KR102026617B1 - Method for fabricating metal interconnection using pattern of metal catalyst and metal interconnection thereby - Google Patents

Abstract

The present invention relates to a method for forming metal wirings using metal catalyst patterns and metal wirings thereby. In more detail, a coating solution including a metal ion, a polymer, and a solvent is prepared, and the coating solution is coated on a substrate to form a coating layer, and a mask pattern is placed on the coating layer. Provided is a method for forming a metal catalyst pattern including particles and plating the metal catalyst pattern to form a metal wiring. Therefore, in the present invention, since metal ions are transformed into metal nanoparticles through reduction by irradiating ultraviolet (UV) light, uniform catalyst dispersion is possible without problems of thermal deformation during metal wiring formation, and metal wiring It reduces the use of metal for plating to manufacture metals, which is effective in terms of process operation time and cost.

Description

Method for fabricating metal interconnection using pattern of metal catalyst and metal interconnection}

The present invention relates to a method for forming metal wirings using metal catalyst patterns and metal wirings thereby. More specifically, the present invention relates to a metal wiring forming method using a metal catalyst pattern including metal nanoparticles formed by irradiating ultraviolet (UV) light on metal ions, and metal wirings thereby.

Recently, according to the trend of high integration and miniaturization of electronic devices, researches on nanostructures and manufacturing methods thereof are being actively conducted. In general, nanostructures consist of particles of several nm size, have optical, magnetic, and electrical properties, and exhibit different properties depending on the size of the particles.

Metal nanoparticles, which are used as raw materials for manufacturing nanostructures, exhibit new physical properties that were not seen in bulk, and when the size or shape of metal nanoparticles change, new properties appear. Metal nanoparticles have inherent characteristics such as magnetic properties, high catalysis, and various research and development using these characteristics are actively being carried out throughout the entire industry such as sensors, medicine, catalysts, electronics, and optics.

In recent years, industries such as electronic displays, organic solar cells, and organic semiconductors are rapidly developing, and in order to secure more competitiveness, functional materials including a combination of various characteristics and functions, such as thin and flexible characteristics and functions, and Simple process technology is required, and functional thin film technology is widely used in substrate electrode materials, organic conductors, and the like to realize this process.

To this end, by spin-coating a metal nanoparticle solution on a pre-fabricated organic polymer support by a method of patterning metal nanoparticles for the above-described purpose, removing a solvent, and removing a resistor from the support, Forming method, inkjet printing method, microcontact printing method, dip-pen nanolithography method, self-assembly monolayer, layer-by-layer (LBL) assembly method) is mainly used.

However, since the metal nanoparticles are very small in size and have a strong cohesive force, they are difficult to uniformly disperse. In order to solve the above problems, a technique of mixing and coating metal nanoparticles with a polymer has been studied. There was still a problem that it was difficult to uniformly disperse due to the cohesion of.

In order to uniformly disperse the metal nanoparticles, a process of mixing the polymer and the metal ions to spin coating or dipping and then reducing them by heat treatment was studied. In this process, the uniform dispersion of the metal nanoparticles was secured, but the heat resistance In the case of the device is not high, there is a problem that the deformation of the device may be exposed to thermal deformation. In addition, there is a complex problem in the process because an additional heat treatment device to prevent oxidation in the reduction process of metal ions.

Therefore, the process is simple, and technology development for metal nanoparticle patterning that can reduce metal ions to energy at a level at which thermal deformation does not occur, rather than thermal energy, is required.

Republic of Korea Patent No. 10-1373834

The technical problem to be achieved by the present invention is to overcome the limitations of the conventional metal nanoparticle patterning, by placing a mask pattern on a metal ion-coated substrate, and irradiated with ultraviolet (UV) metal nanoparticles It is an object of the present invention to provide a method for forming a metal wiring using a metal catalyst pattern included.

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned above may be clearly understood by those skilled in the art from the following description. There will be.

