KR102042228B1 - Light emitting diode package - Google Patents

Abstract

A light emitting diode package is provided. A light emitting diode package according to an embodiment of the present invention includes a first electrode lead having one polarity; A second electrode lead having a different polarity than the first electrode lead and including a heat radiation function; And a light emitting device connected to the first electrode lead and the second electrode lead, wherein the first electrode lead and the second electrode lead are spaced apart from each other by a predetermined distance, and the separation distance is within 200 μm.

Description

Light emitting diode package

The present invention relates to a light emitting diode package, and more particularly, to a package that can be applied to automotive lighting apparatus and can increase thermal stability.

Light emitting diodes used in many fields in recent years require high output. Therefore, the light emitting diode is constructed by mounting a high power LED chip capable of high output to meet the market demand. At this time, the high-power LED chip mounted on the light emitting diode increases the light output and generates a lot of heat. Therefore, the temperature of the LED chip is increased due to a lot of heat generated during the operation of the LED chip, which causes a problem that the output of the LED chip is different from the target may appear.

Particularly, when a light emitting diode using a high power LED chip is used as a side light emitting diode (Side View Type) and applied to an automobile lighting device, it should be manufactured to have high reliability in order to prevent inconvenience of a user due to frequent failures. However, in the case of the high-power LED chip, there is a problem that the reliability is lowered due to a phenomenon such as the output is lowered due to low thermal stability.

Republic of Korea Patent Publication No. 2012-0110766

In order to solve the problems of the prior art as described above, an embodiment of the present invention is to provide a light emitting diode package capable of thermal stability and various voltage adjustment by using a structural improvement.

According to an aspect of the present invention for solving the above problems, there is provided a light emitting diode package. The LED package may include a first electrode lead having one polarity; A second electrode lead having a different polarity than the first electrode lead and including a heat radiation function; And a light emitting device connected to the first electrode lead and the second electrode lead, wherein the first electrode lead and the second electrode lead are spaced apart from each other by a predetermined distance, and the separation distance is within 200 μm.

Two light emitting devices may be formed.

A body having an open upper portion and having a volume; And a molding material formed inside the body, wherein the body may include the first electrode lead, the second electrode lead, and the light emitting element therein.

The molding material may be formed including a nanolens as an inorganic material.

The body, the lower surface and the upper surface is formed in parallel with each other, the lower surface is formed with a smaller area than the upper surface, the comb surface connecting the lower surface and the upper surface is formed in a trapezoidal shape, four of the upper surface The sides may be formed in the form of parallelograms.

According to one aspect of the invention, a light emitting diode package is provided. The LED package may include a first electrode lead having one polarity; A second electrode lead having a different polarity than the first electrode lead; A heat dissipation lead having a heat dissipation function; And a light emitting device connected to the first electrode lead, the second electrode lead, and the heat dissipation lead, wherein the heat dissipation lead is spaced apart from the first electrode lead and the second electrode lead, respectively. The separation distance is within 200 μm, and the size of the heat dissipation lead is within 4.3 mm.

A plurality of light emitting devices may be formed.

A body having an open upper portion and having a volume; And a molding material formed inside the body, wherein the body may include the first electrode lead, the second electrode lead, the heat dissipation lead, and the light emitting element therein.

The molding material may be formed including a nanolens as an inorganic material.

The body, the lower surface and the upper surface is formed in parallel with each other, the lower surface is formed with a smaller area than the upper surface, the comb surface connecting the lower surface and the upper surface is formed in a trapezoidal shape, four of the upper surface The sides may be formed in the form of parallelograms.

The LED package according to an embodiment of the present invention has an effect of increasing thermal stability.

In addition, the LED package according to an embodiment of the present invention has an effect of increasing the reliability of the package operation as the thermal stability is increased.

In addition, the LED package according to an embodiment of the present invention has the effect of easy adjustment of the LED chip voltage.

1 is a cross-sectional view of a light emitting diode package in which one electrode according to an embodiment of the present invention includes a heat radiation function (a) one light emitting device and (b) two light emitting devices are combined.
FIG. 2 is a cross-sectional view of a light emitting diode package including one light emitting device of FIG. 1A.
3 is a plan view of a LED package according to an exemplary embodiment of FIG. 1.
4 is a cross-sectional view of a light emitting diode package in which two electrode leads and one heat dissipation lead are formed according to an embodiment of the present invention, wherein (a) three light emitting elements and (b) four light emitting elements are respectively coupled to the heat dissipation leads. to be.
FIG. 5 is a cross-sectional view of (a) parallel connection and (b) series connection of the LED package including the three light emitting devices of FIG. 4A.
6 is a plan view of a LED package according to an exemplary embodiment of FIG. 4.
7 is an experimental result of the heat emission improvement effect using the LED package 400 according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.

