KR101941448B1 - Method of fabricating lightweight and thin liquid crystal display device - Google Patents

Abstract

In the method of manufacturing a lightweight thin-type liquid crystal display device of the present invention, when an auxiliary substrate is used for progressing a thin glass substrate, an edge portion between a thin glass substrate and an auxiliary substrate is removed by a knife, The auxiliary substrate can be easily separated from the liquid crystal panel in the cell state in which the process is completed by separating the auxiliary substrate by injecting air therebetween.
At this time, the method of manufacturing a lightweight thin liquid crystal display device of the present invention is characterized by optimizing the shape of a push pin for forming an edge desorption start point.
Further, in the method of manufacturing a lightweight and thin liquid crystal display device of the present invention, a foreign substance attached between a thin glass substrate and an auxiliary substrate is removed in advance by using a laser or a knife or a thin film or liquid nitrogen, Thereby eliminating defects caused thereby.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a lightweight thin liquid crystal display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device, and more particularly, to a method of manufacturing a lightweight thin type liquid crystal display device.

2. Description of the Related Art Recently, the display field for processing and displaying a large amount of information has been rapidly developed as society has entered into a full-fledged information age. Recently, thin-film transistors (thin A liquid crystal display (LCD) has been developed to replace a conventional cathode ray tube (CRT).

The liquid crystal display device mainly comprises a color filter substrate and an array substrate, and a liquid crystal layer formed between the color filter substrate and the array substrate.

Wherein the color filter substrate is divided into a color filter composed of sub-color filters of red (R), green (G), and blue (B) A black matrix for blocking light, and a transparent common electrode for applying a voltage to the liquid crystal layer.

A gate line and a data line are vertically and horizontally arranged on the array substrate to define a pixel region. At this time, a thin film transistor, which is a switching element, is formed in a crossing region between the gate line and the data line, and pixel electrodes are formed in the pixel regions.

The color filter substrate and the array substrate are adhered to each other so as to face each other by a sealant formed on the outer periphery of the image display area to constitute a liquid crystal panel, And a joining key formed on the substrate.

Such a liquid crystal display device is particularly used for portable electronic devices, so that the size and weight of the liquid crystal display device can be reduced to improve the portability of electronic devices. Further, recently, as a large-area liquid crystal display device is manufactured, the demand for such a light weight and thin shape is further increased.

There are various methods for reducing the thickness and weight of the liquid crystal display device, but there are limitations in reducing the structure and the essential components of the liquid crystal display device in the current state of the art. Moreover, since these essential components are small in weight, it is very difficult to reduce the thickness and weight of the entire liquid crystal display device by reducing the weight of these essential components.

A method for reducing the thickness and weight of a liquid crystal display device by reducing the thickness of a color filter substrate and an array substrate constituting a liquid crystal panel has been actively studied. However, since a thin substrate must be used, The substrate is bent or broken during the process.

It is an object of the present invention to provide a method of manufacturing a lightweight thin liquid crystal display device in which breakage of a thin glass substrate is prevented by attaching an auxiliary substrate to a thin glass substrate.

Another object of the present invention is to provide a method of manufacturing a lightweight and thin liquid crystal display device in which an auxiliary substrate is easily separated from a liquid crystal panel in a cell state in which the process is completed.

It is still another object of the present invention to provide a method of manufacturing a lightweight thin liquid crystal display device in which a shape of a push pin for forming an edge desorption starting point is optimized when the auxiliary substrate is detached.

It is still another object of the present invention to provide a method of manufacturing a lightweight thin liquid crystal display device capable of eliminating defects due to foreign substances adhering to the auxiliary substrate during the process of attaching and detaching the auxiliary substrate.

Other objects and features of the present invention will be described in the following description of the invention and claims.

According to an aspect of the present invention, there is provided a method of manufacturing a lightweight thin liquid crystal display device including: providing first and second auxiliary substrates and first and second thin mother boards; Attaching the first and second auxiliary substrates to the first and second thin mother boards, respectively; Performing an array process on the first mother substrate to which the first auxiliary substrate is attached; Performing a color filter process on a second mother substrate to which the second auxiliary substrate is attached; Attaching a first mother board on which the array process is performed and a second mother board on which the color filter process is performed; Providing a desorption device with a table; Loading the first and second bonded mother boards on the table; Detaching an edge portion between the second auxiliary board and the second mother board using the first and second knives; Separating the second auxiliary substrate from the first and second mother substrate; Inverting the first and second mother boards with the second auxiliary board separated; Detaching an edge portion between the first auxiliary substrate and the first mother substrate using the first and second knives; And separating the first auxiliary substrate from the first and second mother substrate.

At this time, after the first and second auxiliary boards and the first and second mother boards are provided, the corners of the first and second auxiliary boards and the first and second mother boards are cut at an oblique angle cutting a corner cut to form a corner cut.

At least two corners of the first and second mother substrates are further cut inward than the corners of the first and second mother substrates, and the corner portions of the first and second mother substrates are exposed Thereby forming a push pin region.

In this case, after the first and second mother boards are loaded on the table, the push pin is pressed upward by a predetermined pressure using a push pin, and a knife is inserted between the second auxiliary board and the second mother board, Further comprising the step of forming an entry space.

At this time, first and second knives are introduced into the knife entry space between the second auxiliary substrate and the second mother substrate, and the first and second knives are moved in the other direction from the first direction to the second direction, And an edge portion between the auxiliary board and the second mother board is detached.

At this time, the desorption apparatus includes a plurality of vacuum pads and a vacuum pad plate for moving the vacuum pads up and down.

The method may further include attaching the plurality of vacuum pads to the surface of the second auxiliary substrate after detaching the edge portion between the second auxiliary substrate and the second mother substrate.

At this time, the vacuum pad or the vacuum pad plate is raised to form a space for entry of the air knife between the second auxiliary substrate and the second mother substrate.

At this time, the air knife is introduced into the air knife entry space formed between the second auxiliary substrate and the second mother substrate, and air is sprayed to separate the second auxiliary substrate from the first mother substrate and the second mother substrate .

At this time, after the first and second mother substrates are separated by the second auxiliary substrate, the first mother substrate and the first mother substrate are inverted by using a push pin, Thereby forming a knife entry space therebetween.

At this time, the first and second knives are introduced into the knife entry space between the first auxiliary substrate and the first mother substrate, and the first and second knives are moved in the other direction from one direction to the other, And an edge portion between the auxiliary substrate and the first mother substrate is detached.

At this time, air is injected through the air holes provided in the first and second knives together with the movement of the first and second knives.

The method may further include attaching the plurality of vacuum pads to the surface of the first auxiliary substrate after detaching the edge portion between the first auxiliary substrate and the first mother substrate.

At this time, the vacuum pad or the vacuum pad plate is raised to form a space for entry of the air knife between the first auxiliary substrate and the first mother substrate.

The air knife is introduced into the air knife entry space formed between the first auxiliary substrate and the first mother substrate and the air is sprayed to separate the first auxiliary substrate from the first mother substrate and the second mother substrate, .

The first and second knives are located on the left and right sides of the table, and the air knife is arranged between the first and second knives in a longitudinal direction.

The first and second knives may be formed of a metal such as SUS (Steel Use Stainless) or a knife blade made of plastic such as PET (polyethylene terephthalate) or HDPE (high density polyethylene).

When one of the first and second knives is provided at one end of the table, one of the knives is moved in the longitudinal direction of the table so that one edge portion between the second auxiliary substrate and the second mother substrate, And the first edge portion between the first mother substrate and the first mother substrate, and the moved first and second knives return to their original positions.

At this time, the first and second knives are moved in the horizontal direction of the table so that upper and lower edge portions between the second auxiliary substrate and the second mother substrate, and upper and lower edge portions between the first auxiliary substrate and the first mother substrate are detached , And the moved first and second knives return to their original positions.

When two first and second knives are provided on the front and rear ends of the table, one of the front and rear ends of the knife is moved in the longitudinal direction of the table so that the distance between the second auxiliary board and the second mother board Left and right edge portions between the first auxiliary board and the first mother board, and the first and second knives moved back to their original positions.

At this time, each of the two first and second knives is moved by half in the transverse direction of the table so that the upper and lower edge portions between the second auxiliary substrate and the second mother substrate, and between the first auxiliary substrate and the first mother substrate, The upper and lower edge portions are detached, and the moved first and second knives are returned to their original positions.

The push pin is characterized in that the contact surface contacting the push pin region has a triangular shape, a circular shape and a triangle shape, or a quadrangular shape or a circular shape.

At this time, after forming the push pin region, recognizing the ends of the first and second auxiliary substrates through observation equipment such as a charge-coupled device (CCD) camera; And moving the push pins along the x-axis and the y-axis in consideration of positions of the ends of the recognized first and second auxiliary substrates to align the push pins with the set positions.

Recognizing the ends of the first and second mother boards through observation equipment such as a CCD camera after forming the push pin area; And moving the push pins along the -x axis and the -y axis in consideration of the positions of the ends of the recognized first and second mother boards, thereby aligning the push pins with the set positions.

At this time, after aligning the push pins by recognizing the ends of the first and second mother substrates and the first and second auxiliary substrates, the aligned push pins are moved in the z axis direction, And an edge portion between the mother substrate and the first auxiliary substrate and the first mother substrate is detached.

Alternatively, after aligning the push pins by recognizing the ends of the first and second mother substrates and the first and second auxiliary substrates, the aligned push pins are alternately moved in the z-axis direction and the -z axis direction, And an edge portion between the second auxiliary board and the second mother board or between the first auxiliary board and the first mother board is detached.

Alternatively, after aligning the push pins by recognizing the ends of the first and second mother substrates and the first and second auxiliary substrates, the aligned push pins are alternately moved in the z-axis direction and the -z axis direction, And the moving distance is sequentially increased and moved so that the edge portions between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate are removed.

A thin film instead of the first and second knives is introduced into the corner space between the second auxiliary substrate and the second mother substrate, and the thin film is moved in the other direction in one direction of the table, 2 removes foreign objects existing between the mother substrate plates and removes the edge portions therebetween.

At this time, a thin film instead of the first and second knives is introduced into the corner space between the first auxiliary substrate and the first mother substrate, and the thin film is moved in the other direction in one direction of the table, And an edge portion between the first mother substrate and the first mother substrate is removed.

