KR101856217B1 - Film type optical component package and manufacturing method thereof - Google Patents

Abstract

The present invention discloses a film type optical device package and a manufacturing method thereof. Wherein the film type optical device package comprises: an insulating film formed with a via hole penetrating therethrough; A metal layer located on one side of the insulating film and having a recess formed in a portion of the metal layer corresponding to the via hole so as to be recessed from one surface of the insulating film toward the other surface; An optical element mounted on the depression and electrically connected to the metal layer; And a heat sink joined to the depression of the metal layer. According to the present invention, by bonding an optical device package to a metal plate (or a heat sink) having no adhesive layer, bottleneck of heat flow due to the existing bonding layer is prevented, thereby maximizing the heat dissipation efficiency and simplifying the existing complicated heat dissipating structure The economic efficiency can be improved.

Description

TECHNICAL FIELD [0001] The present invention relates to a film type optical device package, and a manufacturing method thereof. [0002]

The present invention relates to an optical device package and a manufacturing method thereof.

In general, a light emitting diode (hereinafter referred to as LED) generates a small number of injected carriers (electrons or holes) by using a pn junction structure of a semiconductor, converts electric energy into light energy by recombination thereof, And an intermetallic compound junction diode that emits light. LEDs emit visible light as light energy generated when electrons and holes combine when applying power to the cathode and anode terminals.

White LEDs emitting white light can be realized by a combination of three colors of red LED, green LED and blue LED, or can be implemented by combining yellow phosphor with blue LED. Due to the emergence of white LEDs, the application field of LEDs has expanded to include products that will come from indicators of electronic products, advertising panels, etc. Now, with the high efficiency of LED chips, Head lamps, and fluorescent lamps.

High power and high brightness LEDs are being applied in various lighting applications. The efficiency and lifetime of the LED deteriorate as the heat generated from the junction surface of the LED increases. High-power and high-brightness LED packages require a design to dissipate heat generated from the LED chips.

About 15% of the energy applied to the LED package is converted to light and about 85% is consumed as heat. The higher the temperature of the LED chip, the higher the failure rate of the LED package.

Resin molding type LED packages fail to provide an efficient heat dissipation structure in LED chips of 0.2 W / mK or more due to the low thermal conductivity of the plastic resin. For this reason, a resin molding type LED package is used as an indicator using an LED chip of 0.1 W or less or for low luminance. In order to improve the heat dissipation structure of the LED package of the resin molding type, a heat sink of copper (thermal conductivity 300-400 W / mK) or aluminum (thermal conductivity 150-180 W / mK) Package structure was developed.

The LED package with built-in heat sink has a relatively good heat dissipation effect using direct heat dissipation through heat sink metal, and can be applied to LED packages of 0.1 W or more. However, heat between the resin material and the metal core for heat sink There is a problem in reliability due to cracks between them due to the difference in expansion coefficient.

Heat generated from the LED package is dissipated through the metal PCB. Metal PCB is a resin layer on an aluminum metal substrate. A copper foil layer, and a solder resist layer. The resin layer serves to form a heat transfer path between the copper foil layer through which the current flows and the metal substrate layer thereunder, and between the copper foil layer and the metal substrate layer below. Heat generated from the LED package is firstly conducted through the copper foil layer of the metal PCB and transferred to the underlying metal substrate through the resin layer.

When the LED packages are mounted on a metal PCB in an array form, the heat dissipation effect of the metal PCB alone is low, so a separate heat sink can be mounted on the bottom of the metal PCB for heat dissipation.

1 is a cross-sectional view showing the structure of an LED package bonded to a conventional heat sink.

Referring to FIG. 1, LED 10 is soldered to a metal circuit, such as copper circuit 40, by solder 20. Then, a solder resist 30 is applied to a selected portion on the copper circuit, and the copper circuit 40 is mounted on the printed circuit board 50. The printed circuit board 50 is bonded to the thermal sheet 70 through the adhesive 60. Preferably, the heat-transfer sheet 70 is made of a thermal sheet for diffusing the heat of the high-temperature electronic component, the heat conductivity is lowered by 100 W / mK or more, the thickness is 1 mm or less and the curvature radius is 10 cm or less Do. The heat-transfer sheet 70 diffuses or conveys heat generated in a small electronic appliance due to light-weight shortening of the electronic component.

