KR101629866B1 - Spring Probe Pin of Inner Bridge Type - Google Patents

Abstract

According to the spring probe pin of the present invention, loss and distortion of an electric signal transmitted between electronic parts such as a semiconductor wafer, an LCD module, a semiconductor package, various sockets, and the like can be minimized, and an effect that a physical size can be minimized have.
The spring probe pin of the present invention includes: a first probe 500 having a first contact portion for electrical contact with the outside at one end and an insertion-type connection portion at the other end and formed in a plate-like shape; A second probe 600 having a second contact portion for electrical contact with the outside at one end, and two lead wires at the other end; And a spring (700) for applying a longitudinal elastic force to the first probe and the second probe in a state in which at least a part of the first probe and the second probe are interpolated, wherein the first probe ) Is inserted at least partly between two lead wires of the second probe, and the insertion type connecting portion and the two lead wires slide in a state of being in contact with each other.

Description

Inner bridge type spring probe pin {Spring Probe Pin of Inner Bridge Type}

The present invention relates to a spring probe pin, a so-called pogo pin. More particularly, the present invention relates to a spring probe pin for transmitting electrical signals between electronic components such as semiconductor wafers, LCD modules, semiconductor packages, various sockets, and the like.

The spring probe pin, aka Pogo Pin, is widely used for inspection equipment such as semiconductor wafers, LCD modules and semiconductor packages, various sockets, and battery connection parts for mobile phones.

1 is a cross-sectional view showing a conventional spring probe pin.

1, the spring probe pin 10 includes a spring 16 for applying an elastic force to the upper probe 12, the lower probe 14, the upper probe 12 and the lower probe 14, A cylindrical body 18 (also referred to as an "outer tube") that receives the lower end of the lower probe 14 and the upper end of the lower probe 14 and the spring 16.

One end of the upper probe 12 and the lower probe 14 are engaged with the cylindrical body 18,

It is prevented from escaping from the body 18 to the outside, and is subjected to elastic force by the spring 16.

2 is a cross-sectional view showing a plurality of spring probe pins 10 housed in the insulating body 20, illustrating a socket for inspecting a semiconductor package.

2, the semiconductor package inspection socket 30 includes a plurality of spring probe pins 10 and an insulating main body 20 which accommodates a plurality of spring probe pins 10 at predetermined intervals.

The plurality of spring probe pins 10 are accommodated in the insulating main body 20 such that the upper probe 12 protrudes from the upper surface of the insulating main body 20 and the lower probe 14 protrudes from the lower surface of the insulating main body 20. A plurality of spring probe pins 10 are received in the insulating body 20 at the same intervals as the external terminals 4 of the semiconductor package 2 contacting the upper probe 12. The lower probes 14 are arranged at the same intervals as the contact pads 8 of the test boat 6 located under the semiconductor package inspection socket 30.

The test board 6 is placed under the socket 30 for inspecting the semiconductor package and the semiconductor package 2 is placed on the socket 30 for inspecting the semiconductor package. When the semiconductor package 2 is pressed, the external terminals 4 of the semiconductor package 2 are brought into contact with the upper probe 12 of the spring probe pin 10 and the lower probe 14 is brought into contact with the contact of the test board 6 And is in contact with the pad 8. The upper probe 12 and the lower probe 14 are elastically supported to the upper and lower portions of the insulating main body 20 by the spring 16 in the spring probe pin 10, (2) and the test board (6).

However, as miniaturization, integration, and high performance of the semiconductor package have progressed, the size of the spring probe pin 10 for inspecting the semiconductor package has become smaller, and the size of the test socket using the spring probe pin 10 has also become smaller . The outer diameter of the spring probe pin 10 must be reduced as the distance between the external terminals 4 of the semiconductor package 2 becomes smaller. In the case of the highly integrated semiconductor package 2, the required outer diameter of the spring probe pin 10 may be 0.3 mm or less.

In order to realize high performance, electrical signal loss and distortion should be minimized in the process of transferring electrical signals between the semiconductor package and the test board. For this, the propagation path must be stable and the impedance on the propagation path must be minimized.

However, it is difficult to meet these requirements with a conventional spring probe pin. The path through the spring 16 becomes longer by the number of times the spring is wound, and since the spring has a relatively poor electrical characteristic, a large amount of unwanted impedance components are generated. Therefore, the path through the spring 16 is not suitable as a path for transmission of the electric signal.

Accordingly, the path of propagation of important electrical signals in the conventional spring probe pin 10 is a path through the upper probe 12, the cylindrical body 18, and the lower probe 14. However, the path through the cylindrical body 18 has other problems.

The upper probe 12 and the lower probe 14 must be freely movable up and down within the cylindrical body 18. Therefore, the outer diameters of the upper probe 12 and the lower probe 14 received in the cylindrical body 18 should be smaller than the cylindrical body 18. The electrical contact between the cylindrical body 18 and the upper probe 12 and the lower probe 14 may be incomplete in some cases and the contact resistance may significantly increase. Accordingly, there is a problem that the transmitted electric signal is lost or distorted. Particularly, when the electric signal needs to be transmitted at a high speed, such a problem becomes even more serious.

It is an object of the present invention to provide a spring probe pin capable of minimizing loss and distortion of electrical signals transmitted between electronic components such as semiconductor wafers, LCD modules, semiconductor packages, various sockets, and the like.

