KR101810598B1 - JUMPER WIRE COMPOSED OF Al-Mg/Cu EXTRUDED MATERIAL - Google Patents

Abstract

The present invention is characterized in that a cylindrical copper (Cu) alloy plate is coated on the outer circumferential surface of a wire made of an alloy of aluminum and magnesium (Al-Mg) and extruded by using an extruder to form an Al-Mg / Cu extruded material , And a jumper wire formed by plating tin (Sn) on the surface of the Al-Mg / Cu extruded material.

Description

JUMPER WIRE COMPOSED OF Al-Mg / Cu EXTRUDED MATERIAL < RTI ID = 0.0 >

The present invention is characterized in that a cylindrical copper (Cu) alloy plate is coated on the outer circumferential surface of a wire made of an alloy of aluminum and magnesium (Al-Mg) and extruded by using an extruder to form an Al-Mg / Cu extruded material , And a jumper wire formed by plating tin (Sn) on the surface of the Al-Mg / Cu extruded material.

As disclosed in Korean Registered Utility Model No. 20-0422191 (Registered on July 18, 2006) and Korean Patent Laid-Open No. 10-2010-0109184 (Published Date 2010.10.08), a conventional jumper wire uses an aluminum wire, The wire of the present invention has a problem in that it is easily warped or stretched due to its material properties.

In order to solve such a problem, it was tried to solve the problem by using a plating technique such as copper plating on the surface of an aluminum wire. However, due to the limitation of the plating technique, And it is difficult to expect a great effect on the improvement of the electric conductivity by the copper plating.

SUMMARY OF THE INVENTION The present invention solves the problems of the prior art, and it is possible to solve the problem of being easily warped or stretched, expecting improvement of electric conductivity and improvement of wear resistance.

Korea Registered Practitioner 20-0422191 (Registered Date 2006.07.18) Korean Patent Publication No. 10-2010-0109184 (published date Oct. 10, 2010)

In order to solve the problems of the prior art, the present invention has been made in order to solve the problems of the prior art by coating a cylindrical copper (Cu) plate with an outer circumferential surface of a wire made of an alloy of aluminum and magnesium (Al- (Sn) plating on the surface of such an Al-Mg / Cu extruded material to solve the problems of the conventional aluminum jumper wire and to improve the electrical conductivity, It is an object of the present invention to provide a jumper wire made of an Al-Mg / Cu extruded material which is adjustable in strength and capable of improving abrasion resistance.

In order to achieve the above object,

The present invention relates to a jumper wire using aluminum,

The jumper wire is formed by covering a cylindrical copper (Cu) plate with an outer circumferential surface of aluminum and a magnesium alloy (Al-Mg) wire,

Extruded using a hydrostatic extruder to form an Al-Mg / Cu extruded material,

And a surface of the Al-Mg / Cu extruded material is subjected to tin plating treatment.

The jumper wire made of the Al-Mg / Cu extruded material according to the present invention can improve the durability such as the improvement of the abrasion resistance property by forming the copper (Cu) layer through the extrusion method on the surface of the wire made of the alloy of aluminum and magnesium, It is adjustable in strength and has the property of improving electrical conductivity.

It also has the advantage of being able to solve the problem of being easily warped and stretched, which is a problem caused by forming copper plating on the surface of a conventional aluminum wire.

1 is a view showing a jumper wire made of an Al-Mg / Cu extruded material according to the present invention.

Hereinafter, the technical contents of the present invention will be described in detail.

1, the jumper wire 1 made of an Al-Mg / Cu extruded material according to the present invention has an outer peripheral surface of an aluminum-magnesium alloy (Al-Mg) wire 10 A copper layer 20, and a tin layer 30 are sequentially formed.

The copper layer 20 is formed integrally with aluminum and magnesium alloy (Al-Mg) wires 10 by an extrusion method other than a plating method. The tin layer 30 is made of aluminum and a magnesium alloy (Al-Mg) The wire 10 and the copper layer 20 are formed by plating on the surface of the Al-Mg / Cu extruded material which is integral with each other.

As described above, the jumper wire made of the Al-Mg / Cu extruded material according to the present invention is formed by covering a cylindrical copper (Cu) plate with the outer peripheral surface of aluminum and magnesium alloy (Al-Mg) wire 10,

Extruded using a hydrostatic extruder to form an Al-Mg / Cu extruded material,

And then tin plating the surface of the Al-Mg / Cu extruded material.