The thin film is characterized by having a thickness of 0.001 mm to 1.0 mm.

In order to minimize damage such as scratches on the substrate made of glass, the thin film is made of a material having a Mohs hardness of 3 or less such as PET (polyethylene terephthalate), PVC (polyvinyl chloride), PE (polyethylene), PC polycarbonate, low density polyethylene (LDPE), high density polyethylene (HDPE) and ethylene vinyl acetate (EVA).

And air is sprayed through the air holes provided in the thin film together with the movement of the thin film to carry out a process of removing foreign substances and desorbing edges.

At this time, separation of the second auxiliary substrate or the first auxiliary substrate is performed by using the thin film and the air jet.

The cooling material is sprayed on the front surface of the second auxiliary substrate or the first auxiliary substrate or on the side between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate, And separating the second auxiliary substrate or the first auxiliary substrate using a thin film and air instead of the first and second knives.

The cooling material is sprayed on the entire surface of the second auxiliary substrate or the first auxiliary substrate or between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate, The separation of the second auxiliary substrate or the first auxiliary substrate is progressed by using the thin film and the air instead of the first and second knives after weakening the adhesion of the foreign matter.

At this time, heat corresponding to a temperature between room temperature and 80 ° C is applied to the lower part including the first and second mother board.

The cooling material is characterized by including a cooling material of -10 ° C or lower which can induce heat shrinkage stress on foreign matter such as dry ice at -78.5 ° C in addition to liquid nitrogen at -196 ° C.

By moving the first and second knives in the space between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate along the direction in which the edge portion is removed, And removing it.

And detecting a pressure of the vacuum pad or the vacuum pad plate when the vacuum pad or the vacuum pad plate rises in the process of separating the second auxiliary substrate or the first auxiliary substrate.

At this time, it is further determined whether there is an abnormality in the pressure sensed by the sensor, and if there is an abnormality, an alarm or a foreign object occurrence indicating that the foreign object has died is displayed on a monitor or the like.

At this time, if a foreign matter is generated, the foreign matter in the portion where the pressure abnormality is detected is removed using a laser, and then the separation process of the second auxiliary substrate or the first auxiliary substrate is continued.

And inspecting foreign objects along the edges of the second auxiliary board, the second mother board, the first auxiliary board and the first mother board.

At this time, when a foreign object is generated, it is further characterized by displaying a monitor or the like on the occurrence of an alarm or foreign object that the foreign object is generated.

At this time, foreign substances are removed from the portion where the foreign object is detected by using a laser, and the foreign substance inspection and removal process is performed on all the edges of the second mother substrate and the second mother substrate or the first auxiliary substrate and the first mother substrate .

At this time, after the foreign substance removal process is completed, the separation process of the second auxiliary substrate or the first auxiliary substrate is performed.

As described above, according to the method of manufacturing a lightweight and thin liquid crystal display device according to the present invention, it is possible to realize a thin and lightweight liquid crystal display device using a thin glass substrate, thereby reducing the thickness and weight of television and monitor models and portable electronic devices Provides a possible effect.

Also, in the method of manufacturing a lightweight thin liquid crystal display device according to the present invention, an edge portion between a thin glass substrate and an auxiliary substrate is removed by a knife, air is injected therebetween through an air knife, So that the auxiliary substrate can be easily separated from the liquid crystal panel in the cell state in which the process is completed. As a result, the process is stabilized and the price competitiveness of the product is improved.

In addition, the method of manufacturing a lightweight thin liquid crystal display device according to the present invention can improve the success rate of the push pin application process by optimizing the shape of the push pin for forming the edge desorption start point. As a result, when the auxiliary substrate is detached, the damage to the thin glass substrate and the auxiliary substrate is reduced.

In addition, the method of manufacturing a lightweight thin liquid crystal display device according to the present invention can remove defects caused by foreign substances when the auxiliary substrate is detached by removing foreign materials adhered between the thin glass substrate and the auxiliary substrate in advance, Thereby providing an improved effect.

FIG. 1 is a flowchart schematically showing a method of manufacturing a lightweight thin-type liquid crystal display device according to a first embodiment of the present invention.
FIGS. 2A to 2D are schematic views showing a process part of a method for manufacturing a lightweight thin liquid crystal display device according to the present invention; FIG.
FIGS. 3A to 3D are schematic views showing another example of a process part of a method of manufacturing a lightweight thin liquid crystal display device according to the present invention; FIG.
FIGS. 4A to 4D are schematic views showing another example of a process part of a method of manufacturing a lightweight thin liquid crystal display device according to the present invention; FIG.
FIGS. 5A and 5B are plan views schematically showing first and second auxiliary substrates and first and second mother boards, each of which has a corner cut according to the present invention; FIG.
FIG. 5C is a plan view schematically showing first and second mother boards in a state where first and second auxiliary boards having edge cuts formed thereon are attached with a push pin area according to the present invention; FIG.
6A to 6D are sectional views showing, for example, a push pin shape applied to the push pin region (A) according to the present invention.
7A to 7D are cross-sectional views showing, for example, a push pin shape applied to another push pin region (B) according to the present invention.
8A and 8B are perspective views showing, for example, a method of recognizing the ends of a thin glass substrate or an auxiliary substrate.
Figs. 9A to 9C are perspective views showing, by way of example, a method of pushing a push pin after recognizing the ends of a thin glass substrate or an auxiliary substrate. Fig.
FIG. 10 is a flowchart showing an example of a separation process of an auxiliary substrate according to the first embodiment of the present invention. FIG.
11 is a plan view schematically showing a lower structure of a desorption apparatus according to the present invention.
12A and 12B are views schematically showing a configuration of a knife according to the present invention.
Figs. 13A to 13D are views showing the shape of a blade in the knife shown in Figs. 12A and 12D, for example.
FIG. 14 is an exemplary view showing an example of a sequence of an edge portion desorption process using a knife according to the present invention; FIG.
FIG. 15 is another example showing the order of the edge portion desorption process using the knife according to the present invention. FIG.
FIGS. 16A to 16P are views showing the steps of sequentially separating an auxiliary substrate in a method of manufacturing a lightweight thin liquid crystal display device according to a first embodiment of the present invention. FIG.
17 is a flowchart schematically showing a method of manufacturing a lightweight thin-type liquid crystal display device according to a second embodiment of the present invention.
FIG. 18 is a view showing an example of sequentially removing a foreign object and a separation step of an auxiliary substrate in the method of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG.
19 is a view showing another example of sequentially removing the foreign object and the auxiliary substrate from the light-weight thin liquid crystal display device according to the second embodiment of the present invention shown in FIG.
FIG. 20 is a view showing still another example of a process of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG.
FIG. 21 is a view showing still another example of a process of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG.
FIG. 22 is a view showing still another example of a process of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG.

2. Description of the Related Art [0002] Recently, various applications of liquid crystal display devices have been gaining interest in lightweight and thin liquid crystal display devices, and attention has been paid to thinning of substrates that occupy the largest portion of the thickness of liquid crystal panels. In addition, since a retarder or a protective function substrate is added to a liquid crystal panel in a 3D or touch panel, the demand for further thinning is increased. However, in the case of a thin substrate, the process progress is limited due to weak physical properties such as warpage and rigidity.

In order to solve this problem, a method of attaching an auxiliary substrate to a thin glass substrate and then separating the thin glass substrate from the auxiliary substrate after the process is completed is attempted.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a method of manufacturing a lightweight thin liquid crystal display device according to the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

1 is a flowchart schematically showing a method of manufacturing a lightweight thin liquid crystal display device according to a first embodiment of the present invention.

1 illustrates a method of manufacturing a liquid crystal display device in a case where a liquid crystal layer is formed by a liquid crystal dropping method. However, the present invention is not limited thereto, and the present invention can be applied to a liquid crystal display The present invention can be applied to a manufacturing method of a liquid crystal display device.

The manufacturing process of the liquid crystal display device can be largely divided into a driving element array process for forming driving elements on the lower array substrate, a color filter process for forming a color filter on the upper color filter substrate, and a cell process.

As described above, there are various factors that determine the thickness and weight of the liquid crystal display device. Among them, the color filter substrate or the array substrate made of glass is the heaviest component among the other components of the liquid crystal display device. Therefore, it is most effective to reduce the thickness and weight of the glass substrate in order to reduce the thickness and weight of the liquid crystal display device.

There is a method of reducing the thickness or weight of the glass substrate by etching the glass substrate or using a thin glass substrate. In the first method, the glass etching process is further performed after the completion of the cell to reduce the thickness thereof.

Therefore, in the present invention, a thin glass substrate having a thickness of about 0.1 t to 0.4 t is used to carry out the array process, the color filter process and the cell process. At this time, a thin glass substrate is adhered to an auxiliary substrate, So as to minimize the influence of the warp of the glass substrate and to prevent the breakage of the thin glass substrate during movement. In this case, t stands for mm, 0.1t stands for a thickness of 0.1 mm, and 0.4 t stands for a thickness of 0.4 mm. In the following description, mm is denoted by t for convenience of explanation.

That is, when a thin glass substrate having a thickness of about 0.1 t to 0.4 t is inserted into a general liquid crystal display device manufacturing line, a large amount of warpage occurs and the glass substrate is severely deflected. Therefore, by using a moving means such as a cassette There is a problem in moving, and when loading and unloading in a unit process equipment, the occurrence of warpage occurs rapidly due to a small impact, resulting in frequent positional errors. As a result, failure failure increases due to collision, etc., Respectively.

Therefore, in the present invention, by attaching the auxiliary substrate before putting the thin glass substrate of 0.1 t to 0.4 t into the production line, it is possible to obtain the same or further improved warpage as that of the glass substrate having the thickness of about 0.7 t used in general liquid crystal display So that it is possible to prevent the occurrence of problems such as deflection of the glass substrate during movement or the progress of the unit process.

First, an auxiliary substrate of about 0.3 t to 0.7 t is attached to the above-mentioned thin glass substrate of 0.1 t to 0.4 t before a thin glass substrate of 0.1 t to 0.4 t is put into a manufacturing line of an array process and a color filter process (S101). However, the present invention is not limited to the thicknesses of the thin glass substrate and the auxiliary substrate.

The adhesion between the thin glass substrate and the auxiliary substrate can be achieved by bringing the two substrates into contact in a vacuum state. The combining force between the two substrates can be estimated by electrostatic force, vacuum force, surface tension, or the like.

