KR102040066B1 - Liquid composition for stripping a color resist and an organic insulating layer - Google Patents
Liquid composition for stripping a color resist and an organic insulating layer Download PDFInfo
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- KR102040066B1 KR102040066B1 KR1020190094381A KR20190094381A KR102040066B1 KR 102040066 B1 KR102040066 B1 KR 102040066B1 KR 1020190094381 A KR1020190094381 A KR 1020190094381A KR 20190094381 A KR20190094381 A KR 20190094381A KR 102040066 B1 KR102040066 B1 KR 102040066B1
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- organic insulating
- insulating film
- amine
- color resist
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- 239000000203 mixture Substances 0.000 title claims abstract description 34
- 239000007788 liquid Substances 0.000 title claims abstract description 17
- -1 quaternary ammonium salt compound Chemical class 0.000 claims abstract description 32
- 150000003973 alkyl amines Chemical class 0.000 claims abstract description 11
- 239000002798 polar solvent Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 10
- 125000006165 cyclic alkyl group Chemical group 0.000 claims abstract description 10
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 5
- 239000001257 hydrogen Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 claims description 6
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 5
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims description 4
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 4
- HMWXCSCBUXKXSA-UHFFFAOYSA-N 2-propoxyethanamine Chemical compound CCCOCCN HMWXCSCBUXKXSA-UHFFFAOYSA-N 0.000 claims description 3
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 claims description 3
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 3
- WRDLTPMUGXTIAM-UHFFFAOYSA-N 1-(oxolan-2-yl)ethanamine Chemical compound CC(N)C1CCCO1 WRDLTPMUGXTIAM-UHFFFAOYSA-N 0.000 claims description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 2
- BQCCJWMQESHLIT-UHFFFAOYSA-N 1-propylsulfinylpropane Chemical compound CCCS(=O)CCC BQCCJWMQESHLIT-UHFFFAOYSA-N 0.000 claims description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- ASUDFOJKTJLAIK-UHFFFAOYSA-N 2-methoxyethanamine Chemical compound COCCN ASUDFOJKTJLAIK-UHFFFAOYSA-N 0.000 claims description 2
- PWGVOCGNHYMDLS-UHFFFAOYSA-N 3-(2-methoxyethoxy)propan-1-amine Chemical compound COCCOCCCN PWGVOCGNHYMDLS-UHFFFAOYSA-N 0.000 claims description 2
- VHYUNSUGCNKWSO-UHFFFAOYSA-N 3-propan-2-yloxypropan-1-amine Chemical compound CC(C)OCCCN VHYUNSUGCNKWSO-UHFFFAOYSA-N 0.000 claims description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- LIWAQLJGPBVORC-UHFFFAOYSA-N N-ethyl-N-methylamine Natural products CCNC LIWAQLJGPBVORC-UHFFFAOYSA-N 0.000 claims description 2
- MRNZSTMRDWRNNR-UHFFFAOYSA-N bis(hexamethylene)triamine Chemical compound NCCCCCCNCCCCCCN MRNZSTMRDWRNNR-UHFFFAOYSA-N 0.000 claims description 2
- 150000004985 diamines Chemical class 0.000 claims description 2
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 claims description 2
- 229940043279 diisopropylamine Drugs 0.000 claims description 2
- XHFGWHUWQXTGAT-UHFFFAOYSA-N dimethylamine hydrochloride Natural products CNC(C)C XHFGWHUWQXTGAT-UHFFFAOYSA-N 0.000 claims description 2
- 235000011056 potassium acetate Nutrition 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 2
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 2
- 235000011151 potassium sulphates Nutrition 0.000 claims description 2
- 150000003141 primary amines Chemical class 0.000 claims description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 2
- 150000003335 secondary amines Chemical class 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 239000004317 sodium nitrate Substances 0.000 claims description 2
- 235000010344 sodium nitrate Nutrition 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
- 150000003512 tertiary amines Chemical class 0.000 claims description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 2
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 claims description 2
- PNXOJQDKFIWCED-UHFFFAOYSA-N 1-(oxolan-2-yl)pentan-2-amine Chemical compound CCCC(N)CC1CCCO1 PNXOJQDKFIWCED-UHFFFAOYSA-N 0.000 claims 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims 1
- 229920000768 polyamine Polymers 0.000 claims 1
- 235000011181 potassium carbonates Nutrition 0.000 claims 1
- 235000011118 potassium hydroxide Nutrition 0.000 claims 1
- 235000017550 sodium carbonate Nutrition 0.000 claims 1
- 235000011121 sodium hydroxide Nutrition 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000758 substrate Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- YNOGYQAEJGADFJ-UHFFFAOYSA-N oxolan-2-ylmethanamine Chemical compound NCC1CCCO1 YNOGYQAEJGADFJ-UHFFFAOYSA-N 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 2
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 2
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 235000007686 potassium Nutrition 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
- G03F7/327—Non-aqueous alkaline compositions, e.g. anhydrous quaternary ammonium salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명은 4급 암모늄염 화합물, 극성용제, 알킬 아민, [화학식 1]의 알콕시 알킬아민, 무기염기 또는 그의 염화합물 및 물을 포함하는 것을 특징으로 하는, 칼라 레지스트 및 유기계 절연막 박리액 조성물에 관한 것이다.
