KR101534524B1 - 이송로봇 - Google Patents
이송로봇 Download PDFInfo
- Publication number
- KR101534524B1 KR101534524B1 KR1020130077581A KR20130077581A KR101534524B1 KR 101534524 B1 KR101534524 B1 KR 101534524B1 KR 1020130077581 A KR1020130077581 A KR 1020130077581A KR 20130077581 A KR20130077581 A KR 20130077581A KR 101534524 B1 KR101534524 B1 KR 101534524B1
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- South Korea
- Prior art keywords
- driving device
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- driving force
- arm
- driving
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- 238000012546 transfer Methods 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims description 5
- 230000033001 locomotion Effects 0.000 description 21
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000007769 metal material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 206010028980 Neoplasm Diseases 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
- B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2 는 도 1에 대한 평면도.
도 3은 도 2의 이송로봇의 암이 진행된 제1 예시도.
도 4는 도 2의 이송로봇의 암이 진행된 제2 예시도.
10: 하부 몸체
110: 제1 구동장치 130: 하부 프레임
20: 상부 몸체
210: 상부 프레임 230: 제2 구동장치
30: 하부핸드 40: 상부핸드
300,400: 암
370: 제1 회전축 470: 제2 회전축
390: 제 3구동장치 490: 제 4구동장치
Claims (4)
- 이송로봇으로서,
지면으로부터 상하운동을 하면서 중공으로 형성된 하부 프레임(130)과 상기 하부 프레임(130)을 상하운동으로 이동하도록 구동력을 전달하는 제1 구동장치(110)를 구비하는 하부 몸체(10);
지면으로 돌출되면서 상기 하부 프레임(130)에 삽입되고 중공으로 형성되어 상기 하부 프레임(130)을 따라 상하 직선운동을 하고 상기 하부 프레임(130)과 별도로 회전운동을 하는 상부 프레임(210)과 상기 상부 프레임(210)을 회전하도록 돌출 부위와 연결되어 구동력을 전달하는 제2 구동장치(230)를 구비하는 상부 몸체(20);
지면으로 돌출되면서 상기 상부 프레임(130)에 삽입되고 중공으로 형성된 제1 회전축(370)과 상기 제1 회전축(370)의 돌출부위와 연결되어 구동력을 전달하는 제3 구동장치(390)와 제3 구동장치(390)의 구동력을 전달받아 기판을 이송시키는 암(300)을 구비하는 하부핸드(30); 및
상기 제1 회전축(370)에 삽입되고 지면으로 돌출된 제2 회전축(470)과 상기 제2 회전축(470)의 돌출부위와 연결되어 구동력을 전달하는 제4 구동장치(490)와 상기 제4 구동장치(490)의 구동력을 전달받아 기판을 이송시키는 암(400)을 구비하는 상부핸드(40);를 포함하고,
상기 상부 몸체(20)와 제1 회전축(370)과 제2 회전축(470)이 순차적으로 지면으로 돌출되어 각각을 회전시키는 상기 제2 구동장치(230), 제3 구동장치(390), 제4 구동장치(490)와 타이밍 벨트로 각각 연결되며, 상기 제2 구동장치(230)는 상기 상부 프레임(210)의 하단부에 상기 상부 프레임(210)의 중공축과 소정거리 이격되어 배치되고, 상기 제3 구동장치(390)와 제4 구동장치(490)는 상기 하부 프레임(130)의 내부에 배치되며,
상기 암(300)은 소정 길이를 갖는 제1 링크부재(312)와 상기 제1 링크부재(312)에 체결되는 제2 링크부재(316)로 구성되는 구동력 암(310)을 포함하고, 상기 제1 링크부재(312)는 상기 제2 링크부재(316)와 길이가 동일하거나 길게 형성되며, 상기 제1 링크부재(312)와 상기 제2 링크부재(316)는 전체장치의 무게를 줄이기 위하여 내부가 파여 있도록 형성되는 이송로봇.
- 삭제
- 삭제
- 청구항 1에 기재되어 있는 이송로봇으로 구비되는 것을 특징으로 하는 공정장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120117179 | 2012-10-22 | ||
KR20120117179 | 2012-10-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140051049A KR20140051049A (ko) | 2014-04-30 |
KR101534524B1 true KR101534524B1 (ko) | 2015-07-09 |
Family
ID=50655937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130077581A Active KR101534524B1 (ko) | 2012-10-22 | 2013-07-03 | 이송로봇 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101534524B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240173294A (ko) | 2023-06-02 | 2024-12-11 | 주식회사 라온테크 | 이송 로봇 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105150202A (zh) * | 2015-10-01 | 2015-12-16 | 合肥金海康五金机械制造有限公司 | 取料机械手抓取机构 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100036659A (ko) * | 2008-09-30 | 2010-04-08 | 주식회사 아토 | 웨이퍼 이송 로봇 |
-
2013
- 2013-07-03 KR KR1020130077581A patent/KR101534524B1/ko active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100036659A (ko) * | 2008-09-30 | 2010-04-08 | 주식회사 아토 | 웨이퍼 이송 로봇 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240173294A (ko) | 2023-06-02 | 2024-12-11 | 주식회사 라온테크 | 이송 로봇 |
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Publication number | Publication date |
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KR20140051049A (ko) | 2014-04-30 |
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