성을 갖는 관능기(d1)를 반응시키는 공정(3-1)을 포함하는 제조 방법에 따라 얻어지는 것인 중합성 수지.The method of claim 5,
A compound (A) having a functional group having a radical generating ability and a polymerizable unsaturated monomer (C1) having a reactive functional group (c1) are added to one end of a silicone chain having a molecular weight of 2,000 or more into the reaction system, and radicals from the compound (A) Step (1-1) of obtaining a polymer segment (q) containing a structure derived from the polymerizable unsaturated monomer (C) by producing
The polymer segment (q) and the polymerizable unsaturated monomer (B) are introduced into the reaction system containing the polymer segment (q) by introducing a polymerizable unsaturated monomer (B) and generating radicals from the polymer segment (q). Step (2-1) of obtaining a polymer (Q2) containing a polymer segment containing a derived structure,
In the reaction system containing the polymer (Q2), a compound (D) having a functional group (d1) and a polymerizable unsaturated group (d2) reactive with respect to the reactive functional group (c1) possessed by the polymer (Q2) are introduced, and the reactive functional group A polymerizable resin obtained according to a production method comprising the step (3-1) of reacting a functional group (d1) having reactivity with (c1).
상기 제1 중합체 세그먼트(α)와 제2 중합체 세그먼트(β)를, 질량비[(α)/(β)]로 20/80∼80/20이 되는 범위에서 갖는 중합성 수지.The method according to any one of claims 5 to 7,
A polymerizable resin having the first polymer segment (α) and the second polymer segment (β) in a range of 20/80 to 80/20 in a mass ratio [(α) / (β)].
상기 화합물(A)이 갖는 라디칼 생성능을 갖는 관능기가, 할로겐 원자를 갖는 유기기, 알킬텔루륨기를 갖는 유기기, 디티오에스테르기를 갖는 유기기, 퍼옥시드기를 갖는 유기기 또는 아조기를 갖는 유기기로 이루어지는 군에서 선택되는 1종 이상의 관능기인 중합성 수지.The method of claim 6 or 7,
The functional group having a radical generating ability of the compound (A) is composed of an organic group having a halogen atom, an organic group having an alkyl tellurium group, an organic group having a dithioester group, an organic group having a peroxide group, or an organic group having an azo group Polymerizable resin which is one or more functional groups selected from the group.
상기 화합물(A)이 갖는 실리콘쇄가 분자량 2,000∼20,000의 실리콘쇄인 중합성 수지.The method of claim 6 or 7,
The polymerizable resin in which the silicone chain of the compound (A) is a silicone chain having a molecular weight of 2,000 to 20,000.
상기 화합물(A)이 갖는 라디칼 생성능을 갖는 관능기가, 할로겐 원자를 갖는 유기기, 알킬텔루륨기를 갖는 유기기 또는 디티오에스테르기를 갖는 유기기이며, 또한 상기 화합물(A)에 상기 중합성 불포화 단량체(B)와 중합성 불포화 단량체(C)를 공중합시키는 중합법이, 리빙 라디칼 중합인 중합성 수지. The method of claim 6 or 7,
The functional group having a radical generating ability of the compound (A) is an organic group having a halogen atom, an organic group having an alkyltellurium group, or an organic group having a dithioester group, and the polymerizable unsaturated monomer in the compound (A) The polymerizable resin in which the polymerization method for copolymerizing (B) and the polymerizable unsaturated monomer (C) is living radical polymerization.
상기 리빙 라디칼 중합이, 중합 개시제, 천이 금속 화합물 및 당해 천이 금속과 배위 결합 가능한 배위자를 갖는 화합물의 존재하에서 행하는 원자 이동형 라디칼 중합인 중합성 수지. The method of claim 11,
A polymerizable resin in which the living radical polymerization is an atomic transfer radical polymerization performed in the presence of a polymerization initiator, a transition metal compound, and a compound having a ligand capable of coordinating bonds with the transition metal.
상기 반응성 관능기(c1)가 수산기, 이소시아네이트기, 에폭시기, 카르복시기, 카르복시산할라이드기 및 카르복시산 무수물기로 이루어지는 군에서 선택되는 1종 이상의 관능기인 중합성 수지.The method of claim 6 or 7,
The polymerizable resin wherein the reactive functional group (c1) is at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, an epoxy group, a carboxy group, a carboxylic acid halide group and a carboxylic acid anhydride group.