[화학식 1]
(상기 화학식 1에서, R1은 C1~C6의 사슬형 또는 고리형 알콕시기이며, 상기 알콕시기는 C1~C6의 사슬형 또는 고리형 알킬기, 또는 C1~C3의 알콕시기로 치환된 것 일 수 있고, R2 및 R3는 각각 독립적으로 수소, 또는 C1~C6의 사슬형 또는 고리형 알킬기이고, n은 1 내지 4의 정수이다.)The present invention relates to a color resist and organic insulating film release liquid composition comprising a quaternary ammonium salt compound, a polar solvent, an alkyl amine, an alkoxy alkylamine of [Formula 1], an inorganic base or a salt compound thereof and water. .
[Formula 1]
(In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer of 1 to 4).
Description
본 발명은 칼라필터의 경화된 칼라레지스트 및 유기계 절연막을 제거하여 칼라필터를 재사용하기 위한 칼라 레지스트 및 유기계 절연막 박리액 조성물에 관한 것이다.The present invention relates to a color resist and an organic insulating film release liquid composition for removing a cured color resist and an organic insulating film of a color filter to reuse the color filter.
칼라필터(color filter)는 상보성 금속 산화막 반도체(complementary metal oxide semiconductor, CMOS) 또는 전하결합소자(charge coupled device, CCD)와 같은 이미지 센서의 컬러 촬영 장치 내에 내장되어 실제로 컬러 화상을 얻는데 이용될 수 있으며, 이 밖에도 촬영소자, 플라즈마 디스플레이 패널(PDP), 액정표시장치(LCD), 전계방출 디스플레이(FEL) 및 발광 디스플레이(LED) 등에 널리 이용되는 것으로, 그 응용범위가 급속히 확대되고 있다. 특히, 최근에는 LCD의 용도가 더욱 확대되고 있으며, 이에 따라 LCD의 색조를 재현하는데 있어서 컬러필터는 가장 중요한 부품 중의 하나로 인식되고 있다.The color filter is embedded in a color imaging device of an image sensor such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), and may be used to actually obtain a color image. In addition, it is widely used in photographing devices, plasma display panels (PDPs), liquid crystal displays (LCDs), field emission displays (FELs), and light emitting displays (LEDs), and its application range is rapidly expanding. In particular, in recent years, the use of LCDs has been further expanded. Accordingly, color filters have been recognized as one of the most important components in reproducing the color tone of LCDs.
칼라필터 기판은 적(R), 녹(G), 청(B) 패턴과 각 화소 사이의 누설광을 차단하고 대비를 향상시키기 위한 역할을 하는 블랙 매트릭스, 그리고 액정셀에 전압을 인가하는 공통전극으로 구성되어 있다.The color filter substrate is composed of a red matrix, a green matrix, a blue matrix, and a black matrix, which serves to block leakage light and improve contrast between pixels, and a common electrode for applying a voltage to the liquid crystal cell. It consists of.
칼라필터는 용도에 따라 선택된 블랙매트릭스 재료를 유리 기판에 도포하고 블랙 마스크 패턴을 형성한 다음 RGB 칼라레지스트 패턴을 포토리소그래피 공정에 의해 형성함으로써 제조된다.The color filter is manufactured by applying a black matrix material selected according to the application to a glass substrate, forming a black mask pattern, and then forming an RGB color resist pattern by a photolithography process.
이러한 칼라필터 제조 공정 중 불량 칼라필터가 불가피하게 발생할 수 있는데, 이러한 불량 칼라필터의 재사용을 위해 경화된 칼라레지스트를 제거하기 위한 조성물 개발이 필요하다.While a bad color filter may inevitably occur during the manufacturing process of such a color filter, it is necessary to develop a composition for removing the cured color resist for reuse of the bad color filter.
