KR101746062B1 - Preparation method thereof and a conductive adhesive tape by using a conductive ball cushion - Google Patents

Abstract

The present invention relates to a conductive adhesive tape using a conductive cushion ball and a method for producing the conductive adhesive tape, and more particularly, to a conductive adhesive tape having conductive cushion balls coated with a conductive metal on the outer surface thereof and a pressure- It is an object of the present invention to improve the protrusion phenomenon through the deformation and restoration characteristics of the tapes by themselves, so that the tacky material easily adheres to the surface to be adhered flatly. In the present invention constituted for this purpose, 0.2 to 30 parts by weight of a conductive cushion ball in which a conductive metal layer is plated on the outer circumferential surface of a cushion ball of a flexible polymer material in which a gas layer is formed inside of a 100% And then coating the mixed conductive pressure-sensitive adhesive on one side or both sides of the film to a predetermined thickness.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a conductive adhesive tape using a conductive cushion ball and a method of manufacturing the conductive adhesive tape,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive tape using a conductive cushion ball, and more particularly, to a conductive adhesive tape using conductive cushion balls, The present invention relates to a conductive adhesive tape using a conductive cushion ball and a method of manufacturing the same.

Generally, in an electronic packaging such as an LCD, a PDP, and an organic EL, there is an increasing need to connect a large number of electrodes at a time, with a narrow gap in accordance with an increase in connection density and an ultrafine gap in a circuit.

Particularly, in the above-described electronic packaging, in liquid crystal display (LCD) packaging, a conductive adhesive is used for mechanical and electrical connection with a flexible printed circuit (FPC) and a glass display have.

On the other hand, the conductive pressure-sensitive adhesive is largely in the form of isotropic conductive adhesive and anisotropic conductive film (ACF), and basically, a form in which monodisperse conductive fine particles are dispersed in thermosetting or thermoplastic insulating resin I have.

When the thickness of the pressure-sensitive adhesive to be formed becomes thicker than 0.02 mm, the content of the metal powder contained in the pressure-sensitive adhesive must be proportionally increased so that the electric flowability becomes good, If it exceeds 0.04 mm, it is difficult to increase the content, and the size of the metal powder must be increased.

As described above, when the size of the metal powder is increased, a phenomenon of protruding on the surface of the pressure-sensitive adhesive occurs, which appears as a protrusion on the outer surface of the tape and causes appearance problems. Also, Resulting in problems in adhesion performance and electrical characteristics of the product.

Korean Patent Publication No. 10-2000-0060106 (published October 16, 2000)

Disclosure of the Invention The present invention has been conceived to solve all of the problems of the prior art. The present invention provides a conductive adhesive tape And the object of the present invention is to provide a conductive adhesive tape using a conductive cushioning ball and a method of manufacturing the same by which a sticking phenomenon is improved through deformation and restoration characteristics of the conductive adhesive cushion ball, .

Another object of the present invention is to provide a conductive adhesive tape by applying a pressure sensitive adhesive comprising a conductive cushion ball coated on its outer surface with a conductive adhesive cushion ball and a viscous resin at a predetermined ratio to one side or both sides of the release paper, So that the protrusion phenomenon is improved through the deformation and restoration characteristics of the electrode.

The present invention configured to achieve the above object is as follows. That is, in the conductive adhesive tape using the conductive cushion ball according to the present invention, a conductive metal layer is plated on the outer circumferential surface of a cushion ball of a flexible polymer material in which a gas layer is formed inside 100 parts by weight of the adhesive resin, And 10 to 50 parts by weight of a conductive cushion ball are mixed and coated on one side or both sides of the film to a predetermined thickness.

In the structure according to the present invention as described above, the conductive metal layer is made of any one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) .

In the structure according to the present invention, the conductive metal layer may be plated on the outer circumferential surface of the cushion ball through electroless plating.

Meanwhile, in the constitution according to the present invention, the adhesive resin may be composed of a single material selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber, or a mixture of two or more thereof.