1 is a cross-sectional view of a light emitting diode package (a) one light emitting device and (b) two light emitting devices in which one electrode has a heat dissipation function according to an embodiment of the present invention, Figure 2a 3 is a cross-sectional view of a light emitting diode package provided with one light emitting device, and FIG. 3 is a plan view of the light emitting diode package according to the embodiment of FIG. 1. Hereinafter, a light emitting diode package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.

Referring to FIG. 1, a light emitting diode package according to an embodiment of the present invention may be configured as shown in FIG. 1A to which one light emitting device is coupled, and FIG. 1B to which two light emitting devices are coupled.

The light emitting diode package 100 according to an embodiment of the present invention is formed of a body 110, a first electrode lead 130, a second electrode lead 150, and a light emitting device 170.

Body 110 is formed so that one side, preferably the top is open and has a certain volume. The body 110 may include a first electrode lead 130, a second electrode lead 150, and a light emitting device 170 therein. In this case, the body 110 may be formed to further include a molding material 210 in an empty space existing between an upper portion of the first electrode lead 130 and the second electrode lead 150 and an upper portion of the body 110. Can be.

The molding material 210 is provided inside the body 110. The molding member 210 fixes the first electrode lead 130, the second electrode lead 150, and the light emitting device 170 formed inside the body 110 to the inside of the body 110, and at the same time meets the needs of the user. Therefore, a phosphor may be included or a substance which may increase the light emitting effect may be added.

As shown in FIG. 2, the molding material 210 is formed on the first electrode lead 130 and the second electrode lead 150 to form the light emitting device 170, the first wire 191, and the second wire ( 193) is buried. Through this, the LED package 100 according to an embodiment of the present invention prevents the positional deviation that may occur due to the external force applied to the light emitting device 170, the first wire 191 and the second wire 193. In addition, as described above, a phosphor or a substance (such as a nano lens) that may increase the light emission effect may be added to increase the light emission efficiency.

The first electrode lead 130 has any one electrode. The first electrode lead 130 is electrically connected using the light emitting device 170 and the first wire 191 coupled to the second electrode lead 150, which will be described later.

The second electrode lead 150 has a different electrode from the first electrode lead 130. For example, the second electrode lead 150 has a (-) electrode when the first electrode lead 130 has a (+) electrode, and conversely, when the first electrode lead 130 has a (-) electrode (+). ) Has an electrode. In addition, the second electrode lead 150 may be electrically connected to the light emitting device 170 using the second wire 193, or may use a surface where the light emitting device 170 and the second electrode lead 150 contact each other. It can also be electrically connected.

The second electrode lead 150 includes a heat dissipation function. The second electrode lead 150 may further include a heat radiating function for emitting heat generated while generating light from the light emitting device 170 to the outside. To this end, the second electrode lead 150 may be formed to completely contact one surface of the light emitting device 170 as shown in FIGS. 1A and 1B, and may include five surfaces except for an upper portion of the light emitting device 170. Since the contact area is formed to be in contact with each other, the contact area with the light emitting device 170 may be increased, thereby increasing the amount and efficiency of heat transfer generated from the light emitting device 170.

Meanwhile, the light emitting device 170 may be connected to the first electrode lead 130 without using a wire. In this case, one portion of the lower portion of the light emitting device 170 may be in contact with the upper surface of the first electrode lead 130, and the other portion of the lower portion may be formed in contact with the upper surface of the second electrode lead 150. .

In FIG. 2, the first electrode lead 130 and the second electrode lead 150 may be formed to be spaced apart by a predetermined distance A, as shown in the drawing. In this case, the separation distance may be a distance from which the first electrode lead 130 and the second electrode lead 150 may be electrically insulated. For example, the separation distance may be 100 μm to 200 μm, and most preferably 150 μm.

3 is a plan view from above of a light emitting diode package according to an embodiment of the present invention. Referring to FIG. 3, the body 110 of the LED package 100 according to an embodiment of the present invention may include an upper surface 310, a lower surface 330, and an inclined surface 350.

