KR101747852B1 - Printed circuit board coating inspection apparatus and inspection methods thereof - Google Patents

Abstract

The present invention relates to a printed circuit board (PCB) coating inspecting apparatus, comprising: a test board on which the printed circuit board is mounted; a camera unit coupled to the moving member and capturing the printed circuit board mounted on the test board; A moving unit for moving the camera unit in an axial direction of at least one of an X-axis, a Y-axis, and a Z-axis, and a control unit for processing image data photographed by the camera unit, And an angle adjusting unit for adjusting the angle of view of the camera unit by rotating in at least one axial direction of the camera unit.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a printed circuit board coating inspection apparatus and a method of inspecting the same.

The present invention relates to a printed circuit board coating inspecting apparatus and a method for inspecting a printed circuit board coating inspecting apparatus which can inspect a coating state formed on a printed circuit board at various positions and angles through a camera unit capable of tilting, .

The printed circuit board (PCB) coating prevents short circuit, short circuit and discharge of the printed circuit board and prolongs the life of the printed circuit board. In addition, as the electrical insulation is enhanced through the printed circuit board coating, it is possible to design the printed circuit board finely and permit a high voltage on the printed circuit board. The international standards for printed circuit boards specify inspection items for printed circuit board coatings, and it is necessary to carefully inspect the printed circuit board coating for defects in order to meet the prescribed coating standards. However, due to problems such as eye fatigue, concentration reduction, and throughput, such testing is a very difficult task. In addition, with the development of technology, the elements to be bonded to the printed circuit board have been diversified, densified and miniaturized. As a result, work for finding defective coating of the printed circuit board is becoming more difficult, The productivity and reliability of the coating are deteriorating.

To solve this problem, in the prior art, the camera was fixed and the printed circuit board was moved to check whether or not the printed circuit board coating was defective. However, in the conventional inspection apparatus, when the printed circuit board is located outside the allowable range of the depth of focus of the camera lens, clear image data can not be obtained, and accurate inspection is difficult.

In addition, when the size of the printed circuit board is large, the prior art requires a plurality of cameras, which increases the cost and requires a large space for installation of the inspection apparatus.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and it is an object of the present invention to provide a method of inspecting a printed circuit board, And a method of inspecting the printed circuit board.

The PCB coating inspecting apparatus according to an embodiment of the present invention may include a test board on which the printed circuit board is placed, a camera unit coupled to the moving member and capturing the printed circuit board mounted on the test board, A moving member for moving the camera unit in an axial direction of at least one of an X-axis, a Y-axis, and a Z-axis for photographing a circuit board, and a control unit for processing image data photographed by the camera unit, And an angle adjusting unit that rotates in at least one axial direction of the X-axis and the Y-axis to adjust the photographing angle of the camera unit.

Preferably, the angle adjusting unit includes an X-axis tilting unit coupled to one end of the moving member and rotated in the X-axis direction, and a Y-axis tilting unit coupled to one end of the X-axis tilting unit and rotated in the Y- The camera unit may further include a camera lens unit coupled to one end of the Y-axis tilting unit.

Also, preferably, the camera unit may adjust the angle of the camera lens unit according to the distance between components coupled at a vertical angle with the printed circuit board.

Preferably, the inspection table further includes a fixing unit fixedly mounting the printed circuit board and adjusting the length of the printed circuit board according to the size of the printed circuit board.

Further, preferably, the inspection table is rotated so that a plurality of surfaces of the printed circuit board are exposed to the camera unit.

Preferably, the printed circuit board coating inspecting apparatus may further include a plurality of rollers, and a transferring unit for transferring the printed circuit board to the inspecting base.

The printed circuit board coating inspecting apparatus may further include a reading device for providing the type and position information of the printed circuit board to the control unit.

The control unit may previously store the image data of the printed circuit board that has been normally coated and compare the image data of the printed circuit board image data of the normally coated printed circuit board with the image data of the printed circuit board image taken by the camera unit Thus, it is possible to analyze whether or not the photographed printed circuit board is defective.

A method of inspecting a printed circuit board coating according to an embodiment of the present invention includes the steps of transferring a printed circuit board, placing the printed circuit board on a test stand, rotating in at least one axial direction of the X axis and the Y axis, A step of photographing the printed circuit board mounted on the inspection table by the camera unit, and a step of determining whether the printed circuit board is defective by analyzing the photographed image data .

According to the present invention, errors in the printed circuit board coating can be quickly and accurately grasped by automation and prompt inspection, and a highly reliable product can be produced.

