KR101584665B1 - Remove Film Oxide Composition and Removing Methed of Film Oxide - Google Patents
Remove Film Oxide Composition and Removing Methed of Film Oxide Download PDFInfo
- Publication number
- KR101584665B1 KR101584665B1 KR1020140031004A KR20140031004A KR101584665B1 KR 101584665 B1 KR101584665 B1 KR 101584665B1 KR 1020140031004 A KR1020140031004 A KR 1020140031004A KR 20140031004 A KR20140031004 A KR 20140031004A KR 101584665 B1 KR101584665 B1 KR 101584665B1
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- oxide film
- group
- surfactant
- ionized water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000002253 acid Substances 0.000 claims abstract description 24
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 21
- 150000007524 organic acids Chemical class 0.000 claims abstract description 20
- 239000004094 surface-active agent Substances 0.000 claims abstract description 13
- 239000013522 chelant Substances 0.000 claims abstract description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 239000002738 chelating agent Substances 0.000 claims description 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003945 anionic surfactant Substances 0.000 claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- -1 glycol ethers Chemical class 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 claims description 2
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004327 boric acid Substances 0.000 claims description 2
- 239000003093 cationic surfactant Substances 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 239000000174 gluconic acid Substances 0.000 claims description 2
- 235000012208 gluconic acid Nutrition 0.000 claims description 2
- 150000002334 glycols Chemical class 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 2
- 229940116269 uric acid Drugs 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003915 air pollution Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 230000007797 corrosion Effects 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 150000004696 coordination complex Chemical class 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229960003330 pentetic acid Drugs 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 230000001603 reducing effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- MTVMXNTVZNCVTH-UHFFFAOYSA-N ethane-1,2-diol;2-(2-hydroxyethoxy)ethanol Chemical compound OCCO.OCCOCCO MTVMXNTVZNCVTH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 230000001953 sensory effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000003832 thermite Substances 0.000 description 2
- YFSUTJLHUFNCNZ-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-M 0.000 description 1
- GNVFCWJZMJINCS-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCC GNVFCWJZMJINCS-UHFFFAOYSA-N 0.000 description 1
- YZWVMKLQNYGKLJ-UHFFFAOYSA-N 1-[2-[2-(2-ethoxyethoxy)ethoxy]ethoxy]-2-methoxyethane Chemical compound CCOCCOCCOCCOCCOC YZWVMKLQNYGKLJ-UHFFFAOYSA-N 0.000 description 1
- DSPIZZQMSHIZLS-UHFFFAOYSA-N 1-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]propane Chemical compound CCCOCCOCCOCCOCCC DSPIZZQMSHIZLS-UHFFFAOYSA-N 0.000 description 1
- HKVKMZGRXWKGGV-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethoxy]octane Chemical compound CCCCCCCCOCCOCCOCCOCCOCCCC HKVKMZGRXWKGGV-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- GSAJQUMOODCIHD-UHFFFAOYSA-N 1-ethoxy-3-(3-ethoxypropoxy)propane Chemical compound CCOCCCOCCCOCC GSAJQUMOODCIHD-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- LJVNVNLFZQFJHU-UHFFFAOYSA-N 2-(2-phenylmethoxyethoxy)ethanol Chemical compound OCCOCCOCC1=CC=CC=C1 LJVNVNLFZQFJHU-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- KVPHZILZNXDCNH-UHFFFAOYSA-N 2-[2-(2-phenylmethoxyethoxy)ethoxy]ethanol Chemical compound OCCOCCOCCOCC1=CC=CC=C1 KVPHZILZNXDCNH-UHFFFAOYSA-N 0.000 description 1
- KCBPVRDDYVJQHA-UHFFFAOYSA-N 2-[2-(2-propoxyethoxy)ethoxy]ethanol Chemical compound CCCOCCOCCOCCO KCBPVRDDYVJQHA-UHFFFAOYSA-N 0.000 description 1
- QDPIVUQXPXUNLN-UHFFFAOYSA-N 2-[2-[2-(2-phenylmethoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound OCCOCCOCCOCCOCC1=CC=CC=C1 QDPIVUQXPXUNLN-UHFFFAOYSA-N 0.000 description 1
- SXNRWWNGEQMQCB-UHFFFAOYSA-N 2-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCOCCOCCOCCOCCO SXNRWWNGEQMQCB-UHFFFAOYSA-N 0.000 description 1
- UMUSOTNGYAALST-UHFFFAOYSA-N 2-[2-[2-[2-(2-phenylmethoxyethoxy)ethoxy]ethoxy]ethoxy]ethanol Chemical compound OCCOCCOCCOCCOCCOCC1=CC=CC=C1 UMUSOTNGYAALST-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- HYDWALOBQJFOMS-UHFFFAOYSA-N 3,6,9,12,15-pentaoxaheptadecane Chemical compound CCOCCOCCOCCOCCOCC HYDWALOBQJFOMS-UHFFFAOYSA-N 0.000 description 1
