KR101814424B1 - Wedge-shaped Attachment Structure of Electronics Module for Maximizing Thermal Contact Area - Google Patents

Abstract

An electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area is disclosed. An electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention includes an outer housing having an inner housing space formed therein and a diameter of the inner peripheral surface of the housing space becoming smaller toward the inner housing, At least one printed circuit board and at least one coupling structure to which the printed circuit board is coupled, wherein the coupling structure is received in the receiving space and coupled with the outer housing, and the outer peripheral surface of the coupling structure is connected to the inner peripheral surface of the receiving space And the electronic module is formed such that its diameter becomes smaller toward the coupling direction so as to correspond thereto.

Description

[0001] The present invention relates to an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic module assembly, and more particularly, to an electronic module assembly capable of minimizing thermal contact resistance due to an improved coupling structure of an external housing and a coupling structure in which a printed circuit board is mounted.

Generally, an electronic module mounted in an external housing of an electrical component is designed as a metal can can be used for mechanical and electrical protection, heat dissipation, and ease of mounting and dismounting. The electronic module is designed as a hexahedron shaped box or a cylindrical shape for the sake of practicality. When the electronic module is coupled to the external housing, it is directly fastened with screws or fixed to the housing by using a separate fixing retainer or the like.

1 is a view showing a coupling structure of a conventional general electronic module assembly.

As shown in Fig. 1, the electronic module 20 is fastened to the external housing 10 only by one side of the screw 30 and tightly assembled, or only a part of the rear surface is directly brought into close contact with the fixing retainer.

That is, the clearance 12 for assembly exists, and the contact area with the outer housing 10 is insufficient. Further, since the screw 30 is fixed by the screw 30, the pressure of the contact surface is not constant due to the pressing of the screw. Therefore, since the thermal contact resistance is high, the efficiency of heat transfer to the outer housing 10 is very low and it is difficult to expect an efficient heat radiation effect to the outside.

For good thermal conductors such as metal materials, thermal contact resistance is a very important factor and sometimes dominant. The thermal contact resistance can be largely determined by the size of the contact area, the contact surface pressure, the surface roughness, etc. when the other elements are the same.

If there is a component with high calorific value on the printed circuit board, if the heat is not sufficiently dissipated to the outer housing due to the thermal contact resistance, the temperature of the junction of the component will increase above the reference temperature, causing permanent deformation, , Which can cause serious problems in reliability.

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-mentioned problems, and an object of the present invention is as follows.

First, the present invention provides an electronic module assembly having a wedge-shaped coupling structure for minimizing thermal contact resistance to maximize a heat transfer contact area for improving heat transfer efficiency.

Second, the present invention provides an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area that can easily separate a fastening member during assembly or assembly.

Third, the present invention provides an electronic module assembly having a wedge-type coupling structure for maximizing a heat transfer contact area that can prevent damage to a connector due to stress applied to the connector during assembly.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention includes an outer housing and an electronic module.

A receiving space is formed in the outer housing, and a diameter of the inner circumferential surface of the receiving space is formed to be smaller toward the inside.

The electronic module includes at least one printed circuit board and at least one coupling structure to which the printed circuit board is coupled. The coupling structure is accommodated in the accommodation space and coupled with the outer housing, and the outer circumferential surface of the coupling structure is formed to have a smaller diameter in the coupling direction so as to correspond to the inner circumferential surface of the accommodation space.

The electronic module may also be coupled to the outer housing by a mating thread extending through the one or more of the mating structures to the outer housing.

Meanwhile, the electronic module assembly of the present embodiment may further include a puller for separating the mooring screw from the external housing and the electronic module.

When the mooring screw is detached from the coupling structure using the puller, the puller is coupled to the coupling groove, and the mooring screw is separated from the electronic module.

To this end, a coupling groove is formed in the head of the mating screw, and a female screw may be formed on the inner peripheral surface of the coupling groove.

In addition, the puller may include a coupling hole formed by rotation of the female screw coupled with the female screw formed in the coupling groove.

And the puller may be configured to simultaneously rotate a plurality of the coupling holes in the same direction, and the puller may be configured to rotate the plurality of coupling holes in the same direction at the same time have.

When the left thread is formed on the body of the mooring screw, a right thread is formed on the inner circumferential surface of the coupling groove, and a left thread may be formed on the inner circumferential surface of the coupling groove when a right screw is formed on the mating thread.

By the engagement of the mating screws, the electronic module is pressed in the coupling direction, and a contact surface pressure may be generated between the external housing and the coupling structure.

