KR101695948B1 - 기판처리 시스템 - Google Patents
기판처리 시스템 Download PDFInfo
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- KR101695948B1 KR101695948B1 KR1020150091108A KR20150091108A KR101695948B1 KR 101695948 B1 KR101695948 B1 KR 101695948B1 KR 1020150091108 A KR1020150091108 A KR 1020150091108A KR 20150091108 A KR20150091108 A KR 20150091108A KR 101695948 B1 KR101695948 B1 KR 101695948B1
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- substrate processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2 내지 도 4는 도 1의 기판처리 시스템의 사용 상태를 나타내는 측면도들이다.
도 5는 본 발명의 다른 실시예에 따른 기판처리 시스템을 나타내는 사시도이다.
도 6은 내지 도 8은 본 발명의 여러 실시예들에 따른 기판처리 시스템들을 나타내는 사시도들이다.
도 9는 도 8의 기판처리 장치의 프레임의 일례를 나타내는 사시도이다.
도 10은 본 발명의 또 다른 실시예에 따른 기판처리 시스템을 나타내는 사시도이다.
11: 챔버
20, 20-1, 20-2: 도어
30: 고정장치
40: 프레임
41: 수직 지지부재
42: 수평 지지부재
50: 하부 테이블
60: 웨이트
100, 110, 120: 기판처리 장치
1000, 1100, 1200, 1300, 1400, 1500: 기판처리 시스템
T: 소정 거리
L: 본체의 전후면 길이
Claims (10)
- 복수의 기판처리 장치를 순차적으로 적층한 기판처리 시스템으로서,
상기 기판처리 장치는,
기판처리 공간을 제공하는 챔버를 포함하는 본체; 및
상기 본체의 상하방향으로 이동가능하게 설치되어 상기 본체의 전면을 개폐하는 도어;
를 포함하고,
복수의 상기 기판처리 장치는, 하부층으로부터 상부층으로 갈수록 상기 본체의 전면 방향으로 소정 거리 시프팅(shifting)되면서 순차적으로 적층되며,
상기 소정 거리는, 상부에 위치하는 기판처리 장치의 도어가 하한점에 위치할 경우에, 하부에 위치하는 기판처리 장치의 본체의 전면 방향에서, 하부에 위치하는 상기 기판처리 장치의 도어와 이격될 수 있는 거리인 것을 특징으로 하는, 기판처리 시스템. - 삭제
- 제1항에 있어서,
상기 소정 거리의 값은,
상기 도어의 두께보다 크고, 상기 본체의 전후면 길이의 절반보다 작은 것을 특징으로 하는, 기판처리 시스템. - 제1항에 있어서,
상기 소정 거리만큼 시프팅 되어 적층되는 복수개의 상기 기판처리 장치를 지지할 수 있도록 형성되는 고정장치;
를 더 포함하는 기판처리 시스템. - 제1항에 있어서,
최하부에 설치되는 상기 기판처리 장치를 지지할 수 있도록 형성되는 하부 테이블;
을 더 포함하는, 기판처리 시스템. - 제1항에 있어서,
상기 소정 거리만큼 시프팅되어 적층되는 복수개의 상기 기판처리 장치를 지지할 수 있도록 형성되는 프레임;
을 더 포함하는, 기판처리 시스템. - 제6항에 있어서
상기 프레임은,
상기 기판처리 장치의 수직하중을 견딜 수 있도록 수직으로 형성되는 수직 지지부재; 및
서로 이웃하는 상기 수직 지지부재를 연결할 수 있도록 형성되는 수평 지지부재;
를 포함하는, 기판처리 시스템. - 제6항에 있어서
상기 프레임은,
상기 기판처리 장치와 상기 기판처리 장치 상부 또는 하부에 이웃하고 있는 기판처리 장치의 사이가 이격되어 적층될 수 있도록 형성되는 것인, 기판처리 시스템. - 제6항에 있어서,
상기 프레임은,
각각의 상기 기판처리 장치를 지지하는 각각의 세트로 분리가 가능한 것인, 기판처리 시스템. - 제6항에 있어서,
최하부에 설치되는 상기 기판처리 장치를 지지할 수 있도록 형성되는 하부 테이블; 및
상기 기판처리 장치를 수용하여 복수개의 단으로 적층된 상기 프레임이 붕괴되지 않도록 상기 하부 테이블에 형성되는 웨이트(weight);
를 더 포함하는, 기판처리 시스템.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020150091108A KR101695948B1 (ko) | 2015-06-26 | 2015-06-26 | 기판처리 시스템 |
CN201610458061.1A CN106298589B (zh) | 2015-06-26 | 2016-06-22 | 基板处理系统 |
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KR1020150091108A KR101695948B1 (ko) | 2015-06-26 | 2015-06-26 | 기판처리 시스템 |
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KR20170001309A KR20170001309A (ko) | 2017-01-04 |
KR101695948B1 true KR101695948B1 (ko) | 2017-01-13 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20210076560A (ko) * | 2019-12-16 | 2021-06-24 | 주식회사 원익아이피에스 | 기판처리 시스템 |
Families Citing this family (1)
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KR102810677B1 (ko) | 2021-11-18 | 2025-05-23 | 주식회사 원익아이피에스 | 게이트 밸브 조립체 |
Citations (3)
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JP2000005944A (ja) * | 1998-06-26 | 2000-01-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR100422467B1 (ko) * | 2001-05-09 | 2004-03-12 | 삼성전자주식회사 | 반도체장치 제조설비 |
JP2013093597A (ja) | 2004-12-22 | 2013-05-16 | Applied Materials Inc | 基板を処理するクラスタツールアーキテクチャ |
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TWI698944B (zh) * | 2013-12-23 | 2020-07-11 | 南韓商圓益Ips股份有限公司 | 批量式基板處理裝置 |
-
2015
- 2015-06-26 KR KR1020150091108A patent/KR101695948B1/ko active Active
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2016
- 2016-06-22 CN CN201610458061.1A patent/CN106298589B/zh active Active
Patent Citations (3)
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JP2000005944A (ja) * | 1998-06-26 | 2000-01-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR100422467B1 (ko) * | 2001-05-09 | 2004-03-12 | 삼성전자주식회사 | 반도체장치 제조설비 |
JP2013093597A (ja) | 2004-12-22 | 2013-05-16 | Applied Materials Inc | 基板を処理するクラスタツールアーキテクチャ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210076560A (ko) * | 2019-12-16 | 2021-06-24 | 주식회사 원익아이피에스 | 기판처리 시스템 |
KR102615294B1 (ko) | 2019-12-16 | 2023-12-19 | 주식회사 원익아이피에스 | 기판처리 시스템 |
Also Published As
Publication number | Publication date |
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CN106298589B (zh) | 2021-11-05 |
CN106298589A (zh) | 2017-01-04 |
KR20170001309A (ko) | 2017-01-04 |
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