KR101452190B1 - Method for manufacturing multi-layer pcb - Google Patents

Abstract

The present invention relates to a method of manufacturing a high-multilayered PCB including an image pattern realizing method and an image pattern realizing method, and more particularly, to a method of manufacturing a multi-layered PCB by smoothly completing a fine image pattern of a PCB substrate, Layer PCB including a method of implementing an image pattern and a method of implementing an image pattern to improve flatness.
Layer PCB including the image patterning method and the image pattern implementing method according to the present invention is characterized in that an image film 60 is coated on a substrate 10 on which a copper foil 40 copper-plated on an insulator is formed, An etching process (S100) of forming an image pattern (20) by partially melting the copper foil (40) to expose the insulator; A laser beam 30 is irradiated to the image pattern 20 remaining on the substrate 10 through the etching step S100 so that the image pattern 20 has a width of 10 to 30 占 퐉, Pattern process S200; And a peeling process (S300) for completely removing the image film (60) and other residues except for the image pattern (20) formed on the substrate (10) through the micro image pattern process (S200).

Description

[0001] METHOD FOR MANUFACTURING MULTI-LAYER PCB [0002] BACKGROUND OF THE INVENTION [0003]

The present invention relates to a method of manufacturing a high-multilayered PCB including an image pattern realizing method and an image pattern realizing method, and more particularly, to a method of manufacturing a multi-layered PCB by smoothly completing a fine image pattern of a PCB substrate, Layer PCB including a method of implementing an image pattern and a method of implementing an image pattern to improve flatness.

Pattern processing technology for forming patterns is a key technology that can provide ripple effects in various fields ranging from electronic devices, optical devices, MEMS, and recently, biotechnology, as underlying technologies that are the foundation of various industrial fields.

In particular, since the 1990s, there have been a number of studies focusing on the phenomena that are different from those of conventional macroscopic structures in nanostructures. As a result, studies on patterning technology, ie, patterning technology, .

The application of fine patterning technology, which was mainly used in the electronics industry, has been increasingly applied to various nano devices and optical devices due to the development of various mixed-use technologies based on nanotechnology in the traditional fields of electric, electronic, chemical, And its applications to biotechnology such as biochips are becoming widespread.

On the other hand, a PCB is a substrate on which a conductor circuit is formed on the surface or inside of an insulating substrate for connecting components based on a circuit design, and is obtained by heating and pressing multiple layers of sheets obtained by bonding a resin to an insulator such as glass fiber.

These PCBs are exposed to ultraviolet rays by radiating ultraviolet rays on the image film after the film is coated on the insulator, thereby separating the pattern image portion and the pattern image portion.

When the exposure operation is completed, the image film is subjected to a development process in which portions except for the image pattern that receives the exposure light are removed.

Then, the copper foil except the image pattern is removed through etching.

However, when an image pattern is completed by removing the copper foil through etching, an image pattern having a width of less than 50 mu m is very difficult to complete.

Particularly, in the case of a finely connected image pattern, hydrochloric acid and chloric acid used in etching have a problem of deforming or damaging the shape of the image pattern.

Further, in order to complete an image pattern having a width of less than 50 占 퐉, there is a problem that the production rate is lowered because the image pattern must be completed by repeatedly etching.

On the other hand, in case of BVH-applied PCB, it is necessary to use expensive equipment such as LDI (LASER DIRECT IMAGING) due to unstable dimensional stability.

In addition, since PCBs are required to have multi-layered and high-performance products, when a plurality of PCBs are laminated and press-bonded to form a multi-layered PCB, defects and flatness can not be guaranteed, .

In addition, when a high-multilayer PCB is found to be distorted at the completion stage of the product, the product must be discarded and the process must be carried out again.

Patent No. 10-1009729

A method of manufacturing a high-multilayer PCB including a method of implementing an image pattern and a method of implementing an image pattern according to the present invention, which is devised to solve the above problems, includes a method of implementing an image pattern to smoothly produce a fine image pattern of a PCB substrate, Layer printed circuit board (PCB) including a method of fabricating a pattern.

A method of manufacturing a high-multilayer PCB including an image pattern implementation method and an image pattern implementation method according to the present invention includes a method of implementing an image pattern and an image pattern implementation method that enable a complicated and fine image pattern of a PCB substrate to be easily produced It is an object of the present invention to provide a method for manufacturing a multilayer PCB.

A method of manufacturing a high-multilayer PCB including a method of implementing an image pattern and a method of implementing an image pattern according to the present invention is a method for manufacturing a high-multilayer PCB, which includes finely patterning an image pattern, Layer printed circuit board (PCB), and a method of manufacturing an image pattern.