In order to achieve the above technical problem, an embodiment of the present invention comprises the steps of preparing a coating solution containing a metal ion, a polymer and a solvent, forming a coating layer by applying the coating solution on a substrate, on the coating layer After placing the mask pattern, irradiating ultraviolet (UV) between the mask patterns to reduce the metal ions in the coating layer region irradiated with ultraviolet rays to metal nanoparticles to form a metal catalyst pattern and plating the metal catalyst pattern It provides a metal wiring forming method comprising the step of forming a metal wiring.

In an embodiment of the present invention, the metal ion may be a metal wiring forming method, characterized in that at least one metal ion selected from silver ions, palladium ions, cobalt ions, nickel ions, gold ions and copper ions.

In an embodiment of the present invention, the polymer is polystyrene, polymethyl methacrylate, polybenzoylbutene, benzocyclobutene, polyvinyl acetate, and polyvinyl butyral. butyral) may be a metal wiring forming method comprising at least one polymer selected from.

In an embodiment of the present invention, the polymer may be a metal wiring forming method, characterized in that contained 5 wt% to 22 wt% in the coating solution.

In an embodiment of the present invention, the solvent is N, N-dimethylformamide (N, N-dimethylformamide, DMF), dichloromethane (dichloromethane), methylene chloride (formic acid), isopropyl It may be a metal wiring forming method comprising any one selected from alcohol (isopropyl alcohol) and dimethylacetamide (dimethylacetamide).

In an embodiment of the present invention, it may be a metal wiring forming method, characterized in that further adding a metal nanoparticle aggregation blocker to the coating solution.

In an embodiment of the present invention, the method of applying the coating solution on the substrate may be a method for forming metal wirings using spin-coating.

In an embodiment of the present invention, the spin coating (spin-coating) may be a metal wiring forming method, characterized in that performed for 10 seconds to 120 seconds at a speed of 300 rpm to 2500 rpm.

In an embodiment of the present invention, the ultraviolet (UV) irradiated to the coating layer may be a metal wiring forming method, characterized in that the wavelength is 200 nm to 400 nm ultraviolet (UV).

In an embodiment of the present invention, when irradiating ultraviolet (UV) to the coating layer, the irradiation time may be a metal wiring forming method, characterized in that 1 minute to 2 hours.

In an embodiment of the present invention, the method may further include removing a region of the coating layer that is not irradiated with UV light between the forming of the metal catalyst pattern and the forming of the metal wiring. It may be a wiring forming method.

In an embodiment of the present invention, the plating may be a metal wiring forming method, characterized in that by the electroless plating method.

In the embodiment of the present invention, the plating metal may be a metal wiring forming method, characterized in that at least one metal selected from copper, nickel, chromium, zinc, tin and aluminum.

In order to achieve the above technical problem, another embodiment of the present invention provides a metal wiring manufactured according to the metal wiring forming method.

As an effect of the present invention, when preparing a catalyst with a coating solution containing a metal ion and a polymer, the metal ion is transformed into metal nanoparticles by reduction by irradiating ultraviolet (UV), not heat treatment, Uniform catalyst dispersion is possible without problems of thermal deformation.

In addition, when the mask pattern is used in preparing the catalyst, a metal catalyst pattern capable of dispersing the catalyst only in a desired region may be obtained.

As another effect of the present invention, a metal wiring may be formed by plating a metal on a metal catalyst pattern including metal nanoparticles using an electroless plating method.

In addition, in the case of using a metal catalyst pattern that is not uniformly dispersed, the amount of metal to be plated also increases when the metal is plated while increasing the number of contacts between the metal nanoparticles, which is a constituent material of the metal catalyst pattern. After forming the metal catalyst pattern, it is possible to reduce the use of the plating metal used to form the metal wiring, thereby economically operating the process in terms of process operation time and cost.

