KR101831585B1 - Plasma Sterilization Film and Packaging, and Apparatus of Power System Applying to Plasma Sterilization Film and Packaging - Google Patents

Abstract

A sterile film is provided. This sterilizing film has an intermediate electrode layer including an intermediate electrode portion and an intermediate pad portion electrically connected to the outside while being electrically connected to the intermediate electrode portion and the intermediate electrode portion in the form of a thin plate, an upper dielectric barrier layer having flexibility, A dielectric barrier layer, and an intermediate electrode layer, and is electrically connected to the upper ground electrode section and the upper ground electrode section and is electrically connected to the outside An upper ground electrode layer including an upper ground pad portion, a lower ground electrode portion having a porous screen structure and provided on a lower surface opposite to an upper surface of the lower dielectric barrier layer having an intermediate electrode layer, the lower ground electrode portion having a plurality of through holes, And a lower ground pad portion electrically connected to the outside while being electrically connected to the lower ground pad portion A lower ground electrode layer, and a lower protective layer covering the lower ground electrode layer. The intermediate pad portion and the lower ground pad portion are electrically connected to an external power source to form a plasma around the perforated screen structure of the lower ground electrode portion.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma sterilizing film and a sterilizing packaging container,

The present invention relates to a sterilizing film capable of generating a plasma, a method of manufacturing the sterilizing film, and a power supply device applied thereto, and more particularly, to a sterilizing film capable of generating plasma, A ground electrode layer and a lower protective layer to generate an atmospheric plasma to sterilize the sterilized film, a method for manufacturing the sterilized film, and a power supply device applied thereto.

Japanese Unexamined Patent Publication (Kokai) No. 2008-183025 discloses a plasma sterilization apparatus by generating a dielectric barrier discharge (DBD) using an air permeable packaging material. (O ₃ ) or hydroxyl (O ₃ ) ions generated by excitation of the water vapor component in the air by an oxygen radical directly generated by dielectric barrier discharge inside or an ultraviolet ray (UV-ray) OH-), hydrogen peroxide (H ₂ O ₂ ), and the like. However, Japanese Patent Application No. 2008-183025 is not applicable when the object to be treated is liquid.

Korean Patent No. 10-1012442 discloses a sterilizing apparatus using atmospheric pressure plasma. However, Korean Patent No. 10-1012442 is difficult to apply to packaging materials, and even if the object to be treated is liquid, it is difficult to apply.

In general, food, beverages, etc. are packaged and delivered to consumers in order to increase the value of the products and to protect the goods during the distribution process. Paper, glass, and plastic are used as packaging materials. Particularly, in the case of dry food, a plastic packaging container such as polyethylene terephthalate (PET) is used to prevent moisture absorption, discoloration, fat burning and flavor deterioration, and aluminum foil having low moisture and oxygen permeability, (Al foil) are further laminated and used.

In addition, by applying the gas replacement packaging method developed as an improvement measure for the vacuum packaging method, it is possible to realize a decrease in the growth speed of the microorganism, a delay in the deterioration due to the enzyme, and maintenance of the color of meat.

However, microorganisms can grow even in packaged foods. In addition, in order to sterilize food, the food is packaged after sterilization treatment before packaging except for high-pressure pasteurization using a retort pouch. Therefore, re-contamination (cross-contamination) tends to occur at this time, and a problem may occur during storage.

Heat sterilization of retort pouches is considered to be effective and safe, but it has disadvantages due to physicochemical changes of food such as destruction of nutrients and change of flavor caused by heat sterilization. In addition, heat sterilization can not be performed for the treatment of heat sensitive foods.

Recently, Japanese Patent Laid-Open No. 2008-183025 discloses a plasma sterilization apparatus by generating a dielectric barrier discharge (DBD) using a breathable packaging material. (O ₃ ) or hydroxyl (O ₃ ) ions generated by excitation of the water vapor component in the air by an oxygen radical directly generated by dielectric barrier discharge inside or an ultraviolet ray (UV-ray) OH-), hydrogen peroxide (H ₂ O ₂ ), and the like. However, Japanese Patent Application Laid-Open No. 2008-183025 is characterized in that electrodes of different polarities are formed on one dielectric surface. The gap between the electrodes is limited to be minimized by the dielectric characteristics, A uniform plasma can not be generated. In addition, a process for forming electrodes of different polarities on one surface is very difficult and mass production is not applicable. For example, if there is a small defect in the dielectric, a relatively high electric field is formed at the defect site rather than a plasma discharge at the surface, so that the plasma discharge is started first, and the small defect becomes larger due to the plasma discharge . In addition, the Japanese Laid-Open Patent Application No. 2008-183025 can not secure the electrical safety due to the release of the electromagnetic wave and the exposure of the high voltage, and it can not be applied as a device for sterilization.

Korean Patent No. 10-1012442 discloses a sterilizing apparatus using atmospheric pressure plasma. However, in the packaging material of Korean Patent No. 10-1012442, it is not possible to secure electrical safety due to exposure of high voltage and generation of electromagnetic wave, and it is not applicable to a device for sterilization as disclosed in Japanese Patent Laid-Open No. 2008-183025.

In the application of food packaging materials, packaging plays a fundamental role in raising the value of goods and protecting them in the distribution process. Generally, paper, glass, plastic and the like are used for the packaging container. Particularly, in the case of dry food, a plastic packaging container such as polyethylene terephthalate (PET) is used to prevent moisture absorption, discoloration, fat burning and flavor deterioration, and aluminum foil having low moisture and oxygen permeability, (Al foil) are further laminated and used.

For the distribution and sale of food, the food is packed after a sufficient sterilization process, but the remaining microorganisms are grown during storage and studies are carried out to ensure food safety.

A representative example of this is high-pressure pasteurization using a retort pouch for food sterilization. Heat sterilization of retort pouches may be regarded as effective and safe, but it has disadvantages due to physicochemical changes of foods such as destruction of nutrients and changes in flavor caused by heat sterilization. In addition, heat sterilization can not be performed for the treatment of heat sensitive foods. Recently, nonthermal sterilization methods have been developed and commercialized to overcome the disadvantages of such heat sterilization.

Typical unheated sterilization methods include ultraviolet sterilization, radiation (gamma ray (γ-ray), electron ray, X-ray) sterilization, and ultrahigh pressure process sterilization. Ultraviolet rays are weak in permeability, making it difficult to treat food inside the package. On the other hand, radiation is highly permeable and can be processed in a fully packaged state, but its initial installation and management costs are enormous, and commercial acceptability is still slow due to low acceptability of consumers. Although the ultra high pressure process can be performed in a fully packaged state, this method also has a problem of high initial investment cost and physico-chemical change of food.

In the application of medical packaging, the packaging performs the basic function of preventing and storing secondary contamination of the sterilized medical device. There are a variety of medical packaging materials that are used to perform sterilization processes using a sterilizer in the use of reusable medical devices in a medical facility and thereafter. To prevent secondary contamination, use packaging materials that are permeable to the sterilizing agent defined in each sterilizer so that the medical device can be sterilized in a packaged state after packaging. For example, a packaging material made of woven, non-woven, paper, or polypropylene can be used for a high-pressure steam sterilizer. In the case of an ethylene oxide (EtO) sterilizer, a polymer material such as polyethylene and Tyvek may be used.

