KR101918203B1 - Laser Processing Apparatus and Method - Google Patents

Abstract

The present invention relates to a laser oscillator comprising a laser oscillating section for oscillating a laser beam, a guide section arranged in a traveling path of the laser beam so as to adjust the path and size of the laser beam, a laser beam passing through the guide section for shaping the laser beam into different shapes And an image forming unit arranged on a progress path of the laser beam passing through the variable optical unit so as to form a focal point of the laser beam on the substrate. In the adjustment of the size of the laser beam according to the size of the defect, A laser processing apparatus capable of reducing energy loss and a laser processing method applied thereto are proposed.

Description

[0001] DESCRIPTION [0002] LASER PROCESSING APPARATUS AND METHOD [

The present invention relates to a laser processing apparatus and method, and more particularly, to a laser processing apparatus and method capable of reducing energy loss in adjusting the size of a laser beam according to the size of a defect.

Various display devices include electronic circuits formed on a substrate. During manufacturing of these electronic circuits, some of the conductive lines of the electronic circuit may be short-circuited or overlapped. A signal line such as an electrode, a wiring, or a signal line of each device formed on a substrate during a process of manufacturing a display device such as an LCD (Liquid Crystal Display), an OLED (Organic Light Emitting Display) There is a case where a defect is generated due to overlapping. If a defect is generated on the substrate, the pixel formed on the substrate can not form a correct image. Therefore, a process of cutting the overlapping signal lines so as not to overlap each other is performed, which is referred to as repair.

On the other hand, in the case of display devices such as LCDs, OLEDs, and LEDs, as the number of pixels realized per unit area increases, the number of elements driving these pixels becomes smaller, and the line width of signal lines connecting the elements becomes thinner. Accordingly, the defects generated on the substrate are also very small, on the order of several micrometers.

That is, in order to repair defects formed in a small size of about several micrometers, the size of the laser beam irradiated to the defects on the substrate must be reduced to about several micrometers. In order to repair defects of a size as small as several micrometers, a laser beam oscillated to a size of, for example, several millimeters is passed through a slit and adjusted to a size of hundreds to several hundreds of micrometers, Pass through the objective lens. After passing through the objective lens, the laser beam is focused on defects on the substrate to a size of about several micrometers to repair defects.

At this time, a laser beam of several millimeters passes through a slit having a size as small as hundreds to several hundreds of micrometers, the laser beam is diffracted, and the laser beam is spread by diffraction, so that the shape of the phase is not maintained during image formation.

Also, the size of the laser beam passing through the slit is about one hundred to several hundreds of microns, whereas a considerable amount of energy can not be used for repairing the defect, and the laser beam is lost at the slit.

Techniques that serve as the background of the present invention are disclosed in the following patent documents.

KR 10-1560378 B1 KR 10-2014-0099404 A

The present invention provides a laser processing apparatus and method capable of reducing energy loss in adjusting the size of a laser beam.

The present invention provides a laser processing apparatus and method capable of adjusting the size of a laser beam by selectively using an imaging optical system and a focusing optical system in one apparatus.

A laser processing apparatus according to an embodiment of the present invention is an apparatus capable of processing a substrate by using a laser beam, the apparatus comprising: a laser oscillation section for oscillating a laser beam; A guide disposed in a path of the laser beam so as to adjust the path and size of the laser beam; A variable optical part disposed in a traveling path of the laser beam passing through the guide part so as to allow the laser beam to be shaped in different shapes; And an imaging element disposed on a path of the laser beam that has passed through the variable optical portion so as to form a focus of the laser beam on the substrate.

Wherein the guide unit comprises: a laser mirror arranged to guide a laser beam emitted from the laser oscillation unit to the variable optical unit; And a slit arranged to adjust the size of the laser beam guided by the laser mirror.

Wherein the variable optical unit includes: a plurality of optical systems capable of shaping laser beams into different shapes; And a driver for selectively positioning the plurality of optical systems in the progress path of the laser beam.

