KR101880344B1 - Thermosetting resin composition, cured product thereof, and display member using the same - Google Patents

Abstract

An object of the present invention is to provide a thermosetting resin composition which is excellent in both insulation and heat resistance, can attain balanced balance of surface flatness, adhesion and curability at a high level and which is required both during high temperature insulation resistance and solvent resistance, And a member for a display using the same. In particular, the present invention provides a thermosetting resin composition, a cured product thereof, and a display member using the same, which is excellent in high temperature insulation resistance under stringent conditions during the manufacturing process.
(B) a silane coupling agent having a glycidyl group and a hydroxyl group; (c) at least one member selected from the group consisting of barium sulfate, silica and talc; and (d) Is a thermosetting resin composition containing a colorant. And a display member using the same.

Description

TECHNICAL FIELD [0001] The present invention relates to a thermosetting resin composition, a cured product thereof, and a display member using the thermosetting resin composition,

The present invention relates to a thermosetting resin composition capable of forming a cured product capable of achieving balance of surface flatness, adhesiveness and curability at a high level and capable of achieving high temperature insulation resistance and solvent resistance, and a thermosetting resin composition for a display Member.

In an electronic device having a display device (display) in recent years, when a display portion such as a liquid crystal or an organic EL is viewed from the user side, information or an image is not displayed on the entire surface of the transparent glass, A frame portion such as a black application portion or a white application portion is provided, and information is displayed inside this frame portion. In a variety of electronic apparatuses such as a portable telephone, a personal digital assistant, a notebook computer, a tablet computer, etc. in which a touch panel type input device (hereinafter, simply referred to as a "touch panel" A frame portion such as a black coating portion or a white coated portion is provided on the outer peripheral portion, and information is displayed inside this frame portion.

This frame portion is called a decorative portion, and has a function of dividing the display portion into a quadrangular shape and concealing a portion (a wiring portion for display, etc.) which is not desired to be seen. The decorative part is very important as an exterior decorative member of a portable terminal display unit, and is particularly important in terms of design, so that its coloring, adhesion, and curability can be balanced at a high level, There is also a demand for a thermosetting resin composition capable of forming a cured product which is compatible with high temperature insulation resistance and solvent resistance required for a processing process.

Conventionally, as such a thermosetting resin composition, for example, Patent Document 1 discloses a composition containing (A) a bismaleimide-triazine resin, (B) an epoxy resin, and (C) carbon black.

Japanese Patent Application Laid-Open No. 62-266805

In recent years, a level of adhesion required for a curable resin composition containing an epoxy resin has been increased, and in particular, a curable resin composition that is both excellent in both curability and adhesiveness and capable of achieving high temperature insulation resistance and solvent resistance has been required . However, the conventional curable resin composition disclosed in Patent Document 1 can achieve balance and good adhesion and curability at a high level, and is not compatible with high temperature insulation resistance and solvent resistance. Particularly, there was room for improvement in high-temperature insulation resistance under severe conditions such as higher temperature during the manufacturing process, depending on the difference in the usage pattern.

Accordingly, the present invention provides a thermosetting resin composition which is excellent in both insulation and heat resistance, can achieve balance in surface flatness, adhesion, and curability at a high level and is excellent in both high temperature insulation resistance and solvent resistance, And a display member using the same. In particular, it is an object of the present invention to provide a thermosetting resin composition, a cured product thereof, and a display member using the same, which is excellent in high temperature insulation resistance under stringent conditions during the manufacturing process.

The present inventors have intensively studied in order to solve the above problems and found that a composition containing a curable resin, a specific silane coupling agent, a specific filler, and a colorant is excellent in insulating property, heat resistance, adhesiveness and solvent resistance, .

That is, the present invention provides the following (1) to (5).

(C) at least one member selected from the group consisting of barium sulfate, silica and talc; and (d) at least one colorant selected from the group consisting of a colorant And a thermosetting resin composition.

(2) The thermosetting resin composition according to (1), wherein the silane coupling agent has at least one of a hydroxyl group and a methoxy group.

(3) The thermosetting resin composition according to (1) or (2), wherein the silane coupling agent has a structure represented by the following general formula (I).

(I)

(I)

Wherein R is a hydrogen atom or a methyl group, n is an integer of 1 to 3, R 'is - (CH ₂ ) _i -O- (CH ₂ ) _j -, i and j are each independently 1 to 5 Integer)

(4) A cured product of the thermosetting resin composition according to any one of (1) to (3), which is formed on a substrate.

(5) A member for a display, which comprises the cured product described in (4) above.

INDUSTRIAL APPLICABILITY The present invention provides a thermosetting resin composition which is excellent in insulation and heat resistance and can achieve balanced balance of surface flatness, adhesion and curability at a high level, and which can form a cured product capable of achieving both high temperature insulation resistance and solvent resistance Composition can be provided. In addition, it is possible to provide a thermosetting resin composition excellent in high-temperature insulation resistance under stringent conditions during the production process. Further, the thermosetting resin composition of the present invention is preferable as a decorative ink used in a display device.

(B) a silane-based coupling agent having a glycidyl group and a hydroxyl group; and (c) a silane coupling agent having a carboxyl group such as barium sulfate, silica (Hereinafter, also referred to as an " insulating filler ") selected from the group consisting of talc and talc, and (d) a colorant.

Hereinafter, each component used in the composition of the present invention will be described in detail.

[(A) Curable resin]

The thermosetting resin composition of the present invention comprises (a) a curable resin, and examples of the curable resin include an epoxy resin, a carboxyl group-containing resin, and a silicone resin. Of these, at least one of the epoxy resin and the carboxyl group-containing resin is preferable because of the combination of the glycidyl group and the silane coupling agent having a hydroxyl group, from the viewpoint of maintaining various characteristics while exhibiting high-temperature insulation resistance.

The epoxy resin as the curable resin is preferably a component for imparting heat resistance and preferably contains an epoxy compound having an aromatic skeleton. Only one epoxy compound having an aromatic skeleton may be used, or two or more epoxy compounds may be used in combination. Of these, novolak type epoxy resins are preferable because they are excellent in heat resistance. From the viewpoint of further enhancing the adhesion between the glass substrate and the molded article, the epoxy compound preferably contains an epoxy compound having an alicyclic skeleton. The epoxy compound having an alicyclic skeleton may be used alone, or two or more epoxy compounds may be used in combination. A modified epoxy resin may also be used in combination.