Unlike sterilization of foods, medical sterilizers are required to achieve sterility with a proven process, ie, a medical device that performs sterilization, to provide a medical device free of living microorganisms.

A typical medical sterilizer is a high-pressure steam sterilizer, which is sterilized at a high temperature of about 134 ^° C and a high pressure of about 2 bar. There is a restriction that sterilization can not be performed for medical devices whose use in high-temperature and high-pressure processes is limited, such as in food sterilization. In addition, further restrictions due to corrosion of the medical device due to moisture occur in order to perform sterilization by steam. The dry heat sterilizer to remove the restriction by moisture is sterilized at a high temperature of about 180 ^° C. However, it has a disadvantage in that it is impossible to use a medical device containing a material such as plastic which is vulnerable to heat.

Recently, a chemical sterilizer has been developed for the sterilization of medical devices which are vulnerable to high temperature, high pressure and moisture, and a representative example is an ethylene oxide sterilizer. However, due to the toxicity of ethylene oxide gas, proper management is required. After sterilization, it must be purified for more than 8 hours. Recently, ethylene oxide gas is regulated in some countries due to the risk of ethylene oxide gas. Plasma sterilizers have recently been developed and commercialized as an environmentally friendly chemical sterilizer. However, chemical sterilizers are also sterilized after packaging using special packaging materials such as Tyvek to solve the secondary contamination problem that may occur in the packaging process after sterilization.

However, the sterilization process performed on the medical device in a packaged state requires a long sterilization time of about 1 hour in order to limit the permeability of the sterilant to have its sterilization reliability. In addition, the primary contamination of the packaging material may affect the permeability of the sterilant and the sterilization reliability may be lowered. In addition, the conventional chemical sterilizer is processed in a sterilization chamber, and the size of the sterilizer is large, so that the introduction of the sterilizer is limited due to the lack of space in the medical institution, and the introduction of the technology is difficult due to the expensive equipment.

Therefore, the development of the plasma sterilization / sterilization technology inside the packaging material by using the structure of the packaging container itself is a highly effective technology because it can prevent secondary contamination and have a high sterilizing power. Through the commercialization of this technology, It can be performed in the inside of the packaging material, so that space utilization can be increased, and an economical and innovative sterilizer can be provided by simplifying the equipment.

Accordingly, the present inventors have completed the present invention with an economical low-temperature plasma packaging material sterilizer which makes it possible to sterilize the inside of a packaging material while maximizing the basic structure of the packaging material and ensuring electrical safety.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sterilizing film and a packaging container that can be sterilized by uniformly generating plasma on the inner surface of a packaging material by simply applying external power to the packaging material itself. More specifically, the present invention provides a sterilizing film and a packaging container for forming a vacuum inside the packaging material for application to a sterilizer for medical use so that the diffusion and penetration ability of the sterilizing agent generated in the inside of the packaging material can be enhanced.

It is another object of the present invention to provide a power supply device applied to a packaging container including a sterilizing film capable of sterilizing the inside of a packaging container by generating a plasma by simply applying external power to the packaging material itself.

The problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention provides a sterilizing film and a packaging container. This sterilizing film has an intermediate electrode layer including an intermediate electrode portion and an intermediate pad portion electrically connected to the outside while being electrically connected to the intermediate electrode portion and the intermediate electrode portion in the form of a thin plate, an upper dielectric barrier layer having flexibility, A dielectric barrier layer, and an intermediate electrode layer, and is electrically connected to the upper ground electrode section and the upper ground electrode section and is electrically connected to the outside An upper ground electrode layer including an upper ground pad portion, a lower ground electrode portion having a porous screen structure and provided on a lower surface opposite to an upper surface of the lower dielectric barrier layer having an intermediate electrode layer, the lower ground electrode portion having a plurality of through holes, And a lower ground pad portion electrically connected to the outside while being electrically connected to the lower ground pad portion A lower ground electrode layer, and a lower protective layer covering the lower ground electrode layer. The intermediate pad portion and the lower ground pad portion may be electrically connected to an external power source to form a plasma around the perforated screen structure of the lower ground electrode portion.

The intermediate electrode layer may have a planar shape narrower than the upper ground electrode layer so as to have a structure that is completely covered by the upper ground electrode layer.

The upper ground electrode layer and the lower ground electrode layer may have the same planar outer circumferential shape.

The upper dielectric barrier layer and the lower dielectric barrier layer may be formed of at least one of polytetrafluoroethylene (PTFE), nylon, polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP) , Polystyrene (PS), or polyester (polyester).

The upper dielectric barrier layer and the lower dielectric barrier layer may have a thickness of at least 30 [mu] m.

The intermediate electrode layer, the upper ground electrode layer, and the lower ground three-electrode layer may include copper, chromium, or aluminum.

The intermediate electrode layer, the upper ground electrode layer, and the lower ground electrode layer may have a thickness in the range of 5 [mu] m to 20 [mu] m.

The lower protective layer may comprise polypropylene or polyethylene.

The surface of the lower protective layer facing the lower ground electrode layer may be in an embossed form.

And an upper protective layer disposed on the upper ground electrode layer. The top protective layer may comprise polyester, nylon or polyethylene that is printable on the top surface and can protect the interior against physical impact. The germicidal film may further comprise a friction resistant layer interposed between the upper ground electrode layer and the upper protective layer.

The diameter of the through-hole of the porous screen structure may range from 0.3 mm to 7 mm.

The middle pad portion and the lower ground pad portion are spaced apart from each other so as not to face each other. The middle pad portion and the upper ground pad portion are spaced apart from each other so as not to face each other, and the upper ground pad portion and the lower ground pad portion face each other And can be spaced apart.

The upper ground electrode layer and the lower ground electrode layer may be formed to have the same planar outer circumferential shape.

According to another aspect of the present invention, there is provided a power supply apparatus applied to a packaging container including a sterilizing film. This power supply device comprises a power supply for generating a plasma in a packaging container containing the sterilizing film described above, an intermediate pad portion and an upper ground pad portion of the sterilizing film, or a power supply And a hermetically sealed portion including a heat supply portion for generating heat to the heating means and a heat supply portion for generating heat to the packaging means.

One of the two power connection terminals can connect the upper ground pad portion and the lower ground pad portion together.

The power supply may further include a vacuum to lower the pressure inside the packaging container. The pressure inside the packaging container may be less than 200 torr by vacuuming. The sealing part can seal the packaging container after the pressure inside the packaging container is lowered by the vacuuming.

The power supply device may further include an impedance meter connected to the power supply and the power supply connection terminals and the power supply connection point.