The effects of the present invention are not limited to the above-described effects, but should be understood to include all the effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a flowchart schematically showing a method for forming metal wirings according to an embodiment of the present invention.
Figure 2 is a schematic diagram showing a simple process of forming a metal wiring according to an embodiment of the present invention.
Figure 3 is a schematic diagram showing a cross-sectional view briefly in the process of forming a metal wiring according to an embodiment of the present invention.
4 is an SEM image of a metal wire manufactured according to an embodiment of the present invention.
5 is an XPS graph of a metal wire according to ultraviolet (UV) irradiation time according to an embodiment of the present invention.
6 is an XPS graph of a silver element in a metal wire according to ultraviolet (UV) irradiation time according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is said to be "connected (connected, contacted, coupled)" with another part, it is not only "directly connected" but also "indirectly connected" with another member in between. "Includes the case. In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, the terms “comprise” or “have” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, a method of forming metal wires will be described with reference to FIG. 1.

1 is a flowchart schematically showing a method for forming metal wirings according to an embodiment of the present invention.

Referring to Figure 1, the metal wire forming method of the present invention to prepare a coating solution containing a metal ion, a polymer and a solvent (S100), applying a coating solution on a substrate to form a coating layer (S200) And placing a mask pattern on the coating layer, irradiating ultraviolet (UV) between the mask patterns to reduce metal ions in the coating layer region irradiated with ultraviolet rays to metal nanoparticles to form a metal catalyst pattern (S300). And forming a metal wiring by plating the metal catalyst pattern (S400). Hereinafter, each step will be described in detail.

Looking at each step more schematically, Figure 2 is a schematic diagram showing the process of forming a metal wiring, to prepare a substrate 10 (Fig. 2 (A)), the coating layer by spin coating on the substrate 10 2 (B), the mask pattern 30 is disposed on the coating layer 20, and the ultraviolet rays 40 are irradiated between the mask patterns 30 to form metal nanoparticles. It shows about the process of forming the metal catalyst pattern 50 by reducing it to (2 (C)), and plating the said metal catalyst pattern 50 to form the metal wiring 60 (FIG. 2 (D)).

In the case of Figure 3, a schematic diagram showing the progress of the process according to each step corresponding to Figure 2, but specifically showing the cross section. More specifically, the cross section (FIG. 3 (A)) at the stage in which the substrate 10 of FIG. 2A is prepared, and a coating containing metal ions and a polymer on the substrate 10 of FIG. 2B. The mask pattern 30 is placed on the coating layer 20 of the cross section (FIG. 3B) and the coating layer 20 of FIG. 2C at the step of coating the solution to form the coating layer 20. The cross section (Fig. 3 (C)) and the metal catalyst pattern 50 of Fig. 2 (D) at the step of forming the metal catalyst pattern 50 by reducing the metal ions to metal nanoparticles by irradiating ultraviolet rays 40 therebetween. The cross section (FIG. 3 (D)) at the stage in which the metal wiring 60 was formed by plating is shown.

First, in the step (S100) of preparing a coating solution containing a metal ion, a polymer and a solvent, the metal ion and the polymer is added to a solvent to prepare a coating solution, the metal ion is a metal in the step S300 step It can be seen as a precursor for reducing with a catalyst. In this case, in order to prepare the metal ion, the metal ion is not naturally present, it is preferable to prepare in the form of a salt that can be dissolved in the solvent used, the metal ion is silver ions, palladium ions, cobalt ions, nickel It may be one or more metal ions selected from ions, gold ions and copper ions.

As a specific example, when the metal ion is silver ion, silver nitrate (AgNO ₃ ) or silver peroxide (Ag ₂ O ₂ , Ag ₂ O ₃ ) may be dissolved in a solvent to generate a coating solution, but is not limited thereto. Any material can be applied as long as it is a salty substance that can be present in the metal ion state when dissolved in a solvent.

In the case of the polymer, as a material used for forming a coating layer in a later step S200, more specifically, polystyrene, polymethyl methacrylate, benzocyclobutene, It may include one or more polymers selected from poly (vinyl acetate) and polyvinyl butyral, but is not limited to the case of the polymer that can be used for coating layer formation irrespective of the type Can all be used.

