KR101730498B1 - Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same - Google Patents

Abstract

In order to provide an organic layer deposition apparatus and a manufacturing method of an organic light emitting display apparatus using the organic layer deposition apparatus, which are more suitable for a mass production process of a large substrate and enable patterning of fixed patterns, the present invention provides an organic layer deposition apparatus for forming an organic layer on a substrate An electrostatic chuck coupled to the substrate to fix the substrate, the seating surface of the substrate having a predetermined curvature; An evaporation source for emitting an evaporation material to the substrate side; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And a plurality of patterning slits arranged in a second direction perpendicular to the first direction, the plurality of patterning slits being formed to face the evaporation source nozzle portion, and the second direction being perpendicular to the first direction and the second direction And the patterning slit sheet is formed to be spaced apart from the substrate by a predetermined distance, the patterning slit sheet is formed so as to be spaced apart from the substrate by a predetermined distance, Wherein the deposition is performed while moving the deposition source, the deposition source nozzle unit, and the patterning slit sheet along the first direction.

Description

[0001] The present invention relates to an organic layer deposition apparatus and an organic light emitting display apparatus using the same,

The present invention relates to an organic layer deposition apparatus and a method of manufacturing an organic light emitting display apparatus using the same, and more particularly, to an organic layer deposition apparatus that is more suitable for a mass production process of a large substrate, And a manufacturing method of a display device.

Of the display devices, the organic light emitting display device has a wide viewing angle, excellent contrast, and fast response speed, and is receiving attention as a next generation display device.

The organic light emitting display device includes a light emitting layer and an intermediate layer including the light emitting layer between the first electrode and the second electrode facing each other. At this time, the electrodes and the intermediate layer can be formed by various methods, one of which is the independent deposition method. In order to manufacture an organic light emitting display device using a deposition method, a fine metal mask (FMM) having the same pattern as that of an organic layer to be formed is closely contacted to a substrate surface on which an organic layer or the like is to be formed, A material is deposited to form an organic layer of a predetermined pattern.

However, the method using such a fine metal mask has a limitation that it is unsuitable for the large-scale use using a mother glass of 5G or more. That is, when a large area mask is used, the mask is warped due to its own weight, and distortion of the pattern due to this warping may occur. This is in line with the current tendency to require a fixed tax on the pattern.

The present invention has been made to solve the above problems and it is an object of the present invention to provide an organic layer deposition apparatus and a manufacturing method of an organic light emitting display device using the organic layer deposition apparatus, The purpose is to provide.

The present invention relates to an organic layer deposition apparatus for forming an organic layer on a substrate, the apparatus comprising: an electrostatic chuck in which the substrate is fixed in combination with the substrate and the seating surface of the substrate is formed to have a predetermined curvature; An evaporation source for emitting an evaporation material to the substrate side; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And a plurality of patterning slits arranged in a second direction perpendicular to the first direction, the plurality of patterning slits being formed to face the evaporation source nozzle portion, and the second direction being perpendicular to the first direction and the second direction And the patterning slit sheet is formed to be spaced apart from the substrate by a predetermined distance, the patterning slit sheet is formed so as to be spaced apart from the substrate by a predetermined distance, Wherein the deposition is performed while moving the deposition source, the deposition source nozzle unit, and the patterning slit sheet along the first direction.

In the present invention, the substrate may be bent so as to have substantially the same curvature as the seating surface of the electrostatic chuck in a state where the substrate is engaged with the electrostatic chuck.

In the present invention, the patterning slit sheet may be curved so as to have a curvature substantially equal to that of the seating surface of the electrostatic chuck.

In the present invention, the patterning slit sheet may be formed in a polygonal shape corresponding to the seating surface of the electrostatic chuck, spaced apart from the substrate by a predetermined distance.

In the present invention, the deposition may be performed while moving the electrostatic chuck having the substrate fixed thereon along the first direction with respect to the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet.

In the present invention, the substrate can be tightly coupled to the seating surface by the electromagnetic force provided by the electrostatic chuck.

In the present invention, the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet may be integrally formed by a coupling member.

Here, the connection member may guide the movement path of the evaporation material.

Here, the connection member may be formed to seal the space between the evaporation source and the evaporation source nozzle unit and the patterning slit sheet from the outside.

In the present invention, the evaporation material may be continuously deposited on the substrate while the substrate moves along the first direction with respect to the organic layer deposition apparatus.

In the present invention, the patterning slit sheet of the organic layer deposition apparatus may be formed smaller than the substrate.

Here, the width of the patterning slit sheet in the second direction may be formed to be substantially equal to the width of the substrate in the second direction.

In the present invention, the plurality of evaporation source nozzles may be formed to tilt a predetermined angle.

