KR101811253B1 - Colorless and transparent polyamide-imide flim and preparation method of the same - Google Patents
Colorless and transparent polyamide-imide flim and preparation method of the same Download PDFInfo
- Publication number
- KR101811253B1 KR101811253B1 KR1020160044370A KR20160044370A KR101811253B1 KR 101811253 B1 KR101811253 B1 KR 101811253B1 KR 1020160044370 A KR1020160044370 A KR 1020160044370A KR 20160044370 A KR20160044370 A KR 20160044370A KR 101811253 B1 KR101811253 B1 KR 101811253B1
- Authority
- KR
- South Korea
- Prior art keywords
- bpdc
- mol
- tpc
- unit structure
- structure derived
- Prior art date
Links
- 239000004962 Polyamide-imide Substances 0.000 title claims abstract description 29
- 229920002312 polyamide-imide Polymers 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title 1
- 150000001408 amides Chemical group 0.000 claims abstract description 6
- 150000003949 imides Chemical group 0.000 claims abstract description 6
- 229920001577 copolymer Polymers 0.000 claims abstract 2
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 claims description 61
- 229920005575 poly(amic acid) Polymers 0.000 claims description 8
- KPPQQLYIXMUBRE-UHFFFAOYSA-N 4-phenylcyclohexa-2,4-diene-1,1-dicarbonyl chloride Chemical compound C1=CC(C(=O)Cl)(C(Cl)=O)CC=C1C1=CC=CC=C1 KPPQQLYIXMUBRE-UHFFFAOYSA-N 0.000 claims description 5
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- -1 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropanediamine Imide Chemical class 0.000 claims description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 3
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 239000004642 Polyimide Substances 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 42
- 230000000052 comparative effect Effects 0.000 description 35
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
본 발명은 투명성을 가지는 동시에, 표면 경도 및 기계적 물성을 구현하는 특성을 가지는 폴리아마이드-이미드 필름 및 그 제조방법에 관한 것이다.
본 발명의 일 측면에 따른 폴리아마이드-이미드 필름은 TFDB, 6-FDA, BPDC 및 TPC로부터 유래된 단위구조가 공중합된 것을 포함하며, 상기 TFDB는 6-FDA와 이미드 구조를 형성하고, 상기 TFDB는 TPC 또는 BPDC와 아마이드 구조를 형성하며, 상기 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조는 50 내지 80 mol%로 공중합된 것을 특징으로 하며, 상기 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 50 내지 70 mol%로 공중합된 것을 특징으로 할 수 있다.
본 발명에 따른 폴리아마이드-이미드 필름은 폴리아마이드 구조와 폴리이미드 구조가 공중합된 폴리아마이드-이미드 형태로부터 투명성과 우수한 표면경도, 기계적 물성을 구현할 수 있는 효과를 가질 수 있다.The present invention relates to a polyamide-imide film having transparency and characteristics of realizing surface hardness and mechanical properties, and a process for producing the polyamide-imide film.
The polyamide-imide film according to one aspect of the present invention comprises a copolymer of a unit structure derived from TFDB, 6-FDA, BPDC and TPC, wherein the TFDB forms an imide structure with 6-FDA, TFDB forms an amide structure with TPC or BPDC, and the unit structure derived from the 6-FDA and the unit structure derived from TPC and BPDC, relative to 100 mol% of the unit structure derived from TPC and BPDC, is 50 to 80 mol% And a unit structure derived from BPDC is copolymerized in an amount of 50 to 70 mol% with respect to 100 mol% of a unit structure derived from TPC and BPDC.
The polyamide-imide film according to the present invention can have transparency, excellent surface hardness and mechanical properties from polyamide-imide type copolymerized polyamide structure and polyimide structure.
Description
본 발명은 무색 투명하면서도 표면 경도 등의 기계적 물성이 우수한 폴리아마이드-이미드 필름 및 이의 제조방법에 관한 것이다.The present invention relates to a polyamide-imide film which is colorless and transparent and has excellent mechanical properties such as surface hardness and a method for producing the polyamide-imide film.
폴리이미드 수지는 방향족 디안하이드라이드와 방향족 디아민 또는 방향족 디이소시아네이트를 용액중합한 폴리아믹산 유도체를 고온에서 폐환(ring closure)하여 이미드화한 고내열 수지이다.The polyimide resin is a high heat resistant resin imidized by ring closure of a polyamic acid derivative solution-polymerized with an aromatic dianhydride and an aromatic diamine or an aromatic diisocyanate at a high temperature.
상기 방향족 디안하이드라이드로는 피로멜리트산이무수물(PMDA) 또는 비페닐테트라카르복실산 이무수물(BPDA) 등을, 상기 방향족 디아민으로는 옥시디아닐린(ODA), p-페닐렌 디아민(p-PDA), m-페닐렌 디아민(m-PDA), 메틸렌디아닐린(MDA), 비스아미노페닐헥사플루오로프로판(HFDA) 등을 사용할 수 있다.Examples of the aromatic dianhydride include pyromellitic dianhydride (PMDA) or biphenyltetracarboxylic dianhydride (BPDA), and the aromatic diamines include oxydianiline (ODA), p-phenylenediamine (p- PDA), m-phenylenediamine (m-PDA), methylene dianiline (MDA), and bisaminophenylhexafluoropropane (HFDA).