At this time, the present invention can easily detach the auxiliary substrate from the thin glass substrate by forming a plasma treatment using a fluorine or the like on the auxiliary substrate and relieving the bonding force by forming a concave-convex pattern. Explain.

FIGS. 2A to 2D are schematic views illustrating a process part of a method for manufacturing a lightweight thin liquid crystal display device according to the present invention, and illustrate a process of attaching and detaching a thin glass substrate and a plasma-processed auxiliary substrate .

In this case, FIGS. 2A to 2D illustrate that the plasma is processed on the entire surface of the auxiliary substrate to relax the bonding force between the auxiliary substrate and the thin glass substrate to facilitate detachment between the auxiliary substrate and the thin glass substrate.

As shown in FIG. 2A, for example, a thin glass substrate 100 of about 0.1 t to 0.4 t and an auxiliary substrate 110 of about 0.3 t to 0.7 t are prepared.

At this time, the thin glass substrate 100 may be a large-area mother substrate having a plurality of color filter substrates for a color filter process, or a large-area mother substrate having a plurality of array substrates for array processing.

Next, as shown in FIG. 2B, the entire surface 111 of the auxiliary substrate 110 is treated with plasma using fluorine or the like, so that the auxiliary substrate 110 can be easily attached and detached.

When the auxiliary substrate 110 is treated with fluorine, the fluorine may etch the surface 111 of the auxiliary substrate 110 to increase the surface roughness or change the chemical characteristics of the surface, 100 can be weakened.

Next, as shown in FIG. 2C, the plasma-treated auxiliary substrate 110 is attached to the thin glass substrate 100. In this case, when the glass substrate 100 is used as the auxiliary substrate 110, the two glass substrates 100 and 110 are brought into contact with each other in a vacuum state. At this time, 100, and 110) can be estimated by electrostatic force, vacuum force, surface tension, and the like.

The process panel in a state in which the thin glass substrate 100 having a thickness of 0.1 t to 0.4 t and the auxiliary substrate 110 having a thickness of 0.3 t to 0.7 t are adhered is formed on the thin glass substrate 100 And the auxiliary substrate 110 are made of the same glass material, the same expansion rate as the temperature change is the same, so that there is no such problem that warping occurs due to the difference in the expansion ratio during the unit process.

Though the thin glass substrate 100 has a thickness of 0.1 t to 0.4 t itself, since the glass substrate 100 is bonded to the auxiliary substrate 110 to form a process panel, the occurrence of warpage is remarkably reduced, It is not a problem to proceed with the unit process for a liquid crystal display device.

Then, a color filter process or an array process, which will be described later, is performed on the thin glass substrate 100 to which the auxiliary substrate 110 is attached to form a thin film transistor or a color filter layer as a driving element in each of the panel regions.

After completion of the predetermined process, the auxiliary substrate 110 must be separated from the thin glass substrate 100, as shown in FIG. 2D. At this time, plasma is irradiated to the entire surface 111 of the auxiliary substrate 110 So that the auxiliary substrate 110 can be easily attached and detached.

That is, if the glass substrate 100 has a strong bonding force between the glass substrate 100 and the auxiliary substrate 110, it is difficult to physically separate the glass substrate 100 and the auxiliary substrate 110, The combined force between the thin glass substrate 100 and the auxiliary substrate 110 is lowered so that the auxiliary substrate 110 can be easily attached and detached.

The auxiliary substrate 110 detached from the thin glass substrate 100 may be attached to a new glass substrate and recycled for a new process.

Meanwhile, the method of processing plasma on the auxiliary substrate may be a partial processing method in addition to the above-mentioned front processing, and will be described in detail with reference to the drawings.

FIGS. 3A to 3D are schematic views illustrating a process part of a method for manufacturing a lightweight thin liquid crystal display device according to the present invention. FIG. 3A to FIG. 3D illustrate a process of attaching and detaching a thin glass substrate and a plasma- have.

Here, FIGS. 3A to 3D are views for explaining plasma processing on a predetermined portion of the auxiliary substrate to facilitate the detachment between the auxiliary substrate and the thin glass substrate by reducing the combined force between the auxiliary substrate and the thin glass substrate.

As shown in FIG. 3A, a thin glass substrate 100 having a thickness of, for example, 0.1 t to 0.4 t and an auxiliary substrate 110 having a thickness of about 0.3 to 0.7 t are prepared.

At this time, the thin glass substrate 100 may be a large-area mother substrate having a plurality of color filter substrates for a color filter process, or a large-area mother substrate having a plurality of array substrates for array processing.

Next, as shown in FIG. 3B, a plasma using fluorine or the like is applied to a part of the surface 111 'of the auxiliary substrate 110 so that the auxiliary substrate 110 can be easily attached and detached. 3B illustrates a case where a part of the surface 111 'of the center of the auxiliary substrate 110 is fluorine-treated, but the present invention is not limited thereto.

As described above, when the auxiliary substrate 110 is treated with fluorine, the surface of the auxiliary substrate 110 is etched by fluorine to increase the surface roughness or change the chemical characteristics of the surface, It is possible to weaken the combining force by the contact with the substrate 100. Particularly, in this case, as only a part of the surface 111 'of the auxiliary substrate 110 is treated with fluorine, coalescence is performed in an area where the substrates 100 and 110 can contact each other, There is an advantage that the detachment can be facilitated due to some surfaces 111 '.

Next, as shown in FIG. 3C, the plasma-treated auxiliary substrate 110 is attached to the thin glass substrate 100. In this case, when the glass substrate 100 is used as the auxiliary substrate 110, the two glass substrates 100 and 110 are brought into contact with each other in a vacuum state. At this time, 100, and 110) can be estimated by electrostatic force, vacuum force, surface tension, and the like.

Then, the color filter process or the array process is performed on the thin glass substrate 100 to which the auxiliary substrate 110 is attached to form a thin film transistor or a color filter layer as a driving device in each of the panel regions.

After the completion of the predetermined process, the auxiliary substrate 110 must be separated from the thin glass substrate 100, as shown in FIG. 3D. At this time, a part of the surface 111 'of the auxiliary substrate 110 Plasma processing is performed, so that the auxiliary substrate 110 can be easily attached and detached.

On the other hand, in the above case, a case is described in which the plasma processing is performed on the auxiliary substrate to facilitate the detachment by alleviating the assisting force with the thin glass substrate. However, the present invention is not limited to this, and it is also possible to reduce an assemble force with a thin glass substrate by forming an uneven pattern on an auxiliary substrate, and this will be described in detail with reference to the drawings.

FIGS. 4A to 4D are schematic views illustrating a process part of a method for manufacturing a lightweight thin liquid crystal display device according to the present invention. FIGS. 4A to 4D illustrate a process for attaching and detaching a thin glass substrate and an auxiliary substrate .

4A to 4D are views illustrating a method of forming a concavo-convex pattern on a predetermined portion of an auxiliary substrate to facilitate the detachment between an auxiliary substrate and a thin glass substrate by alleviating an assisting force between the auxiliary substrate and the thin glass substrate .

As shown in FIG. 4A, a thin glass substrate 100 of about 0.1 t to 0.4 t and an auxiliary substrate 110 of about 0.7 t are prepared.

At this time, the thin glass substrate 100 may be a large-area mother substrate having a plurality of color filter substrates for a color filter process, or a large-area mother substrate having a plurality of array substrates for array processing.

Next, as shown in FIG. 4B, an uneven pattern 125 is formed on a part of the surface of the auxiliary substrate 110 so that the auxiliary substrate 110 can be easily attached and detached. 4B illustrates a case where the concavo-convex pattern 125 is formed on a part of the center of the auxiliary substrate 110, but the present invention is not limited thereto.

As the method of forming the concavo-convex pattern 125, inorganic insulating film patterning, organic insulating film patterning, low-temperature SiO2 etching, and laser patterning method are available.

When the concavo-convex pattern 125 is formed on the auxiliary substrate 110 as described above, as the surface roughness increases, the adhesion force due to contact with the thin glass substrate 100 can be weakened. Particularly, in this case, the concave / convex pattern 125 is formed on only a part of the surface of the auxiliary substrate 110, so that the concave / convex pattern 125 is formed in the area where the substrates 100 and 110 can contact each other. There is an advantage that desorption can be facilitated due to the formed region.

Next, as shown in FIG. 4C, the auxiliary substrate 110 on which the concavo-convex pattern 125 is formed is attached to the thin glass substrate 100. In this case, when the glass substrate 100 is used as the auxiliary substrate 110, the two glass substrates 100 and 110 are brought into contact with each other in a vacuum state. At this time, 100, and 110) can be estimated by electrostatic force, vacuum force, surface tension, and the like.

As described above, the process panel in a state in which the thin glass substrate 100 having a thickness of 0.1 t to 0.4 t and the auxiliary substrate 110 having a thickness of 0.3 t to 0.7 t are adhered is formed of a thin glass Since the substrate 100 and the auxiliary substrate 110 are made of the same glass material and have the same expansion rate according to the temperature change, there is no problem such as a warp due to the difference in the expansion ratio during the unit process.

Though the thin glass substrate 100 has a thickness of 0.1 t to 0.4 t itself, since the glass substrate 100 is bonded to the auxiliary substrate 110 to form a process panel, the occurrence of warpage is remarkably reduced, It is not a problem to proceed with the unit process for a liquid crystal display device.

Then, the color filter process or the array process is performed on the thin glass substrate 100 to which the auxiliary substrate 110 is attached to form a thin film transistor or a color filter layer as a driving device in each of the panel regions.

After completion of the predetermined process, the auxiliary substrate 110 is separated from the thin glass substrate 100 as shown in FIG. 4D. In the embodiment of the present invention, a part of the surface of the auxiliary substrate 110 And the auxiliary substrate 110 can be easily attached and detached.

The auxiliary substrate 110 detached from the thin glass substrate 100 can be attached to a new glass substrate and recycled for a new process.

However, the present invention is not limited to the above-described method of attaching the auxiliary substrate. The present invention can be performed in a vacuum state without an adhesive or a surface treatment for attaching the auxiliary substrate to the thin glass substrate, May be adhered in vacuum by electrostatic force, vacuum force, van der Waals force, surface tension, or the like.