The type of the polymer may also be affected as a factor influencing the coating layer forming process performed in step S200, but the content of the polymer may also be affected. In the present invention, the polymer may contain 5 wt% to 22 wt% of the total mass of the coating solution. When the mass ratio of the polymer is less than 5 wt%, since the concentration is relatively dilute and low in viscosity because it is used as a coating solution for forming the coating layer, an even coating layer may not be formed on the substrate to be coated. On the other hand, if the mass ratio of the polymer exceeds 22 wt%, there is a problem that the uniform coating is difficult because the viscosity is high, the mass ratio of the polymer is preferably 5 wt% to 22 wt%.

In the coating solution, in addition to metal ions and polymers, as a solvent, N, N-dimethylformamide (N, N-dimethylformamide, DMF), dichloromethane, methylene chloride, formic acid At least one material selected from isopropyl alcohol and dimethylacetamide may be further added. The materials to be added are not limited to the materials listed above, and any compound may be added regardless of the kind, in the case of a dispersant capable of dissolving the polymer. In particular, in the case of DMF, it is a typical polar organic solvent and can be used as a solvent for dispersing and dissolving the polymer.

Next, in the step (S200) of coating the coating solution on a substrate to form a coating layer, the coating solution may be coated on a substrate using spin-coating. The spin coating is a coating method in which a solution or a liquid material of a material to be coated is dropped on a substrate and rotated at a high speed to spread thinly, and is a coating method generally used in the manufacture of electronic device devices. The thickness of the coating layer prepared by the spin coating may depend on the process conditions of the spin coating, as a factor determining the thickness of the coating layer, the concentration of the coating solution, the molar mass of the polymer, the viscosity, the spin coating speed, the spin It can be adjusted by various factors such as coating time. However, the thickness of the coating layer may not be determined only by the aforementioned factors, but may be determined by all factors related to spin coating and additional factors that may occur in the curing process.

In forming the coating layer by the spin coating, the spin coating may be performed for 10 seconds to 120 seconds at a speed of 300 rpm to 2500 rpm. If the spin coating speed is less than 300 rpm or more than 120 seconds, the amount of coating solution applied on the substrate may be uneven. If the spin coating speed is more than 2500 rpm or less than 10 seconds, the metal wiring may be formed. It is preferable that a sufficient thickness may not be formed, so that the spin coating speed is controlled at 300 rpm to 2500 rpm, and is performed for 10 seconds to 120 seconds.

After the step of applying the coating solution on the substrate to form a coating layer (S200), a firing step for removing the solvent may be further added, the solvent may reduce the electrical conductivity of the metal wire finally manufactured It is desirable to remove them because they can act as impurities. Removing the solvent may be performed at 50 ℃ to 80 ℃ for 5 minutes to 1 hour. If the temperature at which the solvent is removed is less than 50 ° C. or the time at which the solvent is removed is less than 5 minutes, the solvent may not be sufficiently removed, and the residual solvent may later act as an impurity. Is more than 80 ° C. or more than one hour when the solvent is removed, it is not preferable because the deformation of the metal wiring may occur later due to thermal deformation of the coating layer.

Subsequently, irradiating ultraviolet rays between the mask patterns to reduce metal ions in the coating layer region irradiated with ultraviolet rays to metal nanoparticles to form a metal catalyst pattern (S300). The reaction and the reaction of removing a part of the polymer may proceed simultaneously. In the reduction reaction for converting the metal ions into a metal catalyst pattern, the metal ions, in which the mask pattern is not absorbed, absorb ultraviolet rays and undergo a reduction reaction to reduce the metal ions dissolved in the solvent to metal nanoparticles. The dissolved polymer is a reaction which is oxidized by the photooxidation reaction. As a specific example, when the metal ion is silver ions (Ag ⁺ ), the metal ions may be reduced to silver (Ag ⁰ ) nanoparticles, and the polymer may be photooxidized. When the metal ions are reduced to form a metal catalyst pattern, the reduced metal nanoparticles start to aggregate from that moment. In this step, as the ultraviolet rays are irradiated, the metal ions are reduced to the metal nanoparticles, and aggregation between the metal nanoparticles may occur. In particular, when silver ions are used, flocculation may occur.

