KR101977759B1 - Exhaust assembly and Apparatus for treating substrate - Google Patents

Abstract

The present invention provides an apparatus for processing a substrate. The substrate processing apparatus includes: a first chamber having a first processing space for processing a substrate therein; A second chamber having a second processing space for processing the substrate therein; And an exhaust assembly for exhausting each of the first processing space and the second processing space; The exhaust assembly includes an integrated exhaust duct; A decompression member for decompressing the integrated exhaust duct; A first connection duct connecting the first processing space and the integrated exhaust duct; And a first connection duct connecting the first processing space and the integrated exhaust duct, wherein the integrated exhaust duct includes a first connection duct and a second connection duct, wherein the first airflow introduced through the first connection duct is connected to the second connection duct through the second connection duct, And an airflow guiding member for guiding the direction of the first airflow so as not to collide with the airflow.

Description

[0001] The present invention relates to an exhaust assembly and a substrate processing apparatus having the same,

The present invention relates to an apparatus for processing a substrate.

Various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture semiconductor devices. Various processes are carried out in sequence, and the substrates are sequentially conveyed to the respective chambers in accordance with the order. A processing space is provided inside the chamber, and the processing space is evacuated to maintain a constant atmosphere.

Generally, the process space is evacuated by the exhaust assembly, which exhausts each of the plurality of chambers performing the same process.

FIG. 1 is a sectional view showing a general exhaust assembly, and FIG. 2 is a view showing an air current interference phenomenon in an exhaust duct.

Referring to Figs. 1 and 2, the exhaust assembly 4 includes an exhaust duct 6 and a pressure-reducing member 8. The exhaust duct 6 is connected in parallel to each of the chambers 2, and the pressure-reducing member 8 decompresses the exhaust duct 6. Thus, the interior atmosphere of the chamber 2 is exhausted through the exhaust duct 6.

The existing exhaust duct 6 is quadrangular in cross section for convenience of the structure and is exhausted from the top to the bottom along the longitudinal direction. However, the exhaust airflow of the chamber 2 collides with the inner surface of the exhaust duct 6 and is exhausted downward. In addition, the exhaust airflow of the chamber 2 located in the lower layer interferes with the exhaust airflow of the chamber located in the upper layer in the process of being introduced into the exhaust duct 6. That is, a vortex is generated by the interfered exhaust air flow, which causes the exhaust of each chamber to be interrupted. As a result, the exhaust efficiency of the chambers is reduced and the exhaust of each of the chambers becomes uneven, and fume is easily deposited inside the exhaust duct 6 due to a non-uniform flow of airflow, thereby shortening the PM cycle do.

Korean Published Patent 2007-0005817

An object of the present invention is to provide an apparatus capable of improving the exhaust efficiency with respect to the internal space of a chamber.

Another object of the present invention is to provide an apparatus for preventing the exhaust airflow of a chamber from colliding with an exhaust duct during exhausting.

It is another object of the present invention to provide an apparatus capable of minimizing interference between two or more exhaust air streams.

The present invention also provides an apparatus capable of preventing fume deposition.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a plasma processing apparatus comprising: a first chamber having a first processing space for processing a substrate therein; A second chamber having a second processing space for processing the substrate therein; And an exhaust assembly for exhausting each of the first processing space and the second processing space; The exhaust assembly includes an integrated exhaust duct; A decompression member for decompressing the integrated exhaust duct; A first connection duct connecting the first processing space and the integrated exhaust duct; And a first connection duct connecting the first processing space and the integrated exhaust duct, wherein the integrated exhaust duct includes a first connection duct and a second connection duct, wherein the first airflow introduced through the first connection duct is connected to the second connection duct through the second connection duct, There is provided a substrate processing apparatus including an airflow guiding member for guiding the direction of the first airflow so as not to collide with an airflow.

In addition, the second chamber is disposed below the first chamber, and the integrated exhaust duct is circular in cross section and can provide an exhaust flow flowing from top to bottom.

The integrated exhaust duct may include a first connection hole to which the first connection duct is connected; And a second connection hole to which the second connection duct is connected, and the airflow guide member may be positioned above the second connection hole.

Further, the airflow guiding member may have a triangular shape.