Here, the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction, and the evaporation source nozzles of the two rows may be tilted in directions opposite to each other .

Here, the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction, and the evaporation source nozzles disposed on the first one of the evaporation source nozzles of the two rows Are arranged to face the second side edge of the patterning slit sheet and the evaporation source nozzles disposed on the second side of the two rows of evaporation source nozzles are arranged to face the first side edge of the patterning slit sheet .

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device using an organic layer deposition apparatus for forming an organic layer on a substrate, the method comprising: bending the substrate so that the substrate has a predetermined curvature; The substrate being spaced apart from the organic layer deposition apparatus by a predetermined distance; And depositing a deposition material to be emitted from the organic layer deposition apparatus on the substrate while moving one side of the organic layer deposition apparatus and the substrate relative to the other side. to provide.

According to the present invention, the step of bending the substrate so that the substrate has a predetermined curvature includes: disposing the substrate on an electrostatic chuck having a seating surface having a predetermined curvature; And applying a voltage to the electrostatic chuck to bring the substrate into close contact with the seating surface.

In the present invention, the organic layer deposition apparatus may include a patterning slit sheet including a plurality of patterning slits and curved to have substantially the same curvature as the seating surface of the electrostatic chuck, and the patterning slit sheet may be formed by evaporation The deposited material can be patterned.

In the present invention, the organic layer deposition apparatus may include a patterning slit sheet including a plurality of patterning slits and formed in a polygonal shape corresponding to the seating surface of the electrostatic chuck, wherein the patterning slit sheet is formed by depositing The material can be patterned.

According to another aspect of the present invention, there is provided a deposition apparatus including: an evaporation source that emits a deposition material; an evaporation source nozzle unit disposed on one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; A plurality of patterning slits disposed opposite to each other along a second direction orthogonal to the first direction and a plurality of patterning slits formed on the plane forming the second direction and a third direction perpendicular to the first direction and the second direction The organic layer deposition apparatus including a patterning slit sheet formed so that a cross section thereof is bent to a certain degree is disposed so as to be spaced apart from a substrate fixed to an electrostatic chuck formed so that a seating surface of the substrate has a predetermined curvature, Wherein the organic layer deposition apparatus and the substrate fixed to the chuck are moved relative to each other to deposit on the substrate. A method of manufacturing a display device is provided.

According to the organic layer deposition apparatus of the present invention and the method of manufacturing the organic light-emitting display apparatus using the same, the organic layer deposition apparatus is more suitable for the mass production process of a large substrate and enables patterning of fixed patterns. A manufacturing method of a display device can be implemented.

1 is a system configuration diagram schematically showing an organic layer deposition apparatus according to an embodiment of the present invention.
2 is a schematic view showing an example of the electrostatic chuck of FIG.
3 is a perspective view schematically showing an organic layer deposition assembly of the organic layer deposition apparatus of FIG.
Figure 4 is a schematic side cross-sectional view of the organic layer deposition assembly of Figure 4;
Figure 5 is a schematic top cross-sectional view of the organic layer deposition assembly of Figure 4;
6 is a view showing an organic layer formed on a substrate when the patterning slit sheet and the substrate are formed flat as in the conventional art.
FIG. 7 is a view showing the patterning slit sheet and the substrate of FIG. 3 in more detail.
8 is a view showing another embodiment of the patterning slit sheet of Fig.
9 is a view showing an organic layer deposition assembly according to another embodiment of the present invention.
FIG. 10 is a view schematically showing a distribution pattern of a deposition layer deposited on a substrate when the evaporation source nozzle is not tilted in the organic layer deposition assembly of FIG. 9. FIG.
FIG. 11 is a view schematically showing a distribution pattern of a deposition film deposited on a substrate when an evaporation source nozzle is tilted in the organic layer deposition assembly of FIG. 9. FIG.
12 is a cross-sectional view of an active matrix organic light emitting display device manufactured using the organic layer deposition apparatus of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

1 is a system configuration diagram schematically showing an organic layer deposition apparatus according to an embodiment of the present invention.

1, an organic layer deposition apparatus according to an embodiment of the present invention includes a loading unit 710, a deposition unit 730, an unloading unit 720, a first circulation unit 610, and a second circulation unit 620).

The loading section 710 may include a first rack 712, an introduction robot 714, an introduction chamber 716, and a first reversing chamber 718.

A plurality of substrates 500 before deposition is deposited on the first rack 712 and the introduction robot 714 holds the substrate 500 from the first rack 712 and the substrate 500 is transferred from the second circulation unit 620 The substrate 500 is placed on the transferred electrostatic chuck 600 and then the electrostatic chuck 600 to which the substrate 500 is attached is transferred to the introduction chamber 716.