Examples of the epoxy compound having an aromatic skeleton include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, cresol novolak type epoxy compounds, phenol novolac type epoxy compounds, glycine obtained by reacting polybasic acid compound having aromatic skeleton with epichlorohydrin A cydyl ester type epoxy compound, and a glycidyl ether type epoxy compound having an aromatic skeleton. From the standpoint of further increasing the strength and heat resistance of the molded article, it is preferable that the epoxy compound having an aromatic skeleton has a bisphenol skeleton or novolak skeleton.

The epoxy equivalent of the epoxy compound having an aromatic skeleton is preferably 100 or more and 1000 or less. When the epoxy equivalent is 100 or more, the moldability of the curable composition is further improved. When the epoxy equivalent is less than 1,000, the strength of the molded article is further increased.

Specific examples of the epoxy compound having an alicyclic skeleton include 2- (3,4-epoxy) cyclohexyl-5,5-spiro- (3,4-epoxy) cyclohexane-m-dioxane, 3,4- Cyclohexenylmethyl-3 ', 4'-epoxycyclohexene carboxylate, dicyclopentadienedioxide, vinylcyclohexene monoxide, 1,2-epoxy-4-vinylcyclohexane, Epoxycyclohexylmethyl) butane tetracarboxylate, 2,2-bis (hydroxymethyl) -1-butanol, 1,2-epoxy-1,4- - (2-oxiranyl) cyclohexane adduct and the like. From the standpoint of further increasing the heat resistance of the molded article, the epoxy compound having an alicyclic skeleton is preferably a 1,2-epoxy-4- (2-oxiranyl) cyclohexane-adduct of 2,2-bis (hydroxymethyl) Water is preferred.

Examples of commercially available epoxy compounds having an alicyclic skeleton include alicyclic epoxy resins such as alicyclic epoxy resins exemplified by Celloxide 2021, Celloxide 2021A, Celloxide 2021P, Celloxide 2081, Celloxide 2000 and Celloxide 3000 manufactured by Daicel Chemical Industries, Epoxy, epoxy (meth) acrylate compounds such as Cychroma A200, Cychroma M100, methacrylate having a methyl glycidyl group such as MGMA, and Sara Cure manufactured by Dow Chemical Company. But are not limited thereto.

The compounding amount of the epoxy compound is suitably adjusted so as to suitably cure by the application of heat, and is not particularly limited. The amount of the epoxy compound to be blended is preferably 5 parts by mass or more and 60 parts by mass or less, more preferably 5 parts by mass or more and 30 parts by mass or less, based on 100 parts by mass of the total amount of the thermosetting resin composition in terms of solid content. When the compounding amount of the epoxy compound is within the above range, the curing composition is more effectively cured by heating, and the heat resistance of the molded article is further increased.

The carboxyl group-containing resin as the curable resin is a component for thermosetting a carboxyl group and an epoxy group in the resin, and specific examples include the resins listed below.

(1) a carboxyl group-containing copolymer resin obtained by copolymerizing at least one unsaturated carboxylic acid such as (meth) acrylic acid with a compound having another unsaturated double bond,

(2) a copolymer of an unsaturated carboxylic acid such as (meth) acrylic acid with one or more of other unsaturated double bond-containing compounds, glycidyl (meth) acrylate or 3,4- epoxycyclohexylmethyl Containing resin obtained by adding an ethylenically unsaturated group as a pendant with a compound having an epoxy group and an unsaturated double bond such as (meth) acrylate or (meth) acrylic acid chloride,

(3) a copolymer of a compound having an unsaturated double bond with an epoxy group such as glycidyl (meth) acrylate or 3,4-epoxycyclohexylmethyl (meth) acrylate and a compound having an unsaturated double bond other than the above Containing resin obtained by reacting an unsaturated carboxylic acid such as (meth) acrylic acid with a polybasic acid anhydride to the produced secondary hydroxyl group,

(4) An unsaturated double bond is added to a copolymer of an acid anhydride having an unsaturated double bond such as maleic anhydride and a compound having other unsaturated double bond, such as 2-hydroxyethyl (meth) A carboxylic acid-containing resin obtained by reacting a compound having a carboxyl group,

(5) a carboxyl group-containing resin obtained by reacting a polyfunctional epoxy compound with an unsaturated monocarboxylic acid and reacting the resulting hydroxyl group with a saturated or unsaturated polybasic acid anhydride,

(6) a carboxyl group-containing resin obtained by reacting a saturated or unsaturated polybasic acid anhydride with a hydroxyl group-containing polymer such as a polyvinyl alcohol derivative, and then reacting the resultant carboxylic acid with a compound having an epoxy group and an unsaturated double bond in one molecule,

(7) A process for producing a reaction product of a polyfunctional epoxy compound, an unsaturated monocarboxylic acid, at least one alcoholic hydroxyl group in a molecule, and a compound having one reactive group other than an alcoholic hydroxyl group reacting with an epoxy group, with a saturated or unsaturated polybasic acid anhydride A carboxyl group-containing resin obtained by reacting a carboxyl group-

(8) A method for producing a carboxyl group-containing polymer, which comprises reacting an unsaturated monocarboxylic acid with a multifunctional oxetane compound having at least two oxetane rings in a molecule and reacting a saturated or unsaturated polybasic acid anhydride with the primary hydroxyl group in the obtained modified oxetane resin Containing resin, and

(9) A process for producing a carboxylic acid-containing resin obtained by reacting a polyfunctional epoxy resin with an unsaturated monocarboxylic acid and then reacting the polybasic acid anhydride with a compound having one oxirane ring and at least one ethylenic unsaturated group in the molecule, And a carboxyl group-containing resin obtained by subjecting a carboxyl group-containing resin to a polymerization reaction.

