KR101602063B1 - 3-dimension printing apparatus and method for packaging a chip using the same - Google Patents

Abstract

The present invention relates to a packaging method of an integrated circuit chip using a three-dimensional printing apparatus which performs printing by injecting a metal material, a dielectric material and a resistive material. Provided is a packaging method of an integrated circuit chip using the three-dimensional printing apparatus, which forms circuit devices of an input stage to receive a signal or an external electricity through printing of the resistive material and the metal material and a metal line to connect the circuit devices, and packages the integrated circuit chip by printing the dielectric material for separating the circuit devices from the metal line.

Description

TECHNICAL FIELD [0001] The present invention relates to a 3D printing apparatus and a method of packaging an integrated circuit chip using the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a 3D printing apparatus and a method of packaging an integrated circuit chip using the same, which can package and package elements necessary for driving a chip implemented with an integrated circuit using 3D printing technology.

 In general, a variety of devices, such as resistors, capacitors, and inductors, required for packaging semiconductor chips and driving them are assembled on PCB boards and used in electronic products.

 In recent years, chip-scale packaging (SCP) has been manufactured and marketed close to the size of a semiconductor chip. However, in order to use the chip-scale packaging (SCP) in electronic products, And

Conventional packaging technology is to mount chip mounted on BGA (ball grid array) or surface mount type on PCB board and assemblies of various devices such as surface mount type resistor, capacitor, and inductor by soldering to drive it, .

However, since conventional packaging techniques use a considerable amount of toxic substances and energy in the fabrication of PCBs and fabrication and assembly of surface mount devices such as resistors, capacitors, and inductors, capital investment to reduce toxic substances and energy Resulting in an increase in manufacturing cost.

In addition, since conventional packaging techniques mount chips on a PCB board, there is a problem that design and manufacture of electronic products and electronic devices are limited depending on the size of the PCB board.

Conventional packaging techniques require various equipment for packaging, such as wire bonding, soldering, exposure devices for developing PCBs, and developing devices.

Korean Patent Publication No. 10-2010-0004475 (2010. 01. 13)

The present invention relates to a 3D printing apparatus and a method of manufacturing the same which are capable of minimizing packaging cost by forming circuit elements necessary for driving a chip by using 3D printing technology and packaging circuit elements and chips, And an integrated circuit chip packaging method using the same.

In addition, the present invention forms a metal line connecting a circuit element and a circuit element to a chip by using a 3D printing technique, thereby reducing the amount of toxic substances emitted in a packaging process, PCB fabrication and assembly, And an integrated circuit chip packaging method using the same.

The above objects of the present invention are achieved by a method of packaging an integrated circuit chip using a 3D printer that sprays and prints a metal material, a dielectric material, and a resistance material, Forming a metal line connecting the circuit elements of the input stage for the integrated circuit chip and the circuit elements, and printing the dielectric material between the circuit elements and the metal line, And a method of packaging an integrated circuit chip using the 3D printing apparatus.

Wherein the packaging method comprises the steps of: placing the integrated circuit chip on a fixing member; connecting the first and second pads to the first and second pads of the integrated circuit chip through printing of the resistance material and the metal material; A first metal line connecting the first driving element and one end of the resistor through printing of the metal material, and a second metal line connecting the second driving element and the other end of the resistor Forming a capacitor connected through the first metal line through printing of the dielectric material and the metal material and forming an inductor connected to the second metal line; And a metal material printed on the upper portion of the capacitor through printing of the metal material and the dielectric material, and a metal material printed on the upper portion of the inductor Wherein each metal material printed to form the first driving element, the second driving element, the resistor, the capacitor, the inductor, the first contact, and the second contact comprises a dielectric material And is isolated through printing of the material.

In the method of packaging an integrated circuit chip using the 3D printing apparatus, the capacitor has a structure in which at least two metal layers are laminated through printing of the metal material, a dielectric material is printed between the metal layers to form a dielectric layer The metal layers corresponding to the odd-numbered layers formed through the printing of the metal material are connected to each other, and the metal layers corresponding to the even-numbered layers are connected to each other.

