KR101743542B1 - 힌지 모듈을 사용하여 리드를 제어하기 위한 장치 - Google Patents
힌지 모듈을 사용하여 리드를 제어하기 위한 장치 Download PDFInfo
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- KR101743542B1 KR101743542B1 KR1020160038721A KR20160038721A KR101743542B1 KR 101743542 B1 KR101743542 B1 KR 101743542B1 KR 1020160038721 A KR1020160038721 A KR 1020160038721A KR 20160038721 A KR20160038721 A KR 20160038721A KR 101743542 B1 KR101743542 B1 KR 101743542B1
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- 230000001174 ascending effect Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 31
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- 230000007246 mechanism Effects 0.000 abstract description 2
- WABPQHHGFIMREM-NOHWODKXSA-N lead-200 Chemical compound [200Pb] WABPQHHGFIMREM-NOHWODKXSA-N 0.000 description 35
- 230000008569 process Effects 0.000 description 22
- 230000008878 coupling Effects 0.000 description 13
- 238000010168 coupling process Methods 0.000 description 13
- 238000005859 coupling reaction Methods 0.000 description 13
- 230000001939 inductive effect Effects 0.000 description 11
- 235000014676 Phragmites communis Nutrition 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- WABPQHHGFIMREM-AKLPVKDBSA-N lead-210 Chemical compound [210Pb] WABPQHHGFIMREM-AKLPVKDBSA-N 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D90/00—Component parts, details or accessories for large containers
- B65D90/008—Doors for containers, e.g. ISO-containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D90/00—Component parts, details or accessories for large containers
- B65D90/54—Gates or closures
- B65D90/62—Gates or closures having closure members movable out of the plane of the opening
- B65D90/623—Gates or closures having closure members movable out of the plane of the opening having a rotational motion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Closures For Containers (AREA)
Abstract
Description
도 2는 도 1에 도시된 장치의 리드 개폐 모듈의 구성을 보인 사시도.
도 3은 도 2에 도시된 리드 개폐 모듈의 동작에 따라 리드가 개방되어 가는 과정을 보인 사시도.
도 4는 도 2에 도시된 리드 개폐 모듈의 동작에 따라 리드가 직각의 회전각을 갖도록 개방된 상태를 나타낸 사시도.
도 5는 본 발명의 다른 실시예에 따른 힌지 모듈 및 리드 개폐 모듈을 포함하는 장치의 외관을 보인 사시도.
도 6은 도 5에 도시된 장치의 힌지 모듈의 구성을 보인 사시도.
도 7은 도 5에 도시된 장치의 트리거링 부재의 동작에 따라 힌지 모듈이 소정 방향으로 이동되어 가는 과정을 보인 사시도.
도 8는 도 7에 도시된 힌지 모듈의 이동에 따라, 직각의 회전각을 갖는 리드가 둔각 이상의 회전각을 갖도록 개방되어 가는 과정을 보인 측면도.
