KR101471930B1 - Bonding system for Liquid Crystal Display - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding system, and more particularly, to a bonding system for pressing an electronic component on which a driving IC is mounted on a liquid crystal panel of a liquid crystal display device.

A bonding system for a liquid crystal display according to an embodiment of the present invention includes a component supplying member for supplying an electronic component, a film attaching member for attaching a film to the component supplied by the component supplying member, And a bonding member for receiving and aligning and attaching to the liquid crystal panel a plurality of electronic components which are aligned and inspected in the index member.

Description

[0001] The present invention relates to a bonding system for a liquid crystal display,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding system, and more particularly, to a bonding system for pressing an electronic component on which a driving IC is mounted on a liquid crystal panel of a liquid crystal display device.

Generally, a process for manufacturing a liquid crystal display (LCD) includes a TFT process in which a thin film transistor is arranged in a glass electronic component, a process in which an alignment film is applied to a glass electronic component and a liquid crystal is injected into the finished product cell And a module process in which a driving IC and a PCB are attached to a completed cell, and a back light unit and a housing are assembled.

In the module process, a driving IC is mounted on a liquid crystal display device by a COG (Chip On Glass) mounting method and a TAB (Tape Automated Bonding) mounting method. In the seedless mounting method, the driving IC is directly mounted on the gate region and the data region of the liquid crystal liquid crystal panel without a separate structure. In the tap mounting method, a driving IC is indirectly mounted on a gate region and a data region of a liquid crystal liquid crystal panel through a tape carrier package (TCP: Tape Carrier Package) on which a driving IC is mounted.

When a TAB (TAB) mounting method is adopted as a method of mounting a driving IC on a liquid crystal display device, a tape carrier package (hereinafter referred to as a TAB IC) equipped with a driving IC is anisotropic conductive film : Anisotropic Conductive Film) to be firmly connected to both the liquid crystal liquid crystal panel and the printed circuit electronic component (PCB), thereby enabling the driving IC to quickly perform the functions assigned to it.

In other words, in the step of mounting the tab IC on the liquid crystal liquid crystal panel, the anisotropic conductive film (ACF) is attached to the liquid crystal liquid crystal panel as a medium for electrical conduction between the electrode of the liquid crystal liquid crystal panel and the tab eye, The tap IC is aligned on the liquid crystal panel electrode with the film (ACF), and the tap is aligned with the electrode, and the tap bonding is performed using a hot pressing process using HOT BAR, And the attachment work is completed.

One aspect of the present invention relates to a bonding system for pressing a TCP having a driving IC mounted on a liquid crystal panel of a liquid crystal display device to a liquid crystal panel.

A bonding system for a liquid crystal display according to an embodiment of the present invention includes a component supplying member for supplying an electronic component, a film attaching member for attaching a film to the component supplied by the component supplying member, And a bonding member for receiving the plurality of electronic components aligned and inspected in the index member and attaching to the liquid crystal panel.

Further, the bonding member includes a bonding stage on which the liquid crystal panel is mounted, and a bonding head portion for pressing and pressing the electronic component.

The bonding member may further include a laser supply unit for applying laser light to the film so that the electronic component can be bonded to the liquid crystal panel.

A pressing tool is provided at the tip of the bonding head to press the electronic component with a predetermined heat and pressure. A suction nozzle is provided at the rear end of the bonding head to transfer the electronic component in a suction state.

Further, the laser supplying unit includes a laser light source and a beam transmitting optical system for transmitting light to the film.

Further, the electronic component is characterized by including a tap IC (TAP-IC).

Further, the film is characterized by including an anisotropic conductive film (ACF).

The bonding system of the liquid crystal display device according to the embodiment of the present invention can be manufactured by attaching an ACF to an electronic component and pressing it onto a liquid crystal panel and replacing it with a laser process in a hot pressing process by HOT BAR, .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic perspective view showing a bonding system of a liquid crystal display device according to an embodiment of the present invention.

1, a bonding system of a liquid crystal display according to an embodiment of the present invention includes a component supply member 100, a component transfer member 200, an index member 300, a film attachment member 400 And a bonding member 500. The bonding member 500 is formed of a metal.