Among these examples, preferred are the carboxyl group-containing resins (2), (5), (7) and (9) above, and the carboxyl group-containing resin of the above (5) is particularly preferable in view of the thermosetting property and the cured coating property . Herein, (meth) acrylate is generically referred to as acrylate, methacrylate and a mixture thereof, and the same applies to other similar expressions hereinafter.

The acid value of the carboxyl group-containing resin is preferably in the range of 10 to 150 mgKOH / g, and more preferably in the range of 30 to 120 mgKOH / g. When the acid value of the carboxyl group-containing resin is 10 mgKOH / g or more, the adhesiveness becomes better. When the acid value is 150 mgKOH / g or less, the thermal stability of the cured product is further improved.

The weight average molecular weight of the carboxyl group-containing resin varies depending on the resin skeleton, but is generally in the range of 1,000 to 30,000, more preferably 5,000 to 20,000. When the weight average molecular weight is 1000 or more, the tackfree performance becomes higher and the hardness of the cured product becomes more sufficient. When the weight average molecular weight is 20,000 or less, adhesion and curability can be achieved in a more balanced manner.

The blending amount of such a carboxyl group-containing resin is preferably 25 to 60 parts by mass, more preferably 25 to 50 parts by mass, based on 100 parts by mass of the whole thermosetting resin composition in terms of solid content. When the amount is 25 parts by mass or more, the curability becomes more sufficient. When the amount is 50 parts by mass or less, the viscosity becomes optimum and the coatability and the like are not lowered.

The silicone resin as the curable resin generally has poor adhesion when it contains titanium oxide, so that it is possible to balance the adhesion and the curability by the addition of the silicone resin. Particularly, by adding the following linear silicone resin and crosslinkable silicone resin, it is possible to obtain still better adhesion, curability and heat resistance.

The linear silicone resin is a silicone resin having a structure represented by the following general formula (II) and having silanol groups at both terminals. By the linear silicone resin, it is possible to impart even better high-temperature crack resistance.

(II)

(II)

(Wherein R represents a linear or branched alkyl group having 1 to 12 carbon atoms, and n is an integer with a viscosity of 10 to 100 cp)

The linear silicone resin can be used without problems if it is a linear silicone resin having the structure of the above general formula (II) and having silanol groups at both ends. Examples of commercially available products include YF3800, XF3905, YF3057, YF3807, YF3802, YF3897, XC96-723, and 2D Silanol Fluid manufactured by Momentive Performance Materials, Inc.

The molecular weight of the linear silicone resin is not particularly limited, but if it is too large, the handling property may become poor due to high viscosity. Therefore, it is preferable to adjust the molecular weight to 10 to 100 cp, To 70 cp. The weight average molecular weight of the linear silicone resin is preferably in the range of 300 to 8000, more preferably 400 to 7000.

The crosslinkable silicone resin is not particularly limited, and any of a heat curing type silicone resin and a room temperature curing type silicone resin can be used. The cross-linkable silicone resin can provide better solvent resistance.

The weight average molecular weight of the crosslinkable silicone resin is preferably in the range of 5,000 to 50,000, more preferably 10,000 to 30,000. If the weight average molecular weight is 5000 or more, the hardness of the cured product becomes more sufficient. When the weight average molecular weight is 50,000 or less, adhesion and curability can be more balanced.

Examples of the crosslinkable silicone resin include commercially available products such as SR2400, SR2410, SR2411, SR2510, SR2405, 840RESIN and 804RESIN (all trade names, manufactured by Toray Dow Corning), KR271, KR272, KR274, KR216, KR280, (All trade names, manufactured by Shin-Etsu Silicone Co., Ltd.), TSR127B, YR3370 (all trade names, manufactured by Shin-Etsu Silicones Co., Ltd.), KR- (Trade name, manufactured by Momentive Performance Materials Co., Ltd.). Of these, one type may be used alone, or two or more types of resins may be used in combination.

[(B) Silane coupling agent having a glycidyl group and a hydroxyl group]

The thermosetting resin composition of the present invention includes a silane-based coupling agent having a glycidyl group and a hydroxyl group. By using a silane coupling agent having a glycidyl group and a hydroxyl group in combination with the curable resin, excellent high temperature insulation resistance can be obtained even under severe conditions during the production process.

The silane coupling agent preferably has at least any one of a hydroxyl group and a methoxy group, more preferably a structure represented by the following general formula (I).

(I)

(I)

Wherein R is a hydrogen atom or a methyl group, n is an integer of 1 to 3, R 'is - (CH ₂ ) _i -O- (CH ₂ ) _j -, i and j are each independently 1 to 5 Integer)

More preferably, in the silane coupling agent, i in R 'in the formula (I) is 1, j is 3, and the carbon atom on the j side bonds to Si in the formula (I).

As the silane coupling agent, a silane coupling agent having at least any one of a hydroxyl group and a methoxy group and having the structure of the general formula (I) can be used without any problem. Commercially available products include, for example, CoatOSil MP 200 (trade name, manufactured by Momentive Performance Materials, Inc.).

The molecular weight of the silane coupling agent is not particularly limited, but it is preferable to adjust the molecular weight to 0.003 m 2 / s or less. More preferably, it is 0.001 m 2 / s or less.

The blending amount of the glycidyl group and the silane coupling agent having a hydroxyl group is preferably 1 to 20 parts by mass, more preferably 2 to 15 parts by mass based on 100 parts by mass of the entire thermosetting resin composition in terms of solid content. When the compounding amount of the silane coupling agent is 20 parts by mass or less, the printability (coatability) is improved.

Further, the thermosetting resin composition of the present invention can be used in combination with other silane-based coupling systems. The other silane coupling agents are not particularly limited, and examples thereof include epoxy silane coupling agents, aminosilane coupling agents, cationic silane coupling agents, vinylsilane coupling agents, acrylsilane coupling agents, mercaptosilane coupling agents, Based coupling agents and complex-based coupling agents thereof.

Examples of commercially available products of other silane coupling agents include KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM- 603, KBM-903, KBE-903, KBE-9103, KBM-9103, KBM-573, KBM-573, KBM-503, KBE- KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846 and KBE-9007 (all trade names, manufactured by Shinetsu Silicones), Silquest A- -187 (both trade names, manufactured by Momentive Performance Materials Co., Ltd.). These may be used alone or in combination of two or more.