As described above, according to the means for solving the problem of the present invention, the sterilizing film has the electrode layers of three layers, so that the electrical stability can be secured. Thereby, a highly reliable sterilizing film can be provided. In addition, since the surface of the lower protective layer corresponding to the inner layer of the sterilizing film has an embossed shape, an effective vacuum can be formed and the plasma sterilization efficiency can be increased. Accordingly, a sterilized packaging container which is more economical and has high sterilization reliability than conventional plasma sterilizers can be provided. In addition, since the sterilization is performed in a narrower packing material than the sterilization chamber of the conventional plasma sterilizer, the loss of the sterilant can be minimized, and the process time can be shortened. Further sterilization agent (in the case of the conventional plasma sterilizer, ) Can be used to perform reliable sterilization. As a result, the maintenance cost of the sterilizer is reduced, and the convenience of the user can be maximized.

In addition, according to the solution of the problem of the present invention, the power supply device includes the vacuum forming part and the sealing part for vacuum-sealing the packaging container, thereby preventing re-contamination of the object to be processed and performing efficient sterilization. In addition, it can be performed in vacuum sealed packaging and sterilized equipment, maximizing ease of use. In addition, since the sterilizer is miniaturized according to the configuration of the small power source and the construction of the plasma electrode using the packaging material, the sterilizer can be carried, which makes it possible to sterilize the medical device in the external treatment of the medical institution. Accordingly, sterilization reliability and storage efficiency are excellent, and a sterilized packaging container and a power supply device which are economical and convenient can be provided.

FIG. 1A is a conceptual view illustrating a packaging container including a sterilizing film according to an embodiment of the present invention. FIG.
1B is a cross-sectional view showing cross-sectional views of the sterilizing film of FIG. 1A.
1C is a sectional view of FIG. 1A.
Fig. 2 is a plan view of Fig. 1a.
3A to 3D are cross-sectional views illustrating sterilizing films according to still another embodiment of the present invention.
4 is a cross-sectional view illustrating a packaging container including a sterilizing film according to an embodiment of the present invention.
5A to 5C are process conceptual diagrams illustrating a method of manufacturing a sterilizing film according to an embodiment of the present invention.
6 is a block diagram illustrating a power supply device applied to a packaging container including a sterilizing film according to an embodiment of the present invention.

A typical dielectric barrier plasma source generates a plasma at the dielectric plate surface by applying a voltage to the electrodes. The dielectric barrier plasma source performs a sterilization process on the contents disposed at a distance from the dielectric plate. In order to package the contents, it is necessary to insert the contents into the packaging material after the sterilization process is completed.

Conventional dielectric barrier plasma sources have a problem that plasma sterilization is performed and secondary contamination occurs in the process of transferring the contents of the sterilization process to the packaging material. Therefore, hygienic management of the environment in which the packaging is carried out is very important, and costs may be incurred accordingly. In addition, since it is impossible to completely manage the packaging environment, it is necessary to sterilize the contents which require sterilization such as a medical instrument. As a result, the cost of the entire sterilization process is increased. In addition, there is a disadvantage in that uniformity of the sterilizing performance is lowered because the distance from the dielectric barrier plasma source is not constant in processing curved contents.

A typical dielectric barrier discharge technique requires that the contents be spaced a certain distance from the plasma electrode and that the contents contain a large amount of moisture. There is a disadvantage that usage is limited. Therefore, it is difficult to apply a conventional dielectric barrier plasma sterilization technique as a packaging material technology.

The retort pouch uses a lamination film, which is made by attaching three layers or five layers of plastic film or aluminum foil with different properties to improve heat resistance, gas permeability and heat adhesion.

The plasma sterilizing film according to one embodiment of the present invention can be integrally bonded to the structure of a conventional retort pouch. A typical retort pouch film is composed of inner layer (polypropylene) / interlayer (aluminum) / outer layer (polyester). Each layer of the retort pouch film can be bonded to each other through an adhesive layer. On the other hand, the plasma sterilizing film is composed of a lower protective layer / a lower electrode / a dielectric barrier film / an upper electrode / an upper protective layer which are sequentially stacked. For dielectric barrier discharge, a plate-shaped upper electrode and a porous screen-shaped lower electrode are disposed with a dielectric barrier film interposed therebetween. Therefore, in the structure of the retort pouch, in order to perform the dielectric barrier discharge, it is required to change the structure of the retort pouch.

For example, if the intermediate layer (aluminum) of the retort pouch is used as the upper electrode of the dielectric barrier discharge and the inner layer of the retort pouch (polypropylene) is used as the dielectric barrier film of the dielectric barrier discharge, a separate lower electrode is required. On the other hand, when the lower electrode is exposed to the liquid, the lower electrode of the porous screen shape may be electrically connected to each other to cause an unstable discharge. Therefore, the lower electrode is covered with a lower protective layer to suppress direct contact with the object to be treated. Accordingly, the lower protective layer may be a polypropylene or polyethylene material as the food contact layer.

Further, in the structure of the retort pouch, the outer layer functions as a protective layer using polyethylene materials and functions as an upper protective layer disposed on the upper electrode of the plasma sterilizing film. As a result, in the structure of the retort pouch, by adding the lower electrode and the lower protective layer, a plasma sterilization film can be provided. When the plasma sterilizing film is operated as a packaging container, stable plasma discharge can be performed to sterilize the inside of the packaging container or the inside of the retort pouch.

The plasma sterilization film can be used as a whole or as a part of a packaging container per se. In addition, the plasma sterilization film can be combined with conventional packaging containers to provide a plasma sterilization function. When the plasma sterilizing film is applied to a retort pouch, the retort pouch may be performed by either plasma sterilization and heat sterilization, either selectively or in combination.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in different forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the concept of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

Like reference numerals refer to like elements throughout the specification. Accordingly, although the same reference numerals or similar reference numerals are not mentioned or described in the drawings, they may be described with reference to other drawings. Further, even if the reference numerals are not shown, they can be described with reference to other drawings.

FIG. 1A is a conceptual view illustrating a packaging container including a sterilizing film according to an embodiment of the present invention, FIG. 1B is a cross-sectional view showing regions of the sterilizing film of FIG. 1A, FIG. 1C is a sectional view of FIG. 1A And Fig. 2 is a plan view of Fig. 1A.

Referring to Figs. 1A and 2, the packaging container 10 includes a sterilizing film 100. The sterilization film 100 includes a sterilizing area 103a, a sealing area 103c, and a pad area 103b. The sterilizing area 103a is formed between the upper ground electrode part 120a and the middle electrode part 140a and between the upper ground electrode part 120a and the middle electrode part 140a. A plasma is generated inside the sealed packaging container 10 by using the disposed upper dielectric barrier layer 130 and the lower dielectric barrier layer 150 disposed between the lower ground electrode portion 160a and the middle electrode portion 140a. . The sealing region 103c is disposed around the sterilizing region 103a to house the object to be processed therein. The pad region 103b includes an intermediate pad portion 140b electrically connected to the intermediate electrode portion 140a and a lower ground pad portion 140b electrically connected to the lower ground electrode portion 160a. As shown in FIG. 2, the pad region 103b may include an upper ground pad portion 120b electrically connected to the upper ground electrode portion 120a. That is, one surface of the upper ground pad portion 120b, the middle pad portion 140b, and the lower ground pad portion 160b are exposed to the atmosphere, respectively. Alternatively, one surface of the pad portions 120b, 140b or 160b may not be exposed to the atmosphere. In this case, the layers on the pad portions 120b, 140b or 160b are penetrated by the power connection terminals (see 212 in FIG. 6) of the power source device 200, and the pad portions 120b, 140b or 160b and the power connection terminal And can be electrically connected.

