KR101535718B1 - Wafer level molding apparatus - Google Patents

Abstract

The apparatus includes a first mold for supporting a wafer on which semiconductor chips are mounted, and a second mold disposed to face the first mold and having a cavity for molding the semiconductor chips do. At this time, a plurality of gates for providing a molding resin for molding the semiconductor chips and a plurality of air vents for removing air from the cavity are connected to edge portions of the cavity.

Description

[0001] WAFER LEVEL MOLDING APPARATUS [0002]

Embodiments of the present invention relate to a wafer level molding apparatus. And more particularly to a wafer level molding apparatus for mounting a plurality of chips on a wafer and then performing a molding process for the semiconductor chips on the wafer.

In general, a molding process for molding semiconductor packages is performed by disposing a substrate such as a lead frame or a printed circuit board on which semiconductor chips are mounted in a mold and injecting a molding resin such as epoxy resin into a cavity of the mold Lt; / RTI > The apparatus for performing the molding process includes a transfer molding method of injecting a molten resin or a liquid resin into the cavity, a method of supplying a molding resin, a molten resin or a liquid resin in powder form into the cavity, And a compression molding type device for compressing and molding the molding resin between the lower molds.

However, in recent semiconductor package miniaturization trend, chip size package technology is required. As one example, a wafer level package technology for performing a direct molding process on a wafer is being developed.

An example of the wafer level package technology is disclosed in Korean Patent Laid-Open Publication No. 10-2001-0014657. According to the above-mentioned Japanese Patent Application Laid-Open No. 10-2001-0014657, a compression molding apparatus for manufacturing a wafer level package includes a top mold and a bottom mold, and a resin tablet may be supplied on a wafer placed on the bottom mold. The resin tablet may melt between the upper mold and the lower mold to mold the entire surface of the wafer.

However, in the above-described compression molding apparatus, the resin tablet on the wafer is compressed and melted by the upper mold so as to flow from the central portion to the edge portion of the wafer. However, in the process of compressing the resin tablet, Semiconductor chips and the like may be damaged, and defects such as voids may occur in the completed semiconductor package when the resin tablet is not sufficiently melted.

It is an object of the present invention to provide a transfer molding type wafer level molding apparatus capable of preventing structure damage on a wafer and uniformly providing a molding resin.

A wafer level molding apparatus according to embodiments of the present invention includes a first mold for supporting a wafer on which semiconductor chips are mounted, a second mold having a cavity facing the first mold, Two molds may be included. At this time, a plurality of gates for providing a molding resin for molding the semiconductor chips and a plurality of air vents for removing air from the cavity may be connected to edge portions of the cavity.

According to embodiments of the present invention, the first mold includes a first cavity block for supporting the wafer, a plurality of port blocks connected to edge portions of the first cavity block and providing the molding resin, And a plurality of guide blocks connected to the edge portions of the first cavity block and disposed between the port blocks, wherein the second mold includes a second cavity for providing the cavity, A plurality of curb blocks corresponding to the port blocks and having the gates, and a plurality of air vent blocks corresponding to the guide blocks and having the air vents.

According to embodiments of the present invention, two port blocks may be disposed on either side of the first cavity block, respectively.

According to embodiments of the present invention, each curl block may have a plurality of gates spaced apart at regular intervals, and each air vent block may have a plurality of air vents spaced apart at regular intervals.

According to embodiments of the present invention, each curl block may have at least one well region for temporarily storing the molding resin and then delivering it to the cavity.

According to embodiments of the present invention, the port blocks may be spaced apart at regular intervals.

According to embodiments of the present invention, a release film providing unit for providing a release film on the second mold may be provided, wherein the first mold is provided with a plurality of first vacuum channels for vacuum-sucking the wafer And the second mold may be provided with a plurality of vacuum channels for vacuum adsorption of the release film.

According to embodiments of the present invention, the air vent blocks may be provided with air holes connected to the air vents. The air holes may include a vacuum source for providing a vacuum for adsorbing the release film to the inner surfaces of the air vents to open the air vents, and compressed air to be blocked by the release film To provide a compressed air source.

