KR102069613B1 - Apparatus for irradiating light - Google Patents

Abstract

The substrate processing apparatus according to the present invention has a transmission window through which light can be transmitted, and is provided above the stage on which the substrate is seated to irradiate the light onto the substrate, and to allow the incident light reflected from the substrate to pass through the transmission window. Located in the upper side of the transmission window, and includes a dump having a dissipation induction portion provided with a first groove for trapping light and reflecting a plurality of times.
Therefore, according to the embodiment of the present invention, it is possible to further increase the number of reflections of the laser beam, thereby preventing the dump from being degraded by the heat of the laser beam. For this reason, it is possible to prevent the deterioration of mura on the substrate due to the change in the airflow around the dump due to the deterioration of the dump during the progress of the process.

Description

Substrate Processing Unit {APPARATUS FOR IRRADIATING LIGHT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus and to a substrate processing apparatus capable of preventing generation of MURA due to deterioration on a substrate.

In manufacturing a liquid crystal display device, a photovoltaic device, and the like, a heat treatment process for crystallizing an amorphous polycrystalline thin film (for example, an amorphous polycrystalline silicon thin film) is involved. In this case, when glass is used as a substrate, the amorphous polycrystalline thin film is crystallized using a laser. When the amorphous polycrystalline thin film reacts with oxygen (O ₂ ), it is oxidized to form an oxide thin film, and impurities contaminate the thin film. Problems or change their properties.

Conventional laser substrate processing apparatus is also disclosed in Korea Patent Publication No. 2011-0071591, the process chamber 10 having a space in which the substrate 1 is processed therein, the process chamber 10 is installed inside the substrate is placed thereon And, the stage 2 to be transferred in the process progress direction, the upper part of the process chamber 10, the transmission window 40 that can transmit the laser 8, the transmission window 40 from the outside of the process chamber 10 ) Is installed on the upper side of the transmission window 40 outside the process chamber 10, the light source 30 that outputs the laser 8, and is reflected from the substrate 1 to reflect the transmission window 40. A dump 50 that absorbs the transmitted reflected light is included (see FIG. 8).

On the other hand, the laser 61 outputted from the light source 30 and irradiated onto the substrate 1 is reflected 62 in the opposite direction, ie, upward direction, symmetrical with the incident direction, and passes through the transmission window 40 again, and transmits the transmission window 40. It enters into the dump 50 located above the window 40. At this time, the laser is partially offset by the dump 50, but is not completely extinguished, and is again reflected by the dump 50 to be incident to the transmission window 40. As the temperature of the transmission window 40 is uneven due to the repeated incidence of the reflected light and the temperature is continuously raised, when the laser penetrates the transmission window 40 and irradiates the substrate 1 for the crystallization process, There is a problem that mura occurs.

In addition, as the laser is repeatedly absorbed in the dump 50, the temperature of the dump 50 rises, thereby raising the temperature of the parts around the dump 50 and thermally deforming. This is a factor in which the laser beam irradiated onto the substrate 1 is shifted.

Korean Laid-Open Patent 2011-0071591

The present invention provides a substrate processing apparatus that can prevent deterioration of a dump.

SUMMARY OF THE INVENTION The present invention provides a substrate processing apparatus for causing light that is reflected and incident into the dump to be dissipated within the dump.

The present invention is a dump that is installed on the upper side of the transmission window capable of transmitting light, and the light reflected from the object disposed below the transmission window to block the incident to the transmission window, one end is located corresponding to the upper side of the transmission window, A dump body extending to the other end so as to be located outside the width direction of the transmission window; And an extinction induction part provided in the dump body to reflect the light incident through the transmission window into the dump body a plurality of times and to extinguish the light.

The inner space of the dump body provided with the extinction induction part is formed to be narrower from one end of the dump body toward the other end.

The extinction induction part includes a first extinction induction part including an inner wall of the dump body that defines an inner space of the dump body, and the first extinction induction part comprises: an upper wall located above the dump body inner space; A lower wall facing the upper wall; One side wall of an inner space of the dump body corresponding to one end of the dump body; And

And the other side wall of the inner space of the dump body corresponding to the other end of the dump body.

An upper wall of the first extinction induction part is formed to face the transmission window, the first upper reflecting surface receiving light reflected from the target object and incident into the dump body and reflecting the light toward the other side wall of the dump body; A second upper reflecting surface extending from the first upper reflecting surface to be inclined downward toward the other wall to receive and reflect light; And a third upper reflection surface extending from the second upper reflection surface to the other side wall to receive and reflect light.

The first upper reflecting surface has a concave curvature in the inward direction of the dump body, and is formed so that at least a portion thereof faces the lower wall.

Unevenness is provided in at least one of the upper wall, the lower wall, and the other side wall of the first extinction induction part.

The extinction induction part is formed in at least one of the upper wall, the lower wall and the other side wall extending inwardly so as to communicate with the internal space of the dump body, a second groove having a light trapped inside and reflecting a plurality of times An extinction induction part.

The first groove is provided in the upper wall

The first groove is provided in the third upper reflective surface of the upper wall.

Unevenness is provided on an inner wall of the upper wall that partitions the first groove.

The extinction induction part is provided so that at least a portion of an outer circumferential surface of the dump body is spaced apart from an inner wall of the dump body, and reflects light reflected from the inner wall of the dump body again to induce extinction of the light. It includes; 3 induction extinction.

The third extinction induction part, in the internal space of the dump body, the extinction induction body is installed so that at least a portion of the outer peripheral surface is spaced apart from the inner wall of the dump body; And a second groove extending in an inward direction from the outer circumferential surface of the second groove to trap light therein and reflect the light a plurality of times.

Unevenness is provided on at least one of an outer circumferential surface of the extinction induction body and an inner wall of the extinction induction body that defines the second groove.

The third extinction guide unit is installed to be adjacent to the other side wall in comparison with the one side wall in the dump body.

The third extinction induction part extends from the third upper reflection surface position in the direction of the other side wall of the dump body.

The second groove extends in one direction facing one side wall of the dump body from the other end of the outer circumferential surface of the decay induction body facing the other side wall of the dump body, and the second groove is formed in the decay induction body. The other end direction is opened.

A light irradiator having a transmission window through which light can be transmitted and irradiating the light to a substrate; A dump positioned on an upper side of the transmission window to allow incidence of light transmitted through the transmission window and reflecting the light incident through the transmission window into the dump body a plurality of times to extinguish the light; Include.

And a cutter located between the transmission window and the dump, the cutter extending from the position corresponding to the transmission window in an outward direction of the transmission window opposite to the dump and inclined downward toward the transmission window.

The dump may include a dump body having one end corresponding to an upper side of the transmission window and the other end extended to be positioned outside the width direction of the transmission window, and the inner space of the dump body may be wider from one end of the dump body to the other end. It is formed so as to narrow, the extinction induction is provided in the dump body.

