KR101767865B1 - 이어폰 소켓 어셈블리와 전자기기 - Google Patents
이어폰 소켓 어셈블리와 전자기기 Download PDFInfo
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- KR101767865B1 KR101767865B1 KR1020167033991A KR20167033991A KR101767865B1 KR 101767865 B1 KR101767865 B1 KR 101767865B1 KR 1020167033991 A KR1020167033991 A KR 1020167033991A KR 20167033991 A KR20167033991 A KR 20167033991A KR 101767865 B1 KR101767865 B1 KR 101767865B1
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- earphone socket
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/50—Bases; Cases formed as an integral body
- H01R13/501—Bases; Cases formed as an integral body comprising an integral hinge or a frangible part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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- H01R13/65802—
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- H01R13/65805—
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- H01R13/65807—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6589—Shielding material individually surrounding or interposed between mutually spaced contacts with wires separated by conductive housing parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/58—Contacts spaced along longitudinal axis of engagement
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/60—Substation equipment, e.g. for use by subscribers including speech amplifiers
- H04M1/6033—Substation equipment, e.g. for use by subscribers including speech amplifiers for providing handsfree use or a loudspeaker mode in telephone sets
- H04M1/6041—Portable telephones adapted for handsfree use
- H04M1/6058—Portable telephones adapted for handsfree use involving the use of a headset accessory device connected to the portable telephone
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Telephone Set Structure (AREA)
- Headphones And Earphones (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
Abstract
Description
도 1은 일 예시적 실시예에 따른 이어폰 소켓 어셈블리의 구조 모식도이다.
도 2a는 다른 예시적 실시예에 따른 이어폰 소켓 어셈블리의 구조 모식도이다.
도 2b는 다른 예시적 실시예에 따른 이어폰과 회로기판이 연결된 구조 모식도이다.
도 2c는 다른 예시적 실시예에 따른 이어폰 소켓과 회로기판에서의 용접방식의 모식도이다.
도 2d는 다른 예시적 실시예에 따른 전자기 차폐 하우징이 회로기판에서의 용접방식의 모식도이다.
도 3a는 또 다른 예시적 실시예에 따른 이어폰 소켓 어셈블리의 구조 모식도이다.
도 3b는 또 다른 예시적 실시예에 따른 이어폰 소켓과 회로기판이 연결된 구조 모식도이다.
도 3c는 또 다른 예시적 실시예에 따른 이어폰 소켓 어셈블리와 회로기판의 커넥터를 연결하는 구조 모식도이다.
도 4는 일 예시적 실시예에 따른 전자기기의 구조 모식도이다.
도 5는 다른 예시적 실시예에 따른 전자기기의 구조 모식도이다.
도 6은 또 다른 예시적 실시예에 다른 전자기기의 구조 모식도이다.
Claims (10)
- 전자기기의 회로기판에 전기적으로 연결되는 이어폰 소켓;
상기 이어폰 소켓의 외주에 설치되는 전자기 차폐 소자를 포함하고,
상기 전자기 차폐 소자는 이어폰 소켓을 완전히 덮으며, 상기 전자기 차폐 소자와 상기 이어폰 소켓 사이에는 지지 부재가 없고,
상기 이어폰 소켓의 핀은 본딩 포인트를 통하여 상기 회로기판의 전기전도성 트랙에 전기적으로 연결되고,
상기 전자기 차폐 소자는, 상기 이어폰 소켓의 외주와 상기 회로기판 상의 상기 이어폰 소켓의 상기 본딩 포인트의 외주를 덮으며, 상기 회로기판을 통하여 접지되는 전자기 차폐 하우징이며, 상기 전자기 차폐 하우징의 면적은 상기 이어폰 소켓의 상기 본딩 포인트의 외주만 덮을 수 있도록 설정된
이어폰 소켓 어셈블리.