Layer PCB including the image patterning method and the image pattern implementing method according to the present invention is characterized in that an image film 60 is coated on a substrate 10 on which a copper foil 40 copper-plated on an insulator is formed, An etching process (S100) of forming an image pattern (20) by partially melting the copper foil (40) to expose the insulator; A laser beam 30 is irradiated to the image pattern 20 remaining on the substrate 10 through the etching step S100 so that the image pattern 20 has a width of 10 to 30 占 퐉, Pattern process S200; And a peeling process (S300) for completely removing the image film (60) and other residues except for the image pattern (20) formed on the substrate (10) through the micro image pattern process (S200).

The fine image pattern process S200 may be performed by a controller 100 so that the laser beam 30 can be irradiated according to the irradiation position of the laser beam 30 to be irradiated to the substrate 10 and the information input to the irradiation path (Step S210).

The fine image patterning step S200 includes an outer layer patterning step S220 of processing the upper surface of the substrate 10 so that the width of the image pattern 20 is 10 to 30 占 퐉, (S230) in which the width of the image pattern (20) of the light emitting diode (LED) is partially 10 to 30 mu m.

An etching process for forming an image pattern 20 by coating an image film 60 on a substrate 10 on which a copper foil 40 copper-plated with an insulator is formed, and then partially melting the copper foil 40 to expose an insulator (S100); A laser beam 30 is irradiated to the image pattern 20 remaining on the substrate 10 through the etching step S100 so that the image pattern 20 has a width of 10 to 30 占 퐉, Pattern process S200; A peeling step (S300) for completely removing the remnants of the image film (60) except for the image pattern (20) formed on the substrate (10) through the micro image patterning step (S200); A top sheet sheet 300 in which a plurality of different substrates 10 are laminated is disposed on a lower sheet 200 on which a plurality of substrates 10 are laminated through the peeling process S300, (S400); The upper surface sheet 300 and the lower sheet sheet 200 are pressurized under the same condition by pressing the upper surface of the upper sheet sheet 300 stacked through the arranging step S400 with the press 50 S500); A hole processing step (S600) of separating the upper sheet sheet (300) and the lower sheet sheet (200) from each other after the primary pressing step (S500) is completed; The upper plate sheet 300 and the lower plate sheet 200 which have undergone the hole processing step S600 are subjected to electrolytic copper plating and a portion excluding the portion of the image pattern 20 formed on the image film 60 is subjected to frontal work, The image pattern 20 is formed by exposing the insulating material by melting the portion of the copper foil 40 exposed on the substrate 10 to form an image pattern 20, An outer fine patterning step (S700) of irradiating the image pattern (20) with a laser beam (30) so that the width of the image pattern (20) is 10 to 30 mu m in part; And a secondary pressing step (S800) in which an adhesive 70 is applied between the lower sheet 200 and the upper sheet 300 and then the upper surface of the upper sheet 300 is pressed by the press 50 .

The primary pressing step S500 includes a polishing step (S510) of polishing the upper sheet sheet 300 and the lower sheet 200 to planarize the thickness.

The image pattern 20 is formed on the lower surface of the upper sheet 300 and the upper surface of the lower sheet 200 in the external fine patterning process (S700).

The outer fine patterning process S700 includes placing an image film 60 on the lower surface of the upper sheet 300 and the upper surface of the lower sheet 200 to form the image pattern 20, (S710) for partially etching the image pattern 20 so that the width of the image pattern 20 is less than 30 mu m and less than 70 mu m.

The secondary pressing step S800 is a step of pressing the lower sheet 200 and the upper sheet 100 to increase the adhesive strength of the adhesive 40 used between the lower sheet 200 and the upper sheet 100 And a preprocessing step (S810) for preprocessing.

The method for manufacturing a high-multilayer PCB including the method of implementing an image pattern and the method of implementing an image pattern according to the present invention has a technical effect that a width of a PCB substrate image pattern can have a minute shape of 10 to 30 μm.

The method for manufacturing a high-multilayer PCB including the image pattern implementation method and the image pattern implementation method according to the present invention can easily produce complicated and fine image patterns while eliminating the tilting phenomenon of a high multilayer PCB and improving the flatness There is a technical effect.

Layer printed circuit board (PCB) manufacturing method that includes the method of implementing an image pattern and the method of implementing an image pattern according to the present invention is to manufacture a high-multilayer PCB with minimized thickness deviation while manufacturing a fine image pattern, There is a technical effect that can be maximized.

FIG. 1 is a flowchart schematically showing a method of implementing an image pattern according to an embodiment of the present invention.
FIG. 2 is a conceptual diagram showing each step of an image pattern implementation method according to an embodiment of the present invention.
3 is a flowchart schematically showing a method for manufacturing a high-multilayer PCB including a method of implementing an image pattern according to an embodiment of the present invention.
4 is a conceptual view showing each step of a method of manufacturing a high-multilayer PCB including a method of implementing an image pattern according to an embodiment of the present invention.

