KR101707372B1 - Reverse offset printing composition and printing method using the same - Google Patents

Abstract

The present invention relates to a reverse offset printing composition using a silicone-based blanket, comprising: 1) a binder resin; 2) a low boiling point solvent having a boiling point of less than 100 캜; And 3) a reverse offset printing composition using a silicone-based blanket containing a diol-based high boiling point solvent having a boiling point of 180 ° C or higher and a printing method thereof.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reverse offset printing composition and a printing method using the reverse offset printing composition.

The present invention relates to a printing composition and a printing method using the same. More specifically, the present invention relates to a reverse offset printing composition capable of forming a fine pattern and improving the uniformity of a coating film and a margin of a printing process, and a printing method using the reverse offset printing composition. More particularly, the present disclosure relates to a reverse offset printing composition using a silicone-based blanket, in particular a resist composition and a printing method using the same.

Recently, as the performance of electronic devices such as a touch screen, a display, and a semiconductor has diversified and advanced, it has become necessary to form a pattern using materials having various functions, and there is an increasing need to form line width and line spacing of the pattern finer .

For example, a conductive pattern for forming an electrode in various electronic devices, a black matrix of a color filter, or a resist pattern for forming a conductive pattern are widely used, and they are formed more finely as the size and performance of the electronic device are improved There is a need.

The method for forming the conventional pattern varies depending on the application, but typical examples thereof include photolithography, screen printing, inkjet and the like.

The photolithography method is a method in which a photosensitive layer is formed of a photosensitive material, selectively exposed and developed, and patterned to form a pattern.

However, the photolithography method leads to an increase in the process cost due to the cost of the photosensitive material and the developing solution which are not included in the final product but are developed and lost, and the disposal cost of the photosensitive material and the developing solution. There is also a problem of environmental pollution due to disposal of the above materials. In addition, the method requires a large number of steps and is complicated, resulting in a long time and cost.

The screen printing method is performed by screen printing using ink based on conductive particles of a size of several hundred nanometers to several tens of micrometers and then firing.

The screen printing method has a limitation in realizing a fine pattern of several tens of micrometers.

Korean Patent Laid-Open Publication No. 2015-0105254

The present invention relates to a reverse offset printing composition capable of realizing a fine pattern through a reverse offset printing process using a silicon-based blanket and capable of improving a printing waiting time and a coating thickness margin in order to solve the problems of the above- And provides a printing method.

The present invention relates to a reverse offset printing composition using a silicone-based blanket, comprising: 1) a binder resin; 2) a low boiling point solvent having a boiling point of less than 100 캜; And 3) a silicone-based blanket comprising a diol-based high boiling point solvent having a boiling point of 180 ° C or higher.

In addition, the reverse offset printing composition further comprises a medium boiling point solvent having a boiling point of at least 100 캜 and less than 180 캜.

Further, the present specification provides a printing method using a reverse offset printing composition using the silicon-based blanket. Specifically, the printing method comprises: coating the printing composition on a silicon-based blanket; Removing a part of the coating film by contacting the printing composition coating film coated on the silicon-based blanket with a cliche; And transferring the printing composition coating film remaining on the silicon-based blanket to the substrate.

The printing composition according to the present invention is particularly adapted for use in a reverse offset printing process using a silicone-based blanket, wherein the solvent in the printing composition is controlled to have certain properties in relation to the binder resin and the silicone- The swelling phenomenon of the blanket can be minimized even when the number of times of printing is repeated. By applying a high boiling point solvent having an appropriate evaporation rate, changes in the pattern characteristics depending on the print waiting time and the change in the coating thickness can be minimized.

Figure 1 illustrates a process schematic diagram of the reverse offset printing method of the present disclosure.

Hereinafter, the present invention will be described in more detail.

One embodiment of the present disclosure is a reverse offset printing composition using a silicone-based blanket, comprising: 1) a binder resin; 2) a low boiling point solvent having a boiling point of less than 100 캜; And 3) a silicone-based blanket comprising a diol-based high boiling point solvent having a boiling point of 180 ° C or higher.

The present inventors have found that a printing composition for use in a reverse offset printing method using a blanket made of a silicone-based material, wherein the solvent of the printing composition is selected in consideration of the binder resin contained in the printing composition and the characteristics of the blanket material used in the printing process , Printing processability and fine patterns can be realized. Based on this, it has been deduced to derive the optimum physical properties of the solvent when the silicon-based blanket is used.

According to one embodiment of the present invention, the solubility parameter of the diol-based high boiling point solvent may be 10 (cal.cm) ^1/2 or more and 14 (cal.cm) ^1/2 or less.

When the solubility parameter of the diol-based high boiling point solvent is within the above-mentioned numerical range, the solubility of the binder resin in the solvent is high and the compatibility of the solvent and the binder resin is high. Therefore, the stickiness tackiness.

The solubility parameter, including the present specification, refers to the Hildebrand solubility parameter as a measure of solubility.

According to one embodiment of the present disclosure, the diol based high boiling point solvent may have a swelling parameter for the silicon blanket of less than 1.4%. Specifically, the swelling parameter may be 0.5% or less, and more specifically, the swirling parameter may be 0.3% or less.