The sterilizing area 103a, the sealing area 103c and the pad area 103b may be connected to one another in a plurality of upper and lower dielectric barrier layers 130 and 150, respectively. The pad region 103b has a structure similar to that of the sterilizing region 103a but one side of the intermediate electrode layer 140 is exposed to form the intermediate pad portion 120b and one surface of the lower ground electrode layer 160 is exposed, And may be formed to form a portion 160b. The sealing region 103c has a structure similar to that of the sterilizing region 103a so that the intermediate electrode portion 140a, the intermediate pad portion 140b, the lower ground electrode portion 160a, or the lower ground pad portion 160b are removed .

The sterilizing area 103a forms a plasma through the dielectric barrier discharge in the interior of the packaging container 10 and sterilizes the inside thereof. The sterilizing region 103a of the sterilizing film 100 includes a plurality of flexible dielectric barrier layers 130 and 150, a top ground electrode portion of a thin plate shape disposed on the top surface of the top dielectric barrier layer 130 A plurality of dielectric barrier layers 130a and 150a disposed on the lower surface of the lower dielectric barrier layer 160, a thin plate-like intermediate electrode portion 140a disposed between the plurality of dielectric barrier layers 130 and 150, A lower protective layer 110 disposed on the upper surface of the upper ground electrode portion 120a and a lower protective layer 110 disposed below the lower surface of the lower ground electrode portion 160a, 170).

The pad region 103b is formed for electrical connection with the outside and is disposed outside the inner space of the packaging container 10 and is electrically connected to the intermediate pad 140b and the lower ground pad 160b or The intermediate pad 140b and the upper ground pad 120b may not be disposed opposite to each other. The intermediate pad 140b and the lower ground pad 160b and / or the intermediate pad 140b and the upper ground pad 120b may be connected to an external power source. The lower ground pad 160b and / or the upper ground pad 120b may be grounded, and a high voltage may be applied to the intermediate pad 140b. Conversely, the intermediate pad 140b may be grounded, and a high voltage may be applied to the lower ground pad 160b and / or the upper ground pad 120b.

The sealing region 103c may be a region disposed to enclose the sterilizing region 103a and forming a closed space. The sealing region 103c of the sterilizing film 100 includes a plurality of flexible dielectric barrier layers 130 and 150, a thin, top ground electrode portion (not shown) disposed on the top surface of the top dielectric barrier layer 130 An upper protective layer 110 disposed on the upper surface of the upper ground electrode portion 120a, a lower ground electrode layer 120b disposed on the lower surface of the lower dielectric barrier layer 150 and having a plurality of through holes, And a lower protective layer 170 disposed on the lower surface of the electrode portion 160a and the lower ground electrode portion 160a. The sealing region 103c may include a portion where the upper sterilizing film 100 and the lower packaging (or sterilizing) film are joined by thermocompression bonding.

According to a modified embodiment of the present invention, the sealing region 103c may not generate plasma. Accordingly, the upper ground electrode part 120a and the lower ground electrode part 160a in the sealing area 103c can all be removed. On the other hand, only one of the upper ground electrode part 120a and the lower ground electrode part 160a may be disposed to prevent external light from penetrating into the packaging container 10 in the sealing area 103c.

The plurality of dielectric barrier layers 130 and 150 may comprise at least one of polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, and polyester. The dielectric barrier layers 130 and 150 may perform similar functions as the inner layer of the retort pouch. The dielectric barrier layers 130 and 150 may serve as a substrate film on which the upper ground electrode part 120a, the intermediate electrode part 140a and the lower ground electrode part 160a are formed. In addition, the dielectric barrier layers 130 and 150 can be materials that can generate dielectric barrier discharge stably at high voltage without dieletric breakdown. The dielectric breakdown voltage is determined according to the dielectric strength value and the thickness of the selected material. If the voltage is roughly higher than the driving voltage of the atmospheric plasma, most of the materials can be used. The thickness of the dielectric barrier layers 130 and 150 may range from 30 [mu] m to 300 [mu] m. Preferably, the thickness of the dielectric barrier layers 130 and 150 may be around 100 [mu] m. The dielectric barrier layers 130 and 150 preferably have flexibility and are preferably made of a material having flexibility in adhesion between the upper ground electrode portion 120a and the middle electrode portion 140b and between the middle electrode portion 140b and the lower ground electrode portion 160a This good material is preferable.

The upper ground electrode part 120a, the intermediate electrode part 140a, and the lower ground electrode part 160a may include copper (Cu) or aluminum. The upper ground electrode part 120a, the intermediate electrode part 140a and the lower ground electrode part 140a are electrically connected to the lower dielectric layer 170 and the lower dielectric barrier layer 150, And can be contaminated. Accordingly, the upper ground electrode part 120a, the intermediate electrode part 140a, and the lower ground electrode part 160a can be coated with a thin film such as aluminum and can be harmless to the human body. The upper ground electrode portion 120a may be coated on the upper surface of the upper dielectric barrier layer 130. The upper ground electrode part 120a may be patterned through a patterning process after the upper ground electrode layer 120 is coated. For example, a region of the upper ground electrode layer 120 opposed to the intermediate pad portion 140b may be removed.

The intermediate electrode portion 140a may be coated below the lower surface of the upper dielectric barrier layer 130 or over the upper surface of the lower dielectric barrier layer 150. [ The intermediate electrode portion 140a may be formed through a patterning process after the intermediate electrode layer 140 is formed. The middle electrode portion 140a may have a planar shape that is narrower than the upper ground electrode portion 120a so as to have a structure that is completely covered by the upper ground electrode portion 120a.

The lower ground electrode portion 160a may be coated beneath the lower surface of the lower dielectric barrier layer 150. The lower ground electrode 160a may be formed through a patterning process after the lower ground electrode 160 is formed. The lower ground electrode part 160a may have the same planar outer shape as the upper ground electrode part 120a. That is, although the lower ground electrode part 160a has a plurality of through holes therein, the planar surface of the lower ground electrode part 160a with respect to the plane outer circumference is the same as the planar surface with respect to the outer circumferential surface of the upper ground electrode part 120a . The thickness of the upper ground electrode portion 120a, the intermediate electrode portion 140a, and the lower ground electrode portion 160a may be in a range of 5 占 퐉 to 20 占 퐉. The thickness of the upper ground electrode part 120a, the intermediate electrode part 140a, and the lower ground electrode part 160a may be about 15 占 퐉.