In addition, in the constitution according to the present invention, a releasable paper may be further adhered to the surface of the conductive pressure-sensitive adhesive of the conductive pressure-sensitive adhesive tape.

Another feature of the present invention is to provide a method of manufacturing a conductive adhesive tape using a conductive cushion ball, which comprises the steps of (a) forming a gas layer on the inside of a 100 parts by weight adhesive resin, 0.2 to 30 parts by weight of a conductive cushion ball plated with a conductive metal layer on the outer circumferential surface of the cushion ball to form an electrically conductive pressure sensitive adhesive; And (b) a step of applying a conductive pressure-sensitive adhesive prepared in the step (a) to a surface of the film or both surfaces thereof to a predetermined thickness to produce a conductive tape.

In the step (a) of the present invention as described above, the conductive metal layer may be formed of a material selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) And the like.

In the step (a) of the constitution according to the present invention, the conductive metal layer may be plated on the outer circumferential surface of the cushion ball through electroless plating.

Meanwhile, in the step (a) of the composition according to the present invention, the adhesive resin may be a single substance selected from the group consisting of acryl, silicone, urethane, epoxy, PE, natural or synthetic rubber, or a mixture of two or more thereof.

In addition, a process of attaching a release paper to the surface of the conductive pressure-sensitive adhesive of the conductive pressure-sensitive adhesive tape manufactured in the step (b) of the constitution according to the present invention may be added.

According to the technique of the present invention, a conductive adhesive tape coated with a conductive metal on the outer surface thereof and a pressure-sensitive adhesive which is prepared by mixing and blending a pressure-sensitive adhesive resin at a predetermined ratio is applied to one or both sides of a release paper to produce a conductive adhesive tape, The projecting phenomenon is improved and the adhesive material can be easily adhered to the surface to be adhered in a flat plane.

In addition, according to the present invention, a conductive adhesive tape coated with a conductive metal on an outer surface thereof and a pressure-sensitive adhesive obtained by blending and mixing a pressure-sensitive adhesive resin at a predetermined ratio are applied to one side or both sides of a release paper to produce a conductive pressure- It is possible to improve the protrusion phenomenon through the restoration property and to maintain the electrical property retention.

1 is a cross-sectional view showing a conductive cushion ball according to the present invention.
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a conductive cushion ball.
3 is a cross-sectional view showing an electric flow of the conductive cushion ball in the constitution of the electroconductive electrodeposit according to the present invention.
4 is an enlarged view showing an electrically conductive pressure sensitive adhesive containing a conductive cushion ball according to the present invention enlarged through an electron microscope.
FIG. 5A is a photograph showing an enlarged view of a conductive pressure-sensitive adhesive in which a conventional metal powder is mixed and formed. FIG.
5B is an enlarged photograph of the conductive pressure-sensitive adhesive in which the conductive cushion balls according to the present invention are mixed and formed.
6 is a photograph showing the surface of a conductive tape using a conventional metal powder and a conductive tape using the conductive cushion ball according to the present invention.

Hereinafter, preferred embodiments of a conductive adhesive tape using the conductive cushion ball according to the present invention and a method of manufacturing the same will be described in detail with reference to the drawings.

FIG. 1 is a cross-sectional view showing a conductive cushion ball according to the present invention. FIG. 2 is a sectional view showing a conductive tape using the conductive cushion ball according to the present invention. FIG. 4 is an enlarged view of an electrically conductive pressure sensitive adhesive containing a conductive cushion ball according to the present invention, which is enlarged through an electron microscope. FIG. 5A is an enlarged view of the conductive pressure sensitive adhesive containing the conductive cushion ball according to the present invention, FIG. 5 is a photograph showing an enlarged view of the conductive adhesive layer in which the conductive cushion balls according to the present invention are mixed, FIG. 6 is a photograph showing the conductive adhesive tape using the conventional metal powder and the conductive cushion balls according to the present invention, And the surface of the conductive tape used was compared.