The plurality of optical systems includes a first optical system formed to be capable of shaping a laser beam whose path and size are adjusted to a focusing beam; And a second optical system configured to adjust the path-adjusted laser beam into a parallel beam and to be adjustable in size.

The first optical system may include a tube lens portion, and the second optical system may include a collimator lens portion.

The variable optical unit may include a variable optical system capable of shaping the laser beam into different shapes.

Wherein the variable optical system includes: a first lens unit that is formed to be capable of shaping a laser beam into a convergent beam, and that is disposed in a traveling path of the laser beam; A second lens unit positioned on a traveling path of the laser beam toward the first lens unit and capable of forming a collimator lens unit together with the first lens unit; And a driver for selectively positioning the second lens unit on the path of the laser beam directed toward the first lens unit.

The first lens unit may include a tube lens unit, and the second lens unit may include a concave lens unit.

A laser processing method according to an embodiment of the present invention includes: a process of oscillating a laser beam; Adjusting a path of the laser beam; A step of shaping the laser beam using a variable optical part capable of shaping the laser beam into different shapes; And irradiating the substrate with the laser beam to process defects of the substrate.

A step of adjusting a size of the laser beam during a process of adjusting the path of the laser beam and a process of shaping the laser beam, and a step of shaping the laser beam, To form a focused beam.

The step of shaping the laser beam may include a step of shaping the path-adjusted laser beam into a parallel beam and adjusting its size.

According to the embodiments of the present invention, in repairing defects of various sizes formed on a substrate with one apparatus, the size of the laser beam can be adjusted by selectively using the focusing optical system and the focusing optical system depending on the size of the defect . At this time, when the size of the laser beam is reduced to several micrometers corresponding to the small size defect, energy loss can be remarkably reduced by adjusting the size of the laser beam using the focal optical system. Further, when the size of the laser beam is adjusted to a size of several tens of micrometers or more corresponding to a relatively large size defect, the size of the laser beam can be easily adjusted by adjusting the size of the laser beam using the imaging optical system, Size defects can be efficiently repaired. Thus, defects of various sizes can be seamlessly repaired to one device without loss of energy or waste.

1 is a block diagram of a laser processing apparatus according to an embodiment of the present invention.
2 is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention.
3 is a schematic view of a laser processing apparatus according to a modification of the present invention.
4 is a first operation diagram of a laser processing apparatus according to an embodiment of the present invention.
5 is a second operation diagram of the laser processing apparatus according to the embodiment of the present invention.
6 is a first operation diagram of a laser processing apparatus according to a modification of the present invention.
7 is a second operational diagram of a laser processing apparatus according to a modification of the present invention.
FIG. 8 is a photograph of an image forming form of a laser beam according to an embodiment of the present invention.
9 is a photograph of a slit according to a comparative example of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but may be embodied in various forms. It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS The drawings may be exaggerated for purposes of describing embodiments of the present invention, wherein like reference numerals refer to like elements throughout.

FIG. 1 is a block diagram showing a laser processing apparatus according to an embodiment of the present invention, FIG. 2 is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention, and FIG. 3 is a block diagram of a laser processing apparatus according to a modification of the present invention Fig.

FIG. 4 is a first operational view of the laser processing apparatus according to the embodiment of the present invention, FIG. 5 is a second operational view of the laser processing apparatus according to the embodiment of the present invention, and FIG. FIG. 7 is a second operational diagram of a laser processing apparatus according to a modification of the present invention. FIG.

FIGS. 8A and 8B are photographs of different imaging forms of the laser beam according to the embodiment of the present invention, and FIGS. 9A and 9B are photographs of slits In which the laser beam is diffracted.