According to embodiments of the present invention, a first master die on which the first mold is mounted and a second master die on which the second mold is mounted may be provided, and the first and second molds may include the first master Can be resiliently mounted to the die and the second master die, respectively.

According to embodiments of the present invention, the second master die may be provided with the opening / closing members so as to protrude into the air vents through the air vent blocks to open / close the air vents, May protrude into the air vents to block the air vents when a preset clamp pressure is applied to the first and second master dies.

According to embodiments of the present invention, the molding process for the semiconductor chips may be performed at a first clamp pressure at which the air vents are opened, and after the mold resin is filled in the cavity, A second clamp pressure higher than the first clamp pressure may be applied.

According to embodiments of the present invention as described above, the wafer level molding apparatus may include a second mold having a first mold supporting the wafer and a cavity for molding the semiconductor chips on the wafer. At this time, a plurality of gates for supplying molding resin and a plurality of air vents for removing air from the cavity may be connected to edge portions of the cavity.

Since the molding resin can be supplied into the cavity through the gates in a sufficiently melted state in the port blocks connected through the gates and the curl blocks, Can be prevented. Also, since the air inside the cavity can be easily removed through the plurality of air vents, the occurrence rate of defects such as voids during the wafer level molding process can be greatly reduced.

FIG. 1 is a schematic view illustrating a wafer level molding apparatus according to an embodiment of the present invention. Referring to FIG.
Fig. 2 is a schematic plan view for explaining the first mold shown in Fig. 1. Fig.
3 is a schematic bottom view for explaining the second mold shown in Fig.
4 is a schematic plan view for explaining another example of the first mold shown in Fig.
Fig. 5 is a schematic bottom view for explaining another example of the second mold shown in Fig. 1. Fig.
Figs. 6 and 7 are schematic enlarged cross-sectional views for explaining the opening and closing of the air vents shown in Fig.
FIGS. 8 and 9 are schematic structural views for explaining another structure for opening and closing the air vents shown in FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

FIG. 1 is a schematic structural view for explaining a wafer level molding apparatus according to an embodiment of the present invention, FIG. 2 is a schematic plan view for explaining a first mold shown in FIG. 1, and FIG. 3 is a cross- Is a schematic bottom view for explaining a second mold shown in Fig.

1 to 3, a wafer level molding apparatus 10 according to an embodiment of the present invention mounts a plurality of semiconductor chips 30 on a semiconductor wafer 20 through a bonding process, May be used to mold the chips 30 with the molding resin 40. [ In particular, the wafer level molding apparatus 10 may be used to perform a molding process for the semiconductor chips 30 at a semiconductor wafer level, unlike a typical molding process.

According to an embodiment of the present invention, the molding apparatus 10 includes a first mold 100 for supporting a wafer 20 on which a plurality of semiconductor chips 30 are mounted, a second mold 100 for supporting the first mold 100, A second mold 200 having a cavity 202 for molding the semiconductor chips 30 and a release film providing unit 300 for providing a release film 50 on the second mold 200 ). The release film providing unit 300 may include a supply roller 310 for supplying the release film 50 and a winding roller 320 for winding the release film 50.

According to an embodiment of the present invention, a plurality of gates 204 for providing a molding resin 40 for molding the semiconductor chips 30 are formed at edge portions of the cavity 202, A plurality of air vents 206 for removing air from the air vents 206 may be connected.

For example, the first mold 100 may include a first cavity block 110 for supporting the wafer 20, and a second cavity block 110 connected to edge portions of the first cavity block 110, A plurality of guide blocks 130 connected to the other edge portions of the first cavity block 110 and disposed between the port blocks 120; The second mold 200 may include a second cavity block 210 providing the cavity 202 and a second cavity block 210 corresponding to the port blocks 120, And a plurality of air vent blocks 230 corresponding to the guide blocks 130 and having the air vents 206. The air vent blocks 230 may include a plurality of air curtains 220,

Although not shown, the first mold 100 may be provided with a plurality of first vacuum flow paths (not shown) for vacuum-sucking the wafer 20, and the second mold 200 And second vacuum channels (not shown) for vacuum-adsorbing the release film 50 may be provided. Particularly, the second vacuum channels may be disposed so that the release film 50 may be entirely coated on one surface of the second mold 200 where the cavity 202 is formed.

