KR102035413B1 - Apparatus for handling semiconductor devices - Google Patents

Abstract

A semiconductor device handler is disclosed. The semiconductor device handler may include a DC test unit for testing a defective assembly of semiconductor devices, a load unit for loading the semiconductor devices into the DC test unit, and first semiconductor devices determined as defective in the DC test unit. A first unloading unit for unloading and a second semiconductor element determined as good in the DC test unit onto a burn-in board for burn-in test, and a load / load for unloading second semiconductor elements for which burn-in test is completed from burn-in board An unloading unit, a second unloading unit for unloading third semiconductor elements determined to be defective according to the burn-in test result, and a third unloading unit for unloading fourth semiconductor elements determined to be good according to the burn-in test result. It includes.

Description

Semiconductor device handlers

Embodiments of the present invention relate to a semiconductor device handler. More specifically, the present invention relates to a semiconductor device handler for storing semiconductor devices on a burn-in board for classifying the semiconductor devices and classifying the semiconductor devices according to a burn-in test result.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The semiconductor devices formed as described above may be individualized through a dicing process and may be commercialized through an assembly process such as a bonding process and a packaging process.

In the wafer state, the semiconductor devices are electrically inspected through an inspection apparatus such as a probe station and the like, and semiconductor devices that have been subjected to good quality can be commercialized through the assembly process, and then burn-in to the semiconductor devices for reliability verification. Test processes can be performed. In the burn-in test process, an electrical stress may be applied along with a thermal stress of about 80 to 125 ° C. to detect defects of the semiconductor devices.

The semiconductor devices may be transferred to a burn-in test apparatus in a state of being stored on a burn-in board for a burn-in test, and the test results are obtained by loading the semiconductor devices onto the burn-in board and unloading the semiconductor devices whose burn-in test is completed from the burn-in board. Semiconductor device handlers that are classified according to can be used with the burn-in test apparatus.

For example, the semiconductor device handler may include a loading unit for loading semiconductor devices, a DC test unit for DC testing of the semiconductor devices, a board stage supporting a burn-in board for loading the semiconductor devices, and providing the burn-in board. Board loaders, and the like. In addition, the first buffer unit for classifying the semiconductor devices determined as defective by the DC test unit and transferring the semiconductor devices determined as good to the burn-in board, and classifying the semiconductor devices for which the burn-in test is completed as good and defective It may include a second buffer unit for.

However, in the case of the semiconductor device handler as described above, classification of good and bad semiconductor devices according to DC test results is performed in the first buffer unit, and classification of good and bad semiconductor devices according to burn-in test results is performed. Since this is done in two buffer units, there is a problem in that the classification in the first and second buffer units takes a considerable time.

Embodiments of the present invention provide a semiconductor device handler capable of shortening the time required for transferring and sorting semiconductor devices.

According to embodiments of the present invention, a semiconductor device handler includes a DC test unit for testing a defect in assembly of semiconductor devices, a load unit for loading the semiconductor devices into the DC test unit, and a failure in the DC test unit. A first unloading unit for unloading the first semiconductor elements determined to be and a second semiconductor element loaded with the second semiconductor elements determined as good in the DC test unit onto the burn-in board for burn-in test and the burn-in test is completed A load / unload unit for unloading from the burn-in board, a second unload unit for unloading third semiconductor elements determined to be defective according to the burn-in test result, and a fourth semiconductor element determined to be good according to the burn-in test result And a third unload unit for unloading them.

According to embodiments of the present disclosure, the semiconductor device handler may include a first device transfer unit for transferring the first semiconductor devices from the DC test unit to the first unload unit, and the second semiconductor devices may be transferred to the DC. A second element transfer unit for transferring from a test unit to the load / unload unit, transferring the third semiconductor elements from the load / unload unit to the second unload unit, and transferring the fourth semiconductor elements to the load / unload unit The device may further include a third device transfer unit for transferring the device to the third unload unit.

According to embodiments of the present invention, the first element transfer unit may include a first buffer tray for accommodating the first semiconductor elements, a first storage position adjacent to the DC tester, and the first buffer tray; It may include a first buffer tray transfer unit for moving in the first horizontal direction between the first unload position adjacent to the first unload unit.

According to embodiments of the present invention, the second element transfer unit may be disposed in parallel with the first element transfer unit, a second buffer tray for accommodating the second semiconductor elements, and the second buffer tray. And a second buffer tray transfer unit for moving in the first horizontal direction between a first transfer position adjacent the DC tester and a second transfer position adjacent the load / unload unit.

According to embodiments of the present invention, the third element transfer unit may be disposed between the second unload unit and the third unload unit, and for receiving the third semiconductor elements and the fourth semiconductor elements. A third buffer tray and a second between the second storage position adjacent the load / unload unit and the second unload position and the third unload position between the second unload unit and the third unload unit; It may include a third buffer tray transfer unit for moving in the horizontal direction.

In example embodiments, the load unit and the first, second and third unload units may include the semiconductor devices, the first semiconductor devices, the third semiconductor devices, and the fourth semiconductor device. Each tray may include a tray shuttle for transferring the trays accommodated therein, and a shuttle driver for moving the tray shuttle in a second horizontal direction.

According to embodiments of the present invention, the load unit and the first, second and third unload units may further include a height adjusting unit for adjusting the height of the tray shuttle.