1 to 7, a laser processing apparatus according to an embodiment of the present invention includes a laser oscillation unit 100 for oscillating a laser beam, a laser oscillation unit 100 disposed in a path of the laser beam for adjusting the path and size of the laser beam, A variable optical portion 300 disposed in a path of the laser beam that has passed through the guide portion 200 so as to allow the laser beam to be shaped in different shapes, a focal point of the laser beam on the substrate 10 And a concave portion 400 disposed on a path of the laser beam that has passed through the variable optical portion 300 so as to be formed.

The laser processing apparatus according to the embodiment of the present invention includes an observation unit 500 disposed in the path of the laser beam toward the imaging unit 400 in the variable optical unit 300 to acquire an image of the substrate 10, For example, a stage (not shown) disposed on the path of the laser beam passing through the substrate 400 to support the substrate 10.

The laser processing apparatus according to the embodiment of the present invention may be a device for repairing defects of the substrate 10 and irradiating the substrate 10 with laser beams of various sizes to irradiate the substrate 10 in various ways Or may be a device capable of performing various processing and processing including repairing the substrate 10 by irradiating a laser beam with a fine size of about several micrometers.

The substrate 10 may be various plates in which processes for manufacturing electronic devices, conductive pattern lines, and the like are in progress or terminated. For example, the substrate 10 may be a TFT (Thin Film Transistor) substrate in which a process for manufacturing an OLED is in progress, and may include a gate line, a data line, a pixel, and a thin film transistor. Of course, the substrate 10 may be a variety of substrates in which processes for manufacturing various display devices are in progress or terminated. The substrate 10 may be supported on the support portion 600. The substrate 10 and the concave portion 400 may be provided so as to be movable relative to each other. For example, the supporting part 600 may be movably installed, or the imaging part 400 may be installed to be movable by a gantry (not shown) or the like. The substrate 10 can be processed in various ways by a laser beam.

The laser oscillating unit 100 can oscillate the laser beam L. [ The laser oscillating unit 100 can oscillate laser beams having different wavelengths using one or a plurality of sources and can oscillate laser beams having wavelengths of 1064 nm, 532 nm, 355 nm, and 266 nm, for example, The laser beam may be a very early stage laser beam such as a femtosecond laser or a pico second laser for processing or processing the substrate 10. [ The manner in which the laser oscillation unit 100 oscillates the laser beam and the wavelength of the laser beam oscillated in the laser oscillation unit 100 may be varied as described above. A flat top lens (not shown) may be provided at an end of the laser oscillating unit 100, and the energy of the laser beam may be relatively evenly distributed.

The guide unit 200 is disposed in the path of the laser beam so as to adjust the path and size of the laser beam. The guide unit 200 can adjust the size of the laser beam guided by the laser mirror 210 and the laser mirror 210 arranged to guide the laser beam emitted from the laser oscillation unit 100 to the variable optical unit 300 (Not shown).

The laser mirror 210 reflects the laser beam to change the traveling path. The laser mirrors 210 may be arranged in a predetermined position that can guide the laser beam oscillated in the laser oscillating unit 100 to the slits 220 by a variety of numbers. The number and position of the laser mirrors 210 are not particularly limited.

The slit 220 may be disposed in a traveling path of the laser beam reflected by the laser mirror 210 and directed to the variable optical system 300 to adjust the size and shape of the laser beam. That is, the slit 220 can adjust the size of the transmitted laser beam.

Meanwhile, the laser beam oscillated in the laser oscillating unit 100 may have a size of several millimeters, and it may be adjusted to a desired size in the slit 220. For example, when the laser beam is adjusted to a size of hundreds to several hundreds of micrometers, There are many. Particularly, when the laser beam is adjusted to a size of about 150 mu m at the slit 220, the diffraction of the laser beam at the slit 220 may occur.

Therefore, in the embodiment of the present invention, if the focal length of the laser beam to be formed on the substrate 10 corresponding to the focal size of the laser beam to be formed on the substrate 10 is a small size of about several micrometers, ) Is fully opened to allow the laser beam to pass through. At this time, the laser beam is shaped into a parallel beam at the variable optical part 300, adjusted to a size of hundreds to several hundreds of micrometers, and then guided to the imaging part 400. So that energy loss of the laser beam is prevented and diffraction can be prevented. Also, in this case, it is possible to repair defects of a relatively small size precisely.

