KR101439602B1 - 발광 장치 - Google Patents
발광 장치 Download PDFInfo
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- KR101439602B1 KR101439602B1 KR1020120071059A KR20120071059A KR101439602B1 KR 101439602 B1 KR101439602 B1 KR 101439602B1 KR 1020120071059 A KR1020120071059 A KR 1020120071059A KR 20120071059 A KR20120071059 A KR 20120071059A KR 101439602 B1 KR101439602 B1 KR 101439602B1
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- light emitting
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
- H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/48997—Reinforcing structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/85951—Forming additional members, e.g. for reinforcing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
도 2: 도 2의 (A)는 발광측 상의 측면 방향으로부터 도시된 발광 장치(10)의 평면도이다. 도 2의 (B)는 발광 장치(10)를 도시하는 측단면도이고, 도 2의 (A)의 X-X를 따라 취한 단면도이다.
도 3: 도 3의 (A)는 발광측 상의 측면 방향으로부터 도시된 본 발명의 실시예 2의 발광 장치(100)의 평면도이다. 도 3의 (B)는 발광 장치(100)의 측단면도이고, 도 3의 (A)의 X-X를 따라 취한 단면도이다.
도 4: 도 4의 (A)는 본 발명의 실시예 3의 발광 장치(200)의 평면도이다. 도 4의 (B)는 발광 장치(200)의 측단면도이고, 도 4의 (A)의 X-X를 따라 취한 단면도이다.
도 5: 도 5의 (A)는 본 발명의 실시예 4의 발광 장치(300)의 평면도이다. 도 5의 (B)는 발광 장치(300)의 측단면도이고, 도 5의 (A)의 X-X를 따라 취한 단면도이다.
Claims (7)
- 2개 이상의 발광 소자;
상기 발광 소자에 전기적으로 연결된 2개 이상의 리드 프레임; 및
가늘고 평평한 박스 형상으로 형성되고, 상기 발광 소자 및 상기 리드 프레임을 수용하기 위한 수용 오목부를 가지는 케이스를 포함하는 발광 장치이며,
상기 발광 장치는 측방 조망형 발광 장치를 포함하고, 상기 측방 조망형 발광 장치는 광이 상기 발광 장치의 측면 방향에서 상기 수용 오목부의 개구부로부터 방출되고,
상기 리드 프레임의 표면이 상기 수용 오목부의 저면으로부터 노출되도록, 상기 리드 프레임은 상기 케이스 내에 매립되고 상기 케이스의 종방향으로 나란히 제공되고, 상기 리드 프레임의 표면과 상기 수용 오목부의 저면은 상호 동일 평면을 이루고 상기 리드 프레임의 표면들은 공통의 평면 상에 배열되고;
상기 발광 소자는 상기 수용 오목부의 종방향의 두 단부에 배열된 상기 리드 프레임 상에 장착되고;
복수의 리드 프레임과 상기 케이스는 상기 종방향으로 상기 발광 장치를 양분하는 중심선에 대해 선대칭 구조로 배열되고,
상기 케이스의 종방향을 따르는 측면으로부터 상기 리드 프레임이 노출되어 절곡되고,
상기 케이스의 종방향의 중앙에 돌출부가 설치되는, 발광 장치. - 제1항에 있어서, 상기 복수의 발광 소자는 선대칭 구조로 배열되는, 발광 장치.
- 제1항에 있어서, 3개 이상의 리드 프레임이 나란히 제공되고, 상기 복수의 발광 소자 사이에 상기 3개 이상의 리드 프레임 중의 적어도 하나가 배치되고, 상기 복수의 발광 소자는 상기 발광 소자들 사이에 배열된 리드 프레임 중의 적어도 하나를 통해 직렬 연결되는, 발광 장치.
- 제1항에 있어서, 상기 돌출부는 상기 복수의 발광 소자 사이의 케이스의 내측면으로부터 돌출하는, 발광 장치.
- 제4항에 있어서, 상기 돌출부는 상기 리드 프레임의 표면을 덮는, 발광 장치.