A first inverting chamber 718 is provided adjacent to the introduction chamber 716 and a first inverting robot 719 located in the first inverting chamber 718 inverts the electrostatic chuck 600 to form the electrostatic chuck 600, To the first circulation unit 610 of the evaporation unit 730.

As shown in FIG. 2, the electrostatic chuck 600 has an electrode 602 to which power is applied, and a high voltage is applied to the electrode 602, Thereby attaching the substrate 500 to the surface of the main body 601.

1, the introduction robot 714 places the substrate 500 on the upper surface of the electrostatic chuck 600. In this state, the electrostatic chuck 600 is transferred to the introduction chamber 716, The substrate 500 is positioned downward in the deposition unit 730 as the substrate 719 reverses the electrostatic chuck 600. [

The configuration of the unloading unit 720 is configured in reverse to the configuration of the loading unit 710 described above. That is, the substrate 500 and the electrostatic chuck 600 which have passed through the deposition unit 730 are reversed by the second reverse robot 729 in the second reverse chamber 728 and transferred to the discharge chamber 726, The substrate 500 and the electrostatic chuck 600 are taken out from the discharge chamber 726 and then the substrate 500 is separated from the electrostatic chuck 600 and loaded on the second rack 722. The electrostatic chuck 600 separated from the substrate 500 is returned to the loading unit 710 through the second circulation unit 620.

The substrate 500 is fixed to the lower surface of the electrostatic chuck 600 from the time when the substrate 500 is initially fixed to the electrostatic chuck 600, . In this case, for example, the first inverting chamber 718 and the first inverting robot 719, the second inverting chamber 728, and the second inverting robot 729 are not required.

The deposition unit 730 has at least one vapor deposition chamber. 1, the deposition unit 730 includes a chamber 731 in which a plurality of organic layer deposition assemblies 100, 200, and 300 (hereinafter, referred to as " 400 are disposed. 1, a first organic layer deposition assembly 100, a second organic layer deposition assembly 200, a third organic layer deposition assembly 300, and a fourth organic layer deposition chamber 100 are formed in the chamber 731. In this embodiment, Four organic layer deposition assemblies of deposition assembly 400 are installed, but the number is variable depending on the deposition material and deposition conditions. The chamber 731 is kept in vacuum during deposition.

1, the electrostatic chuck 600 to which the substrate 500 is fixed is connected to the deposition unit 730 by the first circulation unit 610, The electrostatic chuck 600 separated from the substrate 500 by the unloading unit 720 is sequentially moved to the loading unit 710, the deposition unit 730 and the unloading unit 720. The second circulation unit 620 To the loading unit 710 by the user.

The first circulation unit 610 passes through the chamber 731 when passing through the deposition unit 730 and the second circulation unit 620 is provided to transfer the electrostatic chuck.

Next, an organic layer deposition assembly 100 of an organic layer deposition apparatus according to an embodiment of the present invention will be described. FIG. 3 is a perspective view schematically illustrating an organic layer deposition assembly of the organic layer deposition apparatus of FIG. 1, FIG. 4 is a schematic side view of the organic layer deposition assembly of FIG. 3, and FIG. 5 is a schematic plan view of the organic layer deposition assembly of FIG. 3 .

3, 4 and 5, an organic layer deposition assembly 100 according to one embodiment of the present invention includes an evaporation source 110, an evaporation source nozzle unit 120, and a patterning slit sheet 150 .

3, 4 and 5 do not show chambers for convenience of explanation, it is preferable that all the configurations of Figs. 3 to 5 are disposed in a chamber (see 731 in Fig. 1) in which a proper degree of vacuum is maintained . This is to ensure the straightness of the deposition material.

In this chamber (see 731 in FIG. 1), a substrate 500 as a deposition target is disposed. The substrate 500 may be a substrate for a flat panel display, and a large-sized substrate such as a mother glass capable of forming a plurality of flat panel displays may be used.

The substrate 500 is tightly coupled to the seating surface 605 of the electrostatic chuck 600 having a predetermined curvature and the substrate 500 coupled to the electrostatic chuck 600 is coupled to the first circulation unit 610, As shown in FIG. The combination of the electrostatic chuck 600 and the substrate 500 will be described later in detail.

Here, in one embodiment of the present invention, the deposition proceeds as the substrate 500 relatively moves with respect to the organic layer deposition assembly 100.

Specifically, in the conventional FMM deposition method, the FMM size must be formed equal to the substrate size. Therefore, as the substrate size increases, the FMM must be made larger, which makes it difficult to fabricate the FMM, and it is not easy to align the FMM with a precise pattern by pulling the FMM.