Further, in the embodiment of the present invention, when the focal size of the laser beam to be formed on the substrate 10 corresponds to the focal size of the laser beam to be formed on the substrate 10, After the size of the laser beam is adjusted, the laser beam is guided to the variable optical portion 300, the laser beam is shaped into a converging beam at the variable optical portion 300, and then guided to the concave portion 400. In this case, the size and shape of the laser beam can be easily adjusted, for example, defects of relatively large size can be easily repaired.

The guiding unit 200 includes a slit beam splitter 230 disposed between the laser mirror 210 and the slit 220 so as to be positioned in the path of the laser beam, And a slit-viewing illuminator 240 for providing a slit-viewing illumination.

Slit observation illumination is generated from the slit observation illuminator 240 toward the slit observation beam splitter 230 and the slit observation illumination is reflected by the slit observation beam splitter 230 and guided to the slit 220 . It is possible to confirm whether or not the slit 220 is well aligned with the objective lens 410 of the image formation part 400 by a CCD camera (not shown) for observing the slit, The alignment can be adjusted so as to be aligned with the lens 410.

The slit-viewing beam splitter 230 is movably installed and is disposed in the path of the laser beam before or after the processing of the substrate 10 and can be removed from the path of the laser beam during processing of the substrate 10 have.

The variable optical unit 300 can be disposed in the path of the laser beam that has passed through the guide unit 200 so that the laser beam L can be shaped in different shapes. The variable optical unit 300 may include a plurality of optical systems capable of shaping the laser beam into different shapes and a driver (not shown) for selectively positioning the plurality of optical systems in the progress path of the laser beam. The plurality of optical systems includes a first optical system 310 configured to form a laser beam whose path and size is adjusted to be a focusing beam, a second optical system 310 configured to shape a path-adjusted laser beam into a parallel beam, (Not shown).

The first optical system 310 includes a tube lens portion 311 and can be shaped into a focusing beam while fixing the shape of the laser beam whose size and shape are adjusted and determined while passing through the slit 220. At this time, the convergent beam means a laser beam that travels in the traveling direction and is collected at a predetermined angle?. The slit 220, the first optical system 310, and the objective lens 410 of the imaging element 400 are referred to as an imaging optical system. The focusing optical system can adjust the focal size of the laser beam formed on the substrate 10 using the slit 220. In the embodiment of the present invention, the substrate 10 can be efficiently processed or processed using an imaging optical system when the focal size of the laser beam formed on the substrate 10 is adjusted to a size of several tens of micrometers or more.

The second optical system 320 may include a collimator lens portion. At this time, the collimator lens portion may be composed of a combination of the concave lens portion 322 and the tube lens portion 321. The second optical system 320 collimates the path-adjusted laser beam while passing through the guide unit 200, and can adjust the size of the laser beam to a size of hundreds to several hundreds of 탆 while shaping the parallel beam. Thus, the laser beam can be guided to the objective lens 410 without loss of energy. The second optical system 320 and the objective lens 410 are referred to as a focal optical system. The focal optical system can prevent the energy loss when forming the focal point of the laser beam with a fine size of several micrometers and can prevent the diffraction at the time of adjusting the size of the laser beam. Thus, the substrate 10 can be finely processed or processed. On the other hand, the structure of the beam expander in the second optical system 320 may be used.

The first optical system 310 and the second optical system 320 are selectively disposed on the progress path of the laser beam while being moved by the actuator, and the structure and the manner of the actuator for this purpose are not particularly limited.

Meanwhile, the laser processing apparatus according to a modification of the present invention includes a variable optical unit 300, which includes a variable optical system 330 that can form laser beams differently. The variable optical system 330 includes a first lens unit that is formed to be capable of shaping a laser beam into a convergent beam and that is disposed in a traveling path of the laser beam, a second lens unit that is positioned on a traveling path of the laser beam toward the first lens unit, A second lens unit capable of forming a collimator lens unit together, and a driver (not shown) for selectively positioning the second lens unit on the path of the laser beam toward the first lens unit.