The following detailed description of the invention refers to the accompanying drawings, which illustrate, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with one embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is to be limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly explained. In the drawings, like reference numerals refer to the same or similar functions throughout the several views, and length and area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

In the following detailed description, for example, an image pattern implementation method and an image pattern implementation method that smoothly finish a fine image pattern of a PCB substrate, It is needless to say that the technical structure of the multi-layer PCB manufacturing method (particularly, the micro image patterning process) can be equally applied.

FIG. 1 is a flowchart schematically showing a method of implementing an image pattern according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram showing each step of an image pattern implementation method according to an embodiment of the present invention.

1 and 2, an image film 60 is coated on a substrate 10 on which a copper foil 40 copper-plated on an insulator is formed, and then the copper foil 40 is partially melted to expose an insulator, The etching process (S100) for forming the resist pattern 20 is performed.

The laser beam 30 is irradiated to the image pattern 20 remaining on the substrate 10 through the etching step S100 so that the width of the image pattern 20 is partially 10 to 30 占 퐉. A fine image pattern process (S200) is performed.

Then, a peeling process (S300) is performed to completely remove the remnants of the image film (60) except the image pattern (20) formed on the substrate (10) through the fine image pattern process (S200).

Etching process ( S100 )

The substrate 10 on which the copper foil 40 is formed through copper plating with an insulator is coated with the image film 60 on the substrate 10 prior to etching.

Wherein the image film 60 is used to complete an image pattern 20 for partitioning the copper foil 40 of the substrate 10, i.e., where the current flows and does not flow, on the substrate 10 do.

The image pattern 20 completed through the image film 60 is separated from the insulator on the substrate 10 so that current can flow.

At this time, an oxidized film or a fingerprint generated on the copper foil 40 of the plated substrate 10 is removed, and the copper foil is roughened so that the image film 60 is smoothly adhered to the substrate 10 The frontal work, which is scrubbing, proceeds.

A lamination operation of compressing and applying the image film 60 to the substrate 10 with predetermined heat and pressure is performed.

Subsequently, an ultraviolet ray or light energy such as UV is supplied to the laminated substrate 10 to perform a lithography operation in which a monomer is reacted with a polymer to reproduce a necessary pattern image.

Then, a developing operation for peeling off the portion that has not changed into a polymer in the exposure operation using sodium carbonate is performed.

When the portion of the image film 60 excluding the image pattern 20 is removed through the developing operation, the copper foil 40 of the substrate 10, except for the portion where the image pattern 20 is formed, An etching process is performed in which the etched portions are melted through etching.

The exposed portion of the copper foil 40 is melted through the etching operation and only the copper foil 40 of the portion constituting the image pattern 20 remains to be the image pattern 20.
The etching operation is performed by removing the portion of the image film 60 except for the portion of the image pattern 20 through the front operation, the lamination operation, the exposure operation, and the developing operation, The exposed portion of the copper foil 40 is melted to expose the insulator so as to form the image pattern 20.

At this time, if the portion of the copper foil 40 is melted through the etching operation, the insulator of the substrate 10 is exposed to a portion where the copper foil 40 is missing.

The copper foil 40 constituting the image pattern 20 is protected by the image film 60 and remains on the substrate 10.
That is, the copper foil 40 constituting the image pattern 20 is left on the substrate 10 while being protected by the image film 60.

In the etching process, hydrochloric acid and chloric acid are preferably used as a solution for dissolving the copper foil 40 of the substrate 10 except for the image pattern 20.

Various solutions may be used as long as the unnecessary copper foil 40 on the substrate 10 is smoothly melted and the substrate 10 and the image pattern 20 are not damaged.

Fine image pattern process ( S200 )

The fine image patterning step (S200) is a step of partially finely finishing the image pattern (20) formed on the substrate (10) through the etching step (S100).

At this time, the laser beam 30 is used as means for finely smoothing the image pattern 20 through the fine image pattern process S200.

That is, in the fine image pattern process S200, the laser beam 30 is irradiated to the image pattern 20 remaining on the substrate 10 through the etching process S100 to form the width of the image pattern 20 May be 10 to 30 占 퐉 in part.
The fine image pattern process S200 irradiates the laser beam 30 onto the image pattern 20 of the image film 60 left on the substrate 10 to form the image pattern 20, Lt; RTI ID = 0.0 > 10-30 < / RTI >

The fine image patterning step S200 is a step of irradiating the substrate 10 with the laser beam 30 so that the laser beam 30 can be irradiated according to the irradiation position of the laser beam 30 and the input information of the irradiation path. (Step S210) of controlling the image forming apparatus 100 through the image forming apparatus 100.

The controller 100 includes a laser generator 110 for generating the laser beam 30, a beam switch 120 for commanding the laser beam 30 to be emitted, Is connected to an optical attenuator 130 which adjusts the output of the optical attenuator so that the intensity of the light can be output at a constant interval or continuously.