The first connection duct and the second connection duct may be tangentially connected to the inner diameter of the integrated exhaust duct to form a small protrusion airflow.

In addition, the integrated exhaust duct may be formed with a helical flow path on the inner circumferential surface to form a swirl flow.

Further, the helical flow path may be provided by spiral protrusions protruding from the inner circumferential surface of the integrated exhaust duct.

Further, the helical flow path may be provided by helical grooves engraved on the inner circumferential surface of the integrated exhaust duct.

According to another aspect of the present invention, there is provided an exhaust gas purification apparatus comprising: an integrated exhaust duct installed in a vertical direction and having an exhaust passage; And connection ducts connecting the integrated exhaust ducts with the chambers in which the substrate processing is performed; The integrated exhaust duct may include an exhaust assembly including an airflow guide member for guiding the direction of the pre-flow so that the pre-flow of air flowing through the exhaust passage does not collide with the flow of air flowing through the connection duct.

In addition, the integrated exhaust duct may have a circular cross section.

In the integrated exhaust duct, the connection holes connected to the connection ducts may be disposed apart from each other in the vertical direction.

Further, the airflow guiding member may have a triangular shape.

The connecting duct may be tangentially connected to the inner diameter of the integrated exhaust duct to form a small protrusion airflow.

In addition, the integrated exhaust duct may be formed with a helical flow path on the inner circumferential surface to form a swirl flow.

The spiral flow path may be provided by spiral protrusions protruding from the inner circumferential surface of the integrated exhaust duct or spiral grooves engraved on the inner circumferential surface of the integrated exhaust duct.

According to an embodiment of the present invention. The airflow guiding member flows through the first connecting duct and turns the direction of the first airflow flowing into the exhaust passage of the integrated exhaust duct to naturally join with the second airflow flowing through the second connecting duct to flow as one airflow It has a remarkable effect.

According to the embodiment of the present invention, since the eddy current flows in the integrated exhaust duct and the eddy current is generated so as to rotate rapidly, the eddy current in the integrated exhaust duct becomes stronger as it goes downward, It is possible to prevent the fume from being deposited on the inner circumferential surface of the duct.

1 is a sectional view showing a general exhaust assembly;
FIG. 2 is a view showing an air current interference phenomenon in an exhaust duct. FIG.
3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 4 is a cross-sectional view showing the application chamber of Fig. 3;
5 is a cross-sectional view showing the heating unit of Fig.
6 is a cross-sectional view showing the exhaust assembly.
7 is a top view of the exhaust assembly.
8 is a cross-sectional view of the integrated exhaust duct.
9 is a view showing the flow of air in the integrated exhaust duct.
10 is a view showing another example of the integrated exhaust duct.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a coating process and a developing process on a substrate, which is connected to an exposure apparatus. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 3, the substrate processing apparatus 1 has an index module 10 and a processing module 20.

The index module 10 has a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are sequentially arranged in a line. The direction in which the load port 120, the transfer frame 140 and the processing module 20 are arranged is referred to as a first direction 12 and a direction perpendicular to the first direction 12 Direction is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16. [

The carrier 130 in which the substrate W is accommodated is mounted on the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20 and the like. A plurality of slots (not shown) are formed in the carrier 130 for accommodating the substrates W horizontally with respect to the paper surface. As the carrier 130, a front opening unified pod (FOUP) may be used.

The processing module 20 has a buffer unit 220, a transfer chamber 240, an application chamber 260, a bake chamber 280, and an exhaust assembly 700. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. The application chambers 260 may be disposed on one side of the transfer chamber 240 and the bake chambers 280 may be disposed on the other side. The application chambers 260 and the bake chambers 280 may be provided to be symmetrical with respect to the transfer chamber 240. A portion of each of the application chambers 260 and the bake chambers 280 is disposed along the longitudinal direction of the transfer chamber 240. Further, a part of each of the application chambers 260 and the bake chambers 280 may be arranged so as to be stacked on each other. That is, on one side of the transfer chamber 240, the application chambers 260 are arranged in the arrangement of A X B and on the other side the bake chambers 280 are arranged in the arrangement of A X B. Where A is the number of application chambers 260 and bake chambers 280 provided in a row along the first direction 12 and B is the number of application chambers 260 and bake chambers 25 provided in a row along the third direction 16, (280). When four or six application chambers 260 are provided on one side of the transfer chamber 240, the application chambers 260 may be arranged in an array of 2 X 2 or 3 X 2.