At this time, the first lens unit may include a tube lens unit 331, and the second lens unit may include a concave lens unit 332. Of course, the configuration of each lens unit for constituting the collimator lens unit may be various other than this.

In the modified example of the present invention, it is referred to as an imaging optical system including a slit 220, a tube lens portion 331, and an objective lens 410. The technical features of the imaging optical system according to the modification correspond to the technical features of the imaging optical system of the embodiment.

For example, when the variable optical system 330 functions as an imaging optical system, the second lens unit is removed from the path of the laser beam, and the laser beam passes through the slit 220 using the tube lens unit 331, It is possible to form the beam with the focusing beam while fixing the shape of the beam. The substrate 10 can be efficiently processed or processed by using an imaging optical system when adjusting the focal size of the laser beam formed on the substrate 10 to a size of several tens of micrometers or more.

In a modification of the present invention, a concave lens portion 332, a tube lens portion 331, and an objective lens 410 are referred to as a focus optical system. The technical features of the focal optical system of the modified example correspond to the technical features of the focal optical system of the embodiment.

For example, when the variable optical system 330 functions as a focusing optical system, the second lens unit is positioned on the progress path of the laser beam to constitute a collimator lens unit. The collimator lens unit passes through the guide unit 200, The size of the laser beam can be adjusted to a size of hundreds to several hundreds of micrometers while the beam is collimated and shaped into the shape of a parallel beam. Thus, the laser beam can be guided to the objective lens 410 without loss of energy, and the focal point of the laser beam can be formed at a size of several mu m in the objective lens 410 to process or process the substrate 10 in a minute size And it is possible to prevent the diffraction at the time of adjusting the size of the laser beam.

On the other hand, the configuration and the method of the actuator for moving the second lens unit to selectively position the laser beam in the path of the laser beam are not particularly limited.

The imaging element 400 is disposed in the path of the laser beam that has passed through the variable optical portion 300 to form a focal point of the laser beam on the substrate. The imaging element 400 includes an objective lens 410, a first beam splitter 420, a second beam splitter 430, an autofocuser 440, a reflective illumination mirror 450 and a reflective illuminator 460 .

The objective lens 410 compresses the laser beam to have a high energy density, irradiates it onto the substrate 10, and forms a focal point of the laser beam on the substrate 10. That is, the objective lens 410 can focus the laser beam and irradiate the substrate 10. The objective lens 410 may selectively use a plurality of lenses having different magnifications to adjust the magnification of the laser beam to several to several tens of magnifications. For example, the objective lens 410 may focus the laser beam at a fifty magnification, but it is not particularly limited thereto. The substrate 10 can be processed by the focus of the laser beam formed on the substrate 10.

The reflective illuminator 460 produces illumination for viewing the substrate 10 and the reflective illumination mirror 450 directs illumination for viewing the substrate 10 to the first beam splitter 420. The first beam splitter 420 passes a laser beam for processing the substrate 10 and reflects the illumination for observing the substrate 10 and guides it to the substrate 10. [ The autofocuser 440 receives the image of the substrate 10 guided by the first beam splitter 420 and the second beam splitter 430 and corrects the focus of the objective lens 410. At this time, the manner in which the auto-focus unit 440 corrects the focus of the objective lens 410 is not particularly limited.

On the other hand, the first beam splitter 420 can pass the illumination reflected from the substrate 10 and the second beam splitter 430 can pass the illumination reflected from the substrate 10 while observing the substrate 10 To pass through the lighting.

The observation unit 500 may include a CCD camera 510, a cutoff filter 520, an image mirror 530, an image tube lens 540, an infrared filter 550 and a third beam splitter 560.

