KR101819654B1 - Solution process apparatus and manufacturing method of multilayered structure device using the same - Google Patents

Abstract

A solution processing apparatus according to an embodiment of the present invention includes an inkjet printing unit for printing ink on a substrate, a laser processing unit for irradiating the ink with the ink to process the ink, a connection unit connected to the substrate, the inkjet printing unit, And a moving stage for adjusting the position of the substrate, the inkjet printing unit, and the laser processing unit.

Description

TECHNICAL FIELD [0001] The present invention relates to a solution processing apparatus and a method for manufacturing a multi-

The present invention relates to a solution processing apparatus and a method for manufacturing a multi-layered structural element using the same.

Due to cost or environmental problems of the silicon-based semiconductor industry, development of devices by alternative technologies is underway. Among them, many researches have been made on the device patterning technology using the solution process. The solution process is a process for manufacturing a device such as a flat panel display device by printing a liquid material. Conventionally, a deposition process used for manufacturing a device has a low material utilization efficiency of about 10%, has a complicated process, and is difficult to apply to a large-area device. However, the solution process is theoretically 100% in terms of the material utilization efficiency, so that the cost is reduced, the process is simple, and it is easy to apply to a large-sized device.

In this device using a solution process, the pattern of a single layer structure is commercialized and used in many industries at present. However, in order to form a multi-layer structure, there is a disadvantage that it must be manufactured through a lot of equipment and various processes.

That is, in order to form a pattern of a single-layer structure element using a solution process, a technique such as vapor deposition or laser sintering is used. In order to form a multi-layer structure, an etching process is separately performed to connect the lower layer and the upper layer, . This method is time consuming and costly because different processes are used for each process. In addition, unlike a two-dimensional structure, a three-dimensional structure is difficult to implement by a step formed on a substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a solution processing apparatus having a low manufacturing cost and a high manufacturing process speed, and a method for manufacturing a multi-layered structural element using the same.

A solution processing apparatus according to an embodiment of the present invention includes an inkjet printing unit for printing ink on a substrate, a laser processing unit for irradiating the ink with the ink to process the ink, a connection unit connected to the substrate, the inkjet printing unit, And a moving stage for adjusting the position of the substrate, the inkjet printing unit, and the laser processing unit.

The moving stage may include a horizontal stage that supports the substrate and adjusts the horizontal position of the substrate, the inkjet printing portion, and a vertical stage to which the laser processing portion is attached and controls the vertical position of the substrate.

The apparatus may further include a touch sensor installed on the vertical stage for measuring step data of the substrate and a data transceiver transmitting and receiving the step data measured by the touch sensor to the vertical stage.

Wherein the inkjet printing unit includes an inkjet nozzle for jetting the ink onto the substrate, an inkjet pump for supplying the ink to the inkjet nozzle, and a voltage supplier for supplying a voltage to the inkjet nozzle, An on-demand nozzle, and a spray coating nozzle.

The laser processing unit may include a laser generator for generating the laser, and a laser adjusting member for adjusting the shape of the laser.

The laser control member may include a beam shutter for interrupting the laser, a beam expander for changing a focal distance of the laser beam passing through the beam shutter, and a focusing lens for focusing the laser beam passing through the beam expander.

A method of manufacturing a multilayered element according to an embodiment of the present invention includes an inkjet printing unit printing an ink on a substrate, a laser processing unit irradiating the ink with the ink to process the ink, the substrate, the inkjet printing unit, And a moving stage for adjusting the position of the substrate, the inkjet printing unit, and the laser processing unit, the first ink is jetted using the inkjet nozzle of the inkjet printing unit, Forming an ink pattern, forming a lower layer electrode pattern by sintering the lower layer ink pattern using the laser processing portion, injecting a second ink using the inkjet nozzle to form an insulating layer covering the substrate and the lower layer electrode pattern Forming a dielectric layer on the insulating layer; Forming a connection hole for exposing a part of the lower layer electrode pattern, forming an upper layer ink pattern filling the connection hole by injecting a third ink using the inkjet nozzle, And sintering the ink pattern to form an upper electrode pattern.