- CDOUZKKFHVEKRI-UHFFFAOYSA-N 3-bromo-n-[(prop-2-enoylamino)methyl]propanamide Chemical compound BrCCC(=O)NCNC(=O)C=C CDOUZKKFHVEKRI-UHFFFAOYSA-N 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 description 1
- 229940063953 ammonium lauryl sulfate Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229960000686 benzalkonium chloride Drugs 0.000 description 1
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- PSLWZOIUBRXAQW-UHFFFAOYSA-M dimethyl(dioctadecyl)azanium;bromide Chemical compound [Br-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC PSLWZOIUBRXAQW-UHFFFAOYSA-M 0.000 description 1
- 235000019329 dioctyl sodium sulphosuccinate Nutrition 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- TUEYHEWXYWCDHA-UHFFFAOYSA-N ethyl 5-methylthiadiazole-4-carboxylate Chemical compound CCOC(=O)C=1N=NSC=1C TUEYHEWXYWCDHA-UHFFFAOYSA-N 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000008235 industrial water Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VJSDWOMGAPBZGY-UHFFFAOYSA-N n'-(2-aminoethyl)ethane-1,2-diamine;oxalic acid Chemical compound OC(=O)C(O)=O.NCCNCCN VJSDWOMGAPBZGY-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- SMGTYJPMKXNQFY-UHFFFAOYSA-N octenidine dihydrochloride Chemical compound Cl.Cl.C1=CC(=NCCCCCCCC)C=CN1CCCCCCCCCCN1C=CC(=NCCCCCCCC)C=C1 SMGTYJPMKXNQFY-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
- C23G1/088—Iron or steel solutions containing organic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/08—Iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Detergent Compositions (AREA)
Abstract
본 발명은 산화막 제거 조성물 및 이의 제조방법에 관한 것이다. 보다 구체적으로는 유기산 및 무기산의 혼합산 1 ~ 10 중량%, 계면활성제 3 ~ 12 중량%, 킬레이트제 3 ~ 15 중량%, 전해 이온수 35 ~ 60 중량% 및 물 10 ~ 50 중량%를 포함하는 산화막 제거 조성물 및 이의 제조방법으로, 작업 안전성이 우수하고 수질 및 대기오염 방지력이 우수하며, 친환경적인 산화막 제거 조성물 및 이의 제조방법에 관한 것이다.The present invention relates to an oxide film removing composition and a manufacturing method thereof. More specifically, an oxide film containing 1 to 10 wt% of mixed acid of organic acid and inorganic acid, 3 to 12 wt% of surfactant, 3 to 15 wt% of chelate, 35 to 60 wt% of electrolytic ionized water and 10 to 50 wt% Which is excellent in work safety and is excellent in water quality and air pollution preventing ability, and is an environmentally friendly oxide film removing composition and a manufacturing method thereof.
Description
본 발명은 철근, 철골 구조물의 산화막 제거에 관한 것이다. 더욱 구체적으로는 철근, 철골 구조물에 전해이온수가 포함된 산화막 제거 조성물을 스프레이 또는 붓칠을 하여 산화막 제거를 진행함으로써 작업 안전성이 우수하고, 친환경적인 산화막 제거 조성물에 관한 것이다.FIELD OF THE INVENTION The present invention relates to oxide film removal of steel bars and steel structures. More particularly, the present invention relates to an environmentally friendly oxide film removing composition which is excellent in work safety by conducting an oxide film removal by spraying or rubbing an oxide film removing composition containing electrolytic ionized water in steel bars and steel structures.
일반적으로, 금속은 공기 중에 있는 산소, 수분, 이산화탄소 등의 작용에 의해서 금속 표면에 녹이 슬게 되는데 이는 금속의 부식을 촉진 시킬 뿐 아니라, 특히 건설 현장에서 건물의 골격으로 사용되는 철근 철골에서는 콘크리트 부착 강도가 약화되는 원인이 되므로 표면에 생성된 녹을 제거하고 콘크리트 작업을 하게 된다. 금속 구조물의 산화피막 생성으로 인한 내구성 감소 및 강도 저하 등을 방지하기 위하여 금속 구조물의 표면을 페인트 등으로 도장하여 보호하였으나 이는 경제적 비용 및 시간 등이 소요되고 있다. Generally, metal is rusted on the metal surface by the action of oxygen, moisture, carbon dioxide, etc. in the air. In addition to accelerating the corrosion of metal, in steel reinforcing steel used as a skeleton of a building in a construction site, Which is a cause of weakening the surface of the rust is removed and the concrete will work. In order to prevent durability and strength degradation due to the formation of an oxide film of the metal structure, the surface of the metal structure is protected by painting with paint or the like, but this requires economic cost and time.
또한, 다른 방법으로는 산화피막이 형성된 금속 구조물을 강산, 강알칼리등을 30 중량%이상 사용하여 처리하는 화학적 방법 등이 있으나, 공정이 복잡하고 처리제 개봉 시 과량으로 사용된 강산, 강알칼리 등으로 인한 유해가스 발생으로 환경적으로 유해하고 인체에 묻었을 경우 심한 화상으로 치명적인 인체를 상하게 할 수 있어 안전 문제 및 환경적으로 유해한 폐단이 있었다.Another method is a chemical method in which a metal structure having an oxide coating formed thereon is treated with strong acid, strong alkali or the like in an amount of 30 wt% or more. However, since the process is complicated and excessive use of strong acid, strong alkali, It is harmful to the environment, and if it is buried in the human body, there is a safety problem and an environmentally harmful end which can injure a fatal human body due to severe burns.