Another object of the present invention is to provide a spring probe pin in which the physical size can be minimized.

A spring probe pin according to one aspect of the present invention includes: a first probe having a first body part and a first connection part extending from the first body part and integrally formed with the first body part; A second probe having a second body portion and a second connection portion extending from the second body portion and integrally formed with the second body portion; And a spring for applying an elastic force to the first probe and the second probe in a state in which at least the first connection portion and the second connection portion of the first probe are inserted, And the first connection part and the second connection part are slid in contact with each other through the first connection part and the second connection part.

A spring probe pin according to an aspect of the present invention includes a first probe including a first body portion and a first connection portion extending in the longitudinal direction from the first body portion and integrally formed with the first body portion; A second probe including a second body portion and a second connection portion extending in a longitudinal direction from the second body portion and integrally formed with the second body portion; And a spring for applying a longitudinal elastic force to the first probe and the second probe in a state in which at least the first connection portion and the second connection portion of the first probe are inserted, Wherein the first connection portion includes at least two first connection legs, and a gap c between the two or more first connection legs in the longitudinal direction is electrically connected to the first connection portion through the first connection portion and the second connection portion, , Wherein the second connecting portion includes at least two second connecting legs, a gap (c) in the longitudinal direction between the at least two second connecting legs, and an inner side surface of the spring has at least a first connection And presses the leg and the side of the second connecting leg.

According to an aspect of the present invention, there is provided a spring probe pin, comprising: a first probe having a first contact portion for electrical contact with the outside at one end thereof and an insertion-type connection portion at the other end thereof; A second probe having a second contact portion for electrical contact with the outside at one end, and two lead wires at the other end; And a spring for applying an elastic force to the first probe and the second probe in the longitudinal direction in a state in which at least a part of the first probe and the second probe are interpolated, And at least a portion is inserted between two lead wires of the second probe, so that the insertion type connecting portion and the two lead wires slide in contact with each other.

According to an aspect of the present invention, since the upper probe and the lower probe are directly connected without passing through the conventional cylindrical body, electrical loss and distortion of the electric signal can be minimized.

According to an aspect of the present invention, as the loss and distortion of the electric signal are minimized, the stability and reliability of various electronic components to which the spring probe pin is applied are improved.

In addition, according to one aspect of the present invention, since the cylindrical body used in the conventional spring probe pin can be omitted, the outer diameter of the spring probe pin can be minimized.

In addition, according to one aspect of the present invention, since the outer diameter of the spring probe pin can be minimized, the spring probe pin can be used for highly integrated electronic parts.

In addition, according to one aspect of the present invention, since complicated processes for machining a cylindrical body can be omitted, high-speed mass production is possible, and the overall manufacturing cost can be reduced.

1 is a cross-sectional view showing a conventional spring probe pin.
2 is a cross-sectional view showing a plurality of spring probe pins 10 housed in the insulating body 20, illustrating a socket for inspecting a semiconductor package.
3 is a view showing the structure of a spring probe pin according to a first embodiment of the present invention.
FIG. 4 is a detailed view illustrating a structure of a first probe and a second probe of the spring probe pin according to the first embodiment of the present invention.
5 and 6 show only the connecting legs of the first probe 200 and the second probe 300 of the spring probe pin in detail, and FIG. 5 is a sectional view of the first probe 200 and the second probe 300 , And FIG. 6 is a top view. As shown in FIG.
7 is a cross-sectional view of a state where a pair of first connection legs 222 and a pair of second connection legs 322 are located inside the spring 400 according to the first embodiment of the present invention.
8 is a top view of the front end of the first connection leg 222 or the second connection leg 322 according to the first embodiment of the present invention viewed from above.
9A is an enlarged top view of a portion where a step is formed in the first probe 200 or the second probe 300 according to the first embodiment of the present invention. And a side view of the second connection leg 322. As shown in Fig.
10 is a view illustrating a structure of a spring probe pin according to a second embodiment of the present invention.
11 is a perspective view and a side view of a first probe according to a second embodiment of the present invention.
12 is a perspective view and a side view of a second probe according to a second embodiment of the present invention.
13 is a side view for explaining a state in which a first probe and a second probe according to a second embodiment of the present invention are coupled.
Fig. 14 is a view showing a modified example of the modification of the second embodiment.
15 is a view illustrating the structure of a spring probe pin according to a third embodiment of the present invention.
16 is a three-dimensional view of the first probe according to the third embodiment of the present invention.
17 is a three-dimensional view of a second probe according to the third embodiment of the present invention.
18 is a cross-sectional view of the second probe 600 in the spring probe pin according to the third embodiment.
19 and 20 are side views for explaining a state in which a first probe and a second probe according to a third embodiment of the present invention are combined.
FIG. 21 is a view showing a structure of a spring probe pin according to a fourth embodiment of the present invention, and FIG. 22 is a view showing first probes in a spring probe pin according to a fourth embodiment of the present invention.
23 is a view showing another embodiment of the latch in the fourth embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention in the drawings, parts not related to the description are omitted, and similar names and reference numerals are used for similar parts throughout the specification.

In the prior art, although the upper probe 12 and the lower probe 16 are electrically connected to each other through the cylindrical body 18, the present invention uses a bridge located inside the spring without using the conventional cylindrical body 18 Thereby forming an electrical path. The electrical bridge inside these springs is called 'Inner Bridge'.