The extruded Al-Mg / Cu extruded material is extruded using a 600 ton hydrostatic extruder and is extruded at an extrusion pressure of 300 to 450 tons, an rpm speed of 8 to 15 mm / sec, and an extrusion temperature of 230 to 280 DEG C .

Aluminum (Al) has an atomic weight of 26.98, an atomic radius of 0.142 nm and a lattice constant of 0.405 nm, which is a face-centered cubic (FCC) structure. The specific gravity of aluminum is 2.7 g / cm 3, which is about 3/1 of light metal compared to 9.9 g / cm 3 of copper and 7.9 g / cm 3 of iron.

Aluminum is very hard and hardly attached to the aluminum surface, and the aluminum oxide (Al ₂ O ₃ ) is very thin with a thickness of about nano meter. It keeps its unique metallic luster and maintains its appearance for a long time. do. Also, it has good ductility and excellent electric conductivity, so it is used for producing high-voltage electric wire, and it is light and does not suck well.

Conventionally, jumper wires having been plated with copper on the outer circumferential surface of an aluminum jumper wire have been conventionally disclosed in manufacturing jumper wires using such aluminum, but the conventional copper plating techniques are limited to the level of surface treatment due to limitations of plating technology The effect due to copper plating is insignificant. As a result, the jumper wire is easily warped and elongated due to the characteristics of aluminum material, and the improvement in electric conductivity is insufficient.

As described above, the present invention solves the above-mentioned problems. As described above, a cylindrical copper (Cu) plate is coated on the outer peripheral surface of aluminum and magnesium alloy (Al-Mg) wire 10, The extruded material is extruded under a strong pressure to produce a jumper wire of an Al-Mg / Cu extruded material having a thick copper layer.

Magnesium used for the Al-Mg alloy is rarely used in pure form. In general, aluminum, zinc, manganese, zirconium, silver, rare earth metals and the like are added to obtain strength and physical properties required as a structural material.

An important factor in determining the alloying elements of magnesium is the relative difference in the respective atomic sizes. The atomic size of magnesium is 0.320 nm, and an alloy element having an atomic size generally within about 15% difference can be a candidate.

The magnesium alloy contains 3 to 7 wt% of Zn and 0.1 to 1.8 wt% of Cu, based on the entire content.

The electrical conductivity and thermal conductivity of the magnesium alloy are affected by grain refinement due to the addition of Zn and Cu, the type and fraction of the second phase, and the amount of Zn in the? -Mg matrix. As the addition amount of Zn increases beyond the above-mentioned range, the electric conductivity and the thermal conductivity characteristics are weakened. Therefore, the addition amount of Zn is preferably limited within the above-mentioned range.

Also, when the amount of Cu added is less than the above-mentioned range, the electrical conductivity and the thermal conductivity property are weakened. Therefore, the amount of Cu added is preferably limited within the above-mentioned range.

The chemical composition of aluminum used for the Al-Mg alloy includes 97.9% of aluminum, 1.0% of Mg, 0.6% of Si, 0.3% of Cu and 0.2% of Cr,

The magnesium alloy is composed of 92.9 to 96.9 wt% of Mg, 3 to 7 wt% of Zn and 0.1 to 1.8 wt% of Cu.

The Al-Mg alloy is formed by mixing 40 to 60 wt% of aluminum (Al) and 40 to 60 wt% of a magnesium alloy.

The jumper wire of the Al-Mg / Cu extruded material is formed by pressing a metal having different properties onto the surface of the Al-Mg alloy wire by a working method such as extrusion or rolling.

This is because the two plates are bonded together to form a single plate, which is a thermodynamic spontaneous reaction.

Solid-state bonding between these materials is a spontaneous reaction, and the bonding between the two materials at the bonding interface is caused by the mutual attractive force of the atoms. In order for the interatomic attraction to act between the atoms, the distance between the atoms should be within about 10 Å, but in reality, the surface of the plate is coarse and there is unevenness.

In order to solve this problem, it is necessary to apply a pressure to the bonding surface to achieve plastic deformation of 10% or more, and a pretreatment for removing impurities existing at the interface is required.

That is, scales and foreign substances present on the bonding surfaces of the Al-Mg alloy and copper (Cu) are cleanly removed to ensure proper bonding.

Hereinafter, a specific example of the production of the jumper wire of the Al-Mg / Cu extruded material will be described with reference to examples.