또한, 현재 평판표시장치 제조 공정에서, 칼라필터의 코팅을 위해 유기계 절연막이 사용되고 있어, 칼라필터의 RGB가 코팅불량이 발생하거나 유기계 절연막의 코팅 불량이 발생될 경우, 칼라필터를 폐기하는 대신 코팅 불량면을 제거하는 공정을 거치면 공정의 수율 향상 및 원가 절감의 효과가 있기 때문에 칼라필터의 재사용을 위해 RGB 칼라레지스트 및 유기계 절연막을 동시에 제거할 수 있는 박리액 조성물이 요구되고 있다.In addition, in the current flat panel display device manufacturing process, an organic insulating film is used for coating the color filter, so if the RGB of the color filter has a coating defect or a coating defect of the organic insulating film occurs, the coating defect is replaced instead of discarding the color filter. Since the process of removing the surface has the effect of improving the yield and cost reduction of the process, there is a need for a peeling liquid composition that can simultaneously remove the RGB color resist and organic insulating film for reuse of the color filter.
대한민국 공개특허 10-2009-0019299호는 무기알칼리 하이드록사이드 또는 알킬암모늄하이드록사이드, 알킬렌글리콜 또는 알킬렌 글리콜에테르, 하이드록실 아민, 알콕시알킬아민 및 잔량의 물을 포함하는 칼라레지스트 박리액 조성물을 개시하나, 하이드록실 아민의 사용으로 고온 공정 시 휘발로 인해 장기 사용시 제거성 저하 발생 문제가 있을 뿐 아니라, 칼라레지스트 및 유기계 절연막을 빠른 속도로 동시에 제거하는 효과를 나타내지 못하는 문제점이 있다.Korean Patent Laid-Open Publication No. 10-2009-0019299 discloses a color resist stripper composition comprising an inorganic alkali hydroxide or an alkylammonium hydroxide, an alkylene glycol or an alkylene glycol ether, a hydroxyl amine, an alkoxyalkylamine and a residual amount of water. However, the use of the hydroxyl amine due to the volatilization in the high-temperature process, there is a problem in that the removal of deterioration in long-term use, as well as the problem that does not exhibit the effect of simultaneously removing the color resist and organic insulating film at a high speed.
상기 종래 기술의 문제점을 해결하기 위해, 본 발명은 칼라필터의 경화된 칼라레지스트 및 유기계 절연막을 빠른 속도로 동시에 제거하여, 칼라필터의 재사용을 가능하게 하는 칼라 레지스트 및 유기계 절연막 박리액 조성물을 제공하는 것을 목적으로 한다.In order to solve the problems of the prior art, the present invention is to remove the cured color resist and the organic insulating film of the color filter at the same time at a high speed, to provide a color resist and organic insulating film release liquid composition to enable reuse of the color filter For the purpose of
상기 목적을 달성하기 위해, 본 발명은, 조성물 총 중량에 대하여, 4급 암모늄염 화합물 1-10 중량%, 극성용제 40-80 중량%, 알킬 아민 1-20 중량%, [화학식 1]의 알콕시 알킬아민 1-10 중량%, 무기염기 또는 그의 염화합물 0.001-1 중량% 및 물 1-40 중량%를 포함하는 것을 특징으로 하는, 칼라 레지스트 및 유기계 절연막 박리액 조성물을 제공한다.In order to achieve the above object, the present invention, based on the total weight of the composition, 1-10% by weight of the quaternary ammonium salt compound, 40-80% by weight polar solvent, 1-20% by weight alkyl amine, alkoxy alkyl of [Formula 1] Provided is a color resist and an organic insulating film release liquid composition comprising 1-10% by weight of an amine, 0.001-1% by weight of an inorganic base or a salt compound thereof, and 1-40% by weight of water.
[화학식 1][Formula 1]
상기 화학식 1에서, R1은 C1~C6의 사슬형 또는 고리형 알콕시기이며, 상기 알콕시기는 C1~C6의 사슬형 또는 고리형 알킬기, 또는 C1~C3의 알콕시기로 치환된 것 일 수 있고, R2 및 R3는 각각 독립적으로 수소, 또는 C1~C6의 사슬형 또는 고리형 알킬기이고, n은 1 내지 4의 정수이다.In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
본 발명의 박리액 조성물은 LCD 칼라필터의 경화된 RGB 및 투명 유기절연막 제거에 사용되며 레진을 용해시킴으로 장비 내 필터 막힘을 최소화하며, 칼라필터 및 유기 절연막을 효과적으로 제거하여 glass 혹은 하부 증착막에 대한 재사용(rework)의 생산성을 향상시킬 수 있다.The stripper composition of the present invention is used to remove the cured RGB and transparent organic insulating film of the LCD color filter and minimizes the filter clogging in the equipment by dissolving the resin, and effectively removes the color filter and the organic insulating film to reuse the glass or the lower deposition film. It can improve productivity of rework.
도 1은 본 발명의 실시예 3 및 비교예 6의 조성물을 70℃에서 개방컵으로 휘발 평가를 진행한 결과를 나타내는 그래프이다.
도 2는 실시예 3 및 비교예 6의 조성물을 70℃에서 개방컵으로 휘발시키면서 컬러레지스트 기판의 제거성을 평가한 결과를 나타내는 그래프이다.1 is a graph showing the results of volatilization evaluation of the compositions of Example 3 and Comparative Example 6 of the present invention in an open cup at 70 ℃.