Further, according to the present invention, accurate and clear image data can be obtained by moving the camera section after fixing and fixing the printed circuit board, and the inspection time can be shortened.

Further, according to the present invention, it is possible to inspect coating defects and contamination on the side of a component vertically coupled to a printed circuit board such as an automobile printed circuit board.

Further, according to the present invention, the inspection table can be rotated so that a plurality of the surfaces of the printed circuit board can be inspected by one inspection apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the drawings recited in the detailed description of the present invention, a brief description of each drawing is provided
1 shows a printed circuit board coating inspection apparatus according to an embodiment of the present invention.
2 shows a camera unit according to an embodiment of the present invention.
FIG. 3 illustrates a method of operating a camera unit according to an embodiment of the present invention.
4 illustrates a printed circuit board coating inspection method according to an embodiment of the present invention.

Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, embodiments of the present invention will be described below, but the technical idea of the present invention is not limited thereto, and various modifications may be made by those skilled in the art.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Throughout the specification, when an element is referred to as " comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

1 shows a printed circuit board coating inspection apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a printed circuit board coating inspection apparatus 1000 includes a transfer unit 100, a reading unit 200, a inspection unit 300, a moving unit 400, a camera unit 500, and a controller (not shown) .

The transfer unit 100 can transfer the coated printed circuit board P to the inspection stand 300. To this end, the transfer unit 100 may include a plurality of rollers 101.

The rollers 101 may be provided at regular intervals on the inner side of the frame constituting the transfer unit 100 and may be rotated around the rotation axis to move the printed circuit board P. [ The roller 101 directly contacts the lower surface of the printed circuit board P and conveys the printed circuit board P by rotation so that the frictional force with the printed circuit board P is increased and the scratches are not generated The surface of the roller 101 may be formed of rubber, synthetic resin, or the like. The conveyance unit 100 may be omitted from the printed circuit board coating inspection apparatus 1000 and the personnel may directly transfer the printed circuit board P to the inspection stand 300. [

The reading device 200 can be formed in one area of the printed circuit board coating inspection apparatus 1000 and can recognize information such as the type of the printed circuit board P to be transferred or the inspection position. The control unit may control the operation of at least one of the inspection unit 300, the moving unit 400, and the camera unit 500. In this case, Or the position can be controlled in advance. In one embodiment, in order to recognize information on the printed circuit board P, the reading device 200 may be implemented as a device capable of recognizing a two-dimensional bar code. To this end, the reading device 200 can recognize information on the printed circuit board P, including a camera, a scanner, and the like. In another embodiment, the RFID tag may be attached to the printed circuit board P, and the RFID reader may be included in the reading device 200 to recognize the information on the printed circuit board P. However, it is to be understood that a variety of printed circuit board recognition apparatuses and techniques may be used in accordance with the embodiments, as is known to those skilled in the art.

1, the reading apparatus 200 may be installed in one area of the transfer unit 100, that is, in one upper area of the frame constituting the transfer unit 100, 100 or a side frame of the transfer unit 100, the reading apparatus 200 may be formed at various positions. When the feeding unit 100 is omitted from the printed circuit board coating inspecting apparatus 1000, the reading apparatus 200 may be mounted on various regions of the printed circuit board coating apparatus 1000 such as the inspection unit 300 or the camera unit 500 .

The inspection table 300 seats the printed circuit board P in a suitable inspection position. In one embodiment, the inspection table 300 may further include a fixing unit (not shown), which automatically adjusts the length and width of the fixing unit according to the size of the printed circuit board P, Can be fixedly mounted on the test stand 300. Thereby, the printed circuit board P of various kinds and sizes can be inspected without changing the components of the inspection table 300. In one embodiment, the inspection table 300 may further include a configuration for sensing the flow and position of the printed circuit board P and a configuration for stopping the printed circuit board P. [ Accordingly, the inspection table 300 senses the flow of the printed circuit board P conveyed from the conveyance unit 100, and can transfer and seat the printed circuit board P to an appropriate inspection position.

In addition, the inspection table 300 can rotate at various angles with the horizontal plane. The surface of the various printed circuit boards P such as the side surface or the lower surface of the printed circuit board P can be photographed by rotating the inspection table 300 . For example, in the case where both sides of the printed circuit board P are inspected, one side of the printed circuit board P is photographed in the inspection table 300, and then the inspection table 300 is rotated 180 degrees so that the opposite side is continuously It is possible to conduct double-side inspection of the printed circuit board P by photographing.