상기 폴리이미드 수지는 내열산화성, 내열특성, 내방사선성, 저온특성, 내약품성 등이 우수하다. 이에 자동차 재료, 항공 소재, 우주선 소재 등의 내열 첨단소재나 절연코팅제, 절연막, 반도체, TFT-LCD의 전극 보호막 등의 전자재료로 많이 사용된다.The polyimide resin is excellent in heat resistance, oxidation resistance, heat resistance, radiation resistance, low temperature characteristics, and chemical resistance. Therefore, it is widely used as an electronic material such as heat-resistant high-temperature material such as automobile material, air material, space ship material, insulating coating, insulation film, semiconductor, electrode protection film of TFT-LCD.
그러나 폴리이미드 수지는 방향족 고리 밀도가 높아 갈색 또는 황색으로 착색이 된다. 따라서 필름 등의 투명성이 요구되는 제품에는 사용하기 곤란하다는 한계가 있었다.However, the polyimide resin has a high aromatic ring density and is colored in brown or yellow. Therefore, there is a limit in that it is difficult to use the film in a product requiring transparency.
이에 폴리이미드 필름의 투명성을 개선하고자 하는 많은 시도가 있었다. 그 일환으로 한국 공개공보 제10-2003-0009437호는 -O-, -SO2-, CH2- 등의 연결기, p-위치가 아닌 m-위치에 연결된 굽은 구조의 단량체, -CF3 등의 치환기를 갖는 방향족 디안하이드라이드와 방향족 디아민 단량체를 사용하여 열적 특성이 크게 저하되지 않는 한도에서 투과도 및 색상의 투명도에 대한 문제를 해결하였다. 그러나 복굴절 특성이나 표면경도, 탄성계수 등의 기계적 물성이 저하되어 디스플레이(Display)용으로 사용하기에는 무리가 있었다.Accordingly, there have been many attempts to improve the transparency of the polyimide film. As a part of the Korea 10-2003-0009437 Unexamined Publication No. -O-, -SO 2 -, such as monomers of the connector, connected to the bent structure m- location other than the p- position, such as, -CF 3 -, CH 2 The problem of transparency and color transparency was solved with the use of aromatic dianhydride having a substituent and an aromatic diamine monomer as long as the thermal properties were not significantly deteriorated. However, the mechanical properties such as birefringence characteristics, surface hardness, and elastic modulus deteriorate and it was difficult to use it for a display.
이에 여전히 투명성 등의 광학적 물성, 표면경도 등의 기계적 물성이 모두 우수한 폴리이미드 필름을 제공하기 위한 연구가 필요한 실정이다.Therefore, there is still a need for research to provide a polyimide film excellent in mechanical properties such as optical properties such as transparency and surface hardness.
본 발명은 위와 같은 문제점 및 한계를 해결하기 위한 것으로 다음과 같은 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems and limitations and has the following purpose.
본 발명은 폴리이미드와 폴리아마이드를 적절히 혼합하여 무기입자의 도입 없이도 기계적, 광학적 물성이 모두 우수한 폴리아마이드-이미드 필름을 제공하는 것을 그 목적으로 한다.It is an object of the present invention to provide a polyamide-imide film excellent in both mechanical and optical properties without the introduction of inorganic particles by properly mixing polyimide and polyamide.
본 발명의 목적은 이상에서 언급한 목적으로 제한되지 않는다. 본 발명의 목적은 이하의 설명으로 보다 분명해 질 것이며, 특허청구범위에 기재된 수단 및 그 조합으로 실현될 것이다.The object of the present invention is not limited to the above-mentioned object. The objects of the present invention will become more apparent from the following description, which will be realized by means of the appended claims and their combinations.
본 발명은 위와 같은 목적을 달성하기 위해 아래와 같은 구성을 포함할 수 있다.In order to achieve the above object, the present invention can include the following configuration.
본 발명에 따른 무색 투명한 폴리아마이드-이미드 필름은 TFDB(2,2’-비스(트리플루오로메틸)-4,4’-디아미노바이페닐), 6-FDA(2,2-비스(3,4-디카복시페닐)헥사플루오로프로판 디안하이드라이드), BPDC(1,1-비페닐-4,4-디카르보닐디클로라이드), 및 TPC(테레프탈로일클로라이드)로부터 유래된 단위구조가 공중합된 것을 포함하고, 상기 TFDB는 6-FDA와 이미드 구조를 형성하고, 상기 TFDB는 TPC 및 BPDC와 아마이드 구조를 형성하며, 상기 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조는 50 내지 80 mol%로 공중합된 것일 수 있다.The colorless transparent polyamide-imide films according to the present invention can be prepared by reacting TFDB (2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl), 6-FDA (2,2- , 4-dicarboxyphenyl) hexafluoropropane dianhydride), BPDC (1,1-biphenyl-4,4-dicarbonyldichloride), and TPC (terephthaloyl chloride) Wherein the TFDB forms an imide structure with 6-FDA, the TFDB forms an amide structure with TPC and BPDC, and the unit structure derived from the 6-FDA and the unit structure derived from TPC and BPDC The unit structure derived from TPC and BPDC may be copolymerized in an amount of 50 to 80 mol% with respect to 100 mol%.
본 발명의 바람직한 구현예는 상기 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 50 내지 70 mol%로 공중합된 것일 수 있다.In a preferred embodiment of the present invention, a unit structure derived from BPDC is copolymerized in an amount of 50 to 70 mol% relative to 100 mol% of a unit structure derived from TPC and BPDC.