The heat transfer sheet (70) is bonded to the heat sink (90) through the adhesive (80). The heat sink 90 emits heat generated from the LED 10 and the associated copper circuit 40. The heat sink 90 forms a path for discharging the heat generated from the LED to the outside through the bottom surface of the package body.

Conventionally, when a heat-dissipating LED package is mounted on a substrate, a heat sink is attached to the substrate 50 by the conductive adhesive material 60, 80. The stronger the heat sink is attached to the substrate by the adhesive material, the better the heat radiation performance of the LED package. However, in many cases, the adhesive strength to the substrate is lowered due to the force of the heat-dissipating LED package sliding on the substrate, which causes the heat dissipation performance of the LED package by the heat sink 90 to deteriorate.

That is, the bonding of the basic structure to the lower printed circuit board (PCB) in the LED package uses various adhesives for adhesion between the respective layers as described above, and a basic interlayer material, a thermal sheet, The attachment to the heat sink is complicated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an optical device package in which a heat dissipation structure of an optical device package is simplified and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a film type optical device package including: an insulating film formed through a via hole; A metal layer located on one side of the insulating film and having a recess formed in a portion of the metal layer corresponding to the via hole so as to be recessed from one surface of the insulating film toward the other surface; An optical element mounted on the depression and electrically connected to the metal layer; And a heat sink joined to the depression of the metal layer.

The metal layer may be plated with a metal.

The surface of the heat sink bonded to the metal layer may be subjected to flux treatment.

Heatsink The metal layer may be bonded to the heat sink by a solder layer, and the solder layer may be formed by any one of solder, silver paste and copper paste.

The depression may have a depression depth smaller than the thickness of the insulation film.

According to another embodiment of the present invention, there is provided a method of manufacturing a film type optical device package, comprising: forming a via hole in an insulating film; Forming a metal layer on one surface of the insulating film; A portion of the metal layer corresponding to the via hole is pressed toward the other surface of the insulating film to form a depression; Mounting an optical element on the depression so as to be electrically connected to the metal layer; And bonding a heat sink to the depression of the metal layer.

The film type optical device package manufacturing method may further include plating the metal layer with a metal.

The film type optical device package manufacturing method may further include fluxing the surface of the base heat sink to be bonded to the metal layer.

By bonding an optical device package to a metal plate (or a heat sink) without an adhesive layer, the present invention maximizes the heat dissipation efficiency by simplifying the existing complicated heat dissipation structure by preventing the bottleneck of heat flow due to the existing junction layer, Can be improved.

1 is a cross-sectional view showing a junction between a conventional LED package and a heat sink.
2 is a cross-sectional view of a film type optical device package according to an embodiment of the present invention.
3 is a cross-sectional view of a film type optical device package manufacturing process according to an embodiment of the present invention.
4 is a view showing a step of directly bonding an array of optical device packages of Fig. 3 to a heat sink according to the present invention.

Hereinafter, a film type optical device package and a method of manufacturing the same according to a preferred embodiment will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

In addition, the size of each component in the drawings may be exaggerated for the sake of explanation and does not mean a size actually applied.

Conventionally, the bonding of the basic structure to the lower printed circuit board (PCB) in the LED package uses various adhesives for attaching between the respective layers as described above, and the basic interlayer material and the heat transfer sheet (Thermal sheet) and a heat sink.

In order to solve the above problems, the present invention joins an optical device package to a metal plate (or a heat sink) without an adhesive layer. Specifically, the optical device package according to the present invention is directly attached to the lower heat sink by using soldering, silver paste, copper paste, or the like. The surface of the heat sink before fluxing is treated by fluxing to ensure good soldering.

The structure of the LED package according to the preferred embodiment of the present invention will be described with reference to FIG.

2 is a cross-sectional view illustrating an LED package according to a preferred embodiment of the present invention.

2 is a cross-sectional view of a film type optical device package according to an embodiment of the present invention. 2, a film type optical device package according to an embodiment of the present invention includes an insulating film 110 formed with a via hole penetrating therethrough, an optical device 130 positioned on one side of the insulating film 110, A metal layer 120 having a depression 125 formed to be recessed from one surface of the insulation film 110 toward the other surface at a portion corresponding to the via hole for receiving the metal layer 120, And an optical element 130 electrically connected to the first electrode 120.

The insulating film 110 is preferably a polyimide film, but the present invention is not limited thereto and may be made of a ceramic material resistant to thermal shock. In addition, the metal layer 120 is preferably made of copper (Cu). Since the insulating film 110 is in the form of a film, it can be mass-produced by a roll-to-roll process.