In addition, although the second mold 200 is disposed on the first mold 100, the second mold 200 may be disposed under the first mold 100. That is, the upper and lower arrangements of the first and second dies 100 and 200 may be changed and thus the scope of the present invention is not limited thereto.

According to an embodiment of the present invention, two port blocks 120 may be disposed on both sides of the first cavity block 110, and two guide blocks 130 may be disposed on both sides of the port blocks 120, respectively. Two curb blocks 220 may be disposed on both sides of the second cavity block 210 so as to correspond to the port blocks 120 and two airblock blocks 230 may be disposed on both sides of the second cavity block 210, Curl blocks 220, respectively.

As an example, each of the port blocks 120 may be provided with a plurality of ports as shown in FIG. 1 for supplying the molding resin, and the molding resin 40 may be connected to the cavities And a plunger 122 for injecting the liquid into the inside of the chamber. In one example, a resin tablet may be supplied in the ports, and the resin tablets may be injected into the cavity 202 via the curl blocks 220 after the resin tablets have melted in the ports. have. Although not shown, the port blocks 120 may include a heater (not shown) for melting the resin tablet and a driving unit (not shown) for reciprocating the plungers 122.

Each of the curled blocks 220 may be provided with a well region 222 for temporarily storing the molding resin 40 supplied from the port blocks 120 and then transferring the molding resin 40 to the cavity 202, A plurality of gates 204 may be provided between the cavity 202 and the well regions 222. The gates 204 may each have a trench shape and may be spaced apart from each other at regular intervals to uniformly inject the molding resin 40. The plurality of wells 222 corresponding to the ports of the port block 120 are provided in the respective curl blocks 220. In this case, Regions may be provided.

In addition, each of the air vent blocks 230 may be provided with a plurality of air vents 206 spaced apart from each other at a predetermined interval. In operation, each air vent 206 may have a trench shape and extend radially relative to the center of the cavity 202, respectively. 3 indicate the feeding direction of the molding resin 40 and the dotted arrows indicate the direction of air discharge inside the cavity 202. [

According to an embodiment of the present invention, a separate cavity is formed in which the wafer 20 is inserted by the first cavity block 110, the port blocks 120, and the guide blocks 130 In which case the first cavity block 110 may be resiliently mounted to the first master die 12. As an example, the first cavity block 110 may be resiliently supported by the first master die 12 by first springs 16, so that the first mold 100, The damage of the wafer 20 placed on the first cavity block 110 by the first springs 16 when the second mold 200 is coupled can be prevented.

Also, the second cavity block 210, the curl blocks 220, and the air vent blocks 230 may be resiliently mounted to the second master die 14. The second curb block 210 and the curb blocks 220 and the air vent blocks 230 may be mounted on the second master die 14 by the second springs 18. [ It can be supported sexually. In this case, the damage of the wafer 20 can be prevented by the second springs 18, and the thickness of the wafer mold formed on the wafer 20 can be adjusted.

The molten molding resin 40 may be supplied into the cavity 202 after the first mold 100 and the second mold 200 are coupled to each other, The damage of the semiconductor chips 30 mounted on the wafer 20 can be greatly reduced. Particularly, the molding resin 40 can be uniformly injected through the gates 204 connected to the edge portions of the cavity 202 and the air vents 206 connected to the other edge portions can be injected into the cavities 202, Since the air inside the buttice 202 can be easily discharged, the occurrence of voids in the molding resin 40 can be reduced, thereby greatly improving the quality of the wafer level package. In addition, the molded wafer mold can be easily separated from the second mold 200 by the release film 50 after the molding process for the semiconductor chips 30 is completed.