본 발명에 따른 무색 투명한 폴리아마이드-이미드 필름의 제조방법은 TFDB를 용해시킨 용액에, 6-FDA를 투입하여 반응시키는 단계, BPDC를 투입하여 반응시키는 단계, 및 TPC를 투입하여 반응시키는 단계를 포함하여 폴리아믹산 용액을 제조하는 단계; 및 상기 폴리아믹산 용액을 사용하여 폴리아마이드-이미드 필름을 제조하는 단계;를 포함하고, 상기 TPC 및 BPDC의 총 투입량은 TFDB 100mol% 대비 50 내지 80 mol% 인 방법일 수 있다.The method for preparing a colorless transparent polyamide-imide film according to the present invention comprises the steps of charging 6-FDA into a solution in which TFDB is dissolved, reacting with BPDC, and reacting with TPC To produce a polyamic acid solution; And preparing a polyamide-imide film using the polyamic acid solution. The total amount of the TPC and BPDC may be 50 to 80 mol% based on 100 mol% of TFDB.
본 발명의 바람직한 구현예에 있어서, 상기 BPDC의 투입량은 상기 TPC 및 BPDC의 총 투입량 100mol% 대비 50 내지 70 mol% 일 수 있다.In a preferred embodiment of the present invention, the amount of the BPDC may be 50 to 70 mol% based on 100 mol% of the total amount of the TPC and BPDC.
본 발명에 따른 폴리아마이드-이미드 필름은 플렉시블 디스플레이 또는 커버 윈도우에 사용될 수 있다.The polyamide-imide film according to the present invention can be used in a flexible display or a cover window.
본 발명은 상기와 같은 구성을 포함하므로 다음과 같은 효과가 있다.The present invention includes the above-described configuration, and thus has the following effects.
본 발명에 따른 폴리아마이드-이미드 필름은 무색 투명하면서도 표면경도, 탄성계수 등의 기계적 물성이 뛰어나다.The polyamide-imide film according to the present invention is colorless and transparent and has excellent mechanical properties such as surface hardness and elastic modulus.
이에 본 발명에 따른 폴리아마이드-이미드 필름은 플렉시블 디스플레이(Flexible display)용 광학 필름, 커버 윈도우(Cover window)용 필름 등에 적용하기 적합하다.Accordingly, the polyamide-imide film according to the present invention is suitable for application to an optical film for a flexible display, a film for a cover window, and the like.
이하, 실시예를 통해 본 발명을 상세하게 설명한다. 본 발명의 실시예는 발명의 요지가 변경되지 않는 한 다양한 형태로 변형될 수 있다. 그러나 본 발명의 권리범위가 이하의 실시예에 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail by way of examples. The embodiments of the present invention can be modified into various forms as long as the gist of the invention is not changed. However, the scope of the present invention is not limited to the following embodiments.
본 발명의 요지를 흐릴 수 있다고 판단되면 공지 구성 및 기능에 대한 설명은 생략한다. 본 명세서에서 "포함"한다는 것은 특별한 기재가 없는 한 다른 구성요소를 더 포함할 수 있음을 의미한다.In the following description, well-known functions or constructions are not described in detail since they would obscure the invention. As used herein, " comprising "means that other elements may be included unless otherwise specified.
본 발명인 폴리아마이드-이미드 필름은 TFDB(2,2’-비스(트리플루오로메틸)-4,4’-디아미노바이페닐), 6-FDA(2,2-비스(3,4-디카복시페닐)헥사플루오로프로판 디안하이드라이드), BPDC(1,1-비페닐-4,4-디카르보닐디클로라이드), 및 TPC(테레프탈로일클로라이드)로부터 유래된 단위구조가 공중합된 것을 포함하는 폴리아마이드-이미드 필름이고, 상기 TFDB는 6-FDA와 이미드 구조를 형성하고, 상기 TFDB는 TPC 및 BPDC와 아마이드 구조를 형성하며, 상기 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조는 50 내지 80 mol%로 공중합된 것을 특징으로 한다.The polyamide-imide film of the present invention is a film obtained by mixing TFDB (2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl), 6-FDA (2,2- Bisphenyl phenyl) hexafluoropropane dianhydride), BPDC (1,1-biphenyl-4,4-dicarbonyldichloride), and TPC (terephthaloyl chloride) Wherein the TFDB forms an imide structure with 6-FDA, the TFDB forms an amide structure with TPC and BPDC, and the unit structure derived from the 6-FDA and the TPC derived from TPC and BPDC The unit structure derived from TPC and BPDC is copolymerized in an amount of 50 to 80 mol% based on 100 mol% of the unit structure.
상기 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조가 50mol% 미만이면 표면경도가 저하되어 사용에 따른 표면 결함이 일어날 수 있고, 마찰 등에 의해 쉽게 손상될 수 있다.If the unit structure derived from the 6-FDA and the unit structure derived from TPC and BPDC is less than 50 mol% with respect to 100 mol% of the unit structure derived from TPC and BPDC, the surface hardness may be lowered, It can be easily damaged by friction or the like.
또한, 필름의 탄성계수(Modulus)도 저하될 수 있어 플렉시블 디스플레이(Flexible display)용 광학 필름 및 커버 윈도우(Cover window)용 필름 등에 사용하기 어려울 수 있다.In addition, the modulus of the film may be lowered, and thus may be difficult to be used for an optical film for a flexible display and a film for a cover window.
그리고, 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조가 80 mol%를 초과하면 이미드 구조가 부족해져 투명성이 저하될 수 있다. 따라서 디스플레이용 필름 등에 사용하기 어려울 수 있다.If the unit structure derived from 6-FDA and the unit structure derived from TPC and BPDC from the 100 mol% of the unit structure derived from TPC and BPDC exceeds 80 mol%, the imide structure may be insufficient and the transparency may be lowered. Therefore, it may be difficult to use for a display film or the like.