In order to solve such a problem, the organic layer deposition assembly 100 according to an embodiment of the present invention is characterized in that the organic layer deposition assembly 100 and the substrate 500 are deposited while moving relative to each other. In other words, the substrate 500 arranged to face the organic layer deposition assembly 100 performs the deposition continuously while moving along the Y-axis direction. That is, the substrate 500 is moved in the direction of arrow A in FIG. 3, and the deposition is performed by a scanning method. Although the substrate 500 is illustrated as being deposited in the chamber (not shown) while moving in the Y-axis direction, the present invention is not limited thereto. The substrate 500 may be fixed, It is also possible that the assembly 100 itself performs the deposition while moving in the Y-axis direction.

Accordingly, the organic layer deposition assembly 100 of the present invention can make the patterning slit sheet 150 much smaller than the conventional FMM. That is, in the case of the organic layer deposition assembly 100 of the present invention, since the substrate 500 performs the deposition in a scanning manner while moving along the Y-axis direction, the X of the patterning slit sheet 150 The lengths in the axial direction and the Y-axis direction can be formed to be much smaller than the length of the substrate 500. [ As described above, since the patterning slit sheet 150 can be made much smaller than the conventional FMM, the patterning slit sheet 150 of the present invention can be easily manufactured. That is, the patterning slit sheet 150 of a small size is advantageous compared to the FMM deposition method in all the processes such as the etching operation of the patterning slit sheet 150, the subsequent precision tensioning and welding operation, the movement and the cleaning operation. Further, this becomes more advantageous as the display device becomes larger.

In order to deposit the organic layer deposition assembly 100 and the substrate 500 relative to each other, the organic layer deposition assembly 100 and the substrate 500 are preferably spaced apart from each other. This will be described later in detail.

On the other hand, on the side facing the substrate 500 in the chamber, an evaporation source 110 in which the evaporation material 115 is stored and heated is disposed. As the evaporation material 115 stored in the evaporation source 110 is evaporated, deposition is performed on the substrate 500.

In detail, the evaporation source 110 includes a crucible 111 in which an evaporation material 115 is filled, a evaporation material 115 filled in the crucible 111 by heating the crucible 111, And a heater 112 for evaporating the evaporation source toward the evaporation source nozzle unit 120 side.

The evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110, specifically, on the evaporation source 110 side toward the substrate 500. A plurality of evaporation source nozzles 121 are formed in the evaporation source nozzle portion 120 along the Y axis direction, that is, the scanning direction of the substrate 500. Here, the plurality of evaporation source nozzles 121 may be equally spaced. The evaporated material 115 vaporized in the evaporation source 110 passes through the evaporation source nozzle unit 120 and is directed toward the substrate 500 as a deposition target. When a plurality of evaporation source nozzles 121 are formed on the evaporation source nozzle unit 120 in the Y axis direction, that is, along the scanning direction of the substrate 500, the patterning slits 150 of the patterning slit sheet 150 151 are influenced only by the size of one evaporation source nozzle 121 (that is, since there is only one evaporation source nozzle 121 in the X-axis direction), the size of the pattern formed by the evaporation material passing through the evaporation source nozzles 121 , And no shadow occurs. In addition, since a plurality of evaporation source nozzles 121 exist in the scanning direction, even if a flux difference between the individual evaporation source nozzles occurs, the difference is canceled, and the uniformity of deposition is maintained constant.

A patterning slit sheet 150 and a frame 155 are further provided between the evaporation source 110 and the substrate 500. The frame 155 is formed substantially in the shape of a window frame, and a patterning slit sheet 150 is coupled to the inside of the frame 155. A plurality of patterning slits 151 are formed in the patterning slit sheet 150 along the X-axis direction. The evaporated material 115 vaporized in the evaporation source 110 passes through the evaporation source nozzle unit 120 and the patterning slit sheet 150 and is directed toward the substrate 500 as a deposition target. At this time, the patterning slit sheet 150 can be manufactured through etching, which is the same method as that of a conventional fine metal mask (FMM), particularly, a stripe type mask. At this time, the total number of the patterning slits 151 may be larger than the total number of the evaporation source nozzles 121.

Here, the organic layer deposition assembly according to an embodiment of the present invention is characterized in that the patterning slit sheet and the substrate are formed to have a certain degree of curvature, which will be described in detail later.