According to embodiments of the present disclosure, the semiconductor device handler may include a load stacker for loading the trays in which the semiconductor devices are accommodated, a first unload stacker for loading the trays in which the first semiconductor devices are accommodated, The semiconductor device may further include a second unload stacker for loading the trays in which the third semiconductor devices are accommodated, and a third unload stacker for loading the trays in which the fourth semiconductor devices are accommodated.

According to embodiments of the present invention, the load unit and the first, second and third unload units may be disposed under the load stacker and the first, second and third unload stackers, respectively.

According to embodiments of the present invention, the rod stacker and the first, second and third unload stackers may each include latch members for supporting side portions of the lowermost tray of the trays.

According to embodiments of the present disclosure, the semiconductor device handler may include the load unit and the first, second and third unload units and the load stacker and the first, second and third unload stackers. It may further comprise elevators for the delivery of the trays.

According to embodiments of the present disclosure, the semiconductor device handler may be configured between the load unit and the first, second and third unload units and the load stacker and the first, second and third unload stackers. The semiconductor device may further include a lower tray transfer unit configured to transfer an empty tray from the load unit to the first, second or third unload unit after the semiconductor elements are loaded into the DC test unit.

According to embodiments of the present invention, the lower tray transfer unit may include a lower tray shuttle for holding side portions of the empty tray, and a lower shuttle driving unit for moving the lower tray shuttle in a first horizontal direction. Can be.

According to embodiments of the present invention, the lower tray transfer unit may include a rotation drive unit for rotating the lower tray shuttle, a container disposed below the lower tray shuttle and collecting semiconductor elements remaining in the empty tray. It may further include.

According to embodiments of the present invention, the semiconductor element handler is disposed under the lower tray transfer unit and is disposed below the lower tray transfer unit for loading the trays in which the semiconductor elements are stored. A lower buffer stacker for stacking the trays in which the first semiconductor elements or the third semiconductor elements are accommodated; a lower buffer stacker disposed below the lower tray transfer unit and for loading the trays in which the fourth semiconductor elements are accommodated. It may further include an unload stacker.

According to embodiments of the present disclosure, the semiconductor device handler may include a tray load port for loading and unloading the trays, the load stacker and the first, second and third unload stackers, and the trays. The apparatus may further include a load tray and an upper tray transfer unit for transferring the trays between the load stacker and the first, second and third unload stackers.

The semiconductor device handler of claim 1, further comprising: a board stage configured to support the burn-in board and to move in a horizontal direction for loading and unloading the second semiconductor devices; It may further include a board loader for storing the board racks containing the burn-in boards of the board and to provide the board racks to the burn-in tester, and a board transfer unit for transferring the burn-in board between the board stage and the board loader. .

According to the embodiments of the present invention as described above, the first semiconductor elements determined as defective by the DC test unit and the second semiconductor elements determined as good are transferred to the first unload unit and the load / unload unit. Each can be transported. In particular, the first semiconductor elements and the second semiconductor elements may be transferred to the first unload unit and the load / unload unit by the first element transfer unit and the second element transfer unit, respectively. Therefore, the time required for the transfer of the first and second semiconductor elements may be significantly shortened as compared with the conventional technology of transferring semiconductor elements to a classification and burn-in board based on a DC test result using one buffer unit.

1 is a schematic diagram illustrating a semiconductor device handler according to an embodiment of the present invention.
FIG. 2 is a schematic diagram illustrating the first device transfer unit illustrated in FIG. 1.
FIG. 3 is a schematic configuration diagram illustrating the second element transfer unit illustrated in FIG. 1.
4 is a schematic diagram illustrating a load unit illustrated in FIG. 1.
FIG. 5 is a schematic diagram illustrating the load stacker illustrated in FIG. 1.
FIG. 6 is an enlarged configuration diagram for describing the latch member illustrated in FIG. 5.
FIG. 7 is a schematic plan view illustrating the tray shuttle shown in FIG. 4.
8 is a schematic configuration diagram illustrating the lower tray transfer unit and the upper tray transfer unit.
FIG. 9 is a schematic plan view for describing a first lower tray shuttle of the lower tray transport unit illustrated in FIG. 8.
10 is a schematic view for explaining a board loader and a board transfer unit.
FIG. 11 is a schematic diagram illustrating the board loader illustrated in FIG. 10.
FIG. 12 is a schematic diagram illustrating the third element transfer unit illustrated in FIG. 1.
FIG. 13 is a schematic diagram illustrating another example of the first and second unload stackers illustrated in FIG. 1.
14 is a schematic diagram illustrating a semiconductor device handler according to another embodiment of the present invention.

Embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

In the embodiments of the present invention, when an element is described as being disposed or connected on another element, the element may be disposed or connected directly on the other element, with other elements interposed therebetween. May be Alternatively, if one element is described as being directly disposed or connected on another element, there may be no other element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not.

The terminology used in the embodiments of the present invention is merely used for the purpose of describing particular embodiments and is not intended to limit the present invention. Also, unless stated otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected sufficiently. Accordingly, embodiments of the invention are not to be described as limited to the particular shapes of the areas described as the illustrations, but include variations in the shapes, and the elements described in the figures are entirely schematic and their shapes Is not intended to describe the precise shape of the elements nor is it intended to limit the scope of the invention.

1 is a schematic diagram illustrating a semiconductor device handler according to an embodiment of the present invention.

Referring to FIG. 1, a semiconductor device handler 100 according to an embodiment of the present invention may be used for burn-in test of semiconductor devices. For example, the semiconductor device handler 100 may be used to load semiconductor devices into the burn-in board 20 for burn-in test and to classify the semiconductor devices whose burn-in test is completed according to the burn-in test result.