2 is a graph showing the results of evaluating the removability of the color resist substrate while volatilizing the compositions of Example 3 and Comparative Example 6 with an open cup at 70 ° C.
이하 본 발명을 더욱 상세히 설명한다.Hereinafter, the present invention will be described in more detail.
본 발명은, 조성물 총 중량에 대하여, 4급 암모늄염 화합물 1-10 중량%, 극성용제 40-80 중량%, 알킬 아민 1-20 중량%, [화학식 1]의 알콕시 알킬아민 1-10 중량%, 무기염기 또는 그의 염화합물 0.001-1 중량% 및 물 1-40 중량%를 포함하는 것을 특징으로 하는, 칼라 레지스트 및 유기계 절연막 박리액 조성물을 제공한다.The present invention, 1-10% by weight of the quaternary ammonium salt compound, 40-80% by weight polar solvent, 1-20% by weight alkyl amine, 1-10% by weight alkoxy alkylamine of [Formula 1], Provided is a color resist and an organic insulating film release liquid composition comprising 0.001-1% by weight of an inorganic base or a salt compound thereof and 1-40% by weight of water.
[화학식 1][Formula 1]
상기 화학식 1에서, R1은 C1~C6의 사슬형 또는 고리형 알콕시기이며, 상기 알콕시기는 C1~C6의 사슬형 또는 고리형 알킬기, 또는 C1~C3의 알콕시기로 치환된 것 일 수 있고, R2 및 R3는 각각 독립적으로 수소, 또는 C1~C6의 사슬형 또는 고리형 알킬기이고, n은 1 내지 4의 정수이다.In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
상기 유기계 절연막은 칼라필터를 보호하기 위해 칼라필터 위에 적층되는 것 뿐만 아니라 glass 위에 적층되어 있는 metal 전극간 연결을 방지하기 위한 절연층으로 사용되는 것을 말한다. 상기 유기계 절연막은 아크릴계 고분자 수지, 폴리이미드계 수지, 폴리에테르설폰계 수지 등으로 이루어진다. 본 발명의 조성물은 칼라필터의 재사용을 위해 경화된 칼라레지스트 뿐만 아니라 유기계 절연막을 제거할 수 있다.The organic insulating layer is not only stacked on the color filter to protect the color filter, but also used as an insulating layer to prevent connection between metal electrodes stacked on the glass. The organic insulating film is made of an acrylic polymer resin, a polyimide resin, a polyether sulfone resin, or the like. The composition of the present invention can remove not only the cured color resist but also the organic insulating film for reuse of the color filter.
상기 4급 암모늄염 화합물이 내놓는 하이드록사이드 이온은 칼라 고분자 레지스트내로 침투하여 고분자 레지스트의 용해를 촉진하는 역할을 한다.The hydroxide ions produced by the quaternary ammonium salt compound penetrate into the color polymer resist to promote dissolution of the polymer resist.
상기 4급 암모늄염 화합물은 테트라메틸암모늄 하이드록사이드(TMAH), 테트라에틸암모늄 하이드록사이드(TEAH), 테트라프로필암모늄 하이드록사이드(TPAH) 및 테트라부틸암모늄 하이드록사이드(TBAH)로 이루어진 군으로부터 선택되는 1종 이상인 것이 바람직하지만, 반드시 이에 한정되는 것은 아니다.The quaternary ammonium salt compound is selected from the group consisting of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrabutylammonium hydroxide (TBAH) Although it is preferable that it is 1 or more types, it is not necessarily limited to this.
상기 4급 암모늄염 화합물은 조성물 총 중량에 대하여, 1~10 중량%로 포함되는 것이 바람직하다. 1 중량% 미만으로 포함되면 하이드록사이드 이온의 칼라 레지스트 고분자 내로 침투력이 감소되며, 10중량%를 초과하면 물의 함량이 증가되어 고분자 레진에 대한 용해력이 감소된다.The quaternary ammonium salt compound is preferably included in 1 to 10% by weight based on the total weight of the composition. When included in less than 1% by weight, penetration of the hydroxide ions into the color resist polymer is reduced, and when it exceeds 10% by weight, the water content is increased to decrease the solubility in the polymer resin.
상기 극성용제는 팽윤된 고분자 레지스트에 침투하여 레지스트를 용해시키는 역할을 한다. The polar solvent serves to penetrate the swollen polymer resist to dissolve the resist.