따라서 폴리아마이드-아미드 필름은 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조가 50 내지 80 mol%로 공중합된 것이 바람직하다.Therefore, it is preferable that the polyamide-amide film has a unit structure derived from 6-FDA and a unit structure derived from TPC and BPDC of 50 to 80 mol% based on 100 mol% of the unit structure derived from TPC and BPDC.
본 발명의 폴리아마이드-이미드 필름은 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 TPC 및 BPDC로부터 유래된 단위구조가 50 내지 80 mol%이며, TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 50 내지 70 mol%로 공중합된 것을 특징으로 한다.The polyamide-imide film of the present invention has a unit structure derived from 6-FDA and a unit structure derived from TPC and BPDC of 50 mol% to 100 mol% of a unit structure derived from TPC and BPDC, and is composed of TPC and BPDC And 50 to 70 mol% of a unit structure derived from BPDC relative to 100 mol% of the derived unit structure.
TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 50 mol% 미만이면 탄성계수가 저하되어 외력에 의해 쉽게 변형되므로 플렉시블 디스플레이(Flexible display)용 광학 필름 및 커버 윈도우(Cover window)용 필름 등에 사용하기 어려울 수 있다.When the unit structure derived from BPDC is less than 50 mol% as compared with 100 mol% of the unit structure derived from TPC and BPDC, the modulus of elasticity is lowered and the unit film is easily deformed by external force, so that an optical film for a flexible display and a cover window, It may be difficult to use it for a film or the like.
또한, TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 70mol%를 초과하면 헤이즈(Haze) 현상이 심하게 발생할 수 있고, 황색도(Yellow Index)가 증가해 황변이 일어날 수 있다. 이는 투과도의 저하를 일으키므로 디스플레이용 필름으로 사용하기 어려울 수 있다.Also, when the unit structure derived from BPDC is more than 70 mol% based on 100 mol% of the unit structure derived from TPC and BPDC, a haze phenomenon may occur severely and yellowing may occur due to an increase in yellow index . This may lower the transmittance and thus may be difficult to use as a display film.
따라서, 폴리아마이드-이미드 필름은 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 TPC 및 BPDC로부터 유래된 단위구조가 50 내지 80 mol%이며, TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 50 내지 70 mol%로 공중합된 것이 바람직하다.Thus, the polyamide-imide film has a unit structure derived from 6-FDA and a unit structure derived from TPC and BPDC in an amount of 50 to 80 mol% relative to 100 mol% of a unit structure derived from TPC and BPDC, and is derived from TPC and BPDC Is preferably copolymerized in an amount of 50 to 70 mol% based on 100 mol% of the unit structure derived from BPDC.
6-FDA-TFDB의 이미드 구조는 투명성에 기여하고, TPC-TFDB의 아마이드 구조는 표면경도에 기여하며, BPDC-TFDB의 아마이드 구조는 표면경도 및 탄성계수(Modulus)에 기여한다.The imide structure of 6-FDA-TFDB contributes to transparency, the amide structure of TPC-TFDB contributes to surface hardness, and the amide structure of BPDC-TFDB contributes to surface hardness and modulus.
본 발명의 또 다른 측면에 따르면, TFDB를 용해시킨 용액에, 6-FDA를 투입하여 반응시키는 단계, BPDC를 투입하여 반응시키는 단계, 및 TPC를 투입하여 반응시키는 단계를 포함하여 폴리아믹산 용액을 제조하는 단계; 및 상기 폴리아믹산 용액을 사용하여 폴리아마이드-이미드 필름을 제조하는 단계;를 포함하고, 상기 TPC 및 BPDC의 총 투입량은 TFDB 100mol% 대비 50 내지 80 mol% 인 폴리아마이드-이미드 필름의 제조방법을 제공한다.According to another aspect of the present invention, there is provided a method for producing a polyamic acid solution, which comprises reacting 6-FDA in a solution in which TFDB is dissolved, reacting BPDC and reacting the mixture with TPC, ; And preparing a polyamide-imide film using the polyamic acid solution, wherein the total amount of the TPC and BPDC is 50 to 80 mol% based on 100 mol% of TFDB .
또한, 상기 BPDC의 투입량은, 상기 TPC 및 BPDC의 총 투입량 100mol% 대비 50 내지 70 mol% 인 폴리아마이드-이미드 필름의 제조방법을 제공할 수 있다.The amount of the BPDC may be 50 to 70 mol% based on 100 mol% of the total amount of the TPC and BPDC.
중합반응을 위한 용매는 상기 단량체들을 용해하는 용매이면 특별히 한정되지 않는다. 공지된 반응용매로서 m-크레졸, N-메틸-2-피롤리돈(NMP), 디메틸포름아미드(DMF), 디메틸아세트아미드(DMAc), 디메틸설폭사이드(DMSO), 아세톤, 디에틸아세테이트 중에서 선택된 하나 이상의 극성용매를 사용할 수 있다.The solvent for the polymerization reaction is not particularly limited as long as it is a solvent that dissolves the above monomers. As the known reaction solvent, there may be used, for example, m-cresol, N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), dimethylacetamide (DMAc), dimethylsulfoxide (DMSO) One or more polar solvents may be used.
