KR101698246B1 - Conductive laminate - Google Patents

Abstract

The present invention relates to a conductive laminate and more particularly to a conductive laminate capable of effectively suppressing a change in resistance of the conductive electrode and capable of driving the touch panel stably for a long period of time even when the pressure- to provide.

Description

Conductive laminate {CONDUCTIVE LAMINATE}

The present application relates to a conductive laminate and an electronic device including the same.

BACKGROUND ART [0002] A touch panel or a touch screen is variously applied to various information processing terminals such as a mobile communication terminal or an ATM, or a display device such as a TV and a monitor. In addition, as the application to small portable electronic devices increases, the demand for a smaller and lighter touch panel or screen is increasing.

In the construction of the touch panel or the screen, an adhesive is used. Such a pressure-sensitive adhesive should maintain transparency even under severe conditions such as high temperature or high temperature and high humidity, be excellent in peeling force, and be able to suppress lifting and peeling. Further, the pressure-sensitive adhesive is required to effectively suppress the generation of bubbles, which is a problem more frequently than when a plastic film is used as a base material.

In addition, when the pressure sensitive adhesive is directly attached to a conductive electrode such as a thin film of indium tin oxide (ITO) according to the structure of the touch panel or the touch screen, And the property of suppressing the change in resistance of the electrode is also required for the pressure-sensitive adhesive.

Patent Document 1: Korean Patent Publication No. 2002-0036837 Patent Document 2: Korean Patent Publication No. 2001-0042939

The present application can easily attach the conductive laminate to a conductive electrode such as a glass or ITO so that the process can be conveniently performed and the resistance change of the conductive electrode can be made stable so that the driving of the panel can be stably performed even during long- The conductive layered structure being capable of inhibiting the conductive layer.

The present application relates to a conductive laminate. The conductive laminate according to the present application may include a pressure-sensitive adhesive layer comprising a polymer containing a compound of the following general formula (5) or (6) as polymerized units. In one example, the compound of formula 5 or 6 below may be an N-heterocyclic compound. 1 is a cross-sectional view illustrating a structure of a conductive laminate according to the present application. 1, the conductive laminate 4 according to the present application comprises a base layer 41; A pressure-sensitive adhesive layer (42) formed on one surface of the base layer (41); And a conductive layer 43 formed on the other surface of the base layer 41. The conductive laminate including the pressure-sensitive adhesive layer as described above may be directly attached to a conductive electrode such as ITO.

In an embodiment of the present application, the pressure-sensitive adhesive layer may comprise a polymer containing N-heterocyclic compounds as polymerized units. The N-heterocyclic compound may be represented by the following general formula (5) or (6). The conductive laminate according to the present application can prevent the pressure-sensitive adhesive layer from corroding the conductive electrode under high-temperature and high-humidity conditions even if it is directly attached to the conductive electrode, thereby preventing the resistance of the conductive electrode from rising. That is, the compound represented by the formula (5) or (6) contained in the pressure-sensitive adhesive layer may be contained as a polymerization unit of the polymer constituting the pressure-sensitive adhesive layer and may serve as an acid corrosion inhibitor.

In embodiments of the present application, the polymer may comprise a compound of formula (5) as polymerized units.

[Chemical Formula 5]

In Formula 5, R ₁₁ is hydrogen or an alkyl group. Specifically, R ₁₁ may be hydrogen or an alkyl group having 1 to 4 carbon atoms or 1 to 2 carbon atoms. R ₁₂ and R ₁₃ may be linked together to form an alicyclic or aromatic ring structure having 3 to 20 ring atoms. In the above, the ring member may be carbon, nitrogen or oxygen, and the ring structure may form a monocyclic compound or a bicyclic compound. On the other hand, the ring structure may contain one or more double bonds, and the carbon in the ring constituting atom may be a carbon which forms a carbonyl group. In addition, at least one hydrogen bonded to carbon or nitrogen in the ring atom may be substituted with an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an acryloyl group, a methacryloyl group, an acryloyloxy group, or a methacryloyloxy group .