상기 극성용제는 디메틸설폭사이드, 디에틸설폭사이드, 디프로필설폭사이드, 설포란, n-메틸피롤리돈, 피롤리돈 및 n-에틸피롤리돈으로 이루어진 군으로부터 선택되는 1종 이상인 것이 바람직하지만, 반드시 이에 한정되는 것은 아니다.The polar solvent is preferably at least one selected from the group consisting of dimethyl sulfoxide, diethyl sulfoxide, dipropyl sulfoxide, sulfolane, n-methylpyrrolidone, pyrrolidone and n-ethylpyrrolidone. However, the present invention is not limited thereto.
상기 극성용제는 조성물 총 중량에 대하여, 40 ~ 80중량%로 포함되는 것이 바람직하다. 40 중량% 미만으로 포함되면 고분자 레진의 용해력이 떨어지게 되고, 80 중량%를 초과하면 암모늄염 화합물의 활성을 저해하여 오히려 제거성이 떨어지게 된다.The polar solvent is preferably included in 40 to 80% by weight based on the total weight of the composition. If it is included in less than 40% by weight, the solubility of the polymer resin is lowered, and if it exceeds 80% by weight, the activity of the ammonium salt compound is inhibited and the removal is rather deteriorated.
상기 알킬아민은 칼라레지스트의 염료성분을 용해하는 역할을 한다.The alkylamine serves to dissolve the dye component of the color resist.
상기 알킬아민은 메틸 아민, 에틸아민, 이소프로필 아민 및 모노이소프로필아민을 포함하는 1급 아민; 디에틸 아민, 디이소프로필 아민 및 디부틸아민을 포함하는 2급 아민; 트리메틸아민, 트리에틸아민, 트리이소프로필아민 및 트리부틸아민을 포함하는 3급 아민; 에틸렌디아민, 프로필렌디아민, 1,3-프로판디아민 및 1,2-프로필렌디아민을 포함하는 디아민; 및 디에틸렌트리아민, 디헥실렌트리아민, 트리에틸렌테트라민 및 테트라에틸렌펜타아민을 포함하는 폴리아민으로 이루어진 군으로부터 선택되는 1종 이상인 것이 바람직하지만, 반드시 이에 한정되는 것은 아니다. The alkylamine may be a primary amine including methyl amine, ethylamine, isopropyl amine and monoisopropylamine; Secondary amines including diethyl amine, diisopropyl amine and dibutylamine; Tertiary amines including trimethylamine, triethylamine, triisopropylamine and tributylamine; Diamines including ethylenediamine, propylenediamine, 1,3-propanediamine and 1,2-propylenediamine; And it is preferably one or more selected from the group consisting of diethylenetriamine, dihexylenetriamine, triethylenetetramine and tetraethylenepentaamine, but is not necessarily limited thereto.
상기 알킬아민은 조성물 총 중량에 대하여, 1 ~ 20 중량%로 포함되는 것이 바람직하다. 1 중량% 미만으로 포함되면, 칼라 레지스트의 염료성분을 용해하기 어렵고, 20 중량%를 초과하면 증량에 따른 효과의 증가가 없으므로 경제적이지 못하며 4급 알킬암모늄 화합물 및 극성용제의 상대적 감소로 인해 고분자 레지스트의 용해력이 저하된다.The alkylamine is preferably included in 1 to 20% by weight based on the total weight of the composition. If it is contained in less than 1% by weight, it is difficult to dissolve the dye component of the color resist, if it exceeds 20% by weight is not economical because there is no increase in the effect of the increase and the polymer resist due to the relative decrease of quaternary alkylammonium compound and polar solvent The solvent power of falls.
상기 알콕시 알킬아민은 하기 화학식 1로 표시되는 화합물이다. The alkoxy alkylamine is a compound represented by the following formula (1).
[화학식 1][Formula 1]
상기 화학식 1에서, R1은 C1~C6의 사슬형 또는 고리형 알콕시기이며, 상기 알콕시기는 C1~C6의 사슬형 또는 고리형 알킬기, 또는 C1~C3의 알콕시기로 치환된 것 일 수 있고, R2 및 R3는 각각 독립적으로 수소, 또는 C1~C6의 사슬형 또는 고리형 알킬기이고, n은 1 내지 4의 정수이다.In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
상기 알콕시 알킬아민은 메톡시에틸아민, 메톡시프로필아민, 에톡시프로필아민, 프로폭시에틸아민, 이소프로폭시프로필아민, 메톡시에톡시프로필아민, 옥솔란-2-일-메탄아민, (옥솔란-2-일-메틸)부탄-1-아민 및 메틸옥솔란-2-일-메탄아민으로 이루어진 군으로부터 선택되는 1종 이상인 것이 바람직하지만, 반드시 이에 한정되는 것은 아니다.The alkoxy alkylamines are methoxyethylamine, methoxypropylamine, ethoxypropylamine, propoxyethylamine, isopropoxypropylamine, methoxyethoxypropylamine, oxolan-2-yl-methanamine, (jade It is preferably one or more selected from the group consisting of solan-2-yl-methyl) butan-1-amine and methyloxolane-2-yl-methanamine, but is not necessarily limited thereto.