The deposition source 110 and the patterning slit sheet 150 may be spaced apart from each other by a certain distance. The deposition source 110 (and the associated deposition source nozzle 120) The deposition source nozzle portion 120) and the patterning slit sheet 150 may be connected to each other by the connection member 135. [ That is, the evaporation source 110, the evaporation source nozzle unit 120, and the patterning slit sheet 150 may be connected by the connection member 135 to be integrally formed with each other. Here, the connection members 135 may guide the movement path of the evaporation material so that the evaporation material discharged through the evaporation source nozzle 121 is not dispersed. Although the connecting member 135 is formed only in the lateral direction of the evaporation source 110, the evaporation source nozzle unit 120 and the patterning slit sheet 150 to guide only the X axis direction of the evaporation material, For convenience of illustration, the spirit of the present invention is not limited to this, and the connecting member 135 may be formed in a box-shaped hermetically closed shape so as to simultaneously guide the movement of the evaporation material in the X axis direction and the Y axis direction.

As described above, the organic layer deposition assembly 100 according to one embodiment of the present invention performs deposition while moving relative to the substrate 500, so that the organic layer deposition assembly 100 can be moved relative to the substrate 500 In order to move relatively, the patterning slit sheet 150 is formed to be spaced apart from the substrate 500 by a certain distance.

In detail, in the conventional FMM deposition method, a mask is closely adhered to a substrate to prevent a shadow from being formed on the substrate, and a deposition process is performed. However, when the mask is brought into close contact with the substrate in this manner, there is a problem that a problem of defective due to contact between the substrate and the mask occurs. Further, since the mask can not be moved relative to the substrate, the mask must be formed to have the same size as the substrate. Therefore, as the size of the display device is increased, the size of the mask must be increased. Thus, there is a problem that it is not easy to form such a large mask.

In order to solve such a problem, in the organic layer deposition assembly 100 according to an embodiment of the present invention, the patterning slit sheet 150 is disposed to be spaced apart from the substrate 500, which is a deposition target, by a predetermined distance.

According to the present invention, after the mask is formed smaller than the substrate, the deposition can be performed while moving the mask relative to the substrate, so that it is possible to obtain an effect of facilitating the production of the mask. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the substrate and the mask to adhere to each other in the process becomes unnecessary, an effect of improving the manufacturing speed can be obtained.

Here, the organic layer deposition assembly according to an embodiment of the present invention is characterized in that the patterning slit sheet and the substrate are formed to have a certain degree of curvature.

In detail, when the patterning slit sheet and the substrate are formed flat as in the prior art, there is a problem that the patterns deposited on the substrate are shifted in the X-axis direction to a certain extent toward both ends of the patterning slit sheet, as shown in FIG. 6 Respectively.

That is, the incident angle of the deposition material passing through the patterning slit disposed directly below the evaporation source nozzle is almost perpendicular to the substrate. Thus, the organic layer formed by the deposition material that has passed through the patterning slit is formed at a predetermined position. However, the critical incidence angle of the evaporation material passing through the patterning slit disposed away from the evaporation source nozzle becomes larger, so that the critical incidence angle of the evaporation material passing through the endmost patterning slit becomes about 55 [deg.]. Accordingly, the deposition material is inclined with respect to the patterning slit, and the organic layer formed by the deposition material passing through the patterning slit is formed at a portion shifted from the patterning slit by a certain degree in the X-axis direction.

Since the critical angle of incidence of the evaporation material increases as the distance from the central portion of the patterning slit increases, the distance from the central portion of the patterning slit to the patterning slit becomes larger as the critical incidence angle of the deposition material increases. The greater the amount of pattern shift. (That is, a relationship of? _B <? _C <? _D <? _E , PS ₁ <PS ₂ <PS ₃ <PS ₄ is satisfied).

In order to solve such problems, an organic layer deposition assembly 100 according to an embodiment of the present invention includes a substrate 500 that is bent so as to have a predetermined curvature, a patterning slit sheet 150 is formed on one side of the substrate 500, And are spaced apart from each other by a certain distance from each other to prevent a pattern shift phenomenon and shadow formation.

7 is a more detailed view of the patterning slit sheet 150 and the substrate 500 of FIG.

Referring to Figs. 3 and 7, the seating surface (see 605 in Fig. 3) of the electrostatic chuck (see 600 in Fig. 3) is bent to have a predetermined curvature. And the substrate 500 is seated on the seating surface (see 605 in Fig. 3). In general, the substrate 500 is formed of a transparent material, such as glass or plastic, so that it can be elastically deformed to some extent when a predetermined pressure is applied. Therefore, when a high voltage is applied to the electrode of the electrostatic chuck (see 600 in Fig. 3) in a state where the substrate 500 is disposed on the seating surface (see 605 in Fig. 3) of the electrostatic chuck (See 605 in FIG. 3), the substrate 500 is bent to a certain degree and tightly coupled.