이에 대하여 한국공개특허 제1990-0004889호(1990.04.13)에 코팅 반응물이 네가티브 자유에너지를 갖는 반응물로 구성되고 상기 반응물은 테르미트 코팅과 열전달 또는 촉매화 반응에 의해 반응을 개시하고, 생성물은 필터에 보호코팅을 제공하여 필터 또는 용융금속에 열을 제공하거나 화학적 공격에 대해 저항력을 제공하는 용융금속 필터의 테르미트 코팅제를 개시하고 있다. 그러나 상기 코팅제는 촉매화 반응 등에 의한 반응개시로 부식 방지에 뛰어난 납, 크롬 등의 혼합물을 이용함으로 환경을 오염시키는 문제점이 있다.On the other hand, Korean Patent Laid-Open No. 1990-0004889 (Apr. 14, 1990) discloses that a coating reactant is composed of a reactant having a negative free energy and the reactant initiates a reaction by thermal transfer or catalytic reaction with a thermite coating, Discloses a thermite coating of a molten metal filter that provides a protective coating on a filter or molten metal to provide heat or provide resistance to chemical attack. However, the coating agent has a problem of polluting the environment by using a mixture of lead and chromium which is excellent in corrosion prevention due to the initiation of the reaction by catalytic reaction or the like.
또한, 한국공개특허 제2001-0035294호(2001.05.07)에는 크롬산 등이 함유되지 않으면서 우레탄 수지에 폴리올 용액과 폴리이소시아네이트 용액의 경화제를 혼합한 후, 신나, 실리콘류, 아민류 등을 혼합한 속건성 방청 코팅제를 개시하고 있다. 그러나 상기 속건성 방청 코팅제는 경화온도와 경화속도를 촉진시키기 위해 건조 촉진제로서 아민을 사용함으로써 심한 악취가 발생하고 내식성 및 금속 구조물과 코팅층의 부착력 등에 문제가 발생하는 문제점이 있다.Korean Patent Laid-Open Publication No. 2001-0035294 (2001.05.07) discloses a method of mixing a polyol solution with a curing agent of a polyisocyanate solution in a urethane resin without containing chromic acid and the like, A rust-inhibiting coating agent. However, the use of amine as a drying promoter to accelerate the curing temperature and the curing rate of the quick-drying anti-corrosive coating agent causes a bad odor and causes problems such as corrosion resistance and adhesion to the metal structure and the coating layer.
본 발명은 상기의 문제점을 해결하기 위한 것으로, 산화막 제거에 있어서 금속 표면의 막 제거에 효과적인 유기산과 무기산을 혼합하여 혼합산을 사용함으로써, 산화피막 제거 능력을 개선할 수 있는 산화막 제거 조성물을 제공하는 것이다.Disclosure of the Invention The present invention provides an oxide film removing composition capable of improving an oxide film removing ability by mixing an organic acid and an inorganic acid effective for removing a film on a metal surface in removing an oxide film and using a mixed acid will be.
본 발명의 다른 목적은, 전해이온수를 사용함으로써, 혼합산의 함량을 줄이며, 작업환경 개선 및 장비부식 등과 같은 문제점을 개선할 수 있는 산화막 제거 조성물을 제공하는 것이다.It is another object of the present invention to provide an oxide film removing composition capable of reducing the content of mixed acid by using electrolytic ionized water and improving problems such as work environment improvement and equipment corrosion.
본 발명의 또 다른 목적은, 산화막 제거 조성물을 스프레이 또는 붓칠을 하여 산화막 제거를 진행함으로써, 작업 안전성이 우수하고 친환경적인 산화막 제거 조성물을 제공하는 것이다.It is still another object of the present invention to provide an oxide film removing composition which is excellent in work safety and is environmentally friendly, by performing oxide film removal by spraying or brushing the oxide film removing composition.
본 발명은 산화막 제거 조성물에 관한 것이다.The present invention relates to an oxide film removing composition.
이하는 본 발명의 산화막 제거 조성물에 대하여 구체적으로 설명한다.Hereinafter, the oxide film removing composition of the present invention will be described in detail.
본 발명의 산화막 제거 조성물은 유기산 및 무기산의 혼합산 1 ~ 10 중량%, 계면활성제 3 ~ 12 중량%, 킬레이트제 3 ~ 15 중량%, 전해이온수 35 ~ 60 중량% 및 물 10 ~ 50 중량%를 포함한다.The oxide film removing composition of the present invention comprises 1 to 10 wt% of a mixed acid of an organic acid and an inorganic acid, 3 to 12 wt% of a surfactant, 3 to 15 wt% of a chelate, 35 to 60 wt% of electrolytic ionized water, and 10 to 50 wt% .