- 삭제
- 제 1 항에 있어서,
상기 이어폰 소켓 어셈블리는 커넥터를 더 포함하고;
상기 이어폰 소켓의 핀은 상기 커넥터를 통하여 상기 회로기판의 전기전도성 트랙에 전기적으로 연결되며;
상기 전자기 차폐 소자는 상기 이어폰 소켓의 외주를 둘러싸는 전자기 차폐층인 이어폰 소켓 어셈블리.
- 제 1 항에 있어서,
상기 이어폰 소켓은 상기 회로기판의 어느 하나의 측면에 설치되고, 상기 회로기판에는 적어도 하나의 안테나가 설치되어 있는 이어폰 소켓 어셈블리.
- 제 3 항에 있어서,
상기 전자기 차폐층은 전자기 차폐 재료가 도포된 연성회로기판(FPC)인 이어폰 소켓 어셈블리.
- 전자기기의 회로기판에 전기적으로 연결되는 이어폰 소켓과 상기 이어폰 소켓의 외주에 설치되는 전자기 차폐소자를 포함하는 이어폰 소켓 어셈블리와,
회로기판을 포함하고,
상기 전자기 차폐 소자는 이어폰 소켓을 완전히 덮으며, 상기 전자기 차폐 소자와 상기 이어폰 소켓 사이에는 지지 부재가 없고,
상기 이어폰 소켓의 핀은 본딩 포인트를 통하여 상기 회로기판의 전기전도성 트랙에 전기적으로 연결되고,
상기 전자기 차폐 소자는 상기 이어폰 소켓의 외주와 상기 회로기판 상의 상기 이어폰 소켓의 상기 본딩 포인트의 외주를 덮으며, 상기 회로기판을 통하여 접지되는 전자기 차폐 하우징이며, 상기 전자기 차폐 하우징의 면적은 상기 이어폰 소켓의 상기 본딩 포인트의 외주만 덮을 수 있도록 설정된
전자기기.
- 삭제
- 제 6 항에 있어서,
상기 이어폰 소켓 어셈블리는 커넥터를 더 포함하고;
상기 이어폰 소켓의 핀은 상기 커넥터를 통하여 상기 회로기판의 전기전도성 트랙에 전기적으로 연결되며;
상기 전자기 차폐 소자는 상기 이어폰 소켓의 외주를 덮는 전자기 차폐층인 전자기기.
- 제 6 항에 있어서,
상기 이어폰 소켓은 상기 회로기판의 어느 하나의 측면에 설치되고, 상기 회로기판에는 적어도 하나의 안테나가 설치되어 있는 전자기기.
- 제 8 항에 있어서,
상기 전자기 차폐층은 전자기 차폐재료가 도포된 연성회로기판(FPC)인 전자기기.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410302988.7A CN104134907B (zh) | 2014-06-27 | 2014-06-27 | 耳机插座组件和电子设备 |
CN201410302988.7 | 2014-06-27 | ||
PCT/CN2014/089299 WO2015196666A1 (zh) | 2014-06-27 | 2014-10-23 | 耳机插座组件和电子设备 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020147035919A Division KR20160011560A (ko) | 2014-06-27 | 2014-10-23 | 이어폰 소켓 어셈블리와 전자기기 |
Publications (2)
Publication Number | Publication Date |
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KR20160145195A KR20160145195A (ko) | 2016-12-19 |
KR101767865B1 true KR101767865B1 (ko) | 2017-08-11 |
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KR1020147035919A Ceased KR20160011560A (ko) | 2014-06-27 | 2014-10-23 | 이어폰 소켓 어셈블리와 전자기기 |
KR1020167033991A Active KR101767865B1 (ko) | 2014-06-27 | 2014-10-23 | 이어폰 소켓 어셈블리와 전자기기 |
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KR1020147035919A Ceased KR20160011560A (ko) | 2014-06-27 | 2014-10-23 | 이어폰 소켓 어셈블리와 전자기기 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP2961007B1 (ko) |
JP (1) | JP6195670B2 (ko) |
KR (2) | KR20160011560A (ko) |
CN (1) | CN104134907B (ko) |
BR (1) | BR112014032906B1 (ko) |
MX (1) | MX350524B (ko) |
RU (1) | RU2608170C2 (ko) |
WO (1) | WO2015196666A1 (ko) |
Families Citing this family (6)
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EP3208890A1 (en) * | 2016-02-19 | 2017-08-23 | Thomson Licensing | Socket for an electrical plug and flexible electrical plug |