The extinction induction part includes a first extinction induction part including an inner wall of the dump body that defines an internal space of the dump body, and the inner wall of the first extinction induction part reflects light incident into the dump body a plurality of times. While guiding the light toward the other end of the dump body.

The first extinction induction part, the upper wall located on the upper side of the dump body internal space; A lower wall facing the upper wall; One side wall of an inner space of the dump body corresponding to one end of the dump body; And the other side wall of the inner space of the dump body corresponding to the other end of the dump body.

The upper wall may include a first upper reflection surface formed to face the transmission window and the lower wall, and receive light reflected from the substrate to be incident into the dump body and reflect the light toward the other side wall of the dump body; A second upper reflecting surface extending from the first upper reflecting surface to be inclined downward toward the other side wall, the second upper reflecting surface facing the cutter to receive and reflect light reflected from the cutter; And a third upper reflection surface extending from the second upper reflection surface to the other side wall to receive and reflect light.

The first upper reflecting surface has a concave curvature in the inward direction of the dump body to reflect light reflected from the substrate toward the other side wall in the dump body, and at least a portion thereof is formed to face the lower wall.

The extinction induction part is formed in at least one of the upper wall, the lower wall and the other side wall extending inwardly so as to communicate with the internal space of the dump body, a second groove having a light trapped inside and reflecting a plurality of times An extinction induction part.

The first groove is provided in the third upper reflective surface of the upper wall.

The extinction induction part is provided so that at least a portion of an outer circumferential surface of the dump body is spaced apart from an inner wall of the dump body, and reflects light reflected from the inner wall of the dump body again to induce extinction of the light. It includes; 3 induction extinction.

The third extinction induction part, in the internal space of the dump body, the extinction induction body is installed so that at least a portion of the outer peripheral surface is spaced apart from the inner wall of the dump body; And a second groove extending in an inward direction from the outer circumferential surface of the second groove to trap light therein and reflect the light a plurality of times.

The third extinction guide unit is installed to be adjacent to the other side wall in comparison with the one side wall in the dump body.

The second groove extends in one direction facing one side wall of the dump body from the other end of the outer circumferential surface of the decay induction body facing the other side wall of the dump body, and the second groove is formed in the decay induction body. The other end direction is opened.

According to the embodiment of the present invention, the number of reflections of the laser beam can be increased more than in the related art by providing the extinction induction part having the first groove inside the dump body. Further, by providing a second groove in the inner wall of the dump body, and forming an unevenness in at least one of the inner wall of the dump body, the inner wall around the first and second grooves, and the outer peripheral surface of the extinction guide body, the number of reflections of the laser beam is increased. Can be increased. Therefore, according to the embodiment of the present invention, the deterioration of the dump due to the heat of the laser beam can be prevented, and accordingly, the substrate is deteriorated in accordance with the change in the airflow around the dump due to the deterioration of the dump during the progress of the process. ) Can be prevented from occurring.

In addition, by cooling the dump by providing a cooling unit in the dump during the process, it is possible to prevent the temperature rise and temperature non-uniformity of the dump due to the heat of the reflected light, thereby preventing thermal deformation. In addition, since the dump 5140 is cooled by the cooling unit 5150, it is possible to prevent the surrounding temperature from rising due to the heat of the dump as in the related art.

Then, the temperature of the dump is measured by the temperature sensor during the process, the operator can monitor this in real time. Thus, if the temperature of the dump measured by the temperature sensor exceeds the reference temperature, the operator can know whether the risk of deterioration in the dump through this, it is possible to perform the maintenance work of the substrate processing apparatus as needed.

1 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention.
2 is a front sectional view showing main parts of a substrate processing apparatus according to an embodiment of the present invention;
3 is an enlarged view of an extinction inducing body and a first groove according to an exemplary embodiment of the present invention.
4 is a conceptual diagram illustrating a movement and reflection path of a laser beam reflected from an upper cutter and then incident into a dump after being irradiated onto a substrate, and thus an extinction process accordingly;
FIG. 5 is a conceptual diagram illustrating a movement and reflection path of a laser beam reflected from a lower cutter and then incident into a dump after being irradiated to a substrate, and a process of disappearing accordingly
FIG. 6 is a conceptual diagram illustrating a movement and reflection path of a laser beam, which is mainly reflected back from the substrate and immediately incident into the dump after being irradiated to the substrate, and thus an extinction process
7 is a top view as viewed from the top of the cooling unit according to an embodiment of the present invention.
8 is a conceptual diagram illustrating a substrate processing apparatus;

Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, only the embodiments of the present invention make the disclosure of the present invention complete, and the scope of the invention to those skilled in the art. It is provided for complete information.

1 is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention. 2 is a front sectional view showing the main part of a substrate processing apparatus according to an embodiment of the present invention. 3 is an enlarged view illustrating an extinction induction body and a first groove according to an exemplary embodiment of the present invention. FIG. 4 is a conceptual diagram illustrating a movement and reflection path of a laser beam reflected from an upper cutter and then incident into a dump after being irradiated to a substrate, and thus an extinction process. FIG. 5 is a conceptual diagram illustrating a movement and reflection path of a laser beam reflected from a lower cutter and then incident into a dump after being irradiated to a substrate, and thus an extinction process. FIG. 6 is a conceptual diagram illustrating a movement and reflection path of a laser beam, which is mainly reflected back from the substrate and immediately incident into the dump after being irradiated to the substrate, and thus an extinction process. 7 is a top view as viewed from the top of the cooling unit according to the embodiment of the present invention. 8 is a conceptual diagram illustrating a substrate processing apparatus.

1 is a substrate processing apparatus according to an embodiment of the present invention is installed in the process chamber 100, the process chamber 100 having an internal space in which the substrate S can be processed, and the substrate S is placed thereon. And a stage 200 for horizontally transferring the substrate S in a process progress direction and a light source disposed outside the process chamber 100 to output light for processing the substrate S, for example, a laser. 300, a transmissive window 5111 is installed on a portion of the upper wall of the process chamber 100 to transmit the light output from the light source 300, and guides the light transmitted through the transmissive window 5111 to the substrate S. And a light irradiation module 5000 for irradiating the guided light onto the substrate S and injecting an inert gas onto the substrate S to which light is irradiated.

In the embodiment, since the substrate S is processed using a laser beam, 'light' is described as an example of a laser beam. Of course, the light is not limited to the laser beam, and may be changed into various kinds of light according to the product, process conditions, process fields, etc. to be manufactured, and various forms of light, such as spots, that are not beams. Can be changed to

The process chamber 100 according to the embodiment may have a cylindrical shape having a rectangular cross section, but is not limited thereto and may be changed into various shapes corresponding to the substrate S. FIG. A transmission window 5111 made of, for example, quartz is installed on the upper wall of the process chamber 100. The transmission window 5111 is installed on a part of the upper wall of the process chamber 100, and irradiates light. It is preferably installed to cover the top of the module 5000. Of course, the transmission window 5111 is not limited to covering the upper portion of the light irradiation module 5000 or installed on the upper wall of the process chamber 100, and the light output from the light source 300 is inside the light irradiation module 5000. It may be installed in any position that allows delivery to

Meanwhile, although the process chamber 100 is a sealed structure, there may be oxygen (O ₂ ) or impurities therein. Here, oxygen (O ₂ ) oxidizes the thin film 11 formed on the substrate (S), and the impurities may be particulate powder or gaseous process by-products or other contaminants generated during the process. The quality of the thin film 11 is deteriorated or the property is changed to cause a defect.