상기 [화학식 1]의 알콕시 알킬아민 화합물은 조성물 총 중량에 대하여, 1 ~ 10 중량%로 포함되는 것이 바람직하다. 1중량% 미만으로 포함되면 경화된 레진 내 침투에 의한 결합을 끊는 힘이 떨어지게 되고, 10 중량%를 초과하면 4급 알킬암모늄 화합물 및 극성용제의 상대적 감소로 인해 고분자 레지스트의 용해력이 저하된다.The alkoxy alkylamine compound of [Formula 1] is preferably included in 1 to 10% by weight based on the total weight of the composition. When included in less than 1% by weight, the force to break the bond due to penetration in the cured resin is reduced, when the content exceeds 10% by weight due to the relative decrease of the quaternary alkylammonium compound and polar solvent decreases the solubility of the polymer resist.
상기 무기염기 또는 그의 염화합물은 유기계 절연막에 대한 박리력을 향상시키며, 리튬, 나트륨 또는 칼륨으로 이루어진 금속염을 들 수 있고, 구체적으로는, 수산화나트륨, 수산화칼륨, 탄산나트륨, 탄산칼륨, 중탄산나트륨, 중탄산칼륨, 질산나트륨, 질산칼륨, 황산나트륨, 황산칼륨, 규산나트륨, 규산칼륨, 아세트산나트륨, 및 아세트산칼륨으로 이루어진 군으로부터 선택되는 1종 이상인 것이 바람직하지만, 반드시 이에 한정되는 것은 아니다.The inorganic base or a salt compound thereof improves the peeling force on the organic insulating film, and may include metal salts composed of lithium, sodium or potassium, and specifically, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate and bicarbonate. It is preferably one or more selected from the group consisting of potassium, sodium nitrate, potassium nitrate, sodium sulfate, potassium sulfate, sodium silicate, potassium silicate, sodium acetate, and potassium acetate, but is not necessarily limited thereto.
상기 무기염기 또는 그의 염화합물은 조성물 총 중량에 대하여, 0.001 ~ 1.0 중량%로 포함되는 것이 바람직하다. 0.001 중량% 미만으로 포함되면 유기계 절연막에 대한 박리력이 떨어지며, 1 중량%를 초과하면 증량에 따른 효과가 미미하며 경제적이지 못하다.The inorganic base or a salt compound thereof is preferably included in 0.001 to 1.0% by weight based on the total weight of the composition. When the amount is less than 0.001% by weight, the peeling force of the organic insulating layer is lowered. When the amount is more than 1% by weight, the effect of the increase is insignificant and economical.
상기 물은 조성물 총 중량에 대하여 1 ~ 40 중량%로 포함될 수 있다. 물이 첨가되는 경우, 상기 알칼리계 화합물의 활성화를 향상시켜 레지스트의 제거 속도가 증가되며, 린스 공정시, 기판상에 잔존하는 유기 오염물 및 레지스트 박리액이 빠르고 완전하게 제거시킬 수 있다.The water may be included in 1 to 40% by weight based on the total weight of the composition. When water is added, the activation rate of the alkali-based compound is improved to increase the removal rate of the resist, and during the rinsing process, the organic contaminants and the resist stripping solution remaining on the substrate can be quickly and completely removed.
상기에서 물은 반도체 공정용의 물로서, 비저항값이 18MΩ/㎝ 이상인 탈이온수를 사용하는 것이 바람직하다.In the above, water is water for a semiconductor process, and it is preferable to use deionized water whose specific resistance value is 18 M (ohm) / cm or more.
이하에서, 실시예를 통하여 본 발명을 보다 상세히 설명한다. 그러나, 하기의 실시예는 본 발명을 더욱 구체적으로 설명하기 위한 것으로서, 본 발명의 범위가 하기의 실시예에 의하여 한정되는 것은 아니다. Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are intended to illustrate the present invention more specifically, but the scope of the present invention is not limited by the following examples.
(1) 박리액 조성물의 제조(1) Preparation of Stripping Liquid Composition
하기 표 1에 제시된 성분을 정해진 조성비에 따라 혼합하여 실시예 1 내지 13 및 비교예 1 내지 6의 박리액 조성물을 제조하였다.The components shown in Table 1 were mixed according to a predetermined composition ratio to prepare exfoliating solution compositions of Examples 1 to 13 and Comparative Examples 1 to 6.