In one example, the compound of Formula 5 is selected from the group consisting of 4-acryloylmorpholine, piperazine diacrylamide, 3-acryloyl-2-oxazolidinone, N-acrylated isopropenyl-benzimidazolone Based compound or 4-acryloylpyrrolidone, but is not limited thereto.

In addition, the polymer may include a compound of the following formula (6) as a polymerization unit.

[Chemical Formula 6]

In Formula 6, R ₁₄ is hydrogen or an alkyl group. Specifically, R ₁₄ may be hydrogen or an alkyl group having 1 to 4 carbon atoms or 1 to 2 carbon atoms. The U may be a single bond, an alkylene group or an alkylidene group. R ₁₅ is an alicyclic or aromatic ring structure having 3 to 20 ring members, and the ring member is carbon, nitrogen, or oxygen, and the ring structure may form a monocyclic compound or a bicyclic compound. On the other hand, the ring structure may contain one or more double bonds, and the carbon in the ring constituting atom may be a carbon which forms a carbonyl group. The at least one hydrogen bonded to carbon or nitrogen in the ring atom may be substituted with an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an amino group, a hydroxyl group, a carboxyl group, a halogen atom or a benzotriazolyl group. In one example, at least one hydrogen bonded to carbon or nitrogen in the ring constituent atoms may be substituted with a benzotriazolyl group.

As used herein, the term " single bond " means a single bond connecting atoms and atoms without separate atoms. For example, in the above formula (6), when U is a single bond, the oxygen of formula (1) can be directly connected to the R ₁₅ .

In one example, the compound of Formula 6 is selected from the group consisting of 2- (3-oxazolidinyl) ethyl methacrylate, 2-propenoic acid, 2- methyl-, 2- [3- (2H-benzotriazol- Yl) -4-hydroxyphenyl] ethyl ester or 1,2,2,6,6-pentamethyl-4-piperidinyl (meth) acrylate.

The pressure sensitive adhesive layer according to the present application contains any one of the compounds represented by Chemical Formulas 5 and 6 to prevent corrosion of the conductive electrode to which the pressure sensitive adhesive layer is directly attached under high temperature and high humidity conditions to prevent the resistance of the conductive electrode from rising . That is, the compounds of formulas (5) and (6) contained in the pressure-sensitive adhesive layer may be contained as a polymerization unit in the pressure-sensitive adhesive layer and may serve as an acid corrosion inhibitor.

The term "alkyl group" as used herein means an alkyl group having 1 to 30 carbon atoms, 1 to 25 carbon atoms, 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms ≪ / RTI > The alkyl group may have a linear, branched or cyclic structure and may optionally be substituted with one or more substituents.

The term "alkoxy group" as used herein may mean an alkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms or 1 to 4 carbon atoms, unless otherwise specified. The alkoxy group may be linear, branched or cyclic. In addition, the alkoxy group may be optionally substituted with one or more substituents.

Unless otherwise specified, the term "alkylene group" or "alkylidene group" as used herein may mean an alkylene group or an alkylidene group having 1 to 12 carbon atoms, 4 to 10 carbon atoms, or 6 to 9 carbon atoms . The alkylene group or alkylidene group may be linear, branched or cyclic. Also, the alkylene group or alkylidene group may be optionally substituted with one or more substituents.

Unless otherwise specified, the term "alkenyl group" as used herein may mean an alkenyl group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms have. The alkenyl group may be linear, branched or cyclic. In addition, the alkenyl group may be optionally substituted with one or more substituents.

Unless otherwise specified, the term "alkynyl group" as used herein may mean an alkenyl group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms have. The alkenyl group may be linear, branched or cyclic. In addition, the alkynyl group may be optionally substituted with one or more substituents.

As used herein, the term " aryl group " means a monovalent residue derived from a compound or derivative thereof, including a structure containing benzene or a structure in which two or more benzenes are condensed or bonded, unless otherwise specified have. The aryl group may be, for example, an aryl group having 6 to 22 carbon atoms, preferably 6 to 16 carbon atoms, and more preferably 6 to 13 carbon atoms, and examples thereof include a phenyl group, a phenylethyl group, a phenylpropyl group, , A tolyl group, a xylyl group or a naphthyl group.