Meanwhile, the patterning slit sheet 150 spaced apart from the substrate 500 by a predetermined distance may be formed to have substantially the same curvature as the seating surface (see 605 in FIG. 3) and the substrate 500. 7) of the electrostatic chuck (see 600 in FIG. 3), the substrate 500 and the patterning slit sheet 150 are curved so as to have a predetermined curvature, as shown in FIG. 7, The distance from the evaporation source 110 to each of the patterning slits 151 and the incident angle of the evaporation material incident on each of the patterning slits 151 becomes substantially the same for each of the patterning slits 151. Therefore, the shapes of the respective organic layers 510 formed on the substrate 500 and the distances between the respective organic layers 510 are formed to be substantially equal to each other, thereby preventing generation of shadows and shift of patterns Can be obtained.

The degree of bending of the substrate 500 and the patterning slit sheet 150 in the electrostatic chuck (see reference numeral 605 in Fig. 3) of the electrostatic chuck (see reference numeral 600 in Fig. 3) . At this time, the difference D between the highest point and the lowest point of the substrate 500 in the Z-axis direction may be approximately 1 mm or more. As described above, since the substrate is formed of a glass material or a plastic material, the substrate can be elastically deformed to a certain extent. When D is about 1 mm or less, the substrate is included in the elastic deformation range of the substrate. When the substrate is separated from the electrostatic chuck, It can be returned.

8 is a view showing another embodiment of the patterning slit sheet of Fig. Referring to FIG. 8, the patterning slit sheet 150 'according to another embodiment of the present invention is formed in a polygonal shape that is bent a plurality of times. In detail, in the case of the patterning slit sheet 150 'formed by stretching the metal sheet to a certain degree, it is practically not easy to form a smooth curved surface as shown in FIG. Therefore, by forming the patterning slit sheet 150 'so as to have a polygonal shape instead of having a predetermined curvature, the effect of facilitating the production of the patterning slit sheet 150' can be obtained.

9 is a view showing an organic layer deposition assembly according to another embodiment of the present invention. Referring to the drawings, an organic layer deposition assembly 100 'according to another embodiment of the present invention includes an evaporation source 110, an evaporation source nozzle unit 120, and a patterning slit sheet 150. The evaporation source 110 includes a crucible 111 filled with an evaporation material 115 and a deposition material 115 filled in the crucible 111 by heating the crucible 111 to the evaporation source nozzle portion And a heater 112 for evaporating the refrigerant to the evaporator 120 side. An evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110 and a plurality of evaporation source nozzles 121 are formed on the evaporation source nozzle unit 120 along the Y axis direction. A patterning slit sheet 150 and a frame 155 are further provided between the evaporation source 110 and the substrate 500. A plurality of patterning slits 151 are formed on the patterning slit sheet 150 along the X- . The deposition source 110, the evaporation source nozzle unit 120, and the patterning slit sheet 150 are coupled by a connecting member 135. At this time, the patterning slit sheet and the substrate are formed to have a certain degree of curvature.

The present embodiment is different from the above-described embodiment in that a plurality of evaporation source nozzles 121 formed in the evaporation source nozzle unit 120 are arranged in a predetermined angle tilt. In detail, the evaporation source nozzle 121 may be composed of two rows of evaporation source nozzles 121a and 121b, and the two rows of evaporation source nozzles 121a and 121b are alternately arranged. At this time, the evaporation source nozzles 121a and 121b may be tilted so as to be inclined at a predetermined angle on the XZ plane.

That is, in this embodiment, the evaporation source nozzles 121a and 121b are arranged in a predetermined angle tilt. The evaporation source nozzles 121a of the first row are tilted so as to face the evaporation source nozzles 121b of the second row and the evaporation source nozzles 121b of the second row are tilted so as to face the evaporation source nozzles 121a of the first row, . In other words, the evaporation source nozzles 121a disposed in the left column are disposed to face the right end of the patterning slit sheet 150, and the evaporation source nozzles 121b disposed in the right column are disposed to face the left end of the patterning slit sheet 150 It can be arranged to look at.

FIG. 10 is a schematic view showing a distribution pattern of a deposition layer deposited on a substrate when the deposition source nozzle is not tilted in the organic layer deposition assembly according to the present invention. FIG. 11 is a cross- FIG. 3 is a view schematically showing a distribution pattern of a deposited film deposited on a substrate when tilted. FIG. Comparing FIGS. 10 and 11, it can be seen that when the evaporation source nozzle is tilted, the thickness of the evaporation film formed on both ends of the substrate is relatively increased, and the uniformity of the evaporation film is increased.

According to this structure, the difference in the film thickness between the center and the end of the substrate is reduced, and the deposition amount can be controlled so that the thickness of the entire deposition material can be controlled uniformly. In addition, .

12 is a cross-sectional view of an active matrix organic light emitting display device manufactured using the organic layer deposition apparatus of the present invention.