In order to solve the problem caused by oxygen (O ₂ ) and impurities penetrating the upper side of the substrate (S), the light irradiation module 500 is sprayed with an inert gas to the upper side of the substrate (S) substrate S is irradiated with light The region is formed in an inert gas atmosphere. The light irradiation module 5000 may be referred to as an oxygen partial degassing module (OPDM).

The light irradiation module 5000 is positioned between the light irradiation unit 5100 and the light irradiation unit 5100 and the stage 200 to guide the laser beam output from the light source 300 to the substrate S. And a gas injection unit 5200 mounted below the light irradiation unit 5100 and injecting an inert gas onto the substrate S to which the laser beam is being irradiated.

The light irradiation unit 5100 includes a transmission window 5111 through which light, ie, a laser beam, can pass, and is located above the light irradiator 5120 and the light irradiator 5120 that irradiate light, ie, a laser beam, toward the substrate. And a dump 5140 reflecting and extinguishing the laser beam reflected from the substrate through the transmission window a plurality of times, and positioned between the light source 300 and the transmission window 5111 outside the process chamber 100, and irradiating direction of light. Is installed on the cutter 5130, the dump 5140, which is installed obliquely with respect to the light output from the light source 300 and directed to the transmission window 5111, that is, cutting or screening a part of the laser beam. A cooling unit 5150 for cooling 5140 and a temperature sensor 5160 for measuring the temperature of the dump 5140.

The light irradiator 5120 is connected or mounted to a lower portion of the first body 5100a and the first body 5100a having an inner space through which the light can pass, and is upward and downward in an inner space of the first body 5100a. And a transmission window 5111 mounted on the second body 5100b and an upper portion of the first body 5100a to communicate with each other, and through which light output from the light source 300 is transmitted.

Here, the internal space provided in each of the first and second bodies 5100a and 5100b extends in a direction crossing the direction in which the substrate S is transferred. The transmission window 5111 is installed above the first body 5100a so as to correspond to an upper side of the inner space of the second body 5100b to close the openings of the first body and the second bodies 5100a and 5100b. Or close.

The cutter 5130 extends in a direction crossing the direction in which the substrate S is transferred or in a direction corresponding to the dump 5140, and is positioned between the dump 5140 and the transmission window 5111 and includes a transmission window ( 5111 is installed to be inclined downwardly in the direction in which it is located.

In addition, the cutter 5130 is formed to extend in a direction in which the transmission window 5111 is positioned from a structure located outside the transmission window 5111 such as the first body 5100a, so that at least a partial region is formed on the upper side of the transmission window 5111. It is installed to correspond to the position. That is, a partial region of the transmission window 5111 is provided to be covered by the cutter 5130. More specifically, the cutter 5130 is located above and below the transmission window 5111 in a vertical position, and a part of the cutter 5130 is located outside the transmission window 5111 on the basis of the width direction (or left and right direction), and the rest of the transmission window ( 5111). In other words, the partial width direction position of the cutter 5130 overlaps with the width direction position of the transmission window 5111. At this time, the cutter 5130 is not installed to cover all of the upper side of the transmission window 5111, but is installed to cover a part of the transmission window 5111, for example, a cutter 5130 corresponding to the upper side of the transmission window 5111. ) Is provided so as to correspond to the center in the left and right width directions of the transmission window 5111 or a position adjacent to the center.

The cutter 5130 according to the embodiment extends in a direction crossing each direction in which the substrate S is transferred or in a direction corresponding to the dump 5140, and a pair of cutters (hereinafter, upper part) spaced apart in the vertical direction. Cutter 5130a, lower cutter 5130b). That is, the lower cutter 5130b and the upper cutter 5130a are disposed above the transmission window 5111 so as to be positioned above the lower cutter 5130b.

In the light irradiation unit 5100, the laser beam output from the light source 300 passes through the transmission window 5111, and then passes through internal spaces of the first body 5100a and the second body 5100b. It moves to the inner space of the gas injection unit 5200. Therefore, hereinafter, an interior space provided in the light irradiation unit 5100 corresponding to the area between the transmission window 5111 and the substrate S, that is, the interior provided in the first and second bodies 5100a and 5100b for convenience of explanation. The space is called "first light irradiation space 5110". As described above, the first light irradiation space 5110 penetrates a part of the first body 5100a and the second body 5100b between the transmission window 5111 and the substrate S in the vertical direction. It is formed, and extends in one direction of the substrate (S). The first light irradiation space 5110 according to the embodiment is formed such that the length (or height) in the vertical direction is longer than the width in the left and right directions.

The gas injection unit 5200 irradiates the light passing through the first light irradiation space 5110 of the light irradiation unit 5100 to the substrate S, injects an inert gas toward the substrate S, and at least a laser beam. The substrate S region being irradiated is a means for forming in an inert gas atmosphere so as not to be exposed to oxygen and impurities. The gas injection unit 5200 is mounted to the lower portion of the light irradiation unit 5100, and has an internal space (hereinafter, referred to as a second light irradiation space 5410) communicating with the first light irradiation space 5110, and the substrate S. Gas injection block 5400 which is formed to extend in a direction intersecting with the moving direction of the beams and includes a slit (hereinafter referred to as a first slit 5410a) through which the laser beam and the gas which have passed through the second light irradiation space 5410 pass. And a gas supply unit 5300 and a gas supply unit 5300 installed in the gas injection block 5400 to be located at one side of the second light irradiation space 5410 to supply an inert gas to the second light irradiation space 5410. It is connected to both ends of the gas supply pipe for supplying an inert gas (not shown) and is mounted on the lower portion of the gas injection block 5400 plate-shaped plate (5500) located above the substrate (S).

The gas supply part 5300 is a means for supplying an inert gas into the second light irradiation space 5410, and the gas supply part 530 according to the embodiment may be connected to the side direction of the second light irradiation space 5410. Block 5400. That is, the gas supply part 5300 is formed to extend in the gas injection block 5400, one end of which is connected to the side of the second light irradiation space 5410, and the other end thereof includes a gas storage part (not shown) in which an inert gas is stored. Connected. The gas supply part 5300 inserts a pipe-shaped tube into the gas injection block 5400 so that one end thereof is connected to the side of the second light irradiation space 5410, or the gas injection block 5400 itself is processed. It may be provided so as to communicate with the side of the second light irradiation space (5410).