In one example of the present application, the polymer of the pressure-sensitive adhesive layer may contain a (meth) acrylic acid ester-based monomer as a polymerization unit. In one example, the polymer may comprise from 30 to 95 parts by weight, from 35 to 90 parts by weight or from 40 to 90 parts by weight of alkyl (meth) acrylate having a linear, branched or cyclic alkyl group as polymerized units. The alkyl (meth) acrylate may be an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms in consideration of physical properties such as cohesion, glass transition temperature and tackiness. Examples of such alkyl (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, Acrylate, lauryl (meth) acrylate, and tetradecyl (meth) acrylate. One or more of these may be contained in a polymerized form in the resin.

In addition, the polymer may further comprise, as polymerized units, a compound comprising at least one reactive functional group. That is, when a compound containing a reactive functional group is contained as polymerized units, the compound may provide a reactive functional group capable of reacting with the polyfunctional crosslinking agent in the polymer. Examples of such a compound containing a reactive functional group include a hydroxy group-containing compound or a carboxyl group-containing compound. In the production of polymers, various copolymerizable monomers capable of providing such reactive functional groups to acrylic polymers are known. In the present invention, such monomers may be used without limitation. Examples of the compound having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl Hydroxypropyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethyleneglycol (meth) acrylate or 2-hydroxypropyleneglycol (Meth) acryloyloxybutyric acid, acrylic acid dimer, itaconic acid, itaconic acid, and the like may be used alone or in combination of two or more selected from the group consisting of (meth) acrylic acid, 2- , Maleic acid, maleic anhydride, and the like can be used, but the present invention is not limited thereto. On the other hand, the compound containing a reactive functional group is, for example, 0.1 to 30 parts by weight, 3 to 30 parts by weight, 5 to 30 parts by weight, 8 to 30 parts by weight, 10 to 30 parts by weight 13 to 30 parts by weight, By weight or 15 to 30 parts by weight. The polymer according to the present invention can effectively achieve desired physical properties such as adhesion, durability and peeling force of the pressure-sensitive adhesive layer by controlling the content of the compound containing a reactive functional group as a polymerized unit to be high.

In the present application, the polymer comprises from 30 to 95 parts by weight of an alkyl (meth) acrylate having a linear, branched or cyclic alkyl group, from 0.1 to 30 parts by weight of a compound containing a reactive functional group and from 0.01 to 30 parts by weight of a compound of the formula As a polymerization unit. In the present invention, the unit " parts by weight " means the weight ratio. By adjusting the weight ratio between the monomers as described above, it is possible to effectively maintain the physical properties such as the adhesive strength, durability and peel strength of the pressure-sensitive adhesive layer.

Such polymers in the present application may be prepared by conventional polymerization methods in this field, such as solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization Emulsion polymerization, and the like, preferably by a solution polymerization method. In the above, the polymer may exist in a crosslinked state in the pressure-sensitive adhesive layer.

In the present application, the polymer may be crosslinked by a multifunctional crosslinking agent. Such a crosslinking agent improves the cohesion of the resin cured product (pressure-sensitive adhesive) through the reaction with the polar functional group contained in the acrylic polymer, imparts a crosslinking structure, and controls the adhesive property.

In one example, the polymer in the pressure-sensitive adhesive layer may be crosslinked by at least one polyfunctional crosslinking agent selected from the group consisting of an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent and a metal chelate crosslinking agent, In consideration of the kind, one or more kinds of crosslinking agents can be appropriately selected.