The inspecting table 300 may be implemented as a flat surface as shown in the figure, but the inner surface of the inspecting table 300 may be inclined so that the lower surface of the printed circuit board P is spaced apart from the upper It is possible to prevent contact with the surface. Thereby, when the parts are mounted on the lower surface of the printed circuit board P, the risk of damage to the parts can be prevented. As shown in the drawing, the inspection table 300 may have only one printed circuit board P, or a space may be formed so that a plurality of the printed circuit boards P can be seated. That is, the accommodation space of the inspection table 300 is not limited to the number of the printed circuit boards P.

The movable member 400 can move the camera unit 500 in at least one axial direction of the X axis, the Y axis, and the Z axis. To this end, the shifting member may include a first horizontal member 401, a vertical member 402 and a second horizontal member 403. [ As shown in FIG. 1, the X and Y axes may be parallel to the inspection table 300 and may be orthogonal to each other, and the Z axis may be perpendicular to the inspection table 300.

The camera unit 500 can be moved to the intersection of the X axis center line and the Y axis center line of the printed circuit board P through the first horizontal member 401 and the second horizontal member 402 . Subsequently, by moving the camera unit 500 along the Z axis through the vertical member 402, the camera unit 500 can be positioned at the optimum focal length. Accordingly, the camera unit 500 can clearly capture the entire area of the printed circuit board P in one shot, thereby minimizing the inspection process and improving the inspection capability.

The camera unit 500 can be coupled to the moving member 400 and can photograph the printed circuit board P that is seated on the inspection table 300. The camera unit 500 may include an angle adjusting unit that rotates in at least one axial direction of the X axis and the Y axis to adjust an angle of view of the camera unit 500. As an example, the angle adjusting unit may include an X-axis tilting unit 501 and a Y-axis tilting unit 502 shown in FIG. Accordingly, the camera unit 500 can photograph the printing circuit device P at various angles, and accordingly, the sides of the parts coupled at a vertical angle with the printed circuit board P can also be photographed. In addition, according to the embodiment, the camera unit 500 may adjust the angle of the camera unit 500 according to the distance between the components coupled at a vertical angle with the printed circuit board P, the height of the components, have.

The camera unit 500 generates image data of the entire printed circuit board P through one shot or changes the coordinates of the photographing position through the moving member 400 to convert the image data of the plurality of printed circuit boards P Can be continuously generated. The image data photographed by the camera unit 500 can be transmitted to the control unit. The lens angle adjustment, continuous shooting, and moving shooting of the camera unit 500 will be described in detail below with reference to FIG. 2 and FIG. The camera unit 500 may be implemented as an imaging device having a variety of functions and imaging ranges, as known to those skilled in the art, such as a CCD (charged coupled device) camera, a CMOS (complementary metal oxide semiconductor) . In one embodiment, the camera unit 500 may further include a lighting unit (not shown) that emits light for precise photographing of the printed circuit board P. [ The light emitted from the illumination unit may include at least one of various lights such as a white light, a fluorescent light, an ultraviolet light, and an infrared light, and an appropriate light can be selected according to the characteristics of the coating material coated on the printed circuit board P.

The control unit (not shown) may analyze the coating data by analyzing the image data transmitted from the camera unit 500. The control unit can determine a region where a defect exists in the image data photographed by the camera unit 500 by using a predetermined image data processing algorithm. For example, the control unit may previously store the coated printed circuit board image data, and then compare the image data with the image data of the printed circuit board P photographed by the camera unit 500, It is possible to judge whether the defect is defective or not. In addition, the control unit can generate coordinates of the defective area based on the positional information of the printed circuit board P, provide the user with a defect position, and can control the shifting member 400 and the camera unit 500, It is possible to precisely take a re-image.

In addition, the control unit can control the entire components of the printed circuit board coating inspection apparatus 1000. The control unit can control the transfer unit 100 so that the printed circuit board P can be loaded at a predetermined time or interval. In addition, after the one-side image of the printed circuit board P is obtained by the camera unit 500, the inspection unit 300 may be rotated to obtain an image of the opposite side. That is, after one side of the printed circuit board P is photographed, the control unit can rotate the inspection table 300 by a predetermined angle. By rotating the inspection table 300 by 180 °, both sides of the printed circuit board P can be inspected, and the inspection table 300 can be rotated at various angles according to the embodiment.