Further, when four or six bake chambers 280 are provided on the other side of the transfer chamber 240, the bake chambers 280 may be arranged in an array of 2 X 2 or 3 X 2. The number of application chambers 260 and the number of bake chambers 280 may increase or decrease.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ In the buffer unit 220, a slot (not shown) in which the substrate W is placed is provided. A plurality of slots (not shown) are provided to be spaced along the third direction 16 from each other. The buffer unit 220 is opened on the side facing the transfer frame 140 and on the side facing the transfer chamber 240.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c.

The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130 and another portion of the index arms 144c from the carrier 130 to the processing module 20, ). ≪ / RTI > This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 is connected between the buffer unit 220 and the application chamber 260, between the application chamber 260 and the bake chamber 280, between the bake chambers 280 and between the application chambers 260 W). The transfer chamber 240 is provided with a guide rail 242 and a main robot 244. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12. The main robot 244 is installed on the guide rails 242 and is linearly moved along the first direction 12 on the guide rails 242. The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed so as to be movable along the guide rail 242. The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. Body 244b is also provided to be rotatable on base 244a. The main arm 244c is coupled to the body 244b, which is provided for forward and backward movement relative to the body 244b.

A plurality of main arms 244c are provided and each is provided to be individually driven. The main arms 244c are stacked in a state of being spaced from each other along the third direction 16.

In the application chamber 260, a film forming process for forming a film on the substrate W is performed. In each of the application chambers 260, an apparatus of the same structure (shown in Fig. 4) is provided. However, each device may have a different structure depending on the type of process to be performed. Optionally, the application chambers 260 are divided into a plurality of groups such that the devices 300 in the application chamber 260 belonging to the same group are identical to one another, and the structure of the device within the application chamber 260 belonging to different groups May be provided differently from each other.

Fig. 4 is a cross-sectional view showing the application chamber of Fig. 3;

Referring to FIG. 4, the application chamber 260 forms a thin film, such as a hard mask film, on a substrate W. According to an example, the application chamber 260 may perform a spin-on hard mask (SOH) process. The application chamber 260 includes a housing 810, an airflow providing unit 820, a substrate support unit 830, a processing vessel 850, a lift unit 890, and a liquid supply unit 840.

The housing 810 is provided in a rectangular tubular shape having a space 812 therein. An opening (not shown) is formed at one side of the housing 810. The opening serves as an inlet through which the substrate W is carried in and out. The opening is provided with a door, and the door opens and closes the opening. When the substrate processing process is performed, the door is closed to seal the inner space 812 of the housing 810. An inner exhaust port 814 and an outer exhaust port 816 are formed on the lower surface of the housing 810. The airflow formed in the housing 810 is exhausted to the outside through the inner exhaust port 814 and the outer exhaust port 816. According to one example, the airflow provided in the processing vessel 850 is exhausted through the inner exhaust port 814, and the airflow provided outside the processing vessel 850 can be exhausted through the outer exhaust port 816.

The airflow providing unit 820 forms a downward flow in the inner space of the housing 810. The airflow providing unit 820 includes an airflow supply line 822, a fan 824, and a filter 826. The airflow supply line 822 is connected to the housing 810. The air supply line 822 supplies external air to the housing 810. The filter 826 links the air provided from the airflow supply line 822 to the filter 826. The filter 826 removes impurities contained in the air. The fan 824 is mounted on the upper surface of the housing 810. The fan 824 is located in a central region in the upper surface of the housing 810. The fan 824 forms a downward flow in the inner space of the housing 810. When air is supplied to the fan 824 from the airflow supply line 822, the fan 824 supplies air in a downward direction.

