KR101600159B1 - 태양 전지용 집전 시트의 배선 패턴 형성용 도전성 기재 및 태양 전지용 집전 시트의 제조 방법 - Google Patents
태양 전지용 집전 시트의 배선 패턴 형성용 도전성 기재 및 태양 전지용 집전 시트의 제조 방법 Download PDFInfo
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- C25D7/00—Electroplating characterised by the article coated
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- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- H05K1/02—Details
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- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
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- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/908—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells for back-contact photovoltaic cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10143—Solar cell
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
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Abstract
Description
도 2는 본 발명의 태양 전지용 집전 시트의 배선 패턴 형성용 도전성 기재의 층 구성을 도시하는 모식도.
도 3의 (a) 내지 (d)는, 본 발명의 배선 시트의 제조 방법의 제1 실시 양태에 의해 배선 패턴이 형성되는 모습을 순차 도시하는 모식도.
도 4는 본 발명의 배선 시트의 제조 방법의 제2 실시 양태에 있어서, 사용할 수 있는 제2 도전성 기재의 층 구성을 도시하는 모식도.
도 5의 (a) 내지 (f)는 본 발명의 배선 시트의 제조 방법의 제2 실시 양태에 의해 배선 패턴이 형성되는 모습을 순차 도시하는 모식도.
도 6은 본 발명의 태양 전지용 집전 시트의 제조 방법에 의해 제조되는 태양 전지용 집전 시트가 태양 전지 소자에 접합되어 있는 모습을 모식적으로 도시하는 사시도.
도 7은 본 발명의 태양 전지 모듈의 제조 방법에 의해 제조되는 태양 전지 모듈의 층 구성을 도시하는 모식도.
도 8은 실시예 2에 있어서의 표면 아연량과 땜납 고조 높이의 관계를 나타내는 도표.
10 : 적층체
10a : 제2 적층체
2 : 수지 기재
3 : 배선 패턴
30 : 도전성 기재
30a : 제2 도전성 기재
31 : 도전층
32 : 방청 보호층
33 : 배면 보호층
310 : 구리박
320 : 아연층
321 : 제1 방청 보호층
322 : 제2 방청 보호층
330 : 배면 아연층
331 : 배면 처리층
4 : 에칭 마스크
5 : 태양 전지 소자
6 : 투명 전면 기판
7 : 표면측 밀봉재 시트
8 : 이면측 밀봉재 시트
9 : 이면 보호 시트
100 : 태양 전지 모듈
Claims (10)
- 구리박 표면 위에 제1 방청 보호층이 형성되어 있는 도전성 기재와 수지 기재를 적층해서 적층체를 얻는 적층 공정과,
원하는 배선 패턴의 형상으로 패터닝된 에칭 마스크를 상기 적층체의 표면에 제작한 후에 에칭 처리를 행함으로써, 상기 에칭 마스크로 덮여 있지 않은 부분의 상기 도전성 기재를 제거하는 에칭 공정과,
상기 구리박 표면 위로부터 상기 제1 방청 보호층을 제거하는 제1 방청 보호층 제거 공정과,
상기 제1 방청 보호층 제거 공정 후에, 상기 구리박 위에 제2 방청 보호층을 형성하는 제2 방청 보호층 형성 공정을 구비하고,
상기 제1 방청 보호층은 적어도 크롬, 인산 또는 니켈 중 어느 하나를 포함하는 방청제를 포함하여 이루어지고, 상기 제2 방청 보호층은 아연을 포함하는 층이며, 상기 구리박 표면 위로의 아연의 부착량이 0.5㎎/㎡를 초과하고 20㎎/㎡ 이하인 태양 전지용 집전 시트의 제조 방법. - 제1항에 있어서,
상기 제1 방청 보호층 제거 공정과 상기 제2 방청 보호층 형성 공정이 동일 생산 설비 내에서 연속적으로 행해지는 태양 전지용 집전 시트의 제조 방법. - 제1항 또는 제2항에 있어서,
상기 제1 방청 보호층 제거 공정이 산성의 세정제를 사용한 화학 연마에 의해 제1 방청 보호층을 제거하는 공정인 태양 전지용 집전 시트의 제조 방법. - 제1항 또는 제2항에 있어서,
상기 제1 방청 보호층이 크롬 및 아연을 포함하는 층인 태양 전지용 집전 시트의 제조 방법. - 태양 전지 모듈의 제조 방법으로서,
제1항 또는 제2항에 기재된 태양 전지용 집전 시트의 제조 방법에 의해 태양 전지용 집전 시트를 제조하는 태양 전지용 집전 시트 제조 공정과,
상기 태양 전지용 집전 시트 제조 공정에서 제조된 상기 태양 전지용 집전 시트의 배선 패턴 표면에, 태양 전지 소자의 전극을 땜납 가공에 의해 접합하는 땜납 접합 공정과,
상기 땜납 접합 공정에서 접합된 태양 전지 소자와 태양 전지용 집전 시트를 포함하는 접합체와 태양 전지 모듈을 구성하는 그 외의 부재를 적층해서 일체화하는 모듈 일체화 공정을 구비하는 태양 전지 모듈의 제조 방법. - 삭제
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Application Number | Priority Date | Filing Date | Title |
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JP2011132438A JP5919656B2 (ja) | 2011-06-14 | 2011-06-14 | 太陽電池用集電シートの配線パターン形成用の導電性基材 |
JPJP-P-2011-132438 | 2011-06-14 | ||
JP2011217846A JP5803530B2 (ja) | 2011-09-30 | 2011-09-30 | 太陽電池用集電シートの製造方法 |
JPJP-P-2011-217846 | 2011-09-30 | ||
PCT/JP2012/065210 WO2012173178A1 (ja) | 2011-06-14 | 2012-06-14 | 太陽電池用集電シートの配線パターン形成用の導電性基材、及び太陽電池用集電シートの製造方法 |
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KR101600159B1 true KR101600159B1 (ko) | 2016-03-04 |
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CN (1) | CN103732798B (ko) |