In order to more clearly acquire the image data of the printed circuit board P, the control unit controls the camera unit 500 to move the camera unit 500 in a proper manner through the X- and Y- To the focal distance position. In addition, the control unit may divide the printed circuit board P into a plurality of regions in order to increase the sharpness of the image data to be acquired according to the degree of miniaturization or integration of the components, and the camera unit 500 may be sequentially So that the image data can be generated.

2 shows a camera unit according to an embodiment of the present invention.

Referring to FIG. 2, the camera unit 500 may include an X-axis tilting unit 501, a Y-axis tilting unit 502, and a camera lens unit 503. The X-axis tilting unit 501 is coupled to one end of the moving member 400 and can be rotated in the X-axis direction. The Y-axis tilting unit 502 is coupled to one end of the X- have. Also, as shown in FIG. 2, the camera lens unit 503 may be coupled to one end of the Y-axis tilting unit 502.

The camera unit 500 can adjust the shooting angle of the camera lens unit 503 variously by the X-axis tilting unit 501 and the Y-axis tilting unit 502. Accordingly, the camera unit 500 can photograph not only the various surfaces of the printed circuit board P, but also the parts joined at a predetermined vertical angle (e.g., 90 degrees) with the printed circuit board P. That is, the prior art in which only the plan view can be taken from the top of the printed circuit board P has a problem that it is difficult to detect when the side of the parts vertically coupled to the printed circuit board P is contaminated by the coating material , It is possible to inspect the contamination and coating defects of the side parts and the coupling parts of the parts vertically coupled to the printed circuit board P by adjusting the lens angle of the camera part 500, have. Furthermore, the movement of the camera unit 500 using the moving member 400 described in FIG. 3 can be added to more precisely inspect the printed circuit board P and vertically coupled parts.

For example, the camera unit 500 may measure the distance between the components coupled at a vertical angle with the printed circuit board P, the height of the components, and then tilt the X-axis tilting unit 501 and the Y- The photographing angle of the camera lens unit 503 can be adjusted by rotating the camera lens unit 503 in the X axis or the Y axis using the unit 502. This will be described in detail with reference to FIG.

The configuration of the X-axis tilting unit 501 and the Y-axis tilting unit 502 shown in FIG. 2 is an example, and the camera unit 500 according to an embodiment of the present invention may include a camera 500, The angle adjuster can be implemented with various configurations that allow the angle adjustment.

FIG. 3 illustrates a method of operating a camera unit according to an embodiment of the present invention.

Fig. 3 (a) shows a case where the distance between the components vertically coupled to the printed circuit board is relatively long, and Fig. 3 (b) A relatively short case is shown.

3 (a), the camera unit 500 is rotated by using the X-axis tilting unit 501 and the Y-axis tilting unit 502 so that the camera unit 500 is mounted on the printed circuit board P And a predetermined angle alpha. The side of the parts S vertically coupled to the printed circuit board P and the side parts of the parts S vertically coupled to the printed circuit board P It is possible to check the contamination of the joint portion and the coating failure.

3 (a), the camera unit 500 measures the distance d between the printed circuit board P and the components S coupled at a vertical angle, The photographing angle alpha of the camera lens unit 503 can be adjusted. In addition to the distance d between the components S, the camera unit 500 may be mounted on the camera lens 500 in consideration of the height of the components S, the distance between the camera unit 500 and the printed circuit board P, The photographing angle of the lens unit 503 can be adjusted.

3 (b), when the distance d 'between the components is relatively short compared to (a) of FIG. 3 (d> d`), the camera unit 500 is mounted on the camera lens unit 503, It is possible to adjust the photographing angle (? This adjustment of the photographing angle makes it possible to clearly photograph the side image data of the parts S even if the parts S vertically coupled to the printed circuit board P have various intervals or heights. The distance of the components S vertically coupled to the printed circuit board P may be determined by a method of measuring light by firing in the camera unit 500, a method of inputting the distance between components in advance through the control unit, And a method of applying a specific fluorescent material recognizable by the camera unit 500 to the coupling portion of the components P, P, and the like, can be measured by various distance measuring methods known to those skilled in the art.

3, the camera unit 500 can be moved in the X-axis direction while maintaining a certain distance from the printed circuit board P while maintaining a certain angle (?,?) With the horizontal plane. That is, the printed circuit board P fixedly mounted on the inspection table 300 can be continuously photographed while the camera unit 500 is moved. Thus, the focal distance of the camera lens unit 503 is kept constant, and it is possible to sequentially and clearly photograph whether the coating S of the parts S vertically coupled to the printed circuit board P is poor or not.