1. First Example

3 is a view showing the structure of a spring probe pin according to a first embodiment of the present invention.

The spring probe pin 100 according to the first embodiment of the present invention includes a first probe 200, a second probe 300, and a spring 400. The first probe 200 and the second probe 300 correspond to the upper probe and the lower probe respectively, or correspond to the lower probe and the upper probe, respectively, and the order thereof is not important.

The first contact portion 201 and the second contact portion 301 of the first probe 200 and the second probe 300 are electrically connected to external terminals of the semiconductor package, terminals of the LCD panel, terminals of the circuit board, terminals of the battery, Or a pad of the test substrate.

The spring 400 is in a state in which a part of the first probe 200 and the second probe 300 are inserted inward, that is, a state in which they are interpolated. The spring 400 applies an elastic force to the first probe 200 and the second probe 300 in the longitudinal direction.

The first probe 200 and the second probe 300 slide in contact with each other. Thus, the electrical signal is transmitted directly from the first probe 200 to the second probe 300, or from the second probe 300 to the first probe 200 directly. In the conventional spring probe pin 10 shown in FIG. 1, an electric signal is transmitted through the cylindrical body 18 between the upper probe 12 and the lower probe 14. However, in the first embodiment of the present invention, An electric signal is directly transmitted between the probe 200 and the second probe 300.

FIG. 4 is a detailed view illustrating a structure of a first probe and a second probe of the spring probe pin according to the first embodiment of the present invention.

5 and 6 show only the connecting legs of the first probe 200 and the second probe 300 of the spring probe pin in detail, and FIG. 5 is a sectional view of the first probe 200 and the second probe 300 , And FIG. 6 is a top view. As shown in FIG.

The first probe 200 and the second probe 300 are in a dual relation with each other and may or may not have completely the same structure. The description of the first probe 200 may be common to the description of the second probe 300, unless otherwise specified below. Therefore, the description of the second probe 300 may be omitted.

The first probe 200 includes a first body portion 210 and a first connection portion 220 and the second probe 300 includes a second body portion 310 and a second connection portion 320.

The first body part 210 forms a skeleton of the first probe 200 and the first connection part 220 is integrally formed with the first body part 210 and extends from the first body part 210.

The first probe 200 and the second probe 300 are electrically connected to each other through the first connection part 220 and the second connection part 320. The first connection part 220 and the second connection part 320 are electrically connected to each other Slides in the contacted state, and surface contact is possible.

The first connection part 220 includes a first connection leg 222 extending in the longitudinal direction from the first body part 210 and may include one or more connection legs 222.

The second connection portion 320 includes a second connection leg 322 extending in the longitudinal direction from the second body portion 310 and may include one or more connection legs 222.

The first connection leg 222 extends in the longitudinal direction from the first body 210 after forming a step with respect to the first body 210. The first connection leg 222 is bent at the first bending point 223 and the second bending point 224.

The second connection legs 322 extend in the longitudinal direction from the second body portion 310 and form a step with respect to the second body portion 310 and then extend. The second connection leg 322 is bent at the third bending point 323 and the fourth bending point 324.

The first connection leg 222 and the second connection leg 322 are bent at the first bending point 223, the second bending point 224, the third bending point 323 and the fourth bending point 324, The first body portion 210 and the second body portion 220 have stepped portions. The step may be formed only for the first body part 210 or the second body part 310 as needed.

The first connection part 220 and the second connection part 320 slide in contact with each other. The first connection leg 222 of the first connection part 220 and the second connection leg 322 of the second connection part 320 are overlapped with each other and slide in contact with each other. 4, a pair of first connection legs 222 are under the pair of second connection legs 322 and slide in this state.

The sliding surfaces where the first connecting legs 222 and the second connecting legs 322 are in contact with each other are in opposite directions. The sliding surface of the first connecting leg 222 is directed to the upper end of the figure in FIG. 5, and the sliding surface of the second connecting leg 322 is directed to the lower end of the drawing in FIG.

The first body part 210 includes a first body 218, a first stopper 215, and a first hook 216.

The first body 218 is a skeleton of the first probe 200. The first stopper 215 protrudes from the first body 218 and the spring 400 is released to the outside of the first probe 200 And the shapes of the jaws can be variously adopted for the purpose of preventing the spring from coming off. The first hook 216 prevents the spring 400 from falling in the direction of the first connection part 220. When the spring 400 is coupled to the first body 210, the end of the spring 400 is pushed in and the first stopper 215 passes through the first stopper 215 and the first stopper 216 The end of the spring 400 is limited in position between the first stopper 215 and the first latch 216. In this case, Since the second body part 310 has the same structure as the first body part 210, a duplicated description will be omitted.

5, the first connection leg 222 and the second connection leg 322 extend in the longitudinal direction at an acute angle (b) with respect to the horizontal plane when they extend in the longitudinal direction. Thus, the point a of the first connecting leg 222 is the lowest one of the first sliding surfaces 227 of the first connecting leg 222. Starting from this position, the first connection leg 222 has a shape gradually rising. Here, the angle b may be larger before the first connection leg 222 and the second connection leg 322 are coupled to each other and before it is coupled. Thus, after the first connection leg 222 and the second connection leg 322 are coupled, the first connection leg 222 and the second connection leg 322 press together. The angle b may be formed on either or both of the first connection leg 222 and the second connection leg 322.