The substrate support unit 830 supports the substrate W in the inner space of the housing 810. The substrate support unit 830 rotates the substrate W. The substrate support unit 830 includes a spin chuck 832 and rotation drive members 834 and 836. The spin chuck 832 is provided with a substrate support member 832 for supporting the substrate. The spin chuck 832 is provided to have a circular plate shape. The substrate W contacts the upper surface of the spin chuck 832. The spin chuck 832 is provided so as to have a smaller diameter than the substrate W. [ According to one example, the spin chuck 832 can vacuum-suck the substrate W and chuck the substrate W. Alternatively, the spin chuck 832 may be provided with an electrostatic chuck for chucking the substrate W using static electricity. The spin chuck 832 can also chuck the substrate W by physical force.

The rotation drive members 834 and 836 include a rotation shaft 834 and a driver 836. The rotating shaft 834 supports the spin chuck 832 below the spin chuck 832. The rotary shaft 834 is provided such that its longitudinal direction is directed up and down. The rotation shaft 834 is provided so as to be rotatable about its central axis. The driver 836 provides a driving force such that the rotation shaft 834 is rotated. For example, the driver 836 may be a motor capable of varying the rotational speed of the rotating shaft.

The processing vessel 850 is located in the interior space 812 of the housing 810. The processing vessel 850 provides a processing space therein. The processing vessel 850 is provided so that the upper portion thereof has an open cup shape. The processing vessel 850 includes an inner cup 852 and an outer cup 862.

The inner cup 852 is provided in the shape of a circular plate surrounding the rotation shaft 834. The inner cup 852 is positioned to overlap the inner vent 814 when viewed from above. The upper surface of the inner cup 852 is provided such that its outer and inner regions are inclined at different angles from each other. According to one example, the outer region of the inner cup 852 is oriented downwardly away from the substrate support unit 830, and the inner region is oriented in an upward sloping direction away from the substrate support unit 830 Lt; / RTI > A point where the outer region and the inner region of the inner cup 852 meet with each other is vertically provided in correspondence with the side end portion of the substrate W. [ The upper surface area of the inner cup 852 is provided to be rounded. The upper surface area of the inner cup 852 is provided downwardly concave. The upper surface area of the inner cup 852 may be provided in a region where the processing liquid flows.

The outer cup 862 is provided to have a cup shape that encloses the substrate support unit 830 and the inner cup 852. The outer cup 862 has a bottom wall 864, a side wall 866, a top wall 870, and an inclined wall 870. The bottom wall 864 is provided to have a circular plate shape having a hollow. A collection line 865 is formed in the bottom wall 864. The recovery line 865 recovers the treatment liquid supplied on the substrate W. [ The treatment liquid recovered by the recovery line 865 can be reused by an external liquid recovery system. The side wall 866 is provided to have a circular tubular shape surrounding the substrate supporting unit 830. The side wall 866 extends in a vertical direction from the side edge of the bottom wall 864. The side wall 866 extends upwardly from the bottom wall 864.

The inclined wall 870 extends inward of the outer cup 862 from the top of the side wall 866. The inclined wall 870 is provided so as to approach the substrate supporting unit 830 upward. The inclined wall 870 is provided so as to have a ring shape. The upper end of the inclined wall 870 is positioned higher than the substrate W supported on the substrate supporting unit 830. [

The lifting unit 890 lifts the inner cup 852 and the outer cup 862, respectively. The elevating unit 890 includes an inside moving member 892 and an outside moving member 894. The inner moving member 892 lifts the inner cup 852 and the outer moving member 894 moves the outer cup 862 up and down.

The liquid supply unit 840 performs the coating process and the ball process. The coating step is a step of forming a thin film on a substrate, and the edge bead removal (EBR) is a step of removing edge beads on a treatment liquid film formed by a coating step. The liquid supply unit 840 supplies various kinds of liquid onto the substrate W. According to one example, the liquid supply unit 840 can supply the treatment liquid and the edge bead removing liquid onto the substrate W. [

The liquid supply unit 840 includes an application nozzle 842 and the ball nozzle 844. The application nozzle 842 supplies the treatment liquid onto the substrate W. The treatment liquid supplied onto the substrate W forms a thin film. This ball nozzle 844 supplies the edge bead removing liquid onto the substrate W. [ The edge bead removing liquid removes the edge portion of the treatment liquid film formed on the substrate (W). The edge bead removing liquid exposes the edge portion of the substrate W from the treatment liquid film.