1 to 4, a conductive adhesive tape 100 using a conductive cushion ball according to the present invention includes a conductive adhesive 130 and a conductive cushion ball 200 on a surface or both surfaces of a film 110, And the conductive adhesive 120 is applied to a predetermined thickness.

The conductive adhesive tape 100 according to the present invention as described above can be manufactured by forming the conductive adhesive 120 by mixing the conductive adhesive balls 200 with the adhesive resin 130 at a predetermined ratio to form the conductive adhesive 120 To a conductive adhesive tape (100) for shielding an EMI by applying the conductive adhesive agent (120) on the film paper (110) with a predetermined thickness on one or both sides of the film paper (110).

As described above, the conductive adhesive 120 constituting the conductive adhesive tape 100 having a structure in which the conductive adhesive agent 120 is applied to one side or both sides of the film 110 with a predetermined thickness has the adhesive resin 130 And 0.2 to 30 parts by weight of the conductive cushion balls 200 are mixed and compounded with respect to the weight parts.

The conductive cushion ball 200 in the configuration of the conductive pressure-sensitive adhesive 120 as described above is formed of a ball-shaped cushion ball 210 made of a polymer material containing a gas so as to have an elastic force to be restored to an external pressure And a metal layer 220 is coated on the outer surface of the cushion ball 210 so as to maintain conductivity.

The shell of the cushion ball 210 made of a polymer as described above may be formed to have a diameter of 0.01 to 1.00 mm as a whole considering the thickness of the conductive final product. At this time, the contained gas has an elastic force that is restored to the external pressure so that the spherical shape of the conductive cushion ball 210 is maintained, thereby allowing the conductive cushion ball 200 to maintain the property of preventing the impact continuously.

Here, a substance other than a gas may be contained, but in order to exhibit a cushioning performance in a thin film product, a gas having a high recovery rate is used. This is also excellent in light weight of the product.

In the examples of the technology according to the present invention, all gases may be used, but a risk of explosion due to outflow may occur. As shown in FIG. 1, nitrogen (N ₂ ) gas preferable in terms of stability is used Respectively.

In other words, the above-described conductive cushion ball 200 is formed in the form of a cushion ball 210 made of a polymer material having a gas layer (or a nitrogen gas layer) inside and having elasticity on the outside, And the metal layer 220 is coated with the metal layer 220. The metal layer 220 may be formed of a metal material having good electrical conductivity such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) The thickness of the insulating layer 220 should be maintained at least 2 nm in consideration of electric current flowability.

Meanwhile, as described above, the conductive adhesive tape 100 using the conductive cushion balls according to the present invention as described above is manufactured by mixing the conductive cushion balls 200 with the adhesive resin 130 at a predetermined ratio to prepare tapes Method. The manufacturing of the conductive tape 100 for EMI shielding by mixing the conductive cushion balls 200 with the adhesive resin 130 imparts the following characteristics by a method not heretofore attempted.

First, the conductive cushion ball 200 is applied in a size of 0.01 to 1.00 mm, and the polymeric cushion ball 210 having a specific gravity of 0.5 or less and the metal layer 220 plated on the outer surface of the cushion ball 210 are electroless Plating is performed by plating. The electroless plating material may be an electrically conductive material such as gold, silver, nickel, copper, aluminum, and tungsten. In order to maintain the characteristics of the cushion ball 210, The electroless plating is performed.

The conductive cushion ball 200 as described above has a characteristic that the inside is formed of a gas layer in order to have a characteristic of being crushed and crushed when a load is applied and being restored when a load is removed. At this time, nitrogen (N ₂ ) gas may be used in terms of stability.

In other words, the conductive cushion ball 200 described above is made of a polymer material containing gas inside so as to have an elastic force to be restored to an external pressure. At this time, the contained gas may be various gases including nitrogen (N ₂ ), and may be formed to have a diameter of 0.01 to 1.00 mm as a whole considering the thickness of the final product. For reference, a method of manufacturing the conductive cushion ball 200 at this time is as follows.