상기 유기산 및 무기산의 혼합산은 산화막 제거 목적으로 사용되며, 상기 유기산은 구체적으로 예를 들면, 초산(Acetic acid), 글리콜산(Glycolic acid), 구연산(Citric acid), 글루콘산(Gluconic acid), 요산(Uric acid), 설폰산(Sulfonic acid), 붕산(Boric acid), 시트르산(Citric acid) 및 젖산(Lactic acid)의 군에서 선택되는 어느 하나 또는 둘 이상이며, 바람직하게는 글리콜산을 사용하는 것이 유기산 원료 특유의 냄새가 없고 물에 대한 용해도가 우수하여 제조 후 제품 안정성이 우수한 이유로 좋다. 상기 무기산은 황산, 질산, 염산 및 인산의 군에서 선택되는 어느 하나 또는 둘 이상인 것이나, 반드시 이에 제한되지는 않는다. The mixed acid of the organic acid and the inorganic acid is used for the removal of the oxide film and the organic acid specifically includes, for example, acetic acid, glycolic acid, citric acid, gluconic acid, One or two or more selected from the group consisting of Uric acid, Sulfonic acid, Boric acid, Citric acid and Lactic acid, preferably glycolic acid There is no specific odor of organic acid raw material and it is good because of its excellent solubility in water and excellent product stability after production. The inorganic acid may be any one or more selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid and phosphoric acid, but is not necessarily limited thereto.
본 발명은 유기산 및 무기산의 혼합산을 사용함으로써, 환경에 유해한 무기산을 단독으로 사용하는 경우보다 산화막 제거 능력을 향상시키는 것에 특징이 있다. 또한, 상기 유기산 및 무기산의 혼합산은 본 발명의 목적 달성을 위하여 유기산 : 무기산 = 1 : 5 ~ 5 : 1의 중량비로 혼합된 것을 사용하는 것이 바람직하지만, 반드시 제한되지는 않는다. 유기산 및 무기산의 혼합산의 함량은 1 ~ 10 중량%를 사용하는 것이 바람직하다. 1 중량 % 이하인 경우 산화피막 제거능력이 미미하며, 10 중량%를 초과하는 경우 무기산의 유해한 가스 발생으로 인하여 작업환경 및 장비 부식 등의 문제가 발생할 수 있다.The present invention is characterized by using a mixed acid of an organic acid and an inorganic acid to improve an oxide film removing ability as compared with the case where an inorganic acid harmful to the environment is used alone. In order to achieve the object of the present invention, the mixed acid of organic acid and inorganic acid is preferably used in a weight ratio of organic acid: inorganic acid = 1: 5 to 5: 1, but is not limited thereto. The content of the mixed acid of an organic acid and an inorganic acid is preferably 1 to 10% by weight. If the content is less than 1 wt%, the ability to remove the oxide film is insignificant. If the content is more than 10 wt%, problems such as work environment and equipment corrosion may occur due to generation of harmful gas of inorganic acid.
상기 계면활성제는 표면장력 저하 효과로 부터 우수한 세정력을 부여하여 산화막 제거 후 금속 표면에 잔존하는 금속 착화합물을 효과적으로 제거하기 위하여 사용된다. 예를 들면, 음이온성 계면활성제, 양이온성 계면활성제, 아민류, 에테르류, 알코올류, 글리콜류 및 글리콜 에테르류의 군에서 선택되는 어느 하나 또는 둘 이상을 사용할 수 있지만, 반드시 이에 제한되지는 않는다. 상기 음이온성 계면활성제는 예를 들면, 옥테니딘 디하이드로클로라이드, 세틸트리메틸암모늄브로마이드, 세틸트리메틸암모늄클로라이드, 벤즈알코늄클로라이드 및 디옥타데실디메틸암모늄브로마이드로 이루어진 것이며, 상기 음이온성 계면활성제는 예를 들면, 암모늄라우릴설페이트, 소듐도데실설페이트, 디옥틸소듐설포석시네이트 및 퍼플루오고옥탄설포네이트로 이루어진 군에서 선택되는 하나 또는 둘 이상을 사용할 수 있지만 반드시 이에 제한되지는 않는다. The surfactant is used to effectively remove the metal complexes remaining on the metal surface after removal of the oxide film by imparting excellent detergency to the surface tension reducing effect. For example, one or more selected from the group of anionic surfactants, cationic surfactants, amines, ethers, alcohols, glycols and glycol ethers can be used, but not always limited thereto. The anionic surfactant is, for example, composed of octenidine dihydrochloride, cetyltrimethylammonium bromide, cetyltrimethylammonium chloride, benzalkonium chloride and dioctadecyldimethylammonium bromide, and the anionic surfactant includes, for example, But are not necessarily limited to, one or more selected from the group consisting of ammonium lauryl sulfate, sodium dodecyl sulfate, dioctyl sodium sulfosuccinate, and perfluorooctane sulfonate.