The swelling parameter in the present specification is a numerical value obtained by measuring the degree of swelling of the silicon blanket relative to the solvent. Specifically, a silicone blanket, for example, 7 gf of PDMS (polydimethylsiloxane) was poured into a Petri dish having a diameter of 4.8 cm, and then cured at room temperature for 24 hours and at 60 ° C for 24 hours. The PDMS specimen was taken out from the PDMS specimen, and the residual solvent remaining on the surface was removed within 30 to 40 seconds. The weight change of the PDMS was measured by swelling using an electronic balance. The swelling parameter can be expressed by the following equation (1).

[Equation 1]

Swelling parameter (%) = {(weight of silicone blanket after loading / weight of silicone blanket before loading) - 1} x 100

If the swelling parameter for the silicon-based blanket is within the above numerical range, the degree of swelling of the silicon-based blanket by the solvent is low, so that the swelling phenomenon of the blanket can be minimized even if the number of times of printing is repeated, so that the deformation can be minimized. Thus, the printing process time can be kept constant, and even if the number of times of printing is repeated, the formed pattern accuracy can be kept excellent. For this reason, the smaller the swelling parameter for the silicon-based blanket is, the better.

The numerical range for the swelling parameter for the blanket herein is closely related to the material of the blanket. Therefore, the numerical range can be suitably applied in the case where the blanket is a silicon-based material.

According to one embodiment of the present disclosure, the diol based high boiling point solvent has a solubility parameter of 10 (cal.cm) ^1/2 to 14 (cal.cm) ^1/2 or less, and a swelling parameter for the silicon blanket of 1.4 % ≪ / RTI >

According to one embodiment of the present disclosure, the high boiling point solvent may have a vapor pressure of 0.04 kPa or less at 25 占 폚. Specifically, the high boiling point solvent may have a vapor pressure of 0.02 kPa or less at 25 캜. When the high boiling point solvent has a vapor pressure of 0.02 kPa or less at 25 캜, the printing margin is greatly increased, which is advantageous in securing pattern uniformity in a large area application.

When the vapor pressure of the diol-based high boiling point solvent is within the above range at 25 캜, the rate of evaporation of the ink coating film is decreased to give a stickiness of the printing composition even though the time from transfer of the pattern to transferring the printed matter increases .

According to one embodiment of the present disclosure, the diol based high boiling point solvent has a solubility parameter of 10 (cal.cm) ^1/2 to 14 (cal.cm) ^1/2 or less, and a swelling parameter for the silicon blanket of 1.4 %, And the vapor pressure at 25 캜 may be 0.04 kPa or less.

The reverse offset printing composition of one embodiment of the present disclosure may further include a medium boiling point solvent having a boiling point of 100 ° C or more and less than 180 ° C.

According to one embodiment of the present disclosure, the diol based high boiling point solvent is propylene glycol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 2,3-butanediol; 1,4-butanediol; 1,5-pentanediol; 1,4-pentanediol; 1,3-pentanediol; 2,4-pentanediol; 1,6-hexanediol; 1,5-hexanediol; 1,4-hexanediol; 1,3-hexanediol; 1,2-hexanediol; 2,3-hexanediol; 2,4-hexanediol; 2,5-hexanediol; Hexanediol, and 3,4-hexanediol. However, the scope of the present invention is not limited to these examples.

According to one embodiment of the present invention, the low boiling point solvent may be an alcohol, a ketone, an acetate, or the like. Specifically, dimethyl carbonate; Methanol; Methyl ethyl ketone; Isopropyl alcohol; Ethyl acetate; ethanol; Propanol; Allyl alcohol and 1, 3-propyl alcohol. However, the scope of the present invention is not limited to these examples.

According to one embodiment of the present disclosure, the medium boiling point solvent is ethyl lactate; Propylene glycol monomethyl ether acetate (PGMEA); DMF (N, N-dimethylformamide); Methyl-3-methoxypropionate; Methyl amyl ketone; Ethyl-3-ethoxypropionate; And butyl acetate. ≪ RTI ID = 0.0 > [0040] < / RTI > However, the scope of the present invention is not limited to these examples.

According to one embodiment of the present disclosure, the content of the medium boiling point solvent may be from 0.5 to 15% by weight based on the total composition.

The reverse offset printing composition according to one embodiment of the present invention may be used for forming a resist pattern or for forming an insulating pattern.

According to one embodiment of the present invention, as the binder resin, an appropriate material may be selected according to the end use purpose. Specifically, according to one embodiment of the present invention, the binder resin may be a novolak resin.

Novolak resins are advantageous not only because they are advantageous for forming a resist pattern, but also because they have excellent compatibility with solvents satisfying the conditions according to the printing composition of the present invention described above. In addition, Novolac resin has excellent chemical resistance to etchant, which makes it possible to perform a stable etching process, and is excellent in solubility in a peeling liquid, so that there is an advantage that fewer foreign matters are generated after peeling, and the peeling time is shortened.

The novolak resin in one embodiment of the present invention may have a weight average molecular weight of 1,500 to 20,000. When the weight average molecular weight is less than 1,500, sufficient chemical resistance to etchant is not ensured, cracking and peeling may occur in the resist coating film during the etching process. When the weight average molecular weight exceeds 20,000, solubility Can be lowered.