Annealing is performed at 400 ° C for 2 hours and 30 minutes to reduce the compressive load by lowering the strength of the Al-Mg alloy wire and the cylindrical copper (Cu) plate.

An Al-Mg alloy wire is coated with the above-mentioned cylindrical copper (Cu) plate material. At this time, the difference between the outer diameter of the Al-Mg alloy wire and the inner diameter of the cylindrical copper (Cu) plate is 1 to 2 mm. That is, the outer diameter of the copper (Cu) plate is made 1 to 2 mm larger than the outer diameter of the Al-Mg alloy wire.

Next, a copper (Cu) layer was formed on the surface of the Al-Mg alloy wire by extruding using a hydrostatic extrusion apparatus, and extruding it at an extrusion pressure of 380 tons, a ram speed of 12 mm / sec, A jumper wire of an integrally formed Al-Mg / Cu extruded material is produced.

The jumper wire of the thus-produced Al-Mg / Cu extruded material is tin-plated to enhance durability, corrosion resistance, and inherent properties of the jumper wire.

The tin plating is performed through electroplating or hot-dip coating,

The electroplating is carried out by mixing 65 to 72 wt% of tin sulfate (SnSO ₄ ) having a purity of 97%, 27 to 34 wt% of phenol sulfonic acid (PSA), 1 to 3 wt% of ENSA (ethoxylated alpha-naphthol sulfonic acid) And electroplated at a current density of 5 A / dm ² to 35 A / dm ² using a plating solution at 55 ° C to have a plating adhesion amount of 1.1 g / m 2 to 11.2 g / m 2.

And the hot-dip coating is performed by hot-dipping the Al-Mg / Cu extruded material in a tin plating bath so as to have a plating adhesion amount of 1.1 g / m 2 to 11.2 g / m 2.

If the amounts of PSA and ENSA used for tin plating by electroplating are less than 27 wt% and less than 1 wt%, the strength of the texture is lowered and the quality of plating is lowered. Therefore, the additives PSA and ENSA are 27 ~ 34 wt% and 1 wt% to 3 wt%, respectively.

The PSA maintains the primary rate gold solution acidic, improves electrical conductivity and prevents Sn ⁺² from being oxidized to Sn ⁺⁴ . Therefore, it is necessary to maintain a proper acid concentration in the solution.

In the plating process, the electrode reaction uses a soluble anode to maintain the concentration of Sn ⁺² , and at the cathode, electrodeposition in the script, that is, tin plating is performed. The use of a soluble anode (tin rod) on the anode results in the following soluble anode reaction and the use of an insoluble anode results in an insoluble anodic reaction. In particular, since the H ⁺ ions are consumed as H ₂ in the cathode, the PSA must be supplemented to maintain the concentration of H ⁺ ions continuously.

Soluble Anode Reaction

Cathode

Sn ^{+ 2} + 2e ^{- -} > Sn EO = -0.141 volts

^{2H + + 2e - ---> H} 2 EO = 0.0 volt

Anode

Sn ---> Sn ^{+ 2} + 2e ^-

solution

Sn ⁺⁴ + PSA ---> Sn ⁺⁴ (PSA) salt

Insoluble anodic reaction

Cathode

Sn ⁺² + 2e ^- - > SnEo = -0.141 volts

^{2H + + 2e - ---> H} 2 Eo = 0.0 volt

Anode

2H ₂ O - -> O ₂ + 4H ⁺ + 4e ^-

solution

_{^{2Sn + 4H + + O 2 ---}} > 2Sn +2 + 2H 2 O

^{(Sn + 2H + ----> Sn} +2 + H 2)

On the other hand, PSA is complexed with Sn ⁺⁴ ions in the plating solution and partly consumed. If the concentration of H + in the plating solution is less than the allowable value, the conductivity of the solution is lowered so that a higher voltage is applied. On the other hand, if the concentration of H ⁺ is larger than the allowable value, it is necessary to increase the operating temperature since it unnecessarily wastes acid and causes problems such as stain and hold down roll tin nodule.

The role of the ENSA solution is to inhibit the reaction and act as a reaction inhibitor. ENSA acts as a polish to improve the gloss of existing plated surfaces by inhibiting the rate at which Sn is plated onto the strip surface. ENSA solution consists of 49.7% of ENSA, 7.3% of free sulfuric acid, 2.6% of water and 40.4% of EN content.