In addition, the gas supply part 5300 may be, for example, a double tube structure including an outermost tube, that is, an outer tube and an inner tube located inside the outer tube. In this case, when one end of the gas supply unit 5300 which is connected to the second light irradiation space 5410 and discharges the inert gas into the second light irradiation space 5410 is called a discharge slit, the discharge slit is shown in FIG. 2. As shown in the form of a line, it may be provided to be inclined downward. In addition, in other words, at least a part of the region of the gas supply part 5300 corresponding to the front end of the discharge slit is bent a plurality of times.

Of course, the shape of the gas supply unit 5300 is not limited to the above-described shape, and may be changed to various shapes and configurations capable of supplying an inert gas to the second light irradiation space 5410.

The plate 5500 is connected to the lower portion of the gas injection block 5400 and positioned above the stage 200 on which the substrate S is placed. The plate 5500 according to the embodiment extends in both directions from the first slit 5400a provided in the gas injection block 5400. The plate 5500 is provided with a slit 5500a (hereinafter referred to as a second slit 5500a) through which a laser beam and an inert gas can pass. The plate 5500 is positioned below the first slit 5400a. Accordingly, the laser beam passing through the first slit 540a of the gas injection block 5400 passes through the second slit 5500a of the plate 5500 and is irradiated onto the substrate. In addition, the inert gas discharged from the second slit 5500a through the first slit 540a of the gas injection block 5400 is spread to the gap between the plate 5500 and the substrate S.

The dump 5140 functions to extinguish the reflected beam so that the light reflected from each of the substrate S and the cutter 5130 does not again face the transmission window 5111. The dump 5140 is installed above the transmission window 5111 and the cutter 5130 at the upper outside of the process chamber 100. The dump 5140 is transmissive to one side of the cutter 5130 and the transmission window 5111 to which light is transmitted, and has a space (that is, an internal space) to which light incident therein moves. It has a structure that reflects light a plurality of times so that extinction is possible.

Referring to the dump 5140 in more detail, the dump 5140 extends in a direction corresponding to the cutter 5130 and the transmission window 5111 or in a direction crossing the moving direction of the substrate S, thereby cutting the cutter 5130. And a body having an empty space, ie, an inner space (hereinafter referred to as a dump body 5251) and a dump body 551, which are installed to face the upper side of the transmission window 5111 and have an internal space where light incident therein can move. The cover member 5252 and the tipper body 5151 which are installed at a position facing or opposing the 5130 and the transmission window 5111 and sealing the internal space of the tipper body 5151, are capable of transmitting the laser beam. Internally, included in the dump body (5141), including the extinction induction portion (5143) to induce extinction by causing the light incident into the dump body (5141) is reflected a plurality of times in various paths.

The dump body 5151 is positioned above the cutter on the upper and lower sides, and extends from the transmission window 5111 to the outside of the transmission window 5111 in the width direction (or left and right direction). This will be described with reference to the transmission window 5111 again, and the cutter 5130 and the dump body 5151 are formed to extend in opposite directions to each other. That is, for example, the cutter 5130 is formed to extend in one side outward direction of the transmission window 5111 from a position corresponding to the transmission window 5111, the dump body 5151 is a position corresponding to the transmission window 5111 Is formed extending from the other side of the transmission window (5111). Then, some regions of the cutter 5130 and the transmission window 5111 are provided to be covered by the dump body 5151. More specifically, the dump body (5141) is located on the upper side of the cutter 5130 and the transmission window (5111) in the vertical position, and part of the cutter 5130 and the transmission window (5111) on the basis of the width direction (or horizontal direction). ), And the rest is located outside the transmission window (5111). In other words, a part of the width direction position of the dump body 5151 overlaps with the part of the cutter 5130 and the width direction position of the transmission window 5111. In this case, the area of the transmission window 5111 corresponding to the dump body 5151 or the area of the transmission window 5111 covered by the dump body 5151 is exposed by the area or the area not covered by the cutter 5130. Area. Accordingly, one surface of the dump body 5151 corresponding to the upper side of the cutter 5130 and the transmission window 5111 may face the cutter 5130 and the transmission window 5111.

Here, the region in which the width direction position overlaps the cutter 5130 and the transmission window 5111 of the dump body 5151 may be an open structure, and a cover member 5152 may be installed therein. Thus, the cover member 5152 is positioned above the cutter 5130 in the vertical position, and the width direction position overlaps the cutter 5130 and the transmission window 5111. Thus, the dump body (5141) is an installation structure covering the transmission window (5111) and a part of the cutter (5130) and a part of the transmission window (5111), most of the area covered by the cover member (5142) It is an area not covered by 5130.

The cover member 5152 according to the embodiment is quartz, but is not limited thereto, and various materials capable of transmitting light may be applied.

Returning to the dump body 5151 again, as described above, the dump body 5251 has an internal space in which light can move. Here, the peripheral wall partitioning the inner space, or the inner wall of the dump body (5141) may be named as the upper wall (5141a), lower wall (5141b) and side walls according to the position. The side wall is divided into one side wall connecting one end of the upper wall 5151a and one end of the lower wall 5151b, and the other side wall 5251c connecting the other end of the upper wall 5151a and the other end of the lower wall 5151b. The one side wall may be an inner wall surface of the cover member 5152.

Each of the upper wall 5151a, the lower wall 5251b, and the other side wall 5151c of the dump body 5151 serves as a reflecting surface that reflects light incident into the dump body 5151.

The upper wall (5141a) according to an embodiment can be divided into three zones, a predetermined length extending from the direction in which the cover member (5142) is located in the direction of the other side wall (5141c), and has a predetermined curvature (hereinafter, The first upper reflecting surface 5141a-1), an area extending from the first upper reflecting surface 5151a-1 to be inclined downward in the other direction (hereinafter, referred to as the second upper reflecting surface 5151a-2), 2 includes a region (hereinafter referred to as a third upper reflecting surface 5151a-3) extending a predetermined length from the upper reflecting surface 5151a-2 toward the other side wall 5251c.

The first upper reflecting surface 5151a-1 has a concave curvature in the inward direction of the dump body 5151, and may be, for example, an arc shape, and the second upper reflecting surface 5251a-2 as a whole. It is a shape inclined upwardly. In addition, the first upper reflecting surface 5141a-1 is provided to face the substrate so that the light reflected from the substrate S and incident directly into the dump body 5151 can reach or reflect the light (see FIG. 6). .

The second upper reflecting surface 5141a-2 is an area between the first upper reflecting surface 5151a-1 and the third upper reflecting surface 5251a-3 and is downward in the direction of the third upper reflecting surface 5251a-3. It is an inclined shape. In this case, the connection portion between the first upper reflective surface 5251a-1 and the second upper reflective surface 5251a-2 may have a stepped structure having a height difference. The second upper reflecting surface 5151a-2 is formed to face or face the upper cutter 5130a so that the laser beam reflected from the upper cutter 5130a and incident into the dump body 5151 can reach or reflect it. (See FIG. 4).