According to an embodiment of the present disclosure, the semiconductor device handler 100 may include a DC test unit 110 for testing a defect in assembly of semiconductor devices, and a load for loading the semiconductor devices into the DC test unit 110. A first unload unit 160 for unloading the load unit 120, the semiconductor devices (hereinafter referred to as 'first semiconductor devices') that are determined to be defective in the DC test unit 110, and the DC test In the unit 110, semiconductor devices (hereinafter referred to as 'second semiconductor devices') that are determined to be good are loaded onto the burn-in board 20 for burn-in test, and the burn-in boards of the second semiconductor devices that have completed the burn-in test ( A load / unload unit 112 for unloading from 20 and a second unload for unloading semiconductor devices (hereinafter referred to as 'third semiconductor devices') which are determined to be defective according to the burn-in test result. The unit 162 may include a third unloading unit 164 for unloading semiconductor devices (hereinafter, referred to as 'fourth semiconductor devices') that are determined to be good according to the burn-in test result.

In addition, the semiconductor device handler 100 may include a first device transfer unit 130 and a second device for transferring the first semiconductor devices from the DC test unit 110 to the first unload unit 160. A second element transfer unit 140 for transferring semiconductor elements from the DC test unit 110 to the load / unload unit 112, and the third semiconductor elements from the load / unload unit 112. And a third device transfer unit 150 for transferring the second unload unit 162 and transferring the fourth semiconductor elements from the load / unload unit 112 to the third unload unit 164.

FIG. 2 is a schematic configuration diagram for describing the first element transfer unit illustrated in FIG. 1, and FIG. 3 is a schematic configuration diagram for describing the second element transfer unit illustrated in FIG. 1.

Referring to FIG. 2, the first element transfer unit 130 may include a first buffer tray 132 for accommodating the first semiconductor elements and a first buffer tray for transferring the first buffer tray 132. It may include a transfer unit 134. For example, the first device transfer unit 130 may include two first buffer trays 132 in order to speed up the transfer of the first semiconductor elements, and the first buffer tray transfer unit 134. ) Is the first buffer tray in a first horizontal direction, for example, an X-axis direction, between a first receiving position adjacent to the DC test unit 110 and a first unloading position adjacent to the first unloading unit 160. The field 132 may be reciprocated. In particular, as shown, the first buffer trays 132 may be installed at different heights to cross-move in opposite directions.

Although not shown in detail, the first buffer trays 132 may include pockets for accommodating the first semiconductor devices. As another example, although not shown, the first buffer trays 132 may include a plurality of vacuum holes for vacuum suction of the first semiconductor devices. In this case, an adsorption pad having a flat top surface and a plurality of vacuum holes may be provided on the first buffer trays 132, and the adsorption pad may be commonly used regardless of the sizes of the first semiconductor devices. . In this case, the adsorption pad is preferably made of a flexible material such as silicone resin or rubber so that the vacuum adsorption state of the first semiconductor devices can be stably maintained.

In addition, although not shown, as another example, the first device transfer unit 130 may include height adjusting units for adjusting the heights of the first buffer trays 132. In this case, the height adjusting units may adjust the heights of the first buffer trays 132 differently when the first buffer trays 132 cross each other in opposite directions. As an example, the height adjusting units may be configured using a pneumatic cylinder.

Referring to FIG. 3, the second element transfer unit 140 may include a second buffer tray 142 for accommodating the second semiconductor elements and a second buffer tray for transferring the second buffer tray 142. It may include a transfer unit 144. For example, the second element transfer unit 140 may be disposed in parallel with the first element transfer unit 130, for example, in the X-axis direction, and the transfer of the second semiconductor elements may be faster. To this end, two second buffer trays 142 may be provided. In addition, the first buffer tray transfer unit 144 may include a first transfer position adjacent to the DC test unit 110, that is, a first transfer position adjacent to the first storage position and a first transfer position adjacent to the load / unload unit 112. The second buffer trays 142 may be reciprocated in the X-axis direction between two transfer positions. In particular, as shown, the second buffer trays 142 may be installed at different heights to cross-move in opposite directions.

Although not shown in detail, the second buffer trays 142 may include pockets for accommodating the second semiconductor devices. As another example, although not shown, the second buffer trays 142 may include a plurality of vacuum holes for vacuum suction of the second semiconductor devices. In this case, an adsorption pad having a flat upper surface and a plurality of vacuum holes may be provided on the second buffer trays 142, and the adsorption pad may be commonly used regardless of the sizes of the second semiconductor devices. . At this time, the adsorption pad is preferably made of a flexible material such as silicone resin or rubber so that the vacuum adsorption state of the second semiconductor devices can be stably maintained.

In addition, although not shown, as another example, the second element transfer unit 140 may include height adjusting units for adjusting the heights of the second buffer trays 142. In this case, the height adjusting units may adjust the heights of the second buffer trays 142 differently when the second buffer trays 142 cross each other in opposite directions. As an example, the height adjusting units may be configured using a pneumatic cylinder.

As described above, the first semiconductor device determined as defective and the second semiconductor devices determined to be good according to the test result of the DC test unit 110 include the first device transfer unit 130 and the second device transfer unit. Each of the semiconductor devices 140 may be transferred using the 140, so that the classification of semiconductor devices according to the DC test result may be performed very quickly. Referring back to FIG. 1, the DC test unit 110, although not shown in detail, may test defects that may occur in an assembly process of the semiconductor devices, for example, a die bonding, a wire bonding, a packaging process, and the like. Can be used for For example, the DC test unit 110 may measure DC characteristics such as open / short, input current, output voltage, power current, and the like by applying a prescribed voltage to the semiconductor devices. A good payment can be determined. Although not shown, the DC test unit 110 may include a DC test socket into which the semiconductor devices are inserted and a DC test board for applying a test signal to semiconductor devices inserted into the DC test sockets. have.