7 is a cross-sectional view of a state where a pair of first connection legs 222 and a pair of second connection legs 322 are located inside the spring 400 according to the first embodiment of the present invention.

A gap (c) is formed between the pair of first connection legs (222), and the gap extends in the longitudinal direction like the first connection legs (222). A gap c is also formed between the pair of second connection legs 322 and the gap extends in the longitudinal direction like the second connection leg 322 also.

7, the inner side surface 401 of the spring 400 and the first connection leg 222 and the second connection leg 322 are in contact with each other. The maximum outer diameter of the cross section of the first connection leg 222 and the second connection leg 322 when assembling the first connection leg 222 and the second connection leg 322 is larger than the inner diameter of the spring 400 Are made equal or larger. The inner side surface 401 of the spring is connected to the first connection leg 222 by the elastic force of the first connection leg 222 and the second connection leg 322 having the gap c and the elastic force of the spring 400, And the side of the second connection leg 322. The inner side surface 401 of the spring 400 and the first connection leg 222 and the second connection leg 322 are in contact with each other under pressure.

This pressurization results in the application of pressure to the contact surface between the first connection leg 222 and the second connection leg 322 and the electrical connection between the first connection leg 222 and the second connection leg 322 Make contact more secure.

8 is a top view of the front end of the first connection leg 222 or the second connection leg 322 according to the first embodiment of the present invention viewed from above.

The tip of the first connection leg 222 or the second connection leg 322 according to the first embodiment has an acute inclined portion d. The inclined portion d can be formed by pressing when the spring probe pin 100 is manufactured in the stamping process and the first connection leg 222 and the second connection leg 322 can be formed in the inside of the spring 400 Thereby minimizing the latching phenomenon.

9A is an enlarged top view of a portion where a step is formed in the first probe 200 or the second probe 300 according to the first embodiment of the present invention. And a side view of the second connection leg 322. As shown in Fig.

The portion where the step is formed in the first probe 200 or the second probe 300 is narrowed by narrowing the width. That is, the portion where the first bending point 223 and the second bending point 224, or the third bending point 323 or the fourth bending point 324 are formed is narrowed by narrowing the width.

By narrowing the width, the bending height can be increased in a limited space and the structure is made flexible, so that the connecting legs 222 and 322 are advantageously pressed against each other.

On the other hand, the tip end of the first connection leg 222 and the second connection leg 322 has an acute inclined portion e. The inclined portion e smoothly slides when the first connection leg 222 and the second connection leg 322 face each other at the time of assembling.

2. The second Example

10 is a view illustrating a structure of a spring probe pin according to a second embodiment of the present invention.

The spring probe pin 800 according to the second embodiment of the present invention includes a first probe 900, a second probe 1000, and a spring 1100. The first probe 900 and the second probe 1000 correspond to the upper probe and the lower probe, or correspond to the lower probe and the upper probe, the order of which is not critical. However, in the following description, the first probe 900 corresponds to the upper probe and the second probe 1000 corresponds to the lower probe.

The spring 1100 functions to apply an elastic force to the first probe 900 and the second probe 1000 in the longitudinal direction by interpolating a portion of the first probe 900 and the second probe 1000.

11 is a perspective view and a side view of a first probe according to a second embodiment of the present invention.

The first probe 900 according to the second embodiment of the present invention serves as an upper probe or a lower probe of the spring probe pin, and is implemented as a plate-like plate.

To this end, the first probe 900 includes a first contact 910, a first stopper 920, a first hook 930, and an insertable connection 940. A first contact portion 910 is formed at one end of the first probe 900 and an insertion-type connection portion 940 is provided at the opposite end.

As an embodiment of the present invention, the thickness of the first contact portion 910 and the first stopper 920 portion may be made thicker than other portions of the first probe 900. In other words, a portion of the plate material is squeezed to reduce the thickness of the plate material, and then other portions of the first probe 900 are formed in a portion where the thickness of the plate material is reduced. The first contact portion 910 and the first stopper 920, When the parts are formed, a section of two thicknesses can be realized in one plate material.

The first contact portion 910 and the first stopper portion 920 receive the load repeatedly in the vertical direction and at the same time the sectional area of the first contact portion 910 is increased so that the load per unit area is reduced, To help reduce the size of the product.

Further, other portions of the first probe 900 are not burdened with a vertical load, but are located in a very narrow inner space of the spring 1100, so that it is possible to reduce the thickness to a certain extent.

12 is a perspective view and a side view of a second probe according to a second embodiment of the present invention.

'자형 등 일측이 2개로 구현된 여러 형태가 가능하다.The second probe 1000 according to the second embodiment of the present invention serves as a lower probe or an upper probe of the spring probe pin and is formed in a U shape. In this case, the second probe 1000 is not limited to the U-shape, but may be a V-shaped, a Y-shaped,

It is possible to have various shapes such as 'shape', one side being implemented as two.

The second probe 1000 includes a second contact portion 1010, a second stopper 1020, a second hanging portion 1030 and a prismatic lead wire 1040 having two pieces. In Fig. 12, the second stopper 1020 and the second hangers 1030 are each provided with two pieces. A second contact portion 1010 is formed at one end of the second probe 1000 and a prismatic lead wire 1040 is formed at the other end of the second probe 1000. "Square" refers to the point where the lead wire forms a square section.