The third upper reflecting surface 5141a-3 is an area extending from the second upper reflecting surface 5151a-2 toward the other side wall 5251c. The third upper reflection surface 5151a-3 may be provided to be parallel to the lower wall 5251b without being inclined. In addition, the third upper reflecting surface 5141a-3 is provided with a groove extending in the inward direction of the dump body 5151 (hereinafter referred to as a second groove 5251d). That is, the second upper reflecting surface 5141a-3 is provided with a second groove 5251d having an empty space in the inward direction of the dump body 5151. In other words, it extends in the direction crossing the moving direction of the substrate S or the extending direction of the dump body 5151 at a position corresponding to the third upper reflective surface 5251a-3 in the interior of the dump body 5151. The second groove 5251d may be provided, and the second groove 5251d has a shape in which a direction of the third upper reflective surface 5251a-3 is opened. The second grooves 5251d are provided in plural and are formed to be spaced apart from each other in the moving direction of the substrate S.

The second groove 5251d as described above cancels the light by trapping the laser beam incident therein and reflecting the light several times therein.

A plurality of irregularities having a width of several μm to several tens of μm may be provided on at least one of the upper wall 5151a, the lower wall 5251b, and the other side wall 5251c as described above. This unevenness can increase the surface area that the laser beam touches and can improve the extinction effect as compared with the case where unevenness is not formed, and it is effective to convert the energy of the laser beam into heat.

The extinction guide portion 5503 extends in a direction intersecting with the moving direction of the substrate S or in a direction corresponding to the dump body 5251, and inside the dump body 5251, the upper wall of the dump body 5151 ( 5141a), the lower wall 5251b, and the other side wall (5141c) is installed so as to be spaced apart. In addition, the extinction guide portion 5503 may be installed to be adjacent to the other side wall than the cover member 5152 in the dump body (5141). More specifically, the extinction induction part 5503 is more specifically installed at a position spaced apart from the position where the laser beam is incident on the dump body 5151 among the internal space of the dump body 5151, for example, the third upper reflecting surface. It is provided between the (5141a-3) and the lower wall (5141b).

The disappearance induction part 5503 is formed to extend in a direction intersecting with the moving direction of the substrate S or in a direction corresponding to the dump body 5251 (hereinafter, referred to as an extinction induction body) 5143a)), a groove provided in the inward direction of the disappearance induction body 5503a from the end (hereinafter referred to as the other end) opposite the other side wall 5151c of the dump body 5151 on the extinction induction body 5103a (hereinafter, referred to as a first groove). 5143b).

As described above, the extinction guide body 5153a is spaced apart from the upper wall 5151a, the lower wall 5151b, and the other side wall 5151c in the dump body 5151. In addition, the extinction induction body (5143a) is preferably provided to be adjacent to the other side wall of the dump body (5141) than the cover member (5142). At this time, each of the upper and lower surfaces of the extinction guide body 5153a facing the upper wall 5151a and the lower wall 5251b of the dump body 5151 is parallel to the upper wall 5151a and the lower wall 5251b. Form. Further, the other end of the extinction induction body 5153a facing the other side wall 5151c of the dump body 5151 among the both ends of the extinction induction body 5153a based on the moving direction of the substrate S may be formed by the other side wall ( Parallel to 5141c, one end of the disappearance inducing body 5503a may be inclined. The extinction inducing body 5503a is incident to the inside of the dump body 5151, and reflects the light reflected by the upper wall 5151a and the lower wall 5251b of the dump body 5151 to induce the extinction of the light. Do it.

The first groove 5103b extends inward from the other end of the extinction guide body 5153a facing the other side wall 5151c among the inner wall surfaces of the dump body 5151, and the extension direction thereof is a movement of the substrate S. FIG. Is the direction corresponding to the direction. At this time, the first groove (5143b) is not formed to extend to one end that is opposite to the other end of the disappearance induction body (5143a), the first groove (5143b) is a shape in which the other end direction of the disappearance induction body (5143a) is opened. .

The first grooves 5503b have a function of trapping light incident therein and reflecting it several times, thereby extinguishing it. More specifically, the light is reflected from the cutter 5130 or the substrate S to be incident into the dump body 5251, and then reflected from the upper wall 5151a, the lower wall 5151b, or the other side wall of the dump body 5151. The laser beam is destroyed by trapping at least a portion of the laser beam and causing it to be reflected several times or several times therein. That is, at least a portion of the light incident into the dump body 5151 is incident and trapped inside the first groove 5103b, which is a narrow space, thereby partitioning the first groove 5514b inside the first groove 5103b. As it is reflected by the wall surface, light disappears.

In addition, a plurality of irregularities having a diameter of several μm to several tens of μm may be provided on an outer circumferential surface of the extinction inducing body 5503a, that is, an upper surface, a lower surface, one end and the other end, and an inner wall surface that partitions the first groove 5514b. Can be. This unevenness can increase the surface area where the laser beam touches the extinction induction part 5503, thereby improving the extinction effect as compared with when unevenness is not formed, and it is effective to convert the energy of the laser beam into heat.

4 to 6, the reflection and the disappearance of the light (laser beam) in the dump according to the embodiment of the present invention will be described.

FIG. 4 is a conceptual diagram illustrating a movement and reflection path of a laser beam reflected from an upper cutter and then incident into a dump after being irradiated to a substrate, and thus an extinction process. FIG. 5 is a conceptual diagram illustrating a movement and reflection path of a laser beam reflected from a lower cutter and then incident into a dump after being irradiated to a substrate, and thus an extinction process. FIG. 6 is a conceptual diagram illustrating a movement and reflection path of a laser beam, which is mainly reflected back from the substrate and immediately incident into the dump after being irradiated to the substrate, and thus an extinction process.

The laser beam emitted from the light source 300 passes through the transmission window 5111, the first light irradiation space 5110, the second light irradiation space 5510, the first slit 5410a and the second slit 5500a. Irradiated to the substrate. The laser beam irradiated onto the substrate S crystallizes the thin film formed on the substrate S. At least a portion of the light irradiated onto the substrate S is reflected from the substrate S and moves upward toward the dump 5140, where the reflected laser beam is directed back to the transmission window 5111. Do not do it. Among the laser beams reflected from the substrate S and moved to the dump 5140, some are beams reflected from the upper cutter 5130a, others are beams reflected from the lower cutter 5130b, and others are The beam reflected from the substrate S is directly reflected into the dump body 5251.