The controller 100 further includes a laser head 140 to which the laser beam 30 is emitted and a beam shaper for controlling the laser beam 30 to be output only in a predetermined moving direction 150 are connected.

The laser generator 110 can generate a laser having an infra-red wavelength suitable for processing the image pattern 20, and is controlled by the controller 100.

The controller 100 controls a pulse repetition rate, a pulse width, and a duty cycle of the rare earth beam 30.

The beam shaper 150 may perform a function of smoothing a cutting surface of the image pattern 20.

The control unit 100 controls the laser beam 30 according to information previously set by the user in the control unit 100 or a command sent directly by the user to the control unit 100, So that the width partially forms 10 to 30 mu m.

The image pattern 20 formed on the upper surface of the substrate 10 may be formed on the upper surface of the substrate 10 so that the current flows smoothly when a plurality of the substrates 10 are stacked together. And the image pattern 20 formed on the lower surface of another substrate 10 to be laminated on the upper surface of the substrate 10.

The micro image patterning step S200 includes an outer layer patterning step S220 for partially forming the image pattern 20 on the upper surface of the substrate 10 to have a width of 10 to 30 占 퐉, 10), the width of the image pattern 20 is partially 10 to 30 占 퐉.

In the outer layer patterning step S220 and the inner layer patterning step S230, the controller 100 determines whether the user has previously set the information on the controller 100 or a command sent directly to the controller 100 by the user. The image pattern 20 formed on the plurality of substrates 10 is processed by controlling the laser beam 30.

Peeling process S300 )

The peeling step S300 is a step of completely removing the image film 60 and other residues except for the image pattern 20 formed on the substrate 10 through the fine image patterning step S200.

The copper foil 40 constituting the image pattern 20 is protected by the image film 60 and remains on the substrate 10.

The image film 60 remaining on the upper surface of the image pattern 20 of the substrate 10 is completely removed through the peeling process.

In addition, other residual materials except the image pattern 20 on the substrate 10 are also removed through the peeling step (S300) through the fine image pattern process (S200).

If the minute image pattern 20 is implemented in the fine image pattern process S200 and all the residues on the substrate 10 are removed through the peeling process S300, an automatic optical inspection (AOI) And then the image pattern 20 is inspected.

The AOI work is performed through the AOI facility, optically observing the appearance of the object, and examining defects and goodness by image processing using a PC.

That is, the AOI operation is determined by accurately ascertaining the increase in the number of circuits, defects, and electrical shorts.

The AOI operation has a function of detecting a potential defect so that a deficiency of the image pattern 20 of the substrate 10 is detected by irradiating a light beam onto the substrate 10 to form the image pattern 20 of the copper foil 40, And the connection failure can be confirmed.

When the AOI operation is completed, an OXID operation is performed to increase the adhesion between the substrate 10 and the image pattern 20.

The OXID process is a pretreatment process for increasing the adhesion between the substrate 10 and the image pattern 20, and is an operation for roughening the outer surface using sulfuric acid, hydrogen peroxide, or the like.

As a result, the peeling step (S300) and the associated process are completed.

As a result, through the fine image patterning step (S200), it is possible to finely process the image pattern (20) of the substrate (10) completed in the etching step (S100) so as to have a width of 10 to 30 mu m do.

The adhesion between the substrate 10 and the image pattern 20 is increased and the impurities generated on the substrate 10 excluding the image pattern 20 are removed through the separation step S300. .

3 is a flowchart schematically showing a method for manufacturing a high-multilayer PCB including a method of implementing an image pattern according to an embodiment of the present invention.

4 is a conceptual view showing each step of a method of manufacturing a high-multilayer PCB including a method of implementing an image pattern according to an embodiment of the present invention.

3 and 4, an image film 60 is coated on a substrate 10 on which a copper foil 40 copper-plated on an insulator is formed, and then the copper foil 40 is partially melted, And an etching process (S100) for forming the image pattern 20 by exposing the resist pattern.

The laser beam 30 is irradiated to the image pattern 20 remaining on the substrate 10 through the etching step S100 so that the width of the image pattern 20 is partially 10 to 30 占 퐉. And a fine image patterning step (S200).

The peeling step (S300) for completely removing the residual film of the image film (60) except for the image pattern (20) formed on the substrate (10) through the fine image pattern step (S200).

In addition, the upper plate sheet 300, on which a plurality of different substrates 10 are laminated, is disposed on the lower plate 200 on which a plurality of substrates 10 are laminated through the peeling process (S300) (S400) in which the first and second electrodes (80, 80) are provided.

Subsequently, the upper surface of the upper plate sheet 300 stacked through the arranging step (S400) is pressed by the press 50 to press the upper plate sheet 300 and the lower plate sheet 200 under the same conditions, (S500).