The upper ground electrode part 120a is used as a ground electrode of a dielectric barrier discharge in a thin plate shape and may function as a light blocking layer for blocking external light and an air blocking layer for blocking external air from entering. The intermediate electrode portion 140a is in the form of a thin plate and is used as an electrode for applying a dielectric barrier discharge. Since the middle electrode portion 140a has a planar shape that is narrower than the upper ground electrode portion 120a and is completely covered by the upper ground electrode portion 120a, the plasma generated inside the packaging container 10 is radiated to the outside The possibility can be minimized.

The upper ground pad portion 120b is electrically connected to the upper ground electrode portion 120a, and the upper protective layer 110 may be removed to be electrically connected to an external power source. The upper ground pad 120b and the upper ground electrode portion 120a are disposed on the upper dielectric barrier layer 130. The upper ground pad 120b and the upper ground electrode 120a may be formed at the same time.

The intermediate pad portion 140b is electrically connected to the intermediate electrode portion 140a and the upper protective layer 110, the upper ground electrode layer 120 and the upper dielectric barrier layer 130 may be removed and electrically connected to an external power source have. The intermediate pad portion 140b and the intermediate electrode portion 140a are disposed on the lower dielectric barrier layer 150. [ The intermediate pad portion 140b and the intermediate electrode portion 140a may be formed at the same time.

The lower ground electrode part 160a has a porous screen shape and forms a strong electric field to cause a dielectric barrier discharge. The shape of the lower ground electrode part 160a may be a shape including a mesh shape or a hole arranged in a matrix form. The shape of the hole may be a circle, a polygon, a slit, or a serpentine slit shape. The diameter of the through-hole of the porous screen structure corresponding to the diameter or width of the hole may have a range of 0.3 mm to 7 mm. Further, the width of the lines surrounding the through holes may be 2 mm or less.

The lower ground pad portion 160b may be electrically connected to the lower ground electrode portion 160a and the intermediate pad portion 140b may not be disposed opposite to the lower ground pad portion 160b. Thus, plasma generation can be suppressed at the pad portion. The lower ground pad portion 160b and the lower ground electrode portion 160a may be formed on the lower surface of the lower dielectric barrier layer 150 at the same time.

The upper protective layer 110 is disposed on the upper ground electrode portion 120a, and may be exposed to the external atmosphere. The upper protective layer 110 can function to protect the surface with sufficient strength. The top protective layer 110 may be polyether or polyethylene terephthalate. The thickness of the upper protective layer 110 may range from several micrometers to several tens of micrometers. Preferably, the thickness of the top protective layer 110 may be around 10 μm. The upper protective layer 110 may be bonded to the upper dielectric barrier layer 130 by thermocompression bonding or may be bonded to the upper dielectric barrier layer 130 or the upper ground electrode portion 120a using an adhesive. The upper protective layer 110 may be removed on the upper ground pad portion 120b to expose the upper ground pad portion 120b.

According to a modified embodiment of the present invention, the upper protective layer 110 may be formed on the upper dielectric barrier layer 130 having the upper electrode layer 120 formed thereon through a coating process.

The lower protective layer 170 can directly contact the package and protect the lower ground electrode part 160a. The lower protective layer 170 may be polypropylene. The lower protective layer 170 may be made of the same material as the lower dielectric barrier layer 150. The thickness of the lower protective layer 170 may range from several tens of micrometers to several hundreds of micrometers. Preferably, the thickness of the lower protective layer 170 may be around 200 μm. The lower protective layer 150 may be removed under the lower ground pad portion 160b to expose the lower ground pad portion 160b.

The lower ground electrode part 160a may be coated on the lower surface of the lower dielectric barrier layer 150 or may be coated on the upper surface of the lower protective layer 170. [ The lower protective layer 170 may be bonded to the lower dielectric barrier layer 150 by thermocompression bonding or through an adhesive layer.

According to a modified embodiment of the present invention, the lower protective layer 170 may be formed on the lower surface of the lower dielectric barrier layer 150 on which the lower ground electrode part 160a is formed.

The external power supply 200 can output AC power of low frequency (1 kHz to 100 kHz). The waveform of the external power source 200 may be any waveform such as a sine wave, a square wave, and a pulse. The peak voltage is driven within a range of the dielectric breakdown voltage of the dielectric barrier layer 130 or 150 used, and usually 0.5 kV to 5 kV is used. When treating temperature sensitive growth, the temperature of the gas induced from the plasma and the temperature of the electrode are important. Using a pulse voltage having a pulse width in the range of tens to hundreds of nanoseconds and a repetition rate in the range of 1 kHz to 100 kHz The temperature can be maintained near room temperature.

The plasma used in the present invention is a dielectric barrier discharge. As the discharge gas, inert gas such as helium, argon, neon (Ne) and the like as well as oxygen, nitrogen and air may be used at atmospheric pressure. The inside of the packaging container 10 can be treated to contain a small amount of oxygen.

In addition, the type of the substitution gas usable as the discharge gas of the plasma may vary depending on the packaged food, and usually nitrogen, oxygen, and carbon dioxide (CO ₂ ) are often used. It is preferable that at least 1 mole% of oxygen gas or nitrogen gas is substituted because microorganism sterilization using atmospheric plasma plays an important role of sterilization of active nitrogen species and active oxygen species. In the case of air, the molar composition ratio of N ₂ : O ₂ = 78.09: 20.95 is also easy to discharge the dielectric barrier, and it is possible to sterilize effectively without additional cost to the gas.

The sterilizing film 100 generates a plasma to provide a sterilizing function. The sterilizing film 100 is electrically connected to a plurality of flexible dielectric barrier layers 130 and 150, an upper ground electrode portion 120a and an upper ground electrode portion 120a in a thin plate shape, An upper ground electrode layer 120 disposed on the upper surface of the upper dielectric barrier layer 130 and an intermediate electrode portion 140a and a thin plate intermediate electrode portion 140a, An intermediate electrode layer 140 disposed between the plurality of dielectric barrier layers 130 and 150 and a plurality of through holes having a plurality of through holes, And a lower ground pad portion 160b electrically connected to the lower ground electrode portion 160a and the lower ground electrode portion 160a and electrically connected to the outside of the screen structure, The bottom surface And a lower protective layer 170 disposed to surround the exposed surface of the ground electrode layer 160 and the lower ground electrode layer 160 and formed of a dielectric.

The upper ground pad portion 120b, the intermediate pad portion 140b and the lower ground pad portion 160b are electrically connected to an external power source to form a plasma around the lower ground electrode portion 160a of the porous screen structure. The sterilizing film 100 may include a lower protective layer 170 so as to suppress an abnormal discharge even in contact with the liquid. In addition, it can be flexible enough to be attached to any type of packaging container 10.

The sterilization film 100 has a structure similar to that of a conventional retort pouch film. A typical retort pouch film is composed of inner layer (polypropylene) / interlayer (aluminum) / outer layer (polyester). The manufacturing method of the sterilizing film 100 may be similar to that of a conventional retort pouch film.