The illumination for observing the substrate 10 is generated in the reflective illuminator 460 and then reaches the substrate 10 via the reflective illumination mirror 450, the second beam splitter 430 and the first beam splitter 420 do. The light reflected from the substrate 10 is guided from the third beam splitter 560 to the infrared filter 550 after passing through the first beam splitter 420 and then passes through the image tube lens 540, ) And the cutoff filter 520, and can be imaged into an image after reaching the CCD camera 510. Thus, the process of the substrate 10 can be observed in real time. That is, the substrate 10 can be processed while viewing the image.

Here, the cutoff filter 520 cuts a laser beam that can enter the CCD camera 510, and the image tube lens 540 has a function of cutting off the laser beam from the substrate 10 by the illumination transmitted through the objective lens 410 It serves to image the image at a certain position. The third beam splitter 560 may pass a laser beam for processing of the substrate 10.

A laser processing method according to an exemplary embodiment of the present invention includes a process of oscillating a laser beam, a process of adjusting a path of a laser beam, a process of shaping the laser beam using a variable optical part capable of shaping the laser beam into different shapes, And irradiating the substrate with a laser beam to process defects of the substrate.

First, the laser beam is oscillated. The laser oscillation unit 100 oscillates a laser beam of a desired wavelength. Thereafter, the path of the laser beam is adjusted using the laser mirror 210. At this time, may be a number of sizes (D ₀₎ ㎜ of the laser beam, for example, it may be from 2 to 3㎜.

4 and 6, the laser beam is shaped using a variable optical part capable of shaping the laser beam into different shapes. At this time, the focal size of the laser beam L to be formed on the substrate 10 The size of the laser beam L can be adjusted by using the slit 220 between the process of adjusting the path of the laser beam and the process of shaping the laser beam. At this time, the size (D ₁ ) of the laser beam may be several hundreds of micrometers.

Thereafter, the laser beam is passed through the variable optical portion 300 to be shaped. For example, a path and a laser beam whose size is adjusted is shaped into a focusing beam. At this time, the size D ₃ of the laser beam can be reduced as the laser beam gradually converges to a predetermined angle?.

Thereafter, the laser beam is passed through the objective lens 410, compressed at several tens of magnifications, and irradiated onto the substrate. At this time, the laser beam focus size D may be several tens of micrometers or more. The focus shape at this time may be a shape as shown in FIG. 8 (a).

5 and 7, when the focal point size of the laser beam L to be formed on the substrate 10 is, for example, several micrometers, the slit 220 is completely opened, Passes through the variable optical portion 330 and is shaped into a parallel beam, and the size of the beam is adjusted. At this time, the size (D ₀ ) of the laser beam before passing through the slit 220 and the size (D ₁ ) of the laser beam after passing through the slit 220 may be the same, The size (D ₂ ) of the collimated beam may be, for example, 100 to several hundreds of micrometers.

Thereafter, the laser beam is passed through the objective lens 410, compressed at several tens of magnifications, and irradiated onto the substrate. The laser beam focus size D at this time may be several 占 퐉, for example, 5 to 3 占 퐉 or 1 占 퐉 or less. The focus shape at this time may be a spot shape as shown in Fig. 8 (b).

Then, the substrate 10 is irradiated with a laser beam to treat defects of the substrate 10. [ Although the laser processing method using the laser processing apparatus is exemplified in the embodiment of the present invention as described above, the processing method of the substrate using the laser processing apparatus may be various.

9 (a), when the size of the laser beam passing through the slit is a large size of several hundreds of micrometers or more, it can be seen that the laser beam passes well without diffraction. In FIG. 9 (b) The diffraction occurs when the size of the light beam passes through a size of about one hundred to two hundred micrometers.

Therefore, in the above-described embodiment of the present invention, when the size of the laser beam is to be transmitted to the variable optical portion corresponding to the focal size of the laser beam to be formed on the substrate, an imaging optical system is used. Thus, the substrate can be processed while adjusting the focal size and shape of the laser beam as desired.