Referring to FIG. 4, after the laser beam reflected from the upper cutter 5130a is incident into the dump body 5151, the dump body 5151 is alternately reflected by the upper wall 5151a and the lower wall 5251b. It is gradually moved toward the other side wall (5141c) or the extinction guide portion (5143). More specifically, the laser beam reflected from the upper cutter 5130a is incident into the dump body 5251 and is mainly reflected from the second upper reflecting surface 5151a-2 in the dump body 5151, mainly to the lower wall 5251b. ), And again the laser beam is reflected by the lower wall (5141b), mainly toward the third upper reflecting surface (5141a-3) and reflected therefrom with the other side wall (5141c) or extinction inducing portion (5143) in the dump body (5141) Move or progress toward Thereafter, the laser beam is reflected a plurality of times by the outer circumferential surface of the extinction guide part 5503 and the inner wall of the dump body 5151 in the space between the extinction guide part 5503 and the inner wall of the dump body 5251. As shown in FIG. 4, when the laser beam reflected from the upper cutter 5130a and incident into the dump body 5151 is reflected between the extinction guide portion 5503 and the dump body 5151, the upper wall of the dump body 5151 and The amount of laser beam reflected by the top surface of the extinction guide portion 5503 may be greater than the amount of laser beam reflected by the bottom wall 5141b of the dump body 5151 and the bottom surface of the extinction guide portion 5503. In addition, the laser beam is reflected a plurality of times in the first groove 5153b of the extinction guide portion 5503 and in the second groove 5251d provided with the upper wall 5151a. That is, some of the laser beams reflected from the other side wall 5151c, the upper wall 5151a, and the lower wall 5251b of the dump body 5151 may be provided with the first groove 5514b and the second groove ( 5141d), and are trapped inside the first groove 5103b and the second groove 5251d, where it is reflected many times by the inner wall that defines the first groove 5103b and the second groove 5251d.

As another example, referring to FIG. 5, the laser beam reflected from the lower cutter 5130b is also incident on the dump body 5151, and then alternately reflected by the upper wall 5151a and the lower wall 5251b, and the dump body ( 5141, gradually moving toward the other side wall (5141c) or extinction guide portion (5143). More specifically, the laser beam reflected from the lower cutter 5130b is incident into the dump body 5251 and is mainly reflected from the second upper reflecting surface 5141a-2 in the dump body 5151, mainly to the lower wall 5251b. ), The laser beam is reflected by the lower wall (5141b) and travels mainly between the extinction inducing portion (5143) and the lower wall (5141b) and toward the upper wall (5141a), and the extinction inducing portion (5143) and the lower wall ( 5141b), the reflection is repeatedly performed a plurality of times between the space between the evanescent induction portion 5503 and the upper wall 5251a, and then proceeds toward the other side wall 5251c. That is, when the laser beam is moved to the place where the extinction induction part 5503 is located, the outer circumferential surface of the extinction induction part 5503 and the inner wall of the dump body 5251 in the space between the extinction induction part 5503 and the inner wall of the dump body 5251. Is reflected a plurality of times. As shown in FIG. 5, when the laser beam reflected from the lower cutter 5130b and incident into the dump body 5151 is reflected between the extinction guide portion 5503 and the dump body 5151, the lower wall ( 5141b) and the amount of the laser beam reflected by the lower surface of the extinction guide portion 5503 may be higher than the amount of the laser beam reflected by the upper surface of the dump body 5151 and the upper surface of the extinction guide portion 5503. have. In addition, the laser beam is reflected a plurality of times in the first groove 5153b of the extinction guide portion 5503 and in the second groove 5251d provided in the upper wall. That is, some of the laser beams reflected from the other side wall 5151c, the upper wall 5151a, and the lower wall 5251b of the dump body 5151 are the first grooves 5514b and the second grooves of the extinction guide portion 5503. (5141d) is incident inside, trapped inside the first groove (5143b) and the second groove (5141d), and is reflected several times by the inner wall partitioning the first groove (5143b) and the second groove (5141d) .

4 and 5, when the laser beam reflected from the upper cutter 5130a and incident on the dump body 5151 is reflected several times in the dump body 5151, it is trapped and reflected in the first groove 5103b. The amount of laser beam tends to be greater than in FIG.

As another example, referring to FIG. 6, a laser beam reflected from the substrate S and immediately incident into the dump body 5151 is primarily reflected from the first upper reflecting surface 5141a-1 in the dump body 5151. Mainly directed to the lower wall 5251b, and again the laser beam is reflected by the lower wall 5251b and mainly reflected from them towards the lower wall of the third upper reflecting surface 5251a-3 and the extinction inducing body 5103a and dumps it. It gradually moves toward the other side wall 5151c or the extinction guide portion 5503 in the body 5251. Thereafter, the laser beam is reflected a plurality of times by the outer circumferential surface of the extinction guide part 5503 and the inner wall of the dump body 5151 in the space between the extinction guide part 5503 and the inner wall of the dump body 5251.

As shown in FIG. 6, most of the laser beam reflected from the substrate S and immediately incident on the dump body 5151 is directed to the first upper reflecting surface 5251a-1, which in the embodiment is the first upper reflecting surface. Since the 5201a-1 is configured to have an arc shape having a curvature, the laser beam can be collected and advanced in the direction of the lower wall 5251b of the dump body 5151, thereby advancing the laser beam toward the extinction induction part 5503. You can. In addition, as shown in FIG. 6, when the laser beam reflected from the substrate S and immediately incident into the dump body 5151 is reflected between the extinction guide portion 5503 and the dump body 5151, the lower portion of the dump body 5251 is used. The amount of laser beam reflected by the wall 5251b and the lower surface of the extinction inducing portion 5203 is compared to the amount of laser beam reflected by the upper surface of the dump body 5151 and the upper surface of the extinction inducing portion 5503. There can be many. In addition, the laser beam is reflected a plurality of times in the first groove 5131b of the extinction guide portion 5503 and in the second groove 5251d provided in the upper wall 5151a. That is, some of the laser beams reflected from the other side wall 5151c, the upper wall 5151a, and the lower wall 5251b of the dump body 5151 may be incident into the first groove 5514b of the extinction guide portion 5503. It is trapped inside the first groove 5103b, where it is reflected several times by the inner wall of the extinction inducing body 5153a which defines the first groove 5514b. In this case, the amount of the laser beam trapped and reflected by the second groove 5251d may be greater than that of the first groove 5103b. In the case of FIG. 6, the amount of laser beam that is trapped and reflected by the second groove is greater than that of FIGS. There can be many.

As described above, according to the exemplary embodiment of the present invention, the laser beam incident into the dump body 5151 may be reflected several times inside the dump body 5151 to induce energy to be released as heat, thereby reducing the energy, thereby extinguishing it. . In particular, by providing the extinction induction part 5503 inside the dump body 5151, the number of reflections of the laser beam can be further increased, and the first grooves 5503b and the dump body 5151 are formed on the inner wall of the extinction induction part 5503. The energy dissipation rate of the laser beam can be further improved by providing the second groove 5251d so as to be trapped therein and guided to be reflected several times therein.

In addition, an inner wall of the dump body 5151, an outer circumferential surface of the extinction inducing part 5203, an inner wall of the extinction inducing part 5203 partitioning the first groove 5103b of the extinction inducing part 5203, and an inner wall of the dump body 5151 are provided. By providing the irregularities in at least one of the walls dividing the second grooves 5251d, the surface area in contact with the laser beam can be widened to further improve the energy dissipation rate of the laser beam.