FIG. 4 is a schematic plan view for explaining another example of the first mold shown in FIG. 1, and FIG. 5 is a schematic bottom view for explaining another example of the second mold shown in FIG.

4 and 5, a plurality of the port blocks 120 may be connected to the edge portions of the first cavity block 110 such that the plurality of port blocks 120 are spaced apart from each other by a predetermined distance, And may be disposed between the port blocks 120. 6, six port blocks 120 and six guide blocks 130 are used. However, the number of the port blocks 120 and the number of the guide blocks 130 may be variously changed.

The plurality of curb blocks 220 may be connected to the edge portions of the second cavity block 210 so as to correspond to the port blocks 120 and the plurality of airblock blocks 230 may be connected to the edge portions of the second cavity block 210, Curls < / RTI > Although six curb blocks 220 and six airbroom blocks 230 are used, the number of curb blocks 220 and the number of airbroom blocks 230 can be variously changed.

Meanwhile, according to an embodiment of the present invention, the air vents 206 may be configured to be openable and closable.

Figs. 6 and 7 are schematic enlarged cross-sectional views for explaining the opening and closing of the air vents shown in Fig.

6 and 7, each of the air vent blocks 230 of the second mold 200 includes a plurality of air holes 208 connected to the air vents 206 And the air holes 208 may be connected to a vacuum source 250 including a vacuum pump or the like through the vacuum line 240 and the first valve 242. The air holes 208 may be connected to a compressed air source 252 including an air pump or the like through an air line 244 and a second valve 246.

The release film 50 may be vacuum adsorbed to the inner surfaces of the air vents 206 by a vacuum provided through the air holes 208 so that the air vents 206 are opened . The molding process for the semiconductor chips 30 can be performed in a state where the air vents 206 are opened as described above and the compressed air can be supplied through the air holes 208 at the completion time of the molding process Can be supplied. As a result, the release film 50 can be partially swollen by the compressed air inside the air vents 206, as shown in FIG. 7, Can be blocked by the film (50).

Since the air vents 206 can be blocked by the partial expansion of the release film 50 at the time of completion of the molding process as described above, Can be prevented from leaking through. Particularly, since the air vents 206 can be cut off as described above, the area of the air vents 206 can be sufficiently secured, so that the air vent 206 from the cavity 202 during the molding process Can be easily performed. As a result, voids and the like in the molding process of the semiconductor chips 30 can be sufficiently reduced.

Meanwhile, the completion time of the molding process may be preset based on a time required for the molding resin 40 to be sufficiently filled in the cavity 202, and the interruption of the air vents 206 And closing the first valve 242 and opening the second valve 246 at completion.

FIGS. 8 and 9 are schematic structural views for explaining another structure for opening and closing the air vents shown in FIG.

Referring to FIGS. 8 and 9, the molding apparatus 10 may include open / close members 260 for opening / closing the air vents 206. The opening and closing members 260 may be mounted on the second master die 14 so as to protrude into the air vents 206 through the air vent blocks 230 of the second mold 200 have. In particular, when the predetermined clamp pressure is applied to the first and second master dies 12 and 14, the opening and closing members 260 are protruded to the inside of the air vents 206, ).

The wafer level molding process for the semiconductor chips 30 may be performed at a first clamp pressure at which the air vents 206 are opened and the molding resin 40 is introduced into the cavity 202. [ A second clamp pressure higher than the first clamp pressure may be applied to shut off the air vents 206. [

In particular, the first and second master dies 12 and 14 may be provided with a first clamp pressure to the extent that the opening and closing members 260 do not protrude to the inside of the air vents 206, In this state, the molding resin 40 can be injected into the cavity 202. After completion of the molding process, that is, the molding resin 40 is sufficiently filled in the cavity 202, a predetermined second clamp pressure is applied to the first and second master dies 12 and 14 The positions of the first mold 100 and the second mold 200 are not changed and the opening and closing members 260 mounted on the second master die 14 relatively move to the second The air vents 206 can be blocked by being pressed by the master die 14 and protruding inward of the air vents 206.

