KR101573301B1 - 유리 기판용 용기 - Google Patents
유리 기판용 용기 Download PDFInfo
- Publication number
- KR101573301B1 KR101573301B1 KR1020117010802A KR20117010802A KR101573301B1 KR 101573301 B1 KR101573301 B1 KR 101573301B1 KR 1020117010802 A KR1020117010802 A KR 1020117010802A KR 20117010802 A KR20117010802 A KR 20117010802A KR 101573301 B1 KR101573301 B1 KR 101573301B1
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- KR
- South Korea
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- glass substrate
- reinforcing member
- container
- side wall
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 106
- 239000011521 glass Substances 0.000 title claims abstract description 105
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 77
- 230000003139 buffering effect Effects 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 description 6
- -1 polypropylene Polymers 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/07—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using resilient suspension means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는 유리 기판용 용기의 용기 본체의 평면도로서, (a)는 보강 부재가 장착되기 전의 상태, (b)는 보강 부재가 장착된 상태를 나타낸다.
도 3은 유리 기판용 용기의 용기 본체의 주요부 확대 단면도로서, (a)는 보강 부재가 장착되기 전의 상태, (b)는 보강 부재가 장착된 상태를 나타낸다.
도 4는 유리 기판용 용기의 용기 본체에 유리 기판이 수용된 상태의 평면도를 나타낸다.
도 5는 다른 실시예에 관한 유리 기판용 용기의 용기 본체의 주요부 확대 평면도로서, (a)~(c)는, 각각 보강 부재의 형태가 상이한 것을 나타낸다.
도 6은 종래의 유리 기판용 용기 및 그 용기 본체 중에 수용되는 유리 기판의 사시도를 나타낸다.
도 7은 유리 기판용 용기의 용기 본체에 유리 기판이 수용된 상태의 평면도를 나타낸다.
2: 수용부
2a: 모서리부
2a': 장착 오목부
2a'': 장착 오목부
3: 저부
4: 측벽부
5: 퇴피 오목부
6, 6', 6'', 6''': 보강 부재
6a, 6a', 6a'', 6a''': 한쪽 부분
6b, 6b', 6b'': 다른 쪽 부분
7: 보강 부재
X: 유리 기판
X1: 프린트 기판
Claims (4)
- 저부(底部) 및 상기 저부를 에워싸는 측벽부에 의해 발포 수지 성형품으로 이루어지는 용기 본체가 구성되며, 상기 용기 본체 내에, 유리 기판을 수평으로 하여 수용하기 위한 수용부가 형성되는 유리 기판용 용기에 있어서,
상기 유리 기판의 모서리부에 대응하여 설치되는 상기 수용부의 모서리부에, 상기 유리 기판의 일방향 및 상기 일방향과 직교하는 다른 방향 중 적어도 어느 한 방향에 대하여 완충 작용을 가지는 보강 부재가 배치되며, 상기 보강 부재는, 상기 측벽부의 두께 방향으로 형성되는 장착 오목부에 장착되고, 상기 보강 부재의 내면과 상기 측벽부의 내면이 면일치로 되는, 유리 기판용 용기. - 제1항에 있어서,
상기 보강 부재는, 상기 유리 기판의 일방향에 대하여 완충 작용을 가지는 한쪽 부분과, 상기 한쪽 부분과 직교하고, 상기 유리 기판의 다른 방향에 대하여 완충 작용을 가지는 다른 쪽 부분을 포함하는, 유리 기판용 용기. - 제2항에 있어서,
상기 보강 부재의 한쪽 부분 및 다른 쪽 부분은, 각각 플레이트형으로 형성되는, 유리 기판용 용기. - 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2009-032752 | 2009-02-16 | ||
JP2009032752A JP5227827B2 (ja) | 2009-02-16 | 2009-02-16 | ガラス基板用容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110115997A KR20110115997A (ko) | 2011-10-24 |
KR101573301B1 true KR101573301B1 (ko) | 2015-12-01 |
Family
ID=42561762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117010802A Active KR101573301B1 (ko) | 2009-02-16 | 2010-02-08 | 유리 기판용 용기 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5227827B2 (ko) |
KR (1) | KR101573301B1 (ko) |
CN (1) | CN202089455U (ko) |
TW (1) | TWI476134B (ko) |
WO (1) | WO2010092920A1 (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101920816B (zh) * | 2010-08-24 | 2012-04-18 | 友达光电股份有限公司 | 包装缓冲装置 |
JP5826569B2 (ja) * | 2011-09-12 | 2015-12-02 | 積水化成品工業株式会社 | 板状体の搬送用容器 |
CN102616488B (zh) * | 2012-04-13 | 2014-04-02 | 深圳市华星光电技术有限公司 | 一种液晶玻璃包装盒 |