2 and 7, the cooling unit 5150 is configured to circulate a refrigerant therein, and is installed at an upper portion of the dump 5140 to cool or cool the dump 5140 to thereby cool down the temperature of the dump 5140. Prevent rise. The cooling unit 5150 has a cooling jacket structure, and is provided in the cooling member 5151 and the cooling member 5151 installed on the upper portion of the dump body 5151, and a refrigerant circulation tube 5502 in which a refrigerant, for example, coolant, is circulated. It includes, one end of the refrigerant circulation pipe (5152) is connected to the refrigerant supply unit (not shown). Accordingly, even if the reflected laser beam (that is, the reflected light) is incident to the dump 5140 and the dump 5140 is heated by the heat of the reflected light during the cancellation and extinction process in the dump 5140, the refrigerant circulation pipe ( The cooling member 5151 is cooled by the refrigerant circulated through 5152. Therefore, as the dump 5140 connected to the cooling member 5151 is cooled, it is possible to prevent thermal deformation due to temperature rise and temperature non-uniformity of the dump 5140 due to the reflected beam.

The temperature sensor 5160 is installed in the dump 5140 and the cooling unit 5150 as described above. More specifically, a temperature sensor (hereinafter, referred to as a lower temperature sensor) is installed inside the lower wall of the dump body 5151, and a temperature sensor (hereinafter, referred to as a side temperature sensor) penetrates the other side wall 5251 c of the dump body 5151. Is installed. In addition, a plurality of temperature sensors 5160 are installed in the above-described cooling member 5151, and may be installed to partially penetrate an upper portion of the dump body 5151 positioned below the cooling member 5151. Thus, the temperature sensor 5160 installed in the cooling member 5151 is called the upper temperature sensor 5160. Here, the upper temperature sensor 5160 may be provided at the center of the extending direction of the cooling member 5151 (the direction crossing the substrate extending direction) and at both edge positions.

Thus, the lower and upper temperature sensors installed on each of the lower and cooling members 5151 of the dump 5140 serve to measure the temperature of the dump body 5251, and the sidewall temperature sensor is a temperature of the internal space of the dump body 5251. It serves to measure. The temperature measured by each of the lower, upper, and side temperature sensors 5160 is displayed on a monitor of a controller that controls the operation of the substrate processing apparatus so that the operator can monitor the temperature.

Hereinafter, a method of crystallizing a thin film using a substrate processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8.

First, an amorphous polycrystalline thin film 11, for example, an amorphous polycrystalline silicon thin film, is formed on a glass substrate S. Subsequently, the substrate S on which the amorphous polycrystalline silicon thin film is formed is charged into the process chamber 100 of the substrate processing apparatus and placed on the stage 200.

When the substrate S is seated on the stage 200, light is transferred onto the thin film 11 formed on the substrate S while horizontally transferring the substrate S through the stage 200 in the process progress direction. That is, the laser beam is irradiated. To this end, by operating the light source 300 to output a laser from the light source 300, the output laser is the first light irradiation space (5110) and the gas injection unit of the light irradiation unit 5100 through the transmission window (5111) After passing through the second light irradiation space 5410 of 5200, the thin film 11 formed on the substrate S is irradiated through the first slit 5400a and the second slit 5500a. Thus, the amorphous polycrystalline silicon thin film formed on the substrate S reacts with the laser to become a crystalline silicon thin film.

In this way, while irradiating the laser beam toward the substrate S, nitrogen (N ₂ ) gas is injected onto the substrate S or the thin film 11. For this, nitrogen at a gas supply unit 5300 provided in the gas injection block (5400) (N ₂₎ when the gas supply, the nitrogen in the second light irradiation space 5410 through the discharge slit of the gas supply unit 5300 (N ₂ ) The gas is supplied. In addition, the nitrogen (N ₂ ) gas supplied to the second light irradiation space 5410 is injected onto the substrate S through the first slit 5410a and the second slit 5500a. In addition, the nitrogen (N ₂ ) gas discharged to the upper side of the substrate S spreads in both directions around the second slit 5400a, and oxygen and impurities that may exist between the plate 5500 and the substrate S are present. It is pushed in both directions. In other words, the inert gas discharged through the second slit 5400a spreads to fill the space between the plate 5400 and the substrate S, wherein oxygen and oxygen present between the plate 5500 and the substrate S are filled. The impurities are pushed out of the light irradiation module 5000 and the substrate S by the nitrogen gas.

Accordingly, oxygen and impurities may not be exposed to the substrate S and the silicon thin film 11 formed on the substrate S, thereby preventing oxidation. More specifically, since at least the substrate S or the thin film 11 in the region to which the laser is irradiated is not exposed to oxygen and impurities, the silicon thin film in the region to which the laser is irradiated is not oxidized and becomes a crystalline silicon thin film.

On the other hand, the laser beam output from the light source 300 and irradiated onto the substrate S crystallizes the thin film 11 as described above, and is then reflected back from the substrate S again. At this time, the laser beam is reflected upward in a direction symmetrical to the direction in which the laser beam is incident on the substrate S to retransmit the transmission window 5111. The laser beam passing through the transmission window 5111 is incident to the inside of the dump, and is reflected by the inside of the dump a plurality of times or several times. At this time, the energy of the laser beam is released as heat and reduced. More specifically, in the dump according to the embodiment of the present invention, by providing the extinction guide portion 5503 having the first groove 5153b inside the dump body 5151, the number of reflections of the laser beam is increased more than in the prior art. You can. In addition, by providing the second groove (5141d) in the inner wall of the dump body (5141), by forming irregularities on at least one of the inner wall of the dump body, the inner wall around the first and second grooves, the outer peripheral surface of the extinction guide body, The number of reflections of the beam can be further increased. Therefore, according to the embodiment of the present invention, it is possible to prevent the dump from being deteriorated by the heat of the laser beam, and accordingly, the substrate is deteriorated due to the change in the airflow around the dump due to the dump deterioration during the process. mura) can be prevented from occurring.

In addition, by cooling the dump 5140 by providing a cooling unit in the dump 5140 during the process, it is possible to prevent the temperature rise and temperature non-uniformity of the dump 5140 due to heat of reflected light, thereby preventing thermal deformation. can do. In addition, since the dump 5140 is cooled by the cooling unit 5150, the surrounding temperature can be prevented from rising by the heat of the dump 5140 as in the related art.

In addition, the temperature of the dump 5140 may be measured by a temperature sensor during the process, and the operator may monitor the temperature in real time. Thus, if the temperature of the dump measured by the temperature sensor exceeds the reference temperature, the operator can know whether the risk of deterioration in the dump through this, it is possible to perform the maintenance work of the substrate processing apparatus as needed.