Among ENSA solutions, ENSA is an anion and EN is a non-ion and is known to be insoluble in water.

Electric tin plating apparatus control panel, the rectifier, the plating cell, reservoir, pump, as a general device consisting of a pipe, a DC rectifier with a maximum capacity of the coating apparatus to apply a current density to the plating specimen to 250A up to 100A / dm ² Lt; / RTI >

The distance between the counter electrodes (anode and cathode spacing) of the plating cell is 20 mm, and the reaction area between the anode and the cathode is 100 × 250 mm ² (2.5 dm ² ). The plating solution temperature is 25 占 폚 to 55 占 폚 and electroplated at a current density of 5 A / dm ² to 35 A / dm ² to have a plating thickness of 0.15 to 1.50 占 퐉.

The temperature of the plating solution is a factor related to the denseness of the plating. When the temperature of the plating solution is less than 25 ° C, the denseness of the plating is deteriorated and the plating gloss becomes poor. On the other hand, There is a problem that the surface is deteriorated. Therefore, it is preferable that the temperature of the plating solution is maintained in the range of 25 캜 to 55 캜.

The current density is a factor affecting gloss and tissue strength, and the current density is 5 A / dm < ^{2 >} , There is a problem that the plating gloss is lowered and the tissue strength is lowered. When the density exceeds 35 A / dm ² , the current density is insignificant because the increase in the tissue strength hardly occurs, and the current density is 5 A / dm ² To 35 A / dm < ² >

The plating thickness is a factor affecting the plating strength. When the plating thickness is less than 0.15 m, the plating strength is lowered. When the plating thickness exceeds 1.50 m, the plating strength is increased. However, since the use amount of the plating solution is increased, it is not economical. Therefore, it is preferable that the plating thickness is kept in the range of 0.15 to 1.50 m in consideration of the plating strength and economical efficiency.

FIG. 1 is a view showing a jumper wire made of an Al / Mg extruded material according to the present invention. The physical properties of the jumper wire produced according to the present invention are shown in Table 1 below.

Wire diameter Copper total thickness The tensile strength Elongation rate Flexural strength Conductivity
0.6-0.8Φ
More than 30um
15 ㎏ _f / mm ² or more
1% or more
1.5 times or more
More than 60%

The jumper wire made of an Al-Mg / Cu extruded material according to the present invention is formed by extruding a jumper wire made of an aluminum-magnesium alloy wire with a cylindrical copper (Cu) / Cu extruded material, and tin (Sn) plating is applied to the surface of such an Al-Mg / Cu extruded material to solve the problems of conventional aluminum jumper wires and to improve electric conductivity and wear resistance, This is big.

1: Jumper wire
10: Al-Mg alloy wire
20: copper layer
30: tin layer

Claims (5)

Claims [1] A jumper wire formed by coating copper on an outer circumferential surface of a wire using aluminum and extruding the same followed by tin plating,

The jumper wire is formed by coating a cylindrical copper (Cu) plate with an outer circumferential surface of an aluminum-magnesium alloy (Al-Mg) wire composed of 40 to 60 wt% of aluminum and 40 to 60 wt%
Extruded under extrusion conditions of an extrusion pressure of 300 to 450 tons, an rpm speed of 8 to 15 mm / sec, and an extrusion temperature of 230 to 280 DEG C using a 600 ton hydrostatic extruder to form an Al-Mg / Cu extruded material,
The surface of the Al-Mg / Cu extruded material is coated with a mixture of 65 to 72 wt% of tin sulfate (SnSO ₄ ) having a purity of 97%, 27 to 34 wt% of PSA (phenolsulfonic acid), 1 to 3 wt% of ENSA (ethoxylated alpha-naphthol sulfonic acid) And electroplating at a current density of 5 A / dm ² to 35 A / dm ² using a plating solution of 25 to 55 ° C, which is a mixture of copper and copper, and electroplating to have a plating adhesion amount of 1.1 g / ㎡ to 11.2 g / Wherein the jumper wire is made of an Al-Mg / Cu extruded material.
delete delete delete The method according to claim 1,
Jumper wire diameter 0.6 ~ 0.8Φ, Cu thickness of 30um or more, tensile strength of 15 ㎏ _f / mm ² or more, elongation at break 1 Mg-Al, characterized in that with a% or more and a bending strength 1.5 or more times, the electric conductivity of 60% or more attribute / Jumper wire made of Cu extruded material.

Images