[(C) at least one of barium sulfate, silica, and talc]

(C) at least one insulating filler selected from the group consisting of barium sulfate, silica and talc used in the thermosetting resin composition of the present invention not only improves high temperature insulation resistance of the cured product but also improves the surface flatness It is possible to effectively prevent scratches and micro cracks in addition to suppressing deformation due to heating of the machining process and maintaining surface flatness. In particular, from the viewpoint of improving the surface flatness, the insulating filler preferably contains barium sulfate. From the viewpoint of preventing microcracks, it is more preferable to further include at least one of talc and silica in addition to the barium sulfate.

It is preferable that the average particle diameter of the barium sulfate is 0.05 to 5.00 m, the average particle diameter of the silica is 0.1 to 5.0 m, and the average particle diameter of the talc is 0.1 to 5.0 m. When the average particle diameter of the insulating filler is not more than the upper limit of the above range, the dispersibility and the surface flatness are further improved. If the average particle diameter of the insulating filler is at least the lower limit of the above range, the curing property and the high temperature resistance are further improved.

The total amount of the insulating filler is preferably 10 to 70 parts by mass, more preferably 10 to 60 parts by mass in view of further improving the high-temperature insulation resistance against 100 parts by mass of the entire thermosetting resin composition in terms of solid content . In addition, commercially available barium sulfate, silica, and talc may be used.

Examples of commercially available products of barium sulfate include precipitated barium sulfate # 100, precipitated barium sulfate # 300, precipitated barium sulfate SS-50, BARIACE B-30, Barias B-31, Barias B- 33, Barias B-34, BARIFINE BF-1, Bari Pine BF-10, Bari Pine BF-20, Bari Pine BF-40 (manufactured by Sakai Kagaku Kogyo) , B-34 (manufactured by Sakai Kagaku Kogyo Co., Ltd.), W-1, W-6, W-10 and C-300 (manufactured by Takehara Kagaku Kogyo Co., Ltd.).

Commercially available products of silica include A series such as Aerosil 50, Aerosil 200, Aerosil 380, Aerosil A 300, RY series such as RY 300 (manufactured by Nippon Aerosil Co., Ltd.); WACKER HDK S13, waxy HDK V15, and waxy HDK N20 (both manufactured by Asahi Kasei Corporation); (A product of Tokuyama Corporation), Pine Silicone (manufactured by Tokuyama Corporation), Silysia (manufactured by Fuji Silysia Kagaku Co., Ltd.), SNOWTEX UP, SNOWTEX OUP Nipsil L-300, Nipsil KQ (manufactured by Nippon Silica Kogyo Co., Ltd.), and the like.

Examples of commercially available talc include LMS-100, LMS-200, LMS-300, LMS-3500, LMS-400, LMP-100, PKP-53, PKP-80, PKP- 600, D-800, D-1000, P-2, P-3, P-4, P-6, P-8 and SG-95 (manufactured by Nippon Talc). These may be used singly or in combination.

[(D) Colorant]

The thermosetting resin composition of the present invention contains a colorant. As the coloring agent to be used, a black coloring agent, a white coloring agent, a blue coloring agent, a red coloring agent, a purple coloring agent, a yellow coloring agent, a green coloring agent, an orange coloring agent and a brown coloring agent may be used and any of pigments, dyes and pigments may be used. These may be used alone or in combination of two or more. Particularly, from the viewpoint of hiding, it is preferable that the composition be one of black, white and gray. As a specific example, a color index (issued by CI., Issued by The Society of Dyers and Colors) is given as follows. Particularly preferred is a black colorant.

The black colorant to be contained in the composition of the present invention is not particularly limited as long as it sufficiently exhibits black color and does not chemically react with the carboxyl group-containing resin or epoxy resin. For example, CI Pigment black 6, 7, 9, Carbon black based coloring agents represented by CI Pigment Black 8, CI Pigment Black 8 and CI Pigment Black 35, CI Pigment Black 11, 12 and 27, Pigment Brown 35, Based coloring agents represented by CI Pigment Black 20, CI Pigment Black 13, and CI Pigment Black 13, manufactured by Mitsubishi Material Co., Ltd., titanium black of 13M manufactured by Mitsubishi Materials, And 29 and the like, a coloring agent of a copper oxide series represented by CI Pigment Black 15 and 28, CI Pigment Black 14 and 26, and the like, antimony oxide based coloring agents represented by CI Pigment Black 23 and the like, nickel oxide based coloring agents represented by CI Pigment Black 30 and the like, and coloring agents represented by CI Pigment Black 31 and 32 A phenol-based coloring agent, an aniline-based coloring agent represented by Pigment Black 1, and molybdenum sulfide or bismuth sulfide may also be mentioned as preferable coloring agents. These colorants are used alone or in appropriate combination.

M-40, M-45, M-50, MA-8 and MA-100 manufactured by Mitsubishi Chemical Corporation, carbon black 1255 manufactured by Columbia Chemical Company, and the like are particularly preferable. .

If the blending amount of the black colorant is too much, the insulating property is lowered and the cost is increased. If too little, the coloring or non-transparency may be insufficient. It is preferably 1 to 25 parts by mass, more preferably 2 to 20 parts by mass, based on 100 parts by mass of the entire thermosetting resin composition in terms of solid content.

Examples of the white colorant include zinc oxide represented by CI Pigment White 4, titanium oxide represented by CI Pigment White 6, and zinc sulfide represented by CI Pigment White 7. Particularly preferred from the viewpoint of tinting power and non-toxicity, R-550, R-580, R-630, R-820, CR-820 manufactured by Ishihara Sangyo Co., TA-100, TA-200, and TA-200 manufactured by Fuji Titanium Kogyo Co., Ltd. were used, and the rutile type titanium oxide such as CR-60, CR-60, CR-90, KR-270, KR- 300, TA-500, and Anita type titanium oxide such as A100 and A220 manufactured by Ishihara Sangyo, KA-15, KA-20, KA-35 and KA-90 manufactured by Titanium Corporation.