The sterilizing film 100 may be used as a part of the flexible hermetically sealed container or may be inserted into the hermetically sealed container separately from the hermetically sealed container. When used separately and inserted into the hermetically sealed container, the sterilizing area 103a may be disposed inside the hermetically sealed container, and the pad area 103b may be disposed to protrude out of the hermetically sealed container. In addition, the hermetically sealed container can press the pad region 103b or the sealing region 103c to form an enclosed space therein. When the sealed container has a flexible packaging container such as a vinyl packaging container or a retort pouch, the sterilizing film 100 may be heat-pressed and fixed or fused with the flexible packaging container.

On the other hand, when the sealed container is a fixed plastic container to which the sealed container is coupled using the handle, the sterilized film 100 has a sufficiently thin thickness so that it can be fitted by packing between the body of the fixed plastic container and the lid . Accordingly, the sterilizing area 103a of the sterilizing film 100 may be disposed inside the plastic hermetically sealed container, and the pad area 103b may be disposed outside the plastic hermetically sealed container.

3A to 3D are cross-sectional views illustrating sterilizing films according to still another embodiment of the present invention.

3A, the sterilizing film 100a is electrically connected to a plurality of flexible dielectric barrier layers 130 and 150, a thin plate-shaped upper ground electrode portion 120a, and an upper ground electrode portion 120a And an upper ground pad portion 120b for electrical connection to the outside, and an upper ground electrode layer 120 disposed on the upper surface of the upper dielectric barrier layer 130, a thin plate-shaped middle electrode portion 140a, An intermediate electrode layer 140 electrically connected to the intermediate electrode portion 140a and including an intermediate pad portion 140b for external electrical connection and disposed between the plurality of dielectric barrier layers 130 and 150, And a lower ground pad portion 160b electrically connected to the external and electrically connected to the lower ground electrode portion 160a and the lower dielectric electrode layer 160a having through-holes of the lower dielectric barrier layer 150 < / RTI > It arranged to surround the exposed surface of the lower ground electrode 140 and the lower ground electrode 160, and a lower protective layer 170 is formed of a dielectric material. The upper ground pad portion 120b, the intermediate pad portion 140b and the lower ground pad portion 160b are electrically connected to an external power source to form a plasma around the lower ground electrode portion 160a of the porous screen structure.

The upper protective layer 110 may be disposed on the upper ground electrode layer 120. The top protective layer 110 may be polyethylene, polypropylene, polystyrene, and polyester.

The lower protective layer 170 may be polyethylene, polypropylene, polystyrene, and polyester. The lower protective layer 170 may be disposed only on the lower surface and the side surface of the through hole of the lower ground electrode part 160a of the porous screen structure.

The plurality of dielectric barrier layers 130 and 150 may comprise at least one of polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, and polyester.

The upper ground electrode layer 120, the intermediate electrode layer 140, and the lower ground electrode layer 160 may include copper or aluminum.

The lower protective layer 170 may include through holes aligned with the through holes of the lower ground electrode part 160a. The lower ground electrode part 160a may have a plurality of porous screen structures. The lower protective layer 170 may be bonded to the lower dielectric barrier layer 150 formed with the lower ground electrode part 160a through thermocompression bonding or adhesive.

Referring to FIG. 3B, the sterilizing film 100b may perform a dielectric barrier discharge. The lower protective layer 170 conformally covers the profile of the lower ground electrode portion 160a and may cover the lower surface of the exposed lower dielectric barrier layer 150. [ The lower protective layer 170 may be formed through a coating. Alternatively, the lower protective layer 170 may be bonded to the lower dielectric barrier layer 150 formed with the lower ground electrode part 160a through thermocompression bonding or adhesive.

Referring to FIG. 3C, the sterilizing film 100c can perform a dielectric barrier discharge. The anti-friction layer 122 may be disposed between the upper ground electrode layer 120 and the upper protective layer 110. The anti-friction layer 122 protects the internal film and can suppress damage caused by the impact. The anti-friction layer 122 may be made of polyethylene terephthalate or nylon.

Referring to FIG. 3D, the sterilizing film 100d may perform a dielectric barrier discharge. The lower protective layer 170 may be in the form of an embossed surface facing the lower ground electrode part 160a. This may be for facilitating the formation of vacuum in a vacuum process for lowering the pressure inside the packaging container (refer to 10 in FIG. 1), for facilitating the generation of plasma and securing a space for generating a plasma, thereby increasing plasma sterilization efficiency.

4 is a cross-sectional view illustrating a packaging container including a sterilizing film according to an embodiment of the present invention.

Referring to Fig. 4, the packaging container 10 uses a packaging film 101 to seal the object to be processed. A portion of the packaging film 101 may comprise a sterilizing film 100. The sterilizing film 100 includes a plate-shaped upper ground electrode portion 120a, an upper protective layer 110 disposed on the upper ground electrode portion 120a, a plate-like middle portion disposed below the upper ground electrode portion 120a, A lower ground electrode part 160a having a porous screen structure disposed under the intermediate electrode part 140a, a lower protective layer 170 disposed below the lower ground electrode part 160a, An upper dielectric barrier layer 130 disposed between the lower electrode part 120a and the middle electrode part 140a and a lower dielectric barrier layer 150 disposed between the middle electrode part 140a and the lower ground electrode part 160a. do.

The packaging container 10 may include a packaging film 101 providing one side of the packaging container 10 and a sterilizing film 100 forming the other side of the packaging container 10 in combination with the packaging film 101 . The edges of the sterilization film 100 and the packaging film 101 may be fused by thermocompression bonding. The sterilizing film 100 can receive the electric power from the external power source and perform the dielectric barrier discharge inside the packaging container 10. [

The packaging film 101 may include at least one of polyethylene, polypropylene, polystyrene, polyvinyl and polyester. Alternatively, the packaging film 101 may be composed of an inner layer (polypropylene) / an intermediate layer (aluminum) / an outer layer (polyester) in a retort pouch film structure.

The sterilizing film 100 may include a sterilizing area and a pad area, and the pad area may be disposed to protrude out of the packaging container 10.

5A to 5C are process conceptual diagrams illustrating a method of manufacturing a sterilizing film according to an embodiment of the present invention.

Referring to FIG. 5A, an upper ground pad portion (120b in FIG. 1C) for electrically connecting to the outside while being electrically connected to the upper ground electrode portion (refer to 120a in FIG. 1C) The upper protective layer 110 is formed with an upper ground electrode layer 120 formed thereon. The upper protective layer 110 may be formed of polyester. The upper ground electrode layer 120 may be formed of copper or aluminum. The upper ground electrode layer 120 may have a thickness ranging from 5 [mu] m to 20 [mu] m.

Although not shown in the drawing, the upper protective layer 110 having the upper ground electrode layer 120 is prepared by further interposing a frictional resistance layer (see 122 in FIG. 3C) between the upper ground electrode layer 120 and the upper protective layer 120 And the like.

An upper dielectric barrier layer 130 is formed on the upper ground electrode layer 120 of the upper protective layer 110. The upper dielectric barrier layer 130 may be formed to include at least one selected from polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, or polyester. The upper dielectric barrier 130 may have a range from 30 [mu] m to 300 [mu] m. Preferably, the thickness of the upper dielectric barrier layer 130 may be around 100 [mu] m.