The component supplying member 100 is a part for supplying the electronic components 110 to be bonded to the liquid crystal panel 10 one by one. The component supply member 100 is mounted with a component reel 120 in which a strap having the electronic components 110 in a line is wound in a reel shape. Here, the electronic component 110 according to the embodiment of the present invention may include the tab IC 110. The component supply member 100 is provided with a punching unit 130. The punching unit 130 separates the electronic component 110 on the strap.

The component supply member 100 is provided with a blowout unit 140. The takeout unit 140 takes out the electronic component 110 separated from the punching unit 130 to the outside of the component supply member 100. The take-out unit (140) is provided with a take-out table (150). The take-out table 150 transfers the electronic component 110 between the punching unit 130 and the outside of the component supplying member 100.

The component transferring member 200 is a part for transferring and transferring the electronic component 110 separated from the strap in the component supplying member 100. The component transferring member 200 is provided with a suction head (not shown) which sucks the electronic component 110 placed on the take-out table 150 and transfers it to the index member 300.

The index member 300 is a portion for aligning and inspecting the electronic component 110 supplied through the component transfer member 200. The index member 300 is provided with an index table 310 rotatably on a base (not shown). The index table 310 receives the electronic component 110 while rotating as a circular table, and selectively supplies the electronic component 110 to the bonding member 500 through alignment and inspection.

In the area A adjacent to the component transferring member 200 in the index table 310, the electronic component 110 is delivered through the component transferring member 200. A film 400a is attached to the electronic component 110 so as to be bonded to the liquid crystal panel 10 in the area B rotated 90 degrees in the A area. For this, a film attaching member 400 is provided in a region adjacent to the B region.

The film attaching member 400 serves to attach the film 400a in a state before the electronic component 110 is squeezed onto the liquid crystal panel 10. [ Here, the film 400a may use an anisotropic conductive film (ACF) in order to make the electrodes of the liquid crystal panel 10 and the electrodes of the electronic component 110 conductive. Non-Conductive Paste (NCP) and Non-Conductive Film (NCF) may be used as the film 400a for attaching the electronic component 110. In this case, ACF is used as the film 400a The following description will be given.

2 is a view showing an embodiment of a film-attaching member according to an embodiment of the present invention. 2, the film attaching member 400 according to the embodiment of the present invention may include a supplying unit 410, a collecting unit 420, a guide unit 430, and an attaching unit 450.

The ACF 400a is wound on the reel of the supply part 410 and the ACF 400a used on the reel of the collecting part 420 is gradually wound. The ACF 400a may be formed of a layered tape material formed by adhering an ACF 400a to one surface of an elongated tape. However, in the embodiment of the present invention, when the ACF 400a is formed of a tape material having a single layer structure Will be described.

The ACF 400a is moved from the supply part 410 to the recovery part 420 by the rotation driving.

The guide portions 430 and 440 are composed of a first guide portion 430 disposed on the side of the supplying portion 410 and a second guide portion 440 disposed on the side of the collecting portion 420. The ACF 400a, . That is, the ACF 400a unwound from the reel of the supply unit 410 is wound on the reel of the collecting unit 420 via the first guide unit 430 and the second guide unit 440.

The attaching portion 450 includes a head portion 451 for pressing the ACF 400a upward and attaching the ACF 400a to the electronic component 110 located at the lower portion and a cylinder 452 for vertically moving the head portion 451 , The ACF 400a can be attached to the electronic component 110 placed in the B area of the index table 310. [

In the area (C) rotated by 90 degrees in the area B, alignment and inspection of the electronic part 110 to which the ACF 400a is attached are performed. That is, the ACF 400a is attached to the electronic component 110 to have a predetermined length, and then the ACF 400a is aligned with the ACF 400a so that the ACF 400a can be pressed against the liquid crystal panel 10 to be.

The electronic component 110 is transferred to the bonding member 500 in the region D rotated by 90 degrees in the C region. In the D region, alignment is performed properly in the C region, and only the electronic component 110 having no defect is transferred to the bonding member 500.

The bonding member 500 according to the embodiment of the present invention serves to bond the electronic component 110 to which the ACF 400a is attached to the liquid crystal panel 10. [ FIG. 3 is a schematic view of a bonding member according to an embodiment of the present invention, and FIG. 4 is a view illustrating a bonding head of a bonding member according to an embodiment of the present invention.