The novolak resin can be produced through a condensation reaction of a phenol compound and an aldehyde compound. As the phenolic compound, those known in the art may be used. Examples of the phenolic compound include m-cresol, o-cresol, p-cresol, 2,5-xylenol, 3,4- And 2,3,5-trimethylphenol can be used. As the aldehyde-based compound, those known in the art can be used, and at least one selected from the group consisting of formaldehyde, paraformaldehyde, acetaldehyde, benzaldehyde, phenylaldehyde and salicylaldehyde can be used. The novolak resin may further contain an optional monomer within the range not impairing the object of the present invention.

According to one embodiment of the present disclosure, the composition may comprise from 5 to 30% by weight of binder resin, from 50 to 90% by weight of a low boiling solvent and from 1 to 25% by weight of a diol based high boiling point solvent.

According to one embodiment of the present disclosure, the composition comprises 5 to 30% by weight of a binder resin, 50 to 90% by weight of a low boiling point solvent, 0.5 to 15% by weight of a high boiling point solvent and 1 to 25% by weight of a diol based high boiling point solvent .

One embodiment of the present disclosure relates to a reverse offset printing composition using a silicone blanket comprising: 1) 5 to 30% by weight of a binder resin; 2) 50 to 90% by weight of a low boiling solvent; and 3) 1 to 25% by weight of a diol- And the solubility parameter of the diol-based high boiling point solvent may be 10 (cal.cm) ^1/2 or more and 14 (cal.cm) ^1/2 or less.

An embodiment of the present disclosure relates to a reverse offset printing composition using a silicone-based blanket comprising: 1) 5 to 30% by weight of binder resin, 2) 50 to 90% by weight of a low boiling solvent, and 3) 1 to 25% by weight of a diol- 4) 0.5 to 15% by weight of a medium boiling point solvent, and the solubility parameter of the high boiling point solvent may be 10 (cal.cm) ^1/2 or more and 14 (cal.cm) ^1/2 or less.

One embodiment of the present disclosure relates to a reverse offset printing composition using a silicone blanket comprising: 1) 5 to 30% by weight of a binder resin; 2) 50 to 90% by weight of a low boiling solvent; and 3) 1 to 25% by weight of a diol- Wherein the diol based high boiling point solvent has a solubility parameter of 10 (cal.cm) ^1/2 or more and 14 (cal.cm) ^1/2 or less, and a swelling parameter for the silicone blanket may be less than 1.4%.

One embodiment of the present disclosure relates to a reverse offset printing composition using a silicon based blanket comprising: 1) 5 to 30% by weight of a binder resin; 2) 50 to 90% by weight of a low boiling solvent; 3) 1 to 25% by weight of a diol- (Cal.cm) ^1/2 to 14 (cal.cm) ^1/2 or less, and the solubility parameter of the diol-based high boiling point solvent is not more than 14 (cal.cm) The ring parameter may be less than 1.4%.

One embodiment of the present disclosure relates to a reverse offset printing composition using a silicone blanket comprising: 1) 5 to 30% by weight of a binder resin; 2) 50 to 90% by weight of a low boiling solvent; and 3) 1 to 25% by weight of a diol- Wherein the diol-based high boiling point solvent has a solubility parameter of 10 (cal.cm) ^1/2 to 14 (cal.cm) ^1/2 or less, a swelling parameter for the silicone blanket of less than 1.4% The vapor pressure may be below 0.04 kPa.

An embodiment of the present disclosure relates to a reverse offset printing composition using a silicone-based blanket comprising: 1) 5 to 30% by weight of binder resin, 2) 50 to 90% by weight of a low boiling solvent, and 3) 1 to 25% by weight of a diol- 4) from 0.5 to 15% by weight of a medium boiling point solvent, wherein the diol based high boiling point solvent has a solubility parameter of 10 (cal.cm) ^1/2 to 14 (cal.cm) ^1/2 or less, The swelling parameter may be less than 1.4% and the vapor pressure at 25 캜 may be less than or equal to 0.04 kPa.

The reverse offset printing composition of one embodiment herein may further comprise a surfactant. The surfactant may be a conventional leveling agent, a wetting agent and a slip agent. For example, a silicone-based, fluorine-based or polyether-based surfactant may be used. The content of the surfactant may be 0.01 to 0.5% by weight based on the total weight of the reverse offset printing composition.

The reverse offset printing composition of one embodiment of the present invention may further include an adhesion improving agent. As the adhesion improver, a melamine-based, styrene-based or acrylic oligomer or polymer may be used. The weight average molecular weight of the oligomer or polymer may be 5,000 or less, specifically 3,000 or less, more specifically 1,000 or less. The content of the adhesion improver may be 0.01 to 1% by weight based on the total weight of the reverse offset printing composition.

The reverse offset printing composition of one embodiment of the present disclosure may include both a surfactant and an adhesion improver.

The reverse offset printing composition of one embodiment herein uses a low boiling point solvent, a medium boiling point solvent and a high boiling point solvent, wherein the low boiling point solvent is selected so that the low viscosity of the printing composition and the viscosity of the blanket And is then removed by volatilization to increase the viscosity of the printing composition and to allow pattern formation and maintenance on the blanket to be performed well. On the other hand, a high-boiling solvent is a solvent exhibiting relatively low volatility, and can impart tackiness to the printing composition until the pattern is transferred to the substrate. The medium boiling point solvent may remain in the printing composition and function even after the low boiling point solvent is volatilized. In the present invention, by using three or more kinds of solvents having different boiling points, the viscosity of the printing composition can be controlled more precisely as described above.