Measuring the step data of the substrate using a touch sensor provided in the solution processing apparatus, and adjusting the vertical position of the substrate using the step data.

Forming the lower layer electrode pattern, and forming a semiconductor layer covering a part of the lower layer electrode pattern by ejecting the fourth ink using the inkjet nozzle.

The first ink and the third ink may include metal nanoparticles, the second ink may include an insulating material, and the fourth ink may include a solution semiconductor material.

Wherein the jetting mode of the inkjet printing unit includes any one selected from a line printing mode, a drop on demand mode, and a spray coating mode, Ink is sprayed in the line-printing mode, the second ink is sprayed in a spray coating mode, and the fourth ink is sprayed in a drop-on-demand mode.

The solution processing apparatus according to an embodiment of the present invention and the method of manufacturing a multi-layered structural element using the same include both a laser processing unit and an inkjet printing unit, thereby performing ink printing, ink sintering process, It is possible to simultaneously realize a patterning process for forming a connection hole for the contact hole.

Therefore, it is possible to minimize the time and cost by minimizing the solution processing apparatus capable of simultaneously performing the laser processing and the inkjet printing, and can rapidly manufacture the multi-layered element.

1 is a schematic perspective view of a solution processing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a line printing mode of an ink-jet printing unit of a solution processing apparatus according to an embodiment of the present invention.
3 is a diagram illustrating a drop-on-demand mode of an injection mode of an ink-jet printing unit of a solution processing apparatus according to an embodiment of the present invention.
4 is a view showing a spray coating mode among the spray modes of the inkjet printing unit of the solution processing apparatus according to an embodiment of the present invention.
5 is a diagram showing a high voltage waveform in a unipolar mode.
6 is a diagram showing a high voltage waveform in a bipolar mode.
7, 9, 11, 13, 15, 17, and 19 are views sequentially illustrating a method of manufacturing a multi-layered structural element using a solution processing apparatus according to an embodiment of the present invention. Fig.
8, 10, 12, 14, 16, 18 and 20 are respectively a line VIII-VIII, a line XX in FIG. 9, a line XII-XII in FIG. 11, Line, XVI-XVI line in Fig. 15, XVIII-XVIII line in Fig. 17, and XX-XX line in Fig.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

A solution processing apparatus according to an embodiment of the present invention will now be described in detail with reference to FIGS. 1 and 2. FIG.

FIG. 1 is a schematic perspective view of a solution processing apparatus according to an embodiment of the present invention, FIG. 2 is a diagram illustrating a line printing mode in an ink-jet printing unit of a solution processing apparatus according to an embodiment of the present invention, FIG. 3 is a diagram illustrating a drop-on-demand mode of an ink-jet printing unit of a solution processing apparatus according to an exemplary embodiment of the present invention. FIG. Mode in the spray coating mode.

1, a solution processing apparatus according to an embodiment of the present invention includes an inkjet printing unit 100 for printing ink 20 on a substrate 10, And a moving stage 300 for adjusting the positions of the laser processing unit 200, the substrate 10, the inkjet printing unit 100, and the laser processing unit 200.

The moving stage 300 is connected to the substrate 10, the inkjet printing unit 100, and the laser processing unit 200. The moving stage 300 includes a horizontal stage 310 for supporting the substrate 10 and adjusting the horizontal position of the substrate 10, an inkjet printing unit 100 and a laser processing unit 200, And a vertical stage 320 for adjusting the vertical position of the vertical stage 320.

The moving speed of the horizontal stage 310 is 1.0 mm / s to 2.0 m / s, and the moving speed of the vertical stage 320 is 1.0 mm / s to 2.0 m / s. Thus, the manufacturing process time can be shortened.