In the method of packaging an integrated circuit chip using the 3D printing apparatus, the inductor has a structure in which at least two metal layers and dielectric layers are stacked through printing of the metal material, Depositing a metal layer and a dielectric layer by printing a metal material on a part of the upper part of the dielectric material buried in such a manner that the metal material is printed on the partial area and a part of the upper surface of the dielectric material after printing the material, And the metal layer is connected by the metal material printed in the partial area.

In the method of packaging an integrated circuit chip using the 3D printing apparatus, the forming of the first and second contacts may include printing the dielectric material and the metal material, and printing the metal material corresponding to the first and second contacts And forming first and second trenches made of a dielectric material.

The method for packaging an integrated circuit chip using the 3D printing apparatus may further include inserting an external power source or an input / output terminal for signal input / output into the first and second trenches.

The method for packaging an integrated circuit chip using the 3D printing device may further include connecting an external power source or an input / output terminal for signal input / output to the first and second contacts using a conductive adhesive or epoxy.

The method for packaging an integrated circuit chip using the 3D printing apparatus may further include molding the portion excluding the fixing member and the input / output terminal using a non-conductive material.

According to another embodiment of the present invention, there is provided a microstructure comprising: a microstage part for moving an integrated circuit chip mounted on a fixing member in X-axis, Y-axis and Z-axis; A resistive material spraying unit for spraying a resistive material on the integrated circuit chip to print a resistance connected to the integrated circuit chip; a dielectric material spraying unit for spraying a dielectric material onto the integrated circuit chip A dielectric material spraying unit for isolating the metal layer from each other and isolating the capacitor, the inductor, and the resistor; a temperature control unit for controlling the temperatures of the metal material spraying unit, the resistance material spraying unit, and the dielectric material spraying unit; A pressure control unit for controlling the pressure of the resistance material spraying unit and the dielectric material spraying unit; And controls the operation of the micro-stage unit, the metal material spray unit, the resistance material spray unit, the dielectric material spray unit, the temperature control unit, the pressure control unit, and the chip loading unit, And a control unit for moving and adjusting the chip loading unit based on a signal received from the control unit and placing the integrated circuit chip on the fixing member, wherein the 3D printing apparatus is provided .

According to the embodiments of the present invention, since the chip is packaged by using the 3D printing apparatus, equipment such as wire bonding, exposure apparatus for PCB, and developing unit are unnecessary, so that the cost of chip packaging can be reduced. It can also drastically reduce the emission and energy of significant quantities of toxic substances that are essentially released in the packaging process.

According to embodiments of the present invention, devices can be formed using a 3D printing device, and chips can be connected to each other, thereby enabling miniaturized packaging regardless of board size.

1 illustrates a 3D printing apparatus for packaging an integrated circuit chip according to an embodiment of the present invention;
Figure 2 shows the structure of a resistor applied to the packaging of the present invention,
3 is a view showing a structure of a capacitor applied to the packaging of the present invention,
4 is a view showing a structure of an inductor applied to the packaging of the present invention,
5A to 5F are cross-sectional views illustrating a process of packaging an integrated circuit chip according to an embodiment of the present invention.
6 is a perspective view illustrating a scale board of an integrated circuit chip produced through a packaging process according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to provide a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, this is merely an example and the present invention is not limited thereto.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification. The terms used in the detailed description are intended only to describe embodiments of the invention and should in no way be limiting.

1 is a view illustrating a 3D printing apparatus for packaging an integrated circuit chip according to an embodiment of the present invention.

1, the 3D printing apparatus includes a control unit 100, an X and Y axis microstage unit 110, a Z axis microstage unit 115, a metal material spray unit 120, A pressure control unit 130, a temperature control unit 140, a compression pump unit 150, a sensor unit 160, a chip loading unit 170, and the like.

The chip loading unit 170 loads the integrated circuit chip S and can be moved and adjusted based on the control of the control and control unit 100. [

The sensor unit 160 may sense the seating state of the integrated circuit chip S on the fixing member 500 (FIG. 5A) and provide a signal corresponding thereto to the control and control unit 100. Specifically, the sensor unit 160 may provide the control unit 100 with an image corresponding to the state of tin of the integrated circuit chip S to the fixing member 500.