용매의 함량에 대하여 특별히 한정되지는 않으나, 적절한 용액의 분자량과 점도를 얻기 위하여 용매의 함량은 전체 용액 중 40~95중량%가 바람직하고, 50~90중량%인 것이 보다 바람직하다.Although the content of the solvent is not particularly limited, the content of the solvent is preferably from 40 to 95% by weight, more preferably from 50 to 90% by weight, in order to obtain a suitable molecular weight and viscosity of the solution.
반응시의 조건은 특별히 한정되지 않지만 반응 온도는 -20~80℃가 바람직하고, 반응시간은 30분~24시간이 바람직하다. 또한 반응시 아르곤이나 질소 등의 불활성 분위기인 것이 보다 바람직하다.The reaction conditions are not particularly limited, but the reaction temperature is preferably -20 to 80 占 폚, and the reaction time is preferably 30 minutes to 24 hours. It is more preferable that the reaction atmosphere is an inert atmosphere such as argon or nitrogen.
얻어지는 폴리아마이드-이미드 필름의 두께는 특별히 한정되는 것은 아니지만, 10~250㎛의 범위인 것이 바람직하고, 보다 바람직하게는 25~150㎛인 것이 좋다.The thickness of the obtained polyamide-imide film is not particularly limited, but is preferably in the range of 10 to 250 탆, more preferably 25 to 150 탆.
이하, 본 발명을 실시하기 위한 구체적인 내용으로서 실시예를 상세히 설명하기로 한다. 다만 이들 실시예는 오로지 본 발명을 예시하기 위한 것으로써, 본 발명의 범위가 이들 실시예에 의하여 제한되는 것으로 해석되지는 않는다 할 것이다.Hereinafter, embodiments of the present invention will be described in detail as specific examples for carrying out the present invention. It is to be understood, however, that these examples are for illustrative purposes only and are not to be construed as limiting the scope of the present invention.
실시예Example 1 : One : 폴리아마이드Polyamide -- 이미드Imide 필름의 제조 Production of film
온도조절이 가능한 이중자켓의 1L용 유리반응기에 20℃의 질소 분위기 하에서 디메틸아세트아마이드(DMAc) 710.8g을 채운 후, 2,2’-비스(트리플루오로메틸)-4,4’-디아미노바이페닐(2,2’-TFDB) 64g(0.2mol)을 서서히 투입하면서 용해시키고, 이어 2,2-비스(3,4-디카복시페닐) 헥사플루오로프로판 디안하이드라이드(6-FDA 26.6g(0.06mol)을 서서히 투입하며 1시간 동안 교반하였다. 710.8 g of dimethylacetamide (DMAc) was charged in a 1 L glass reactor equipped with a temperature controllable double jacket under a nitrogen atmosphere at 20 캜, and 2,2'-bis (trifluoromethyl) -4,4'-diamino 64 g (0.2 mol) of biphenyl (2,2'-TFDB) was slowly added and dissolved, and then 2,6-bis (3,4-dicarboxyphenyl) hexafluoropropanediol hydride (0.06 mol) was slowly added thereto and stirred for 1 hour.
그리고 1,1-비페닐-4,4-디카르보닐디클로라이드(BPDC) 23.4g(0.084mol)을 투입한 뒤 1시간 동안 교반하였다. 테레프탈로일클로라이드(TPC) 11.4g(0.056mol)을 투입한 뒤 1시간 동안 교반하여 중합용액을 제조하였다. Then, 23.4 g (0.084 mol) of 1,1-biphenyl-4,4-dicarbonyldichloride (BPDC) was added thereto, followed by stirring for 1 hour. 11.4 g (0.056 mol) of terephthaloyl chloride (TPC) was added and stirred for 1 hour to prepare a polymerization solution.
상기 중합용액을 유리판에 도포한 후, 80℃의 열풍으로 30분 건조하였다. 건조한 폴리아마이드-이미드 중합물을 유리판에서 박리한 후, 핀 프레임에 고정하여 80-300℃ 온도범위에서 2℃/min 속도로 승온시켜 두께 30㎛의 폴리아마이드-이미드 필름을 얻었다.The polymer solution was coated on a glass plate and then dried with hot air at 80 캜 for 30 minutes. The dried polyamide-imide polymer was peeled off from the glass plate, fixed on a pin frame, and heated at a rate of 2 DEG C / min in a temperature range of 80-300 DEG C to obtain a polyamide-imide film having a thickness of 30 mu m.
실시예Example 2 2
6-FDA 26.6g(0.06mol), BPDC 27.3g(0.098mol), TPC 8.5g(0.042mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1 except that 26.6 g (0.06 mol) of 6-FDA, 27.3 g (0.098 mol) of BPDC and 8.5 g (0.042 mol) of TPC were added.
실시예Example 3 3
6-FDA 35.5g(0.08mol), BPDC 20g(0.072mol), TPC 9.8g(0.048mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다. A film was prepared in the same manner as in Example 1 except that 35.5 g (0.08 mol) of 6-FDA, 20 g (0.072 mol) of BPDC and 9.8 g (0.048 mol) of TPC were added.
실시예Example 4 4
6-FDA 44.3g(0.1mol), BPDC 16.7g(0.06mol), TPC 8.1g(0.04mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1 except that 44.3 g (0.1 mol) of 6-FDA, 16.7 g (0.06 mol) of BPDC and 8.1 g (0.04 mol) of TPC were added.
비교예Comparative Example 1 One
BPDC를 투입하지 않고, 6-FDA 26.6g(0.06mol), TPC 28.5g(0.14mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1, except that 26.6 g (0.06 mol) of 6-FDA and 28.5 g (0.14 mol) of TPC were added without adding BPDC.