First, the production of the cushion ball 210 made of a polymer leaves the polymer into which the gas flows so that the outer surface of the polymer material reaches the glass transition temperature (Tg) and is retreated at a constant temperature (high temperature). As a result, the envelope of the polymer material expands. The polymeric material shell is then allowed to cool below a critical point at which the shell of the polymeric material can hold, thereby allowing the polymeric material shell to cure. As a result, the shell layer becomes thinner and the volume of the contained gas layer becomes large.

On the other hand, the cushion ball 210 made of a polymer material as described above uses a material having a melting point of 90 ° C or higher. In the present invention, the metal layer is coated on the outer surface of the cushion ball 210 made of a polymer material which is expanded by heat so as to maintain conductivity.

The conductive cushion ball 200 is formed by coating the metal layer 220 on the outer surface of the cushion ball 210 provided to maintain conductivity. At this time, a metal layer is plated on the outer surface of the cushion ball 210 using electroless plating. That is, a catalyst is immersed on the outer surface of the cushion ball 210 and a metal such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) Alternatively, the metal layer 220 is coated by electroless plating with different layers.

As described above, the metal layer 220 uses a metal material having good electrical conductivity such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum , And the thickness of the metal layer 220 should be maintained at 2 nm or more in consideration of electric current flowability. At this time, the conductive cushion ball 200 coated with the metal layer 220 may have a single or multiple sizes as shown in FIGS. 3 and 4.

On the other hand, the conductive adhesive 120 is manufactured by mixing and mixing the conductive cushion balls 200 manufactured as described above with the adhesive resin 120 at a predetermined ratio. The mixing ratio of the adhesive resin 130 and the conductive cushion ball 200 constituting the conductive adhesive 120 may be in the range of 0.2 to 30 parts by weight of the conductive cushion ball 200 per 100 parts by weight of the adhesive resin 130, . At this time, the content of the adhesive resin 130 may be adjusted according to the degree of adhesion between the conductive cushion balls 200 and the size of the conductive cushion balls 200.

2, the conductive adhesive 120 is applied and fixed to one side or both sides of the film 110 to a predetermined thickness. Thus, the adhesive portion 120 of the conductive adhesive tape 100 to be manufactured according to the present invention, .

In addition, as described above, the conductive adhesive tape 100 may be rolled up into rolls so that the adhesive portion is located on the inner side of the film 110 with the conductive adhesive 120 applied to one side or both sides thereof to a predetermined thickness , The releasing paper 150 may be adhered to the surface of the conductive adhesive 120 of the conductive adhesive tape 100 as shown in FIG. The releasing paper 150 is separated from the surface of the conductive adhesive 120 when the conductive adhesive tape 100 is adhered to the place of use.

As shown in FIGS. 5A and 6A, when the thickness of the conductive pressure-sensitive adhesive formed for attachment of the conductive gradual tape is thickened beyond 0.02 mm, the content of the metal powder contained in the pressure-sensitive adhesive increases proportionally The electric current flowability is improved. If the particle size exceeds 0.04 mm, it is difficult to increase the content and the size of the metal powder must be increased.

However, when the size of the metal powder is increased, a phenomenon of protruding on the surface of the pressure-sensitive adhesive occurs, which appears as a protrusion on the outer surface of the tape and causes appearance problems. Also, Causing problems in adhesion performance and electrical characteristics of the product.

On the other hand, when the pressure-sensitive adhesive resin 130 in which the conductive cushion balls 200 are mixed is applied as shown in FIGS. 4B and 5B of the technique according to the present invention, the conductive cushion balls 200 200) is pressed and the entire surface is in contact with the surface to be adhered, so that the adhesion area is increased by 50% or more as compared with the case where the metal powder is supplied. As a result, the adhesive strength and the electrical characteristics are improved, and the appearance defect due to the projections is solved.