The two-prismatic lead wire 1040 is a portion into which the insertion type connecting portion 940 of the first probe 900 is inserted when the first probe 900 is coupled.

The first contact portion 910 of the first probe 900 and the second contact portion 1010 of the second probe 1000 are electrically connected to external terminals of the semiconductor package, terminals of the LCD panel, terminals of the circuit board, terminals of the battery, Such as a pad of a test board or a pad of a test board.

The first stopper 920 prevents the distal end of the spring 1100 from being released to the outside of the first probe 900 and the first spring 930 prevents the end of the spring 1100 from moving toward the insertion- Thereby preventing it from falling out. The first stopper 920 and the first hook 930 position the one end of the spring 1100 between the first stopper 920 and the first hook 930. The first stopper 920 and the first latch 930 are protruded from the body of the first probe 900. In addition, the first hook 930 is formed with an inclined surface so that the spring 1100 can easily enter when the spring 1100 is assembled.

The second stopper 1020 prevents the end of the spring 1100 from being released to the outside of the second probe 1000 and the second spring 1030 prevents the end of the spring 1100 from moving toward the leash line 1040 Thereby preventing it from falling out. The second stopper 1020 and the second spring 1030 allow the spring 1100 to be positioned between the second stopper 1020 and the second spring 1030. The second stopper 1020 and the second protrusion 1030 are protruded from the body of the second probe 1000. In addition, the second hook 1030 is formed with an inclined surface so that the spring 1100 can easily enter when the spring 1100 is assembled.

At this time, when the outer dimension of the first hanging part 930 or the second hanging part 1030 is larger than the inner diameter of the spring 1100 and the entry of the spring 1100 is difficult, the circular end surface of the spring 1100 is pressed into an oval shape Or two opposite second hangers 1030 are pressed from the outside to enter the interior of the spring 1100 in a state in which the interval between the second hangers 1030 is narrowed and then the first hangers 930 or The spring 1100 can be fixed to the first hanging part 930 or the second hanging part 1010 by engaging the second hanging part 1030 and removing the pressing. Accordingly, one end of the spring 1100 is positioned between the first stopper 920 and the first hangers 930, and the opposite end is positioned between the second stopper 1020 and the second hangers 1030 .

13 is a side view for explaining a state in which a first probe and a second probe according to a second embodiment of the present invention are coupled.

In the spring probe pin according to the second embodiment of the present invention, the first probe 900 and the second probe 1000 are elastically supported by the spring 1100 while being positioned at both ends of the spring 1100. At this time, the insertion type connecting portion 940 of the first probe 900 is inserted between the prismatic lead wires 1040 of the second probe 1000, and the first probe 900 and the second probe 900, 2 probe 1000 are relatively free to move in the longitudinal direction.

The gap between the lead wires 1040 in the second probe 1000 is made smaller than the thickness of the insertable connection portion 940 in the first probe 900 when the second probe 1000 is manufactured by continuous stamping. The two prismatic lead wires 1040 implemented in the second probe 1000 are implemented as opposed to each other and elastically press the insertable connection portion 940 of the inserted first probe 900 on both sides. Accordingly, the electrical connection between the first probe 900 and the second probe 1000 can be maintained constant.

Since the insertion type connecting portion 940 of the first probe 900 is in sliding contact with the two lead wires 1040 of the second probe 1000, the electric signal is transmitted through the insertion type connecting portion 940 of the first probe 900 To the lead wire 1040 of the second probe 1000 or from the lead wire 1040 of the second probe 1000 to the insertable connection 940 of the first probe 900.

On the other hand, there is an improved method in which the two lead wires 1040 press the insertable connection portion 940. The maximum outer diameter of the cross section of a portion of the second probe 1000 located inside the spring 1100 is made larger than the inner diameter of the spring and enters the inside of the spring 1100 in a pressed state and then removes the pressing. Specifically, the maximum outer diameter of the cross section occupied by the two lead wires 940 in a part or the entire section of the lead wire 940 is made larger than the inner diameter of the spring 1100, the wire is pushed into the inside of the spring 1100, Remove. Or the distal end of the spring 1100 is positioned, the maximum outer diameter of the end surface of the second probe 1000 is made larger than the inner diameter of the spring, and the spring 1100 enters the inside of the spring 1100 in a pressed state. For example, the portion between the second stopper 1020 and the second hook 1030 can be configured as described above.

Accordingly, the spring 1100 can further push the lead wire 1040 inwardly thereof, and the lead wire 1040 can increase the force pressing the insertable connection portion 940. Such a method can be similarly applied to the third and fourth embodiments described later. Accordingly, a detailed description of the third and fourth embodiments will be omitted.

Fig. 14 is a view showing a modified example of the modification of the second embodiment.

The spring probe pin of FIG. 14 is further characterized in that a protruding contact 1050 protruding from the spring probe pin of FIGS. 10 to 13 to the lower end of the second contact portion 1010 is further formed. The protruding contact 1050 is a component for electrical contact with an electronic element or a contact pad, and can be easily formed by a method such as press working.

3. Third Example

15 is a view illustrating the structure of a spring probe pin according to a third embodiment of the present invention.