비교예Comparative Example 2 2
TPC를 투입하지 않고, 6-FDA 26.6g(0.06mol), BPDC 39g(0.14mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1, except that 26.6 g (0.06 mol) of 6-FDA and 39 g (0.14 mol) of BPDC were added without TPC.
비교예Comparative Example 3 3
BPDC를 투입하지 않고, 6-FDA 17.7g(0.04mol), TPC 32.6g(0.16mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1 except that 17.7 g (0.04 mol) of 6-FDA and 32.6 g (0.16 mol) of TPC were added without adding BPDC.
비교예Comparative Example 4 4
6-FDA 26.6g(0.06mol), BPDC 31.2g(0.112mol), TPC 5.7g(0.028mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1 except that 26.6 g (0.06 mol) of 6-FDA, 31.2 g (0.112 mol) of BPDC and 5.7 g (0.028 mol) of TPC were added.
비교예Comparative Example 5 5
BPDC를 투입하지 않고, 6-FDA 44.3g(0.1mol), TPC 20.3g(0.1mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1 except that 44.3 g (0.1 mol) of 6-FDA and 20.3 g (0.1 mol) of TPC were added without adding BPDC.
비교예Comparative Example 6 6
6-FDA 62.1g(0.14mol), BPDC 10g(0.036mol), TPC 4.9g(0.024mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1, except that 62.1 g (0.14 mol) of 6-FDA, 10 g (0.036 mol) of BPDC and 4.9 g (0.024 mol) of TPC were added.
비교예Comparative Example 7 7
6-FDA 8.9g(0.02mol), BPDC 30g(0.108mol) TPC 14.6g(0.072mol)을 투입한 것을 제외하고는 실시예 1과 동일하게 필름을 제조하였다.A film was prepared in the same manner as in Example 1 except that 8.9 g (0.02 mol) of 6-FDA and 30 g (0.108 mol) of BPDC and 14.6 g (0.072 mol) of TPC were added.
상기 실시예 및 비교예의 성분 투입량을 하기 표 1에 나타내었다.The amounts of the components in the above Examples and Comparative Examples are shown in Table 1 below.
시험예Test Example
실시예들 및 비교예들에 의해 제조된 필름의 물성들을 하기와 같은 방법으로 측정하여 하기 표 2에 나타내었다.The physical properties of the films prepared by Examples and Comparative Examples were measured by the following methods and are shown in Table 2 below.
1. 표면경도1. Surface Hardness
표면경도는 연필경도 측정기(CT-PC1, CORE TECH, Korea)에 연필경도 측정용 연필을 45° 각도로 끼우고, 일정한 하중 (750g)을 가하면서 연필 속도 300mm/min으로 측정하였다. 연필은 Mitsubishi 연필을 사용하였는데, H-9H, F, HB, B-6B 등의 강도를 나타내는 연필을 사용하였다.The surface hardness was measured with a pencil hardness measuring instrument (CT-PC1, CORE TECH, Korea) with a pencil hardness measuring pencil at a 45 ° angle and a pencil speed of 300 mm / min while applying a constant load (750 g). The pencil used was a Mitsubishi pencil, and pencils indicating the strength of H-9H, F, HB, B-6B and the like were used.
2. 황색도(YI)2. Yellowness (YI)
YI(Yellow Index) 즉, 황색도는 분광광도계 (Hunter Associates Laboratory사 UltraScan PRO)의 CIE 표색계를 사용하여 측정하였다.YI (Yellow Index), i.e., yellowness, was measured using a CIE colorimeter of a spectrophotometer (UltraScan PRO, Hunter Associates Laboratory).
3. Haze3. Haze
일본 덴쇼쿠고교사의 헤이즈미터 NDH-5000W를 사용하여 측정하였다.And a haze meter NDH-5000W manufactured by Denso Corporation of Japan.
4. 투과도4. Transmission
UV분광계를 이용하여 380 ~ 780nm에서의 투과도를 측정하였다.The transmittance at 380-780 nm was measured using a UV spectrometer.
5. Modulus5. Modulus
인스트론사의 만능시험기 UTM(4206-001)을 사용하여 측정하였다.And was measured using UTM (4206-001), a universal testing machine manufactured by Instron.
먼저 상기 표 1과 같은 조성으로 폴리아마이드-이미드 필름을 제조하였을 때, ⅰ) 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조(이하, 'TPC 및 BPDC로부터 유래된 단위구조'라 함), ⅱ) 상기 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조(이하, 'BPDC로부터 유래된 단위구조'라 함)는 이하의 표 2와 같다.First, when a polyamide-imide film was prepared with the composition as shown in Table 1, it was found that (i) the unit structure derived from 6-FDA and the unit structure derived from TPC and BPDC relative to 100 mol% (Hereinafter referred to as 'unit structure derived from TPC and BPDC'), ii) unit structure derived from BPDC relative to 100 mol% of unit structure derived from TPC and BPDC (hereinafter referred to as 'unit structure derived from BPDC' ) Are shown in Table 2 below.
유래된 단위구조 [mol%]From TPC and BPDC
Derived unit structure [mol%]
상기 시험예의 결과는 이하의 표 3과 같다.The results of the above test examples are shown in Table 3 below.