When photographing only the plan view of the conventional printed circuit board P, it is impossible to check whether or not the vertically coupled parts are contaminated. The present invention can adjust the photographing angle of the camera lens unit 503 through the X-axis tilting unit 501 and the Y-axis tilting unit 502 and can move the camera unit 500 using the moving member 400 Therefore, such a problem can be solved. Further, as the lens is adjusted at various angles, even when the height of the joined parts S is different, the angle can be adjusted to perform inspection.

In addition, the camera unit 500 can perform reciprocating movement. As shown in the drawing, the X-axis moves the component S, vertically coupled to the printed circuit board P, The other side of the parts S vertically coupled to the printed circuit board P can be inspected while returning to the starting point.

In addition, even in the case of photographing the printed circuit board P having a large size, the camera unit 500 can easily photograph the printed circuit board P through a plurality of reciprocating movements, and further installation of a camera or a scanner I do not need it. In one embodiment, the printed circuit board P can be divided into several regions and photographed. Particularly, when the printed circuit board P is large, after one printed circuit board P is divided into two regions (for example, region A and region B) and the region A is photographed, The camera section 500 can be moved to the area and then the area B can be photographed. Thus, the present invention can easily take a printed circuit board P of various sizes without changing the constituent devices.

Although only the X-axis movement of the camera unit 500 is shown in FIG. 3, according to the embodiment, the camera unit 500 can be moved in various directions such as the Y-axis direction, and the printed circuit board P can be photographed.

4 illustrates a printed circuit board coating inspection method according to an embodiment of the present invention.

Referring to FIG. 4, the printed circuit board coating inspection method 400 may include a step S410 of transferring a printed circuit board. The printed circuit board P may be directly transported by a person or may be transported using a separate device. The printed circuit board coating inspecting apparatus 1000 may further include a transferring unit 100. The transferring unit 100 transfers the printed circuit board P to the printed circuit board P, Can be placed on the roller (101), and the position of the printed circuit board (P) can be aligned. When the roller 101 rotates, the printed circuit board P positioned on the roller can be transferred to the inspection table 300.

In one embodiment, the method 400 for inspecting printed circuit board coating may further include recognizing the type and size of the printed circuit board P that has entered the transfer unit 100. To this end, the reading device 200 may further include a reading device 200. When the printed circuit board P is positioned in the recognition area of the reading device 200, the reading device 200 reads the type and size of the printed circuit board P Or the like, and transmit it to the control unit.

Next, the printed circuit board coating inspection method 400 may include placing a printed circuit board P on the inspection table 300 (S420). As an example, the inspection table 300 may further include a fixing portion to automatically adjust the width of the printed circuit board P in accordance with the size of the printed circuit board P, thereby fixing the printed circuit board P to the inspection table 300. Thus, it is possible to inspect the printed circuit board P of various types and sizes without changing a large configuration of the printed circuit board coating inspection apparatus 1000.

In one embodiment, the inspection table 300 is capable of rotating at various angles with the horizon. This makes it possible to mount a variety of printed circuit boards P such as a side surface or a lower surface of the printed circuit board P by photographing one surface of the printed circuit board P and then rotating the test stand 300 on which the printed circuit board P is fixedly mounted, The surface of the substrate P can be photographed.

Next, the printed circuit board coating inspection method 400 may include a step S430 of adjusting the photographing angle of the camera unit 500 by rotating in at least one axial direction of the X axis and the Y axis. That is, the shooting angle of the camera lens unit 503 can be adjusted using the X-axis tilting unit 501 and the Y-axis tilting unit 502 in step S430. In addition, according to the embodiment, the camera unit 500 may include a distance d between the components S coupled at a vertical angle with the printed circuit board P, a height of the components S, 500) and the printed circuit board (P), the angle of view of the camera lens unit (503) can be adjusted. This makes it possible to inspect coating defects and contamination on the side of the component combined with the printed circuit board (P). The distance and height measurement method between the parts and the angle adjustment of the lens are the same as those described in FIG. 2 and FIG.

Next, the printed circuit board coating inspection method 400 may include a step S440 in which the camera unit 500 photographs the printed circuit board P mounted on the inspection table 300. FIG. The camera unit 500 can be fixedly positioned at a predetermined position so that the entire printed circuit board P can be photographed at a time. 3, the camera unit 500 can move along the moving member 400 and continuously photograph the printed circuit board P, and the camera lens unit 503 ) Can be photographed with a different shooting angle of the printed circuit board P. In this way, it is possible to acquire image data of a clear printed circuit board (P) and to inspect even side coating errors of parts (S) vertically coupled to the printed circuit board (P). In one embodiment, the camera section 500 can photograph an area of the printed circuit board P divided by the control section using an established algorithm.