Meanwhile, as will be described later, there is a method of lifting an auxiliary substrate or a thin glass substrate by holding the auxiliary substrate or the upper portion of the glass substrate with a vacuum pad by a desorption method applicable to the above, The formation of the concavo-convex pattern makes it possible to facilitate the desorption because the combined force between the two substrates is not large. At this time, air can be injected while making a gap between the auxiliary substrate and the thin glass substrate with a knife to facilitate the desorption.

After the auxiliary substrate is attached to the thin glass substrate in this way, the thin glass substrate for the array substrate to which the above-described auxiliary substrate is attached (hereinafter referred to as an array substrate for convenience of explanation) is arrayed on the array substrate A plurality of gate lines and data lines defining a pixel region are formed, and a thin film transistor, which is a driving element connected to the gate line and the data line, is formed in each of the pixel regions (S102). In addition, a pixel electrode connected to the thin film transistor through the array process and driving the liquid crystal layer as a signal is applied through the thin film transistor is formed.

Further, a thin glass substrate for a color filter substrate (hereinafter, referred to as a color filter substrate for convenience of description) to which the above-described auxiliary substrate is attached is provided with red, green and blue sub-color filters And a common electrode are formed (S103). At this time, when an in-plane switching (IPS) liquid crystal display device is manufactured, the common electrode is formed on the array substrate on which the pixel electrode is formed through the array process.

Then, after aligning films are printed on the color filter substrate and the array substrate, alignment control force or surface fixing force (that is, pretilt angle and orientation) is applied to the liquid crystal molecules of the liquid crystal layer formed between the color filter substrate and the array substrate Direction) of the alignment film is rubbed (S104, S105).

A sealing material is applied to the rubbed color filter substrate to form a predetermined seal pattern, and a liquid crystal layer is formed by dropping liquid crystal on the array substrate (S106, S107).

On the other hand, the color filter substrate and the array substrate are formed on a large-sized mother substrate. In other words, a plurality of panel regions are formed on each of the large-sized mother substrate, and a thin film transistor or color filter layer serving as a driving element is formed on each of the panel regions.

At this time, the dropping system dispenses liquid crystal to an image display area of a large-area first mother substrate on which a plurality of array substrates are arranged or a second mother substrate on which a plurality of color filter substrates are arranged using a dispenser, And the liquid crystal is uniformly distributed over the entire image display area by the pressure for attaching the first and second mother substrates to each other, thereby forming a liquid crystal layer.

Therefore, when the liquid crystal layer is formed on the liquid crystal panel through the dropping method, the seal pattern must be formed in a closed pattern surrounding the periphery of the pixel region so as to prevent the liquid crystal from leaking out of the image display region.

The dropping method can drop the liquid crystal in a shorter time than the vacuum injection method, and even when the liquid crystal panel is enlarged, the liquid crystal layer can be formed very quickly. In addition, since only a necessary amount of liquid crystal is dropped onto the first mother substrate, it is possible to prevent an increase in the price of the liquid crystal panel due to the disposal of expensive liquid crystal such as a vacuum injection system, thereby enhancing the price competitiveness of the product.

Thereafter, the first mother substrate and the second mother substrate are bonded together by applying a pressure in a state in which the first mother substrate and the second mother substrate, to which the liquid crystal is dropped and the sealing material is coated, are aligned, The liquid crystal dropped by application of pressure is uniformly spread over the liquid crystal panel (S108). By this process, a plurality of liquid crystal panels having a liquid crystal layer are formed on the first and second large-sized mother substrates, and the first and second large-sized mother substrates on which the plurality of liquid crystal panels are formed are separated from the auxiliary substrate Then, the liquid crystal panel is processed, cut and separated into a plurality of liquid crystal panels, and each liquid crystal panel is inspected to manufacture a liquid crystal display device (S109, S110).

In this case, as described above, the present invention is characterized in that an edge portion between an auxiliary substrate and a thin glass substrate is detached with a knife, air is injected therebetween through an air knife to separate an auxiliary substrate from the liquid crystal panel, If a push-pin region is formed by using a corner cut formed at the edge of the substrates, it is easy to separate the auxiliary substrate by the knife and air injection, which will be described in detail with reference to the drawings.

FIGS. 5A and 5B are plan views schematically showing first and second auxiliary substrates and first and second mother substrates having corner cuts formed according to the present invention. FIG.

5C is a plan view schematically showing first and second mother boards in which first and second auxiliary boards having corner cuts formed thereon are attached to each other and a push pin region is formed according to the present invention.

Referring to the drawings, as described above, in the present invention, a glass substrate having a thickness of 0.1 t to 0.4 t, that is, a first and a second mother substrate 101 or 102, The first auxiliary substrate 110a and the second auxiliary substrate 110b having the same thickness as the first auxiliary substrate 110a and the second auxiliary substrate 110b can be moved or unitized It is possible to prevent problems such as deflection of the glass substrate during the process.

At this time, the corners of the first and second mother substrates 101 and 102 and the auxiliary substrate 110 to which the plurality of liquid crystal panels 103 are allocated are cut at a predetermined inclined angle This is called a corner cut.

Particularly, at least two edges of the first and second mother boards 101 and 102 are cut inward in comparison with the first and second auxiliary boards 110a and 110b for directional distinction and post-processing The edge portions of the first and second auxiliary substrates 110a and 110b are exposed in accordance with the first and second auxiliary substrates 110a and 110b in order to start the separation process of the first and second auxiliary substrates 110a and 110b Can be used as the push pin regions (A, B).

At this time, the contact surface of the push pin for starting the separation process of the first and second auxiliary substrates may have an O-ring shape, for example, and the push method is as follows.

First, the first and second auxiliary substrates are attached, and the first and second mother boards are loaded. After the first and second mother boards are aligned with the push pins, the push pins are moved from the fixed state to the upper state.

In the state where the separate pushing process is not performed, misalignment may occur during the pushing process, so that the corners of the thin first and second mother board and the first and second auxiliary substrates may be broken.

In addition, the O-ring type push pin has a small contact area with the first and second auxiliary substrates, so that the pushing process can proceed unstably.

Thus, in another example of the present invention, the shape of the push pin for forming the edge desorption start point is optimized to the shape of the push pin area, and the push method is established, which will be described in detail with reference to the drawings.

6A to 6D are sectional views showing, for example, a push pin shape applied to the push pin region A according to the present invention.

7A to 7D are sectional views showing, for example, a push pin shape applied to another push pin region B according to the present invention.

Referring to the drawings, at least two corners of the thin first and second mother substrates 101 and 102 are formed on the first and second auxiliary substrates 110a and 110b for directional distinction and post- The corner portions of the first and second auxiliary substrates 110a and 110b are exposed as the cutting is performed in the inward direction compared to the first and second auxiliary substrates 110a and 110b. May be used as the push pin regions A and B to which the push pins 130a to 130d, 130a 'to 130d' are applied for starting.

At this time, the contact surfaces of the push pins 130a to 130d, 130a 'to 130d' are formed in the shape of the exposed push pin regions A and B so as to maximize the contact area with the exposed push pin regions A and B, For example, a triangle, a combination of a circle and a triangle, or a square or a circle.

8A and 8B are perspective views showing, for example, a method of recognizing the ends of a thin glass substrate or auxiliary substrate, showing a method of increasing the success rate of the push pin application process and reducing misalignment to stabilize the desorption process.

8A illustrates a method of recognizing the ends of the first and second auxiliary boards. FIG. 8B illustrates a method of recognizing the ends of the first and second mother boards.

First, as shown in FIG. 8A, the end P 'of the first and second auxiliary substrates 110a and 110b is recognized through observation equipment (not shown) such as a charge-coupled device (CCD) camera do.

Subsequently, the push pins 130 are moved in the x-axis and the y-axis in consideration of the position of the end P 'of the recognized first and second auxiliary substrates 110a and 110b, Alternatively, as shown in FIG. 8B, the end P "of the first and second mother boards 101 and 102 is recognized through observation equipment (not shown) such as a CCD camera.

Then, the push pins 130 are moved on the -x axis and the -y axis in consideration of the position of the end P "of the recognized first and second mother boards 101 and 102, and aligned.

Figs. 9A to 9C are perspective views showing, for example, a method of pushing a push pin after recognizing the ends of a thin glass substrate or an auxiliary substrate.

After aligning the push pins by recognizing the ends of the first and second mother substrates and the first and second auxiliary substrates by the above-described method, as shown in FIG. 9A, the aligned push pins 130 May be moved in the z-axis direction to start the separation process of the first and second auxiliary substrates 110a and 110b.

As another example, as shown in FIG. 9B, the aligned push pins 130 are alternately moved in the z-axis direction and the -z axis direction to separate the first and second auxiliary substrates 110a and 110b (Pulse method).

As another example, as shown in FIG. 9C, the aligned push pins 130 are alternately moved in the z-axis direction and the -z axis direction, and the movement distance is sequentially increased and moved, 2 auxiliary substrates 110a and 110b may be started (sequential pulse method).

Hereinafter, the entire process of separating the auxiliary substrate from the liquid crystal panel in the cell state in which the process is completed is described in detail with reference to the drawings.

10 is a flowchart showing an example of a separation process of the auxiliary substrate according to the first embodiment of the present invention.

11 is a plan view schematically showing the lower structure of the desorption apparatus according to the present invention.

FIGS. 12A and 12B are views schematically showing the construction of a knife according to the present invention, and FIGS. 13A to 13D are views showing the shape of a blade in the knife shown in FIGS. 12A and 12B, for example.

FIG. 14 is a view illustrating an example of the sequence of the edge detachment process using the knife according to the present invention, and FIG. 15 is another example showing the sequence of the edge detachment process using the knife according to the present invention .

16A to 16P are diagrams for illustrating sequential steps of separating an auxiliary substrate in a method of manufacturing a lightweight thin liquid crystal display device according to a first embodiment of the present invention.

16A, the first and second mother boards 101 and 102 after completion of the process are connected to the first and second auxiliary boards 110a and 110b, The first and second mother boards 101 and 102 are loaded on the table 190 of the desorption apparatus (S111). The first and second mother boards 101 and 102 are separated from the first and second mother boards 101 and 102, respectively. .

At this time, the first and second mother boards 101 and 102 are connected to each other in a state in which the second mother board 102 on which the color filter boards are formed on the first mother board 101 on which the TFT array substrates are formed, . However, the present invention is not limited thereto. The first and second mother boards 101 and 102 may include a first mosquito board 102 having thin film transistor array substrates formed on a second mother substrate 102 on which color filter substrates are formed, The plate 101 may be in a laminated state.