The control and control unit 100 processes the signal received from the sensor unit 160 and moves and adjusts the chip mounting unit 170 to accurately position and fix the integrated circuit chip S to the fixing member 500 . Specifically, the control and control unit 110 places the fixing member 500 on the X and Y axis microstage unit 110 and then fixes the integrated circuit chip S mounted on the chip mounting unit 170 to the fixing member The chip mounting unit 170 is moved on the basis of the determined seating state by analyzing a signal received through the sensor unit 160, for example, an image, So that the integrated circuit chip S can be placed on the member 500.

The control unit 100 includes a program capable of executing an NC code to adjust movement of the X, Y-axis microstage unit 110 and the Z-axis microstage unit 115 through the program, A capacitor, an inductor, and the like necessary for packaging in the integrated circuit chip by controlling the pressure applied to the metal material spraying unit 120, the dielectric material spraying unit 122, and the resistance material spraying unit 124 Can be formed.

The control and control unit 100 adjusts the movement of the X, Y-axis microstage unit 110 and the Z-axis microstage unit 115 and controls the pressure control unit 130 to control the pressure applied to the metal material spray unit 120 The metal lines and contacts to be connected between the circuit elements can be formed.

The control and control unit 100 adjusts the movement of the X, Y-axis microstage unit 110 and the Z-axis microstage unit 115 and controls the pressure control unit 130 to control the pressure applied to the dielectric material spray unit 122 A via hole into which the input / output terminal can be inserted and a dielectric layer for insulation between the circuit elements can be formed.

The X and Y axis microstages 110 are positioned and fixed by the fixing member such as a substrate or a heat radiator so that the X and Y axis microstages 110 are moved in the X and Y axes by the control and control unit 100, And the Z axis micro stage unit 115 fixes the various material spray units 120, 122, and 124, and is movable in the Z axis by the control and control unit 100. [

The metal material spraying unit 120, the dielectric material spraying unit 122 and the resistance material spraying unit 124 move the Z-axis microstage unit 115 according to the control and control of the control and control unit 100, (S), and the pressure and the vacuum are controlled to enable the middle of the injection and the injection.

The pressure control unit 130 is connected to the compression pump unit 150 and controls the control unit 100 and the compression pump unit 150 to operate the metal material spray unit 120, the dielectric material spray unit 122, And supplies pressure and vacuum to the material jetting section 124.

The temperature regulating unit 140 accommodates the temperature regulating device so that the temperature of the metal material injecting unit 120, the dielectric material injecting unit 122, and the resistance material injecting unit 124 can be adjusted. Specifically, the temperature regulating unit 140 can control the melting points of the materials in the metal material spraying unit 120, the dielectric material spraying unit 122, and the resistance material spraying unit 124 through temperature control.

A process of forming an element necessary for packaging, such as a resistor, an inductor, a capacitor, and the like, using the 3D printing apparatus having the above configuration will be described with reference to FIGS. 2 to 4. FIG.

2 is a view for explaining a process of forming a resistance using a 3D printing apparatus according to an embodiment of the present invention.

2, the control and control unit 100 of the 3D printing apparatus adjusts the movement of the X, Y-axis microstage unit 110 and the Z-axis microstage unit 115 and controls the pressure control unit 130 and the temperature The control unit 140 controls the pressure supplied to the resistance material spraying unit 124 to maintain the temperature of the resistance material for printing through the temperature control and controls the resistance material on the integrated circuit chip S And a resistor 200 having a predetermined thickness is formed by printing. The control and control unit 100 then controls the metal material spraying unit 120 in the same manner as the control of the resistance material spraying unit 124 to print the metal material on both sides of the resistor 200, .

3 is a view illustrating a process of forming a capacitor using a 3D printing apparatus according to an embodiment of the present invention.

