KR101537798B1 - 백색 발광 다이오드 패키지 - Google Patents
백색 발광 다이오드 패키지 Download PDFInfo
- Publication number
- KR101537798B1 KR101537798B1 KR1020080095925A KR20080095925A KR101537798B1 KR 101537798 B1 KR101537798 B1 KR 101537798B1 KR 1020080095925 A KR1020080095925 A KR 1020080095925A KR 20080095925 A KR20080095925 A KR 20080095925A KR 101537798 B1 KR101537798 B1 KR 101537798B1
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- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- chips
- red
- white light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
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- Led Device Packages (AREA)
Abstract
Description
Claims (11)
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- 교류전원에 연결되는 제1 및 제2 리드 단자들;상기 제1 및 제2 리드 단자에 연결되고 각각 적색 발광 다이오드 칩을 포함하는 제1 내지 제4 브리지부들로 이루어진 브리지 정류기;단일 기판 상에 서로 직렬 연결된 복수개의 발광셀들의 어레이를 갖고 상기 브리지 정류기에 연결된 청색 발광 다이오드 칩; 및상기 청색 발광 다이오드 칩에서 방출된 광의 일부를 파장변환시키는 황색 형광체를 포함하고,상기 브리지 정류기는 상기 적색 발광 다이오드 칩 및 상기 청색 발광 다이오드 칩에 정류 전류를 공급하고,상기 청색 발광 다이오드칩은 상기 브리지 정류기의 노드들 사이에서 서로 직렬 연결되고,동작시, 상기 청색 발광 다이오드 칩에 인가되는 전압과 상기 브리지부들 내의 적색 발광 다이오드 칩들에 인가되는 전압은 각각, 패키지에 인가되는 전체 전압에 대해, 65~90% 범위 및 10~35% 범위 내에 있으며,2500~4000K의 온백색광을 구현하는 백색 발광 다이오드 패키지.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080095925A KR101537798B1 (ko) | 2008-09-30 | 2008-09-30 | 백색 발광 다이오드 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080095925A KR101537798B1 (ko) | 2008-09-30 | 2008-09-30 | 백색 발광 다이오드 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100038252A KR20100038252A (ko) | 2010-04-14 |
KR101537798B1 true KR101537798B1 (ko) | 2015-07-22 |
Family
ID=42215113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080095925A Active KR101537798B1 (ko) | 2008-09-30 | 2008-09-30 | 백색 발광 다이오드 패키지 |
Country Status (1)
Country | Link |
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KR (1) | KR101537798B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8395312B2 (en) * | 2010-04-19 | 2013-03-12 | Bridgelux, Inc. | Phosphor converted light source having an additional LED to provide long wavelength light |
KR101149325B1 (ko) * | 2010-05-12 | 2012-05-23 | 주식회사 루멘스 | 발광 다이오드 모듈 |
KR102006389B1 (ko) | 2013-03-14 | 2019-08-02 | 삼성전자주식회사 | 발광 소자 패키지 및 발광 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070070147A (ko) * | 2007-06-22 | 2007-07-03 | 서울옵토디바이스주식회사 | 지연형광체를 구비하는 교류용 발광소자 |
KR20080059785A (ko) * | 2006-12-26 | 2008-07-01 | 서울옵토디바이스주식회사 | 다수의 발광셀을 갖는 발광소자 |
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2008
- 2008-09-30 KR KR1020080095925A patent/KR101537798B1/ko active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080059785A (ko) * | 2006-12-26 | 2008-07-01 | 서울옵토디바이스주식회사 | 다수의 발광셀을 갖는 발광소자 |
KR20070070147A (ko) * | 2007-06-22 | 2007-07-03 | 서울옵토디바이스주식회사 | 지연형광체를 구비하는 교류용 발광소자 |
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Publication number | Publication date |
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KR20100038252A (ko) | 2010-04-14 |
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