The vertical stage 320 is provided with a touch sensor 410 and a data transceiver 420. The touch sensor 410 measures the step data of the substrate 10, and the data transceiver 420 transmits the step data measured by the touch sensor to an external computer (not shown). Then, the external computer transmits the step data to the vertical stage 320, so that the vertical stage 320 adjusts the vertical position of the substrate 10. Therefore, even when the substrate 10 has a step, a multi-layered element can be easily manufactured.

The inkjet printing unit 100 includes an inkjet nozzle 110 for jetting the ink 20 onto the substrate 10, an inkjet pump 120 for supplying the ink 20 to the inkjet nozzle 110, And a voltage supplier 130 for supplying a voltage.

The inkjet pump 120 is attached to the vertical stage 320 and may be a micro syringe pump. Therefore, the amount of the ink 20 to be ejected can be precisely adjusted up to the unit of the micro-scale.

The inkjet nozzle 110 is attached to the vertical stage 320 and the inkjet nozzle 110 includes a line printing nozzle 111, a drop-on-demand nozzle 112, A spray coating nozzle 113, and the like. The line printing nozzle 111 and the drop-on-demand nozzle 112 can be formed by changing the diameter of the nozzle according to a desired line width (0.5 to 100 mu m) or a desired amount of ink using the same nozzle, coating nozzle 113 is a separate nozzle from the line printing nozzle 111 and the drop-on-demand nozzle 112. The inkjet nozzle 110 may be selected according to the injection mode.

The injection mode is a line printing mode in which the ink 20 is formed on the substrate 10 in a line form, a drop-on-demand mode in which the ink 20 is printed in a predetermined pattern, And a spray coating mode in which a large area is coated.

2, the line printing nozzle 111 applied to the line printing mode forms the ink 20 in the form of a line on the substrate 10, and as shown in FIG. 3, Similarly, the drop-on-demand nozzle 112 applied to the drop-on-demand mode can drop the ink 20 into a desired shape at a desired position, and as shown in Fig. 4, The ink 20 can be coated on a large area.

The voltage supplier 130 is a device for applying a high voltage to the inkjet nozzle 110 to form an electric field E between the inkjet nozzle 110 and the substrate 10. The electric charge E charged in the inkjet nozzle 110 flows to the charged substrate 10 by the electric field E between the inkjet nozzle 110 and the substrate 10, It is called Electro hydro dynamic (EHD). By using the voltage supplier 130, the voltage intensity can be changed from 100 V to 10 kV, and the voltage application period can be changed from 10 Hz to 1 kHz.

High voltage of DC mode, Unipolar mode and Biopolar mode can be used. The direct current mode, which supplies DC with constant input voltage, is mainly applied to the line printing mode. The unipolar mode, which supplies the digital AC, which is the voltage waveform having the + input voltage and 0V as the maximum voltage and the lowest voltage respectively, Biopolar mode, which supplies digital alternating current, a voltage waveform with + input voltage and - input voltage as the highest and lowest voltages, respectively, applies to drop-on-demand mode.

FIG. 5 is a diagram showing a high voltage waveform in a unipolar mode, and FIG. 6 is a diagram showing a high voltage waveform in a bipolar mode.

As shown in Fig. 5, in the unipolar mode, for example, an electric field is formed at 5 kv to sprinkle ink, and at 0 kv, no electric field is formed and ink is not ejected. Then, as shown in Fig. 6, in the bipolar mode, an electric field is formed at +5 kv and -5 kv, for example, to sprinkle ink, and an electric field is not formed for a short time of 0 kv, so that no ink is ejected.

The laser processing unit 200 includes a laser generator 210 for generating a laser L and a laser adjusting member 220 for adjusting the shape of the laser L. [

The laser generator 210 can adjust the power of the laser L. [ The laser power can be adjusted from 50 mW to 2 W, and power suitable for the sintering process or the patterning process can be used.

The laser control member 220 includes a beam shutter 221 for interrupting the laser L, a beam expander 222 for changing the focal length of the laser L passing through the beam shutter, And a focusing lens 223 for focusing the laser L passing through the expander. A plurality of optical lenses 224 may be provided on the optical path between the beam splitter 222 and the focusing lens 223.