There is also a hole processing step (S600) of separating the upper sheet sheet (300) and the lower sheet sheet (200) from each other after the primary pressing step (S500) is completed.

The laser beam 30 is irradiated to the image pattern 20 formed by plating the upper sheet sheet 300 and the lower sheet 200 through the hole processing step S600 so that the width of the image pattern 20 (S700) so as to be 10 to 30 mu m in part.

Finally, a secondary pressing step (S800) in which an adhesive 70 is applied between the lower sheet 200 and the upper sheet 300 and then the upper surface of the upper sheet 300 is pressed by the press 50, Respectively.

Here, the etching step (S100), the fine image patterning step (S200), and the peeling step (S300) are performed in the same manner as described with reference to FIG. 1 and FIG.

Batch process S400 )

The arrangement step S400 is a step of irradiating the image pattern 20 remaining on the substrate 10 with a laser beam 30 so that the image pattern 20 has a width of 10 to 30 占 퐉, A plurality of the substrates 10 from which the residues have been removed through the patterning step (S200) and the peeling step (S300) are arranged one after the other, and are then prepared for adhesion.

More specifically, the arranging step (S400) includes: the upper sheet sheet 300 in which a plurality of the substrates 10 are laminated to each other through the adhesive 70; and a plurality of different substrates 10, And the lower sheet 200 formed by mutually stacking the upper and lower sheets 200 are laminated and arranged.

At this time, it is preferable that the upper surface of the lower plate sheet 200 is laminated so as to be in close contact with the lower surface of the upper plate sheet 300.

The rivets 80 are installed at the edges of the lower sheet 200 and the upper sheet 300 to prevent the lower sheet 200 and the upper sheet 300 from being moved while being disposed.

When the upper plate sheet 300 and the lower plate sheet 300 are laminated and arranged, the upper surface of the upper plate sheet 300 is pressed by the press 50 so that the upper plate sheet 300 and the lower plate sheet 200 are in the same condition A primary pressing step (S500) is performed.

Primary press process ( S500 )

The primary pressing step S500 is a step of pressing the upper sheet 300 and the lower sheet 200 under the same condition through the press 50 so that the same finished product can be completed .

The upper surface of the upper plate sheet 300 is pressed by the press 50 so that the pressure of the press 50 can be transmitted to the lower plate sheet 200 adhered to the lower surface of the upper plate sheet 300 do.

At this time, no separate foreign material is provided between the upper sheet 300 and the lower sheet 200, and the upper sheet 300 is pressed with the press 50 in a state in which the upper and lower sheets are closely adhered to each other, .

The pressure at which the press 50 presses the upper surface of the top sheet 300 is preferably 18 to 24 kgf / cm 2 and is preferably performed at a temperature of 180 to 200 ° C for 2.5 to 3.5 hours.

When the pressure for pressing the top sheet 300 of the press 50 is less than 18 kgf / cm 2, the top sheet 300 and the bottom sheet 200 may not be squeezed to a desired thickness.

If the pressure for pressing the upper plate sheet 300 of the press 50 exceeds 24 kgf / cm 2, the upper plate sheet 300 and the lower plate sheet 200 may be partially damaged or broken.

When the press 50 presses the top sheet 300 and maintains the temperature at less than 180 ° C, the thickness at which the top sheet 300 and the bottom sheet 200 are squeezed may not be satisfied.

The upper sheet 300 and the lower sheet 200 may be partially deformed when the press 50 presses the upper sheet 300 and maintains the temperature higher than 200 ° C.

The press thickness of the upper and lower sheet sheets 300 and 200 may not be satisfied even when the press 50 presses the upper surface of the upper sheet sheet 300 for less than 2.5 hours.

If the pressing time of the press 50 against the upper surface of the upper plate sheet 300 exceeds 3.5 hours, the deformation of the product may occur due to unreasonable pressing of the upper plate sheet 300 and the lower plate sheet 200. .

The primary pressing step S500 includes a polishing step S510 of polishing the upper plate sheet 300 and the lower plate sheet 200 through the polishing apparatus 90 to flatten the thickness of the upper plate sheet 300 and the lower plate sheet 200. [

In the polishing step S510, the top sheet 300 and the bottom sheet 200 are separately processed to increase the flatness of the top sheet 300 and the bottom sheet 200.

That is, the polishing step (S510) is a step of polishing the outer surfaces of the upper sheet 300 and the lower sheet 200 before the primary pressing step (S500) so that their flatness is the same.

Hole machining process ( S600 )

The hole forming process (S600) is a process of separating the upper sheet sheet (300) and the lower sheet sheet (200) after the primary pressing process (S500) and separating the holes from each other.