The blending amount of the white colorant is preferably 0.1 to 60 parts by mass based on 100 parts by mass of the entire thermosetting resin composition in terms of solid content.

Examples of the blue colorant include pigments such as phthalocyanine and anthraquinone pigments, and compounds in which the dye system is classified as a solvent. Specifically, the following color index numbers are given . Pigment Blue: Pigment Blue 15, Pigment Blue 15: 1, Pigment Blue 15: 2, Pigment Blue 15: 3, Pigment Blue 15: 4, Pigment Blue 15: 6, 16, Pigment Blue 60; Dye system: Solvent Blue 35, Solvent Blue 63, Solvent Blue 68, Solvent Blue 70, Solvent Blue 83, Solvent Blue 87, Solvent Blue 94, Solvent Blue 97, Solvent Blue 122, Solvent Blue 136, Solvent Blue 67 , Solvent Blue 70 and the like can be used. In addition to the above, metal substituted or unsubstituted phthalocyanine compounds may also be used.

Examples of the red colorant include monoazo, disazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone. A color index number as shown below is given.

Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114 , 146, 147, 151, 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269;

Disazo system: Pigment Red 37, 38, 41;

48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53: 1, 53: 2, 57: 1, 58: 4, 63: 1, 63: 2, 64: 1, 68;

Benzimidazolone pigments: Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 185, Pigment Red 208;

Solvent Red 135, Solvent Red 179, Pigment Red 123, Pigment Red 149, Pigment Red 166, Pigment Red 178, Pigment Red 179, Pigment Red 190, Pigment Red 194, Pigment Red 224;

Pigment Red 254, Pigment Red 255, Pigment Red 264, Pigment Red 270, Pigment Red 272;

Pigment Red 220, Pigment Red 144, Pigment Red 166, Pigment Red 214, Pigment Red 220, Pigment Red 221, Pigment Red 242;

Anthraquinone series: Pigment Red 168, Pigment Red 177, Pigment Red 216, Solvent Red 149, Solvent Red 150, Solvent Red 52, Solvent Red 207;

Quinacridone pigments: Pigment Red 122, Pigment Red 202, Pigment Red 206, Pigment Red 207, Pigment Red 209.

Specific examples of the purple colorant include Pigment Violet 19, 23, 29, 32, 36, 37, 38, 42; Solvent Violet 13, 36; CI Pigment Brown 25; C.I. Pigment Black 1, C.I. Pigment Black 7, Pigment Violet 37 (dioxazine), and the like.

Examples of the yellow colorant include a monoazo system, a disazo system, a condensed azo system, a benzimidazolone system, an isoindolinone system, and an anthraquinone system, and specific examples include the following colorants.

Monoazo pigments: Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62: 1, 65, 73, 74, 75, 97, 100, 104 , 105, 111, 116, 167, 168, 169, 182, 183;

Disazo system: Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198;

Condensation azo pigments: Pigment Yellow 93, Pigment Yellow 94, Pigment Yellow 95, Pigment Yellow 128, Pigment Yellow 155, Pigment Yellow 166, Pigment Yellow 180;

Benzimidazolone pigments: Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, Pigment Yellow 181;

Isoindolinone pigments: Pigment Yellow 110, Pigment Yellow 109, Pigment Yellow 139, Pigment Yellow 179, Pigment Yellow 185;

Anthraquinone series: Solvent Yellow 163, Pigment Yellow 24, Pigment Yellow 108, Pigment Yellow 193, Pigment Yellow 147, Pigment Yellow 199, Pigment Yellow 202.

Examples of the green colorant include phthalocyanine type and anthraquinone type. Specific examples thereof include Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28 Etc. may be used. In addition to the above, metal substituted or unsubstituted phthalocyanine compounds may also be used.

Specific examples of the orange colorant include CI Pigment Orange 1, CI Pigment Orange 5, CI Pigment Orange 13, CI Pigment Orange 14, CI Pigment Orange 16, CI Pigment Orange 17, CI Pigment Orange 24, CI Pigment Orange 34, CI Pigment Orange 36, CI Pigment Orange 38, CI Pigment Orange 40, CI Pigment Orange 43, CI Pigment Orange 46, CI Pigment Orange 49, CI Pigment Orange 51, CI Pigment Orange 63, CI Pigment Orange 64, CI Pigment Orange 71, CI Pigment Orange 73, and the like.

Specific examples of the brown colorant include CI Pigment Brown 23, CI Pigment Brown 25, and the like.

The colorant other than the black colorant and the white colorant is preferably 0.1 to 10 parts by mass based on 100 parts by mass of the entire thermosetting resin composition in terms of solid content.

In addition, the composition of the present invention may contain the following additives in order to adjust desired physical properties or production conditions used in the production process, if necessary.

[Curing catalyst]

In order to accelerate the curing rate or lower the heating temperature, a curing catalyst may be added. Examples of the curing catalyst include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, Imidazole derivatives such as nonethyl-2-phenylimidazole and 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; Amines such as dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine and 4- Compounds, hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; And phosphorus compounds such as triphenylphosphine. Examples of commercially available curing catalysts include 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ and 2P4MHZ (both trade names of imidazole compounds) manufactured by Shikoku Chemicals Corporation, U-CAT 3503N DBT, DBN, U-CATSA102 and U-CAT5002 (both bicyclic amidine compounds and salts thereof) manufactured by Ningxia Huizhou National Petrochemical Industry Co., have. These may be used alone or in combination of two or more.

[Photon tablets]

Further, a hindered amine light stabilizer can be added to the thermosetting resin composition of the present invention for the purpose of reducing the photo-degradation of the cured product thereof.

Examples of the hindered amine light stabilizer include Tinuvin 622 LD, Tinuvin 144; CHIMASSORB 944LD, KIMASORB 119FL (all from BASF Japan); MARK LA-57, LA-62, LA-67, LA-63 and LA-68 (all of which are manufactured by ADEKA); LS-770, LS-765, LS-292, LS-2626, LS-1114 and LS-744 (all of which are manufactured by Sankyo Life Tech Co., Ltd.).