For example, the treatment liquid may be an organic substance, and the edge bead removing liquid may be a liquid capable of reacting with an organic substance. The film formed by the treatment liquid may be a hard mask film formed on the substrate W before the photosensitive liquid is applied.

The bake chamber 280 heat-treats the substrate W. For example, the bake chamber 280 may include a prebake step for heating the substrate W to a predetermined temperature to remove organic matter and moisture on the surface of the substrate W, And a cooling step of cooling the substrate W after each heating step, and the like can be performed. The bake chamber 280 includes a cooling plate 284 and a heating unit 282. The cooling plate 284 is provided in a circular plate shape. Cooling plate 284 is provided with cooling means 423, such as cooling water or a thermoelectric element. For example, the cooling plate 284 can cool the heated substrate W to room temperature.

The heating unit 282 heats the substrate W in a process atmosphere. The process atmosphere may be a reduced-pressure atmosphere lower than normal pressure. 5 is a cross-sectional view showing the heating unit of Fig. 5, the heating unit 282 includes a housing 910, a support plate 920, and a heater 930.

The housing 910 is located at one side of the cooling plate 284. The housing 910 provides a processing space 912 for heating the substrate W therein. The processing space 912 is provided with an outside and a closed space. An exhaust hole 914 is formed in the bottom surface of the housing 910. An exhaust assembly 700 is connected to the exhaust hole 914.

The support plate 920 is located in the processing space 912. The support plate 920 is provided in a circular plate shape. The upper surface of the support plate 920 is provided in a region where the substrate W is seated. A plurality of pinholes (not shown) are formed on the upper surface of the support plate 920. Each of the pin holes (not shown) is positioned to be spaced along the circumferential direction of the support plate 920. The pin holes (not shown) are spaced at equal intervals from each other. Each pin hole is provided with a lift pin (not shown). The lift pins (not shown) are provided to move up and down. For example, pin holes (not shown) may be provided in three.

The heater 930 heats the substrate W placed on the support plate 920 to a preset temperature. The heaters 930 are provided in a plurality of locations and are located in areas different from each other in the support plate 920. Each heater 930 is located on the same plane. Each heater 930 heats different areas of the support plate 920. The areas of the support plate 920 corresponding to each heater 930 are provided with heating zones. For example, the heating zones may be fifteen. For example, the heater 930 may be a thermoelectric element or a hot wire.

 Fig. 6 is a cross-sectional view showing the exhaust assembly, Fig. 7 is a plan view of the exhaust assembly, and Fig. 8 is a cross-sectional view of the integrated exhaust duct.

6 through 8, the exhaust assembly 700 can exhaust the bake chambers 280, respectively. Prior to describing the exhaust assembly 700, the bake chambers 280 positioned one above the other are described as the lower chamber 280b and the upper chamber 280a. The upper layer chamber 282a is defined as a chamber located above the lower layer chamber 282b. Although two bake chambers are stacked in this embodiment, the present invention is not limited thereto.

The exhaust assembly 700 may include an integrated exhaust duct 710, a connecting duct 720, and a pressure reducing member 790.

The integrated exhaust duct 710 may be provided vertically to one side of the upper chamber 282a and the lower chamber 282b. Preferably, the integrated exhaust duct 710 may be provided in a cylindrical shape as a whole, and its flat cross-section may be circular.

The integrated exhaust duct 710 may be connected in parallel to the upper chamber 282a and the lower chamber 282b, respectively, through the connecting ducts 720. [ To this end, connection holes 712 are formed in a part of the integrated exhaust duct 710. A part of the exhaust duct 710 may have a longitudinal direction parallel to the direction in which the upper layer chamber 282a and the lower layer chamber 282b are arranged. The connection holes 712 may be provided in the same number as the number of the bake chambers 280 positioned to be stacked on each other. The connection holes 712 may be spaced apart from each other along the vertical direction.