The beam expander 222 is located on the optical path between the beam shutter and the focusing lens. The beam expander 222 can widen the focal length of the laser L by 8 times and the laser L that has passed through the beam expander 222 can be focused on the substrate 10. [

A focusing lens 223 is located on the optical path between the beam splitter 222 and the substrate 10 and focuses the laser L to irradiate the substrate 10.

Therefore, the laser processing unit 200 can adjust the position at which the laser L is scanned on the substrate 10 by using the moving stage 300. [ Therefore, it is possible to precisely sinter the lower layer ink pattern 21 and the upper layer ink pattern 51 formed on the substrate 10 by irradiating the laser L to the correct position. In addition, the connection hole 41 can be formed in the insulating layer 40 formed on the substrate 10 by irradiating the laser L to the correct position.

A method of manufacturing a multi-layer structure device using the solution processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.

7, 9, 11, 13, 15, 17, and 19 are views sequentially illustrating a method of manufacturing a multi-layered structural element using a solution processing apparatus according to an embodiment of the present invention. 8, Fig. 10, Fig. 12, Fig. 14, Fig. 16, Fig. 18 and Fig. 20 respectively show line VIII-VIII, line XX in Fig. 9, line XII- XIV line in FIG. 13, XVI-XVI line in FIG. 15, XVIII-XVIII line in FIG. 17, and XX-XX line in FIG.

First, as shown in FIG. 1, step data of a substrate 10 is measured using a touch sensor 410 installed in a solution processing apparatus according to an embodiment of the present invention. Then, the vertical position of the substrate 10 is adjusted using the step data.

Next, as shown in FIGS. 7 and 8, the first ink is jetted by using the inkjet nozzle 110 of the inkjet printing unit 100 to form the lower layer ink pattern 21 on the substrate 10. The lower layer ink pattern 21 may be a semiconductor element pattern. At this time, the inkjet nozzle 110 is a line printing nozzle 111 capable of forming ink in a line form on the substrate 10, and the first ink may include metal nanoparticles.

Next, as shown in Figs. 9 and 10, the lower layer ink pattern 21 is formed by sintering the lower layer ink pattern 21 by using the laser processing portion 200. Next, as shown in Figs. That is, the lower layer ink pattern 21 is formed by sintering the lower layer ink pattern 21 using the heat of a continuous laser (continuous laser). The portion not sintered with the laser (L) is cleaned using a solvent.

Next, as shown in Figs. 11 and 12, the fourth ink is jetted using the inkjet nozzle 110 to form a semiconductor layer 30 covering a part of the lower electrode pattern 22. At this time, the inkjet nozzle 110 is a drop-on-demand nozzle 112 capable of dropping ink into a desired shape at a desired position, and the fourth ink may include a solution semiconductor material.

Next, as shown in Figs. 13 and 14, the second ink is jetted using the inkjet nozzle 110 to form an insulating layer (not shown) covering the substrate 10, the lower electrode pattern 22 and the semiconductor layer 30 40 are formed. At this time, the inkjet nozzle 110 is a spray coating nozzle 113 capable of coating the ink 20 over a large area, and the second ink may include an insulating material.

Next, as shown in Figs. 15 and 16, the insulating layer 40 is patterned by using the laser processing unit 200 to form a connection hole 41 exposing a part of the lower layer electrode pattern 22 . At this time, the power of the laser generator 210 of the laser processing unit 200 and the laser adjusting member 220 are adjusted so that the insulating layer 40 can be patterned. Since the connection holes 41 connecting the upper electrode patterns 520 and the lower electrode patterns 22 to each other can be easily formed using the laser processing unit 200 provided in the solution processing apparatus, The time can be minimized and a multilayered structure element including the upper electrode pattern and the lower electrode pattern can be manufactured quickly.

Next, as shown in Figs. 17 and 18, the upper ink layer pattern 51 is formed by jetting the third ink using the inkjet nozzle 110 to fill the connection hole 41. Next, as shown in Figs. At this time, the inkjet nozzle 110 may be a line printing nozzle 111, and the third ink may include metal nanoparticles.