In the present specification, the boiling point of the low boiling point solvent may be less than 100 캜, specifically 95 캜 or lower, more specifically 90 캜 or lower. By including a low boiling point solvent having a boiling point within the above numerical range, the printing composition is applied on the blanket, and then the cliche is contacted with the printing composition coating film applied on the blanket to reduce the process waiting time until some coating films are removed And the swelling phenomenon of the blanket can be reduced.

In the present specification, the boiling point of the low boiling point solvent may be 50 DEG C or higher. If the boiling point of the low boiling point solvent is too low, there may arise a problem that the printing composition is dried at the nozzle when the printing composition is applied to the blanket. The boiling point of the low-boiling point solvent may be 50 ° C or higher in order to improve the leveling property immediately after application of the printing composition.

The medium boiling point solvent may have a boiling point of 100 ° C or higher and lower than 180 ° C, specifically, 130 ° C to 170 ° C. The boiling point of the middle boiling point solvent within the above range is advantageous for increasing the printing process margin. Since the medium boiling point solvent volatilizes between the volatilization timing of the low boiling point solvent and the volatilization point of the high boiling point solvent, the viscosity of the printing composition is lowered so that the stickiness of the printing composition can be maintained and the printing process margin can be improved. For reference, the printing waiting time refers to the time from the time when the printing composition is coated on the blanket to the time when the coating film on the blanket is removed by the cliche, and the printing process margin means that the intended pattern is formed satisfactorily Quot; minimum print waiting time " In addition, the medium boiling point solvent can maintain the viscosity even after the low boiling point solvent is volatilized, thereby improving the film uniformity of the printing composition.

The boiling point of the intermediate boiling point solvent may be 5 ° C or higher, and specifically 10 ° C or higher, from the boiling point of each of the low boiling point solvent and the high boiling point solvent. If the difference in boiling point between the solvents is too small, the volatilization timing of the solvent with the low boiling point solvent or the high boiling point solvent is similar, and it is difficult to achieve the effect depending on the role of the intermediate boiling point itself.

The boiling point of the intermediate boiling point solvent may be 5 ° C or higher, and specifically 10 ° C or higher, from the boiling point of each of the low boiling point solvent and the high boiling point solvent. If the difference in boiling point between the solvents is too small, the volatilization timing of the solvent with the low boiling point solvent or the high boiling point solvent is similar, and it is difficult to achieve the effect depending on the role of the intermediate boiling point itself.

The boiling point of the high boiling point solvent may be 180 ° C or higher. By including a high boiling point solvent having a boiling point within the above-mentioned numerical range, tackiness can be imparted to the printing composition until the pattern is transferred to the substrate, the process latency can be reduced, and the swelling of the blanket The phenomenon can be reduced.

The boiling point of the high boiling point solvent according to the present disclosure may be 300 ° C or less, and may be 250 ° C or less. When the boiling point of the high-boiling point solvent is 250 ° C or lower, the problem that the solvent remains in the final printed matter and takes a long drying or curing time can be prevented, and the precision of the printing pattern can be improved.

According to one embodiment of the present invention, the silicon-based blanket means that the outer periphery of the blanket is made of a silicon-based material. The silicon-based material is not particularly limited as long as it is a material containing silicon and including a curable group, but it may have a hardness of 20 to 70, and more specifically, a hardness of 30 to 60. [ The hardness means Shore A hardness. Deformation of the blanket can be achieved within an appropriate range by using a silicon-based material within the hardness range. If the hardness of the blanket material is too low, part of the blanket may touch the engraved portion of the cliché due to the deformation of the blanket during the off-process to remove a part of the printing composition coating film from the blanket by the cliche, . Further, in consideration of easiness of selection of the blanket material, a material having a hardness of 70 or less can be selected.

For example, a PDMS (polydimethyl siloxane) curable material may be used as the silicon-based blanket material. To the extent that the object of the present invention is not adversely affected, the blanket material may further include additives known in the art.

The printing composition according to the present disclosure can be prepared by mixing the above-mentioned components. If necessary, by filtration with a filter. Such foreign matter or dust can be removed by such filtration.

According to one embodiment of the present invention, it is possible to form the print pattern having a small line width change rate by the above-described configuration. That is, the line width variation rate of the print pattern can reach 20% or less, specifically 10% or less, more specifically, 5% or less. If the line width change rate is 20% or less, it can be seen as a normal pattern, and the smaller the line width change rate is, the higher the pattern accuracy is. The smaller the line width change ratio is, the more the pattern intersection portion can be realized normally, and the possibility that hairring does not occur increases. The hair ring refers to a phenomenon in which the pattern is stretched during the off process.

The line width in the present specification means the width of a line constituting the pattern. Specifically, it means the shortest distance between both edges of the line when looking down the line in the vertical direction with respect to the plate surface of the substrate or the cliche provided with the pattern.

Here, the linewidth of the print pattern is based on the dried state.