In this case, the first mother substrate 101 on which the thin film transistor array substrates are formed and the second mother substrate 102 on which the color filter substrates are formed may be formed of a thin glass substrate having a thickness of about 0.1 t to 0.4 t, The first mother substrate 101 and the second mother substrate 102 are subjected to a predetermined plasma process or a pattern of concavo-convex pattern to form a first auxiliary substrate (about 0.3 to 0.7t) 110a and a second auxiliary substrate 110b may be attached. However, the present invention is not limited to the thicknesses of the first and second mother substrates 101 and 102 and the first and second auxiliary substrates 110a and 110b.

The attachment of the thin first and second mother substrates 101 and 102 and the first and second auxiliary substrates 110a and 110b can be achieved by bringing the two substrates 101, 110a, 102 and 110b into contact with each other in a vacuum state. The combined force between the two substrates 101, 110a, 102, and 110b can be estimated by an electrostatic force, a vacuum force, a surface tension, or the like.

At this time, for example, the first and second mother boards 101 and 102 are loaded on the table 190 with the second auxiliary board 110b to be separated upward, A vacuum pad unit consisting of a plurality of vacuum pads 140 and a vacuum pad plate 145 for supporting the vacuum pads 140 is installed on the upper part of the mother substrate 101,

11, the detachable device includes left and right (or front and rear) ends of the table 190 for separating the first and second auxiliary substrates 110a and 110b, And an air knife 162 arranged longitudinally between the first and second knives 150a and 150b and the first and second knives 150a and 150b.

The desorption apparatus includes an LM guide (linear motion guide) 163 for linear motion of the first and second knives 150a and 150b and the air knife 162, A servo motor 164 and a cable veyor 165 for transmitting power.

Although not shown in the drawing, the desorption apparatus includes first and second mother boards 101 and 102 loaded on a table 190, an align unit for aligning the vacuum pad unit with the first and second mother boards 101 and 102, And a vacuum chuck for fixing the aligned first and second mother boards 101 and 102. The vacuum puck transfer unit may include a vacuum chuck for moving the first and second mother boards 101 and 102,

The first and second mother boards 101 and 102 loaded on the table 190 of the thus configured desorption apparatus are aligned with the upper vacuum pad unit through the above-described alignment unit (S112).

Next, as shown in FIG. 16B, the contact surfaces of the first auxiliary substrate 110b and the second auxiliary substrate 110b are exposed using a push pin 130 having a triangular shape, a circular and triangular combination shape, and a rectangular or circular shape, The push pin region is pressed upward with a predetermined pressure to form a knife entry space between the second auxiliary substrate 110b and the thin glass substrate, that is, the second mother substrate 102 (S113-1).

Next, as shown in FIG. 16C, the first and second knives 150a and 150b are inserted into the edge spaces between the second auxiliary board 110b and the second mother board 102, that is, And the edge portions between the second auxiliary substrate 110b and the second mother substrate 102 are detached by moving the first and second knives 150a and 150b in the other direction in the table, Thereby securing an entry space (S113-2, S113-3).

At this time, by moving the first and second knives 150a and 150b and injecting air through the air holes provided in the first and second knives 150a and 150b, .

The air holes may be provided in the first and second knives 150a and 150b, but they may be installed separately from the first and second knives 150a and 150b.

12A and 12B, the first and second knives 150a and 150b have a knife blade 151 having a size of about 0.1t, a body 152 for storing the knife blade 151, And an extension 153 extending from the body 152 and surrounding the pipe 154.

The pipeline 154 is a path through which air to be introduced moves and the air that has been moved into the body 152 through the pipeline 154 is passed through an air pipe 155 to a plurality of air holes (Not shown). The air holes 157 are formed on the lower surface of the body 152. However, the present invention is not limited thereto, and the air holes 157 may be formed on the lower surface of the body 152, Or may be formed on the side surface.

13A to 13D, the knife blade 151 is fixed to the upper surface of the body 152 by a predetermined bolt 156. The shape of the knife blade 151 is rectangular, quadrangular, triangular, And the like.

The knife blade 151 may be formed of a plastic such as polyethylene terephthalate (PET) or high density polyethylene (HDPE) in addition to a metal such as SUS (Steel Use Stainless).

The edge portion desorption process using the first and second knives thus configured may be performed according to the procedure shown in FIG. 14 or FIG. However, the present invention is not limited to the order of the edge portion desorption process shown in FIG. 14 or FIG.

14, for example, when two knives are provided on the left and right of the front end of the table 190, one of the knives is moved in the longitudinal direction of the table 190 The one edge portion between the second mother substrate is removed, and the moved knife is returned to its original position. Thereafter, the two knives are moved in the horizontal direction (the second and third directions) of the table 190 to detach the upper and lower edge portions between the second auxiliary substrate and the second mother substrate, and the moved knife is returned to its original position do. 15, for example, when two knives are provided on the front and rear ends of the table 190, one knife at each of the front and rear ends is disposed in the longitudinal direction of the table 190 So that the left and right edge portions between the second auxiliary substrate and the second mother substrate are removed, and the moved knife is returned to its original position. Then, the upper and lower edge portions between the second auxiliary board and the second mother board are detached by moving the two knives by half in the horizontal direction (direction of?,? ',?, And?') Of the table 190, The knife is returned to its original position.

After the edge portion between the second auxiliary substrate and the second mother substrate is detached using the knife as described above, the vacuum pad plate 145 is lowered and the vacuum pad 140 is vacuumed The vacuum pad 140 is attached to the surface of the second auxiliary substrate 110b.

16A to 16H, the vacuum knife plate 145 is sequentially raised from the standby position of the vacuum pad plate 145 by 10 mm, 20 mm, And the air is sprayed into the space formed between the second auxiliary substrate 110b and the second mother substrate 102 to advance the detachment of the second auxiliary substrate 110b (S113-4). However, the present invention is not limited to the above-described method of attaching and detaching the second auxiliary substrate 110b.

Thereafter, as shown in FIG. 16I, the first and second mother boards 101 and 102, on which the second auxiliary board 110b is separated, are reversed up and down, and then on the table 190 of the desorption apparatus (S114).

That is, the first and second mother boards 101 and 102 are loaded on the table 190 with the first auxiliary board 110a to be separated upward, and the first and second mother boards The above-described vacuum pad unit is provided on the upper part of the housing 101, 102.

The first and second mother boards 101 and 102 loaded on the table 190 of the desorption apparatus are aligned with the upper vacuum pad unit through the above-described alignment unit (S115).

16J, the push pin region of the first auxiliary substrate 110a may be pressed upward by a predetermined pressure using the push pin 130 to form the first auxiliary substrate 110a, And a glass substrate, that is, a first mother substrate 101, is formed (S116-1).

Next, as shown in FIG. 16K, the first and second knives 150a and 150b are inserted into the edge spaces between the first auxiliary substrate 110a and the first mother substrate 101, that is, And the edge portions between the first auxiliary substrate 110a and the first mother substrate 101 are detached by moving the first and second knives 150a and 150b in the other direction of the table, Thereby securing an entry space (S116-2, S116-3).

At this time, by moving the first and second knives 150a and 150b and injecting air through the air holes provided in the first and second knives 150a and 150b, .

As described above, the air holes may be provided in the first and second knives 150a and 150b, but they may be installed separately from the first and second knives 150a and 150b.

The edge portion desorption process using the first and second knives 150a and 150b may be performed according to the procedure shown in FIG. 14 or FIG. However, the present invention is not limited to the order of the edge portion desorption process shown in FIG. 14 or FIG.

14, for example, when two knives are provided on the left and right of the front end of the table 190, one knife is moved in the longitudinal direction of the table 190 1 auxiliary substrate and the first mother substrate, and the moved knife is returned to its original position. Thereafter, the two knives are moved in the horizontal direction (the directions of [2] and [3]) of the table 190 to detach the upper and lower edge portions between the first auxiliary substrate and the first mother substrate, and the moved knife is returned to its original position do. 15, for example, when two knives are provided on the front and rear ends of the table 190, one knife at each of the front and rear ends is disposed in the longitudinal direction of the table 190 The left and right edge portions between the first auxiliary substrate and the first mother substrate are removed, and the moved knife is returned to its original position. Thereafter, the upper and lower edge portions between the first auxiliary substrate and the first mother substrate are detached by moving the two knives by half in the horizontal direction (direction 2, 2, 3, and 3 ') of the table 190, The knife is returned to its original position.

After the edge portion between the first auxiliary substrate 110a and the first mother substrate 101 is detached using the knife, the vacuum pad plate 145 is lowered and the vacuum pad The vacuum pad 140 is attached to the surface of the first auxiliary substrate 110a.

The vacuum pad plate 145 is sequentially raised to the standby position of 10 mm, 20 mm, ..., and the vacuum pad plate 145 as shown in FIGS. 16L to 16P, And the air is sprayed into the space formed between the first auxiliary substrate 110a and the first mother substrate 101 to advance the first auxiliary substrate 110a (S116-4). However, the present invention is not limited to the above-described method of attaching and detaching the first auxiliary substrate 110a.

As described above, in the method of manufacturing a lightweight thin liquid crystal display device according to the first embodiment of the present invention, the edge portion between the thin glass substrate and the auxiliary substrate is detached and the air is injected therebetween through the air knife, The auxiliary substrate can be easily separated from the liquid crystal panel in the cemented cell state. As a result, the process can be stabilized and the price competitiveness of the product can be improved.

In addition, the method of manufacturing a lightweight thin liquid crystal display device according to the first embodiment of the present invention can improve the success rate of the push pin application process by optimizing the shape of the push pin for forming the edge desorption start point. As a result, damage to the thin glass substrate and the auxiliary substrate is reduced when the auxiliary substrate is detached.

On the other hand, in the case of the above-described first embodiment of the present invention, the edge portion is detached through the movement of the knife before the attachment and detachment of the auxiliary substrate through the vacuum pad unit and the air knife, The foreign object can be physically removed. For reference, when the detaching of the auxiliary substrate using the air knife is progressed while the edge detachment using the knife is not progressed, the possibility of the substrate being damaged due to the increase of the curvature of the auxiliary substrate due to the strong air injection for desorption is increased do.