According to an embodiment of the present invention, the opening and closing members 260 may be resiliently mounted on the second master die 14. As an example, a third elastic member 262 may be disposed between the opening and closing members 260 and the master die 14, and a coil spring may be used as the third elastic member 262. Accordingly, even if the opening / closing members 286 are protruded to the inside of the air vents 206 by the application of the second clamp pressure and are brought into close contact with the edge portions of the wafer 20, the third elastic members 262 The damage of the edge portion of the wafer 20 can be sufficiently prevented.

The wafer level molding apparatus 10 includes a first mold 100 for supporting the wafer 20 and a second mold 100 for molding the semiconductor chips 30 on the wafer 20, And a second mold 200 having a cavity 202. A plurality of gates 204 for supplying the molding resin 40 and a plurality of air vents 206 for removing air from the cavity 202 are formed in edge portions of the cavity 202. [ Can be connected.

The molding resin 40 is heated in the port blocks 120 connected through the gates 204 and the curled block 220 to the inside of the cavity 202 through the gates 204 in a sufficiently melted state, The damage of the semiconductor chips 30 during the injection of the molding resin 40 can be sufficiently prevented. In addition, since the air inside the cavity 202 can be easily removed through the plurality of air vents 206, the incidence of defects such as voids during the wafer level molding process can be greatly reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: wafer level molding apparatus 12: first master die
14: second master die 20: wafer
30: semiconductor chip 40: molding resin
50: release film 100: first mold
110: first cavity block 120: port block
130: guide block 200: second mold
202: Cavity 204: Gate
206: Air vent 210: Second cavity block
220: Curl block 230: Air vent block
300: release film provided

Claims (11)

A first cavity block for supporting a wafer on which semiconductor chips are mounted; port blocks connected to edge portions of the first cavity block for providing a molding resin for molding the semiconductor chips; A first mold connected to the edge portions of the butt block and including guide blocks disposed between the port blocks; And
A second cavity block corresponding to the first cavity block and having a cavity for molding the semiconductor chips, and a curl block having gates for corresponding to the port blocks and for providing the molding resin to the cavity, And a second mold including air vent blocks having air vents for removing air from the cavity and corresponding to the guide blocks. delete The apparatus according to claim 1, wherein two port blocks are disposed on both sides of the first cavity block, respectively. 4. The apparatus of claim 3, wherein each curl block has a plurality of gates spaced apart at regular intervals, and each air vent block has a plurality of air vents spaced apart at regular intervals. 2. The apparatus of claim 1, wherein each curl block has at least one well region for temporarily storing the molding resin and subsequently delivering the molding resin to the cavity. The apparatus of claim 1, wherein the port blocks are spaced apart from each other by a predetermined distance. The apparatus of claim 1, further comprising a release film providing unit for providing a release film on the second mold,
Wherein the first mold is provided with a plurality of first vacuum channels for vacuum adsorption of the wafer and the second mold is provided with a plurality of vacuum channels for vacuum adsorption of the release film. . [8] The apparatus of claim 7, wherein the air vent blocks are provided with air holes connected to the air vents,
The air holes
A vacuum source for providing a vacuum for adsorbing the release film to the inner surfaces of the air vents to open the air vents and a compressed air source for providing compressed air such that the air vents are blocked by the release film Wherein the wafer level molding apparatus is a wafer level molding apparatus. The method according to claim 1, further comprising a first master die on which the first mold is mounted and a second master die on which the second mold is mounted, wherein the first mold and the second mold have a first master die and a second master And each of the first and second molds is resiliently mounted on the die. 10. The air conditioner according to claim 9, wherein the second master die is equipped with open / close members so as to protrude into the air vents through the air vent blocks to open / close the air vents,
Wherein the opening / closing members protrude inward of the air vents to block the air vents when a predetermined clamp pressure is applied to the first and second master dies. 11. The method of claim 10, wherein the molding process for the semiconductor chips is performed at a first clamp pressure at which the air vents are opened, and after the molding resin is filled in the cavity, Wherein a higher second clamp pressure is applied.

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