The line width change ratio (%) can be expressed by the following equation (2). In Equation (2), the line width of the print pattern and the line width of the cleavage pattern mean line widths of the portions corresponding to each other.

&Quot; (2) "

Line width change rate (%) = {(line width size of printed pattern - line width size of cliché pattern) / (line width size of cliché pattern)} x 100

One embodiment of the present disclosure provides a printing method using the reverse offset printing composition. Specifically, the printing method comprises: coating the printing composition on a silicon-based blanket; Removing a part of the coating film by contacting the printing composition coating film coated on the silicon-based blanket with a cliche; And transferring the printing composition coating film remaining on the silicon-based blanket to the substrate.

A reverse offset printing method is illustrated in Fig. The reverse offset printing method comprises the steps of: i) applying a printing composition to a blanket; ii) contacting the blanket with a cliché in which the pattern corresponding to the pattern to be formed is embossed, thereby forming a pattern of the printing composition corresponding to the pattern on the blanket; and iii) transferring the printing composition pattern on the blanket onto the substrate. At this time, the outer peripheral portion of the blanket is made of a silicon-based material.

1, reference numeral 10 denotes a coater for coating the metal pattern material on the blanket, 20 denotes a roll-shaped support for supporting the blanket, 21 denotes a blanket, 22 denotes a coating on the blanket ≪ / RTI > Reference numeral 30 denotes a cliche support, and reference numeral 31 denotes a cliche having a pattern, in which a pattern corresponding to a pattern to be formed is formed as a cathode. Reference numeral 40 denotes a print body, and reference numeral 41 denotes a print composition pattern transferred to a substrate.

According to one embodiment of the present invention, the printing method may further include a step of drying or curing the printing composition transferred to the substrate. In the drying or curing step, the process temperature may be selected from room temperature to 350 ° C, and depending on the binder resin, the drying or curing temperature may be selected from room temperature to 350 ° C, specifically, 50 ° C to 300 ° C . The drying or curing time may be selected depending on the composition and composition of the composition, and the processing temperature.

According to one embodiment of the present disclosure, the reverse offset printing composition may comprise a pattern having a line width of 100 mu m or less.

According to one embodiment of the present invention, the pattern of the printing composition transferred to the substrate of the printing method may include a pattern having a line width of 100 mu m or less. Specifically, it may have a line width or line spacing of 80 mu m or less, more preferably 30 mu m or less. In particular, according to the present specification, a fine pattern which can not be formed by a previously applied inkjet printing method or the like, for example, 20 μm or less, preferably 15 μm or less, more preferably 7 μm or less, further preferably 5 μm or less A pattern having a line width of < RTI ID = 0.0 > The line width may be 0.5 탆 or more, specifically 1 탆 or more, more specifically 1.5 탆 or more.

According to one embodiment of the present invention, the printing method is a printing method in which the pattern of the printing composition transferred onto the substrate is a pattern having a line width of 100 탆 or less, and a step of drying or curing the printing composition transferred to the printing substrate is added As shown in FIG.

According to one embodiment of the present disclosure, the reverse offset printing composition may comprise a pattern having a line width of 5 mu m or less.

According to one embodiment of the present invention, the pattern of the ink composition transferred to the substrate of the printing method includes a pattern having a line width of 5 mu m or less.

According to one embodiment of the present invention, the printing method is a printing method in which the pattern of the printing composition transferred onto the substrate is a pattern having a line width of 5 m or less, and the step of drying or curing the printing composition transferred to the printing substrate is added As shown in FIG.

When the printing method according to one embodiment of the present invention is used, two or more patterns having different linewidths can be formed on the same substrate simultaneously. In particular, the coating film of the printing composition transferred onto the substrate of the reverse offset printing composition of one embodiment of the present specification may include a pattern having a line width of 100 mu m or less and a pattern having a line width of 5 mu m or less. The coating film of the printing composition transferred onto the substrate of the printing method of one embodiment of the present specification may include a pattern having a line width of 100 mu m or less and a pattern having a line width of 5 mu m or less.

According to an embodiment of the present invention, the pattern of the reverse offset printing composition may have a line width change rate expressed by Equation (2) below 20% or less.

According to an embodiment of the present invention, the pattern composition of the printing composition transferred onto the substrate of the printing method may have a line width change rate of 20% or less as expressed by Equation (2).

According to one embodiment of the present invention, the pattern of the reverse offset printing composition may have a full-surface transfer ratio of 80 to 100% expressed by Equation (3).

&Quot; (3) "

(%) = {(Area of the printing composition transferred to the printing medium) / (100 mm x 100 mm)} x 100

According to one embodiment of the present invention, the pattern of the printing composition transferred to the printing material of the printing method may have a front transfer ratio of 80 to 100% expressed by Equation (3).

The pattern of the printing composition, including the present disclosure, refers to the pattern of the printing composition transferred to the substrate.

The reverse offset printing composition of the present invention and the pattern formed by the printing method can be used as a resist pattern. The resist pattern may be used as an etching resist for forming a conductive pattern, a metal pattern, a glass pattern, a semiconductor pattern, or the like. For example, the resist pattern may be used as a resist for forming electrodes or auxiliary electrodes of TFTs, touch screens, displays such as LCDs and PDPs, light emitting devices, solar cells, and various electronic devices. In addition, the pattern formed by the printing composition and the printing method may be used as an insulating pattern necessary for various electronic devices. The insulating pattern may be an insulating pattern covering the metal pattern. For example, the insulating pattern can be used as a passivation layer covering the auxiliary electrode of the OLED illumination substrate.