In this case, if the foreign matter remains before removal of the auxiliary substrate, the substrates, particularly the thin glass substrate, may be damaged during the detachment of the auxiliary substrate through the vacuum pad unit and the air knife. That is, the foreign matter is a residual material that is penetrated between the auxiliary substrate and the thin glass substrate by the chemical solution used in the color filter process, the array process or the cell process, and acts as an adhesive for holding the auxiliary substrate and the thin glass substrate And the adhesion of foreign matter is stronger than the electrostatic adhesion force, so that an unbalanced point of force is generated at the time of desorption, thereby causing breakage of the thin glass substrate.

In the second embodiment of the present invention, in addition to the physical removal of the foreign object by using the knife, foreign matter adhered between the auxiliary substrate and the thin glass substrate is removed in advance by using a laser or a thin film or liquid nitrogen It is possible to eliminate defects due to foreign substances when the auxiliary substrate is detached, which will be described in detail with reference to the drawings.

17 is a flowchart schematically showing a method of manufacturing a lightweight thin-type liquid crystal display device according to a second embodiment of the present invention.

17 illustrates a method of manufacturing a liquid crystal display device in a case where a liquid crystal layer is formed by a liquid crystal dropping method. However, the present invention is not limited to this, The present invention is also applicable to a liquid crystal display device manufacturing method for forming a liquid crystal layer.

The manufacturing process of the liquid crystal display device can be largely divided into a driving element array process for forming driving elements on the lower array substrate, a color filter process for forming a color filter on the upper color filter substrate, and a cell process.

As described above, in the present invention, an array process, a color filter process, and a cell process are performed using a thin glass substrate having a thickness of about 0.1 t to 0.4 t. At this time, a thin glass substrate is attached to an auxiliary substrate, Thereby minimizing the influence of the warping of the thin glass substrate and preventing the breakage of the thin glass substrate during movement.

First, an auxiliary substrate of about 0.3 t to 0.7 t is attached to the above-mentioned thin glass substrate of 0.1 t to 0.4 t before a thin glass substrate of 0.1 t to 0.4 t is put into a manufacturing line of an array process and a color filter process (S201). However, the present invention is not limited to the thicknesses of the thin glass substrate and the auxiliary substrate.

The adhesion between the thin glass substrate and the auxiliary substrate can be achieved by bringing the two substrates into contact in a vacuum state. The combining force between the two substrates can be estimated by electrostatic force, vacuum force, surface tension, or the like.

At this time, the present invention can easily detach and attach the auxiliary substrate to and from the thin glass substrate by forming a plasma treatment or an irregular pattern using fluorine or the like on the auxiliary substrate to alleviate the bonding force. However, the present invention is not limited to the above-described method of attaching the auxiliary substrate. The present invention can be performed in a vacuum state without an adhesive or a surface treatment for attaching the auxiliary substrate to the thin glass substrate, May be adhered in vacuum by electrostatic force, vacuum force, van der Waals force, surface tension, or the like.

After the auxiliary substrate is attached to the thin glass substrate, the array substrate to which the auxiliary substrate is attached is arranged on the array substrate by the array process to form a plurality of gate lines and data lines defining the pixel region, A thin film transistor, which is a driving element connected to the gate line and the data line, is formed in each of them (S202). In addition, a pixel electrode connected to the thin film transistor through the array process and driving the liquid crystal layer as a signal is applied through the thin film transistor is formed.

In addition, the color filter substrate having the auxiliary substrate described above forms a color filter layer composed of sub-color filters of red, green, and blue colors and a common electrode for realizing color by a color filter process (S203). At this time, when the transverse electric field type liquid crystal display device is manufactured, the common electrode is formed on the array substrate on which the pixel electrode is formed through the array process.

Subsequently, an alignment film is printed on each of the color filter substrate and the array substrate, and alignment regulating force or surface fixing force (i.e., pre-tilt angle and alignment direction) is provided to the liquid crystal molecules of the liquid crystal layer formed between the color filter substrate and the array substrate The alignment film is rubbed (S204, S205).

A sealing material is applied to the rubbed color filter substrate to form a predetermined seal pattern, and a liquid crystal layer is formed by dropping liquid crystal on the array substrate (S206, S207).

On the other hand, the color filter substrate and the array substrate are formed on a large-sized mother substrate. In other words, a plurality of panel regions are formed on each of the large-sized mother substrate, and a thin film transistor or color filter layer serving as a driving element is formed on each of the panel regions.

At this time, the dropping method drops and dispenses liquid crystal in an image display area of a large-area first mother substrate or a second mother substrate on which a plurality of color filter substrates are arranged using a dispenser, The liquid crystal layer is formed by uniformly distributing the liquid crystal in the entire image display area by the pressure of attaching the first and second mother substrates to each other.

Therefore, when the liquid crystal layer is formed on the liquid crystal panel through the dropping method, the seal pattern must be formed in a closed pattern surrounding the periphery of the pixel region so as to prevent the liquid crystal from leaking out of the image display region.

The dropping method can drop the liquid crystal in a shorter time than the vacuum injection method, and even when the liquid crystal panel is enlarged, the liquid crystal layer can be formed very quickly. In addition, since only a necessary amount of liquid crystal is dropped onto the substrate, an increase in the price of the liquid crystal panel due to disposal of expensive liquid crystal such as a vacuum injection method is prevented, thereby enhancing the price competitiveness of the product.

Thereafter, the first mother substrate and the second mother substrate are bonded together by applying a pressure in a state in which the first mother substrate and the second mother substrate, to which the liquid crystal is dropped and the sealing material is coated, are aligned, The liquid crystal dropped by the application of the pressure is uniformly spread over the liquid crystal panel (S208). By this process, a plurality of liquid crystal panels having a liquid crystal layer are formed on the first and second large-sized mother substrates, and the first and second large-sized mother substrates on which the plurality of liquid crystal panels are formed are separated from the auxiliary substrate Then, the liquid crystal panel is processed and cut, separated into a plurality of liquid crystal panels, and each liquid crystal panel is inspected to manufacture a liquid crystal display device (S209, S210).

At this time, the second embodiment of the present invention is characterized in that foreign matter existing on the side between the auxiliary substrate and the thin glass substrate is removed by using a laser or a thin film or liquid nitrogen before the attachment and detachment of the auxiliary substrate, After removing the auxiliary substrate, the auxiliary substrate is separated from the liquid crystal panel in substantially the same manner as the first embodiment of the present invention. Hereinafter, the process of removing the foreign substance and the auxiliary substrate will be described in detail with reference to the drawings.

FIG. 18 is a view illustrating an example of sequentially removing a foreign object and a separation step of an auxiliary substrate in a method of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG. 17, Since the desorption method starts from any one of the substrates and sequentially proceeds to all the substrates, a method of detecting the force of lifting the auxiliary substrate, that is, the pressure by the sensor, and locating the portion where the pressure suddenly increases, is removed .

That is, in the process of separating the first and second auxiliary substrates from the first and second mother substrates, the sensor senses the pressure when the vacuum pad or the vacuum pad is lifted (S211, S212). At this time, the pressure is sensed by the sensor along the direction of detachment.

At this time, it is determined whether there is an abnormality in the pressure sensed by the sensor. If there is an abnormality, an alarm indicating that a foreign object is generated and a foreign object occurrence are displayed on a monitor or the like (S213). The portion which is abnormal in the pressure sensed by the sensor is an unbalanced point of the force at the time of desorption, and is a portion having strong adhesive force by foreign matter.

At this time, if a foreign object is generated, the foreign object in the portion where the abnormality is detected by the pressure is removed using the laser (S214).

After the foreign object is removed as described above, the process of separating the first and second auxiliary substrates from the first and second bonded mother boards is continued (S236).

19 is a diagram illustrating another example of a process of manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG. 17, which sequentially shows removal of a foreign object and separation of an auxiliary substrate. In the inspection machine, the foreign object inspection is performed along the joint edge, and the part where the foreign object is generated is immediately removed.

For this purpose, foreign objects are inspected along the edges of the first and second auxiliary substrates attached to the first and second mother substrates through a predetermined inspection unit (S221).

At this time, if a foreign object is issued, an alarm and foreign object occurrence that a foreign object has occurred are displayed on a monitor or the like (S222). Then, the foreign object in the portion where the foreign object is detected is removed by using the laser. The foreign object inspection and removal process is performed on all the surfaces of the joint edge (S223).

After the foreign object removal is completed, the first and second auxiliary substrates are separated from the first and second mother substrates (S224).

FIG. 20 is a view illustrating another example of a process of manufacturing a lightweight thin LCD according to a second embodiment of the present invention shown in FIG. 17, which sequentially removes foreign objects and separates the auxiliary substrate. Foreign matter existing between the first and second auxiliary boards and the first and second mother boards is removed and the edges between the first and second auxiliary boards are removed.

First, the first and second mother boards are loaded onto the table of the desorption apparatus after the process is completed (S301).

At this time, as described above, the first and second mother substrates may be laminated with a second mother substrate on which color filter substrates are formed on a first mother substrate having thin film transistor array substrates formed thereon. However, the present invention is not limited thereto, and the first and second mother substrates may be stacked with a first mother substrate on which TFT array substrates are formed on a second mother substrate on which color filter substrates are formed.

At this time, the first mother substrate on which the thin film transistor array substrates are formed and the second mother substrate on which the color filter substrates are formed may be formed of a thin glass substrate having a thickness of about 0.1 t to 0.4 t. In this case, A first auxiliary substrate and a second auxiliary substrate each having a predetermined plasma process and a concavo-convex pattern formed on a glass substrate, that is, a first mother substrate and a second mother substrate, each having a thickness of about 0.3t to 0.7t, However, the present invention is not limited to the thicknesses of the thin first and second mother substrates and the first and second auxiliary substrates.

At this time, for example, the first and second mother boards are loaded on the table such that the second auxiliary board to be separated faces upward.

In this manner, the first and second mother boards loaded on the table of the desorption apparatus align the desorption apparatus with the alignment apparatus through the alignment unit (S302).

Next, the above-described push pin is used to press the exposed push-pin region of the second sub-substrate edge upward with a certain pressure to form a thin film film between the second auxiliary substrate and the thin glass substrate, Thereby forming a space (S303-1). However, the present invention is not limited thereto, and the process of forming the entrance space of the thin film may not be performed.