상기 계면활성제를 구체적으로 예를 들면, 하기 화학식 1 및 화학식 2로 표시되는 화합물로 이루어진 군에서 선택되는 어느 하나 또는 둘 이상을 사용할 수 있으며, 이에 한정되지는 않는다. The surfactant may be, for example, selected from the group consisting of compounds represented by the following formulas (1) and (2), but is not limited thereto.
[화학식 1][Chemical Formula 1]
[화학식 2](2)
[상기 화학식 1 및 화학식 2에서,[In the above formulas (1) and (2)
m은 1 ~ 5의 정수이고, R1은 수소 또는 (C1-C4)알킬이며, R2는 (C1-C8)알킬이다.]m is an integer from 1 to 5, R 1 is hydrogen or (C 1 -C 4 ) alkyl, and R 2 is (C 1 -C 8 ) alkyl.
상기 계면활성제를 더욱 구체적으로 예를 들면, 모노 에틸렌 글리콜 모노 벤질 에테르, 디 에틸렌 글리콜 모노 벤질 에테르, 트리 에틸렌 글리콜 모노 벤질 에테르, 테트라 에틸렌 글리콜 모노 벤질 에테르, 펜타 에틸렌 글리콜 모노 벤질 에테르, 디 에틸렌 글리콜 모노 메틸 에테르, 트리 에틸렌 글리콜 모노 메틸 에테르, 테트라 에틸렌 글리콜 모노 메틸 에테르, 디 에틸렌 글리콜 모노 에틸 에테르, 트리 에틸렌 글리콜 모노 에틸 에테르, 트리 에틸렌 글리콜 모노 프로필 에테르, 테트라 에틸렌 글리콜 모노 프로필 에테르, 디 에틸렌 글리콜 모노 부틸 에테르, 트리 에틸렌 글리콜 모노 부틸 에테르, 트리 에틸렌 글리콜 디 메틸 에테르, 테트라 에틸렌 글리콜 메틸 에틸 에테르, 디 에틸렌 글리콜 디 에틸 에테르, 디 에틸렌 글리콜 디 부틸 에테르, 트리 에틸렌 글리코로 에틸 프로필 에테르, 테트라 에틸렌 글리콜 디 에틸 에테르, 디 에틸렌 글리콜 부틸 프로필 에테르, 트리 에틸렌 글리콜 디 프로필 에테르, 테트라 에틸렌 글리콜 부틸 옥틸 에테르로 이루어진 군으로부터 선택되는 화합물을 사용할 수 있지만, 반드시 제한되지는 않는다. More specifically, the surfactant may be, for example, monoethylene glycol monobenzyl ether, diethylene glycol monobenzyl ether, triethylene glycol monobenzyl ether, tetraethylene glycol monobenzyl ether, pentaethylene glycol monobenzyl ether, diethylene glycol mono Methyl ether, triethylene glycol monomethyl ether, tetraethylene glycol monomethyl ether, diethylene glycol monoethyl ether, triethylene glycol monoethyl ether, triethylene glycol monopropyl ether, tetraethylene glycol monopropyl ether, diethylene glycol monobutyl Ether, triethylene glycol monobutyl ether, triethylene glycol dimethyl ether, tetraethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, tri But are not limited to, compounds selected from the group consisting of ethylene glycol diethyl ether, ethylene glycol diethyl ether, ethylene glycol diethylene glycol ether, ethylene glycol diethylene glycol, tylene glycol ethoxypropyl ether, tetraethylene glycol diethyl ether, diethylene glycol butyl propyl ether, triethylene glycol dipropyl ether and tetraethylene glycol butyl octyl ether. Do not.
상기 계면활성제의 함량은 3 ~ 12 중량% 사용하는 것이 바람직하다. 3 중량% 미만인 경우 산화막 제거 후 발생되는 금속 착화합물의 세정 성능 및 전해이온수에 대한 린스성 저하에 문제가 있을 수 있고, 12 중량%를 초과하는 경우 제품 제조 시 균일상 유지에 문제가 있을 수 있다.The content of the surfactant is preferably 3 to 12 wt%. If it is less than 3% by weight, there may be a problem of deterioration of rinsing property against electrolytic ionized water and cleaning performance of a metal complex after the oxide film is removed. If it exceeds 12% by weight,
상기 킬레이트제는 금속 착화합물을 효과적으로 제거하기 위하여 사용된다. 구체적으로 예를 들면, 에틸렌디아민사초산(Ethylene Diamine Tetra Acetic Acid : EDTA), 디에틸렌트리아민오초산(Diethylene Triamine Penta Acetic Acid : DTPA), 나이트릴로삼초산(Nitrilotri Acetic Acid : NTA), 하이드록시에틸이덴디포스포릭산(Hydroxy Ethylidene DiPhosphoric Acid : HEDPA) 및 아인산(Phosphorous Acid)으로 이루어진 군에서 선택되는 어느 하나 또는 둘 이상을 사용할 수 있으나, 반드시 이에 제한되지는 않는다. 그 함량은 3 ~ 15 중량% 사용하는 것이 바람직하다. 3 중량% 미만인 경우 금속 착화합물의 제거 능력이 미미하며, 15 중량%를 초과하는 경우 세정제의 제품 제조 시 균일상 유지에 문제가 있을 수 있다.The chelating agent is used to effectively remove the metal complex. Specific examples thereof include ethylenediamine tetraacetic acid (EDTA), diethylene triamine penta acetic acid (DTPA), nitrilotriacetic acid (NTA), hydroxyethyl And one or more selected from the group consisting of Hydroxy Ethyl Diene Di Phosphoric Acid (HEDPA) and Phosphorous Acid, but the present invention is not limited thereto. The content thereof is preferably 3 to 15% by weight. If it is less than 3% by weight, the ability to remove metal complexes is insignificant, and if it exceeds 15% by weight, there may be a problem in keeping the cleaning agent uniformly on the day of manufacture of the product.