상기 표 3을 참조하면, 상기 비교예1, 비교예3 및 비교예5는 BPDC로부터 유래된 단위구조를 포함하지 않아 실시예1 내지 실시예4에 비해 모듈러스(탄성계수)가 굉장히 낮음을 알 수 있다.Referring to Table 3, it can be seen that Comparative Examples 1, 3 and 5 do not include a unit structure derived from BPDC, so that the modulus (elastic modulus) is extremely low as compared with Examples 1 to 4 have.
상기 비교예2 및 비교예4는 BPDC로부터 유래된 단위구조가 70 mol%를 초과하여 YI(황색도)가 높고, Haze가 발생하며, 투과도가 떨어짐을 알 수 있다.In Comparative Example 2 and Comparative Example 4, the unit structure derived from BPDC is more than 70 mol%, YI (yellowing degree) is high, haze is generated, and the permeability is decreased.
상기 비교예6은 TPC 및 BPDC로부터 유래된 단위구조가 50 mol% 미만으로 표면경도가 급격히 낮아졌고, 상기 비교예7은 TPC 및 BPDC로부터 유래된 단위구조가 80 mol%를 초과하여 이미드 구조의 부족으로 인해 투명성(투과도, Haze 및 YI)이 저하되었음을 알 수 있다.In Comparative Example 6, the unit structure derived from TPC and BPDC was less than 50 mol% and the surface hardness was drastically lowered. In Comparative Example 7, the unit structure derived from TPC and BPDC had a unit structure exceeding 80 mol% The transparency (transparency, Haze and YI) was reduced due to the shortage.
이에 반해 상기 실시예1 내지 실시예4에 따른 폴리아마이드-이미드 필름은 표면경도 HB 이상, 모듈러스(탄성계수) 5 GPS 이상으로 기계적 물성이 우수함을 알 수 있다. 또한 투과도 89 % 이상, YI(황색도) 3 이하, 투과도 89% 이상으로 광학적 물성 역시 뛰어나다. 이로부터 본 발명에 따른 폴리아마이드-이미드 필름은 무색 투명하면서도 기계적 물성이 뛰어남을 확인할 수 있다.On the contrary, the polyamide-imide films according to Examples 1 to 4 have excellent mechanical properties with a surface hardness of not less than HB and a modulus (elastic modulus) of 5 GPS or more. Also, it has excellent transparency of 89% or more, YI (yellow color) of 3 or less, transparency of 89% or more, and excellent optical properties. From this, it can be confirmed that the polyamide-imide film according to the present invention is colorless and transparent and has excellent mechanical properties.
이상으로 본 발명의 실시예에 대해 상세히 설명하였는바, 본 발명의 권리범위는 상술한 실시예에 한정되지 않으며, 다음의 특허청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 포함된다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. Modified forms are also included within the scope of the present invention.
Claims (6)
상기 TFDB는 6-FDA와 이미드 구조를 형성하고, 상기 TFDB는 TPC 및 BPDC와 아마이드 구조를 형성하며,
상기 6-FDA로부터 유래된 단위구조와 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 상기 TPC 및 BPDC로부터 유래된 단위구조는 50 내지 80 mol%이며,
상기 TPC 및 BPDC로부터 유래된 단위구조 100mol% 대비 BPDC로부터 유래된 단위구조가 50 내지 70 mol%인 것을 특징으로 하는 무색 투명한 폴리아마이드-이미드 필름.
TFDB (2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl), 6-FDA (2,2-bis (3,4-dicarboxyphenyl) hexafluoropropanediamine Imide film comprising a copolymer of a unit structure derived from terephthaloyl chloride (PTFE) (trimethylolpropane triacrylate), BPDC (1,1-biphenyl-4,4-dicarbonyldichloride), and TPC (terephthaloyl chloride)
The TFDB forms an imide structure with 6-FDA, the TFDB forms an amide structure with TPC and BPDC,
The unit structure derived from the 6-FDA and the unit structure derived from TPC and BPDC is 50 to 80 mol% to 100 mol% of the unit structure derived from TPC and BPDC,
Wherein the unit structure derived from BPDC relative to 100 mol% of the unit structure derived from TPC and BPDC is 50 to 70 mol%.
상기 폴리아믹산 용액을 사용하여 폴리아마이드-이미드 필름을 제조하는 단계;
를 포함하고,
상기 TPC 및 BPDC의 총 투입량은 TFDB 100mol% 대비 50 내지 80 mol%이며,
상기 BPDC의 투입량은, 상기 TPC 및 BPDC의 총 투입량 100mol% 대비 50 내지 70mol%인 폴리아마이드-이미드 필름의 제조방법.
Preparing a polyamic acid solution by adding 6-FDA to a solution in which TFDB is dissolved to cause reaction, adding BPDC to react, and reacting with TPC to prepare a polyamic acid solution; And
Preparing a polyamide-imide film using the polyamic acid solution;
Lt; / RTI >
The total amount of the TPC and BPDC is 50 to 80 mol% based on 100 mol% of TFDB,
Wherein the amount of the BPDC is 50 to 70 mol% based on 100 mol% of the total amount of the TPC and BPDC.