At this time, the aggregation barrier may be further added to the coating solution in order to prevent the formation of a non-uniform metal catalyst pattern due to aggregation and agglomeration of only the metal nanoparticles due to aggregation between the metal nanoparticles. For example, polyvinylpyrrolidone (PVP) may be further added as the aggregation inhibitor. When PVP is added, metal ions can interact with unshared pairs of electrons in the carbonyl oxygen atom of the PVP molecule to form a stable PVP / metal complex, thereby preventing the metal ions from clumping rapidly. However, the coagulation blocker of the reduction reaction of the metal ions is not limited to PVP, and any chemicals may be used regardless of the type in the case of slowing the aggregation rate of the metal nanoparticles or preventing the aggregation.

The wavelength of the ultraviolet light irradiated onto the coating layer may be 200 nm to 400 nm. Ultraviolet rays are light rays shorter in wavelength than visible violet, and are abbreviated UV (Ultraviolet rays), long wavelength A (320 nm to 400 nm), medium length UV B (280 nm to 300 nm), wavelength It is divided into short ultraviolet rays C (100 nm to 280 nm). Ultraviolet rays irradiated to the coating layer can reduce metal ions to metal nanoparticles, and at the same time be able to remove a portion of the polymer, it is preferable to irradiate ultraviolet rays within the wavelength range.

When irradiating the ultraviolet rays, a portion of the polymer may be removed, unlike when the metal ions are reduced by simply using a chemical method, and as the portion of the polymer is removed, the electrical conductivity of the metal wiring may be reduced. In this way, an effect of not lowering the electrical conductivity of the metal wiring may occur.

When irradiating the ultraviolet light to the nanowires, the irradiation time of the ultraviolet ray may be 1 minute to 2 hours. However, since the irradiation time of ultraviolet rays may vary according to the intensity of ultraviolet rays to be irradiated, the irradiation time of ultraviolet rays is not limited to the above range. However, when irradiating ultraviolet rays with ultraviolet rays having a wavelength in the range of 200 nm to 300 nm, if the irradiation time of ultraviolet rays is less than 1 minute, the metal ions of the coating layer are not reduced to most of the metal nanoparticles, as well as the polymers. It is hardly removed so that the metal wiring can not be formed at a later stage. If the irradiation time of the ultraviolet ray exceeds 2 hours, the ultraviolet ray is continuously irradiated even after the reduction reaction is completed by the ultraviolet ray, and of course, the metal catalyst pattern may be damaged. Since all of the polymers are removed to cause the metal catalyst to fall off the substrate, it is preferable to irradiate ultraviolet rays within the above range in the ultraviolet region of a specific wavelength band.

A step of removing the coating layer region not irradiated with ultraviolet rays may be further added between the forming of the metal catalyst pattern (S300) and the subsequent step (S400). On the substrate where the metal catalyst pattern is located, there is a region in which the metal catalyst pattern is not formed. The region does not affect the electrical conductivity of the metal wiring when the metal catalyst pattern is formed as the metal wiring in a later step, but the metal The region can be removed to leave only the catalyst pattern.

In the step of forming the metal wiring by plating the metal catalyst pattern (S400), the metal ions may be plated on the surface after the metal ions are reduced to the metal catalyst, a portion of the polymer is removed.

In particular, the plating method is not limited, and among them, an electroless plating method may be used as an example. Electroless plating is a method of chemically plating or depositing a metal on the surface of an object by autocatalytically reducing metal ions in an aqueous metal salt solution by a reducing agent without receiving electrical energy from the outside. It is called self-catalyst plating. At this time, since the plating reaction occurs based on the chemical reaction between metals, electroless plating cannot be performed on particles composed only of polymers, so that the reduced metal nanoparticles act as a catalyst and the plating reaction may occur. .