[Adhesion promoter]

In the thermosetting resin composition of the present invention, an adhesion promoter may be used to improve the adhesion between layers or the adhesion to a substrate such as polyimide. As the adhesion promoter, for example, benzimidazole, benzoxazole, benzothiazole, 2-mercaptobenzoimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole (trade name: Kawaguchi Kagaku 3-morpholinomethyl-thiazole-2-thione, 5-amino-3-morpholinomethyl-thiazole-2-thione, 2- Methylthio-thiadiazole, triazole, tetrazole, benzotriazole, carboxybenzotriazole, amino group-containing benzotriazole, and silane coupling agent. These may be used alone or in combination of two or more.

[Antioxidant]

In order to prevent oxidation, the curable resin composition of the present invention may contain a radical scavenger for neutralizing radicals generated and an antioxidant such as a peroxide decomposition agent for decomposing the generated peroxide into a harmless substance to prevent generation of new radicals . The antioxidant used in the present invention can prevent oxidation deterioration of a carboxyl group-containing resin, an epoxy resin, and the like, and can suppress yellowing. Examples of the antioxidant include phenol-based antioxidants, phosphorus-based antioxidants, and amine-based antioxidants. Among them, a phenol-based antioxidant is particularly preferable. The antioxidant may be used alone or in combination of two or more.

[Organic solvents]

Further, the thermosetting resin composition of the present invention may be an organic solvent as a diluent for diluting the composition or adjusting the viscosity for application to a substrate or a carrier film.

Examples of such organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents and the like. More specifically, ketones such as methyl ethyl ketone and cyclohexanone; Aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; Methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether And the like; Esters such as ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate and propylene glycol butyl ether acetate; Alcohols such as ethanol, propanol, ethylene glycol and propylene glycol; Aliphatic hydrocarbons such as octane and decane; Petroleum ether such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha and solvent naphtha. These organic solvents may be used singly or as a mixture of two or more kinds. The blending amount of the organic solvent is not particularly limited and may be suitably added as needed.

The thermosetting resin composition of the present invention can be prepared, for example, by adjusting the viscosity with a suitable viscosity for the coating method with the organic solvent described above, and applying the coating composition on the substrate by a dip coating method, a flow coating method, a roll coating method, a bar coater method, , A spray coating method, etc., and the organic solvent contained in the composition is volatilized and dried (dried) at a temperature of about 50 to 300 ° C, whereby a tack-free coating film can be formed.

[Wetting and dispersing agent]

The thermosetting resin composition of the present invention may contain a wetting and dispersing agent in order to adjust the filling property of the composition to the minute concave portion, the surface smoothness of the cured coating, the defoaming property or the surface tension of the composition. Examples of commercially available products thereof include wet dispersants BYK-110, BYK-111 and BYK-183 manufactured by BICKEMIE GMBH. The wetting and dispersing agent may be used alone or in combination of two or more. The blending amount of the wetting and dispersing agent is preferably 0.01 to 5 parts by mass, more preferably 0.5 to 5 parts by mass based on 100 parts by mass of the entire thermosetting resin composition in terms of solid content.

[Leveling agent]

As the leveling agent, for example, there may be mentioned a polyacrylate-based polymer, a polyether-modified dimethylpolysiloxane copolymer, a polyester-modified dimethylpolysiloxane copolymer, a polyether-modified methylalkylpolysiloxane copolymer, an aralkyl-modified methylalkylpolysiloxane copolymer, Modified methylalkylpolysiloxane copolymer, and the like. The leveling agent may be used alone or in combination of two or more. The amount of the leveling agent is preferably 0.01 to 5 parts by mass, more preferably 0.1 to 3 parts by mass based on 100 parts by mass of the total amount of the thermosetting resin composition in terms of solid content.

[Defoamer]

Specific examples of the antifoaming agent include BYK (registered trademark) -054, -055, -057, -1790, and the like manufactured by Big Chem Japan Co., Ltd. as a defoaming agent containing a commercially available non-silicone type foaming polymer solution BYK (registered trademark) -063, -065, -066N, -067A, -077 manufactured by Big Chem Japan Co., Ltd. and dimethyl silicone oil SH200 series manufactured by Toray Dow Corning Silicone Co., .

〔Board〕

Examples of the substrate used in the present invention include a resin film such as a polyimide film and a PET film, a glass substrate, a ceramic substrate, a metal substrate, and a wafer plate. Of these, a resin film such as a polyimide film and a PET film, and a glass substrate can be preferably used. The material and the shape of the substrate are selected according to the use and performance of the intended molded article, and may be used alone or in combination of two or more kinds of materials and shapes, if necessary. From the viewpoint of adhesion, a glass substrate is more preferable.

[Manufacturing / Mixing Method]

The thermosetting resin composition of the present invention can be produced by homogeneously mixing the above essential components and other additives to be used as needed. As the mixing method, a known method can be used, and there is no particular limitation. A method of mixing without using a dispersing machine, and a method of mechanically mixing with various dispersers such as a kneader, a roll mill, an attritor, and a bead mill.

Particularly preferable methods include a method in which the above-mentioned insulating filler, a solvent and a dispersing agent are mixed and dispersed in a dispersing machine such as a bead mill or the like is mixed with another curing resin component or, if necessary, A method in which a part of the resin component, the insulating filler, the solvent and the dispersing agent are mixed and dispersed by a dispersing machine such as a bead mill or the like is mixed with another curing resin component or, if necessary, .

From the viewpoint of dispersibility, it is preferable to add and mix a solution prepared by dissolving or finely dispersing a coloring agent dispersant in a mixed solution prepared by previously dispersing a coloring agent or the like in water or an organic solvent.

[Application method]

After the thermosetting resin composition is prepared in such a manner as described above, the thermosetting resin composition is adjusted to have a viscosity suitable for the application method with, for example, an organic solvent, and a coating method such as dip coating, flow coating, , A bar coater method, a screen printing method, a curtain coating method, a spray coating method and the like. Among them, a flow coating method, a roll coating method, a bar coater method, a screen printing method, and a spray coating method are preferably used, and a screen printing method is particularly preferably used.