Referring to FIG. 5B, a lower ground electrode part (refer to 160a in FIG. 1C) of a porous screen structure having a plurality of through holes and a lower ground pad part (also shown in FIG. 1C) for electrically connecting to the outside while being electrically connected to the lower ground electrode part A lower ground electrode layer 160 including the lower electrode layer 160b (see 160b of FIG. The preparation of the lower ground electrode layer 160 may be such that the diameter of the through-hole of the porous screen structure is in the range of 0.3 mm to 7 mm. The lower ground electrode layer 160 may be formed to have the same planar outer shape as the upper ground electrode layer 120. The lower ground electrode layer 160 may be formed of copper or aluminum. The lower ground electrode layer 160 may have a thickness ranging from 5 [mu] m to 20 [mu] m.

A lower dielectric barrier layer 150 and a lower protective layer 170 are laminated on both surfaces of the lower ground electrode layer 160. [ The lower dielectric barrier layer 150 may be formed to include at least one selected from polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, or polyester. The lower dielectric barrier layer 150 may have a thickness of at least 30 占 퐉. The lower protective layer 170 may be formed of polypropylene or polyethylene. The surface of the lower protective layer 170 facing the lower ground electrode layer 160 may be in an embossed form.

Referring to FIG. 5C, an intermediate electrode layer (see 140a in FIG. 1C) having a thin plate shape and an intermediate pad portion (see 140b in FIG. 1C) electrically connected to the intermediate electrode portion and electrically connected to the outside, (140) are prepared. The intermediate electrode layer 140 may be prepared so as to have a narrower planar area than the upper ground electrode layer 120 so as to have a structure completely covered by the upper ground electrode layer 120. The intermediate electrode layer 140 may be formed of copper or aluminum. The intermediate electrode layer 140 may have a thickness ranging from 5 [mu] m to 20 [mu] m.

The upper dielectric barrier layer 130 and the lower dielectric barrier layer 150 bonded to the upper ground electrode layer 120 and the lower dielectric electrode layer 160 bonded to the lower ground electrode layer 160 are laminated on both surfaces of the intermediate electrode layer 140.

5A to 5C, the upper ground pad portion and the intermediate pad portion are formed to be spaced apart from each other so as not to face each other, the lower ground pad portion and the intermediate pad portion are formed to be spaced apart from each other so as not to face each other, The upper ground pad portion and the lower ground pad portion may be formed to be spaced apart from each other (see FIG. 2) so as to face each other.

The upper dielectric barrier layer 130 is joined to the upper ground electrode layer 120 of the upper protective layer 110 and the lower dielectric barrier layer 150 and the lower protective layer 150 are formed on both surfaces of the lower ground electrode layer 160. [ And an upper dielectric barrier layer 130 and a lower dielectric barrier layer 160 bonded to the lower ground electrode layer 160 on both surfaces of the intermediate electrode layer 140, 130 may be laminated using a laminator roller method or a stamp method.

The upper dielectric barrier layer 130 is formed on the upper ground electrode layer 120 of the upper protective layer 100 and the lower dielectric barrier layer 150 and the lower protective layer 150 are formed on both surfaces of the lower ground electrode layer 160. [ And an upper dielectric barrier layer 130 and a lower dielectric barrier layer 160 bonded to the lower ground electrode layer 160 on both surfaces of the intermediate electrode layer 140, 150 may be performed via the adhesive layer 125, 135, The adhesive layer 125, 135 or 145 may comprise polyethylene.

6 is a block diagram illustrating a power supply device applied to a packaging container including a sterilizing film according to an embodiment of the present invention.

Referring to Figure 6, the power supply 200 includes a power supply 210 for generating plasma within a packaging container (see 10 in Figure 1c) containing the sterilizing film (see 100 in Figure 1c) described above, The power of the power supply unit 210 is supplied to the intermediate pad portion of the film (see 140b in FIG. 1C) and the upper ground pad portion (see 120b of FIG. 1C) or the intermediate pad portion and the lower ground pad portion And a heat supply part 220 for generating heat in the heating device 222. The heat supply part 220 may include a plurality of power supply terminals 212 for applying power to the packaging container 212, have.

One of the two power connection terminals 212 can connect the upper ground pad portion and the lower ground pad portion at the same time.

The power supply apparatus 200 may further include a vacuum for lowering the pressure inside the packaging container. The vacuum part may include a pump 240 for sucking air in the inside of the packaging container through a thin pipe connected to the packaging container and a filter 242 for purifying and discharging air from the pump 240. The pressure inside the packaging container may be less than 200 torr by vacuuming. The sealing part can seal the packaging container after the pressure inside the packaging container is lowered by the vacuuming.

The power supply apparatus 200 further includes an impedance analyzer 230 connected to a power supply connection unit 212 and a matcher 232 connected between the power supply unit 210 and the power supply connection terminals 212 . Plasma can be stably generated inside the packaging container by the matcher 232 and the impedance meter 230.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative and non-restrictive in every respect.

10: Packaging container
100, 100a, 100b, 100c, 100d: sterilized film
101: Packaging film
103a: sterilization zone
103b: sealing area
130c: pad area
110: upper protective layer
120: upper ground electrode layer
120a: upper ground electrode portion
120b: upper ground pad portion
122:
125, 135, 145: adhesive layer
130: upper dielectric barrier layer
140: intermediate electrode layer
140a: intermediate electrode portion
140b:
150: lower dielectric barrier layer
160: Lower ground electrode layer
160a: lower ground electrode portion
160b: lower ground pad portion
170: Lower protective layer
200: Power supply unit
210: Power supply
212: Power connection terminal
220:
222: Heating means
230: Impedance analyzer
232: Matcher
240: pump
242: Filter

Claims (36)