Referring to FIG. 12, the active matrix type organic light emitting diode display is formed on a substrate 30. The substrate 30 may be formed of a transparent material, for example, a glass material, a plastic material, or a metal material. An insulating film 31 such as a buffer layer is formed on the substrate 30 as a whole.

A TFT 40, a capacitor 50 and an organic light emitting diode 60 as shown in FIG. 13 are formed on the insulating film 31.

On the upper surface of the insulating film 31, a semiconductor active layer 41 arranged in a predetermined pattern is formed. The semiconductor active layer 41 is buried in the gate insulating film 32. The active layer 41 may be formed of a p-type or n-type semiconductor.

A gate electrode 42 of the TFT 40 is formed on the upper surface of the gate insulating film 32 to correspond to the active layer 41. An interlayer insulating film 33 is formed so as to cover the gate electrode 42. After the interlayer insulating film 33 is formed, a contact hole is formed by etching the gate insulating film 32 and the interlayer insulating film 33 by an etching process such as dry etching so that a part of the active layer 41 is exposed.

Next, a source / drain electrode 43 is formed on the interlayer insulating film 33 and is formed to contact the active layer 41 exposed through the contact hole. A protective layer 34 is formed to cover the source / drain electrode 43 and a portion of the drain electrode 43 is exposed through an etching process. A separate insulating layer may be further formed on the passivation layer 34 to planarize the passivation layer 34.

The organic light emitting diode 60 may emit red, green, or blue light according to the current flow to display predetermined image information. The organic light emitting diode 60 may include a first electrode 61 formed on the protection layer 34 do. The first electrode 61 is electrically connected to the drain electrode 43 of the TFT 40.

A pixel defining layer 35 is formed to cover the first electrode 61. A predetermined opening 64 is formed in the pixel defining layer 35 and an organic layer 63 including a light emitting layer is formed in a region defined by the opening 64. [ A second electrode 62 is formed on the organic layer 63.

The pixel defining layer 35 divides each pixel and is formed of an organic material to flatten the surface of the substrate on which the first electrode 61 is formed, particularly, the surface of the protective layer 34.

The first electrode 61 and the second electrode 62 are insulated from each other and a voltage of different polarity is applied to the organic layer 63 including the light emitting layer to emit light.

When a low-molecular organic material is used, a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), a light emitting layer An electron transport layer (ETL), and an electron injection layer (EIL) may be stacked in a single or a composite structure. The usable organic material may include copper phthalocyanine (CuPc) phthalocyanine, N, N'-di (naphthalen-1-yl) -N, N'-diphenyl-benzidine ), Tris-8-hydroxyquinoline aluminum (Alq3), and the like.

After the organic light emitting layer is formed, the second electrode 62 may be formed by the same deposition process.

The first electrode 61 and the second electrode 62 may function as an anode and a cathode, respectively. Of course, the first electrode 61 and the second electrode 62 ) May be reversed. The first electrode 61 may be patterned to correspond to a region of each pixel, and the second electrode 62 may be formed to cover all the pixels.

The first electrode 61 may be a transparent electrode or a reflective electrode. When the first electrode 61 is used as a transparent electrode, the first electrode 61 may be formed of ITO, IZO, ZnO, or In 2 O 3. A transparent electrode layer may be formed of ITO, IZO, ZnO, or In 2 O 3 on the reflective layer formed of Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, The first electrode 61 is formed by a sputtering method or the like, and then patterned by a photolithography method or the like.

The second electrode 62 may be a transparent electrode or a reflective electrode. When the second electrode 62 is used as a transparent electrode, the second electrode 62 is used as a cathode electrode. Therefore, Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg and their compounds are oriented in the direction of the organic layer 63 including the light emitting layer, and then ITO, IZO, ZnO, or In2O3 An auxiliary electrode layer or a bus electrode line can be formed. Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and a compound thereof are deposited on the entire surface when the electrode is used as a reflective electrode. At this time, vapor deposition can be performed in the same manner as in the case of the organic layer 63 including the above-described light emitting layer.

The present invention can be used for deposition of an organic film or an inorganic film of an organic TFT or the like and can be applied to other various film forming processes.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: organic layer deposition assembly 110: evaporation source
120: evaporation source nozzle unit 150: patterning slit sheet
500: substrate 600: electrostatic chuck

Claims (20)