[Curing method]

The curing performed after applying the curable resin composition of the present invention can be carried out by a hot air circulating drying furnace, a hot plate, a convection oven or the like (a hot air circulation type drying furnace, And a method of spraying onto a support from a nozzle) can be used. The heating conditions are preferably 100 to 300 占 폚. Especially when an epoxy resin is used as the curable resin, 100 to 200 ° C is preferable, and when a silicone resin is used, 200 to 300 ° C is preferable.

[Example]

Hereinafter, the present invention will be described concretely with reference to Examples, but the present invention is not limited to these Examples. Unless specifically mentioned below, " part " means mass part and "% " means mass%.

(Examples 1 to 7 and Comparative Example 1)

The various components shown in the following Table 1 were compounded in the proportions (parts by mass) shown in Table 1, preliminarily mixed with a stirrer, and kneaded by a three-roll mill to prepare a paste of a thermosetting resin composition.

[Synthesis Example 1 of curable resin (cresol novolak type photosensitive resin)]

To 600 g of diethylene glycol monoethyl ether acetate was added 1070 g of an orthocresol novolak type epoxy resin (EPICLON N-695, manufactured by DIC Corporation, softening point 95 占 폚, epoxy equivalent 214, average functional group number 7.6) (Total number of aromatic rings: 5.0 moles), 360 g (5.0 moles) of acrylic acid and 1.5 g of hydroquinone were charged and stirred at 100 DEG C to dissolve uniformly. Subsequently, 4.3 g of triphenylphosphine was added, and the mixture was heated to 110 캜 and reacted for 2 hours, then heated to 120 캜 and further reacted for 12 hours. 415 g of aromatic hydrocarbon (Solvesso 150, manufactured by Tosho General Sekiyu Co., Ltd.) and 456.0 g (3.0 mols) of tetrahydrophthalic anhydride were added to the obtained reaction solution, the reaction was carried out at 110 DEG C for 4 hours, Thereby obtaining a cresol novolak type photosensitive resin (varnish).

The cresol novolak type photosensitive resin (varnish) thus obtained had a solid content concentration of 65% by mass and an acid value of a solid content of 89 mgKOH / g. The weight average molecular weight (Mw) of the obtained cresol novolak type photosensitive resin was 9,000.

The weight average molecular weight of the obtained resin was measured using a pump LC-6AD manufactured by Shimadzu Corporation and a column Shodex (registered trademark) KF-804 and KF-803 manufactured by Showa Denko K.K. , And KF-802 were measured by high performance liquid chromatography.

* 1 BNE200D75, manufactured by Changchun Synthetic Resin Co., Ltd., epoxy resin (solid content 75%), epoxy equivalent: 198 to 218 (the amount of solid content in the table)

* 2 The cresol novolak type photosensitive resin (varnish) obtained in Synthesis Example 1 (the compounding amount in the table is the value of the solid content)

* 3 Kotosil MP-200, manufactured by Momentive Performance Materials, Inc., epoxy silane oligomer

* 4 Silk Quest A-187, manufactured by Momentive Performance Materials, Inc., Organosilane

* 5 B-30, manufactured by Sakai Kagaku Kogyo Co., Ltd. Average particle diameter: 0.3 占 퐉, surface treated barium sulfate

* 6 Nipil L300, manufactured by Nippon Silica Kogyo Co., Ltd., average particle diameter: 2.2 탆

* 7 SG-95, manufactured by Nippon Talc Co., magnesium hydrate, average particle diameter (D ₅₀ ): 2.5 μm

* 8 1255, manufactured by Columbia Chemical Company, carbon black, black colorant

* 9 Irgazin DPP Red Ultra Opaque, manufactured by BASF Japan Co., a red colorant

* 10 Cromophtal Violet B, manufactured by BASF Japan Ltd., violet colorant (Pigment Violet 37)

* 11 OSTAPLAST YELLOW AGR, manufactured by Synthesia, a, s, anthraquinone, yellow colorant

* 12 RKB-33, manufactured by Bayer AG, titanium oxide, white colorant

* 13 Dicyandiamide

* 14 DEAC, Polynt UK Ltd. , Diethylene glycol monoethyl ether acetate

* 15 BYK-183, a high molecular weight block copolymer having a pigment-affinity group, manufactured by Big-Chemie GmbH

* 16 BYK-110, manufactured by Big-Chemie GmbH, containing an acidic group-containing copolymer

* 17 BYK-354, a polyacrylate leveling agent manufactured by Big-Chemie GmbH

(Preparation of Evaluation Glass Substrate)

The pastes of the thermosetting resin compositions obtained in Examples 1 to 7 and Comparative Example 1 were screen-printed on a glass substrate (manufactured by Central Glass Co., Ltd.) so that the thickness of the cured coating film was about 6 μm by screen printing using a 420 mesh screen The coated glass substrate was placed in an oven (DH-62, manufactured by Yamato Kagaku Co., Ltd.) and baked at 150 占 폚 for 30 minutes to obtain an evaluation glass having a cured coating of about 6 占 퐉 Substrate.

Using the glass substrates on which the cured films of the respective thermosetting resin compositions were formed, the following various properties were evaluated by the following methods.

≪ Light shielding property (OD value) >

The film side of the glass substrate was attached to a measuring instrument by a transmission densitometer (manufactured by Sakata Ink Engineering Co., Ltd., model number: X-Rite 361T, light source wavelength: 400 to 800 nm), and the OD value was evaluated as follows.

○: OD value exceeded 4

DELTA: OD value is 3 or more and 4 or less

X: OD value less than 3

<Hot water resistance (hot water test)>

The glass substrate was immersed in boiling water of 100 占 폚 for 60 minutes and taken out to remove water on the surface, and then penetration of water or precipitation of the film was visually observed. Subsequently, a transparent adhesive tape (manufactured by Niche Reflex Co., Ltd., width: 18 mm) was completely adhered to the coating film side of the evaluation glass substrate, and one end portion of the tape was instantly removed while being held at right angles to the glass substrate, The film was evaluated.

○: No change was confirmed.

?: A slight change was confirmed.

X: Intrusion of water or peeling of the film was confirmed.