Examples of the isocyanate crosslinking agent include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, tetramethylxylene diisocyanate, and naphthalene diisocyanate, Addition reaction product of an isocyanate compound and a polyol may be used. As the polyol, trimethylolpropane or the like may be used. Examples of the epoxy crosslinking agent include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylol propane triglycidyl ether, N, N, N ', N'-tetraglycidylethylenediamine or glycerin diglycidyl Ether and the like can be used. As the aziridine crosslinking agent, N, N'-toluene-2,4-bis (1-aziridine carboxamide), N, N'-diphenylmethane- , 4'-bis (1-aziridine carboxamide), triethylene melamine, bisisopropanoyl-1- (2-methylaziridine) or tri-1-aziridinylphosphine oxide But is not limited thereto. Examples of the metal chelate crosslinking agent include compounds in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium and / or vanadium is coordinated to acetylacetone or ethyl acetate or the like. But is not limited to. The multifunctional crosslinking agent may be contained in an amount of 0.01 to 10 parts by weight, 0.1 to 9 parts by weight, or 0.2 to 8 parts by weight based on 100 parts by weight of the polymer.

In one example, the polymer may have a weight average molecular weight of 500,000 or more, 550,000 or more, 600,000 or more, 650,000 or more, 700,000 or 800,000 or more, and the upper limit is not particularly limited. Less than one million, or less than or equal to 900,000. In this range, the durability and the adhesive property of the pressure-sensitive adhesive layer can be effectively controlled.

In one example, the above-mentioned N-heterocyclic compound is used in an amount of 0.001 to 30 parts by weight, 0.1 to 25 parts by weight, 1 to 20 parts by weight, 2 to 13 parts by weight, or 2 to 10 parts by weight, based on 100 parts by weight of the polymer . In this range, corrosion of the conductive electrode in direct contact with the pressure-sensitive adhesive layer can be effectively prevented. On the other hand, when it exceeds the above range, the adhesive property of the pressure-sensitive adhesive layer may be broken.

In one example, the conductive laminate may have a rate of resistance change represented by the following general formula (1) of 10% or less, 9% or less, or 8% or less. That is, the resistance change rate of the conductive electrode such as the ITO electrode can be minimized at high temperature and high humidity.

The resistance change rate? R can be expressed by the following general formula (1).

[Formula 1]

? R = [(RR _i ) / R _i ] x 100

In the general formula (1),? R denotes the rate of change in resistance, R _i denotes an initial resistance of the ITO electrode measured after attaching the pressure sensitive adhesive layer of the conductive laminate to the ITO electrode, Is the resistance of the ITO electrode measured after holding the ITO electrode at 85 캜 and 85% relative humidity for 240 hours. A specific method for measuring the resistance change rate as described above in the present application adopts the method described in the following embodiments. Further, the lower the numerical value of the rate of change of resistance, the more stable the driving of the touch panel to which the conductive laminate is applied, and the lower limit value is not limited.

In the pressure-sensitive adhesive layer of the present application, in addition to the above-mentioned components, a silane coupling agent; Tackifiers; Epoxy resin; Ultraviolet stabilizer; Antioxidants; Coloring agent; Reinforcing agents; Filler; Defoamer; A surfactant, a plasticizer, and the like may be further included.

In one example, the conductive laminate includes a base layer formed on the pressure-sensitive adhesive layer; And a conductive layer formed on the base layer.

In the present specification, the term " upper " or " lower " means the relative position of each layer constituting the conductive laminate. When constituting the conductive laminate in practice,

The type of the base layer included in the conductive laminate is not particularly limited, and for example, a glass base material or a plastic base material can be used. For example, the substrate layer may be formed of a material such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polyvinyl chloride film, Ethylene-propylene copolymer films, ethylene-ethyl acrylate copolymer films, ethylene-methyl acrylate copolymer films, and polyimide films.

In the present application, the thickness of the base layer is not particularly limited and may be suitably set as long as it can function as a conductive laminate. For example, the thickness of the substrate layer may be in the range of about 1 탆 to 500 탆, about 3 탆 to 300 탆, about 5 탆 to 250 탆, or about 10 탆 to 200 탆.

The base layer is not particularly limited, but may be subjected to appropriate bonding treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching treatment.

A conductive layer may be formed on one surface of the base layer of the conductive laminate of the present application.

The method of forming the conductive layer is not particularly limited, and may be formed by a conventional thin film forming method combining a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, And can usually be formed by a vacuum evaporation method or a sputtering method.