(2) 칼라레지스트의 제거성 평가(2) Evaluation of Removability of Color Resist
칼라레지스트의 제거 평가는 Red, Green, Blue(이하 RGB)가 각각 도포되어 있는 칼라필터 기판을 사용하였다. 칼라레지스트는 도포 후 90℃에서 120초간 프리베이크한 뒤, 노광을 시킨 다음, 현상하였다. 그 후, 오븐에서 패턴이 형성된 기판을 220℃ 오븐에서 하드베이크 하여 제작하였다. The removal evaluation of the color resist used the color filter substrate in which Red, Green, and Blue (hereafter RGB) were apply | coated, respectively. The color resist was prebaked at 90 ° C. for 120 seconds after coating, followed by exposure and development. Thereafter, the substrate on which the pattern was formed in the oven was hardbaked in a 220 ° C. oven to prepare.
칼라레지스트의 제거성을 확인하기 위해 70℃의 용액에 3분, 5분, 10분간 침적하여 광학현미경으로 레지스트의 잔존 여부를 확인 하였다. In order to confirm the removal of the color resist, it was immersed in a solution of 70 ° C. for 3 minutes, 5 minutes, and 10 minutes to determine whether the resist remained by an optical microscope.
◎ : 레지스트 100% 제거◎: 100% removal of resist
○ : 레지스트 80%이상 제거○: Remove 80% or more of resist
△ : 레지스트 80%미만 제거△: remove less than 80% of resist
X : 레지스트 제거 안됨X: No resist removed
(3) 유기계 절연막의 제거성 평가 (3) Evaluation of Removability of Organic Insulating Film
유기계 절연막의 제거성을 확인하기 위해 유리 기판 위에 유기 절연막을 도포한 후, 하드베이크된 기판을 사용하여 70℃의 용액에 5분, 10분간 침적하여 광학현미경으로 유기 절연막의 잔존 여부를 확인하였다. 그 결과를 하기 표 2에 나타내었다.In order to confirm the removability of the organic insulating film, an organic insulating film was coated on the glass substrate, and then, the hard-baked substrate was used for 5 minutes and 10 minutes in a solution at 70 ° C. to confirm whether the organic insulating film remained by an optical microscope. The results are shown in Table 2 below.
◎ : 유기계 절연막 100%제거◎: 100% removal of organic insulating film
○ : 유기계 절연막 80%이상 제거○: Remove 80% or more of organic insulating film
△ : 유기계 절연막 80%미만 제거△: less than 80% of organic insulating film
X : 유기계 절연막 제거 안됨X: organic insulating film not removed
A1 : 이소프로필아민 A1: isopropylamine
A2 : 디에틸아민A2: diethylamine
A3 : 에틸렌디아민A3: ethylenediamine
A4 : 프로필렌디아민A4: Propylenediamine
A5 : 디에틸렌트리아민A5: diethylenetriamine
B1 : 메톡시프로필아민B1: methoxypropylamine
B2 : 프로폭시에틸아민B2: propoxyethylamine
B3 : 옥솔란-2-일-메탄아민B3: oxolan-2-yl-methanamine
B4 : 에톡시프로필아민B4: ethoxypropylamine
HA : 하이드록실아민HA: hydroxylamine
MDG : 디에틸렌글리콜 모노메틸에테르MDG: Diethylene Glycol Monomethyl Ether
상기 표 2에서 나타난 바와 같이, 본 발명의 실시예 1 내지 13의 박리액 조성물은 3분 이내에 컬러필터 레지스트의 80% 이상을 제거하였고, 5분 이내에 레지스트를 100% 제거하여 박리력이 매우 우수한 것을 볼 수 있었다. 또한, 유기계 절연막 레지스트도 10분 이내에 100% 제거하여, 단시간에 RGB 뿐만 아니라 유기계 절연막의 우수한 제거 효과를 나타냄을 알 수 있었다.As shown in Table 2, the peeling liquid composition of Examples 1 to 13 of the present invention removed 80% or more of the color filter resist within 3 minutes, 100% of the resist is removed within 5 minutes is very excellent peeling force Could see. In addition, it was found that 100% of the organic insulating film resists were also removed within 10 minutes, thereby exhibiting an excellent removal effect not only of RGB but also of the organic insulating film.
반면에 비교예 1 내지 5의 조성물은 RGB 뿐만 아니라 유기계 절연막을 제거하기 위해서는 장시간이 필요하였으며, 그 제거 효과도 미흡함을 알 수 있었다.On the other hand, the compositions of Comparative Examples 1 to 5 required a long time to remove not only the RGB but also the organic insulating layer, and it was understood that the removal effect was also insufficient.