The upper surface 310 is formed with a larger area than the lower surface 330. The upper surface 310 is preferably formed so that two sides facing each other in parallel to form a parallelogram shape, the upper surface 310 and the lower surface 330 may be formed in a 'similar' shape. For example, the upper surface 310 and the lower surface 330 may be formed in the form of a rectangle having rounded corners whose vertices are not angled as shown in FIG. 3, but this is only an embodiment of the present invention, and a real user. It may be formed in various forms according to the request or the setting at the time of design.

In addition, due to the difference between the area and the shape of the upper surface 310 and the lower surface 330, the comb surface 350 connecting the upper surface 310 and the lower surface 330 is formed in a trapezoidal shape. This is a phenomenon that occurs because the lower surface 330 is formed in a shape similar to the upper surface 310 and has a smaller area than the upper surface 310.

Meanwhile, the light emitting diode package illustrated in FIGS. 1 to 3 shows a case in which two or less light emitting devices are combined according to an embodiment of the present invention. Hereinafter, a case in which three or more light emitting devices are combined according to an embodiment of the present invention will be described in more detail with reference to FIGS. 4 to 6.

4 is a cross-sectional view of a light emitting diode package in which two electrode leads and one heat dissipation lead are formed according to an embodiment of the present invention, wherein (a) three light emitting elements and (b) four light emitting elements are respectively coupled to the heat dissipation leads. 5 is a cross-sectional view of (a) parallel connection and (b) series connection of the LED package including the three light emitting devices of FIG. 4A, and FIG. 6 is a plan view of the LED package according to the embodiment of FIG. 4. to be.

Referring to FIG. 4, the LED package according to an embodiment of the present invention may be configured as shown in FIG. 4A to which three light emitting elements are coupled, and FIG. 4B to which four light emitting elements are coupled.

The light emitting diode package 400 according to an embodiment of the present invention is formed of a body 410, a first electrode lead 430, a second electrode lead 450, a heat dissipation lead 470, and a light emitting element 490. do.

Body 410 is formed so that one side, preferably the top is open and has a certain volume. The body 410 may include a first electrode lead 430, a second electrode lead 450, a heat dissipation lead 470, and a light emitting element 490 therein. At this time, the body 410, the molding material 510 in the empty space existing between the upper portion of the first electrode lead 430, the second electrode lead 450 and the heat dissipation lead 470 and the upper portion of the body 410. It may be formed to further include.

The molding material 510 is provided inside the body 410. The molding material 510 fixes the first electrode lead 430, the second electrode lead 450, the heat dissipation lead 470, and the light emitting element 490 formed in the body 410 inside the body 410. At the same time, depending on the needs of the user, a phosphor may be included or a material capable of increasing the luminous effect may be added.

As shown in FIG. 5, the molding material 510 is formed on the first electrode lead 430, the second electrode lead 450, and the heat dissipation lead 470 so that the light emitting device 490 and the first wire 491 are formed. ) And the second wire 493 are embedded. Accordingly, the LED package 400 according to an embodiment of the present invention prevents the positional deviation that may occur due to external force applied to the light emitting device 490, the first wire 491, and the second wire 493. In addition, as described above, a phosphor or a substance (such as a nano lens) that may increase the light emission effect may be added to increase the light emission efficiency.

The first electrode lead 430 has any one electrode. The first electrode lead 430 is electrically coupled using the light emitting element 490 and the first wire 491 coupled to the heat dissipation lead 470 to be described later.

The second electrode lead 450 has an electrode different from the first electrode lead 430. For example, the second electrode lead 450 has a (-) electrode when the first electrode lead 430 has a (+) electrode, and conversely, when the first electrode lead 430 has a (-) electrode (+). ) Has an electrode. In addition, the second electrode lead 450 may be electrically connected to the light emitting device 490 using the second wire 493.

The heat dissipation lead 470 has a heat dissipation function. The heat dissipation lead 470 is provided to emit heat generated while generating light from the light emitting device 490 coupled to the top. To this end, the heat dissipation lead 470 may be formed to completely contact one surface of the light emitting device 490, as shown in FIGS. 4A and 4B, and may be in contact with all five surfaces except for the upper portion of the light emitting device 490. In order to increase the contact area with the light emitting device 490, the amount and efficiency of heat transfer generated by the light emitting device 490 may be increased.