The DC test sockets may include latches for fixing the semiconductor elements, and the DC test unit 110 may include a DC socket press member for opening the latches. Although not shown, the DC socket press member may have openings for loading and unloading the semiconductor elements.

4 is a schematic diagram illustrating a load unit illustrated in FIG. 1.

Referring to FIG. 4, the load unit 120 moves the tray shuttle 122 and the tray shuttle 122 to a second horizontal direction, for example, Y, for transferring the tray 10 in which the semiconductor elements are accommodated. Shuttle driver 124 for transferring in the axial direction may be included. For example, the load unit 120 may include two tray shuttles 122 to shorten the time required for loading the semiconductor devices, and the tray shuttles 122 cross each other in opposite directions. Can be placed at different heights for movement.

As another example, although not shown, the load unit 120 may include height adjusting units (not shown) for adjusting the height of the tray shuttles 122. The height adjusting units may adjust the heights of the tray shuttles 122 so that the tray shuttles 122 may be positioned at different heights, thereby reducing the time required for loading the semiconductor devices. Can be. For example, two trays 10 may be positioned up and down at a position adjacent to the DC test unit 110 by the tray shuttles 122, and the semiconductor device accommodated in the upper tray 10. Immediately after all of them are supplied to the DC test unit 110, the semiconductor devices accommodated in the lower tray 10 may be continuously supplied to the DC test unit 110 without time delay. Also, as an example, the height adjusting units may be configured using a pneumatic cylinder.

Referring back to FIG. 1, the semiconductor device handler 100 includes a load stacker 170 for loading the trays 10 in which the semiconductor devices are accommodated, and trays 10 in which the first semiconductor devices are accommodated. A first unload stacker 180 for loading the metal, a second unload stacker 182 for loading the trays 10 in which the third semiconductor devices are accommodated, and trays in which the fourth semiconductor devices are stored. A third unload stacker 184 for loading 10) may be used. The load stacker 170 and the first, second and third unload stackers 180, 182, and 184 may be arranged in an X-axis direction, and the load unit 120 and the first, second, and first The three unload units 160, 162, and 164 may be disposed below the load stacker 170 and the first, second, and third unload stackers 180, 182, and 184, respectively.

As shown, the semiconductor device handler 100 further includes a second load stacker 178 and three third unload stackers 184, but the number of the load stackers 170 and 178. Since the number of the first, second and third unload stackers 180, 182, and 184 can be variously changed, the scope of the present invention will not be limited thereby.

FIG. 5 is a schematic diagram illustrating the load stacker illustrated in FIG. 1, FIG. 6 is an enlarged diagram illustrating the latch member illustrated in FIG. 5, and FIG. 7 illustrates the tray shuttle illustrated in FIG. 4. A schematic plan view for illustration.

5 and 6, the rod stacker 170 supports guide members 172 supporting corner portions of the trays 10 so as to stably maintain the loaded state of the trays 10. It may also include a latch member 174 for supporting the side portions of the lowermost tray 10 of the stacked trays (10).

Specifically, the side portions of the trays 10 may be provided with recesses 12 into which the latch members 174 may be inserted, and the latch members 174 may include the lowermost tray ( It may be inserted into the recesses 12 of 10 to support the stacked trays 10 as a whole. Although not shown in detail, the latch members 174 may be operated by the latch driver 176, respectively, and the latch driver 176 may be configured, for example, in the form of a pneumatic cylinder or an electromagnetic actuator. have.

4 and 5, the load unit 120 may transfer the tray 10 between the DC test unit 110 and the load stacker 170, and the load unit 120 may move. An elevator 190 for transferring the tray 10 from the load stacker 170 to the tray shuttle 122 may be disposed below.

Referring to FIG. 7, the tray shuttle 122 may have a substantially rectangular ring shape for operation of the elevator 190. That is, the tray shuttle 122 may have an opening 122A for the operation of the elevator 190, and a stepped portion for supporting edge portions of the tray 10 may be provided inside the opening 122A. Can be. In addition, the tray shuttle 122 may be provided with pushers 126 for aligning the side portions of the tray 10 by pushing in the horizontal direction, and the tray shuttle (126) by the pushers 126 as described above. Grippers 128 may be provided to press and fix the edge upper surface portions of the tray 10 aligned with the central portion of the 122. As described above, even in the case of a tray in which warpage is generated by the pushers 126 and the grippers 128, the tray shuttle 122 may be stably fixed at a predetermined position on the tray shuttle 122. As an example, the pushers 126 and grippers 128 may be driven by a pneumatic cylinder or an electromagnet actuator.

The elevator 190 may be lifted through the tray shuttle 122 and may be lifted until the trays 10 loaded on the load stacker 170 are supported by the elevator 190. As described above, the latch members 174 may be opened after the trays 10 are supported by the elevator 190, and the elevator 190 is the second tray below the trays 10. 10 may be lowered to correspond with the latch members 174. Subsequently, the latch members 174 may support the second tray 10, and the elevator 190 may be lowered to load the lowermost tray 10 on the tray shuttle 122. have.