In the hole forming step S500, the upper sheet 300 and the lower sheet 200 are separated from each other by the drill 15 according to information set in a state that the upper sheet 300 and the lower sheet 200 are separated from each other, Thereby forming a hole in each hole.

Here, the upper plate sheet 300 and the lower plate sheet 200 are processed separately.

The drill 15 used in the upper plate sheet 300 and the lower plate sheet 200 has a diameter of 0.25 mm and a hole diameter of 1.6T, (Mm / s), which is the depth at which holes are drilled in one rotation of the hole.

When the upper plate sheet 300 and the lower plate sheet 200 are subjected to a hole forming process with a diameter of 0.35 mm and a thickness of 1.6T, the holes are drilled in one rotation of the drill 15 at a speed of 110,000 to 130,000 RPM Hole processing is performed at a depth of 36 to 38 FEED (mm / s).

The bit of the drill 15 may be cemented carbide, tungsten carbide and cobalt may be used, and if necessary, Tic, Ta, Nb, etc. may be added as a metal material.

External fine pattern process ( S700 )

The outer fine sheet pattern 300 and the lower sheet 200 which have undergone the hole forming process S600 are plated to perform an outer fine patterning process S700 to form a fine image pattern 20.

In the outer fine patterning step S700, the image pattern 20 of the upper sheet 300 and the lower sheet 200 is finely trimmed.

As in the fine image pattern process S200 through the outer fine pattern process S700, the image pattern 20 of the upper sheet 300 and the lower sheet 200 may be finely trimmed. A beam 30 is used.

That is, in the external fine patterning process (S700), the image pattern 20 of the top sheet 300 and the bottom sheet 200 partially diffuses through the reinforcing etching process (S710) And then the laser beam 30 is irradiated to the image pattern 20 so that the width of the image pattern 20 partially becomes 10 to 30 占 퐉.
The external fine patterning process S700 may be performed by electrolytically plating the upper sheet sheet 300 and the lower sheet sheet 200 which have undergone the hole forming process S600 through the etching process S100 A portion of the image film 60 excluding the portion of the image pattern 20 is removed through a front operation, a lamination operation, an exposure operation, and a development operation, and then the portion of the copper foil 40 exposed on the substrate 10 is melted, And then the laser beam 30 is irradiated to the image pattern 20 of the image film 60 so that the width of the image pattern 20 partially becomes 10 to 30 占 퐉 .

For this purpose, the outer fine patterning process (S700) may perform electroless copper plating on the upper sheet 300 and the lower sheet 200 separately.

That is, the electrolytic copper plating process is a process for depositing metal on a surface of a material through which electricity can not pass by chemical reaction so that electricity can pass through.

In order to perform electrolytic copper plating, the surface of the upper and lower sheets 300 and 200 is removed and the oxide film is removed.

After the desmear process for removing the oxide film is completed, the remnant is removed after the desmear by the pickling operation.

Then, a catalyst operation is performed so that Pd and Sn colloid can act as a catalyst for the plating reaction.

In the electroless copper plating, metal ions are coated on the surface of the upper sheet sheet 300 and the lower sheet 200, which are nonconductors, by the metal precipitation method to improve the initial reaction speed of the plating and improve the adhesion between the copper foil surface and the plating surface And the like.

As a result, in the non-electrolytic copper plating, a conductive material is coated on the inner wall of the hole of the upper plate sheet 300 and the lower plate sheet 200 penetrated by the drill 15.

In the outer fine patterning step S700, the upper sheet 300 and the lower sheet 200 may be separately electro-copper-plated.

That is, the holes and the surfaces of the upper sheet 300 and the lower sheet 200 are given a predetermined plating function to give a function of a circuit capable of flowing a certain amount of current.

This electrolytic copper plating uses the property that copper sulfate dissolves in water and dissociates into copper ion and converted ion.

The image pattern 20 is formed on the lower surface of the upper sheet 300 and the upper surface of the lower sheet 200 in the external fine patterning step S700.

As described above, the outer fine patterning process (S700) includes placing an image film (60) for forming the image pattern (20) on the top sheet (300) and the bottom sheet (200) (S710) etching the exposed portion 60 to remove the portion excluding the image pattern 20.

In detail, the reinforcing etching process S710 includes placing an image film 60 for forming the image pattern 20 on the lower surface of the upper sheet 300 and the upper surface of the lower sheet 200, (60), the width of the image pattern (20) is partially less than 30 mu m and less than 70 mu m.

For this purpose, in the reinforcing etching step (S710), the oxidized film or the fingerprint generated on the plated copper foil is removed, and the front surface, i.e., scrubbing, which scrubs the copper foil surface to smoothly adhere the image film 60 The work will proceed.

Thereafter, the image film 60 is subjected to a lamination operation in which the upper and lower sheet sheets 300 and 200 are press-coated with predetermined heat and pressure.