3 and 4, the bonding member 500 includes a bonding stage 20 on which the liquid crystal panel 10 is seated, a bonding stage 40 for bonding the electronic component 110 and pressing the electronic component 110 at the same time, A laser supply unit 520 for applying a laser beam to the electronic component 110 so that the electronic component 110 can be bonded to the liquid crystal panel 10; And a control unit 530 for providing a control signal.

The bonding head 511 provided on the bonding head 510 is movably installed in the feeding block 513 in a first direction in which the bonding head 511 is guided by the linear guide 512 and linearly moved. The first direction is guided and moved in the X direction with respect to the linear guide 512 so that the electronic component 110 is transferred from the index table 310 to a position where it is bonded to the liquid crystal panel 10 .

The first direction is set to the feeding table 513 and the feeding table 514 is set to be movable in the second direction (i.e., the Y direction). The second direction is a direction orthogonal to the first direction. And a bonding drive cylinder 515 is provided in the second direction transfer table 514. [ The bonding driving cylinder 515 presses the electronic component 110 on the liquid crystal panel 10 to be bonded. The bonding drive cylinder 515 allows the pressing tool 511a to apply a force in the Z direction.

A supporting bracket 516 is provided on the transfer table 514 in the second direction and a rotation driving source 517 is provided on the supporting bracket 516. The rotation driving source 517 rotates the bonding block 518. A bonding block 518 is provided on the rotation driving source 517 and a compression tool 511a is provided on the tip of the bonding block 518. The pressing tool 511a is a portion that actually presses the electronic component 110 with a predetermined heat and pressure. A suction nozzle 511b is provided at the rear end of the bonding block 518 to allow the electronic component 110 to be transferred while being adsorbed. The bonding block 518 is provided with a heater 519 for controlling the temperature of the pressing tool 511a.

Although not shown in the drawing, a bonding member 500 according to an embodiment of the present invention includes a plurality of cameras (not shown) for pre-aligning electronic components at a position adjacent to the bonding head 510, (Not shown), and a conveyor (not shown) arranged in the forward and backward directions for conveying the liquid crystal panel.

The bonding member 500 is provided with a laser supply unit 520 for irradiating a laser beam on the lower side of the liquid crystal panel 10. The laser supplying unit 520 includes a laser light source 521 and a beam transmitting optical system 522 for transmitting light to the ACF 400a.

The laser light source 521 generates a laser beam of a predetermined intensity under the control of the controller 530. [ The laser light source 521 may include a visible laser and a near infrared laser from a UV laser.

The beam transmitting optical system 522 includes an optical fiber 522a for transmitting the laser beam of the laser light source 521 to the liquid crystal panel side, an optical system fixing table 522b for supporting the optical system, a light beam transmitted through the optical fiber 522a And a beam expander 522c that expands to a shape or size for irradiation.

The electronic component 110 to be pressed on the liquid crystal panel 10 is placed and the ACF 400a is placed on the liquid crystal panel. At this time, the electronic component 110 and the electrode of the liquid crystal panel 10 must be accurately positioned so as to be connected. This process is preferably automated by using a robot or the like.

The laser light source 521 emits light of a wavelength capable of being absorbed by the ACF 400a under the control of the control unit 530 with an appropriate intensity. The emission pattern can be continuous in time or emitted in the form of pulses. The emitted laser beam is transmitted to a beam optical transmission system 522 composed of an optical fiber 522a and irradiated to a portion to be connected via an optical system fixture 522b connecting the beam expander 522c of the beam transmission optical system 522 And is made into light of an appropriate size by using the total beam expander 522c. The beam extended to an appropriate size is irradiated to the connection site through the optical window 20a, which is highly transmissive to the laser wavelength.

When the laser beam is irradiated to the lower surface of the electronic component 110 through the optical window 20a, the electronic component 110 passes most of the laser beam of the infrared wavelength. The laser output has a higher output per unit area than other general light, thus generating sufficient heat for small absorption. The laser beam having passed through the electronic component 110 is transmitted to the ACF 400a so that the electronic component 110 can be pressed onto the liquid crystal panel 10.

Next, the operation of the bonding system of the liquid crystal display device according to the embodiment of the present invention will be described.