상기 전해이온수는 효과적인 산화막 제거를 위하여 사용된다. 상기 전해이온수는 물을 전기분해 하여 pH 1 ~ 5의 산성수인 양극 전해이온수를 사용할 수 있다. 본 발명에서 전해이온수를 산화막 제거 조성물로 사용함으로써, 유기산 무기산의 혼합산을 30 중량% 이상 사용에서 10 중량% 이하 사용으로 획기적으로 줄일 수 있으며, 작업 환경의 개선 및 장비 부식과 같은 문제점을 해결할 수 있다. 그 함량은 35 ~ 60 중량%를 사용하는 것이 바람직하며, 더욱 바람직하게는 40 ~ 50 중량% 사용하는 것이 좋다. 35 중량% 미만인 경우, 유기산 및 무기산의 혼합산의 함량을 줄이는 효과가 미비하고, 60 중량%를 초과하는 경우, 산화막 제거에 대하여 더 이상의 성능 개선의 효과가 없을 수 있다.The electrolytic ionized water is used for effective oxide film removal. The electrolytic ionized water may be electrolyzed water to use an electrolytic electrolytic ionized water having an acidic pH of 1 to 5. By using electrolytic ionized water as an oxide film removing composition in the present invention, mixed acid of organic acid inorganic acid can be drastically reduced from use of not less than 30 wt% to not more than 10 wt%, and problems such as improvement of work environment and equipment corrosion can be solved have. The content thereof is preferably 35 to 60% by weight, more preferably 40 to 50% by weight. If it is less than 35% by weight, the effect of reducing the content of mixed acid of organic acid and inorganic acid is insufficient, and if it exceeds 60% by weight, there is no effect of further improvement in performance of oxide film removal.
본 발명에서 상기 전해이온수를 채택하여 사용하는 경우, 놀랍게도 산화막 제거에 소요되는시간이 단축되고, 산화막제거율 또한 증가되는 것에 특징이 있다.In the present invention, when the electrolytic ionized water is employed, surprisingly, the time required for removing the oxide film is shortened and the oxide film removal rate is also increased.
상기 물은 산화막 조성물의 용해도를 위하여 사용되며, 본 발명에서 물은 산화막 제거 조성물 중 잔여량을 투입하여 1 ℓ로 맞춘다. 구체적으로 예를 들면, 상기 물은 공업용수, 수돗물, 증류수를 사용할 수 있으며, 바람직하게는 3차 증류수를 사용하는 것이 좋다. 그 함량은 10 ~ 50 중량%인 것이 바람직하다. The water is used for the solubility of the oxide film composition. In the present invention, water is added to the remaining amount of the oxide film removing composition and adjusted to 1 liter. Specifically, for example, the water may be industrial water, tap water, distilled water, and preferably, third distilled water. The content thereof is preferably 10 to 50% by weight.
본 발명의 산화막 제거 조성물의 제조방법에 있어서, 여러 가지 성분을 임의의 순서대로 혼합하여도 무방하며, 본 발명의 산화막 제거조성물을 이용한 산화막 제거제도 본 발명의 범위에 포함된다.In the method for producing the oxide film removing composition of the present invention, various components may be mixed in any order, and the oxide film removing agent using the oxide film removing composition of the present invention is also included in the scope of the present invention.
본 발명의 산화막 제거 조성물은 혼합산 및 전해이온수를 포함함으로써, 산화막 제거 능력을 향상시키고, 혼합산의 함량을 줄여 작업환경 개선 및 장비부식과 같은 문제점을 개선하는 것에 특징이 있다.The oxide film removing composition of the present invention is characterized in that it includes mixed acid and electrolytic ionized water to improve the oxide film removing ability and reduce the content of mixed acid to improve problems such as work environment improvement and equipment corrosion.
본 발명의 산화막 제거 조성물은 유기산 및 무기산의 혼합산, 계면활성제, 킬레이트제, 전해이온수 및 물을 포함함으로써, 금속 표면의 산화막 제거에 탁월한 효과가 있고, 산화막 제거 후 남아있는 금속 착화합물의 제거에도 우수하다.The oxide film removing composition of the present invention has an excellent effect for oxide film removal on the metal surface by including a mixed acid of organic acid and inorganic acid, a surfactant, a chelating agent, electrolytic ionized water and water, Do.