As the thickness of the conductive cushion ball 200 is increased, the weight of the conductive cushion ball 200 is very low as compared with the conventional method using a thick metal conductive material, and the total weight can be drastically reduced. That is, since the specific gravity of the conductive cushion ball 200 is less than 2.0, while the specific gravity of the conventional metal powder is 2.7 to 9.8, the total weight can be drastically reduced.

On the other hand, when the conductive material having the same size is manufactured and compared with the thickness of the pressure-sensitive adhesive (120) of 0.04 mm or more in manufacturing, the metallic powder according to the prior art has a problem in that the appearance of the metal powder The weight of the adhesive resin 130 rapidly increases, and a shape that is precipitated upon mixing with the adhesive resin 130 is generated, making it difficult to manufacture and commercialize the resin.

In addition, when a material plated with a non-metallic inorganic material according to the prior art is utilized, it is possible to improve the size and weight of the particles. However, since there is no external protrusion phenomenon and decompression, there is a floating area around the powder, There is a problem that the characteristics are reduced.

On the other hand, when the conductive cushion ball 200 according to the present invention is applied, it is possible to select a particle size according to the thickness of the coating, It has an advantage of being able to maintain the adhesive force and maintain the electrical characteristics since the adhesive material is easily adhered to the flat surface easily on the surface to be adhered.

As described above, there has been a limit in the thickness of the conductive pressure-sensitive adhesive in the production of the conductive pressure-sensitive adhesive tape in the meantime, and there have been technical limitations such as partial application in consideration of the appearance problem. However, according to the application of the present invention, Has been resolved.

The present invention is not limited to the above-described embodiments, and various modifications may be made within the scope of the technical idea of the present invention.

100. Conductive adhesive tape
110. Films
120. Conductive Adhesive
130. Adhesive resin
150. Release paper
200. Conductive cushion ball
210. Cushion ball
220. Metal layer

Claims (10)

0.2 to 30 parts by weight of a conductive cushion ball having a conductive metal layer plated on the outer circumferential surface of a cushion ball made of a flexible polymer material containing nitrogen (N ₂ ) gas therein and restoring to an external stimulus relative to 100 parts by weight of the adhesive resin A conductive adhesive is prepared by applying a conductive adhesive on one side or both sides of a film to a predetermined thickness,
Wherein the conductive metal layer is plated on the outer circumferential surface of the cushion ball through electroless plating,
Wherein the conductive cushion ball is formed to have a diameter of 0.01 to 1.00 mm. The method according to claim 1, wherein the conductive metal layer is any one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) Conductive adhesive tape using a conductive cushion ball. delete The conductive adhesive tape according to claim 1, wherein the adhesive resin is a single substance selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber, or a mixture of two or more thereof. The conductive adhesive tape according to claim 1, wherein a releasing paper is further attached to the surface of the conductive adhesive of the conductive adhesive tape. (a) expanding a sheath of a polymer material containing nitrogen (N ₂ ) inside and expanding by heat to have a diameter of 0.01 to 1.00 mm while maintaining a glass transition temperature (Tg) of the sheath;
(b) cooling and curing the expanded envelope;
(c) depositing a catalyst on the surface of the cured sheath;
(d) coating the surface of the shell on which the catalyst is deposited with at least one metal by electroless plating to produce a conductive cushion ball;
(e) mixing 10 to 30 parts by weight of the conductive cushion balls with 100 parts by weight of the adhesive resin to form a conductive pressure-sensitive adhesive; And
and (f) applying the conductive pressure-sensitive adhesive prepared in the step (e) to one side or both sides of the film to a predetermined thickness to produce a conductive tape. ≪ / RTI > The method of claim 6, wherein the metal is selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum Wherein the conductive adhesive tape is a conductive adhesive tape. delete The conductive cushion ball according to claim 6, wherein the adhesive resin in step (e) is a single substance selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber, A method for producing a conductive adhesive tape. 7. The method of manufacturing a conductive adhesive tape according to claim 6, wherein a step of further adhering a release paper to the surface of the conductive adhesive of the conductive adhesive tape produced in the step (f) is added.

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