Next, the printed circuit board coating inspection method 400 may include a step S450 of analyzing the image of the photographed printed circuit board P (S450). That is, the controller may analyze the photographed image data to determine whether the coating of the printed circuit board P is defective. In one embodiment, the control unit determines a defective area of the printed circuit board P using a predetermined image processing algorithm, generates coordinates of the defective area based on the position information of the printed circuit board P, .

The above inspection method may be performed at the end of one unit process, or the inspection may be performed while the printed circuit board P is completed to the coating. For example, inspection can be performed after photoresist coating, exposure, and development, and inspection can be performed after a TAB (tape automated bonding) process and a PCB (printed circuit board) process in a module process. Further, after the backlight assembly, the inspection may be performed after a certain time of aging. However, this is an exemplary embodiment, and a printed circuit board inspection method coated on various steps according to an embodiment can be used.

As described above, an optimal embodiment has been disclosed in the drawings and specification. Although specific terms have been employed herein, they are used for purposes of illustration only and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1000: Printed Circuit Board Coating Inspection Device
100: Feeder 101: Roller
200: Reading device 300:
400: moving member 401: first horizontal member
402: vertical member 403: second horizontal member
500: camera unit 501: X-axis tilting unit
502: Y-axis tilting portion

Claims (9)

A printed circuit board (PCB) coating inspection apparatus,
A test board on which the printed circuit board is placed;
A camera unit coupled to the movable member for photographing the printed circuit board mounted on the inspection table and measuring a distance between the components coupled at a vertical angle with the printed circuit board;
A moving member for moving the camera unit in at least one axial direction of an X-axis, a Y-axis, and a Z-axis to photograph the printed circuit board; And
And a control unit for processing and analyzing the image data photographed by the camera unit and inspecting coating errors on the sides of the components coupled at a vertical angle with the printed circuit board,
The camera unit includes:
And an angle adjusting unit that rotates in at least one axial direction of the X axis and the Y axis to adjust a photographing angle of the camera lens unit, wherein a distance between the parts coupled at a vertical angle with the printed circuit board, Wherein the angle of the camera lens unit is adjusted according to the height of the vertically coupled parts, thereby inspecting the side of the coupled parts at a vertical angle with the printed circuit board. [2] The apparatus of claim 1,
An X-axis tilting unit coupled to one end of the moving member and rotated in the X-axis direction; And
And a Y-axis tilting unit coupled to one end of the X-axis tilting unit and rotated in the Y-axis direction,
The camera lens unit includes:
Axis tilting unit is coupled to one end of the Y-axis tilting unit. delete The method according to claim 1,
Wherein the inspection table further comprises a fixing part that fixes the printed circuit board and adjusts the length according to the size of the printed circuit board. 5. The method of claim 4,
Wherein the inspection table rotates to move a plurality of surfaces of the printed circuit board to the camera unit. The apparatus of claim 1, wherein the printed circuit board coating inspection apparatus comprises:
Further comprising a plurality of rollers, and a transfer unit for transferring the printed circuit board to the inspection table. The apparatus of claim 1, wherein the printed circuit board coating inspection apparatus comprises:
Further comprising a reading device that provides the type and position information of the printed circuit board to the control unit. The method according to claim 1,
The control unit may previously store image data of the coated printed circuit board, compare the image data of the printed circuit board image captured by the camera unit with the image data of the image data of the normally coated printed circuit board, A printed circuit board coating inspecting apparatus for analyzing whether or not a printed circuit board is defective. A method of inspecting a printed circuit board coating,
Transferring the printed circuit board;
Placing the printed circuit board on a test stand;
Rotating in at least one axial direction of the X axis and the Y axis to adjust a photographing angle of the camera unit;
Photographing a printed circuit board mounted on the inspection table with the camera unit; And
And analyzing the photographed image data to determine whether the coating of the printed circuit board is defective or not, and determining a coating error of the sides of the combined components that are perpendicular to the printed circuit board,
The camera unit includes:
Measuring a distance between the components coupled at a vertical angle with the printed circuit board, measuring a distance between the components coupled at a vertical angle with the printed circuit board, and a height of the coupled components forming a vertical angle with the printed circuit board Wherein the angle of the camera lens unit is adjusted to inspect the side of the coupled components at a vertical angle with the printed circuit board.

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