The via holes formed through the insulating film 110 may include a via hole for mounting the optical device 130, a via hole for electrical connection between the layers, a thermal via hole for facilitating thermal diffusion, A via hole may be formed.

The optical device package may include an adhesive layer (not shown) formed by applying an adhesive material on one surface of the insulating film 110 on which the metal layer 120 is formed. In this case, the right metal layer 120 is formed by an adhesive layer And is attached to the insulating film 110. However, the present invention is not limited thereto, and the metal layer 120 without the adhesive layer can be fixed to one surface of the insulating film 110 according to a technique known in the art.

Further, the metal layer 120 is preferably made of copper (Cu). The metal layer 120 activates the surface through various chemical treatments, then applies a photoresist, and performs exposure and development processes. After the development process is completed, a circuit pattern is formed by forming a necessary circuit through an etching process and peeling the photoresist. In addition, the metal layer 120 may be plated with a metal, such as silver (Ag), in which case light from the optical element 130 may be better reflected from the metal layer 120.

2, the metal layer 120 is formed on one surface of the insulating film 110 and is provided on a portion corresponding to the via hole for receiving the optical device 130 from one surface of the insulating film 110 And a depression 125 formed to be recessed toward the surface. The depression 125 may be formed by a tool that punches the insulating film 110. The lower portion of the metal layer 120 on which the optical element 130 is to be mounted is protruded through the via hole so that a copper slug is exposed to the lower portion of the optical element 130 to be mounted. The element 130 is seated on the depression 125. The light emitted from the optical element 125 is directed toward the surface of the depressed portion 125 and is reflected from the depressed portion 125 so that the depressed portion 125 serves as a reflector. By doing so, the luminance of the optical device package 100 can be improved. The optical element 130 is electrically connected to the metal layer 120 through the wire 140.

In the optical device package 100, the optical element 130 and the wire 140 include a molding part 150 for molding epoxy or glass. The molding part 150 may include a phosphor to increase the efficiency of the optical element 60. [

 The depression 125 of the optical device package 100 may be bonded to one side of the heat sink 230 through the solder layer 210. Since the solder layer 210 has an adhesive force, the optical device package 100 is bonded to one surface of the heat sink 230. The solder layer 210 may be formed of a solder according to an embodiment, and may be formed of a metal paste such as Ag paste, copper paste or the like according to another embodiment.

The surface of the heat sink 230 on which the depression 125 of the optical device package 100 is bonded may be flux treated to form the flux layer 220 on the heat sink 230. Here, the flux treatment refers to a process of applying the flux on the optical device package bonding surface of the heat sink 230. [ A typical flux application device has a flux storage container for storing a flux in a liquid state and a flux application unit having a plurality of nids. When the flux application process is started, an end portion of the needles of the flux application unit is brought into contact with the flux stored in the flux storage container to apply a predetermined amount of flux to the needles.

This flux layer 220 may be removed if a solder layer 210 is provided for bonding the photonic device package 100 and the heat sink 230. In other words, only one of the solder layer 210 and the flux layer 220 is required for bonding the optical device package 100 and the heat sink 230.

Since the integrated heat sink is bonded to the metal layer and the via hole in which the optical device is mounted, a heat transfer line for thermal stress and heat dissipation is generated, thereby maximizing heat dissipation efficiency.

A manufacturing process of the above-described optical device package will be described with reference to FIGS. 3 and 4. FIG.

3 is a cross-sectional view of a film type optical device package manufacturing process according to an embodiment of the present invention.

Referring to FIG. 3, an adhesive layer 112 is coated on one surface of an insulating film 110 (S1). Here, the material of the insulating film 110 may be a polyimide or a ceramic resistant to heat shock. Then, via holes 114 are formed in the insulating film 110 (S2). As described above, in addition to the via holes for accommodating the optical element 130, the via holes are used for electrical connection between the layers, thermal via holes for facilitating thermal diffusion, And the like.

The metal layer 120 is then laminated onto the adhesive layer 112. Thereafter, the expression is activated through various chemical treatments, then the photoresist is applied, and the exposure and development processes are performed. After the development process is completed, a necessary circuit is formed through an etching process and the photoresist is peeled off to form a metal layer 120 on which a circuit pattern is formed (S4). In FIG. 3, it is indicated that a metal layer on which a circuit pattern is formed is formed by indicating that the metal layer 120 has a pattern (S4). Subsequently, depressed portions of the metal layer 120 corresponding to the via holes for accommodating the optical elements 130 are formed (S4) so that the depressions 125 on which the optical elements 130 are seated can be formed.