The pressure-reducing member 790 is installed close to the end of the integrated exhaust duct 710. The pressure-reducing member 790 decompresses the integrated exhaust duct 710. The interior atmosphere of the upper chamber 282a and the lower chamber 282b is exhausted through the integrated exhaust duct 710. [

The connecting duct 720 connects each of the upper chamber 282a and the lower chamber 282b to an integrated exhaust duct 710. The connecting duct 720 connects the process space of the upper chamber 282a and the lower chamber 282b with the connecting hole 712 to each other. The reduced pressure provided from the pressure-reducing member 790 is transmitted to the upper chamber 282a and the lower chamber 282b through the integrated exhaust duct 710 and the connecting duct 720. [ Thus, the inner atmosphere of the upper chamber 282a and the lower chamber 282b is exhausted sequentially through the connecting duct 720 and the exhaust duct 710. The connecting duct 720 includes a first connecting duct 722 and a second connecting duct 724. The first connecting duct 722 connects the upper chamber 282a and the exhaust duct 710 and the second connecting duct 724 connects the lower chamber 282b and the exhaust duct 710.

9 is a view showing the flow of air in the integrated exhaust duct.

7 to 9, the first connection duct 722 and the second connection duct 724 are connected to the inner diameter of the integrated exhaust duct 710 in order to form a small projecting air flow in the exhaust passage of the integrated exhaust duct 710 Tangential direction. That is, the airflow introduced into the integrated exhaust duct 710 through the first connection duct 722 and the second connection duct 724 flows in a spiral manner along the inner peripheral surface of the exhaust passage.

On the other hand, the integrated exhaust duct 710 includes the airflow guiding member 750. The airflow guiding member 750 has a first air flow (indicated by a solid line in FIG. 9) flowing through the first connecting duct 722 and a second air flow (indicated by a dotted line in FIG. 9) flowing through the second connecting duct 724 The direction of the first airflow is guided so as not to collide with the first airflow. In this embodiment, the airflow guiding member 750 may have a triangular shape. The airflow guiding member 750 flows through the first connecting duct 722 and turns the direction of the first airflow flowing through the exhaust passage of the integrated exhaust duct 710 so that the second airflow passing through the second connecting duct 724 It naturally joins with the air stream and flows as a single air stream.

As described above, the exhaust assembly 700 has a structural feature of generating a swirling airflow so that the airflow is introduced into the integrated exhaust duct 710 at the same time as the swirling airflow is rapidly rotated. The vortex flow in the integrated exhaust duct 710 becomes stronger as it goes downward, and congestion is not generated in the duct, thereby preventing fume from being deposited on the inner circumferential surface of the duct.

In the above-described embodiment, the bake chambers 280 are stacked in two stages. However, the bake chamber 280 may be provided to be stacked in three or more stages. Also, although the exhaust assembly 700 has been described as exhausting the bake chamber 280, it can be applied variously as long as it is a chamber having a space for processing the substrate W.

10 is a view showing another example of the integrated exhaust duct.

As shown in FIG. 10, the integrated exhaust duct 710a according to another example is provided with a similar configuration and function to the integrated exhaust duct 710 shown in FIG. 8. Therefore, the difference from the present embodiment will be described below .

In another example, the integrated exhaust duct 710a may be formed with a helical flow passage 718 on the inner circumferential surface thereof for the formation of a swirl flow. The helical flow path 718 may be provided by helical grooves engraved on the inner circumferential surface of the integrated exhaust duct 710a. However, the present invention is not limited thereto, and the helical flow passage 718 may be provided by spiral protrusions protruding from the inner peripheral surface of the integrated exhaust duct 710a.

Since the spiral passage 718 is formed on the inner circumferential surface of the integrated exhaust duct 710a as described above, the flow of air introduced through the connection holes 712 forms a swirl flow, and this flow is transmitted to the inner peripheral surface of the integrated exhaust duct 710a So that the exhaust efficiency can be improved.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

700: Exhaust assembly 710: Integrated exhaust duct
790: pressure reducing member 720: connecting duct
950: airflow guide member

Claims (15)