Subsequently, light energy is supplied to the laminated upper sheet 300 and the lower sheet 200 to perform a photolithography process of reacting a monomer with a polymer to reproduce a necessary pattern image.

Then, a developing operation for peeling off the portion that has not changed into a polymer in the exposure operation using sodium carbonate is performed.

As a result, the width of the image pattern 20 formed on the top sheet 300 and the bottom sheet 200 in the reinforcing etching process S710 of the external fine patterning process S700 is partially 30 Is etched through the reinforcing etching step (S710) so as to be less than 70 mu m.

The width of the image pattern 20 formed on the lower surfaces of the upper sheet 300 and the lower sheet 200 is partially etched through 30 μm to less than 70 μm.

In the outer fine patterning step S700, the laser beam 30 (not shown) is formed so that the width of the image pattern 20 formed on the upper sheet 300 and the lower sheet 200 is 10 to 30 占 퐉. ).

Next, the laser beam 30 is processed so that the width of the image pattern 20 formed on the lower surface of the upper sheet 300 and the lower sheet 200 is 10 to 30 μm.
That is, the laser beam 30 is irradiated to the image pattern 20 of the image film 60 formed on the lower surface of the upper sheet 300 and the lower sheet 200, Mu] m.

In the outer fine patterning process S700, the image pattern 20 is formed to correspond to the lower surface of the upper sheet 300 and the upper surface of the lower sheet 200. [

As a result, the external fine patterning step (S700) and the reinforcing etching step (S710) are completed.

Secondary pressing process ( S800 )

After the external fine patterning step S700 and the reinforcing etching step S710 are completed, an adhesive 70 is applied between the lower sheet 200 and the upper sheet 300, A secondary pressing step (S800) for pressing the upper surface of the sheet 300 is performed.

At this time, a pre-treatment step (S810) of pre-treating the lower sheet 200 and the upper sheet 300 to increase the adhesive strength of the adhesive 70 used between the lower sheet 200 and the upper sheet 300 This is done first.

Here, the preprocessing step S810 will be described. First, the surfaces of the lower sheet 200 and the upper sheet 300 are oxidized.

The blackening treatment is an operation for oxidizing the surface by supplying sulfuric acid and a hydrogen peroxide compound to the surface of the lower sheet 200 and the upper sheet 300 in order to increase the strength with which the adhesive 70 adheres.

The adhesive 70 is disposed between the lower sheet 200 and the upper sheet 300 so that the lower sheet 200 and the upper sheet 300 are not deformed. And perform the operation.

After the preprocessing step S810 is performed, a step of pressing the lower sheet 200 and the upper sheet 300 simultaneously is performed in the secondary pressing step S800.

To this end, the upper surface of the lower sheet 200 and the lower surface of the upper sheet 300 are laminated and adhered together by the adhesive 70.

The rivet 80 is also installed at the edge of the lower sheet 200 and the upper sheet 300 to prevent the lower sheet 200 and the upper sheet 300 from being moved .

The press 50 presses the upper surface of the upper plate sheet 300 so that the upper plate sheet 300 and the upper plate sheet 300 are pressed against the upper plate sheet 300, Are pressed together at the same time.

At this time, the pressure at which the press 50 presses the upper surface of the top sheet 300 is 18 to 24 kgf / cm 2, preferably at a temperature of 180 to 200 ° C. for 2.5 to 3.5 hours.

The conditions under which the press 50 presses the top sheet 300 and the reason therefor are the same as in the primary press step S500.

After the secondary pressing step S800 is performed, the lower sheet 200 and the upper sheet sheet 300, which have been compressed, are used as a high-multilayer circuit board through various processes.

Such a process has an advantage that the width of the PCB substrate image pattern can be partially formed in a minute shape of 10 to 30 mu m.

In addition, it is possible to easily produce complicated and fine image patterns, and it is also advantageous in that the tilting phenomenon of a multi-layer PCB is eliminated and the flatness is improved.

In addition, it is advantageous to minimize the defective rate of the image pattern and to maximize the production efficiency by manufacturing a high-multilayer PCB with minimized thickness deviation while manufacturing a fine image pattern.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Those skilled in the art will appreciate that various modifications and changes may be made thereto without departing from the scope of the present invention.

Therefore, the spirit of the present invention should not be construed as being limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the following claims, I will say.