Next, as shown in Figs. 19 and 20, the upper layer ink pattern 51 is formed by sintering the upper layer ink pattern 51 by using the laser processing portion 200. Next, as shown in Figs. The portion not sintered with the laser (L) is cleaned using a solvent.

 While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the following claims. Those who are engaged in the technology field will understand easily.

10: substrate 20: ink
21: lower layer ink pattern 22: lower layer electrode pattern
30: Semiconductor layer 40: Insulating layer
51: upper layer ink pattern 52: upper layer electrode pattern
100: inkjet printing unit 110: inkjet nozzle
120: inkjet pump 200: laser machining part
210: laser generator 220: laser control member
300: Moving stage 310: Horizontal stage
320: vertical stage

Claims (11)

An inkjet printing unit for printing ink on the substrate,
A laser processing unit for irradiating the ink with a laser to process the ink,
An inkjet printing unit, and a laser processing unit, the moving stage being configured to control a position of the substrate, the inkjet printing unit, and the laser processing unit,
Lt; / RTI >
The inkjet printing unit
An ink jet nozzle for jetting the ink onto the substrate,
An inkjet pump for supplying the ink to the inkjet nozzle,
A voltage supplier for supplying a voltage to the ink-
Lt; / RTI >
The inkjet nozzle is any one selected from a line printing nozzle, a drop-on-demand nozzle, and a spray coating nozzle,
The moving stage
A horizontal stage for supporting the substrate and adjusting a horizontal position of the substrate,
Wherein the inkjet printing unit and the laser processing unit are attached to each other and the vertical stage
/ RTI >
A touch sensor installed on the vertical stage for measuring the step data of the substrate,
A data transceiver for transmitting and receiving the step data measured by the touch sensor to the vertical stage;
Further comprising: delete delete delete The method of claim 1,
The laser processing unit
A laser generator for generating the laser,
A laser control member for adjusting the shape of the laser,
. The method of claim 5,
The laser control member
A beam shutter for interrupting the laser,
A beam expander for changing the focal distance of the laser beam passed through the beam shutter,
A focusing lens for focusing a laser beam passed through the beam expander,
. An inkjet printing unit for printing ink on a substrate, a laser processing unit for processing the ink by irradiating the ink with the ink, a substrate, an inkjet printing unit, and a laser processing unit, Forming a lower layer ink pattern on the substrate by spraying a first ink using an inkjet nozzle of the inkjet printing unit in a solution processing apparatus including a moving stage for adjusting a position of a substrate,
Forming a lower layer electrode pattern by sintering the lower layer ink pattern using the laser processing portion;
Forming an insulating layer covering the substrate and the lower electrode pattern by spraying a second ink using the inkjet nozzle,
Patterning the insulating layer using the laser processing unit to form a connection hole exposing a part of the lower layer electrode pattern,
Jetting a third ink using the inkjet nozzle to form an upper layer ink pattern filling the connection hole,
And sintering the upper layer ink pattern using the laser processing portion to form an upper layer electrode pattern. 8. The method of claim 7,
Measuring step data of the substrate using a touch sensor installed in the solution processing apparatus,
Adjusting the vertical position of the substrate using the step data;
≪ / RTI > 9. The method of claim 8,
Further comprising the step of forming a semiconductor layer covering a part of the lower layer electrode pattern by spraying a fourth ink using the inkjet nozzle after forming the lower layer electrode pattern. The method of claim 9,
Wherein the first ink and the third ink comprise metal nanoparticles, the second ink comprises an insulating material, and the fourth ink comprises a solution semiconductor material. The method of claim 9,
Wherein the jetting mode of the inkjet printing unit includes any one selected from a line printing mode, a drop on demand mode, and a spray coating mode,
The first ink and the third ink are sprayed in the line printing mode, the second ink is sprayed in a spray coating mode, and the fourth ink is sprayed in a drop-on-demand mode. Gt;

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