CN105704271A (zh) * | 2016-03-24 | 2016-06-22 | 广东欧珀移动通信有限公司 | 移动终端 |
CN106163245B (zh) * | 2016-06-28 | 2019-05-10 | Oppo广东移动通信有限公司 | Pcb板组件及具有其的移动终端 |
CN106899907A (zh) * | 2017-02-24 | 2017-06-27 | 惠州Tcl移动通信有限公司 | 一种耳机及通信组件 |
CN106887702B (zh) * | 2017-04-18 | 2020-07-03 | Oppo广东移动通信有限公司 | 移动终端及其天线金属插座组件 |
CN119452675A (zh) * | 2023-03-24 | 2025-02-14 | 深圳市韶音科技有限公司 | 主控电路板和耳机 |
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JP2014107635A (ja) * | 2012-11-26 | 2014-06-09 | Panasonic Corp | ヘッドセットジャックおよび携帯端末 |
CN103096214A (zh) * | 2013-01-31 | 2013-05-08 | 青岛歌尔声学科技有限公司 | 耳机电路板磁屏蔽装置及方法 |
CN103311756B (zh) * | 2013-05-10 | 2016-08-31 | 惠州Tcl移动通信有限公司 | 便携式电子设备 |
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2014
- 2014-06-27 CN CN201410302988.7A patent/CN104134907B/zh active Active
- 2014-10-23 KR KR1020147035919A patent/KR20160011560A/ko not_active Ceased
- 2014-10-23 WO PCT/CN2014/089299 patent/WO2015196666A1/zh active Application Filing
- 2014-10-23 RU RU2014152993A patent/RU2608170C2/ru active
- 2014-10-23 MX MX2014015164A patent/MX350524B/es active IP Right Grant
- 2014-10-23 KR KR1020167033991A patent/KR101767865B1/ko active Active
- 2014-10-23 BR BR112014032906-0A patent/BR112014032906B1/pt active IP Right Grant
- 2014-10-23 JP JP2016528344A patent/JP6195670B2/ja active Active
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2015
- 2015-06-25 EP EP15173842.4A patent/EP2961007B1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011150403A1 (en) | 2010-05-28 | 2011-12-01 | Zenith Investments Llc | Dual orientation connector with external contacts |
US20140051291A1 (en) | 2010-07-19 | 2014-02-20 | Fci Connectors Singapore Pte Ltd | Fpc shielded connector |
Also Published As
Publication number | Publication date |
---|---|
BR112014032906B1 (pt) | 2021-10-13 |
WO2015196666A1 (zh) | 2015-12-30 |
JP6195670B2 (ja) | 2017-09-13 |
EP2961007B1 (en) | 2018-08-08 |
EP2961007A1 (en) | 2015-12-30 |
RU2014152993A (ru) | 2016-07-20 |
JP2016534605A (ja) | 2016-11-04 |
KR20160145195A (ko) | 2016-12-19 |
CN104134907A (zh) | 2014-11-05 |
BR112014032906A2 (pt) | 2017-06-27 |
RU2608170C2 (ru) | 2017-01-17 |
CN104134907B (zh) | 2017-08-15 |
MX2014015164A (es) | 2016-04-26 |
MX350524B (es) | 2017-09-08 |
KR20160011560A (ko) | 2016-02-01 |
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