또한, 비휘발성 유기산 및 무기산의 혼합산 및 전해이온수를 이용함으로써, 작업 안전성이 우수하고 수질 및 대기오염 방지력이 우수하며, 친환경적이다. In addition, by using mixed acid of non-volatile organic acid and inorganic acid and electrolytic ionized water, it is excellent in work safety, excellent in water quality and air pollution prevention ability, and is environmentally friendly.
이하는 본 발명을 보다 구체적으로 설명하기 위하여, 일예를 들어 설명하는바, 본 발명이 하기 실시예에 한정되는 것은 아니다.
Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples.
이하 물성은 하기의 방법으로 측정하였다.The following physical properties were measured by the following methods.
1)산화막 제거율(%)1) Oxide film removal rate (%)
표면이 산화된 철근, 철골 구조물에 상온에서 제조한 각각의 산화막 제거 조성물 원액을 사용하여 스프레이 도포 처리 후 각각 5분간 방치하였다. 스프레이 도포 처리 후, 금속 구조물의 표면 산화막이 제거되는 현상을 육안 관찰하였다.The surfaces of the reinforced steel and steel structure were oxidized by spray coating using the stock solution of each oxide film removing composition prepared at room temperature and left for 5 minutes, respectively. After the spray coating treatment, the phenomenon that the surface oxide film of the metal structure was removed was visually observed.
이때, 금속표면의 총 면적 중 미제거된 산화막이 잔존하는 면적을 환산하여 제거율로 표기하였다. 즉, 산화막이 없다면 제거율을 100 %이며, 전체 면적 중 50 % 면적에 산화막이 잔존하면 제거율을 50 %로 표기하였다.In this case, the area of the oxide film remaining in the total area of the metal surface is converted into the area of the oxide film, which is expressed as the removal rate. That is, if the oxide film is absent, the removal rate is 100%. If the oxide film remains in the area of 50% of the total area, the removal rate is 50%.
2) 산화막 제거에 소요되는 시간2) Time to remove oxide film
상기 산화막 제거율 시험과 동일하게 실시하되 금속 표면에 잔존하는 산화막의 제거가 95 %가 될 때까지 스프레이 도포를 실시하였다. 스프레이 도포시간이 10 분이 경과하여도 오염물이 잔존하면 “-”로 표시하였다.
Spray application was performed in the same manner as in the oxide removal rate test until the removal of the remaining oxide film on the metal surface was 95%. If the contaminant remains even after 10 minutes of spray application time, it is marked as " - ".
3) 금속 착화합물 제거력3) Removal power of metal complex
상기 금속 산화막 제거율 실험 시 스프레이 도포 처리 후 각각 5분간 방치하였을 경우, 금속 산화막과 별도로 금속 표면에 백화 상태의 금속 착화합물이 잔좋나는 현상이 발생되는데 이때 백화형태의 금속 착화합물의 잔착 정도에 따라 하기 표 1과 같이 평가 하였다.When the metal oxide removal rate is measured for 5 minutes after the spray coating, the whiteness of the metal complex is observed on the metal surface separately from the metal oxide film. In this case, 1.
[표 1][Table 1]
4) 장비 부식4) Equipment Corrosion
상기 장비 부식 발생 실험은 공업용 화학 공정 장비에 가장 많이 사용되는 Stainless steel 금속을 이용하여 24시간 침적시킨 후 Stainless steel 금속의 표면의 부식현상(흙갈색 발청 발생)을 육안으로 확인하여 평가 하였다.
The equipment corrosion test was conducted by observing the corrosion phenomenon of the surface of the stainless steel metal (the occurrence of the brown dusting of the ground) visually after immersing it for 24 hours by using the stainless steel metal which is most used in the industrial chemical processing equipment.
5) 유해가스 발생(관능평가)5) Hazardous gas generation (sensory evaluation)
상기 유해 가스 발생 실험은 실시예 및 비교예 샘플 제조 시 유기산 및 무기산의 혼합산 사용 시 발생되는 가스를 육안 및 후각 등의 관능 평가를 통하여 평가 하였다.
The noxious gas generation test was performed through sensory evaluation such as visual and olfactory sensation of gases generated when mixed acids of organic acid and inorganic acid were used in the production of the samples of the Examples and Comparative Examples.
실시예 1 내지 12 및 비교예 1 내지 13Examples 1 to 12 and Comparative Examples 1 to 13
하기 표 2의 조성으로 실시예 1 내지 12 및 비교예 1 내지 13의 산화막 제거 조성물을 제조하였다. 이때, 물에 유기산 및 무기산의 혼합산, 계면활성제, 킬레이트제 및 전해이온수를 가하고 상온에서 투명액상이 될 때까지 교반하여 제조하였다.
The oxide film removing compositions of Examples 1 to 12 and Comparative Examples 1 to 13 were prepared with the compositions shown in Table 2 below. At this time, a mixed acid of organic acid and inorganic acid, a surfactant, a chelating agent and electrolytic ionized water were added to water and stirred at room temperature until a clear liquid state was obtained.