10: substrate 15: drill
20: Image pattern 30: Rivet
40: copper foil 50: press
60: image film 70: adhesive
80: Rivet 90: Polishing machine
100: controller 110: laser generator
120: beam switch 130: optical attenuator
140: laser head 150: beam shaper
200: lower plate sheet 300: upper plate sheet
S100: etching step S200: fine image pattern
S210: control process S220: outer layer pattern process
S230: inner layer pattern process
S300: peeling process
S400: batch process
S500: Primary pressing step S510: Polishing step
S600: Hole machining process
S700: External fine patterning process S710: Reinforcement etching process
S800: Secondary pressing step S810: Pretreatment step

Claims (8)

After the image film 60 is coated on the substrate 10 on which the copper foil copper-plated on the insulator is formed, the portion except for the portion of the image pattern 20 formed on the image film 60 is subjected to frontal working, (S100) for forming an image pattern (20) by exposing an insulator by melting a part of the copper foil (40) exposed on the substrate (10) after removing it through a work, an exposure work and a development work.
The laser beam 30 is irradiated to the image pattern 20 of the image film 60 remaining on the substrate 10 through the etching step S100 so that the width of the image pattern 20 is partially 10 to 30 (S200); And
And a peeling step (S300) for completely removing the image film (60) and other residues except for the image pattern (20) formed on the substrate (10) through the fine image patterning step (S200) .
The method according to claim 1,
The fine image pattern process (S200)
A controlling step S210 for controlling the irradiation position of the laser beam 30 to be irradiated on the substrate 10 and the laser beam 30 through the controller 100 so that the laser beam 30 can be irradiated according to the input information of the irradiation path, ≪ / RTI >
The method according to claim 1,
The fine image pattern process (S200)
An outer layer pattern step (S220) of processing the upper surface of the substrate (10) so that the width of the image pattern (20) is 10 to 30 mu m,
And an inner layer patterning step (S230) of processing the image pattern (20) on the lower surface of the substrate (10) such that the width of the image pattern (20) is at least 10 to 30 占 퐉.
After the image film 60 is coated on the substrate 10 on which the copper foil copper-plated on the insulator is formed, the portion except for the portion of the image pattern 20 formed on the image film 60 is subjected to frontal working, (S100) for forming an image pattern (20) by exposing an insulator by melting a part of the copper foil (40) exposed on the substrate (10) after removing it through a work, an exposure work and a development work.
The laser beam 30 is irradiated to the image pattern 20 of the image film 60 remaining on the substrate 10 through the etching step S100 so that the width of the image pattern 20 is partially 10 to 30 (S200); And
A peeling step (S300) for completely removing the image film (60) and other residues except the image pattern (20) formed on the substrate (10) through the fine image patterning step (S200);
A top sheet sheet 300 in which a plurality of different substrates 10 are laminated is disposed on a lower sheet 200 on which a plurality of substrates 10 are laminated through the peeling process S300, (S400);
The upper surface sheet 300 and the lower sheet sheet 200 are pressurized under the same condition by pressing the upper surface of the upper sheet sheet 300 stacked through the arranging step S400 with the press 50 S500);
A hole processing step (S600) of separating the upper sheet sheet (300) and the lower sheet sheet (200) from each other after the primary pressing step (S500) is completed;
The upper plate sheet 300 and the lower plate sheet 200 which have undergone the hole processing step S600 are subjected to electrolytic copper plating and the image pattern 20 of the image film 60 formed through the etching step S100 ) Is removed through a frontal operation, a lamination operation, an exposure operation, and a development operation, and then the portion of the copper foil 40 exposed on the substrate 10 is melted to expose the insulator to form an image pattern 20 Next, an external fine pattern process (S700) for irradiating the image pattern (20) of the image film (60) with a laser beam (30) so that the width of the image pattern (20) is partially 10 to 30 占 퐉; And
A secondary pressing step (S800) in which an adhesive 70 is applied between the lower sheet 200 and the upper sheet 300 and then the upper surface of the upper sheet 300 is pressed by the press 50 A method for fabricating a high-multilayer PCB, the method comprising:
5. The method of claim 4,
The primary pressing step (S500)
And a polishing step (S510) of polishing the outer surface of the upper sheet sheet (300) and the lower sheet sheet (200) after the arranging step (S400) to polish the outer surface of the lower sheet sheet (300) Way.
5. The method of claim 4,
In the external fine pattern process (S700), the image pattern (20)
Wherein the upper surface of the upper plate sheet (300) and the lower plate sheet (200) are formed on a lower surface of the upper plate sheet (300) and an upper surface of the lower plate sheet (200).
5. The method of claim 4,
During the step of the external fine patterning step (S700)
An image film 60 for forming an image pattern 20 is placed on the lower surface of the upper sheet 300 and the upper surface of the lower sheet 200 and the width of the image pattern 20 is partially (S710) in which the surface of the multilayer printed wiring board is removed by a frontal operation, a lamination operation, an exposure operation, and a development operation so that the width is less than 30 but less than 70 占 퐉.
5. The method of claim 4,
The secondary pressing step (S800)
(S810) for pre-treating the lower sheet 200 and the upper sheet 100 to increase the adhesive strength of the adhesive 40 used between the lower sheet 200 and the upper sheet 100 A method for manufacturing a high - multilayer PCB comprising a method of implementing an image pattern.

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