<High temperature crack resistance>

The glass substrate was placed in a DENG YNG high temperature oven (manufactured by Bunyaku Co., Ltd., model number: DH-400), heated at 280 占 폚 for 1 hour and observed under an electron microscope (50 times, model number MEASURING MICROSCOPE STM-MJS2 ), The surface of the coated film of the glass substrate was evaluated as follows.

○: No crack

Δ: Cracking rate exceeding 0% and less than 10%

×: a crack occurrence rate of 10% or more

<High-temperature Insulation Resistance>

The glass substrate was baked at 300 DEG C for 30 minutes in an oven and the positive electrode and negative electrode of an ohmmeter (Agilent Technologies, High Resistance Meter 4339B, Component Test Fixture 16339A) were placed at a distance of 0.5 cm Respectively, and the resistance of the film was measured under the conditions of a voltage of 500 V and a time of 60 seconds, and the resistance of the film was evaluated as follows.

○: Resistance exceeds 1 × 10 ¹⁰ Ω

DELTA: resistance of not less than 1 x 10 ^{8 and not} more than 1 x 10 ¹⁰ ?

×: Resistance less than 1 × 10 ⁸ Ω

<Surface Flatness>

(Length: 2.5 mm, vertical magnification: 1000, horizontal magnification: 100, cutoff: 0.8 mm, speed: 0.5 mm / s) (Maximum height of peak, RmaxD) of the coating film surface was measured three times and evaluated as follows.

?: RmaxD is less than 1.5 占 퐉

?: RmaxD not less than 1.5 and less than 2 占 퐉

X: RmaxD is 2 mu m or more

<Pencil hardness>

A pencil of 4B to 9H polished so as to flatten the end of the core was pressed against each glass substrate by a pencil hardness tester (model number: C221A, manufactured by Toyo Seiki Co., Ltd.) according to JIS K5400 (1990 edition) , And the hardness of the pencil in which peeling of the film did not occur was recorded.

<Sulfuric acidity>

The glass substrate was immersed in an aqueous 10 vol% sulfuric acid solution at 25 占 폚 for 30 minutes, washed with water, and then water was removed to visually confirm the penetration of water or the elution of the film. Subsequently, a transparent adhesive tape (manufactured by Niche Reflex Co., Ltd., width: 18 mm) was completely adhered to the coating film side of the evaluation glass substrate, and one end portion of the tape was instantly removed while being held at right angles to the glass substrate, The film was evaluated.

○: No change was confirmed.

?: A slight change was confirmed.

X: Intrusion of water or peeling of the film was confirmed.

<Salt resistance>

The glass substrate was immersed in an aqueous 10 vol% hydrochloric acid solution at 25 占 폚 for 30 minutes, washed with water, and then water was removed to visually examine the penetration of water or elution of the film. Subsequently, a transparent adhesive tape (manufactured by Niche Reflex Co., Ltd., width: 18 mm) was completely adhered to the coating film side of the evaluation glass substrate, and one end portion of the tape was instantly removed while being held at right angles to the glass substrate, The film was evaluated.

○: No change was confirmed.

?: A slight change was confirmed.

X: Intrusion of water or peeling of the film was confirmed.

<Alkali resistance>

The glass substrate was immersed in an aqueous 10 wt% NaOH solution at 25 캜 for 30 minutes, washed with water, and then water was removed to visually examine the penetration of water or elution of the film. Subsequently, a transparent adhesive tape (manufactured by Niche Reflex Co., Ltd., width: 18 mm) was completely adhered to the coating film side of the evaluation glass substrate, and one end portion of the tape was instantly removed while being held at right angles to the glass substrate, The film was evaluated.

○: No change was confirmed.

?: A slight change was confirmed.

X: Intrusion of water or peeling of the film was confirmed.

<Solvent resistance>

A small amount of ethanol (95 vol%), dipropylene glycol monomethyl ether (DPM) (100 vol%) and isopropyl alcohol (IPA) (100 vol%) were applied to a lens paper manufactured by Kimberly-Clark After the coating of the glass substrate was wiped repeatedly about 20 times, the surface of the coating film was visually observed.

○: No change was confirmed.

?: A slight change was confirmed.

X: The film was peeled off.

&Lt; Adhesion (Test for adhesion to checkerboard) >

(10 x 10) of 1 mm checkerboards were made on the film of the sample in accordance with JIS K5400, and a transparent adhesive tape (manufactured by Niche Reflex Co., Ltd., width: 18 mm) was completely adhered on the checkerboard and immediately one end of the tape The glass plate was momentarily removed while being held at right angles to the glass substrate, and the number of grid holes remaining without peeling was examined.

In Table 2, the number of remaining checkered eyes is used as a numerator, and the total number of checkered eyes (100 eyes) is denoted as a denominator.

○: 100% of checkerboard snow remained.

?: No less than 95% and less than 100% of checkerboard snow remained.

X: Less than 95% of checkerboard snow remained.

The results of the above evaluation tests are summarized in Table 2.

As shown in Table 2, all of Examples 1 to 7 according to the present embodiment were able to achieve high levels of adhesion, surface flatness and curability in a balanced manner, and both high temperature insulation resistance and solvent resistance. Particularly, it was confirmed that the high temperature insulation resistance in the strict conditions in the manufacturing process was excellent. On the other hand, in Comparative Example 1, since the glycidyl group and the silane-based coupling agent having a hydroxyl group were not compounded, sufficient high-temperature insulation resistance was not obtained.

Claims (5)

(a) a curable resin, (b) a silane coupling agent having a glycidyl group and a hydroxyl group, (c) at least one member selected from the group consisting of barium sulfate, silica and talc, and (d) ,
Wherein the silane-based coupling agent has a structure represented by the following general formula (I).

(I)
(Wherein R is a hydrogen atom or a methyl group, at least R of both terminals is a methyl group, n is an integer of 1 to 3, R 'is - (CH ₂ ) _i -O- (CH ₂ ) _j - And j are each independently an integer of 1 to 5) The cured product of the decorative thermosetting resin composition for a glass substrate according to claim 1, which is formed on a glass substrate. A member for a display, comprising the cured product according to claim 2. delete delete