The depression 125 may be formed by a tool that punches the insulating film 110. That is, the depression 125 may be formed by pressing the portion of the metal layer 120 corresponding to the via hole for receiving the optical element 130 by the punch tool. Concretely, when the punch tool pushes the portion of the metal layer 120 corresponding to the via hole for receiving the optical element 130 from one surface of the insulating film 110 toward the other surface, a depression 125 is formed. On the other hand, the tool for forming the depression 125 can be any tool known to those skilled in the art.

It is apparent to those skilled in the art that the step of forming the circuit pattern (S5) on the metal layer and the step of forming the depression 125 may be performed simultaneously, and the order may be changed.

Subsequently, the metal layer 120 is plated with a metal such as silver (Ag), and the optical element 130 or the optical device chip 130 is mounted on the depression 125 (S5). Light from the optical element 130 can be more reflected from the metal layer 50 by metal plating. Accordingly, the light emitted from the optical element 130 is directed toward the surface of the depression 125, and is reflected from the depression 125, so that the luminance of the optical device package can be improved.

The optical element 130 is then electrically connected to the metal layer 120 through the wire 140 (S7). Alternatively, a phosphor layer (not shown) may be further formed by filling the depression 125 with a fluorescent material. Finally, the optical element 130 and the wire 140 are molded with epoxy or glass to form the molding part 150. Each of the optical device packages 100 is manufactured in the above-described manner.

An array of such optical device packages 100 is shown in FIG.

4 is a view showing a step of directly bonding an array of optical device packages of Fig. 3 to a heat sink according to the present invention.

Referring to FIG. 4, an array of optical device packages 100 is bonded to a heat sink 230 via a solder layer 210. As described above, since the solder layer 210 has an adhesive force, the optical device package 100 is attached to the heat sink 230.

Alternatively, the surface to which the optical device package array of the heat sink 230 is bonded may be flux treated for bonding with the optical device package array. If the solder layer 210 is interposed between the optical device package 100 and the heat sink 230, the flux layer may not be formed on the surface to which the optical device package 100 of the heat sink 230 is bonded have.

As described above, in the case of the arrayed ALP (Advanced LED PKG) according to the present invention, copper slug is exposed to the bottom of the optical device chip, and the copper slug is directly bonded to the heat sink, .

In other words, the present invention joins an optical device package to a metal plate (or a heat sink) without an adhesive layer. As a result, the present invention can maximize the heat dissipation efficiency by preventing the bottleneck of heat flow due to the existing bonding layer and simplify the existing complicated heat dissipation structure, thereby improving the economical efficiency.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

110: Insulation film 120: metal layer
130: optical element 140: wire
150: molding part 210: solder layer
220: flux layer 230: heat sink

Claims (9)

An insulating film formed through the via hole;
A metal layer located on the upper surface of the insulating film and having a depression and a circuit pattern formed on a portion of the metal layer corresponding to the via hole so as to be recessed from the upper surface to the lower surface of the insulating film;
An optical element mounted on the depression and electrically connected to the circuit pattern; And
And a heat sink joined to the lower surface of the insulating film and the lower surface of the depression,
Wherein the heat sink is flux-processed on the lower surface of the insulating film and the surface bonded to the lower surface of the depressed portion. The method according to claim 1,
Wherein the metal layer is plated with a metal. delete The method according to claim 1,
Wherein the metal layer is bonded to the heat sink by a solder layer. 5. The method of claim 4,
Wherein the solder layer is formed by one of solder, silver paste, and copper paste. The method according to claim 1,
Wherein the depression has a recess depth smaller than the thickness of the insulating film. Forming a via hole in the insulating film;
Forming a metal layer on the upper surface of the insulating film;
A portion of the metal layer corresponding to the via hole is pressed toward the lower surface from the upper surface of the insulating film to form a depression;
Forming a circuit pattern on the metal layer;
Mounting an optical element on the depression to be electrically connected to the circuit pattern;
And bonding a heat sink to a lower surface of the insulating film and a lower surface of the depressed portion. 8. The method of claim 7,
Wherein the metal layer is plated with a metal. 8. The method of claim 7,
And fluxing the bonding surface of the heat sink to be bonded to the lower surface of the depression and the lower surface of the insulating film.

Images