5100: light irradiation unit 5120: light irradiation machine
5100a: first body 5100b: second body
5110: first light irradiation space 5410a: second light irradiation space
5130: Cutter 5140: Dump
5141: dump body 5142: cover member
5143: extinction induction part 5143a: extinction induction body
5143b: first groove 5160: temperature sensor
5141a-1: First upper reflective surface 5141a-2: Second upper reflective surface
5141a-3: Third upper reflective surface 5141d: Second groove
5150: cooling unit 5200: gas injection unit

Claims (29)

As a dump provided on the upper side of the transmission window capable of transmitting light, the light reflected from the object to be installed below the transmission window is blocked into the transmission window after the incident light into the transmission window and incident to the object to be processed. ,
A dump body having one end corresponding to an upper side of the transmission window and extending from the other end to a width direction outer side of the transmission window; And
An extinction induction part provided in the dump body and transmitting light through the transmission window to reflect the light incident into the dump body a plurality of times;
Including,
The extinction induction part,
A first extinction guide unit having an inner wall of the dump body that defines an internal space of the dump body;
A third extinction induction part disposed in the inner space of the dump body such that at least a portion of an outer circumferential surface thereof is spaced apart from the inner wall of the dump body, and reflects light reflected from the inner wall of the dump body again to induce extinction of the light;
Including,
The first extinction induction part,
An upper wall positioned above the dump body internal space;
The other side wall of the inner space of the dump body corresponding to the other end of the dump body;
Including;
The upper wall of the first extinction induction part,
A first upper reflecting surface formed to face the transmission window and receiving light reflected from the object to be processed and incident into the dump body to reflect toward the other side wall in the dump body;
A second upper reflecting surface extending from the first upper reflecting surface to be inclined downward toward the other wall to receive and reflect light; And
A third upper reflection surface extending from the second upper reflection surface to the other side wall to receive and reflect light;
Dump containing. The method according to claim 1,
An internal space of the dump body provided with the extinction induction part is formed so that the width becomes narrower from one end of the dump body to the other end. The method according to claim 2,
The first extinction induction part,
A lower wall facing the upper wall;
And a side wall of the inner space of the dump body corresponding to one end of the dump body. delete The method according to claim 3,
And the first upper reflecting surface has a concave curvature in an inward direction of the dump body, wherein at least a portion thereof faces the lower wall. The method according to claim 3,
A dump having irregularities provided in at least one of an upper wall, a lower wall, and the other side wall of the first extinction guide part. The method according to claim 3,
The extinction induction part,
At least one of the upper wall, the lower wall and the other side wall is formed extending inward to communicate with the internal space of the dump body, including a second extinction induction portion having a first groove that traps light and reflects therein a plurality of times; dump. The method according to claim 7,
The first groove is a dump provided in the upper wall. The method according to claim 8,
The first groove is provided in the third upper reflecting surface of the upper wall dump. The method according to claim 9,
A dump having irregularities provided in the inner wall dividing the first groove. delete The method according to claim 3,
The third extinction induction part,
In the internal space of the dump body, at least a portion of the outer peripheral surface is disposed so as to be spaced apart from the inner wall of the dump body; And
A second groove extending in an inward direction from an outer circumferential surface of the extinction inducing body and confining light therein to reflect a plurality of times;
Dump containing. The method according to claim 12,
A dump having irregularities provided in at least one of an outer circumferential surface of the decay induction body and an inner wall of the decay induction body that defines the second groove. The method according to claim 12,
The third extinction induction dump is installed in the dump body to be adjacent to the other side wall relative to the one side wall. The method according to claim 14,
And the third extinction guide portion extends from the third upper reflection surface position in the direction of the other side wall of the dump body. The method according to claim 15,
The second groove is formed extending from one end facing the one side wall of the dump body from the other end facing the other side wall of the dump body of the outer peripheral surface of the extinction guide body,
The second groove is a dump in which the other end direction of the extinction guide body is opened. A light irradiator having a transmission window through which light can be transmitted and irradiating the light to a substrate;
A dump disposed on an upper side of the transmission window to allow incidence of light transmitted through the transmission window, the dump having an extinction induction part for extinguishing light by reflecting the light incident through the transmission window and entering the interior multiple times;
Including,
The dump includes a dump body, one end of which is positioned to correspond to the upper side of the transmission window, and the other end of which is formed to extend outward in the width direction of the transmission window.
The extinction induction part,
A first extinction guide unit having an inner wall of the dump body that defines an internal space of the dump body;
A third extinction induction part disposed in the inner space of the dump body such that at least a portion of an outer circumferential surface thereof is spaced apart from the inner wall of the dump body, and reflects light reflected from the inner wall of the dump body again to induce extinction of the light;
Including,
The first extinction induction part,
An upper wall positioned above the dump body internal space;
The other side wall of the inner space of the dump body corresponding to the other end of the dump body;
Including;
The upper wall of the first extinction induction part,
A first upper reflecting surface formed to face the transmission window and receiving light reflected from the substrate and incident to the dump body to reflect toward the other side wall of the dump body;
A second upper reflecting surface extending from the first upper reflecting surface to be inclined downward toward the other side wall to reflect light; And
A third upper reflection surface extending from the second upper reflection surface to the other side wall to receive and reflect light;
Substrate processing apparatus comprising a. The method according to claim 17,
And a cutter positioned between the transmission window and the dump, the cutter extending from a position corresponding to the transmission window in an outward direction of the transmission window opposite to the dump and inclined downward toward the transmission window. The method according to claim 18,
The inner space of the dump body is formed to be narrower from one end of the dump body toward the other end,
And the extinction induction part is provided in the dump body. The method according to claim 19,
And an inner wall of the first extinction guide part guides the light toward the other end of the dump body while reflecting light incident into the dump body a plurality of times. The method of claim 20,
The first extinction induction part,
A lower wall facing the upper wall;
And one side wall of an inner space of the dump body corresponding to one end of the dump body. The method according to claim 21,
The first upper reflecting surface is formed to face the lower wall,
And the second upper reflecting surface is opposed to the cutter to receive the light reflected from the cutter and reflect the light. The method according to claim 22,
The first upper reflective surface is
And a concave curvature in the inward direction of the dump body to reflect light reflected from the substrate toward the other side wall in the dump body, wherein at least a portion thereof faces the lower wall. The method according to claim 22,
The extinction induction part,
At least one of the upper wall, the lower wall and the other side wall is formed extending inward to communicate with the internal space of the dump body, including a second extinction induction portion having a first groove that traps light and reflects therein a plurality of times; Substrate processing apparatus. The method of claim 24,
And the first groove is provided on a third upper reflective surface of the upper wall. delete The method according to claim 22,
The third extinction induction part,
In the internal space of the dump body, at least a portion of the outer peripheral surface is disposed so as to be spaced apart from the inner wall of the dump body; And
A second groove extending in an inward direction from an outer circumferential surface of the extinction inducing body and confining light therein to reflect a plurality of times;
Substrate processing apparatus comprising a. The method of claim 27,
And the third extinction induction part is disposed to be adjacent to the other side wall in the dump body than the one side wall. The method of claim 28,
The second groove is formed extending from one end facing the one side wall of the dump body from the other end facing the other side wall of the dump body of the outer peripheral surface of the extinction guide body,
And the second groove is open at the other end of the extinction guide body.

Images