An organic layer deposition apparatus for forming an organic layer on a substrate,
An electrostatic chuck that is coupled with the substrate to fix the substrate, and the seating surface of the substrate is formed to have a predetermined curvature;
An evaporation source for emitting an evaporation material to the substrate side;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; And
A plurality of patterning slits are formed along a second direction perpendicular to the first direction, and a plurality of patterning slits are formed in the second direction perpendicular to the first direction and the second direction, And a patterning slit sheet formed so that a cross section on a plane formed by the three directions is bent to a certain extent,
The deposition source, the evaporation source nozzle unit, and the patterning slit sheet are spaced apart from the substrate by a predetermined distance, and the substrate moves along the first direction with respect to the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet, And the organic layer deposition apparatus. The method according to claim 1,
Wherein the substrate is bent to have substantially the same curvature as the seating surface of the electrostatic chuck in a state where the substrate is coupled to the electrostatic chuck. The method according to claim 1,
Wherein the patterning slit sheet is formed to be spaced apart from the substrate by a predetermined distance and curved so as to have substantially the same curvature as the seating surface of the electrostatic chuck. The method according to claim 1,
Wherein the patterning slit sheet is spaced apart from the substrate by a predetermined distance and is formed in a polygonal shape corresponding to a seating surface of the electrostatic chuck. The method according to claim 1,
Wherein the deposition is performed while the electrostatic chuck having the substrate fixed moves along the first direction with respect to the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet. The method according to claim 1,
Wherein the substrate is brought into tight contact with the seating surface by an electromagnetic force provided by the electrostatic chuck.
Organic layer deposition apparatus. The method according to claim 1,
Wherein the evaporation source, the evaporation source nozzle unit, and the patterning slit sheet are integrally formed by a coupling member. 8. The method of claim 7,
Wherein the connection member guides the movement path of the deposition material. 8. The method of claim 7,
Wherein the connection member is formed to seal the space between the evaporation source and the evaporation source nozzle portion and the patterning slit sheet from the outside. The method according to claim 1,
Wherein the deposition material is continuously deposited on the substrate while the substrate moves along the first direction with respect to the organic layer deposition apparatus. The method according to claim 1,
Wherein the patterning slit sheet of the organic layer deposition apparatus is formed to be smaller than the substrate. 12. The method of claim 11,
Wherein a width of the patterning slit sheet in the second direction is substantially equal to a width of the substrate in the second direction. The method according to claim 1,
Wherein the plurality of evaporation source nozzles are formed to be tilted by a predetermined angle. 14. The method of claim 13,
Wherein the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction and the evaporation source nozzles of the two rows are tilted in directions opposite to each other. Organic layer deposition apparatus. 14. The method of claim 13,
Wherein the plurality of evaporation source nozzles include two rows of evaporation source nozzles formed along the first direction,
The evaporation source nozzles disposed on the first one of the two rows of the evaporation source rows are arranged to face the second side edge of the patterning slit sheet,
Wherein the evaporation source nozzles disposed on the second side of the two rows of the evaporation source rows are arranged to face the first side end of the patterning slit sheet. A method of manufacturing an organic light emitting display device using an organic layer deposition apparatus for forming an organic layer on a substrate,
Bending the substrate such that the substrate has a predetermined curvature;
The substrate being spaced apart from the organic layer deposition apparatus by a predetermined distance; And
And depositing a deposition material to be emitted from the organic layer deposition apparatus on the substrate while moving either one of the organic layer deposition apparatus and the substrate relative to the other side,
Wherein the step of bending the substrate such that the substrate has a predetermined curvature comprises:
Disposing the substrate on an electrostatic chuck having a seating surface having a predetermined curvature; And
And applying a voltage to the electrostatic chuck to closely contact the substrate with the seating surface,
Wherein the substrate is bent so as to have substantially the same curvature as the seating surface of the electrostatic chuck in a state where the substrate is coupled to the electrostatic chuck. delete 17. The method of claim 16,
Wherein the organic layer deposition apparatus includes a patterning slit sheet including a plurality of patterning slits and curved so as to have substantially the same curvature as the seating surface of the electrostatic chuck,
Wherein the deposition material deposited on the substrate is patterned by the patterning slit sheet. 17. The method of claim 16,
Wherein the organic layer deposition apparatus includes a patterning slit sheet including a plurality of patterning slits and formed in a polygonal shape corresponding to a seating surface of the electrostatic chuck,
Wherein the deposition material deposited on the substrate is patterned by the patterning slit sheet. An evaporation source nozzle unit disposed on one side of the evaporation source and having a plurality of evaporation source nozzles formed along a first direction; and an evaporation source nozzle unit disposed opposite to the evaporation source nozzle unit, A plurality of patterning slits are formed along a second direction perpendicular to the first direction and a third direction orthogonal to the first direction and the second direction is formed An organic layer deposition apparatus including a patterning slit sheet,
The substrate is placed so as to be spaced apart from a substrate fixed to an electrostatic chuck formed so as to have a predetermined curvature,
Wherein the organic layer deposition apparatus and the substrate fixed to the electrostatic chuck are moved relative to each other during deposition to deposit the substrate.

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