A flexible display comprising the polyamide-imide film according to claim 1.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160044370A KR101811253B1 (en) | 2016-04-11 | 2016-04-11 | Colorless and transparent polyamide-imide flim and preparation method of the same |
TW106111884A TWI640552B (en) | 2016-04-11 | 2017-04-10 | Colorless and transparent polyamide-imide flim and preparation method of the same |
JP2019503885A JP6843224B2 (en) | 2016-04-11 | 2017-04-11 | Colorless and transparent polyamide-imide film and its manufacturing method |
US16/088,390 US11326030B2 (en) | 2016-04-11 | 2017-04-11 | Colorless and transparent polyamide-imide film, and manufacturing method therefor |
CN201780020321.XA CN109071814B (en) | 2016-04-11 | 2017-04-11 | Colorless transparent polyamide-imide film and preparation method thereof |
PCT/KR2017/003889 WO2017179877A1 (en) | 2016-04-11 | 2017-04-11 | Colorless and transparent polyamide-imide film, and manufacturing method therefor |
EP17782632.8A EP3444292A4 (en) | 2016-04-11 | 2017-04-11 | Colorless and transparent polyamide-imide film, and manufacturing method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160044370A KR101811253B1 (en) | 2016-04-11 | 2016-04-11 | Colorless and transparent polyamide-imide flim and preparation method of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170116513A KR20170116513A (en) | 2017-10-19 |
KR101811253B1 true KR101811253B1 (en) | 2017-12-22 |
Family
ID=60298444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160044370A KR101811253B1 (en) | 2016-04-11 | 2016-04-11 | Colorless and transparent polyamide-imide flim and preparation method of the same |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101811253B1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102140287B1 (en) * | 2017-12-11 | 2020-07-31 | 주식회사 엘지화학 | Polyamide-imide copolymers and polyamide-imide film comprising the same |
KR102036238B1 (en) * | 2017-12-28 | 2019-10-24 | 에스케이씨 주식회사 | Polyamide-imide film and preparation method thereof |
KR102350095B1 (en) * | 2018-01-03 | 2022-01-11 | 주식회사 엘지화학 | Poly(amide-imide) copolymer film and preparation method of the same |
KR102036227B1 (en) * | 2018-01-31 | 2019-10-24 | 에스케이씨 주식회사 | Polyamide-imide film and preparation method thereof |
KR102516144B1 (en) * | 2018-08-28 | 2023-03-29 | 주식회사 엘지화학 | Pre-treating method of solvent for transparent film |
KR102334954B1 (en) | 2018-10-11 | 2021-12-02 | 주식회사 엘지화학 | Protection film for foldable display and foldable display device comprising same |
US11339250B2 (en) | 2019-06-26 | 2022-05-24 | Skc Co., Ltd. | Polyamide-imide film and process for preparing the same |
KR20210001810A (en) * | 2019-06-28 | 2021-01-06 | 에스케이씨 주식회사 | Polyimide-based film and preparation method thereof |
KR102158321B1 (en) * | 2020-01-16 | 2020-09-21 | 에스케이씨 주식회사 | Polyamide-imide film and preparation method thereof |
KR102157705B1 (en) * | 2020-01-16 | 2020-09-18 | 에스케이씨 주식회사 | Polyamide-imide film and preparation method thereof |
-
2016
- 2016-04-11 KR KR1020160044370A patent/KR101811253B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20170116513A (en) | 2017-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101811253B1 (en) | Colorless and transparent polyamide-imide flim and preparation method of the same | |
KR101839293B1 (en) | Colorless and transparent polyamide-imide flim and preparation method of the same | |
KR102116512B1 (en) | Colorless and transparent polyamide-imide flim and preparation method of the same | |
JP6843224B2 (en) | Colorless and transparent polyamide-imide film and its manufacturing method | |
KR102339037B1 (en) | Polyamide-imide precursor composition, polyamide-imide film and display device | |
KR101870341B1 (en) | Colorless Polyamide―imide Resin and Film Thereof | |
KR101293346B1 (en) | Polyimide film | |
KR101328838B1 (en) | Polyimide film | |
KR102017196B1 (en) | Polyamideimide copolymers and colorless and transparent polyamideimide film comprising the same | |
EP3392295B1 (en) | Polyamideimide copolymer and polyamideimide film containing same | |
KR20120078510A (en) | Transparent polyimide film and method for preparing the same | |
KR101729731B1 (en) | Colorless and transparent polyamide-imide flim having improved tensile elongation | |
KR101862028B1 (en) | Polyamic acid, And Polyimide Resin And Polyimide Film | |
KR102251518B1 (en) | Polyamic acid, And Polyimide Resin And Polyimide Film | |
KR102093696B1 (en) | Polyimide resin composition having improved frictional property and Film thereof | |
EP3290461A1 (en) | Polyimide resin and film using same | |
TWI656148B (en) | Method for preparing a polyamidamine-imine film | |
KR102251515B1 (en) | Transparent Polyamide-imide film with improved Solvent Resistance | |
KR102271028B1 (en) | Method of preparing Polyamic acid and Polyamic acid, Polyimide resin and Polyimide film thereby | |
US11697710B2 (en) | Colorless polyimide film containing fluorine and cardo structure and preparation method thereof | |
KR101986710B1 (en) | Polyimide resin comprising a pigment and Polyimide film thereof | |
KR102072219B1 (en) | Polyamideimide block copolymers and colorless and transparent polyamideimide film comprising the same | |
KR20170100794A (en) | Polyamic acid, Polyimide Resin, Polyimide Film and Display Device Comprising Thereof | |
KR102251519B1 (en) | Polyamic acid, And Polyimide Resin And Polyimide Film | |
CN113795536A (en) | Polyamic acid composition and preparation method thereof, preparation method of polyimide film and polyimide film prepared from same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20160411 |
|
PA0201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20170724 Patent event code: PE09021S01D |
|
PG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20171214 |
|
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20171215 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20171218 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20201019 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20210927 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20221004 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20240919 Start annual number: 8 End annual number: 8 |