상기 화합물(A)로부터 라디칼을 생성시킴에 의해 상기 중합성 불포화 단량체(B)와 상기 중합성 불포화 단량체(C)를 공중합시켜서 얻어지는 공중합체(P)에, 상기 화합물(D)을 반응시키는 제조 방법이며,
화합물(A)이 갖는 라디칼 생성능을 갖는 관능기가, 할로겐 원자를 갖는 유기기, 알킬텔루륨기를 갖는 유기기 또는 디티오에스테르기를 갖는 유기기이며, 또한 상기 화합물(A)에 상기 중합성 불포화 단량체(B)와 중합성 불포화 단량체(C)를 공중합시키는 중합법이, 리빙 라디칼 중합인 것을 특징으로 하는 중합성 수지의 제조 방법.Compound (A) having a functional group having a radical generating ability and a fluorinated alkyl group having 1 to 6 fluorinated alkyl groups having a fluorine atom bonded to one end of a silicone chain having a molecular weight of 2,000 or more, and a reactive functional group (c1) It is a method for producing a polymerizable resin using a polymerizable unsaturated monomer (C) having a functional group (d1) having a reactivity to the functional group (c1) and a compound (D) having a polymerizable unsaturated group (d2),
A production method in which the compound (D) is reacted with a copolymer (P) obtained by copolymerizing the polymerizable unsaturated monomer (B) and the polymerizable unsaturated monomer (C) by generating radicals from the compound (A). And
The functional group having a radical generating ability of the compound (A) is an organic group having a halogen atom, an organic group having an alkyltellurium group or an organic group having a dithioester group, and the polymerizable unsaturated monomer ( The polymerization method for copolymerizing B) and the polymerizable unsaturated monomer (C) is a living radical polymerization method.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2013-117807 | 2013-06-04 | ||
JP2013117807 | 2013-06-04 | ||
JPJP-P-2014-042738 | 2014-03-05 | ||
JP2014042738 | 2014-03-05 | ||
PCT/JP2014/064244 WO2014196441A1 (en) | 2013-06-04 | 2014-05-29 | Polymerizable resin, active energy ray-curable composition, and article |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160015216A KR20160015216A (en) | 2016-02-12 |
KR102095263B1 true KR102095263B1 (en) | 2020-04-01 |
Family
ID=52008088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157033090A Active KR102095263B1 (en) | 2013-06-04 | 2014-05-29 | Polymerizable resin, active energy ray-curable composition, and article |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5854303B2 (en) |
KR (1) | KR102095263B1 (en) |
TW (1) | TWI609042B (en) |
WO (1) | WO2014196441A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PL3305840T3 (en) * | 2016-10-05 | 2021-05-04 | Evonik Operations Gmbh | Compatibilizer for universal colorant in solventborne alkyd paints |
WO2019239817A1 (en) * | 2018-06-15 | 2019-12-19 | Dic株式会社 | Pressure-sensitive adhesive composition and layered film obtained using same |
WO2020017251A1 (en) * | 2018-07-19 | 2020-01-23 | Dic株式会社 | Actinic energy ray curable composition, and cured film and antireflection film thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004043804A (en) | 2002-06-19 | 2004-02-12 | Byk Chem Gmbh | Leveling agent for coating composition |
JP2004182765A (en) | 2002-11-29 | 2004-07-02 | Lintec Corp | Hard coat film |
US20090087399A1 (en) | 2007-09-27 | 2009-04-02 | Dirk Kuppert | Polysiloxane block copolymers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5200436A (en) * | 1989-08-14 | 1993-04-06 | Minnesota Mining And Manufacture Company | Siloxane iniferter compounds, block copolymers made therewith and a method of making the block copolymers |
KR20010102496A (en) * | 1999-03-05 | 2001-11-15 | 맥켈러 로버트 루이스 | Use of an initiator for controlled polymerisation reactions |
EP1961775A4 (en) * | 2005-12-15 | 2010-09-01 | Asahi Glass Co Ltd | FLUORINATED POLYMER, NEGATIVE PHOTOSENSITIVE COMPOSITION AND SEPARATION PARTITION |
JP2007262287A (en) * | 2006-03-29 | 2007-10-11 | Dainippon Ink & Chem Inc | Coating composition |
JP5574088B2 (en) * | 2009-01-28 | 2014-08-20 | Jsr株式会社 | Radiation sensitive resin composition, spacer for liquid crystal display element and method for forming the same |
KR20100088531A (en) * | 2009-01-30 | 2010-08-09 | 디아이씨 가부시끼가이샤 | Fluorine-containing radical-polymerizable copolymer, active energy ray-curable resin composition using the same and manufacturing method of fluorine-containing radical-polymerizable copolymer |