Although not shown in detail, the first, second, and third unload units 160, 162, and 164 transfer the tray shuttle and the tray shuttle in the Y-axis direction similarly to the load unit 120, respectively. It may include a shuttle driving unit for the lower portion of the first, second and third unload units 160, 162, 164, the first, second and third unload units 160, 162, 164 ) And elevators 190 for transferring the trays 10 may be disposed between the first, second and third unload stackers 180, 182, and 184, respectively. In addition, the first, second and third unload units 160, 162 and 164 may include height adjusting units for adjusting the height of the tray shuttle, respectively, similarly to the load unit 120.

As an example, after the tray 10 in which the first semiconductor elements are accommodated is transferred to the lower portion of the first unload stacker 180 by the first unload unit 160, the elevator 190 may move to the tray 10. ), And the trays 10 loaded on the tray 10 and the first unload stacker 180 by the elevator 190 may be supported by the elevator 190. Subsequently, latch members of the first unload stacker 180 may be opened, and the elevator 190 may raise the stackers 10 so that the tray 10 corresponds to the latch members. . Thereafter, the latch members are lifted from the first unloading unit 160 by the lowermost tray 10 of the trays 10, ie, the elevator 190, to support the trays 10. The side portions of 10) may be supported.

The operation of the second and third unload units 162 and 164 and the second and third unload stackers 182 and 184 and the elevators 190 thereunder are similar to those described above, so Additional descriptions are omitted. In addition, a detailed configuration of the first, second and third unload units 160, 162, and 164 and the first, second and third unload stackers 180, 182, and 184 may include the load unit 120. ) And the detailed configuration of the load stacker 170, so further description thereof will be omitted.

In addition, referring to FIG. 1, the semiconductor device handler 100 may further include buffer stackers 186 and 188. The buffer stackers 186 and 188 may be used to load empty trays and cover trays or to temporarily store the trays 10 loaded with the semiconductor devices or the first, second or third semiconductor devices. . As shown, two buffer trays 186 and 188 are used, but the number of the buffer trays 186 and 188 may be variously changed.

FIG. 8 is a schematic configuration diagram for describing the lower tray transfer unit and the upper tray transfer unit, and FIG. 9 is a schematic plan view for explaining a first lower tray shuttle of the lower tray transfer unit illustrated in FIG. 8.

According to one embodiment of the invention, the semiconductor device handler 100, as shown in Figure 8, the load unit 120 and the first, second and third unload units 160, 162, 164 and a lower tray transfer unit 210 disposed between the rod stacker 170 and the first, second and third unload stackers 180, 182, and 184. For example, the lower tray transfer unit 210 may move the empty tray 10 from the load unit 120 after the semiconductor devices are loaded into the DC test unit 110. It can be used to deliver to unload unit 160, 162 or 164.

The lower tray transfer unit 210 may include lower tray shuttles 212 and 214 and lower tray shuttles 212 and 214 for gripping side portions of the empty tray 10 or the tray 10 in which the semiconductor devices are accommodated. ) May include a lower shuttle driver 216 for transferring the X-axis direction. In particular, as shown, the lower tray transfer unit 210 may include two lower tray shuttles 212 and 214, and the lower tray shuttles 212 and 214 may be moved independently of each other. . To this end, the lower shuttle driver 216 may be configured by using a linear motor, for example, the first lower tray shuttle 212 may transfer the empty tray 10 to the buffer stacker 186 or 188. A second lower tray shuttle 214 can be used to transport the empty tray 10 from the buffer stacker 186 or 188 to the first, second and third unload units 180, 182, 184. ) Can be transferred.

In particular, according to an embodiment of the present invention, as shown in FIG. 9, the first lower tray shuttle 212 may have a quadrangular ring shape for elevating the elevators 190, and the tray Grippers 218 for gripping the side portions of 10 may be provided. In addition, the lower tray transfer unit 210 may be disposed below the rotary drive unit 220 and the lower tray shuttle 212 for rotating the first lower tray shuttle 212. It may include a container 222 for recovering any semiconductor device that may remain. As an example, the container 222 may be located under a transfer path of the first lower tray shuttle 212, and the rotation driving unit 220 may be located at the top of the container 222. By rotating 212, a semiconductor device that may remain in the empty tray 10 may be removed.

In addition, according to an embodiment of the present invention, the semiconductor device handler 100 may include a tray load port 200 for loading and unloading the trays 10 as shown in FIGS. 1 and 8. And between the tray load port 200, the load stacker 170, the first, second and third unload stackers 180, 182, and 184 and the buffer stackers 186 and 188. It may include an upper tray transfer unit 230 for transferring the trays (10).

Although not shown in detail, a tray elevator may be additionally installed in the tray load port 200 to move the trays 10 in a vertical direction, and the upper tray transfer unit 230 may include the trays 10. ) May include a tray transfer hand 232 for holding and a hand driver 234 for moving the tray transfer hand 232 in the X-axis direction.

For example, the tray load port 200 may be loaded with trays 10 in which the semiconductor elements are stored through a ceiling conveying device such as an overhead hoist transport (OHT) device, and the upper tray transport unit 230 may be loaded. The tray 10 may transfer the trays 10 from the tray load port 200 to the load stacker 170. In addition, the trays 10 loaded on the first, second and third unload stackers 180, 182, and 184 may be transferred to the tray load port 200 by the upper tray transfer unit 230. It can then be unloaded by the ceiling conveying device.