Hereinafter, the present invention will be described in more detail with reference to Examples, Comparative Examples and Experimental Examples. However, the following Examples, Comparative Examples and Experimental Examples are provided for illustrating the present invention, and thus the scope of the present invention is not limited thereto.

< Example  1>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of PGMEA, and 5 g of 1,4-butanediol as a high-boiling solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.3%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.002 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Example  2>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, 0.5 g of a surfactant, 81 g of 1-propanol as a low boiling point solvent, 3 g of PGMEA as a point solvent, and 5 g of 1,4-butanediol as a high boiling point solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.3%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.002 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Example  3>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of butyl acetate and 5 g of 1,4-butanediol as a high-boiling solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.3%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.002 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Example  4>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of PGMEA and 5 g of 2,3-butanediol as a high-boiling solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high boiling solvent is 11.1 (cal.cm) ^1/2 , the swelling parameter of the high boiling solvent to the silicone type blanket is 0.5%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.022 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Example  5>

10 g of Novalac resin having a weight average molecular weight of 2,000 in terms of polystyrene, prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were mixed with 84 g of ethanol as a low boiling point solvent, Was dissolved in 5 g of 1,4-butanediol and then filtered at 1 mu m to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.3%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.002 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent and the hardness of the silicone type blanket, Respectively.

< Comparative Example  1>

10 g of a novolak resin having a weight average molecular weight of 2,000 as a polystyrene reduced product prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, 0.5 g of a surfactant, 81 g of formic acid as a low boiling point solvent, 3 g of PGMEA, and 5 g of 1,4-butanediol as a high-boiling solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.3%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.002 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Comparative Example  2>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of phosphorus isopropyl acetate and 5 g of 1,4-butanediol as a high-boiling solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.3%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.002 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Comparative Example  3>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of PGMEA and 5 g of 1-bromonaphthalene as a high-boiling solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 10.6 (cal.cm) ^1/2 , the swelling parameter of the high boiling solvent is 1.4% for the silicon-based blanket, and the vapor pressure of the high boiling solvent at 25 ° C is 0.001 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Comparative Example  4>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of PGMEA as a solvent and 5 g of ethylene glycol as a high boiling point solvent, followed by filtration at 1 탆 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 14.6 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 0.4%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.01 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Comparative Example  5>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of PGMEA as a solvent and 5 g of benzyl alcohol as a high boiling point solvent, followed by filtration at 1 占 퐉 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.1 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 5.5%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.015 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Comparative Example  6>

10 g of a novolak resin having a weight average molecular weight of 2,000 in terms of polystyrene and prepared by mixing m-cresol and p-cresol at a weight ratio of 5: 5, 0.5 g of a melamine adhesion promoting agent, and 0.5 g of a surfactant were dissolved in 81 g of ethanol as a low boiling point solvent, 3 g of PGMEA as a solvent and 5 g of 4-methoxybenzyl alcohol as a high boiling point solvent, followed by filtration at 1 탆 to prepare a printing composition. At this time, the solubility parameter of the high-boiling solvent is 12.3 (cal.cm) ^1/2 , the swelling parameter for the silicon-based blanket of the high boiling solvent is 5.1%, and the vapor pressure of the high boiling solvent at 25 ° C is 0.045 kPa. The hardness of the silicone-based blanket is 47 as measured by a shore A durometer. The above-mentioned printing composition was measured for the front transfer ratio, the initial waiting time, the number of consecutive prints, the print waiting margin and the pattern accuracy by the methods of Experimental Examples 1 to 5 described below. The boiling point of the low boiling point solvent, the boiling point of the medium boiling point solvent, the boiling point of the high boiling point solvent, the solubility parameter of the high boiling point solvent, the swelling parameter for the silicone type blanket of the high boiling solvent, the vapor pressure of the high boiling point solvent, Are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt;

< Experimental Example  1> Front transfer rate

The above Examples 1 to 4 and Comparative Examples 1 to 6 are applied on a silicon blanket at a rate of 50 mm / s to form a coating film having a thickness of 3 占 퐉 before drying. After waiting for 30 seconds after the application, the entire surface of the 100 mm x 100 mm glass substrate was transferred to a glass base material having a transfer speed of 50 mm / s and an ink pressure of 20 m. The measurement results are shown in Table 2 below.

