KR101440666B1 - 광학 필름의 절단 방법 및 이를 이용한 장치 - Google Patents
광학 필름의 절단 방법 및 이를 이용한 장치 Download PDFInfo
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- KR101440666B1 KR101440666B1 KR1020107011599A KR20107011599A KR101440666B1 KR 101440666 B1 KR101440666 B1 KR 101440666B1 KR 1020107011599 A KR1020107011599 A KR 1020107011599A KR 20107011599 A KR20107011599 A KR 20107011599A KR 101440666 B1 KR101440666 B1 KR 101440666B1
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- South Korea
- Prior art keywords
- optical film
- cutting
- adsorption
- polarizing film
- film
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- 238000005520 cutting process Methods 0.000 title claims abstract description 60
- 239000012788 optical film Substances 0.000 title claims description 80
- 238000000034 method Methods 0.000 title claims description 17
- 238000001179 sorption measurement Methods 0.000 claims abstract description 39
- 238000011144 upstream manufacturing Methods 0.000 claims description 27
- 238000010521 absorption reaction Methods 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 82
- 230000007246 mechanism Effects 0.000 description 14
- 239000000356 contaminant Substances 0.000 description 13
- 239000000779 smoke Substances 0.000 description 9
- 230000007723 transport mechanism Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/16—Bands or sheets of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Polarising Elements (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
도 2는 유지 테이블 주변의 주요부 확대도.
도 3은 편광 필름 절단시의 흡착 홈의 상태를 도시하는 도면.
도 4는 변형예 장치의 유지 테이블 주변의 주요부 확대도.
3 : 절단 기구
4 : 반송 기구
6 : 반출 기구
9 : 흡착 테이블
9a, 9b : 유지 블록
11, 12 : 닙 롤러
16 : 제어부
F : 편광 필름
Claims (5)
- 소정 길이의 낱장의 광학 필름으로 절단하는 광학 필름의 절단 방법이며,
상기 광학 필름의 절단 부위의 폭 방향을 따라 또한 연직 방향으로 형성된 흡착 홈을 갖는 흡착대에 당해 광학 필름을 흡착 유지시키면서, 흡착 홈을 걸쳐서 광학 필름을 반송 방향의 전후로 경사지게 한 상태에서 흡인하고, 위쪽으로부터 흡착 홈에 광학 필름을 반송 방향의 전후로 경사지게 한 상태로 흡인하면서 레이저로 절단하는 것을 특징으로 하는 광학 필름의 절단 방법. - 제1항에 있어서, 상기 흡착 홈을 사이에 두고 광학 필름의 반송 방향의 상류측과 하류측의 흡착대의 표면 높이에 단차를 형성한 것을 특징으로 하는 광학 필름의 절단 방법.
- 제2항에 있어서, 상기 흡착대의 단차는, 하류측의 표면 높이가 상류측의 표면 높이보다 낮게 설정되어 있는 것을 특징으로 하는 광학 필름의 절단 방법.
- 소정 길이의 낱장의 광학 필름으로 절단하는 광학 필름의 절단 장치이며,
띠 형상의 상기 광학 필름을 공급하는 공급 수단과,
상기 광학 필름의 절단 부위의 폭 방향을 따라 또한 연직 방향으로 형성된 흡착 홈을 갖고, 또한 당해 흡착 홈을 걸쳐서 광학 필름을 반송 방향의 전후로 경사지게 한 상태에서 흡착 유지하도록 단차를 갖는 흡착대와,
상기 흡착대에 흡착 유지된 광학 필름을 흡착 홈을 따라 절단하는 레이저 장치를 구비한 것을 특징으로 하는 광학 필름의 절단 장치. - 제4항에 있어서, 상기 흡착대의 단차는, 흡착 홈을 사이에 두고 광학 필름 반송 방향의 하류측의 표면 높이를 상류측의 표면 높이보다 낮게 구성한 것을 특징으로 하는 광학 필름의 절단 장치.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/064745 WO2010021024A1 (ja) | 2008-08-19 | 2008-08-19 | 光学フィルムの切断方法およびこれを用いた装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110055476A KR20110055476A (ko) | 2011-05-25 |
KR101440666B1 true KR101440666B1 (ko) | 2014-09-23 |
Family
ID=41706920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107011599A Expired - Fee Related KR101440666B1 (ko) | 2008-08-19 | 2008-08-19 | 광학 필름의 절단 방법 및 이를 이용한 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8257638B2 (ko) |
JP (1) | JP5481195B2 (ko) |
KR (1) | KR101440666B1 (ko) |
CN (1) | CN101778692B (ko) |
TW (1) | TWI474909B (ko) |
WO (1) | WO2010021024A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9029731B2 (en) | 2007-01-26 | 2015-05-12 | Electro Scientific Industries, Inc. | Methods and systems for laser processing continuously moving sheet material |