A first chamber having a first processing space for processing a substrate therein;
A second chamber having a second processing space for processing the substrate therein; And
And an exhaust assembly for exhausting each of the first processing space and the second processing space;
The exhaust assembly
Integrated exhaust duct;
A decompression member for decompressing the integrated exhaust duct;
A first connection duct connecting the first processing space and the integrated exhaust duct; And
And a second connecting duct connecting the second processing space and the integrated exhaust duct,
Wherein the integrated exhaust duct includes an airflow guide member for guiding the direction of the first airflow so that the first airflow flowing through the first connecting duct does not collide with the second airflow flowing through the second connecting duct,
The airflow guiding member
Wherein the integrated exhaust duct is formed in a spiral shape on an inner peripheral surface of the integrated exhaust duct and has a triangular shape in a vertical cross section including a diameter of the integrated exhaust duct having a circular cross section. The method according to claim 1,
The second chamber being disposed below the first chamber,
Wherein the integrated exhaust duct is circular in cross section and provides an exhaust flow flowing from top to bottom. 3. The method of claim 2,
The integrated exhaust duct
A first connection hole to which the first connection duct is connected; And
And a second connection hole to which the second connection duct is connected,
And the airflow guiding member is positioned above the second connection hole. delete A first chamber having a first processing space for processing a substrate therein;
A second chamber having a second processing space for processing the substrate therein; And
And an exhaust assembly for exhausting each of the first processing space and the second processing space;
The exhaust assembly
Integrated exhaust duct;
A decompression member for decompressing the integrated exhaust duct;
A first connection duct connecting the first processing space and the integrated exhaust duct; And
And a second connecting duct connecting the second processing space and the integrated exhaust duct,
Wherein the first connection duct and the second connection duct are tangentially connected to an inner diameter of the integrated exhaust duct for forming a small protruding air flow,
Wherein the integrated exhaust duct includes an airflow guiding member for guiding the direction of the first airflow so that the first airflow flowing through the first connecting duct does not collide with the second airflow flowing through the second connecting duct,
The airflow guiding member
Wherein the integrated exhaust duct is formed in a spiral shape on an inner peripheral surface of the integrated exhaust duct and has a triangular shape in a vertical cross section including a diameter of the integrated exhaust duct having a circular cross section. A first chamber having a first processing space for processing a substrate therein;
A second chamber having a second processing space for processing the substrate therein; And
And an exhaust assembly for exhausting each of the first processing space and the second processing space;
The exhaust assembly
Integrated exhaust duct;
A decompression member for decompressing the integrated exhaust duct;
A first connection duct connecting the first processing space and the integrated exhaust duct; And
And a second connecting duct connecting the second processing space and the integrated exhaust duct,
Wherein the integrated exhaust duct includes an airflow guide member for guiding the direction of the first airflow so that the first airflow flowing through the first connecting duct does not collide with the second airflow flowing through the second connecting duct,
Wherein the second chamber is disposed below the first chamber,
Wherein the integrated exhaust duct is circular in cross section and provides exhaust flow flowing from top to bottom;
Wherein a spiral flow path is formed on an inner peripheral surface to form a swirl flow. The method according to claim 6,
Wherein the spiral flow path is provided by spiral protrusions protruding from an inner peripheral surface of the integrated exhaust duct. The method according to claim 6,
Wherein the helical flow path is provided by helical grooves recessed in the inner circumferential surface of the integrated exhaust duct. An exhaust assembly comprising:
An integrated exhaust duct installed in a vertical direction and having an exhaust passage; And
And a connecting duct connecting the integrated exhaust duct to the chambers where the substrate processing is performed;
The integrated exhaust duct
And an air flow guide member for guiding the direction of the air flow so that the air flow passing through the exhaust passage does not collide with the airflow flowing through the connecting duct,
The airflow guiding member
Wherein the exhaust duct is formed in a spiral shape on an inner peripheral surface of the integrated exhaust duct and has a triangular shape in a vertical cross section including a diameter of the integrated exhaust duct having a circular cross section. delete 10. The method of claim 9,
The integrated exhaust duct
And connection holes that are connected to the connection ducts are vertically spaced apart from each other. delete 10. The method of claim 9,
Wherein the connecting duct is tangentially connected to an inner diameter of the integrated exhaust duct for forming a small projecting air flow. 14. The method according to any one of claims 9, 11 and 13,
The integrated exhaust duct
An exhaust assembly having a spiral flow path formed on an inner circumferential surface thereof to form a swirl flow. 15. The method of claim 14,
Wherein the helical flow path is provided by spiral protrusions protruding from the inner circumferential surface of the integrated exhaust duct or spiral grooves engraved on the inner circumferential surface of the integrated exhaust duct.

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