The third embodiment of the present invention is very similar to the second embodiment. The spring probe pin according to the third embodiment of the present invention includes a first probe 500, a second probe 600, and a spring 700. The first probe 500 and the second probe 600 correspond to the upper probe and the lower probe, or correspond to the lower probe and the upper probe, the order of which is not critical. However, in the following description, the first probe 500 corresponds to the upper probe, and the second probe 600 corresponds to the lower probe.

The spring 700 performs a function of applying an elastic force to the first probe 500 and the second probe 600 in the longitudinal direction by interpolating a portion of the first probe 500 and the second probe 600.

16 is a perspective view of a first probe according to a third embodiment of the present invention.

The first probe 500 according to the third embodiment of the present invention acts as an upper probe or a lower probe of a spring probe pin, and is realized as a plate-like plate.

To this end, the first probe 500 includes a first contact portion 504, a first stopper 503, a first hanging portion 502, and an insertion type connecting portion 501. At this time, a first contact portion 504 is implemented at one end of the first probe 500, and an insertion-type connection portion 501 is implemented at the opposite side. The first hangers 502 include a first hanging surface 505 and a first hanging jaw 508. The distal end of the insertion-type connecting portion 501 is compressed and has an acute-angled shape. This facilitates the insertion of the insertion-type connecting portion 501 between the two lead wires 601.

17 is a perspective view of a second probe according to a third embodiment of the present invention.

'자형 등 일측이 2개로 구현된 여러 형태가 가능하다.The second probe 600 according to the third embodiment of the present invention serves as a lower probe or an upper probe of the spring probe pin, and is implemented in a U shape. At this time, the second probe 600 is not limited to the U-shape, but may be a V-shaped, a Y-shaped,

It is possible to have various shapes such as 'shape', one side being implemented as two.

The second probe 600 includes a second contact portion 604, a second stopper 603, a second hanging portion 602 and a prismatic lead wire 601 of two pieces. Here, the second stopper 603 and the second hangers 602 may be implemented in two, respectively. At this time, a second contact portion 604 is implemented at one end of the second probe 600, and a prismatic lead wire 601 having two pieces at the opposite side is implemented. "Square" means that the cross section of the lead wire is square.

The two-prismatic lead wire 601 is a portion into which the insertion type connecting portion 501 of the first probe 900 is inserted when the first probe 500 is coupled.

The first contact portion 504 of the first probe 500 and the second contact portion 604 of the second probe 600 are electrically connected to external terminals of the semiconductor package, terminals of the LCD panel, terminals of the circuit board, terminals of the battery, Such as a pad of a test board or a pad of a test board.

The first stopper 502 prevents the spring 700 from falling in the direction of the insertable connection 501 and the first stopper 503 prevents the spring 700 from being released to the outside of the first probe 500 . The distal end of the spring 700 is positioned between the first stopper 503 and the first latch 502 by the first latch 502 and the first latch 503.

The second stopper 602 prevents the spring 700 from falling in the direction of the prismatic lead wire 601 and the second stopper 603 prevents the spring 700 from being released to the outside of the second probe 600 do. The distal end portion of the spring 700 is positioned between the second stopper 603 and the second spring 602 by the second and second stoppers 602 and 603. For this, the second stopper 603 and the second protrusion 602 are protruded from the body of the second probe 600.

A first opening face 505 is formed in the first opening 502 and a second opening face 605 is formed in the second opening 602. When the spring 700 is assembled by the inclined face, ) Can easily enter.

If the outer diameter of the first or second hanging member 502 or 602 is significantly larger than the inner diameter of the spring 700 and the entry of the spring 700 is difficult, the distal end circular section of the spring 700 is pressed in an oval shape The first and second hooks 602 and 604 are pressed from the outside to enter the inside of the spring 700 while narrowing the interval between the second hooks 602, The spring 700 can be fixed to the first latching portion 502 or the second latching portion 602. The spring 700 can be fixed to the first latching portion 502 or the second latching portion 602. [ Accordingly, one end of the spring 700 is positioned between the first stopper 503 and the first hangers 502, and the opposite end is positioned between the second stopper 603 and the second hangers 602 .

And the gap formed between the two rectangular lead wires 601 is bent to be smaller than the thickness of the insertion-type connecting portion 501. It is intended to ensure contact between the lead wire 601 and the insertion type connecting portion 501 by opening a small gap when the insertion type connecting portion 501 enters the clearance between the lead wires 201. [

18 is a cross-sectional view of the second probe 600 in the spring probe pin according to the third embodiment.

The distal end of the lead wire 601 of the second probe 600 is formed to have an acute angle by pressing or the like so that the insertion type connecting portion 501 of the first probe 500 can easily enter the lead wire 601 .

The lead wire 601 of the second probe 600 includes a mosquito lamp 209 having a back-like shape of the mosquito. The inner space of the spring 700 is narrow in a state in which the second probe 600 is inserted into the spring 700 so that the inner surface of the spring 700 receives the pressure in the direction of the arrow.

The mosquito lamp 209 has elasticity and flexibility and the degree of bending of the mosquito lamp 209 is increased or decreased in the elastic range according to the degree of pressure externally applied .