US8777007B2 (en) | 2012-04-13 | 2014-07-15 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Packaging box for liquid crystal glass |
TWI432367B (zh) * | 2012-04-13 | 2014-04-01 | Au Optronics Corp | 緩衝包裝盒 |
JP2014009020A (ja) * | 2012-06-29 | 2014-01-20 | Sekisui Plastics Co Ltd | 梱包材および梱包体 |
TWI462211B (zh) * | 2012-06-29 | 2014-11-21 | Au Optronics Corp | 承載裝置與承載裝置及被載物之組合 |
JP5917316B2 (ja) * | 2012-06-29 | 2016-05-11 | 積水化成品工業株式会社 | 梱包材および梱包体 |
CN102849355B (zh) * | 2012-09-26 | 2015-02-25 | 深圳市华星光电技术有限公司 | 液晶玻璃面板包装结构 |
TWI447054B (zh) * | 2012-10-09 | 2014-08-01 | Au Optronics Corp | 箱體及裝載顯示面板的箱體 |
CN102923394B (zh) * | 2012-10-17 | 2016-03-30 | 深圳市华星光电技术有限公司 | 一种用于容纳板体的包装箱 |
KR200473820Y1 (ko) * | 2012-11-29 | 2014-07-31 | 주식회사 삼일이노팩 | 디스플레이장치용 스티로폼 포장재 |
TWI561443B (en) * | 2012-11-30 | 2016-12-11 | Au Optronics Corp | Packing box |
CN103204291B (zh) * | 2013-04-19 | 2015-09-09 | 深圳市华星光电技术有限公司 | 一种包装装置 |
KR101497422B1 (ko) * | 2013-10-22 | 2015-03-02 | 주식회사 삼진엘앤디 | 디스플레이 패널 보호용 슬롯 |
TWM477042U (en) * | 2013-12-05 | 2014-04-21 | Sekisui Plastics Co Ltd | Reinforcing member and panel transportation vessel |
CN103723386B (zh) * | 2014-01-08 | 2016-03-16 | 友达光电(苏州)有限公司 | 面板承载箱 |
CN104185415B (zh) * | 2014-08-21 | 2018-01-16 | 昆山龙腾光电有限公司 | 基板定位承载装置、基板组立系统及基板组立方法 |
CN104401598B (zh) * | 2014-10-31 | 2017-02-01 | 京东方科技集团股份有限公司 | 显示面板的包装装置 |
JP3198009U (ja) * | 2015-03-31 | 2015-06-11 | 積水化成品工業株式会社 | 梱包材及び梱包体 |
US11008150B2 (en) * | 2016-05-18 | 2021-05-18 | Sakai Display Products Corporation | Storage container |
KR101687758B1 (ko) * | 2016-06-24 | 2016-12-19 | (주) 다쓰테크 | 유연기판 또는 유리기판 위에 도금하기 위한 전기 도금장치용 스테이지 |
WO2018016077A1 (ja) * | 2016-07-22 | 2018-01-25 | 堺ディスプレイプロダクト株式会社 | 収納容器 |
JP6357218B2 (ja) * | 2016-12-28 | 2018-07-11 | 積水化成品工業株式会社 | 梱包材および梱包体 |
KR20220022003A (ko) | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | 표시 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088921A (ja) * | 2003-09-16 | 2005-04-07 | Dainippon Printing Co Ltd | 基板収納ケース |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM326523U (en) * | 2007-08-08 | 2008-02-01 | Ynidyi Entpr Co Ltd | Packaging box for LCD panel with enhanced buffering function |
-
2009
- 2009-02-16 JP JP2009032752A patent/JP5227827B2/ja active Active
-
2010
- 2010-02-08 KR KR1020117010802A patent/KR101573301B1/ko active Active
- 2010-02-08 CN CN2010900006164U patent/CN202089455U/zh not_active Expired - Lifetime
- 2010-02-08 WO PCT/JP2010/051766 patent/WO2010092920A1/ja active Application Filing
- 2010-02-12 TW TW099104739A patent/TWI476134B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005088921A (ja) * | 2003-09-16 | 2005-04-07 | Dainippon Printing Co Ltd | 基板収納ケース |
Also Published As
Publication number | Publication date |
---|---|
TW201041788A (en) | 2010-12-01 |
KR20110115997A (ko) | 2011-10-24 |
WO2010092920A1 (ja) | 2010-08-19 |
JP2010189013A (ja) | 2010-09-02 |
CN202089455U (zh) | 2011-12-28 |
JP5227827B2 (ja) | 2013-07-03 |
TWI476134B (zh) | 2015-03-11 |
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