In the plating, the plating metal may be at least one metal selected from copper, nickel, chromium, zinc, tin, and aluminum. In general, however, copper is generally used when efficiency is considered in consideration of the relationship between cost and electrical conductivity.

Hereinafter, the metal wiring manufactured by the metal wiring formation method is demonstrated.

In one embodiment of the present invention, it is possible to provide a metal wiring manufactured according to the forming method. The metal wiring can be manufactured according to the field in which metal wiring such as PCB and IC chip is used by adjusting conditions such as the time of electroless plating, the electroless plating temperature, and the like. Wiring may be applied.

Hereinafter, the preparation examples and experimental examples of the present invention. However, these preparation examples and experimental examples are intended to explain the configuration and effects of the present invention in more detail, and the scope of the present invention is not limited thereto.

[Production Example 1]

Metal wiring manufacturers

A coating solution was prepared by mixing 5 wt% of polyvinyl butyral (PVB), 2 wt% of silver nitrate (AgNO ₃ ), and a DMF solvent, and spin coating at 1000 rpm for 60 seconds to form a coating layer. After the mask pattern was placed on the coating layer, ultraviolet rays having a wavelength of 254 nm were irradiated for 1 minute between the mask patterns to form a metal catalyst pattern. The metal catalyst pattern was electroless copper plated to prepare a metal wiring.

[Production Example 2]

Metal wiring manufacturers

Except that irradiated with ultraviolet light for 2 minutes in Preparation Example 1 was carried out in the same manner to prepare a metal wiring.

[Production Example 3]

Metal wiring manufacturers

Except that irradiated with ultraviolet light for 5 minutes in Preparation Example 1 was carried out in the same manner to prepare a metal wiring.

[Production Example 4]

Metal wiring manufacturers

Except for irradiating UV light for 10 minutes in Preparation Example 1 was carried out in the same manner to prepare a metal wiring.

Production Example 5

Metal wiring manufacturers

Except that irradiated with ultraviolet light for 20 minutes in Preparation Example 1 was carried out in the same manner to prepare a metal wiring.

[Manufacture example 6]

Metal wiring manufacturers

Except for irradiating UV light for 30 minutes in Preparation Example 1 was carried out in the same manner to prepare a metal wiring.

Comparative Example 1

Metal wiring manufacturers

Except for irradiating ultraviolet rays in Preparation Example 1 was carried out in the same manner to prepare a metal wiring.

Experimental Example 1

Patterned  Metal Wiring Geometry Analysis

Scanning Electron Microscopy (SEM) was used to confirm the shape of the patterned metal interconnects. FIG. 4 is an SEM image of a metal wiring manufactured according to an embodiment of the present invention. Referring to FIG. 4, a metal catalyst pattern is formed using a lattice mask pattern, and metal wiring is formed using electroless plating. When prepared, it was confirmed that a lattice metal wiring having a thickness of 150 μm and a height of 100 nm was formed.

Experimental Example 2

Analysis of Metal Wiring Components According to UV Irradiation Time

In order to analyze the components of the metal wiring according to the UV irradiation time, the component analysis was performed by using X-ray photoelectron spectroscopy (XPS). 5 is an XPS graph of metal wiring according to ultraviolet (UV) irradiation time according to an embodiment of the present invention, Comparative Example 1 (UV 0min), Manufacturing Example 1 (UV 1min), Manufacturing Example 3 (UV 5min), Production Example 4 (UV 10 min), Production Example 5 (UV 20 min), and Production Example 6 (UV 20 min) are shown. Referring to FIG. 5, in Comparative Example 1, the peaks of carbon and oxygen are large and the peaks of silver are relatively small, but as the irradiation time of ultraviolet rays increases, the peaks of oxygen and silver are increased. It was confirmed that the size increases, and the size of the peak of carbon decreases. These results indicate that when ultraviolet rays are irradiated onto a coating layer containing silver ions and a polymer, oxygen content increases as the polymer is photooxidized, and the silver ions are reduced to silver nanoparticles by receiving electrons generated by photooxidation of the polymer, It can be judged that a change in peak is observed as the content increases. More specific element contents for the Comparative Examples and Preparation Examples are shown in Table 1 below.