100: 챔버
200: 리드
210: 회전부재 220: 리드결합부재
300: 리드 개폐 모듈
310: 제1 플레이트 320: 가이드부재
330: 이동부재 340: 연동부재
341: 제1 동작유도부 342: 제2 동작유도부
343: 결합부재
400: 힌지 모듈
410: 제1 브라켓 411: 제1 핀홀
420: 제2 브라켓 421: 제2 핀홀
430: 핀
500: 트리거링 부재
Claims (8)
- 내부에 공간이 형성된 챔버, 상기 챔버의 상면을 일부 덮고 있는 상판, 및 상기 상판 이외의 부위에 형성되어 있는 개구부를 개폐할 수 있는 리드를 구비하는 장치에 있어서,
상기 챔버의 측부 또는 상기 리드의 측부에 위치하는 제1 플레이트;
상기 제1 플레이트에 위치하여 경로를 제공하는 가이드부재;
상기 가이드부재의 경로를 따라 이동이 가능한 이동부재; 및
상승, 하강 동작이 가능하며, 상기 상승, 하강 동작을 통해 상기 이동부재의 상기 가이드부재의 경로를 따른 이동을 유도하고, 상기 상승, 하강 동작을 회전운동으로 전환하여 상기 리드를 개폐하도록 하는 연동부재; 를 포함하되,
상기 리드와 상기 상판은 힌지 모듈을 통해 회전 결합하며,
상기 힌지 모듈은 상기 상판 상에서 이동이 가능하게 결합되는 것을 특징으로 하는 장치. - 제1항에 있어서,
상기 힌지 모듈의 이동 방향은,
상기 이동부재가 상기 리드를 열기 위해 이동하는 방향을 제1 방향이라고 가정할 때, 상기 제1 방향의 반대 방향인 것을 특징으로 하는 장치. - 제1항에 있어서,
상기 힌지 모듈을 이동하도록 하는 트리거링 부재가 구비되는 것을 특징으로 하는 장치. - 제3항에 있어서,
상기 트리거링 부재는,
상기 리드가 직각의 회전각을 갖도록 개방되었을 때,
상기 힌지 모듈에 소정의 힘을 가해 상기 힌지 모듈을 이동하도록 하여, 상기 직각의 회전각을 갖도록 개방된 리드가 둔각의 회전각을 갖도록 하는 것을 특징으로 하는 장치. - 제3항에 있어서,
상기 트리거링 부재는,
상기 힌지 모듈의 회전축을 가상으로 연장한 직선을 가정할 때,
상기 연동부재가 상기 가이드부재를 따라 슬라이딩 되다가 상기 직선상에 위치하면, 상기 힌지 모듈에 소정의 힘을 가해 상기 힌지 모듈을 이동하도록 하여, 직각의 회전각을 갖도록 개방된 리드가 둔각의 회전각을 갖도록 하는 것을 특징으로 하는 장치. - 제3항에 있어서,
상기 트리거링 부재가 상기 힌지 모듈을 이동하도록 할 때,
상기 이동부재가 고정되도록 제어하는 것을 특징으로 하는 장치. - 제1항에 있어서,
상기 힌지 모듈은,
일측이 리드와 결합하고 타측에 제1 핀홀이 형성된 제1 브라켓; 및 일측이 상기 상판에서 이동 가능하게 결합되고 타측에 제2 핀홀이 형성된 제2 브라켓; 을 포함하며,
상기 제1 브라켓 및 상기 제2 브라켓은,
상기 제1 핀홀 및 상기 제2 핀홀에 삽입되는 핀; 을 통해 회전 결합되는 것을 특징으로 하는 장치. - 제7항에 있어서,
상기 핀은,
상기 제1 핀홀 또는 상기 제2 핀홀에 삽입되었을 때, 유동이 가능한 것을 특징으로 하는 장치.
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KR1020160038721A KR101743542B1 (ko) | 2016-03-30 | 2016-03-30 | 힌지 모듈을 사용하여 리드를 제어하기 위한 장치 |
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KR1020160038721A KR101743542B1 (ko) | 2016-03-30 | 2016-03-30 | 힌지 모듈을 사용하여 리드를 제어하기 위한 장치 |
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KR101743542B1 true KR101743542B1 (ko) | 2017-06-05 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102015485B1 (ko) * | 2019-02-18 | 2019-08-28 | 주식회사 윈텍 | 오엘이디 제조 챔버 장비용 오토 리드 장치 |
CN117052901A (zh) * | 2023-09-11 | 2023-11-14 | 江苏开源环保技术工程有限公司 | 一种向上翻转式快开门压力容器 |
-
2016
- 2016-03-30 KR KR1020160038721A patent/KR101743542B1/ko active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102015485B1 (ko) * | 2019-02-18 | 2019-08-28 | 주식회사 윈텍 | 오엘이디 제조 챔버 장비용 오토 리드 장치 |
CN117052901A (zh) * | 2023-09-11 | 2023-11-14 | 江苏开源环保技术工程有限公司 | 一种向上翻转式快开门压力容器 |
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