Referring back to FIG. 1, the load unit 120, the first, second and third unload units 160, 162 and 164, and the first, second and third element transfer units ( 130, 140, 150 may be disposed on the process table 102, and the process table 102 may be provided with openings for loading and unloading the second semiconductor elements to the burn-in board 20. have.

The load / unload unit 112 may load the second semiconductor devices transferred by the second device transfer unit 140 to the burn-in board 20, and load the second semiconductor devices that have been burn-in test completed. It can be unloaded from the burn-in board 20.

Although not shown in detail, the burn-in board 20 may include a plurality of burn-in test sockets into which the second semiconductor elements are inserted. The burn-in board 20 may support the burn-in board 20 under the process table 102. Board stage 240 may be disposed. The board stage 240 (see FIG. 10) may be configured to be movable in the X-axis direction and the Y-axis direction for loading and unloading the second semiconductor devices.

Although not shown, the burn-in test sockets may include latches for fixing the second semiconductor elements, and the load / unload unit 112 may include a burn-in socket press member for opening the latches. . The burn-in socket press member may have openings for loading and unloading the second semiconductor elements, and may press the burn-in test sockets to open the latches.

In addition, the semiconductor device handler 100 may include board racks 30 (see FIG. 10) in which a plurality of burn-in boards 200 are accommodated, and provide a board loader 30 to the burn-in tester. 250 (see FIG. 10), and a board transfer unit 260 (see FIG. 10) for transferring the burn-in board 20 between the board stage 240 and the board loader 250.

FIG. 10 is a schematic diagram illustrating a board loader and a board transfer unit, and FIG. 11 is a schematic diagram illustrating the board loader illustrated in FIG. 10.

10 and 11, although not shown in detail, the board loaders 30 may be accommodated in a 2 * 2 matrix form in the board loader 250, and the board loader 250 may have left and right sides. First and second board elevators 252 and 254 may be disposed to lift and lower the board racks 30 of, respectively. For example, each of the first and second board elevators 252, 254 may have an upper support 256 and a lower support 258 for supporting the board racks 30, respectively, as shown in detail. Although not, the upper supports 256 of the first and second board elevators 252, 254 to more efficiently perform the loading and unloading of the burn-in board 20 to the board racks (30) May be configured in the form of a conveyor belt. That is, the rack 30 positioned on the upper support 256 of the second board elevator 254 may be moved onto the upper support 256 of the first board elevator 252.

The board transfer unit 260 may transfer the burn-in board 20 between the board stage 240 and the board loader 250. For example, the board transfer unit 250 may include two board transfer hands for transferring the burn-in board 20, and the burn-in with respect to the board stage 240 using the board transfer hands. Loading and unloading of the board 20 can be performed more quickly.

Meanwhile, the board racks 30 may be transferred between the board loader 250 and the burn-in tester by a transport cart (not shown). The board transfer unit 260 may be configured to be movable in the Y-axis direction to remove the waiting time during the carrying out or storing step of the board rack 30 by the transfer cart. That is, when the step of carrying out or storing by the transfer cart is performed on the left side of the board loader 250, the board transfer unit 260 may be used with respect to the board rack 30 stored on the right side of the board loader 250. The burn-in board 20 may be loaded and unloaded.

Referring back to FIG. 1, the third and fourth semiconductor devices that are unloaded from the burn-in board 20 by the load / unload unit 112 are connected to the second and fourth devices by the third device transfer unit 150. It may be transferred to the third unloading units 162 and 164.

FIG. 12 is a schematic diagram illustrating the third element transfer unit illustrated in FIG. 1.

Referring to FIG. 12, the third device transfer unit 150 may be disposed between the second unload unit 162 and the third unload unit 164, and may include the third semiconductor devices and the fourth. Third buffer trays 152 for accommodating semiconductor devices, a second storage position adjacent to the load / unload unit 112, and the second unload unit 162. It may include a third buffer tray transfer unit 154 for moving between the second unload position and the third unload position between the third unload unit 164.

For example, the third device transfer unit 150 may include three third buffer trays 152, and the third buffer trays 152 may have different heights to cross each other in opposite directions. It can be arranged as. That is, the third buffer trays 152 may be arranged in a three-layer structure, and may be moved in the Y-axis direction by the third buffer tray transfer unit 154. Also, as an example, when the number of the fourth semiconductor devices, which are determined to be good, is greater than the third semiconductor devices, which are determined to be defective, among the second semiconductor devices where the burn-in test is completed, the two buffer trays 152 may be It may be used for the transfer of the fourth semiconductor devices. That is, the third buffer trays 152 may be appropriately operated according to the number of the third and fourth semiconductor devices, and accordingly, the sorting step of the third and fourth semiconductor devices may be faster. .

Although not shown, the semiconductor device handler 100 may include a first pick and place unit for transferring the semiconductor devices from the loader unit 120 to the DC test unit 110, and the DC test unit 110. A second pick and place unit for transferring the first semiconductor elements and the second semiconductor elements to the first element transfer unit 130 and the second element transfer unit 140, respectively, and the first element A third pick and place unit for transferring the first semiconductor elements from the transfer unit 130 to the first unload unit 160, and the burn-in board 20 from the second element transfer unit 140 to the burn-in board 20. A fourth pick and place unit for transferring two semiconductor elements, and a fifth pick for transferring the third and fourth semiconductor elements from the burn-in board 20 to the third element transfer unit 150. An n-place unit, a sixth pick-and-place unit for transferring the third semiconductor elements from the third element transfer unit 150 to the second unload unit 162 and from the third element transfer unit 150. And a seventh pick and place unit for transferring the fourth semiconductor devices to the third unload unit 164. The first to seventh pick-and-place units may include a plurality of pickers for picking up the semiconductor devices and a picker driver for moving the pickers in a horizontal and vertical direction, respectively.