The depth of the cavity formed in the outer housing and into which the mooring screw is inserted may be deeper than the depth of the mooring screw when the mooring screw is fully engaged.

Meanwhile, a connector for electrically connecting the printed circuit boards adjacent to each other may be provided.

A coupling protrusion is formed at the innermost portion of the receiving space, and the outer housing has a receiving groove corresponding to the coupling protrusion, so that excessive stress can be prevented from being applied to the connector during assembly.

Meanwhile, the inner circumferential surface of the receiving space and the outer circumferential surface of the coupling structure may be smoothly formed.

In addition, the coupling structure may be formed of a metal material.

The effects of the present invention will be described below.

First, according to an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention, the receiving space and the coupling structure have a tapered shape corresponding to each other, The space between the outer circumferential surfaces of the outer circumferential surface is minimized, and the contact surface pressure is generated, thereby minimizing the thermal contact resistance. As a result, heat transfer efficiency can be improved.

Second, in an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention, a female thread is formed on an inner circumferential surface of a coupling groove formed in a head of a mating thread, The coupling screw of the puller is coupled to the coupling groove and the mooring screw can be easily separated since the mooring screw is separated from the outer housing and the coupling structure.

Third, in the electronic module assembly having the wedge-shaped coupling structure for maximizing the heat transfer contact area according to an embodiment of the present invention, the coupling protrusions and the receiving grooves corresponding to each other are formed to a sufficient depth in the bottom surface and the outer housing of the coupling structure It is possible to prevent the connector from being damaged due to stress applied to the connector.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

The foregoing summary, as well as the detailed description of the preferred embodiments of the present application set forth below, may be better understood when read in conjunction with the appended drawings. For the purpose of illustrating the invention, there are shown preferred embodiments in the figures. It should be understood, however, that this application is not limited to the precise arrangements and instrumentalities shown.
1 illustrates a conventional electronic module assembly;
FIG. 2 is a cross-sectional view of an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention; FIG.
3 is an exploded perspective view of an outer housing and an electronic module of an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an exemplary embodiment of the present invention;
4 is a view showing a mooring screw separated by a puller of an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention; And
FIG. 5 is a view showing a mooring screw and a puller of an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood, however, that the appended drawings illustrate the present invention in order to more easily explain the present invention, and the scope of the present invention is not limited thereto. You will know.

In describing the embodiments of the present invention, it is to be noted that elements having the same function are denoted by the same names and numerals, but are substantially not identical to elements of the prior art.

Also, the terms used in the present application are used only to describe certain embodiments and are not intended to limit the present invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, an electronic module assembly having a wedge-type coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a cross-sectional view of an electronic module assembly having a wedge-type coupling structure for maximizing a heat transfer contact area according to an exemplary embodiment of the present invention. FIG. 3 is a cross-sectional view of a wedge for maximizing a heat transfer contact area according to an exemplary embodiment of the present invention. An outer housing and an electronic module of an electronic module assembly having a shape-coupling structure.

1 and 2, an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention includes an outer housing 100 and an electronic module 200 .

The outer housing 100 may have a cylindrical or polygonal columnar shape. Although the outer housing 100 is formed in a cylindrical shape in the drawing of the present embodiment, the shape of the outer housing 100 is not limited to that shown in the drawings, and may be a square, triangular, have. A receiving space is formed in the outer housing 100.

Inside the outer housing 100, a receiving space for receiving the electronic module 200 to be described later is formed. Further, the diameter of the inner circumferential surface of the accommodation space may be formed so as to become smaller toward the inside.

The electronic module 200 includes at least one printed circuit board 210 and at least one coupling structure 220. In this embodiment, a plurality of printed circuit boards 210 and coupling structures 220 are provided. The number of the printed circuit board 210 and the coupling structure 220 need not be the same.

The printed circuit boards 210a, 210b, 210c are coupled to the coupling structures 220a, 220b. When a plurality of printed circuit boards 210a, 210b and 210c are provided, one or more of the printed circuit boards 210a, 210b and 210c may be coupled to the plurality of coupling structures 220a and 220b. The plurality of coupling structures 220a and 220b coupled with the printed circuit boards 210a, 210b, and 210c may be stacked.

The coupling structures 220a and 220b are received in the receiving space and coupled with the outer housing 100. The joint structures 220a and 220b have a shape corresponding to the accommodation space. In this embodiment, the overall shape of the stacked joint structures 220a and 220b is formed to be smaller in diameter as they approach the accommodation space.