The second probe 600 can be inserted into the spring 400 even if the spring 700 is somewhat larger or smaller within the tolerance range and also the two lead wires 601 are resiliently connected to the insertion- So that a reliable electrical contact is established.

In Fig. 18, the mosquito lamp 609 is formed on only one lead wire 601, but it may be formed on both lead wires 601. [ In addition, in the example of Fig. 18, the degree of bending of the mosquito light 608 is remarkable, but a finely curved shape is also possible.

Stable transmission of the electric signal is further ensured by the above-described configurations.

19 and 20 are side views for explaining a state in which a first probe and a second probe according to a third embodiment of the present invention are combined.

In the spring probe pin according to the third embodiment of the present invention, the first probe 500 and the second probe 600 are elastically supported by the spring 700 while being positioned at both ends of the spring 700. At this time, the insertion type connection portion 501 of the first probe 500 is inserted between the lead wires 601 of the second probe 600, and the first probe 500 and the second probe 500 Each probe 600 moves freely in the longitudinal direction.

At this time, the prismatic lead wires 601 of the two probes 600 embodied in the second probe 600 are embodied as opposed to each other, and the insertion type connecting portion 501 of the inserted first probe 500 is elastically pressed do. Accordingly, the electrical connection between the first probe 500 and the second probe 600 can be maintained constant.

Since the insertion type connection portion 501 of the first probe 500 is in sliding contact with the lead wire 601 of the second probe 600 so that the electric signal is transmitted from the insertion type connection portion 501 of the first probe 500 Is directly transmitted to the two lead wires 601 of the second probe 600 or to the insertion type connection portion 501 of the first probe 500 from the two lead wires 601 of the second probe 1000.

4. Fourth Example

FIG. 21 is a view showing a structure of a spring probe pin according to a fourth embodiment of the present invention, and FIG. 22 is a view showing first probes in a spring probe pin according to a fourth embodiment of the present invention.

The spring probe pin according to the fourth embodiment of the present invention includes a first probe 1300 and a second probe 1400 and a first probe 1300 and a second probe 1400 that apply an elastic force in the longitudinal direction to the first probe 1300 and the second probe 1400 And a spring (not shown).

The first probe 1300 includes a first contact portion 1310, a first stopper 1320 and an insertion type connection portion 1330. The second probe 1400 includes a second contact portion 1410, a second stopper 1420, And a two-prismatic lead wire 1430.

The first contact portion 1310 and the second contact portion 1410 are contacted with an external terminal of a semiconductor package, a terminal of an LCD panel, a terminal of a circuit board, a terminal of a battery, a pad of a semiconductor wafer, The one stopper 1320 and the second stopper 1420 are portions for preventing the spring from coming out to the outside.

In the second probe 1400 according to the fourth embodiment of the present invention, an end portion of the lead wire 1430 is formed with a latch 1440 protruding inward. The pawl 1440 is used to prevent the first probe 1300 and the second probe 1400 from escaping as they move in the longitudinal direction. To this end, the latch 1440 is inserted into the latching groove 1340, which is embodied in the first probe 1300, during assembly.

The first probe 1300 according to the fourth embodiment of the present invention is provided with a latching groove 1340 and a latching jaw 1350. The latching groove 1340 provides a space through which the latch 1440 of the second probe 1400 can move in the longitudinal direction and the latching jaw 1350 prevents the latch 1440 from being disengaged from the latching groove 1340 do.

As the first probe 1300 and the second probe 1400 are fastened together, the first probe 1300 and the second probe 1400 can move freely in the longitudinal direction and maintain a constant contact.

Since the insertion type connection portion 1330 of the first probe 1300 is slid in contact with the lead wire 1430 of the second probe 1400, the electric signal is transmitted from the insertion type connection portion 1330 of the first probe 1300 Is directly transmitted to the two lead wires 1430 of the second probe 1400 or from the two lead wires 1430 of the second probe 1400 to the insertable connection 1330 of the first probe 1300. [

23 is a view showing another embodiment of the latch in the fourth embodiment.

The latch 1440 shown in Fig. 21 has a stepped shape, while the latch 1450 shown in Fig. 23 has a rounded shape by a pressing process.

5 . A method of manufacturing a spring probe pin according to the present invention

The above-mentioned spring probe pin according to the present invention can be manufactured by processing a metal plate material. The first and second probes can be manufactured through a process of processing a metal plate material by continuous stamping composed of stamping, bending, and the like, and then performing heat treatment and plating. Here, the heat treatment or plating may be performed before the punching and bending process.

Particularly, in the second to third embodiments, the second probe forms a U-shaped metal plate by bending the metal plate 180 degrees in total. On the other hand, in the fourth embodiment, the second probe makes a second probe immediately by tapping a metal plate material having a certain thickness. That is, it does not bend and make it into the form of 'U', but it is made by directly punching it to have the shape of 'U'.

When the first probe and the second probe are obtained, one end of the spring is assembled so as to be positioned between the second stopper and the second spacer of the second probe. At this time, if one end of the spring is pressed and passed through the second probe of the second probe, the assembly can be more easily assembled.

Then, the first probe is engaged with the second probe and the spring assembled. Specifically, the first connection part of the first probe and the second connection part of the second probe are combined (first embodiment), or the insertion type connection part of the first probe is inserted between the two lead wires of the second probe to be coupled Examples 4 to 4). And the opposite end of the spring is fixed between the first stopper and the first latch of the first probe. At this time, if the opposite end of the spring is pressed and passed through the first protrusion of the first probe, the assembly can be more easily assembled.