In the component reel 120 mounted on the component supplying member 100, the strap is released. In the strap, electronic parts 110 are attached in a line, and the electronic parts 110 are separated one by one from the punching unit 130. The separated electronic component 110 is seated on the take-out table 150 of the take-out unit 140 and transferred to the outside of the component supply member 100.

The electronic component 110 delivered to the outside of the component supply member 100 is transferred to the index member 300 by the component transfer member 200. [ The electronic component 110 is seated on the index table 310 in the area A of the index member 300 by the component transfer member 200.

The rotation of the index table 310 causes the electronic component 110 to move to the B region and the ACF 400a is attached to the electronic component 110 by the film attachment member 400 in the B region. Then, the electronic component 110 is moved to the C region by the rotation of the index table 310, and alignment and inspection are performed in the C region. The alignment in the C region is performed so as to be in a position corresponding to the bonding member 500. [

The electronic part 110 which has been aligned and inspected in the C area by the rotation of the index table 310 is moved to the D area. And is moved to the state of being adsorbed by the suction nozzle 511b of the bonding head 511 in the D region. That is, the transfer table 513 moves in the first direction along the linear guide 512 to transfer the electronic component 110 from the index table 310 to the liquid crystal panel 10 side.

The bonding head 511 presses the bonding block 518 against the electronic component 110 by applying a force in the Z direction by the operation of the bonding driving cylinder 515. At this time, the pressing tool 511a is heated to a predetermined temperature by the heater 519 of the bonding block 518, so that the electronic part 110 can be bonded to the liquid crystal panel 10 by heat and pressure.

At the same time, the laser light source 521 provided below the liquid crystal panel 10 emits light of a wavelength that can be absorbed by the ACF 400a under the control of the control unit 530, Can be firmly bonded to the liquid crystal panel 10.

Therefore, in the bonding system of the liquid crystal display device according to the embodiment of the present invention, there is an effect that the electronic component 110 can be bonded to the liquid crystal panel 10 even in the state where the separate pressure bonding is omitted.

The bonding system of the liquid crystal display according to the embodiment of the present invention can be realized by attaching the ACF to the electronic component and pressing it on the liquid crystal panel and replacing the hot pressing process by the HOT BAR with the laser process, Which is the basic technical idea. Therefore, many modifications may be made by those skilled in the art without departing from the scope of the present invention.

1 is a schematic perspective view showing a bonding system of a liquid crystal display device according to an embodiment of the present invention.

2 is a view showing an embodiment of a film-attaching member according to an embodiment of the present invention.

3 is a schematic view of a bonding member according to an embodiment of the present invention.

4 is a view illustrating a bonding head of a bonding member according to an embodiment of the present invention.

Description of the Related Art [0002]

100 ... parts supply member 200 ... parts transfer member

300 ... Index member 400 ... Film attachment member

500 ... bonding member 510 ... bonding head

520 ... laser supply unit

Claims (7)

A component supply member for supplying an electronic component, A film attachment member for attaching a film to the component supplied by the component supply member, An index member for rotating the electronic component with the film attached thereon, And a bonding member for receiving and aligning and inspecting the plurality of electronic components in the index member and aligning and attaching to the liquid crystal panel, Wherein the component supplying member includes a punching unit for mounting a component reel in which a strap having electronic components arranged in a row is wound in a reel shape and for separating the electronic component on the strap, To the outside of the component supplying member, Wherein the index member includes an index table rotatably installed on a base, and the index table receives the electronic component while rotating and selectively supplies the electronic component to the bonding member through alignment and inspection. Bonding system of display device. The method according to claim 1, Wherein the bonding member includes a bonding stage on which the liquid crystal panel is mounted, and a bonding head for pressing and pressing the electronic component. 3. The method of claim 2, Wherein the bonding member further comprises a laser supplier for applying laser light to the film so that the electronic component can be bonded to the liquid crystal panel. 3. The method of claim 2, Wherein a bonding tool is provided on the tip of the bonding head to press the electronic component with a predetermined heat and pressure and a suction nozzle is provided on the rear end of the bonding head to transfer the electronic component in a suction state. Bonding system. The method of claim 3, Wherein the laser supplying unit comprises a laser light source and a beam transmitting optical system for transmitting light to the film. The method according to claim 1, Wherein the electronic component includes a tap IC (TAP-IC). The method according to claim 1, Wherein the film comprises an anisotropic conductive film (ACF).

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