&Quot; (3) &quot;

Overall transfer ratio (%) = {(area of printed composition transferred to the printing medium) / (100 mm x 100 mm)} x 100

A: 100% transferred

B: 80% transferred

C: 50% transferred

D: 30% transferred

E: 10% transferred

F: Not transferred

< Experimental Example  2> Initial print waiting time

The above Examples 1 to 4 and Comparative Examples 1 to 6 are applied on a silicon blanket at a rate of 50 mm / s to form a coating film having a thickness of 3 占 퐉 before drying. After waiting for 30 seconds or longer, the cloth was transferred to a cliche of 100 mm x 100 mm having a line width of 5 mu m and a line-to-line distance of 300 mu m with an engraved mesh pattern at a transfer speed of 50 mm / s and an applied pressure of 20 mu m, A pattern is formed on the blanket. The printing composition pattern formed on the blanket is transferred onto a glass substrate of 100 mm x 100 mm size at a transfer speed of 50 mm / s and an ink pressure of 20 m to form a final pattern. The time for realizing the normal pattern was confirmed by varying the process wait time. The criterion of the normal pattern is that the line width change rate of the pattern formed on the glass base material relative to the cliché is within 20%. The minimum print waiting time is 30 seconds, and the process waiting time can be expressed by the following equation (4). The measurement results are shown in Table 2 below.

&Quot; (4) &quot;

Process waiting time = off start point - time of completion of coating,

< Experimental Example  3> Continuous printing characteristics

The above Examples 1 to 4 and Comparative Examples 1 to 6 are applied on a silicon blanket at a rate of 50 mm / s to form a coating film having a thickness of 3 占 퐉 before drying. After applying the initial print waiting time to form a normal pattern after application, the printing was continuously performed with a line width of 5 탆 and a line distance of 300 탆 with an engraved mesh pattern, and the change of the line width of the pattern was measured. And the number of sheets to be held was measured. The measurement results are shown in Table 2 below.

< Experimental Example  4> Print waiting margin measurement

The above Examples 1 to 4 and Comparative Examples 1 to 6 are applied on a silicon blanket at a rate of 50 mm / s to form a coating film having a thickness of 3 占 퐉 before drying. After waiting for 30 seconds or longer, the cloth was transferred to a cliche of 100 mm x 100 mm having a line width of 5 mu m and a line-to-line distance of 300 mu m with an engraved mesh pattern at a transfer speed of 50 mm / s and an applied pressure of 20 mu m, A pattern is formed on the blanket. The printing composition pattern formed on the blanket is transferred onto a glass substrate of 100 mm x 100 mm size at a transfer speed of 50 mm / s and an ink pressure of 20 m to form a final pattern. The minimum wait time and the maximum wait time at which the normal pattern is implemented are determined by varying the process wait time. The measurement results are shown in Table 2 below.

&Quot; (5) &quot;

Print Wait Margin = Maximum wait time for normal pattern to be implemented - Minimum wait time for normal pattern to be implemented

< Experimental Example  5> Measurement of pattern accuracy

The above Examples 1 to 4 and Comparative Examples 1 to 6 are applied on a silicon blanket at a rate of 50 mm / s to form a coating film having a thickness of 3 占 퐉 before drying. After applying the printing waiting time to form a normal pattern after application, the paper was transferred to a cliche having a size of 100 mm x 100 mm having a line width of 5 mu m and a line distance of 300 mu m with an engraved mesh pattern at a transfer speed of 50 mm / s and a pressure of 20 mu m, Is formed on the blanket. The printing composition pattern formed on the blanket is transferred onto a glass substrate of 100 mm x 100 mm size at a transfer speed of 50 mm / s and an ink pressure of 20 m to form a final pattern. The obtained pattern was observed under a microscope and evaluated according to the following criteria. The measurement results are shown in Table 2 below.

&Quot; (2) &quot;

Line width change rate (%) = {(line width size of printed pattern - line width size of cliché pattern) / (line width size of cliché pattern)} x 100

A: Line width change rate is within 5%, pattern intersection normal implementation

B: Line width change rate is within 10%, pattern intersection disconnection occurs

C: Line width change rate is within 20%, pattern intersection normal implementation

D: Less than 20% line width change rate, pattern crossing disconnection occurred

E: line width change rate 20% or more, pattern intersection disconnection occurrence

F: line width change rate of 20% or more, occurrence of disconnection of pattern intersection, occurrence of hair ring

The hair ring refers to a phenomenon in which the pattern is stretched during the off process.

The boiling point of the low boiling point solvent
(° C) Boiling point of medium boiling point solvent
(° C) Boiling point of high boiling point solvent
(° C) Solubility parameters of high boiling solvents
(cal.cm) ^1/2 Swelling parameters for silicone-based blanket of high boiling solvent
(%) Vapor pressure of high boiling point solvent
(kPa) Hardness of silicone-based blanket Example 1 78 146 235 12.1 0.3 0.002 47 Example 2 97 146 235 12.1 0.3 0.002 47 Comparative Example 1 101 146 235 12.1 0.3 0.002 47 Example 3 78 127 235 12.1 0.3 0.002 47 Comparative Example 2 78 89 235 12.1 0.3 0.002 47 Comparative Example 3 78 146 281 10.6 1.4 0.001 47 Comparative Example 4 78 146 197 14.6 0.4 0.01 47 Comparative Example 5 78 146 205 12.1 5.5 0.015 47 Example 4 78 146 183 11.1 0.5 0.032 47 Comparative Example 6 78 146 259 12.3 5.1 0.07 47 Example 5 78 - 235 12.1 0.3 0.002 47