TABLE 1

To more reliably confirm that silver ions are reduced to silver nanoparticles by ultraviolet rays, XPS analysis was performed on metal wires according to ultraviolet (UV) irradiation time, and binding energy showing peaks of silver elements. ) Was enlarged and analyzed, and the results are shown in FIG. 6. Referring to FIG. 6, in Comparative Example 1, a peak of a silver element is located in a region of 368.8 eV corresponding to a binding energy of silver ions (Ag ⁺ ), but as ultraviolet irradiation proceeds, a peak of silver element (peak) ) Is shifted to the 368.3 eV region corresponding to the binding energy of silver (Ag ⁰ ).

Therefore, according to the preparation examples and experimental examples of the present invention, by placing a mask pattern on the coating layer containing the silver ions and the polymer and irradiated with ultraviolet rays, the polymer is photooxidized, the silver ions are silver nano due to the electrons generated by the photooxidation Reduced to particles, the silver nanoparticles can be used as a catalyst for producing a metal wiring, it can be judged to be effective in terms of process operating time and cost by reducing the use of metal for plating to manufacture the metal wiring.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

10: substrate
20: coating layer
30: mask pattern
40: UV
50: metal catalyst pattern
60: metal wiring

Claims (14)

Preparing a coating solution containing a metal ion, a polymer, and a solvent;
Coating the coating solution on a substrate to form a coating layer;
Placing a mask pattern on the coating layer, and irradiating ultraviolet (UV) between the mask patterns to reduce metal ions in the coating layer region irradiated with ultraviolet rays to metal nanoparticles to form a metal catalyst pattern; And
Forming a metal wiring by plating the metal catalyst pattern;
Forming the metal catalyst pattern is characterized in that the polymer of the coating layer region irradiated with the ultraviolet light by the ultraviolet light is photooxidized, the metal ion is reduced to the metal nanoparticles due to the electrons generated by the photooxidation ,
It is characterized in that the addition of the metal nanoparticle aggregation barrier further to the coating solution,
Ultraviolet light (UV) irradiated to the coating layer is characterized in that the wavelength is 200 nm to 400 nm ultraviolet (UV), when irradiating the ultraviolet (UV) to the coating layer, the irradiation time is characterized in that 1 minute to 2 hours With
The polymer is characterized in that contained 5 wt% to 22 wt% in the coating solution,
The polymer is at least one selected from polystyrene, polymethyl methacrylate, benzocyclobutene, polyvinyl acetate, and polyvinyl butyral. Characterized in that it comprises a polymer,
And removing the coating layer region not irradiated with ultraviolet (UV) light between the forming of the metal catalyst pattern and the forming of the metal wiring.
The method of claim 1,
The metal ion is a metal wiring forming method, characterized in that at least one metal ion selected from silver ions, palladium ions, cobalt ions, nickel ions, gold ions and copper ions.
delete delete The method of claim 1,
The solvent is N, N-dimethylformamide (DMF), dichloromethane, methylene chloride, formic acid, isopropyl alcohol and dimethylacetyl. Metal wiring forming method comprising any one selected from amide (dimethylacetamide).
The method of claim 1,
The method of applying the coating solution on the substrate is a metal wiring forming method, characterized in that using spin-coating (spin-coating).
The method of claim 6,
The spin coating (spin-coating) is a metal wiring forming method, characterized in that performed for 10 seconds to 120 seconds at a speed of 300 to 2500 rpm.
delete delete delete delete The method of claim 1,
And the plating is performed by an electroless plating method.
The method of claim 1,
In the plating, the plating metal is metal wiring forming method, characterized in that at least one metal selected from copper, nickel, chromium, zinc, tin and aluminum.
Metal wiring manufactured according to the metal wiring forming method of claim 1.

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