상기 실시예와 비교예의 결과에 의하면, 알킬 아민 또는 알콕시 알킬아민이 단독으로 사용될 때보다 알킬 아민과 알콕시 알킬아민이 동시에 포함될 경우 RGB 기판과 유기계 절연막의 제거 효과가 양호함을 알 수 있었다. 이는 RGB 제거 효과가 양호한 알킬 아민과 유기계 절연막 제거 효과가 양호한 알콕시 알킬아민의 상호 상승 효과에 의하여 레지스트의 습윤 침투가 용이해져 레지스트 제거 속도가 향상됨을 알 수 있었다. According to the results of the above Examples and Comparative Examples, when the alkyl amine and the alkoxy alkylamine are included at the same time than when the alkyl amine or alkoxy alkylamine is used alone, the removal effect of the RGB substrate and the organic insulating film is better. It was found that the wet penetration of the resist was facilitated by the synergistic effect of the alkyl amine having good RGB removal effect and the alkoxy alkylamine having good organic insulating film removal effect, thereby improving the resist removal rate.
비교예 6과 같이 조성물 내 하이드록실 아민과 알콕시 알킬아민을 동시에 포함할 경우, RGB 또는 유기계 절연막을 단시간에 제거하기 어렵고, 고온 사용시 지나친 휘발에 의해 약액 소모량이 증가하게 되었고, 그에 따른 성능 저하로 인하여, 장기간 사용이 어려운 단점이 있었다.When the hydroxyl amine and the alkoxy alkylamine in the composition are included at the same time as in Comparative Example 6, it is difficult to remove the RGB or organic insulating film in a short time, and the consumption of the chemical liquid is increased due to excessive volatilization at high temperature, resulting in deterioration of performance. It was difficult to use for a long time.
도 1은 본 발명의 실시예 3 및 비교예 6의 조성물을 70℃에서 개방컵으로 휘발 평가를 진행한 결과를 나타내었다. 동일한 온도임에도 불구하고 비교예 6의 경우 2배 이상의 약액이 휘발함으로 인하여, RGB 및 유기계 절연막을 제거하는데 필요한 약액의 소모량이 많아지게 되었다. 또한, 도 2는 실시예 3 및 비교예 6의 조성물을 70℃에서 개방컵으로 휘발시키면서 컬러레지스트 기판의 제거성을 평가한 결과를 나타내었다. 휘발 속도가 빠름에 따라 시간 경과에 따른 성능의 저하도 빠르게 나타남을 확인 할 수 있었다.Figure 1 shows the results of the volatilization evaluation of the compositions of Example 3 and Comparative Example 6 of the present invention in an open cup at 70 ℃. In spite of the same temperature, in Comparative Example 6, since the chemical liquid was volatilized twice or more, the consumption of the chemical liquid required to remove the RGB and the organic insulating film increased. 2 shows the results of evaluating the removability of the color resist substrate while volatilizing the compositions of Example 3 and Comparative Example 6 with an open cup at 70 ° C. As the volatilization speed is high, the performance deterioration over time also appears to be rapid.
상기의 결과와 같이, 본 발명의 칼라 레지스트 및 유기계 절연막 박리액 조성물은 칼라필터의 칼라레지스트를 충분히 제거할 수 있을 뿐만 아니라 유기계 절연막을 충분히 제거할 수 있어, 칼라필터 재사용의 생산성을 향상시킬 수 있었다.As described above, the color resist and the organic insulating film release liquid composition of the present invention can not only sufficiently remove the color resist of the color filter but also sufficiently remove the organic insulating film, thereby improving the productivity of color filter reuse. .
Claims (6)
상기 무기염기 또는 그의 염화합물은 수산화나트륨, 수산화칼륨, 탄산나트륨, 탄산칼륨, 아세트산칼륨, 질산나트륨 및 황산 칼륨으로 이루어진 군으로부터 선택되는 1종 이상인 것을 특징으로 하는, 칼라 레지스트 및 유기계 절연막 박리액 조성물.
[화학식 1]
상기 화학식 1에서, R1은 C1~C6의 사슬형 또는 고리형 알콕시기이며, 상기 알콕시기는 C1~C6의 사슬형 또는 고리형 알킬기, 또는 C1~C3의 알콕시기로 치환된 것 일 수 있고, R2 및 R3는 각각 독립적으로 수소, 또는 C1~C6의 사슬형 또는 고리형 알킬기이고, n은 1 내지 4의 정수이다.It includes a polar solvent, alkyl amine, alkoxy alkylamine of [Formula 1], inorganic base or a salt compound thereof and water,
The inorganic base or a salt compound thereof is at least one selected from the group consisting of sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, potassium acetate, sodium nitrate and potassium sulfate, color resist and organic insulating film release liquid composition.
[Formula 1]
In Formula 1, R 1 is a C 1 ~ C 6 chain or cyclic alkoxy group, the alkoxy group is substituted with a C 1 ~ C 6 chain or cyclic alkyl group, or C 1 ~ C 3 alkoxy group R 2 and R 3 are each independently hydrogen or a C 1 to C 6 chain or cyclic alkyl group, and n is an integer from 1 to 4.
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