Examples of the material constituting the conductive layer include metal such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin or two or more alloys of the above metals, indium oxide, tin oxide, Metal oxides such as titanium oxide, cadmium oxide, or a mixture of two or more of them may be used, and the conductive layer may be a crystalline layer or an amorphous layer. In the present application, indium tin oxide (ITO) may be used among the materials constituting the conductive layer, but the present invention is not limited thereto.

The thickness of the conductive layer may be adjusted to about 10 nm to 300 nm, about 10 nm to 200 nm, or about 10 nm to 100 nm in consideration of the possibility of forming a continuous coating, conductivity, transparency, and the like.

The conductive layer of the present application may be formed on one surface of the base layer via an anchor layer or a dielectric layer, if necessary. The anchor layer or the dielectric layer improves the adhesion between the conductive layer and the base layer, and improves scratch resistance or flex resistance. The anchor layer or the dielectric layer may be formed of an inorganic material such as SiO ₂ , MgF ₂ or Al ₂ O ₃ ; A sputtering method, an ion plating method, or a coating method using an organic material such as an acrylic resin, a urethane resin, a melamine resin, an alkyd resin or a siloxane-based polymer, or a mixture of two or more of them. The anchor layer or the dielectric layer is usually formed to a thickness of about 100 nm or less, specifically 15 nm to 100 nm or 20 nm to 60 nm.

The present application is also directed to electronic devices. An exemplary electronic device may be a touch panel. That is, the present application relates to a touch panel including the conductive laminate described above. The touch panel may include the conductive laminate as an electrode plate for a touch panel, for example.

The touch panel may have a known structure including an electrostatic capacity type or a resistance film type as long as the touch panel includes the conductive laminated body. The conductive laminate can be used for forming various devices such as a touch panel or a liquid crystal display.

The present application also relates to a display device including the touch panel. The structure of the display device and the like can be applied as it is.

The present application provides a conductive laminate capable of effectively suppressing a change in resistance of the conductive electrode even when the pressure-sensitive adhesive layer is directly attached to the conductive electrode, thereby stably driving the touch panel for a long period of time.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a conductive laminate according to one example of the present application. Fig.

Hereinafter, the present invention will be described in more detail with reference to the following examples and comparative examples, but the scope of the present invention is not limited by the following examples.

Each physical property in this example was evaluated in the following manner.

1. Resistance change rate test

The measurement of the rate of change of resistance was carried out in the following manner. First, a commercially available polyethylene terephthalate film (hereinafter, referred to as " conductive PET ") having an ITO thin film formed on one side thereof was fired at 150 DEG C for one hour and cut into a size of 30 mm x 50 mm (width x length). Then silver paste was applied to both ends of the film so as to have a width of 10 mm and baked at 150 DEG C for 30 minutes. Subsequently, the conductive laminate produced in the following examples and the like was cut on the fired film to a size of 30 mm x 40 mm (width x length), and then the center of the pressure-sensitive adhesive layer was attached to the center of the conductive PET Of the pressure sensitive adhesive layer and the ITO thin film are brought into contact with each other). Then, using a conventional resistance measuring device to measure the initial resistance (R _i). After the initial resistance measurement, the ITO electrode to which the pressure-sensitive adhesive layer was adhered was allowed to stand at 85 DEG C and 85% relative humidity for 240 hours, and then the resistance (R) was measured by the same measuring machine, and each value was substituted into the following equation , And the rate of change in resistance (P) were measured.

[Equation 1]

P = [(RR _i ) / R _i ] x 100

2. Weight average molecular weight

The weight average molecular weight of the acrylic polymer was measured using GPC under the following conditions. For the preparation of the calibration curve, the measurement results were converted using standard polystyrene of the Agilent system.