In a sterilizing film having a sterilizing function by generating a plasma,
An intermediate electrode layer 140 including a thin plate-shaped intermediate electrode portion 140a and an intermediate pad portion 140b electrically connected to the intermediate electrode portion and electrically connected to the outside;
An upper dielectric barrier layer 130 and a lower dielectric barrier layer 150 interposed between the intermediate electrode layers, the upper dielectric barrier layer 130 and the lower dielectric barrier layer 150 being flexible;
The upper ground electrode part 120a and the upper ground electrode part 120b are provided on a second surface opposite to the first surface of the upper dielectric barrier layer 130 provided with the intermediate electrode layer 140, An upper ground electrode layer 120 including an upper ground pad part 120b electrically connected to the outside while being connected to the upper ground electrode part 120b.
A lower ground electrode part 160a having a porous screen structure and provided on a second surface opposite to the first surface of the lower dielectric barrier layer provided with the intermediate electrode layer and having a plurality of through holes, A lower ground electrode layer 160 including a lower ground pad portion 160b electrically connected to the outside while being electrically connected to the lower ground electrode layer 160; And
And a lower protective layer 170 covering the lower ground electrode layer,
Wherein the intermediate pad portion and the lower ground pad portion are electrically connected to an external power source to form a plasma around the perforated screen structure of the lower ground electrode portion. The method according to claim 1,
Wherein the intermediate electrode layer has a planar shape narrower than the upper ground electrode layer so as to have a structure completely covered by the upper ground electrode layer. The method according to claim 1,
Wherein the upper ground electrode layer and the lower ground electrode layer have the same planar outer circumferential shape. The method according to claim 1,
Wherein the upper dielectric barrier layer and the lower dielectric barrier layer comprise at least one selected from the group consisting of polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, and polyester. The method according to claim 1,
Wherein the upper dielectric barrier layer and the lower dielectric barrier layer have a thickness of at least 30 占 퐉. The method according to claim 1,
Wherein the intermediate electrode layer, the upper ground electrode layer, and the lower ground electrode layer comprise copper or aluminum. The method according to claim 1,
Wherein the intermediate electrode layer, the upper ground electrode layer, and the lower ground electrode layer have a thickness ranging from 5 占 퐉 to 20 占 퐉. The method according to claim 1,
Wherein the lower protective layer comprises polypropylene or polyethylene. The method according to claim 1,
Wherein the surface of the lower protective layer facing the lower ground electrode layer is in an embossed form. The method according to claim 1,
And an upper protective layer disposed on the upper ground electrode layer. 11. The method of claim 10,
Wherein the top protective layer comprises polyester. 11. The method of claim 10,
Further comprising a frictional resistance layer interposed between the upper ground electrode layer and the upper protective layer. The method according to claim 1,
Wherein the diameter of the through-hole of the porous screen structure ranges from 0.3 mm to 7 mm. The method according to claim 1,
The intermediate pad portion and the lower ground pad portion are spaced apart from each other so as not to face each other,
The intermediate pad portion and the upper ground pad portion are spaced apart from each other so as not to face each other,
Wherein the upper ground pad portion and the lower ground pad portion are disposed apart from each other so as to face each other. An upper ground electrode layer 120 including a top plate electrode 120a having a thin plate shape and an upper ground pad part 120b electrically connected to the upper ground electrode part and electrically connected to the outside, Preparing an upper protective layer 110;
Bonding an upper dielectric barrier layer (130) to the upper ground electrode layer (120) of the upper protective layer (110);
A lower ground electrode layer 160 including a lower ground electrode part of a porous screen structure having a plurality of through holes and a lower ground pad part 160b electrically connected to the lower ground electrode part 160a and electrically connected to the outside );
Bonding the lower dielectric barrier layer 150 and the lower protective layer 170 to both surfaces of the lower ground electrode layer 160;
Preparing an intermediate electrode layer 140 including a thin plate-shaped intermediate electrode portion 140a and an intermediate pad portion 140b electrically connected to the intermediate electrode portion and electrically connected to the outside; And
And bonding the lower dielectric barrier layer (150) to the upper dielectric barrier layer (130) and the lower ground electrode layer laminated to the upper ground electrode layer on both surfaces of the intermediate electrode layer (140) ≪ / RTI > 16. The method of claim 15,
Wherein the preparation of the intermediate electrode layer is performed so as to have a planar area narrower than that of the upper ground electrode layer so as to have a structure completely covered by the upper ground electrode layer. 16. The method of claim 15,
Wherein the upper ground electrode layer and the lower ground electrode layer are formed to have the same planar outer circumferential shape. 16. The method of claim 15,
Wherein the upper dielectric barrier layer and the lower dielectric barrier layer are formed to include at least one selected from the group consisting of polytetrafluoroethylene, polyethylene, polypropylene, polystyrene, and polyester. 16. The method of claim 15,
Wherein the upper dielectric barrier layer and the lower dielectric barrier layer have a thickness of at least 30 占 퐉. 16. The method of claim 15,
Wherein the upper ground electrode layer, the lower ground electrode layer, and the intermediate electrode layer are formed of copper or aluminum. 16. The method of claim 15,
Wherein the upper ground electrode layer, the lower ground electrode layer, and the intermediate electrode layer have a thickness ranging from 5 占 퐉 to 20 占 퐉. 16. The method of claim 15,
Wherein the upper protective layer is formed of polyester. 16. The method of claim 15,
Wherein the lower protective layer is formed of polypropylene or polyethylene. 16. The method of claim 15,
Wherein a surface of the lower protective layer facing the lower ground electrode layer is in an embossed form. 16. The method of claim 15,
Wherein the preparation of the upper protective layer having the upper ground electrode layer further comprises interposing a friction resistance layer further between the upper ground electrode layer and the upper protective layer. 16. The method of claim 15,
Wherein preparing the lower ground electrode layer has a diameter of the through-hole of the porous screen structure ranging from 0.3 mm to 7 mm. 16. The method of claim 15,
The upper ground pad portion and the intermediate pad portion are formed so as to be spaced apart from each other so as not to face each other,
The lower ground pad portion and the intermediate pad portion are formed so as to be spaced apart from each other so as not to face each other,
Wherein the upper ground pad portion and the lower ground pad portion are spaced apart from each other so as to face each other. 16. The method of claim 15,
Bonding the upper dielectric barrier layer to the upper ground electrode layer of the upper protective layer, joining the lower dielectric barrier layer and the lower protective layer to each of both surfaces of the lower ground electrode layer, Wherein the lamination of the upper dielectric barrier layer laminated on the upper ground electrode layer and the lower dielectric barrier layer laminated on the lower ground electrode layer on both surfaces uses a laminate roller method or a stamp method. 16. The method of claim 15,
Bonding the upper dielectric barrier layer to the upper ground electrode layer of the upper protective layer, joining the lower dielectric barrier layer and the lower protective layer to each of both surfaces of the lower ground electrode layer, Wherein joining the upper dielectric barrier layer laminated on the upper ground electrode layer and the lower dielectric barrier layer laminated on the lower ground electrode layer on each of both surfaces is carried out via an adhesive layer. 30. The method of claim 29,
Wherein the adhesive layer comprises polyethylene. 9. A power supply apparatus applied to a packaging container comprising the sterilizing film of claim 1,
A power supply unit for generating a plasma inside the packaging container;
Two power connection terminals for applying power to the upper ground pad portion and the lower ground pad portion of the sterilizing film, or the power supply portion to the upper ground pad portion and the intermediate pad portion;
And a sealing portion including a heating portion for sealing the packaging container and a heat supply portion for generating heat in the heating means. 32. The method of claim 31,
Wherein one of the two power connection terminals is a sterilizing film for connecting the lower ground pad portion and the upper ground pad portion together. 32. The method of claim 31,
And a sterilizing film which further comprises a vacuum for lowering the pressure inside the packaging container. 34. The method of claim 33,
And a sterilizing film having a pressure inside the packaging container of 200 Torr or less by the vacuuming. 34. The method of claim 33,
Wherein the sealing portion comprises a sterilizing film which seals the packaging container after pressure inside the packaging container is lowered by the vacuuming. 32. The method of claim 31,
A matcher coupled between the power supply and the power connection terminals; And
Further comprising an impedance meter connected to the power connection terminals.

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