Each of the printed circuit boards 210a, 210b and 210c may be provided with a connector 212 for electrically connecting adjacent printed circuit boards 210a, 210b and 210c. The adjacent printed circuit boards 210a, 210b and 210c are connected by a connector 212 provided on each printed circuit board 210a, 210b and 210c. An excessive pressure may be applied to the mutually coupled connector 212.

Therefore, in order to prevent excessive stress from being applied to the connector 212 by over-assembly, the coupling protrusion 222 is formed in the coupling structure 220b located at the innermost position in the receiving space, The receiving groove 104 corresponding to the projection 222 may be formed. This prevents the assembling protrusion 222 from being abutted against the bottom surface of the receiving groove 104 before the excessive pressure is applied to the mutually coupled connector 212 at the time of assembling, Can be prevented. The coupling protrusion 222 may be formed to have a sufficient length to prevent over-assembly of the mooring screw 300.

The outer housing 100 and the electronic module 200 may be coupled by a mating screw 300. The mooring screw 300 may extend to the interior of the outer housing 100 through the stacked coupling structures 220a and 220b.

The outer housing 100 may be provided with a cavity 102 for coupling with the mating screw 300. That is, the mooring screw 300 is inserted into the cavity 102 of the outer housing 100 through the plurality of stacked coupling structures 220a and 220b, thereby coupling the outer housing 100 and the electronic module. Here, the depth of the cavity 102 may be formed deeper than the mooring screw 300 completely inserted through the coupling structures 220a and 220b. Accordingly, even when the mooring screw 300 is assembled, the outer housing 100 can be prevented from being damaged.

The coupling structures 220a and 220b can be pushed in the coupling direction by the mooring screw 300 by coupling the outer housing 100 and the coupling structures 220a and 220b with the mating screw 300 as described above . Accordingly, pressure is generated on the contact surfaces of the outer housing 100 and the coupling structures 220a and 220b, thereby minimizing the space between the outer housing 100 and the coupling structures 220a and 220b. As the space between the outer housing 100 and the coupling structures 220a and 220b is minimized, the thermal contact resistance can be minimized.

In order to minimize the thermal contact resistance, the inner peripheral surface of the outer housing 100 and the outer peripheral surfaces of the coupling structures 220a and 220b may be smoothly formed. The coupling structures 220a and 220b may be formed of a metal material to increase the thermal conductivity from the printed circuit boards 210a, 210b, and 210c.

If a component having a high heating value exists in the printed circuit boards 210a, 210b, and 210c, if the heat is not sufficiently radiated to the outer housing 100 due to the thermal contact resistance, the temperature of the component junction increases to be higher than the reference temperature, This can cause parts to malfunction or cause serious reliability problems.

Here, the thermal contact resistance refers to the property of interfering with the heat conduction, and there is always a gap on the contact surface of the object. In most cases, the heat transfer rate is reduced due to the air layer between these narrow gaps. That is, the thermal contact resistance increases. Therefore, the more the contact surface is soft or the contact surface is strongly adhered, the smaller the thermal contact resistance.

For good thermal conductors such as metal materials, thermal contact resistance is a very important factor and sometimes dominant. The thermal contact resistance can be influenced by the size of the contact area, the contact surface pressure, the surface roughness, etc., when the other elements are the same.

FIG. 4 is a view showing a mooring screw separated by a puller of an electronic module assembly having a wedge-type coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention. FIG. FIG. 3 is a view showing a mooring screw and a puller of an electronic module assembly having a wedge-type coupling structure for maximizing a heat transfer contact area according to an example; FIG.

4 and 5, the head 302 of the mooring screw 300 is coupled with the puller 400 for separating the mooring screw 300 from the outer housing 100 and the electronic module 200 An engaging groove 304 may be formed. A female screw may be formed on the inner circumferential surface of the coupling groove 304.

The puller 400 may be provided with a coupling hole 410 formed with a male thread to be engaged with a female screw formed in the coupling groove 304 by rotation.

When the mooring screw 300 is detached from the outer housing 100 and the coupling structures 220a and 220b using the puller 400, the coupling hole 410 of the polar is coupled to the coupling groove 304, 100 and the mating screws 300 can be separated from the coupling structures 220a, 220b.

For this, the coupling groove 304 may be formed with a screw in a direction opposite to the body 306 of the mating screw 300. That is, when the left thread is formed on the body 306 of the mooring screw 300, a right screw is formed on the inner circumferential surface of the coupling groove 304. When a right screw is formed on the body 306 of the mooring screw 300, 304 may be formed on the inner peripheral surface thereof. The mating screw 410 can be coupled to the mating groove 304 and the mating screw 300 can be released and separated from the outer housing 100 and the coupling structures 220a and 220b. This has the advantage that the mooring screw 300 can be easily separated from the outer housing 100 and the coupling structures 220a and 220b.