In forming the inner bridge type spring probe pin according to the present invention, each of the first probe and the second probe may be formed of one metal plate material.

According to the embodiment of the present invention, the first probe and the second probe have predetermined elongation properties in the bending process step, can increase elasticity and strength through heat treatment, and have a small electrical resistance. Accordingly, beryllium copper alloys are preferred, especially ASTMC 17200, a beryllium copper 25 alloy, but other materials that meet mechanical and electrical requirements may also be used.

As the plating material, a material having a low electrical resistance such as gold may be used, and a heat treatment such as annealing, normalizing, quenching, tempering, or the like may be used.

It is advantageous to use a spring material having a very high elastic strength, tensile strength and fatigue strength. At this time, the electrical resistance need not be low. The material of the spring is preferably spring steel or stainless steel, but other materials satisfying the mechanical requirements can also be used.

In the present invention, the first probe and the second probe are resiliently supported by a spring and have a kinematic characteristic capable of being moved in the longitudinal direction in accordance with a load applied from the outside.

In addition, the first connection portion and the second connection portion, or the insertion-type connection portion and the two lead wires can freely move and stably transmit the electric signal through the contact maintained even when the position is changed, thereby minimizing the loss and distortion of the electric signal So that it can be adopted for high integration and high frequency circuit applications.

In addition, according to the present invention, the cylindrical body used in the conventional spring probe pin can be omitted. The cylindrical body used in conventional spring probe pins requires a thickness of 0.05 mm or more. In addition, 0.015 mm is required as the clearance required between the cylindrical body and the spring. In the conventional spring probe pin, a space of 0.13 mm, which is 0.1 mm corresponding to twice the thickness of the cylindrical body and 0.03 mm corresponding to twice the clearance, is consumed in the cylindrical body and the clearance. For example, when making a spring probe pin having a 0.3 mm outer diameter used in a highly integrated semiconductor device, the present invention can reduce the outer diameter of the spring probe pin by 0.13 mm, which means a reduction of 43% in the entire outer diameter do. According to the present invention, since the conventional cylindrical body and the clearance can be omitted, there is an effect that the outer diameter of the spring probe pin used in the highly integrated semiconductor device can be drastically reduced.

Further, in the conventional spring probe pin manufacturing process, since the process of processing the cylindrical body is very difficult, the unit cost of assembling the parts in the cylindrical body is very high. However, in the spring probe pin according to the present invention, since the cylindrical body is omitted, it is not necessary to assemble other parts in the cylindrical body, and the cost for the manufacturing process is increased, so that the overall production cost is greatly reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

200, 500, 900, 1300: first probe
300, 600, 1000, 1400: Second probe
400, 700, 1100: spring
210: first body part 310: second body part
220: first connection part 320: second connection part
504, 910, 1310: first contact portions 604, 1010, 1410:
502, 930: first hangers 602, 1030: second hangers
503, 920, 1320: first stoppers 603, 1020, 1420: second stoppers
501, 940, 1330: insertion type connection portions 601, 1040, 1430: lead wires

Claims (8)

In the spring probe pin,
A first probe having an insertion-type connection portion formed in at least a plate-like plate shape;
A second probe having at least two lead wires facing each other and the insertion type connection portion being inserted between the two lead wires and electrically connected to the first probe;
And a spring for applying an elastic force to the first probe and the second probe in the longitudinal direction in a state in which at least a part of the first probe and the second probe are inserted,
The second probe including the two leads may be a metal plate having a U-shape, a V-shape, a Y-shape,

Shaped spring.
The method according to claim 1,
Wherein the distal end of the spring on the second probe side urges the two lead wires inward and increases the force that the two lead wires press against the insertable connection.
The method according to claim 1,
Wherein the first probe comprises:
A first stopper protruding from the first probe and a first protrusion so as to limit the position of one end of the spring to be between the first stopper and the first protrusion,
Wherein the second probe comprises:
And a second stopper protruding from the second probe and a second stopper to restrict a position of the other end of the spring to be between the second stopper and the second stopper,
Wherein the spring probe pin is a spring.
The method of claim 3,
Wherein an outer dimension of the first and second hangers is larger than an inner diameter of the spring.
The method according to claim 1,
Wherein the opposite ends of the two leads in the second probe are second contact portions for electrical contact with the outside and protruding contacts protruded by press working are formed in the second contact portions.
A first probe having an insertion-type connection portion formed in at least a plate-like plate shape; A second probe having at least two lead wires facing each other and the insertion type connection portion being inserted between the two lead wires and electrically connected to the first probe; And a spring for applying an elastic force to the first probe and the second probe in the longitudinal direction,
A first step of producing at least the first probe by tapping at least a metal plate material;
At least a metal plate material is punched out, and a "U" shape, a "V" shape, a "Y" shape,

A second step of bending the second probe to form the second probe;
And a third step of coupling the first probe, the second probe, and the spring to each other.
The method of claim 6,
In the second step,
Wherein the second probe is manufactured such that a maximum outer diameter of a cross section occupied by the two lead wires at a position where the distal end of the spring on the second probe side is located is larger than an inner diameter of the spring. . delete

Images