<Conditions for measuring weight average molecular weight>

Meter: Agilent GPC (Agilent 1200 series, USA)

Column: Two PL Mixed B connections

Column temperature: 40 ° C

Eluent: tetrahydrofuran

Flow rate: 1.0 mL / min

Concentration: ~ 2 mg / mL (100 μL injection)

Polymer manufacture

Production Example 1. Preparation of Polymer (A)

50 parts by weight of 2-ethylhexyl acrylate (2-EHA), 40 parts by weight of methyl acrylate (MA), 2 parts by weight of 2-hydroxyethyl methacrylate 10 parts by weight of ethyl acrylate (2-HEA) and 5 parts by weight of RUVA (Otsuka Chemical) as a compound of the formula (6). Subsequently, 150 parts by weight of ethyl acetate (EAc) was poured into the reactor, nitrogen gas was purged for 60 minutes to remove oxygen, and azobisisobutyronitrile as a reaction initiator 0.0 &gt; AIBN) &lt; / RTI &gt;

Production Example 2. Preparation of Polymer (B)

, 40 parts by weight of 2-ethylhexyl acrylate (2-EHA), 32 parts by weight of methyl acrylate (MA) and 8 parts by weight of 2-hydroxyethyl acrylate (2-HEA) (B) was prepared in the same manner as in Preparation Example 1, except that 20 parts by weight of 4-acryloylmorpholine was added.

Production Example 3. Preparation of Polymer (C)

Except that 20 parts by weight of LA-82 (ADEKA, 1,2,2,6,6-pentamethyl-4-piperidinyl (meth) acrylate) was added as the compound of the formula (6) instead of 4-acryloylmorpholine. An acrylic polymer (C) was prepared in the same manner as in Production Example 2.

Preparation Example 4. Preparation of Polymer (D)

An acrylic polymer (D) was prepared in the same manner as in Preparation Example 1, except that RUVA was not added.

Production Example 5. Preparation of Polymer (E)

Acrylic polymer (E) was prepared in the same manner as in Preparation Example 1, except that 5 parts by weight of HEAA was added instead of RUVA.

Preparation Example 6. Preparation of Polymer (F)

Acrylic polymer (F) was prepared in the same manner as in Preparation Example 1, except that 5 parts by weight of n-VP was added instead of RUVA.

Example  One

A pressure-sensitive adhesive composition was prepared by uniformly mixing 0.25 part by weight (solid content) of a curing agent (BXX-5627) relative to 100 parts by weight (solid content) of the pressure-sensitive adhesive resin using the polymer obtained in Preparation Example 1 as an adhesive resin.

Example  2

A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1, except that the polymer (B) of Preparation Example 2 was used.

Example  3

A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1, except that the polymer (C) of Production Example 3 was used.

Comparative Example  One

A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1, except that the polymer (D) of Production Example 4 was used.

Comparative Example  2

A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1, except that the polymer (E) of Production Example 5 was used.

Comparative Example  3

A pressure-sensitive adhesive composition was prepared in the same manner as in Example 1, except that the polymer (F) of Preparation Example 6 was used.

Conductivity Of the laminate  Produce

On one surface of the PET film, the pressure-sensitive adhesive composition was releasably treated with silicone, and the pressure-sensitive adhesive composition thus prepared was coated thereon to a thickness of about 50 mu m and dried to form a pressure-sensitive adhesive layer. Thereafter, the pressure-sensitive adhesive layer was transferred to the opposite surface of a PET film (thickness: about 25 mu m) having an ITO layer formed on one surface thereof in a usual manner, and the PET film thus treated was peeled off to produce a conductive laminate.

The compositions of the above Examples and Comparative Examples are shown in Table 1 below.

division Example Comparative Example One 2 3 One 2 3 Acrylic polymer
( Weight portion ) EHA 50 40 40 50 50 50 MA 40 32 32 40 40 40 HEA 10 8 8 10 10 10 Initiator
( Weight portion ) AIBN 0.04 0.04 0.04 0.04 0.04 0.04 The compound of formula 5 or 6 RUVA 5 - - - - - Acryloylmorpholine - 20 - - - - LA -82 - - 20 - - - HEAA - - - - 5 - n- VP - - - - - 5 Hardener
( Weight portion ) BXX -5627 0.25 0.25 0.25 0.25 0.25 0.25 EHA  : Ethyl Hexyl Acrylate
MA : Methyl acrylate
HEA  : Hydroxyethyl acrylate
AIBN  : Azobisisobutyronitrile
HEAA : Hydroxyethyl Acrylamide
n- VP : Vinylpyrrolidone