Next, a thin film having a thickness of 0.001 mm to 1.0 mm is introduced into the edge space between the second auxiliary substrate and the second mother substrate, that is, the thin film entering space, and the thin film is moved in one direction The foreign matter existing between the second auxiliary board and the second mother board is removed, and the edge portion between them is removed (S303-2, S303-3). However, the present invention is not limited thereto, and only the above-described foreign matter removing process may be performed.

In order to minimize damage such as scratches on substrates made of glass, the thin film is made of polyethylene terephthalate (PET) having a Mohs hardness of 3 or less, PVC (polyvinyl chloride), PE (polyethylene), PC ), LDPE (low density polyethylene), HDPE (high density polyethylene), and EVA (ethylene vinyl acetate).

When the thin film is thin, the auxiliary substrate is separated from the substrate when the physical strength is applied. Since the contact with the substrates is in the form of a plane, it is less likely to shake the substrates when the substrate is desorbed, .

At this time, air can be sprayed through the air holes provided in the thin film along with the movement of the thin film, so that the above-described foreign matter removing and edge desorption processes can be smoothly performed.

The air holes may be provided in the thin film, but they may be provided separately from the thin film.

After removing the foreign matter between the second auxiliary substrate and the second mother substrate by using the thin film and detaching the edge portion, the second auxiliary substrate is detached by using the thin film and the air jet (S303 -4). At this time, when only a thin film is used, strong force is required for desorption, and there is a fear of destruction of the substrates, so air blowing can also minimize destruction of substrates and improve desorption speed. In this case, since the first thin film gradually separates the second auxiliary substrate and the second air promotes the separation of the second auxiliary substrate, the air jetting pressure can be reduced compared to the first embodiment. Therefore, the curvature increase of the second auxiliary substrate for securing the air pass is also improved, and the possibility of destruction of the substrates due to the unevenness of the alignment can be lowered. However, the present invention is not limited to the desorption method using the thin film.

After the first and second mother substrates are separated from each other, the first and second mother substrates are reversed and then loaded on the table of the desorption apparatus (S304).

That is, the first and second mother boards are loaded on the table with the first auxiliary board to be separated upward.

The first and second mother boards loaded on the table of the desorption apparatus are aligned with the desorption apparatus through the above-described alignment unit (S305).

Thereafter, the above-described push pin is used to press the exposed push-pin area of the first sub-substrate edge upward with a certain pressure to form a thin film entrance space between the first auxiliary substrate and the thin glass substrate, (S306-1). However, the present invention is not limited to the above-described embodiments, and it is not necessary to proceed with the process of forming the entrance space of the thin film.

Next, the aforementioned thin film is introduced into the edge space between the first auxiliary substrate and the first mother substrate, that is, the thin film entering space, and the thin film is moved in the other direction in one direction of the table, Foreign objects existing between the substrate and the first mother substrate are removed, and the edges between them are removed (S306-2, S306-3). However, the present invention is not limited thereto, and only the above-described foreign matter removing process may be performed.

At this time, air can be sprayed through the air holes provided in the thin film along with the movement of the thin film, so that the above-described foreign matter removing and edge desorption processes can be smoothly performed.

As described above, the air holes may be provided in the thin film, but they may be installed separately from the thin film.

After removing the foreign matter between the first auxiliary substrate and the first mother substrate using the thin film and detaching the edge portion, the first auxiliary substrate is detached using the thin film and air jet (S306 -4). At this time, when the thin film alone is used as described above, a strong force is required for desorption, and there is a fear of destruction of the substrates, so air blowing can minimize the breakage of the substrates and improve the desorption speed. However, the present invention is not limited to the desorption method using the thin film.

FIG. 21 is a view illustrating another example of a process for manufacturing a lightweight thin liquid crystal display device according to a second embodiment of the present invention shown in FIG. 17, which sequentially removes foreign materials and separates an auxiliary substrate. Thereby weakening the adhesive force between the first and second auxiliary boards and the first and second mother boards.

First, the first and second mother boards are loaded onto the table of the desorption apparatus after the process is completed (S401).

At this time, for example, the first and second mother boards are loaded on the table such that the second auxiliary board to be separated faces upward.

In this manner, the first and second mother boards loaded on the table of the desorption apparatus are aligned with the desorption apparatus on the upper side through the above-described alignment unit (S402).

Next, liquid nitrogen at -196 占 폚 is jetted on the front surface of the second auxiliary substrate or between the second auxiliary substrate and the second mother substrate to weaken the adherence of foreign substances present, and then the thin film And the second auxiliary substrate is advanced by using air (S403-1, S403-2).

At this time, as a cooling material sprayed on the entire surface of the second auxiliary substrate or between the second auxiliary substrate and the second mother substrate, there is a possibility of causing heat shrinkage stress on foreign matters such as dry ice of -78.5 ° C in addition to the liquid nitrogen. A cooling substance of 10 DEG C or less can be used.

When liquid nitrogen is injected between the first and second auxiliary substrates and the first and second mother substrates, the substrates and the foreign matter are both cooled and shrunk. Since the heat shrinkage coefficients of the substrates and the foreign materials are different from each other, a stress is generated inside the foreign matter between the substrates, thereby reducing the adhesion of the foreign substances to the substrates.

If the liquid nitrogen treatment weakens the adherence of foreign matter, it may improve the breakage of the substrates upon desorption.

At this time, when a thin film is used only for the detachment of the second auxiliary substrate as described above, a strong force is required for detachment and there is a fear of destruction of the substrates. Therefore, the air jetting is also minimized, . However, the present invention is not limited to the desorption method using the thin film.

Then, the first and second mother boards are reversed upside down, and then loaded onto the table of the desorption apparatus (S404).

That is, the first and second mother boards are loaded on the table with the first auxiliary board to be separated upward.

The first and second mother boards loaded on the table of the desorption apparatus are aligned with the desorption apparatus on the upper side through the above-mentioned alignment unit (S405).

Thereafter, a cooling substance of -10 ° C or lower which can induce heat shrinkage stress on the foreign matter such as liquid nitrogen, dry ice or the like is sprayed on the entire surface of the first auxiliary substrate or the side between the first auxiliary substrate and the first mother substrate, (S406-1, S406-2), the adhesion of the foreign matter existing between the thin film and air is weakened.

FIG. 22 is a view showing another example of sequentially removing the foreign object and the auxiliary substrate in the method of manufacturing a light and thin liquid crystal display device according to the second embodiment of the present invention shown in FIG. 17, And the heat is applied to the first auxiliary substrate and the second auxiliary substrate to weaken the adhesive force of the foreign matter existing between the first and second mother substrates.

First, the first and second mother boards are loaded onto the table of the desorption apparatus after the process is completed (S501).

At this time, for example, the first and second mother boards are loaded on the table such that the second auxiliary board to be separated faces upward.

In this way, the first and second mother boards loaded on the table of the desorption apparatus are aligned with the desorption apparatus on the upper side through the above-mentioned alignment unit (S502).

Next, liquid nitrogen at -196 캜 is sprayed on the entire surface of the second auxiliary substrate or between the second auxiliary substrate and the second mother substrate, and heat is applied to the lower portion including the second mother substrate, After the adhesion is weakened, the second auxiliary substrate is detached using the thin film and air described above (S503-1, S503-2).

At this time, as a cooling material sprayed on the entire surface of the second auxiliary substrate or between the second auxiliary substrate and the second mother substrate, there is a possibility of causing heat shrinkage stress on foreign matters such as dry ice of -78.5 ° C in addition to the liquid nitrogen. A cooling substance of 10 DEG C or less can be used. In addition, heat corresponding to a temperature between room temperature and 80 ° C may be applied to the lower part including the second mother substrate.

When the first and second auxiliary substrates having foreign substances are treated with liquid nitrogen and heat is applied to the lower portions thereof, that is, the first and second mother substrates, the first and second auxiliary substrates are cooled to shrink, The second mosquito plate is inflated. Therefore, stress is generated inside the foreign matter sandwiched between the substrates, and the adhesion of the foreign matter to the substrates can be expected to be lowered.

As described above, when only a thin film is used for detachment of the second auxiliary substrate, strong force is required for detachment, and there is a risk of destruction of the substrates. Therefore, air jetting is also performed in parallel to minimize substrate breakage and improve desorption rate . However, the present invention is not limited to the desorption method using the thin film.

After the first and second mother substrates are separated by the second auxiliary substrate, the first and second mother substrates are reversed and then loaded onto the table of the desorption apparatus (S504).

That is, the first and second mother boards are loaded on the table with the first auxiliary board to be separated upward.

The first and second mother boards loaded on the table of the desorption apparatus are aligned with the desorption apparatus on the upper side through the above-mentioned alignment unit (S505).

Thereafter, a cooling substance of -10 ° C or lower which can induce heat shrinkage stress on the foreign matter such as liquid nitrogen, dry ice or the like is sprayed on the entire surface of the first auxiliary substrate or between the first auxiliary substrate and the first mother substrate The heat corresponding to the temperature between room temperature and 80 ° C is applied to the first mother substrate to weaken the adhesion of the foreign substances present therebetween and then the first auxiliary substrate is detached using the thin film and air described above (S506-1, S506-2).

While a great many are described in the foregoing description, it should be construed as an example of preferred embodiments rather than limiting the scope of the invention. Therefore, the invention should not be construed as limited to the embodiments described, but should be determined by equivalents to the appended claims and the claims.