JP4816986B1 (en) * | 2010-09-06 | 2011-11-16 | Jsr株式会社 | Curable composition and antireflection laminate |
JP5962954B2 (en) * | 2012-01-27 | 2016-08-03 | Dic株式会社 | Fluorine atom-containing silicone-based polymerizable resin, active energy ray-curable composition using the same, cured product and article thereof |
-
2014
- 2014-05-29 WO PCT/JP2014/064244 patent/WO2014196441A1/en active Application Filing
- 2014-05-29 KR KR1020157033090A patent/KR102095263B1/en active Active
- 2014-05-29 JP JP2015521412A patent/JP5854303B2/en active Active
- 2014-06-03 TW TW103119194A patent/TWI609042B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004043804A (en) | 2002-06-19 | 2004-02-12 | Byk Chem Gmbh | Leveling agent for coating composition |
JP2004182765A (en) | 2002-11-29 | 2004-07-02 | Lintec Corp | Hard coat film |
US20090087399A1 (en) | 2007-09-27 | 2009-04-02 | Dirk Kuppert | Polysiloxane block copolymers |
Also Published As
Publication number | Publication date |
---|---|
JP5854303B2 (en) | 2016-02-09 |
TW201512285A (en) | 2015-04-01 |
JPWO2014196441A1 (en) | 2017-02-23 |
WO2014196441A1 (en) | 2014-12-11 |
KR20160015216A (en) | 2016-02-12 |
TWI609042B (en) | 2017-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5794474B2 (en) | Fluorine-containing polymerizable resin, active energy ray-curable composition using the same, and cured product thereof | |
EP2554554B1 (en) | Curable fluorine-containing resin and active energy ray curable composition using same | |
TWI464224B (en) | A fluoropolymerizable polymer and an active energy ray hardening type composition using the same | |
JP5187471B2 (en) | Fluorine-containing curable resin, active energy ray-curable composition and cured product thereof | |
KR20100088531A (en) | Fluorine-containing radical-polymerizable copolymer, active energy ray-curable resin composition using the same and manufacturing method of fluorine-containing radical-polymerizable copolymer | |
JP5397686B2 (en) | Fluorine-containing curable resin, active energy ray-curable coating composition and cured product thereof | |
JP5887834B2 (en) | Fluorine-containing polymerizable resin, active energy ray-curable composition using the same, and cured product thereof | |
KR102095263B1 (en) | Polymerizable resin, active energy ray-curable composition, and article | |
JP5939419B2 (en) | Fluorine atom-containing silicone-based polymerizable resin, active energy ray-curable composition using the same, cured product and article thereof | |
JP6112334B2 (en) | Fluorine atom-containing polymerizable resin, active energy ray-curable composition using the same, cured product and article thereof. | |
JP5487859B2 (en) | Fluorine-containing curable resin, active energy ray-curable coating composition and cured product thereof | |
JP6405647B2 (en) | Polymerizable resin, active energy ray-curable composition and article. | |
WO2011122392A1 (en) | Fluorine-containing styrene compound and active energy ray curable composition using same | |
WO2021256131A1 (en) | Fluorine-containing polymerizable resin, active energy ray-curable composition, cured coating film, and article | |
KR20230160706A (en) | Liquid repellent agent, active energy ray curable composition, cured product and display device | |
JP2013040317A (en) | Silicone-based polymerizable resin, active energy ray curable composition using the same, and cured product of the active energy ray curable composition | |
JP2013087213A (en) | Fluorine-containing polymerizable resin, active energy ray-curable composition using the same, and cured product thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20151119 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20190411 Comment text: Request for Examination of Application |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20200313 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20200325 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20200326 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20240226 Start annual number: 5 End annual number: 5 |