3, the control and control unit 100 of the 3D printing apparatus adjusts the movement of the X, Y axis microstage unit 110 and the Z axis microstage unit 115 and controls the pressure control unit 130 and the temperature The control unit 140 controls the pressure provided to the dielectric material spraying unit 122 and the metal material spraying unit 120 to maintain the temperatures of the dielectric material and the metal material for printing through temperature control, A metal material and a dielectric material are alternately printed to form a capacitor 300 having a parallel plate structure including a plurality of metal layers 310 and a dielectric layer 312. Here, the capacitor 300 having a parallel plate structure may have a structure in which a plurality of metal layers 310 are filled with a dielectric layer 312.

The capacitor 300 having a parallel plate structure includes a metal layer 310 connected to the metal layer 310 formed on a lower surface of the dielectric layer 312 and covering a part of a side surface of the dielectric layer 312, And a covering metal layer 310 connected to the metal layer 310 covering a part of the upper surface and formed on a part of the other side surface of the dielectric layer 312. Thereby, the capacitor 300 having the parallel plate structure having the structure in which the dielectric layer 312 including the plurality of metal layers 310 is surrounded by the metal layer 310 having the "a" structure and the " . In other words, the parallel plate type capacitor 300 has a structure in which at least two metal layers 310 are laminated through printing of a metal material, and a dielectric material is printed between the metal layers 310 to form a dielectric layer 312 And the metal layers 310 corresponding to the odd-numbered layers are connected to each other and the metal layers 310 corresponding to the even-numbered layers are connected to each other.

Meanwhile, the capacitance value of the capacitor 300 having the parallel plate structure may be determined according to the area and the number of layers of the metal layer 310 and the dielectric layer 312.

4 is a view illustrating a process of forming an inductor using a 3D printing apparatus according to an embodiment of the present invention.

4, the control and control unit 100 of the 3D printing apparatus adjusts the movement of the X, Y-axis microstage unit 110 and the Z-axis microstage unit 115 and controls the pressure control unit 130 and the temperature The control unit 140 controls the pressure provided to the dielectric material spraying unit 122 and the metal material spraying unit 120 to maintain the temperatures of the dielectric material and the metal material for printing through temperature control, The metal material and the dielectric material may be printed alternately to form a plurality of metal layers 410 and a dielectric layer 412. The inductor 400 may be formed by printing a portion where each layer is connected with a metal material. Specifically, the inductor 400 of the multi-layer structure is formed in such a manner that the metal layer 410 is formed by printing a metal material on the upper surface edge region and the depressed region of the tetrahedral dielectric layer 412 having a part of the rim . In addition, the inductor 400 of the multi-layer structure can be connected to the upper metal layer 410 by the metal material printed in the recessed area, the lower metal layer 410 formed in the lower dielectric layer 412. At this time, the recessed areas of the dielectric layers 412 corresponding to the respective layers may be formed so as not to overlap each other.

Meanwhile, the inductance value of the inductor 400 having the multilayer structure described above can be determined according to the area and the number of layers of the metal layer 410 and the dielectric layer 412.

A process of packaging the integrated circuit chip using the 3D printing apparatus having the above-described structure will be described with reference to FIGS. 5A to 5F.

5A to 5F are cross-sectional views illustrating a process of packaging an integrated circuit chip using a 3D printing apparatus according to an embodiment of the present invention.

5A, the control and control unit 100 processes a signal received from the sensor unit 160 to move and adjust the chip mounting unit 170 to connect the integrated circuit chip S to the fixing member 500 And the integrated circuit chip S is fixed to the fixing member 500 using the conductive adhesive agent or the epoxy 502. Then, as shown in Fig. At this time, the integrated circuit chip S is provided with first and second pads 504 and 506 to be connected to an external circuit (not shown).

5B, the control and control unit 100 adjusts the movement of the X, Y-axis microstage unit 110 and the Z-axis microstage unit 115, and controls the pressure control unit 130 and the temperature control unit 130, The first and second pads 504 and 506 are maintained at a pressure and a temperature which are provided to the dielectric material spraying unit 122 and the metal material spraying unit 120 through the control of the control unit 140, A dielectric material is sprayed over the entire surface of the circuit chip S and a metal material is sprayed onto a certain portion of the first and second pads 504 and 506 to form the dielectric layer 508, Thereby printing the driving element 512.