In addition, although not shown, the semiconductor device handler 100 may further include code readers for detecting a recognition code such as a barcode or a QR code formed on the semiconductor devices, and the code readers may include the load unit. 120 and upper portions of the first, second and third unload units 160, 162 and 164, respectively.

FIG. 13 is a schematic diagram illustrating another example of the first and second unload stackers illustrated in FIG. 1.

Referring to FIG. 13, first and second unload stackers 270 and 280 may include upper latch members 272 and 282 and lower latch members 274 and 284 for supporting the trays 10. It may include. That is, the first and second unload stackers 270 and 280 may load the trays 10 by dividing the trays 10 into upper and lower ends. For example, the first unload stacker 270 may load the trays 10 containing the semiconductor devices, which are determined to be defective, as a result of the DC test on the upper end, and the semiconductor devices that are determined to be a test object may be loaded. The received trays 10 may be stacked at the bottom. In addition, the second unload stacker 280 may load the trays 10 containing the semiconductor devices, which are determined to be defective, as a result of the burn-in test, on the top of the trays. 10) can be loaded at the bottom.

However, the types of the trays 10 stacked on the upper and lower ends of the first and second unload stackers 270 and 280 may be variously changed as necessary, so that the scope of the present invention is limited by the above. It will not be limited.

14 is a schematic diagram illustrating a semiconductor device handler according to another embodiment of the present invention.

Referring to FIG. 14, a lower load stacker 290, a lower buffer stacker 292 and 294, and a lower unload stacker 296 may be provided below the lower tray transfer unit 210. In addition, first elevators 300 for vertically conveying the tray 10 may be disposed below the lower load stacker 290, the lower buffer stacker 292 and 294, and the lower unload stacker 296. Second elevators 302 may be disposed under the load unit 120 and the first, second and third unload units 160, 162 and 164.

Loading and unloading of the trays 10 for the lower load stacker 290, the lower buffer stackers 292 and 294, and the lower unload stacker 296 may be performed by a ceiling conveying apparatus. The lower load and unload stackers 290 and 296 may be used to prevent supply and discharge delays of the trays 10, and the lower buffer stacker 292 and 294 may be used for the DC test and burn-in test results. Accordingly, the semiconductor devices may be used to variously classify the defect types. In addition, the lower buffer stackers 292 and 294 may be used for loading a cover tray, an RFID tray or an empty tray. As shown, one lower load stacker 290, two lower buffer stackers 292 and 294, and one lower unload stacker 296 are used, but the number of these can be variously changed, thereby The range will not be limited.

The tray 10 loaded on the lower load stacker 290 may be transferred to the load unit 120 by the lower tray transfer unit 210, and the first semiconductor elements determined as defective by the DC test result may be received. The tray 10 may be loaded from the first unload unit 160 to the lower buffer stackers 292 and 294 by the lower tray transfer unit 210. In addition, the tray 10 in which the third semiconductor elements, which are determined to be defective, is received by the lower tray stacker 292 and 294 by the lower tray transfer unit 210 from the second unload unit 162. And a tray 10 in which the fourth semiconductor elements, which are determined to be good, as a result of the burn-in test, are received by the lower tray transfer unit 210 from the third unload unit 164. 296).

According to the embodiments of the present invention as described above, the first semiconductor devices that are determined to be defective by the DC test unit 110 and the second semiconductor devices that are determined to be good are the first unload unit 160. The load / unload unit 112 may be transferred to each. In particular, the first semiconductor elements and the second semiconductor elements are each of the first unloading unit 160 and the load / unload by the first element transfer unit 130 and the second element transfer unit 140. May be transferred to unit 112. Therefore, the time required for the transfer of the first and second semiconductor elements can be significantly shortened as compared with the conventional technology of transferring the semiconductor elements to the classification and burn-in board according to the DC test result using one buffer unit.

In addition, by arranging a plurality of stackers for stacking the trays in the upper and lower portions of the lower tray transfer unit, supply and export of the trays can be smoothly performed without time delay, and various semiconductor devices are classified according to defect types. Can be loaded and unloaded.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the claims below. I can understand that.

10 tray 20 burn-in board
30: board rack 100: semiconductor device handler
110: DC test unit 120: load unit
130: first element transfer unit 140: second element transfer unit
150: third element transfer unit 160: first unload unit
162: second unloading unit 164: third unloading unit
170: load stacker 180: first unload stacker
182: second unload stacker 184: third unload stacker
190: elevator 200: tray loading port
210: lower tray transfer unit 230: upper tray transfer unit
240: board stage 250: board loader
260: board transfer unit 270: first unload stacker
280: second unload stacker 290: lower road stacker
292, 294: Lower Buffer Stacker 296: Lower Unload Stacker
300: first elevator 302: second elevator

Claims (17)