The light emitting device 490 may be connected to the first electrode lead 430 without using a wire. In this case, one portion of the lower portion of the light emitting element 490 contacts the upper surface of the first electrode lead 430, the other portion of the lower portion contacts the upper surface of the second electrode lead 450, and two contact portions The surface in contact with the upper portion of the heat dissipation lead 470 may be provided between.

In FIG. 5, the first electrode lead 430, the heat dissipation lead 470, and the second electrode lead 450 and the heat dissipation lead 570 may be formed at a predetermined distance A, as shown in the drawing. In this case, the separation distance may be a distance at which the two electrode leads 430 and 450 may be electrically insulated from the heat dissipation lead 470, and may be 100 μm to 200 μm, for example, and most preferably 150 μm. In this case, the heat dissipation lead 470 may have a length opposite to the two electrode leads 430 and 450 having a length of 4.3 mm or less.

Meanwhile, in the LED package 400 according to the exemplary embodiment of the present invention, each light emitting device 490 uses the first electrode lead 430 and the first wire 491 as illustrated in FIG. 5A. It may have a parallel connection structure that is electrically connected, and electrically connected using the second electrode lead 450 and the second wire 493. Such a parallel connection structure, due to the electrical characteristics of the parallel connection, even if one light emitting device 490 fails or is disconnected, the remaining light emitting devices 490 can be continuously emitted by being continuously supplied with electricity without disconnection. have.

In addition, the LED package 400 according to an embodiment of the present invention may have a structure in which a plurality of light emitting devices 490 are connected in series as illustrated in FIG. 5B. Referring to FIG. 5B, the first light emitting device 490 disposed closest to the first electrode lead 430 of the light emitting devices 490 of the LED package 400 according to the exemplary embodiment may include a first electrode. After being electrically connected using the lead 430 and the first wire 491, the adjacent second light emitting device 490 and the intermediate wire 495 are connected in series, and the second light emitting device 490 is connected to the intermediate wire ( 495 is electrically connected to the third light emitting device 490. Thereafter, the third light emitting device 490 is electrically connected to each other by using the second electrode lead 450 and the second wire 493, so that the three light emitting devices 490 are connected to the first electrode lead 430 and the second electrode. It may be connected in series with the electrode lead 450. Through this, in the LED package 400 according to the embodiment of the present invention, each of the light emitting devices 490 may be connected in series, and a wider range of voltages may be used.

Meanwhile, in the light emitting diode package according to the exemplary embodiment of the present invention, when the plurality of light emitting elements 490 are provided in the heat dissipation lead 470 as shown in FIG. 5, the light emitting element 490 is provided through one heat dissipation lead 470. It is formed to release heat generated in the outside.

This is a heat intensive heat dissipation method in which heat generated from the plurality of light emitting elements 490 is concentrated by one heat dissipation lead 470 to radiate heat. There is an advantage that can minimize the performance degradation or deformation due to the heat generated.

6 is a plan view of a light emitting diode package according to an embodiment of the present invention viewed from above. Referring to FIG. 6, the body 410 of the LED package 400 according to an embodiment of the present invention may include an upper surface 610, a lower surface 630, and a inclined surface 650.

The upper surface 610 is formed with a larger area than the lower surface 630. The upper surface 610 is preferably formed so that two sides facing each other in parallel to form a parallelogram shape, the upper surface 610 and the lower surface 630 may be formed in a 'similar' shape. For example, the upper surface 610 and the lower surface 630 may be formed in the form of a rectangle having rounded corners that do not have an angle as shown in FIG. 3, but this is only an embodiment of the present invention and is a real user. It may be formed in various forms according to the request or the setting at the time of design.

In addition, due to the difference between the area and the shape of the upper surface 610 and the lower surface 630, the inclined surface 650 connecting the upper surface 610 and the lower surface 630 is formed in a trapezoidal shape. This is a phenomenon that occurs because the lower surface 630 is formed in a shape similar to the upper surface 610 and has a smaller area than the upper surface 610.

On the other hand, Figure 7 shows the experimental results for the heat emission improvement effect using the LED package according to an embodiment of the present invention. Referring to FIG. 7, the light emitting diode package 400 according to the exemplary embodiment of the present invention was formed on an aluminum PCB having a volume of 25.4 mm × 25.4 mm × 1.5 (T). At this time, the size of the heat dissipation lead has a limit of 3.2mm in the past, but in the experiment using the present invention was formed to 4.3mm or less. In addition, in this experiment, the thermal resistance measuring apparatus was used to obtain the result graph of FIG. 7, and the light emitting diode package of the present invention was compared with the conventional product under the same conditions.