100: thin glass substrate 101: first mother board
102: second mother substrate 110, 110a, 110b:
140: Vacuum pad 145: Vacuum pad plate
150a, 150b: knife 162: air knife

Claims (45)

Advancing an array process on the first mother substrate to which the first auxiliary substrate is attached;
Performing a color filter process on a second mother substrate having a second auxiliary substrate attached thereto;
Attaching a first mother board on which the array process is performed and a second mother board on which the color filter process is performed;
Loading the first and second bonded mother boards onto a table of desorption equipment;
Detaching an edge portion between the second auxiliary board and the second mother board using the first and second knives;
Separating the second auxiliary substrate from the first and second mother substrate;
Inverting the first and second mother boards with the second auxiliary board separated;
Detaching an edge portion between the first auxiliary substrate and the first mother substrate using the first and second knives; And
And separating the first auxiliary substrate from the first and second bonded mother boards,
Wherein the first mother substrate and the second mother substrate expose a push pin region of the auxiliary substrate, respectively,
Wherein the step of detaching the edge portion between the first auxiliary substrate and the first mother substrate and the step of detaching the edge portion between the second auxiliary substrate and the second mother substrate are performed using a push pin, And forming a knife entrance space by applying a predetermined pressure to the light guide plate. The method of claim 1, wherein the push pin region is formed at an edge of the first and second mother substrates. [3] The apparatus according to claim 2, wherein edges of the first and second auxiliary boards and the first and second mother boards are cut at an oblique angle to form corner cuts, Wherein at least two corners of the mother substrate are further cut inward than the corners of the first and second auxiliary substrates. delete [2] The apparatus according to claim 1, wherein the first and second knives are introduced into the knife entry space between the second auxiliary substrate and the second mother substrate, and the first and second knives are moved in one direction Wherein the edge portion between the second auxiliary substrate and the second mother substrate is detached. 6. The method of claim 5, wherein the desorption apparatus comprises a plurality of vacuum pads and a vacuum pad plate for moving the vacuum pads up and down. 7. The method of claim 6, further comprising attaching the plurality of vacuum pads to the surface of the second auxiliary substrate after detaching the edge portion between the second auxiliary substrate and the second mother substrate, A method of manufacturing a lightweight thin type liquid crystal display device. 8. The method of claim 7, wherein the vacuum pad or the vacuum pad plate is raised to form an air knife entrance space between the second auxiliary substrate and the second mother substrate. The method as claimed in claim 8, wherein the air knife is introduced into the air knife entering space formed between the second auxiliary substrate and the second mother substrate, and air is sprayed from the first mother substrate to the second mother substrate, And separating the liquid crystal display device from the liquid crystal display device. [12] The method of claim 9, further comprising: pushing up the push pin region with a predetermined pressure using a push pin, after vertically inverting the first and second mother substrate from which the second auxiliary substrate is separated, Further comprising the step of forming a knife entry space between the first mother substrate and the first mother substrate. The apparatus according to claim 10, wherein first and second knives are introduced into a knife entry space between the first auxiliary substrate and the first mother substrate, and the first and second knives are moved from one direction to the other Wherein the edge portion between the first auxiliary substrate and the first mother substrate is detached. 12. The method of manufacturing a lightweight thin-type liquid crystal display device according to claim 11, wherein air is injected through the air holes provided in the first and second knives with movement of the first and second knives. 13. The method of claim 12, further comprising attaching the plurality of vacuum pads to the surface of the first auxiliary substrate after detaching the edge between the first auxiliary substrate and the first mother substrate, A method of manufacturing a lightweight thin type liquid crystal display device. 14. The method of claim 13, wherein the vacuum pad or the vacuum pad plate is raised to form an air knife entry space between the first auxiliary substrate and the first mother substrate. The method as claimed in claim 9, wherein an air knife is introduced into an air knife entry space formed between the first auxiliary substrate and the first mother substrate, and air is injected to eject the first auxiliary substrate from the first and second mother substrates, And separating the liquid crystal display device from the liquid crystal display device. The liquid crystal display according to claim 15, wherein the first and second knives are located on the left and right sides of the table, and the air knife is arranged between the first and second knives in a longitudinal direction. Device manufacturing method. [17] The apparatus of claim 16, wherein the first and second knives include a metal such as SUS (Steel Use Stainless) or a knife blade made of plastic such as PET (polyethylene terephthalate) or HDPE (high density polyethylene) A method of manufacturing a lightweight thin type liquid crystal display device. The method according to claim 16, wherein when one of the first and second knives is installed at one end of the table, one of the knives is moved in the longitudinal direction of the table so that one edge between the second auxiliary board and the second mother board, Wherein the first auxiliary board and the first mother board are detached from the first mother board, and the first and second knives are returned to their original positions. The method as claimed in claim 18, wherein the first and second knives are moved in the horizontal direction of the table so that the upper and lower edge portions between the second auxiliary substrate and the second mother substrate or the upper and lower edge portions between the first auxiliary substrate and the first mother substrate And the first and second knives are returned to their original positions. The method of manufacturing a lightweight thin-type liquid crystal display device according to claim 1, The apparatus according to claim 16, wherein, when two first and second knives are provided on the front and rear ends of the table, one knife is moved in the longitudinal direction of the table, The left and right edge portions between the first mother substrate and the second mother substrate, and between the first mother substrate and the first mother substrate, and the moved first and second knives return to their original positions. A method of manufacturing a display device. The apparatus according to claim 20, wherein each of the two first and second knives is moved by half in the transverse direction of the table so that the upper and lower edge portions between the second auxiliary substrate and the second mother substrate, Wherein the upper and lower edge portions between the mother substrate and the mother substrate are removed, and the moved first and second knives are returned to their original positions. The method of claim 10, wherein the push pin has a triangular, circular, and triangular combination of contact surfaces contacting the push pin region, and a rectangular or circular shape. 23. The method of claim 22, further comprising, after forming the push pin region,
Recognizing the ends of the first and second auxiliary substrates through observation equipment such as a charge-coupled device (CCD) camera; And
Further comprising the step of moving the push pins in the x and y axes and aligning the push pins in a predetermined position in consideration of the positions of the ends of the recognized first and second auxiliary substrates. Way. 23. The method of claim 22, further comprising, after forming the push pin region,
Recognizing the ends of the first and second mother boards through an observation device such as a CCD camera; And
Further comprising the step of moving the push pins in the -x axis and the -y axis in consideration of the positions of the ends of the recognized first and second mother substrates, Device manufacturing method. A method according to any one of claims 23 and 24, wherein after aligning the push pins by recognizing the ends of the first and second mother substrates or the first and second auxiliary substrates, Wherein the second auxiliary substrate and the second mother substrate are separated from each other, and the edge portion between the second mother substrate and the first auxiliary substrate and the first mother substrate is detached. A method according to any one of claims 23 and 24, wherein after aligning the push pins by recognizing the ends of the first and second mother substrates or the first and second auxiliary substrates, Axis direction and the -z axis direction to detach the edge portions between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate, . A method according to any one of claims 23 and 24, wherein after aligning the push pins by recognizing the ends of the first and second mother substrates or the first and second auxiliary substrates, And the moving distance is sequentially increased and moved so that the edge portions between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate are removed Wherein the liquid crystal display device is a thin, lightweight, liquid crystal display device. The method of claim 1, further comprising: moving a thin film in place of the first and second knives in an edge space between the second auxiliary substrate and the second mother substrate, moving the thin film in one direction of the table, And removing the foreign matter existing between the second auxiliary substrate and the second mother substrate and removing the edge portions therebetween. 29. The method of claim 28, further comprising: advancing a thin film in place of the first and second knives in a corner space between the first auxiliary substrate and the first mother substrate, moving the thin film in one direction of the table, And removing the foreign matter existing between the first auxiliary substrate and the first mother substrate and removing the edge portions therebetween. 29. The method of claim 28, wherein the thin film has a thickness of 0.001 mm to 1.0 mm. 29. The method of claim 28, wherein the thin film comprises a material selected from the group consisting of polyethylene terephthalate (PVC), polyvinyl chloride (PE), polyethylene (PE), polycarbonate, low density polyethylene (LDPE) density polyethylene, and ethylene vinyl acetate (EVA). < Desc / Clms Page number 19 > The method of manufacturing a lightweight thin-type liquid-crystal display device according to claim 29, wherein air is sprayed through the air holes provided in the thin film together with the movement of the thin film to perform a process of removing foreign substances and an edge portion. 33. The method of manufacturing a lightweight thin-type liquid crystal display device according to claim 32, wherein separation of the second auxiliary substrate or the first auxiliary substrate is performed using the thin film and the air jet. 29. The method according to claim 28, wherein the cooling material is sprayed onto the second auxiliary substrate or the front surface of the first auxiliary substrate or between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate, And separating the second auxiliary substrate or the first auxiliary substrate by using a thin film and air instead of the first and second knives, Gt; 29. The method according to claim 28, wherein the cooling material is sprayed onto the entire surface of the second auxiliary substrate or the first auxiliary substrate or between the second auxiliary substrate and the second mother substrate or between the first auxiliary substrate and the first mother substrate, And then separating the second auxiliary substrate or the first auxiliary substrate by using a thin film and air instead of the first and second knives. A method of manufacturing a liquid crystal display device. 36. The method of claim 35, wherein heat corresponding to a temperature between room temperature and 80 deg. C is applied to the lower portion including the first and second mother substrates. The method of any one of claims 34 and 35, wherein the cooling material includes a cooling material at -10 캜 or less which can induce heat shrinkage stress on the foreign object. The method according to claim 1, further comprising: moving the first and second knives in a space between the second auxiliary board and the second mother board, or between the first auxiliary board and the first mother board along the direction in which the edge portion is advanced / And removing the foreign substance physically by moving the liquid crystal display panel. 15. The method of claim 14, further comprising sensing a pressure of the vacuum pad or the vacuum pad plate when the vacuum pad or the vacuum pad plate is lifted by a sensor in a process of separating the second auxiliary substrate or the first auxiliary substrate. Of the liquid crystal display device. 41. The method of claim 39, further comprising the step of: determining whether an abnormality is detected in the pressure sensed by the sensor, and displaying an alarm and / A method of manufacturing a display device. 41. The method according to claim 40, wherein when foreign matter is generated, the separation of the second auxiliary substrate or the first auxiliary substrate is continued after removal of foreign matter in a portion where an abnormality has been detected using a laser, A method of manufacturing a thin liquid crystal display device. The method of claim 1, further comprising the step of inspecting foreign objects along the edges of the second auxiliary substrate, the second mother substrate, the first auxiliary substrate, and the first mother substrate. Device manufacturing method. The method of manufacturing a lightweight thin-type liquid crystal display device according to claim 42, further comprising the step of displaying on the monitor an alarm and an occurrence of a foreign object indicating that a foreign object has been generated when foreign objects are generated. 45. The method of claim 43, further comprising the steps of: removing foreign objects from a portion where foreign objects have been detected using a laser; and performing such foreign object inspection and removal processes on the second and third mother substrates, The method of manufacturing a lightweight thin-type liquid crystal display device according to claim 1, 45. The method of manufacturing a lightweight thin-type liquid crystal display device according to claim 44, wherein after the removal of the foreign material, the separating step of the second auxiliary substrate or the first auxiliary substrate is performed.

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