Thereafter, as shown in FIG. 5C, the resistance material is injected into a predetermined portion of the dielectric layer 508 through the control and control of the resistance material injecting unit 124 and the metal material injecting unit 120, The first and second metal lines 516 and 518 connected to both ends of the resistor 514 and the resistor 514 are formed by printing a metal material on the both ends of the resistor 514 and the dielectric layer 508, do. Specifically, a first metal line 516, a second driving element 512, and a resistor 514, which connect one end of the resistor 514 to the first driving element 510 through printing of a metal material, The second metal line 518 may be formed to connect to the other end of the first metal line 518.

5D, the dielectric material and the metal material are sprayed through the control and control of the dielectric material spraying part 122 and the metal material spraying part 120 to form the first and second metal lines 516 and 518 The capacitor 520 and the inductor 522, which are connected to the inductor 522, are printed. Specifically, after the metal material spraying part 120 is positioned at the end of the first and second metal lines 516 and 518, the metal material spraying part 120 is controlled and controlled to spray the metal material, , The dielectric material is sprayed over the entire surface of the resultant of Figure 5C so that the two metal lines 516, 518 are buried. This process is repeatedly performed to print the capacitor 520 and the inductor 522.

5E, a portion of the metal material printed on the capacitor 520 and the upper portion of the inductor 522 is exposed through the control and control of the dielectric material injecting portion 122 and the metal material injecting portion 120 So that the first and second contact holes are formed. Then, a metal material is printed to form a first contact 524 and a second contact 526 so that the metal material is embedded in the first and second contact holes. Accordingly, the first contact 524 and the second contact 526 can be isolated from each other by a dielectric.

5f, the input / output terminals 528 and 530 for external power or signal input / output are bonded to the first contact 524 and the second contact 526 using a conductive adhesive or epoxy , The portion excluding the fixing member 500 is sealed with the non-conductive material 532, for example, plastic.

In the embodiment of the present invention, the first contact 524 and the second contact 526 and the dielectric are printed with a flat structure. However, it is also possible to print a structure having a trench of a predetermined size have. The size of the trench formed to expose the first contact 524 and the second contact 526 may be determined according to the size of the input and output terminals 528 and 530 and the input and output terminals 528 and 530 may be inserted into the trench And can be fixed.

More specifically, the printing of the metal material and the dielectric material allows the sidewall to isolate the first contact 524 and the second contact 526 from the metal material corresponding to the first contact 524 and the second contact 526, And an input terminal is inserted into the first trench and an output terminal is inserted into the second trench. The first and second trenches are formed of a dielectric material.

The scale board of the integrated circuit chip S is produced through the above-described packaging process as shown in FIG.

6 is a perspective view showing a scale board of an integrated circuit chip S formed through a packaging process according to an embodiment of the present invention.

6, the scale board includes a resistor 610, an inductor 612, and a capacitor 614, which are necessary for driving the integrated circuit chip S fixed to the heating plate 600, And they are electrically interconnected by using the internal wiring 616. [ Isolating the integrated circuit elements using dielectric material 618, respectively.

A dielectric material is used between the inductor 612 and the metal material of the capacitor 614. It is used as a dielectric between electrodes. The entirety is molded and packaged using a plastic material 624, which is a non-conductive material, except for the parts for assembling the input / output and power terminals 620 and 622 and the heat sink 600.

Although the packaging process of the integrated circuit chip is described using the 3D printer in the embodiment of the present invention as described above, the inkjet type 3D printer, the direct type 3D printer, the FDM (Fused Deposition Modeling) An integrated circuit chip may also be packaged using a 3D printer.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, . Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by equivalents to the appended claims, as well as the appended claims.