[표 2] (표 2에서 함량은 중량%임)[Table 2] (content in Table 2 is% by weight)
상기 표 2에서, In Table 2,
DEBG : 디 에틸렌 글리콜 모노 부틸 에테르DEBG: diethylene glycol monobutyl ether
DEBG-M : 디 에틸렌 글리콜 디 부틸 에테르DEBG-M: Diethylene glycol dibutyl ether
EDTA : 에틸렌디아민사초산EDTA: Ethylenediamine < RTI ID = 0.0 >
DTPA : 디에틸렌트리아민오초산
DTPA: diethylenetriamine oxalate
[표 3][Table 3]
상기 표 3으로부터 유기산 및 무기산의 혼합산, 계면활성제, 킬레이트제, 전해이온수 및 물을 포함하는 산화막 제거 조성물은, 산화막 제거에 탁월한 효과가 있다. 또한, 산화막 제거제 사용 후 발생되는 금속 착화합물을 효과적으로 제거 할 수 있음을 알 수 있었다. 이는 본 발명의 산화막 제거 조성물에 계면활성제 및 킬레이트제를 사용함으로써 금속 착화합물을 효과적으로 제거할 수 있는 것을 알 수 있다.From Table 3 above, the oxide film removing composition containing mixed acid of organic acid and inorganic acid, surfactant, chelating agent, electrolytic ionized water and water has an excellent effect for oxide film removal. In addition, it was found that the metal complexes generated after using the oxide film remover can be effectively removed. It can be seen that the metal complex can be effectively removed by using a surfactant and a chelating agent in the oxide film removing composition of the present invention.
Claims (6)
상기 전해 이온수는 물을 전기분해하여 제조된 pH 1 ~ 5의 산성수인 양극 전해 이온수이며,
상기 유기산은 초산(Acetic acid), 글리콜산(Glycolic acid), 구연산(Citric acid), 글루콘산(Gluconic acid), 요산(Uric acid), 설폰산(Sulfonic acid), 붕산(Boric acid), 시트르산(Citric acid) 및 젖산(Lactic acid)의 군에서 선택되는 어느 하나 또는 둘 이상을 포함하며,
상기 무기산은 황산, 질산, 염산 및 인산의 군에서 선택되는 어느 하나 또는 둘 이상을 포함하며,
상기 계면활성제는 음이온성 계면활성제, 양이온성 계면활성제, 아민류, 에테르류, 알코올류, 글리콜류 및 글리콜 에테르류의 군에서 선택되는 어느 하나 또는 둘 이상을 포함하며,
상기 킬레이트제는 에틸렌디아민사초산, 디에틸렌트리아민오초산, 나이트릴로삼초산, 하이드록시에틸이덴디포스포릭산 및 아인산의 군에서 선택되는 어느 하나 또는 둘 이상을 포함하는 것인 산화막 제거 조성물.1 to 10 wt% of a mixed acid of an organic acid and an inorganic acid, 3 to 12 wt% of a surfactant, 3 to 15 wt% of a chelate, 35 to 60 wt% of electrolytic ionized water, and 10 to 50 wt%
The electrolytic ionized water is a cathode electrolytic ionized water which is an acidic water having a pH of 1 to 5,
The organic acid may be selected from the group consisting of acetic acid, glycolic acid, citric acid, gluconic acid, uric acid, sulfonic acid, boric acid, Citric acid, and Lactic acid, and more preferably,
The inorganic acid includes any one or two or more selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid and phosphoric acid,
The surfactant includes any one or two or more selected from the group of anionic surfactants, cationic surfactants, amines, ethers, alcohols, glycols and glycol ethers,
Wherein the chelating agent comprises any one or two or more selected from the group consisting of ethylenediaminetetraacetic acid, diethylenetriamineacetic acid, nitriloic acid, hydroxyethylidenedipphosphonic acid and phosphorous acid.
상기 유기산 및 무기산의 혼합산은 유기산 : 무기산 = 1 : 5 ~ 5 : 1의 중량비로 혼합된 것인 산화막 제거 조성물.The method according to claim 1,
Wherein the mixed acid of organic acid and inorganic acid is mixed at a weight ratio of organic acid: inorganic acid = 1: 5 to 5: 1.
상기 계면활성제는 하기 화학식 1 및 화학식 2로 표시되는 화합물로 이루어진 군에서 선택되는 어느 하나 또는 둘 이상인 것인 산화막 제거 조성물.
[화학식 1]
[화학식 2]
[상기 화학식 1 및 화학식 2에서,
m은 1 ~ 5의 정수이고,
R1은 수소 또는 (C1-C4)알킬이며,
R2는 (C1-C8)알킬이다.]The method according to claim 1,
Wherein the surfactant is one or more selected from the group consisting of compounds represented by the following formulas (1) and (2).
[Chemical Formula 1]
(2)
[In the above formulas (1) and (2)
m is an integer of 1 to 5,
R 1 is hydrogen or (C 1 -C 4 ) alkyl,
R 2 is (C 1 -C 8 ) alkyl.]
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