On the other hand, when the variable optical portion needs to be transmitted with a small laser beam size, a focal optical system is used. Thus, energy loss can be prevented, and the substrate can be precisely processed by irradiating the laser beam in the form of a minute spot beam.

That is, one device can have different processing characteristics, and the efficiency of the process can be improved.

The above-described embodiments of the present invention are for the explanation of the present invention and are not intended to limit the present invention. In addition, it should be noted that the configurations and the methods disclosed in the above embodiments of the present invention may be combined or crossed with each other and modified into various forms, and these modifications may be considered as the scope of the present invention. That is, the present invention may be embodied in various forms without departing from the scope of the appended claims and equivalents thereto, and it is to be understood and appreciated by those skilled in the art that various changes in form and details may be made therein without departing from the spirit of the invention You will understand.

100: laser oscillation part 200: guide part
300: Variable optical part 400: Concave part

Claims (11)

A laser oscillation unit for oscillating a laser beam;
A guide disposed in a path of the laser beam so as to adjust the path and size of the laser beam;
A variable optical portion disposed in a path of the laser beam passing through the guide portion so as to allow the laser beam to be shaped in different forms including a focusing beam and a parallel beam; And
And an imaging element disposed on a path of the laser beam passing through the variable optical portion so as to form a focal point of the laser beam on the substrate,
The guide unit may include a slit for adjusting the size of the laser beam according to the focal size of the laser beam to be formed on the substrate and allowing the laser beam to pass therethrough,
The variable optical portion includes a variable optical system capable of shaping the laser beam passing through the slit in different shapes so that the guide portion, the variable optical portion, and the focusing portion selectively form an imaging optical system or a focusing optical system in the progress path of the laser beam and,
The variable optical system includes:
A first lens unit that is formed to be capable of shaping a laser beam into a focusing beam, and is disposed in a traveling path of the laser beam;
A second lens unit capable of forming a collimator lens unit in combination with the first lens unit and capable of shaping a laser beam into a parallel beam together with the first lens unit on the progress path of the laser beam toward the first lens unit, ; And
And a driver for selectively positioning the second lens unit on the path of the laser beam directed toward the first lens unit. The method according to claim 1,
The guide portion
And a laser mirror arranged to guide the laser beam oscillated in the laser oscillation section to the variable optical section,
Wherein the slit is disposed in a traveling path of a laser beam reflected by the laser mirror and directed to the variable optical system. The method according to claim 1,
The slit, the first lens unit, and the image forming unit form an imaging optical system in the traveling path of the laser beam when the focal size of the laser beam to be formed on the substrate is relatively large,
Wherein the first lens unit, the second lens unit, and the imaging unit form a focal optical system in the progress path of the laser beam when the focal size of the laser beam to be formed on the substrate is relatively small. delete delete delete delete The method according to claim 1 or 3,
Wherein the first lens unit includes a tube lens unit,
And the second lens unit includes a concave lens unit. A process of oscillating the laser beam;
Adjusting a path of the laser beam;
Adjusting a size of a laser beam passing through a slit disposed in a path of the laser beam according to a focus size of the laser beam to be formed on the substrate or passing the laser beam through the laser beam;
The first lens unit and the second lens unit are selectively combined in the progress path of the laser beam so as to selectively form an imaging optical system or a focusing optical system in the progress path of the laser beam and to shape the laser beam in different forms including a focusing beam and a parallel beam A step of shaping the laser beam using a variable optical system that can be used; And
And irradiating the substrate with the laser beam to process defects of the substrate. The method of claim 9,
The process of shaping the laser beam includes:
Forming a focused beam by passing only the laser beam whose size is adjusted in the slit through the first lens unit when the focal size of the laser beam to be formed on the substrate is relatively large;
Adjusting a size of the laser beam passing through the slit through the first lens unit and the second lens unit to form a parallel beam when the focal size of the laser beam to be formed on the substrate is relatively small; . delete

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