A plurality of mooring screws 300 are provided and the puller 400 includes a plurality of puller 400 disposed at positions corresponding to the heads 302 of the mooring screws 300 corresponding to the mooring screws 300 . The puller 400 may be configured to simultaneously rotate the plurality of engagement holes 410 in the same direction.

4 and 5, the structure for operating the puller 400 is not shown in detail. However, when the handle 420 is rotated in one direction, the handle 420 and the plurality of engaging members 410 may rotate simultaneously in the same direction. Of course, the above-described operating structure is merely an example, and may be configured in any way as long as it is for rotating the plurality of engagement holes 410 simultaneously in the same direction.

The fuller 400 may be coupled to the head 302 of the mooring screw 300 as in the present embodiment so that the fuller 400 can be coupled to the head 302 of the mooring screw 300. [ So that it is possible to have an advantage in securing the internal space of the electronic module assembly since a separate component for coupling the puller 400 is not required.

Here, the puller 400 may be included in the electronic module assembly of this embodiment, or may be provided as a ready-made product.

In the foregoing, an electronic module assembly having a wedge-shaped coupling structure for maximizing a heat transfer contact area according to an embodiment of the present invention has been described.

As described above, the present invention has been described with respect to preferred embodiments thereof, and it is to be understood that the present invention may be embodied in other specific forms without departing from the spirit or scope of the invention. It is self-evident to those who have. Therefore, the above-described embodiments are to be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and equivalents thereof.

10: outer housing 20: electronic module
30: screw 100: outer housing
102: cavity 104: receiving groove
200: electronic module 210: printed circuit board
212: connector 220: coupling structure
222: engaging projection 300: coiling screw
302: head 304: engaging groove
306: body 400: puller
410: coupling member 420: handle

Claims (14)

delete delete An outer housing having a receiving space formed therein, the inner circumferential surface of the receiving space having a smaller diameter;
At least one printed circuit board and at least one coupling structure to which the printed circuit board is coupled, the coupling structure being received in the receiving space and being coupled to the outer housing, An electronic module formed to be smaller in diameter in a coupling direction so as to correspond to an inner circumferential surface, and coupled to the outer housing by a mating thread; And
A fuller for separating said mooring screw from said outer housing and said electronic module;
≪ / RTI > The method of claim 3,
Wherein when the mooring screw is detached from the coupling structure using the puller, the puller is coupled to the coupling groove and the mooring screw is detached from the electronic module. The method of claim 3,
Wherein an engaging groove is formed in the head of the mating screw and a female screw is formed on an inner circumferential surface of the engaging groove. 6. The method of claim 5,
In the puller,
And an engagement portion formed with a male screw to be engaged with a female screw formed in the engagement groove by rotation. The method according to claim 6,
Wherein the plurality of mating screws are disposed at positions corresponding to the mating threads in a number corresponding to the mating thread and the puller is configured to rotate the plurality of mating holes in the same direction at the same time, Module assembly. 6. The method of claim 5,
Wherein a right screw is formed on an inner circumferential surface of the coupling groove when a left screw thread is formed on the body of the mating screw and a left screw thread is formed on an inner circumferential surface of the coupling groove when a right screw is formed on the mating screw body. The method of claim 3,
Wherein the electronic module is pressed in the coupling direction by the engagement of the mating threads to generate a contact surface pressure between the external housing and the coupling structure. The method of claim 3,
Wherein the depth of the cavity formed in the outer housing and into which the mooring screw is inserted is formed deeper than the depth of the mooring screw when the mooring screw is fully engaged. An outer housing having a receiving space formed therein, the inner circumferential surface of the receiving space having a smaller diameter; And
At least one printed circuit board and at least one coupling structure to which the printed circuit board is coupled, the coupling structure being received in the receiving space and being coupled to the outer housing, An electronic module formed to have a smaller diameter in a coupling direction so as to correspond to an inner peripheral surface;
And a connector for electrically connecting the printed circuit boards adjacent to each other is provided,
Wherein an engaging protrusion is formed at the innermost portion of the accommodating space and a receiving recess corresponding to the engaging protrusion is formed in the outer housing to prevent excessive stress from being applied to the connector during assembling. delete The method according to claim 3 or 11,
An inner circumferential surface of the accommodation space and an outer circumferential surface of the coupling structure are smoothly formed, The method according to claim 3 or 11,
The coupling structure may include:
An electronic module assembly formed from a metallic material.

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