Total Warfare Rate Initial Print Wait Time (seconds) Continuous printing property (every) Print waiting margin (seconds) Pattern precision Example 1 A Within 30 56 90 A Example 2 A 40 50 90 A Comparative Example 1 A 50 20 90 A Example 3 A Within 30 56 80 A Comparative Example 2 A Within 30 56 75 A Comparative Example 3 A 40 35 90 A Comparative Example 4 A Not measurable Not measurable Not measurable F Comparative Example 5 A 35 25 25 A Example 4 A Within 30 56 85 A Comparative Example 6 A Within 30 28 15 A Example 5 A Within 30 60 85 A

10: Coater for coating metal pattern material on blanket
20: roll-type support for supporting the blanket
21: Blanket
22: Printing composition pattern material applied on blanket
30: Cleese support
31: The cliché with patterns
40:
41: Printed composition pattern transferred to the substrate

Claims (24)

A reverse offset printing composition using a silicone-based blanket,
1) a binder resin;
2) a low boiling point solvent having a boiling point of less than 100 캜; And
3) a diol-based high boiling point solvent having a boiling point of 180 ° C or higher,
The diol-based high boiling point solvent has a vapor pressure of 0.04 kPa or less at 25 캜,
The diol based high boiling point solvent is selected from the group consisting of propylene glycol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 2,3-butanediol; 1,4-butanediol; 1,5-pentanediol; 1,4-pentanediol; 1,3-pentanediol; And 2,4-pentanediol;
Wherein the diol-based high boiling point solvent has a solubility parameter of 10 (cal.cm) ^1/2 or more and 14 (cal.cm) ^1/2 or less. delete The reverse offset printing composition of claim 1, wherein the diol based high boiling point solvent has a swelling parameter of less than 1.4% for a silicone blanket satisfying the following formula:
[Equation 1]
Swelling parameter (%) = {(weight of silicone blanket after loading / weight of silicone blanket before loading) - 1} x 100 delete The reverse offset printing composition of claim 1, wherein the reverse offset printing composition further comprises a medium boiling point solvent having a boiling point of greater than or equal to 100 ° C and less than or equal to 180 ° C. The reverse offset printing composition according to claim 1, wherein the binder resin is a novolak resin. 7. The reverse offset printing composition according to claim 6, wherein the novolak resin has a weight average molecular weight of 1,500 to 20,000. delete The method of claim 1, wherein the low boiling point solvent is selected from the group consisting of dimethyl carbonate; Methanol; Methyl ethyl ketone; Isopropyl alcohol; Ethyl acetate; ethanol; And 1, 3-propyl alcohol. 2. The reverse offset printing composition according to claim 1, 6. The method of claim 5, wherein the medium boiling point solvent is ethyl lactate; PGMEA; DMF; Methyl-3-methoxypropionate; Methyl amyl ketone; And ethyl-3-ethoxypropionate. The reverse offset printing composition according to claim 1, The reverse offset printing composition of claim 1, wherein the composition comprises 5 to 30 weight percent of the binder resin, 50 to 90 weight percent of the low boiling point solvent, and 1 to 25 weight percent of the high boiling point solvent. 12. The reverse offset printing composition of claim 11, wherein the composition comprises from 0.5 to 15% by weight of a medium boiling point solvent having a boiling point of at least &lt; RTI ID = 0.0 &gt; 100 C & The composition of claim 1, wherein the composition comprises a surfactant; And an adhesive force improver. The reverse offset printing composition according to claim 1, [13] The method according to claim 13, wherein the surfactant when the surfactant is included is 0.01 to 0.5% by weight based on the total weight of the composition, and the adhesion improver when the adhesion improver is included is 0.01 to 1 wt% %. &Lt; / RTI &gt; The reverse offset printing composition of claim 1, wherein the blanket has a Shore A hardness of from 20 to 70. A reverse offset printing composition according to any one of claims 1, 3, 5 to 7, and 9 to 15, which is for forming a resist pattern or an insulating pattern. A printing method using a reverse offset printing composition according to any one of claims 1, 3, 5 to 7 and 9 to 15,
The printing method comprising: coating the printing composition on a silicon-based blanket;
Removing a part of the coating film by contacting the printing composition coating film coated on the silicon-based blanket with a cliche; And
And transferring the printing composition coating film remaining on the silicon-based blanket to the substrate. delete The printing method according to claim 17, further comprising the step of drying or curing the printing composition transferred to the substrate. 18. The printing method according to claim 17, wherein the pattern of the printing composition transferred onto the substrate includes a pattern having a line width of 100 mu m or less. 18. The printing method according to claim 17, wherein the pattern of the ink composition transferred to the substrate includes a pattern having a line width of 5 mu m or less. 18. The printing method according to claim 17, wherein the coating film of the printing composition transferred onto the substrate comprises a pattern having a line width of 100 mu m or less and a pattern having a line width of 5 mu m or less. 18. The printing method according to claim 17, wherein the pattern of the printing composition transferred onto the substrate has a line width change ratio of 20% or less as represented by the following formula (2)
&Quot; (2) &quot;
Line width change rate (%) = {(line width size of printed pattern - line width size of cliché pattern) / (line width size of cliché pattern)} x 100 18. The printing method according to claim 17, wherein the pattern of the printing composition transferred onto the substrate has a front transfer ratio of 80 to 100% represented by the following formula (3)
&Quot; (3) &quot;
(%) = {(Area of the printing composition transferred to the printing medium) / (100 mm x 100 mm)} x 100

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