100:
110: X, Y axis micro stage unit
115: Z-axis microstage part
120: metal material splitting part
122: dielectric material dispensing part
124: Resistance material dispenser
130:
140:
150: Compression pump part
160:
170: chip loading section

Claims (9)

delete 1. A method of packaging an integrated circuit chip using a 3D printer that sprays a metal material, a dielectric material, and a resistance material,
And a metal line connecting the circuit elements to an input terminal for receiving an external power or signal through the printing of the resistance material and the metal material is formed between the circuit elements and between the circuit elements, And packaging the integrated circuit chip by printing a dielectric material for isolation between the metal lines,
In the packaging method,
Placing the integrated circuit chip on a fixing member,
Forming resistors with first and second driving elements connected to first and second pads of the integrated circuit chip through printing of the resistive material and the metallic material,
A first metal line connecting the first driving element and one end of the resistor through printing of the metal material and a second metal line connecting the second driving element and the other end of the resistor are formed , ≪ / RTI &
Forming a capacitor connected through the first metal line through printing of the dielectric material and the metal material and forming an inductor connected to the second metal line;
Forming a metal material printed on top of the capacitor through printing of the metal material and a dielectric material and first and second contacts connected to the printed metal material on top of the inductor,
Wherein each metal material printed to form the first driving element, the second driving element, the resistor, the capacitor, the inductor, the first contact and the second contact is isolated through printing of the dielectric material. (Method of packaging an integrated circuit chip using the device).
3. The method of claim 2,
The capacitor
Wherein at least two metal layers are laminated through the printing of the metal material, a dielectric material is printed between the metal layers to form a dielectric layer, and the metal layers corresponding to the odd-numbered layers formed through printing of the metal material are connected to each other And the metal layers corresponding to even layers are connected to each other.
3. The method of claim 2,
The inductor includes:
Wherein at least two metal layers and a dielectric layer are laminated through the printing of the metal material,
A method of printing a metal material on a part of the upper portion of the dielectric material buried in such a manner that the dielectric material is printed so that a part of the dielectric material is opened and then a metal material is printed on a part of the upper surface of the dielectric material Wherein the upper metal layer and the lower metal layer are connected to each other by a printed metal material on the metal layer and the dielectric layer.
3. The method of claim 2,
Wherein forming the first and second contacts comprises:
Wherein the first and second trenches are formed of a metal material and a dielectric material, the side walls of which correspond to the first and second contacts, and the first and second trenches are printed with the dielectric material and the metal material. Packaging method.
6. The method of claim 5,
In the packaging method,
And inserting an external power source or an input / output terminal for signal input / output into the first and second trenches.
3. The method of claim 2,
In the packaging method,
And connecting an input / output terminal for external input or signal input / output to the first and second contacts using a conductive adhesive or epoxy.
8. The method according to claim 6 or 7,
In the packaging method,
Further comprising the step of molding the portion excluding the fixing member and the input / output terminal using a non-conductive material.
In the 3D printing apparatus using the packaging method of claim 2,
A chip mounting portion for mounting the integrated circuit chip on the fixing member,
A microstage unit for moving the integrated circuit chip mounted on the fixing member in the X axis, the Y axis, and the Z axis;
A metal material spraying part for spraying a metal material onto the integrated circuit chip to print a metal layer required for metal lines, capacitors, and inductors;
A resistance material injecting unit for injecting a resistance material into the integrated circuit chip to print a resistance connected to the integrated circuit chip,
A dielectric material injecting unit injecting a dielectric material into the integrated circuit chip to isolate the metal layers from each other and isolate the capacitor, the inductor, and the resistor,
A temperature control unit for controlling the temperatures of the metal material spraying unit, the resistance material spraying unit, and the dielectric material spraying unit;
A pressure control unit for controlling the pressures of the metal material spraying unit, the resistance material spraying unit, and the dielectric material spraying unit;
A sensor unit for providing a signal corresponding to a seating state of the integrated circuit chip to the fixing member,
And controls the operation of the micro stage unit, the metal material spray unit, the resistance material spray unit, the dielectric material spray unit, the temperature control unit, the pressure control unit, and the chip loading unit, And a control unit which moves and adjusts the integrated circuit chip to place the integrated circuit chip on the fixing member.

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