In this experiment, a total of three experiments were performed as shown in FIGS. 7A to 7C, and each experiment was performed five times for each of the conventional products and the measurement of the present invention. In the graphs of FIGS. 7A to 7C, the prior arts # 1 to # 5, which are the results of the five repeated measurements of the prior art, are formed in the A range, and the change techniques # 1 to # 5 that are the five times the measurement results of the present invention are B. Is formed in a range. At this time, the results of analyzing the graph of Figures 7a to 7c are shown in Table 1 below.

Item Result 1 Result 2 Result 3 Current [mA] 100 140 200
Rth (JA) [K / W] Prior art 20-23 20-23 21-24 The present invention 17-19 17-19 18-19

Referring to Table 1, when the current is 100mA in the graph of FIG. 7A, the thermal resistance of the conventional technology is 20 to 23 K / W and the present invention is 17 to 19 K / W, respectively. You can see the effect.

In addition, in the case where the current is 140mA in FIG. 7B, the thermal resistance is 20 to 23 K / W in the prior art and 17 to 19 K / W in the present invention, respectively. To 24 K / W and the present invention is 18 to 19 K / W both results can further confirm the effect of lowering the thermal resistance of the present invention compared to the prior art.

When the thermal measurement result graphs of FIGS. 7A to 7C and the analysis results of Table 1 are comprehensively analyzed, it may be confirmed that the LED package of the present invention has a lower thermal resistance at the same current value than in the prior art. This means that the heat transfer effect is superior to the prior art because the present invention has a lower thermal resistance than the prior art, and the heat generated in the light emitting diode package can be easily radiated to the outside than the prior art. Means that.

On the other hand, the light emitting diode package according to an embodiment of the present invention can be used as a side view type lamp in an automobile. The side view type is generally formed in a small size, so the heat dissipation performance is low, which may limit the output. However, the LED package according to an embodiment of the present invention has a better heat dissipation performance through a slight increase in size as shown in the experimental result of FIG. 7, and thus has an effect of having a higher output.

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments set forth herein, and those skilled in the art who understand the spirit of the present invention, within the scope of the same idea, the addition of components Other embodiments may be easily proposed by changing, deleting, adding, and the like, but this will also fall within the spirit of the present invention.

100, 400: light emitting diode package
110, 410: body 130, 430: first electrode lead
150, 450: second electrode lead 170, 490: light emitting element
191, 491: first wire 193, 493: second wire
495: middle wire 210, 510: molding material
310, 610: upper surface 330, 630: lower surface
350, 650: inclined surface 470: heat dissipation lead

Claims (10)

A first electrode lead having one polarity;
A second electrode lead having a polarity different from that of the first electrode lead and having a heat dissipation capability of 4.3 mm; And
A light emitting device connected to the first electrode lead and the second electrode lead and formed at most two;
A body having an upper portion and having a volume, the body including the first electrode lead, the second electrode lead, and the light emitting element therein; And
It includes; a molding agent formed by including a nano-lens that is an inorganic material formed inside the body;
The first electrode lead and the second electrode lead is spaced apart from each other by a predetermined distance, the separation distance is within 200μm,
The body,
The lower and upper surfaces are formed parallel to each other,
The lower surface is formed with a smaller area than the upper surface, the hypotenuse connecting the lower surface and the upper surface is formed in a trapezoidal shape,
The LED package of the four sides of the upper surface is formed in a parallelogram shape. delete delete delete delete A first electrode lead having one polarity;
A second electrode lead having a different polarity than the first electrode lead;
A heat dissipation lead having a heat dissipation function; And
At least three light emitting elements connected to the first electrode lead, the second electrode lead, and the heat dissipation lead;
A body having an upper portion and having a volume and including the first electrode lead, the second electrode lead, the heat dissipation lead, and the light emitting element therein; And
It includes; a molding material formed by including a nano-lens that is an inorganic material inside the body;
The heat dissipation lead is spaced apart from the first electrode lead and the second electrode lead, respectively, the separation distance is within 200μm, the size of the heat dissipation lead is 4.3mm,
The body,
The lower and upper surfaces are formed parallel to each other,
The lower surface is formed with a smaller area than the upper surface, the hypotenuse connecting the lower surface and the upper surface is formed in a trapezoidal shape,
The LED package of the four sides of the upper surface is formed in a parallelogram shape.
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