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KR20170113193A (ko) * | 2016-03-25 | 2017-10-12 | 코오롱인더스트리 주식회사 | 유기태양전지 및 이의 제조방법 |
CN106604538A (zh) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | 一种柔性线路板及其制备方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199228A (ja) | 2009-02-24 | 2010-09-09 | Hitachi Cable Ltd | 太陽電池用配線部品及びその製造方法、ならびに太陽電池モジュール |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585010A (en) | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
JPS5687677A (en) | 1979-12-19 | 1981-07-16 | Nippon Mining Co Ltd | Method of producing copper foil for printed circuit |
JPS5687676A (en) | 1979-12-19 | 1981-07-16 | Nippon Mining Co Ltd | Production of copper foil |
US5338619A (en) | 1991-05-16 | 1994-08-16 | Fukuda Metal Foil And Powder Co., Ltd. | Copper foil for printed circuits and method of producing same |
JPH0732306B2 (ja) | 1991-05-16 | 1995-04-10 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその製造方法 |
JP2919181B2 (ja) | 1992-06-18 | 1999-07-12 | 株式会社日立製作所 | プリント基板の製造方法 |
JPH06112646A (ja) | 1992-09-29 | 1994-04-22 | Metsuku Kk | 銅または銅合金表面の処理方法 |
JP3224704B2 (ja) | 1994-12-05 | 2001-11-05 | 三井金属鉱業株式会社 | 有機防錆処理銅箔 |
JPH09326549A (ja) | 1996-06-04 | 1997-12-16 | Sanyo Electric Co Ltd | プリント基板の防錆方法及びその基板 |
JP3032514B1 (ja) | 1998-12-14 | 2000-04-17 | 株式会社日鉱マテリアルズ | 光沢面の耐酸化性に優れた銅箔及びその製造方法 |
JP2000280401A (ja) * | 1999-03-30 | 2000-10-10 | Furukawa Electric Co Ltd:The | 樹脂付き銅箔 |
JP3768104B2 (ja) * | 2001-01-22 | 2006-04-19 | ソニーケミカル株式会社 | フレキシブルプリント基板 |
JP3332374B1 (ja) * | 2001-11-30 | 2002-10-07 | ディップソール株式会社 | 亜鉛及び亜鉛合金めっき上に六価クロムフリー防錆皮膜を形成するための処理溶液、六価クロムフリー防錆皮膜及びその形成方法。 |
JP3620510B2 (ja) * | 2002-04-05 | 2005-02-16 | ユケン工業株式会社 | 基材とその製造方法と自動車部品 |
JP2005340362A (ja) | 2004-05-25 | 2005-12-08 | Sharp Corp | 太陽電池セルおよび太陽電池モジュール |
JP4699149B2 (ja) | 2005-09-15 | 2011-06-08 | ジャパンゴアテックス株式会社 | 回路基板、および薄膜太陽電池とその製造方法 |
JP4460026B2 (ja) | 2007-11-14 | 2010-05-12 | 日鉱金属株式会社 | 抵抗膜層を備えた銅箔 |
KR100974373B1 (ko) * | 2008-02-28 | 2010-08-05 | 엘에스엠트론 주식회사 | 인쇄회로용 동박의 표면처리 방법과 그 동박 및 도금장치 |
JP4907580B2 (ja) * | 2008-03-25 | 2012-03-28 | 新日鐵化学株式会社 | フレキシブル銅張積層板 |
CN102356472A (zh) | 2009-01-16 | 2012-02-15 | 夏普株式会社 | 太阳能电池模块及太阳能电池模块的制造方法 |
JP2010202891A (ja) | 2009-02-27 | 2010-09-16 | Nippon Steel Chem Co Ltd | 表面処理銅箔及びその製造方法 |
JP5625393B2 (ja) | 2009-11-18 | 2014-11-19 | 大日本印刷株式会社 | 配線シート及び太陽電池モジュール並びにこれらの製造方法 |
-
2012
- 2012-06-14 US US14/126,366 patent/US9666746B2/en not_active Expired - Fee Related
- 2012-06-14 EP EP12800136.9A patent/EP2722417B1/en not_active Not-in-force
- 2012-06-14 CN CN201280038899.5A patent/CN103732798B/zh not_active Expired - Fee Related
- 2012-06-14 TW TW101121355A patent/TWI536581B/zh not_active IP Right Cessation
- 2012-06-14 KR KR1020137033934A patent/KR101600159B1/ko not_active Expired - Fee Related
- 2012-06-14 WO PCT/JP2012/065210 patent/WO2012173178A1/ja active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010199228A (ja) | 2009-02-24 | 2010-09-09 | Hitachi Cable Ltd | 太陽電池用配線部品及びその製造方法、ならびに太陽電池モジュール |
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KR20140016392A (ko) | 2014-02-07 |
EP2722417A1 (en) | 2014-04-23 |
US20140186989A1 (en) | 2014-07-03 |
EP2722417B1 (en) | 2018-06-27 |
US9666746B2 (en) | 2017-05-30 |
TWI536581B (zh) | 2016-06-01 |
TW201322461A (zh) | 2013-06-01 |
CN103732798A (zh) | 2014-04-16 |
WO2012173178A1 (ja) | 2012-12-20 |
CN103732798B (zh) | 2016-07-06 |
EP2722417A4 (en) | 2015-02-25 |
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