EP2637819B1 (de) * | 2011-10-17 | 2017-08-23 | Antolin Interiors Deutschland GmbH | Verfahren zur erzeugung von messer - oder laserschwächungen von lederhäutung |
CN102581492A (zh) * | 2012-01-31 | 2012-07-18 | 武汉吉事达激光技术有限公司 | 卷料自动送料激光刻蚀机 |
KR102025704B1 (ko) * | 2012-09-14 | 2019-09-27 | 삼성디스플레이 주식회사 | 필름 검사 장치 |
CN103600172B (zh) * | 2013-04-28 | 2017-02-08 | 宝山钢铁股份有限公司 | 一种开卷落料方法 |
JP2014228848A (ja) * | 2013-05-27 | 2014-12-08 | 日東電工株式会社 | 光学フィルムロールの製造システムおよび光学フィルムロールの製造方法 |
JP2019038643A (ja) * | 2017-08-24 | 2019-03-14 | 日産自動車株式会社 | シート材製造装置 |
CN112091456B (zh) * | 2020-08-05 | 2023-04-04 | 武汉宁致远汽车配件有限公司 | 一种带有除尘排废功能的激光切割工作台 |
CN215880388U (zh) * | 2021-09-30 | 2022-02-22 | 宁德时代新能源科技股份有限公司 | 模切装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000015472A (ja) | 1998-07-01 | 2000-01-18 | Kyocera Corp | レーザ加工装置 |
JP2001252783A (ja) | 2000-03-09 | 2001-09-18 | Asmo Co Ltd | フェルトの裁断方法、フェルトの裁断装置及び軸受装置用フェルト |
JP2001287063A (ja) * | 2000-04-04 | 2001-10-16 | Matsuya R & D:Kk | レーザー裁断装置 |
JP2005189530A (ja) | 2003-12-25 | 2005-07-14 | Nitto Denko Corp | 積層型偏光板およびその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4675497A (en) * | 1985-12-23 | 1987-06-23 | Gerber Garment Technology | Laser cutting system |
JPH1158061A (ja) * | 1997-08-12 | 1999-03-02 | Murata Mfg Co Ltd | 可撓性材料のレーザ加工装置および加工方法 |
JP2001062584A (ja) * | 1999-08-27 | 2001-03-13 | Amada Co Ltd | レーザ加工機および製品搬出方法 |
JP2001179474A (ja) * | 1999-12-27 | 2001-07-03 | Dainippon Printing Co Ltd | 開封用切目線の形成方法 |
JP4371709B2 (ja) * | 2003-06-05 | 2009-11-25 | 富士フイルム株式会社 | 光学フィルム貼付装置及び方法 |
JP2005118849A (ja) * | 2003-10-20 | 2005-05-12 | Hitachi Kenki Fine Tech Co Ltd | レーザ加工装置 |
CN2724948Y (zh) * | 2004-08-25 | 2005-09-14 | 林瑞森 | 薄膜切割器 |
JP3818451B2 (ja) * | 2004-11-22 | 2006-09-06 | 日東電工株式会社 | 積層体の切断方法 |
DE102004059766A1 (de) * | 2004-12-11 | 2006-06-22 | Vits Systems Gmbh | Querschneider für eine Papierbahn |
JP2008073742A (ja) * | 2006-09-22 | 2008-04-03 | Nitto Denko Corp | 光学フィルムの切断方法及び光学フィルム |
-
2008
- 2008-08-19 KR KR1020107011599A patent/KR101440666B1/ko not_active Expired - Fee Related
- 2008-08-19 US US12/670,976 patent/US8257638B2/en not_active Expired - Fee Related
- 2008-08-19 CN CN2008800171807A patent/CN101778692B/zh not_active Expired - Fee Related
- 2008-08-19 WO PCT/JP2008/064745 patent/WO2010021024A1/ja active Application Filing
- 2008-08-19 JP JP2009537437A patent/JP5481195B2/ja active Active
- 2008-08-22 TW TW097132259A patent/TWI474909B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000015472A (ja) | 1998-07-01 | 2000-01-18 | Kyocera Corp | レーザ加工装置 |
JP2001252783A (ja) | 2000-03-09 | 2001-09-18 | Asmo Co Ltd | フェルトの裁断方法、フェルトの裁断装置及び軸受装置用フェルト |
JP2001287063A (ja) * | 2000-04-04 | 2001-10-16 | Matsuya R & D:Kk | レーザー裁断装置 |
JP2005189530A (ja) | 2003-12-25 | 2005-07-14 | Nitto Denko Corp | 積層型偏光板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101778692B (zh) | 2013-07-10 |
KR20110055476A (ko) | 2011-05-25 |
US20100206859A1 (en) | 2010-08-19 |
JPWO2010021024A1 (ja) | 2012-01-26 |
TWI474909B (zh) | 2015-03-01 |
TW201008736A (en) | 2010-03-01 |
CN101778692A (zh) | 2010-07-14 |
JP5481195B2 (ja) | 2014-04-23 |
US8257638B2 (en) | 2012-09-04 |
WO2010021024A1 (ja) | 2010-02-25 |
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