A DC test unit for testing a defective assembly of semiconductor devices;
A load unit for loading the semiconductor elements into the DC test unit;
A first unloading unit for unloading the first semiconductor elements determined as defective in the DC test unit;
A load / unload unit for loading the second semiconductor elements determined as good in the DC test unit onto the burn-in board for burn-in test and unloading the second semiconductor elements that have been burn-in test completed from the burn-in board;
A second unloading unit for unloading third semiconductor elements determined to be defective according to the burn-in test result;
A third unloading unit for unloading fourth semiconductor elements that are determined to be good according to the burn-in test result;
A first element transfer unit for transferring the first semiconductor elements from the DC test unit to the first unload unit;
A second element transfer unit for transferring the second semiconductor elements from the DC test unit to the load / unload unit; And
A third element transfer unit for transferring the third semiconductor elements from the load / unload unit to the second unload unit and for transferring the fourth semiconductor elements from the load / unload unit to the third unload unit,
And the third element transfer unit is disposed between the second unload unit and the third unload unit. delete The method of claim 1, wherein the first element transfer unit,
A first buffer tray for accommodating the first semiconductor elements; And
And a first buffer tray feeder for moving the first buffer tray in a first horizontal direction between a first receiving position adjacent to the DC test unit and a first unloading position adjacent to the first unloading unit. Semiconductor device handler. The method of claim 3, wherein the second element transfer unit is disposed in parallel with the first element transfer unit,
A second buffer tray for accommodating the second semiconductor elements; And
And a second buffer tray feeder for moving said second buffer tray in said first horizontal direction between a first transfer position adjacent said DC test unit and a second transfer position adjacent said load / unload unit. Semiconductor device handler. The method of claim 1, wherein the third element transfer unit,
Third buffer trays for accommodating the third semiconductor elements and the fourth semiconductor elements; And
A third for moving the third buffer trays in a second horizontal direction between a second storage position adjacent the load / unload unit and a second unload position and a third unload position between the second unload unit and the third unload unit; And a buffer tray transfer unit. delete A DC test unit for testing a defective assembly of semiconductor devices;
A load unit for loading the semiconductor elements into the DC test unit;
A first unloading unit for unloading the first semiconductor elements determined as defective in the DC test unit;
A load / unload unit for loading the second semiconductor elements determined as good in the DC test unit onto the burn-in board for burn-in test and unloading the second semiconductor elements that have been burn-in test completed from the burn-in board;
A second unloading unit for unloading third semiconductor elements determined to be defective according to the burn-in test result; And
And a third unloading unit for unloading the fourth semiconductor devices that are determined to be good according to the burn-in test result.
The load unit and the first, second and third unload units,
A tray shuttle for transporting trays in which the semiconductor devices, the first semiconductor devices, the third semiconductor devices, and the fourth semiconductor devices are respectively accommodated;
A shuttle driver for moving the tray shuttle in a second horizontal direction; And
And a height adjusting unit for adjusting the height of the tray shuttle, respectively. delete A DC test unit for testing a defective assembly of semiconductor devices;
A load unit for loading the semiconductor elements into the DC test unit;
A first unloading unit for unloading the first semiconductor elements determined as defective in the DC test unit;
A load / unload unit for loading the second semiconductor elements determined as good in the DC test unit onto the burn-in board for burn-in test and unloading the second semiconductor elements that have been burn-in test completed from the burn-in board;
A second unloading unit for unloading third semiconductor elements determined to be defective according to the burn-in test result;
A third unloading unit for unloading fourth semiconductor elements that are determined to be good according to the burn-in test result;
A load stacker for stacking trays in which the semiconductor elements are accommodated;
A first unload stacker for stacking the trays in which the first semiconductor elements are accommodated;
A second unload stacker for stacking trays in which the third semiconductor elements are accommodated; And
And a third unload stacker for stacking the trays in which the fourth semiconductor devices are accommodated.
And the load unit and the first, second and third unload units are disposed under the load stacker and the first, second and third unload stackers. 10. The semiconductor device handler of claim 9, wherein the load stacker and the first, second and third unload stackers each comprise latch members for supporting side portions of the lowermost tray of the trays. 10. The system of claim 9, further comprising elevators for transfer of the trays between the load unit and the first, second and third unload units and the load stacker and the first, second and third unload stackers. Semiconductor device handler comprising a. 10. The semiconductor device of claim 9, wherein the load unit and the first, second and third unload units and the load stacker and the first, second and third unload stackers are disposed in the semiconductor device. And a lower tray transfer unit for transferring the empty tray from the load unit to the first, second or third unload unit after being loaded into the test unit. The method of claim 12, wherein the lower tray transfer unit,
A lower tray shuttle for holding side portions of the empty tray; And
And a lower shuttle driver for moving the lower tray shuttle in a first horizontal direction. The method of claim 13, wherein the lower tray transfer unit,
A rotation driver for rotating the lower tray shuttle; And
And a container disposed below the lower tray shuttle and configured to recover the semiconductor devices remaining in the empty tray. The semiconductor device of claim 12, further comprising: a lower load stacker disposed under the lower tray transfer unit and configured to stack trays in which the semiconductor elements are accommodated;
A lower buffer stacker disposed under the lower tray transfer unit and configured to stack trays in which the first semiconductor elements or the third semiconductor elements are accommodated; And
And a lower unload stacker disposed under the lower tray transfer unit and configured to stack the trays in which the fourth semiconductor elements are accommodated. The apparatus of claim 9, further comprising: a tray load port for loading and unloading the trays; And
An upper portion disposed above the load stacker and the first, second and third unload stackers and for transferring the trays between the tray load port and the load stacker and the first, second and third unload stackers. And a tray transfer unit. 10. The apparatus of claim 1, further comprising: a board stage configured to support the burn-in board and to be movable in a horizontal direction for loading and unloading the second semiconductor elements;
A board loader for storing board racks containing a plurality of burn-in boards and providing the board racks to a burn-in tester; And
And a board transfer unit for transferring the burn-in board between the board stage and the board loader.

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