- 제4항에 있어서, 상기 발광 소자 및 상기 리드 프레임을 연결하기 위한 본딩 와이어를 더 포함하고,
상기 수용 오목부 및 상기 돌출부는 상기 본딩 와이어를 따라 둘러싸는 형상으로 형성되는, 발광 장치. - 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011144906A JP5527286B2 (ja) | 2011-06-29 | 2011-06-29 | 発光装置 |
JPJP-P-2011-144906 | 2011-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130007482A KR20130007482A (ko) | 2013-01-18 |
KR101439602B1 true KR101439602B1 (ko) | 2014-11-03 |
Family
ID=47390511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120071059A Expired - Fee Related KR101439602B1 (ko) | 2011-06-29 | 2012-06-29 | 발광 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130003381A1 (ko) |
JP (1) | JP5527286B2 (ko) |
KR (1) | KR101439602B1 (ko) |
CN (1) | CN102856313B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014083805A1 (ja) * | 2012-11-28 | 2014-06-05 | パナソニック株式会社 | 半導体装置およびワイヤボンディング配線方法 |
CN104051447B (zh) * | 2013-03-13 | 2016-08-31 | 光宝电子(广州)有限公司 | 发光模块及其单颗发光结构的制造方法 |
JP2015041685A (ja) * | 2013-08-21 | 2015-03-02 | 豊田合成株式会社 | 発光装置 |
JP6604193B2 (ja) * | 2015-12-22 | 2019-11-13 | 日亜化学工業株式会社 | 発光装置、並びにパッケージ及びその製造方法 |
JP6327382B2 (ja) * | 2017-05-10 | 2018-05-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US11081627B2 (en) * | 2018-08-31 | 2021-08-03 | Nichia Corporation | Semiconductor device and method for manufacturing the same |
JP2020092155A (ja) * | 2018-12-05 | 2020-06-11 | 株式会社ダイセル | 光半導体装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070111963A (ko) * | 2006-05-18 | 2007-11-22 | 스탠리 일렉트릭 컴퍼니, 리미티드 | 반도체 광학장치 |
JP2008300694A (ja) * | 2007-05-31 | 2008-12-11 | Nichia Corp | 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法 |
KR20100021551A (ko) * | 2008-08-16 | 2010-02-25 | 심현섭 | 표면실장 소자형태의 엘이디 모듈 |
KR101039994B1 (ko) * | 2010-05-24 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 이를 구비한 라이트 유닛 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1751806B1 (de) * | 2004-05-31 | 2019-09-11 | OSRAM Opto Semiconductors GmbH | Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement |
JP2006041380A (ja) * | 2004-07-29 | 2006-02-09 | Nippon Leiz Co Ltd | 光源装置 |
JP5119621B2 (ja) * | 2006-04-21 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
JP5217800B2 (ja) * | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
JP2011023557A (ja) * | 2009-07-16 | 2011-02-03 | Toshiba Corp | 発光装置 |
-
2011
- 2011-06-29 JP JP2011144906A patent/JP5527286B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-27 US US13/535,245 patent/US20130003381A1/en not_active Abandoned
- 2012-06-29 CN CN201210226188.2A patent/CN102856313B/zh not_active Expired - Fee Related
- 2012-06-29 KR KR1020120071059A patent/KR101439602B1/ko not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070111963A (ko) * | 2006-05-18 | 2007-11-22 | 스탠리 일렉트릭 컴퍼니, 리미티드 | 반도체 광학장치 |
JP2008300694A (ja) * | 2007-05-31 | 2008-12-11 | Nichia Corp | 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法 |
KR20100021551A (ko) * | 2008-08-16 | 2010-02-25 | 심현섭 | 표면실장 소자형태의 엘이디 모듈 |
KR101039994B1 (ko) * | 2010-05-24 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 이를 구비한 라이트 유닛 |
Also Published As
Publication number | Publication date |
---|---|
CN102856313A (zh) | 2013-01-02 |
JP5527286B2 (ja) | 2014-06-18 |
KR20130007482A (ko) | 2013-01-18 |
CN102856313B (zh) | 2015-08-12 |
US20130003381A1 (en) | 2013-01-03 |
JP2013012613A (ja) | 2013-01-17 |
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