The results of the resistance change rate test as measured in the above Examples and Comparative Examples are shown in Table 2 below.

division Example Comparative Example One 2 3 One 2 3 Rate of change in resistance (%) 7 8 9 11 13 12

As can be seen from Table 2, in the case of the pressure-sensitive adhesive layer of the present invention, the pressure-sensitive adhesive satisfying all the various physical properties required in the touch panel, in particular, the rate of change in resistance to ITO, and the double-sided pressure-sensitive adhesive tape using the same can be manufactured.

4: Conductive laminate
41: substrate layer
42: pressure-sensitive adhesive layer
43: conductive layer

Claims (16)

A pressure-sensitive adhesive layer comprising a polymer containing a compound of the following formula (6) as polymerized units; A base layer formed on the pressure-sensitive adhesive layer; And a conductive layer formed on the base layer,
[Chemical Formula 6]

Wherein R ₁₄ is hydrogen or an alkyl group, U is a single bond, an alkylene group or an alkylidene group, R ₁₅ is an alicyclic or aromatic ring structure having 3 to 20 ring members, Nitrogen or oxygen, said cyclic structure forming a monocyclic compound or a bicyclic compound, said cyclic structure may comprise one or more double bonds, and the carbon in said ring constituent atom is a carbon atom to form a carbonyl group And at least one hydrogen bonded to carbon or nitrogen in the ring atom may be substituted with an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an amino group, a hydroxyl group, a carboxyl group, a halogen or a benzotriazolyl group. The conductive laminate according to claim 1, wherein the polymer comprises a (meth) acrylic acid ester monomer as a polymerization unit. 3. The conductive laminate of claim 2, wherein the polymer further comprises, as polymerized units, a compound comprising at least one reactive functional group. The conductive laminate according to claim 3, wherein the compound containing a reactive functional group is a hydroxy group-containing compound or a carboxyl group-containing compound. The conductive laminate according to claim 3, wherein the polymer comprises 30 to 95 parts by weight of a (meth) acrylic acid ester monomer and 0.1 to 30 parts by weight of a compound containing a reactive functional group as polymerized units. The conductive laminate according to claim 1, wherein the polymer is present in a crosslinked state in the pressure-sensitive adhesive layer. The conductive laminate according to claim 1, wherein the polymer in the pressure-sensitive adhesive layer is crosslinked by at least one polyfunctional crosslinking agent selected from the group consisting of an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent and a metal chelate crosslinking agent. The conductive laminate according to claim 7, wherein the polyfunctional crosslinking agent is contained in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the polymer. The conductive laminate according to claim 1, wherein the polymer has a weight average molecular weight of 500,000 or more. The conductive laminate according to Claim 1, wherein the compound of Formula (6) is contained in an amount of 0.01 to 30 parts by weight based on 100 parts by weight of the polymer. delete The substrate according to claim 1, wherein the substrate layer is at least one selected from the group consisting of polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film, vinyl chloride copolymer film, polyurethane film, ethylene- Film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film, and a polyimide film. The conductive laminate according to claim 1, wherein the conductive layer is an indium tin oxide layer. The conductive laminate according to claim 1, wherein a resistance change rate (DELTA R) represented by the following general formula (1) is 10% or less:
[Formula 1]
? R = [(RR _i ) / R _i ] x 100
In the general formula (1),? R denotes the rate of change in resistance, R _i denotes an initial resistance of the ITO electrode measured after attaching the pressure sensitive adhesive layer of the conductive laminate to the ITO electrode, Is the resistance of the ITO electrode measured after holding the ITO electrode at 85 캜 and 85% relative humidity for 240 hours. A touch panel comprising the conductive laminate of claim 1. A display device comprising the touch panel of claim 15.

Images